WO2025239202A1 - Bonding device and bonding method - Google Patents

Abstract

In the present invention, a carrier has a carrier substrate, a plurality of first through-holes penetrating the carrier substrate in the thickness direction, and a resin film provided to the carrier substrate. A plurality of dies are mounted above the resin film. This bonding device is provided with a carrier holding part, a pressing part, and a first moving part. The carrier holding part has a first surface in contact with the carrier, a second surface facing opposite of the first surface, and a plurality of second through-holes penetrating the same between the first surface and the second surface. The pressing part has a gas supply mechanism for supplying a gas to the first through-holes through the second through-holes, or has a pin drive mechanism for inserting pins into the first through-holes through the second through-holes.

Description

Joining device and joining method

This disclosure relates to a joining device and a joining method.

The chip mounting system described in Patent Document 1 comprises a chip supply device, a bonding device, a surface treatment device, a carry-in/out section, and a transport section (paragraph [0225] of Patent Document 1). The chip supply device supplies multiple chips individually. The chips are adhered to tape covering the opening of the frame, and are pushed upward one by one and turned upside down one by one (paragraph [0251] of Patent Document 1). The bonding device attaches the chips supplied from the chip supply device onto a substrate.

Japanese Patent No. 6337400

One embodiment of the present disclosure provides technology that increases the number of dies that can be mounted on a carrier while suppressing carrier contamination.

A bonding apparatus according to one embodiment of the present disclosure separates multiple dies from a carrier and bonds them to a target substrate. The carrier has a carrier substrate, multiple first through holes penetrating the carrier substrate in the thickness direction, and a resin film provided on the carrier substrate, with the multiple dies mounted on the resin film. The bonding apparatus includes a carrier holding unit that holds the carrier, a pressing unit that presses the dies by supplying gas to the first through holes or by inserting pins into the first through holes, and a first moving unit that relatively moves the pressing unit and the carrier holding unit to change the die being pressed by the pressing unit. The carrier holding unit has a first surface against which the carrier abuts, a second surface facing opposite the first surface, and multiple second through holes penetrating between the first surface and the second surface. The pressing unit has a gas supply mechanism that supplies gas to the first through holes via the second through holes, or a pin driving mechanism that inserts pins into the first through holes via the second through holes.

According to one embodiment of the present disclosure, it is possible to increase the number of dies that can be mounted on a carrier while suppressing contamination of the carrier.

FIG. 1 is a plan view illustrating a joint system according to one embodiment. FIG. 2A is a cross-sectional view showing an example of a target substrate before a die is bonded thereto, and FIG. 2B is a cross-sectional view showing an example of a target substrate after a die is bonded thereto. FIG. 3 is a cross-sectional view of an example carrier before the dies are separated. FIG. 4 is a flowchart illustrating a bonding method according to one embodiment. FIG. 5 is a cross-sectional view showing an example of the operation of the joining device according to the embodiment. FIG. 6 is a cross-sectional view showing an example of the operation of the joining apparatus subsequent to FIG. FIG. 7A is a cross-sectional view showing a pressing unit according to one embodiment, and FIG. 7B is a plan view showing an example of a die that can be pressed by the pressing unit shown in FIG. 7A. FIG. 8 is a cross-sectional view showing a pressing portion according to a modified example. FIG. 9A is a cross-sectional view showing a pressing portion according to a reference embodiment, and FIG. 9B is a plan view showing an example of a die that can be pressed by the pressing portion shown in FIG. 9A.

Embodiments of the present disclosure will be described below with reference to the drawings. Note that identical or similar components in each drawing will be given the same reference numerals, and descriptions thereof may be omitted. In this specification, the X-axis, Y-axis, and Z-axis directions are perpendicular to one another. The X-axis and Y-axis directions are horizontal directions, and the Z-axis direction is vertical. The X-axis direction includes the positive X-axis direction and the negative X-axis direction, which is the direction opposite to the positive X-axis direction. The Y-axis direction includes the positive Y-axis direction and the negative Y-axis direction, which is the direction opposite to the positive Y-axis direction. The Z-axis direction includes the positive Z-axis direction and the negative Z-axis direction, which is the direction opposite to the positive Z-axis direction.

With reference to Figure 1, a bonding system 1 according to one embodiment will be described. The bonding system 1 separates multiple dies from a carrier and bonds them to a target substrate W. As shown in Figure 2(A), the target substrate W has a semiconductor substrate W1, such as a silicon wafer, and multiple devices W2 formed on the semiconductor substrate W1. The multiple devices W2 are partitioned by multiple streets that intersect each other at right angles. Each device W2 includes an electronic circuit. As shown in Figure 2(B), a die D is electrically connected to each device W2. The target substrate W is then cut along the streets to separate each device W2, thereby obtaining a semiconductor device. The semiconductor device includes the device W2 and the die D.

Die D is formed by dividing a semiconductor substrate on which multiple devices other than device W2 are formed into individual devices. The electronic circuitry of die D is electrically connected to the electronic circuitry of device W2 on the target substrate W. Note that the type and number of die D electrically connected to one device W2 are not particularly limited. Although not shown, multiple die D may be electrically connected to one device W2.

As shown in Figure 3, carrier E holds multiple dies D. Carrier E holds each die D with its bonding surface Da facing upward. This allows the bonding surface Da of each die D to be activated and hydrophilized. Carrier E has a carrier substrate E1 and a resin film E2 provided on the surface of carrier substrate E1 facing the die D.

Carrier E holds multiple dies D on resin film E2. Carrier E adsorbs dies D, for example, electrostatically. By pressing dies D against resin film E2, it is possible to deform resin film E2 so as to remove gas from between dies D and resin film E2, and it is also possible to vacuum-adsorb dies D to resin film E2. Carrier E can also adsorb dies D using intermolecular forces.

The carrier substrate E1 may be conductive or insulating. First through holes E3 are formed in the carrier substrate E1, penetrating the carrier substrate E1 in the thickness direction. The die D can be peeled off from the carrier E by supplying gas to the first through holes E3 or by inserting a pin (not shown) into the first through holes E3. The number and arrangement of the first through holes E3 are not particularly limited. One or more first through holes E3 may be formed for each die D.

The resin film E2 is preferably made of a flexible material, specifically a material with an elastic modulus of 2 GPa or less, more preferably 0.5 GPa or less. From the perspective of durability when modifying the bonding surface Da of the die D, the resin film E2 is preferably made of, for example, polyimide or EVA (ethylene-vinyl acetate copolymer). The thickness of the resin film E2 is, for example, 10 μm. In this embodiment, the resin film E2 is a single layer, but it may be made of multiple layers. For example, the resin film E2 may have a polyolefin layer and an acrylic adhesive layer.

As shown in FIG. 1, the bonding system 1 comprises a loading/unloading station 2, a first processing station 3, a second processing station 5, and a control circuit 9. The loading/unloading station 2, the first processing station 3, and the second processing station 5 are arranged in a line, in this order, from the negative side of the X-axis to the positive side of the X-axis. Although not shown, multiple second processing stations 5 may be provided, and multiple second processing stations 5 may be arranged in a line from the negative side of the X-axis to the positive side of the X-axis.

The loading/unloading station 2 includes a mounting table 20. Cassettes C1 to C4 are placed on the mounting table 20. Cassette C1 contains a target substrate W before a die D is bonded to it. Cassette C2 contains a target substrate W after a die D has been bonded to it. Cassette C3 contains a carrier E before the die D has been separated from it. Cassette C4 contains a carrier E after the die D has been separated from it.

The loading/unloading station 2 comprises a first transfer area 21 and a first transfer device 22. The first transfer area 21 is adjacent to the mounting table 20. The first transfer area 21 extends in the Y-axis direction. The first transfer device 22 has a transfer arm. The transfer arm holds and transfers the target substrate W and carrier E in the first transfer area 21. The number of transfer arms may be one or more. The transfer arm for the target substrate W and the transfer arm for the carrier E may be provided separately. The first transfer device 22 has a drive unit (not shown) that moves or rotates the transfer arm. The transfer arm can move horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction), and can rotate around the vertical axis.

The first processing station 3 includes a first storage device 30. The first storage device 30 is adjacent to the first transfer area 21. The first storage device 30 is positioned on the opposite side of the first transfer area 21 from the mounting table 20. The first storage device 30 temporarily stores target substrates W and carriers E. The first storage device 30 has multiple stages arranged vertically. Each stage holds a target substrate W and a carrier E. The stage for the target substrates W and the stage for the carriers E may be provided separately.

The first processing station 3 comprises a second transfer area 31 and a second transfer device 32. The second transfer area 31 is adjacent to the first storage device 30 and extends from the first storage device 30 in the positive direction of the X-axis. The second transfer device 32 has a transfer arm. The transfer arm holds and transfers the target substrate W and carrier E in the second transfer area 31. The number of transfer arms may be one or more. The transfer arm for the target substrate W and the transfer arm for the carrier E may be provided separately. The second transfer device 32 has a drive unit (not shown) that moves or rotates the transfer arm. The transfer arm can move horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction), and can rotate around the vertical axis.

The first processing station 3 includes a first activation device 33, a first hydrophilization device 34, a second activation device 35, and a second hydrophilization device 36. The first activation device 33, the first hydrophilization device 34, the second activation device 35, and the second hydrophilization device 36 are adjacent to the second transport region 31 and are provided on the positive Y-axis side or the negative Y-axis side of the second transport region 31.

The first activation device 33 activates the bonding surface Da of the die D while the die D is attached to the carrier E. The first activation device 33 is, for example, a plasma processing device. In the first activation device 33, oxygen gas, which is the processing gas, is excited under reduced pressure, for example, to form plasma and is ionized. The bonding surface Da is activated by irradiating it with oxygen ions. The processing gas is not limited to oxygen gas, and may be, for example, nitrogen gas.

The first hydrophilization device 34 hydrophilizes the bonding surface Da of the die D while the die D is attached to the carrier E. For example, the first hydrophilization device 34 supplies pure water (e.g., deionized water) to the bonding surface Da while rotating the carrier E held by the spin chuck. The pure water imparts OH groups to the pre-activated bonding surface Da. The die D and target substrate W can be bonded using hydrogen bonds between the OH groups.

The second activation device 35 activates the bonding surface Wa of the target substrate W. The second activation device 35 is, for example, a plasma processing device. In the second activation device 35, oxygen gas, which is the processing gas, is excited under reduced pressure, for example, and turned into plasma and ionized. The bonding surface Wa is activated by irradiating the oxygen ions onto the bonding surface Wa. The processing gas is not limited to oxygen gas, and may be, for example, nitrogen gas.

The second hydrophilization device 36 hydrophilizes the bonding surface Wa of the target substrate W. For example, the second hydrophilization device 36 supplies pure water (e.g., deionized water) to the bonding surface Wa while rotating the target substrate W held by the spin chuck. The pure water imparts OH groups to the pre-activated bonding surface Wa. The die D and the target substrate W can be bonded using hydrogen bonds between the OH groups.

The second processing station 5 includes a second storage device 50. The second storage device 50 is adjacent to the second transport area 31. The second storage device 50 is positioned on the opposite side of the second transport area 31 from the first storage device 30. The second storage device 50 temporarily stores target substrates W and carriers E. The second storage device 50 has multiple stages arranged vertically. Each stage holds at least one of the target substrates W and carriers E. The stage for the target substrates W and the stage for the carriers E may be provided separately.

The second processing station 5 comprises a third transfer region 51 and a third transfer device 52. The third transfer region 51 is adjacent to the second storage device 50 and extends from the second storage device 50 in the positive direction of the X-axis. The third transfer device 52 has a transfer arm. The transfer arm holds and transfers the target substrate W and carrier E in the third transfer region 51. The number of transfer arms may be one or more. The transfer arm for the target substrate W and the transfer arm for the carrier E may be provided separately. The third transfer device 52 has a drive unit (not shown) that moves or rotates the transfer arm. The transfer arm can move horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction), and can rotate around the vertical axis.

The second processing station 5 is equipped with a bonding device 60. The bonding device 60 is adjacent to the third transfer region 51 and is provided on the positive Y-axis side or the negative Y-axis side of the third transfer region 51. The bonding device 60 separates the die D from the carrier E and bonds the die D to the target substrate W by orienting the bonding surface Da of the separated die D toward the bonding surface Wa of the target substrate W. Details of the bonding device 60 will be described later.

The control circuit 9 is, for example, a computer. The control circuit 9 includes an arithmetic unit 91 such as a CPU (Central Processing Unit), and a storage unit 92 such as a memory. The storage unit 92 stores programs that control the various processes executed in the bonding system 1. The control circuit 9 controls the operation of the bonding system 1 by having the arithmetic unit 91 execute the programs stored in the storage unit 92. A lower-level control circuit that controls the operation of each device that makes up the bonding system 1 may be provided, and a higher-level control circuit that controls multiple lower-level control circuits may be provided. The control circuit 9 may be made up of multiple lower-level control circuits and a higher-level control circuit.

The control circuit 9 includes electronic circuits such as a CPU, GPU (Graphics Processing Unit), FPGA (Field Programmable Gate Array), or ASIC (Application Specific Integrated Circuit), and performs the various control operations described in this specification by executing instruction codes stored in memory or by being a circuit designed for a specific application.

Next, a bonding method according to one embodiment will be described with reference to Figure 4. The process in Figure 4 is carried out under the control of the control circuit 9. First, the first transport device 22 removes carrier E from cassette C3 and transports it to the first storage device 30. Next, the second transport device 32 removes carrier E from the first storage device 30 and transports it to the first activation device 33.

Next, the first activation device 33 activates the bonding surface Da of the die D with the carrier E attached to it (step S101). After that, the second transport device 32 removes the carrier E from the first activation device 33 and transports it to the first hydrophilization device 34.

Next, the first hydrophilization device 34 hydrophilizes the bonding surface Da of the die D with the die D attached to the carrier E (step S102). The second transport device 32 then removes the carrier E from the first hydrophilization device 34 and transports it to the second storage device 50. The third transport device 52 then removes the carrier E from the second storage device 50 and transports it to the bonding device 60.

In parallel with steps S101 and S102 above, steps S103 and S104 below are performed. First, the first transfer device 22 removes the target substrate W from the cassette C1 and transfers it to the first storage device 30. Next, the second transfer device 32 removes the target substrate W from the first storage device 30 and transfers it to the second activation device 35.

Next, the second activation device 35 activates the bonding surface Wa of the target substrate W (step S103). After that, the second transport device 32 removes the target substrate W from the second activation device 35 and transports it to the second hydrophilization device 36.

Next, the second hydrophilization device 36 hydrophilizes the bonding surface Wa of the target substrate W (step S104). After that, the second transfer device 32 removes the target substrate W from the second hydrophilization device 36 and transfers it to the second storage device 50. Next, the third transfer device 52 removes the target substrate W from the second storage device 50 and transfers it to the bonding device 60.

Next, the bonding device 60 separates the die D from the carrier E and bonds the die D to the target substrate W by orienting the bonding surface Da of the separated die D toward the bonding surface Wa of the target substrate W (step S105). Note that if multiple dies D are electrically connected to one device W2, the bonding of the die D to the target substrate W is performed for each type of die D.

After the die D has been bonded, the target substrate W is transported to cassette C2. First, the third transport device 52 removes the target substrate W from the bonding device 60 and transports it to the second storage device 50. Next, the second transport device 32 removes the target substrate W from the second storage device 50 and transports it to the first storage device 30. Finally, the first transport device 22 removes the target substrate W from the first storage device 30 and stores it in cassette C2.

After the die D is separated, the carrier E is stored in cassette C4. First, the third conveying device 52 removes the carrier E from the joining device 60 and transports it to the second storage device 50. Next, the second conveying device 32 removes the carrier E from the second storage device 50 and transports it to the first storage device 30. Finally, the first conveying device 22 removes the carrier E from the first storage device 30 and stores it in cassette C4.

Next, a bonding apparatus 60 according to one embodiment will be described with reference to Figures 5 and 6. The bonding apparatus 60 separates multiple dies D from a carrier E and bonds them to a target substrate W. For example, the bonding apparatus 60 sequentially separates multiple dies D one by one from the carrier E and bonds them to the target substrate W.

The bonding device 60 includes, for example, a carrier holding unit 61, a substrate holding unit 62, and a transport unit 63. The carrier holding unit 61 holds the carrier E. In this embodiment, the carrier holding unit 61 holds the carrier E from below with the joining surface Da of the die D facing upward, but it may also hold the carrier E from above with the joining surface Da of the die D facing downward. The substrate holding unit 62 holds the target substrate W. In this embodiment, the substrate holding unit 62 holds the target substrate W from below with the joining surface Wa of the target substrate W facing upward, but it may also hold the target substrate W from above with the joining surface Wa of the target substrate W facing downward. The transport unit 63 transports the die D from the carrier E held by the carrier holding unit 61 to the target substrate W held by the substrate holding unit 62.

The transport unit 63 includes, for example, a pickup unit 64 and a mount unit 65. The pickup unit 64 separates the die D from the carrier E held by the carrier holding unit 61 and transports it. The pickup unit 64 may turn the die D upside down while transporting it. The bonding surface Da of the die D can face downward. The mount unit 65 receives the die D from the pickup unit 64 and bonds the received die D to the target substrate W held by the substrate holding unit 62.

The pickup unit 64 has, for example, a first suction head 64a and a first moving mechanism 64b. The first suction head 64a picks up the die D. The first suction head 64a picks up the joining surface Da of the die D, and may therefore pick up the die D without contact to avoid contaminating the joining surface Da. The first moving mechanism 64b moves the first suction head 64a in the X-axis, Y-axis, and Z-axis directions. The first moving mechanism 64b may also turn the first suction head 64a upside down, thereby turning the die D upside down. The joining surface Da of the die D can be turned upside down.

The mount unit 65 has, for example, a second suction head 65a and a second movement mechanism 65b. The second suction head 65a suctions the die D from the side opposite the first suction head 64a. The second suction head 65a suctions the surface Db of the die D opposite the joining surface Da. Since it is not a problem if the surface Db opposite the joining surface Da becomes dirty, the second suction head 65a may come into contact with the die D. This improves suction force and prevents misalignment.

The second movement mechanism 65b moves the second suction head 65a in the Z-axis direction to bond the die D to the target substrate W. To improve the accuracy of the bonding position, the second movement mechanism 65b may move the second suction head 65a in the X-axis and Y-axis directions, or may rotate the second suction head 65a around the vertical axis. The amount of movement or rotation required to improve the accuracy of the bonding position is small, so when viewed from above, the second suction head 65a does not need to move much.

The bonding device 60 is equipped with a pressing unit 66. The pressing unit 66 presses the resin film E2, for example, by supplying gas to the first through-hole E3 of the carrier substrate E1 or by inserting a pin (not shown) into the first through-hole E3. The pressing direction is a direction in which the resin film E2 moves away from the carrier substrate E1. The resin film E2 can be deformed only in the vicinity of one of the multiple dies D, forming a wedge-shaped gap between the resin film E2 and the die D and allowing the die D to be smoothly separated from the resin film E2.

The joining device 60 includes a first moving unit 68. The first moving unit 68 moves the pressing unit 66 and the carrier holding unit 61 relative to one another to change the die D pressed by the pressing unit 66. The first moving unit 68, for example, moves the carrier holding unit 61 in the X-axis and Y-axis directions, and moves the pressing unit 66 in the Z-axis direction. The first moving unit 68 may move only one of the carrier holding unit 61 and the pressing unit 66.

It is preferable that the first moving unit 68 moves only the carrier holding unit 61 in the X-axis and Y-axis directions out of the carrier holding unit 61 and the pressing unit 66. If the pressing unit 66 does not move in the X-axis and Y-axis directions, the pickup unit 64 can receive the die D at the same receiving position every time. This simplifies the operation of the pickup unit 64.

The bonding device 60 may also include a second moving unit 69. The second moving unit 69 moves the substrate holding unit 62. The second moving unit 69 moves the substrate holding unit 62 in the X-axis direction and the Y-axis direction to change the bonding position of the die D relative to the target substrate W. As a result, the pickup unit 64 can deliver the die D to the mount unit 65 at the same delivery position each time. This simplifies the operation of the pickup unit 64. The second moving unit 69 may also move the substrate holding unit 62 in the Z-axis direction.

The bonding device 60 may be equipped with at least one of a first imaging unit 71, a second imaging unit 72, and a third imaging unit 73 to improve the accuracy of the bonding position of the die D relative to the target substrate W. Note that the first imaging unit 71, the second imaging unit 72, and the third imaging unit 73 do not have to capture images every time the die D and the target substrate W are bonded, and may instead capture images periodically.

As shown in FIG. 5, the first imaging unit 71 captures an image of the alignment marks on the bonding surface Da of the die D held by the second suction head 65a. The number of alignment marks to be captured is, for example, two, but is not particularly limited. The alignment marks may be dedicated marks or may be part of the electronic circuitry of the die D.

The first imaging unit 71 is disposed, for example, below the second suction head 65a. The first imaging unit 71 transmits the captured image to the control circuit 9. The control circuit 9 processes the image captured by the first imaging unit 71 to detect the position of the die D in the first coordinate system set for the second suction head 65a.

As shown in FIG. 6, the second imaging unit 72 captures an image of the alignment marks on the bonding surface Wa of the target substrate W held by the substrate holding unit 62. The number of alignment marks to be captured is, for example, two, but is not particularly limited. The alignment marks may be dedicated marks or may be part of the electronic circuit of the device W2 on the target substrate W.

The second imaging unit 72 is disposed, for example, above the board holding unit 62, and is provided, for example, on the second suction head 65a. The second imaging unit 72 transmits the captured image to the control circuit 9. The control circuit 9 processes the image captured by the second imaging unit 72 to detect the position of the device W2 in the second coordinate system set in the board holding unit 62.

The control circuit 9 uses images captured by at least one of the first imaging unit 71 and the second imaging unit 72 to align the die D held by the second suction head 65a with the device W2 on the target substrate W held by the substrate holder 62. This alignment is performed by controlling at least one of the second movement mechanism 65b and the second movement unit 69. The position of the die D or device W2 can be corrected before bonding the die D and the target substrate W, improving the accuracy of the bonding position.

After the die D and device W2 are bonded, the third imaging unit 73 simultaneously captures an image of both the alignment mark on the bonding surface Da of the die D and the alignment mark on the bonding surface Wa of the target substrate W. The third imaging unit 73 captures an image of the alignment marks of the die D and the target substrate W, for example, by transmitting light through the die D. The third imaging unit 73 is composed of, for example, an infrared camera.

When the third imaging unit 73 is to capture an image of the alignment marks of the die D and the target substrate W through the die D, it is disposed, for example, above the substrate holding unit 62, and is provided, for example, on the second suction head 65a. The third imaging unit 73 transmits the captured image to the control circuit 9. The control circuit 9 processes the image captured by the third imaging unit 73 to detect the deviation between the actual bonding position and the target bonding position.

The control circuit 9 uses the image captured by the third imaging unit 73 to align the die D held by the second suction head 65a with the target substrate W held by the substrate holder 62 when bonding the die D and target substrate W from the next time onwards. The position of the die D or target substrate W can be corrected taking into account the characteristics of the bonding device 60, improving the accuracy of the bonding position.

Next, before describing the pressing unit 66 according to one embodiment with reference to Figure 7, the pressing unit 66 according to a reference embodiment will be described with reference to Figure 9. When the pressing unit 66 presses the resin film E2, the carrier substrate E1 may deform gently around the pressed location, as shown by the dashed line in Figure 9(A). To suppress this gentle deformation, an adsorption unit 67 is provided.

The suction portion 67 suctions the carrier substrate E1 around the pressing portion 66. While the suction portion 67 suppresses deformation of the carrier substrate E1 around the pressing portion 66, the pressing portion 66 deforms the resin film E2. The resin film E2 can be deformed only in the vicinity of one of the multiple dies D, forming a wedge-shaped gap between the resin film E2 and the die D.

The suction portion 67 suppressing gradual deformation of the carrier substrate E1 is particularly effective when the pressing portion 66 presses the resin film E2 with gas pressure. This is because if gradual deformation of the carrier substrate E1 occurs, as shown by the dashed line in Figure 9(A), gas will leak from the gas supply chamber formed between the carrier substrate E1 and the pressing portion 66.

The pressing unit 66 has, for example, a pressing head 66a. The pressing head 66a forms a gas supply chamber between itself and the carrier substrate E1. The gas supply chamber communicates with the first through-hole E3. The pressing unit 66 has an annular sealing member 66b. The sealing member 66b contacts the carrier substrate E1 and seals the gas supply chamber. By supplying gas to the gas supply chamber, the die D can be pressed by the gas pressure.

The suction unit 67 has, for example, a suction head 67a. The suction head 67a forms a gas suction chamber between itself and the carrier substrate E1. The gas suction chamber is formed in a ring shape to surround the gas supply chamber. The suction unit 67 has a ring-shaped sealing member 67b. The sealing member 67b contacts the carrier substrate E1 and seals the gas suction chamber. By generating a pressure (negative pressure) lower than atmospheric pressure in the gas suction chamber, the carrier substrate E1 can be vacuum-sucked by the pressure difference.

The carrier holding portion 61 is formed in an annular shape so that the pressing portion 66 and suction portion 67 can contact the carrier substrate E1, and adsorbs the peripheral edge of the underside of the carrier substrate E1. The pressing portion 66 and suction portion 67 are positioned inside the annular carrier holding portion 61, and contact the center of the underside of the carrier substrate E1.

The pressing unit 66 and the suction unit 67 are moved relative to the carrier holding unit 61 to change the die D pressed by the pressing unit 66. As described above, it is preferable that the first moving unit 68 moves only the carrier holding unit 61 of the carrier holding unit 61 and the pressing unit 66 in the X-axis and Y-axis directions.

The reference embodiment has the following problems (A1) and (A2). (A1) Because the pressing portion 66 and the suction portion 67 are arranged inside the annular carrier holding portion 61, the range of movement of the carrier holding portion 61 in the X-axis and Y-axis directions is limited. Furthermore, even if the pressing portion 66 and the suction portion 67 are moved in the X-axis and Y-axis directions instead of the carrier holding portion 61, the range of movement is also limited. As a result, as shown in Figure 9 (B), the position of the die D that can be pressed by the pressing portion 66 is limited. Therefore, the number of dies D that can be mounted on the carrier E is reduced.

(A2) In order to change the die D pressed by the pressing unit 66, the first moving unit 68 moves the pressing unit 66 and the carrier holding unit 61 relatively, causing the pressing unit 66 and the suction unit 67 to repeatedly come into contact with the carrier E. As a result, the sealing members 66b, 67b may deteriorate, generating particles and contaminating the carrier E. The contamination on the carrier E may be transferred to the die D. Note that when the pressing unit 66 presses the die D with a pin, the pressing unit 66 may not come into contact with the carrier E. However, because the suction unit 67 comes into contact with the carrier E, the carrier E will still become contaminated.

In addition to the above (A1) and (A2), the reference embodiment has the following problem (A3). (A3) If the parallelism between the sealing members 66b, 67b and the carrier E is low, pressing the sealing members 66b, 67b hard against the carrier E to prevent gas leakage can cause the carrier E to bend and be damaged. Therefore, the required parallelism accuracy is high, and the work of adjusting the parallelism is tedious.

In order to solve the above problems (A1) to (A3), this embodiment has the following configurations (B1) to (B2) as shown in FIG. 7(A). (B1) The carrier holding portion 61 has a first surface 61a against which the carrier E abuts, a second surface 61b facing opposite the first surface 61a, and a plurality of second through holes 61c that penetrate between the first surface 61a and the second surface 61b. (B2) The pressing portion 66 has a gas supply mechanism 66c that supplies gas to the first through hole E3 via the second through hole 61c. Note that, as shown in FIG. 8, the pressing portion 66 may also have a pin drive mechanism 66e that inserts a pin 66d into the first through hole E3 via the second through hole 61c.

According to this embodiment, the pressing unit 66 is positioned on the opposite side of the carrier E from the carrier holding unit 61. For example, if the first surface 61a of the carrier holding unit 61 is the upper surface and the second surface 61b is, for example, the lower surface, the pressing unit 66 is provided below the lower surface of the carrier holding unit 61. Therefore, when the first moving unit 68 moves the pressing unit 66 and the carrier holding unit 61 relatively in the X-axis and Y-axis directions to change the die D pressed by the pressing unit 66, no interference occurs between the pressing unit 66 and the carrier holding unit 61, and the range of movement is wide. As a result, as shown in FIG. 7(B), the number of dies D that can be mounted on the carrier E can be increased. This reduces the frequency of carrier E replacement and improves throughput.

In this embodiment, instead of the suction portion 67 of the reference embodiment, the carrier holding portion 61 suppresses deformation of the carrier substrate E1 around the pressing portion 66, while the pressing portion 66 deforms the resin film E2. Therefore, the suction portion 67 is not required, which makes maintenance easier. As shown in FIG. 7(A), the carrier holding portion 61 has suction grooves 61d on the first surface 61a that vacuum-suck the carrier substrate E1. The diameter of the first surface 61a is preferably equal to or greater than the diameter of the carrier substrate E1 to suppress overall deformation of the carrier substrate E1. The suction grooves 61d are preferably provided between adjacent second through holes 61c to locally deform the resin film E2. The suction grooves 61d are formed, for example, in a grid pattern.

In this embodiment, the first moving unit 68 moves the pressing unit 66 and the carrier holding unit 61 relative to one another to change the die D pressed by the pressing unit 66, so that the pressing unit 66 repeatedly comes into contact with the carrier holding unit 61 rather than the carrier E. As a result, even if the sealing member 66b deteriorates, particles are generated, and the second surface 61b of the carrier holding unit 61 becomes contaminated, the first surface 61a of the carrier holding unit 61 remains almost uncontaminated. Therefore, contamination of the carrier E can be suppressed.

In this embodiment, the sealing member 66b contacts the carrier holding portion 61 rather than the carrier E. If the parallelism between the sealing member 66b and the carrier holding portion 61 is not precise, even if the sealing member 66b is pressed hard against the carrier holding portion 61 to prevent gas leakage, the carrier holding portion 61 will not be damaged because it has higher rigidity than the carrier E. Therefore, the required parallelism precision is low, and the parallelism adjustment work is simple.

Note that, as shown in Figure 8, when the pressing unit 66 presses the die D with a pin 66d, the pressing unit 66 does not need to have a sealing member 66b. When the pressing unit 66 has a gas supply mechanism 66c as shown in Figure 7(A), the pressing unit 66 may have a sealing member 66b. When the pressing unit 66 has a pin drive mechanism 66e, the pressing unit 66 does not need to have a sealing member 66b.

The gas supply mechanism 66c supplies gas to the first through-hole E3 via the second through-hole 61c. The gas supply mechanism 66c has a supply line that forms a gas flow path. The gas supply mechanism 66c has, for example, an opening/closing valve and a pressure controller along the supply line. The opening/closing valve opens and closes the gas flow path. The pressure controller controls the gas pressure. The gas supply mechanism 66c may also have a leak valve along the supply line. The leak valve exhausts the gas.

It is preferable that the first through holes E3 and the second through holes 61c are connected one-to-one at the boundary between the carrier holding portion 61 and the carrier E. The number of second through holes 61c only needs to be equal to or greater than the number of first through holes E3, and may even be greater than the number of first through holes E3. It is sufficient that the second through holes 61c are located at the locations where the first through holes E3 are present, and the first through holes E3 and the second through holes 61c do not need to be connected one-to-one.

As shown in Figure 7(A), when the pressing unit 66 has a gas supply mechanism 66c, it is preferable that the opening of the second through hole 61c at the boundary between the carrier holding unit 61 and the carrier E is smaller than the opening of the first through hole E3 and is positioned inside the opening of the first through hole E3. In this case, gas pressure hardly acts on the underside of the carrier substrate E1, so bending of the carrier substrate E1 can be suppressed.

The pressing unit 66 may use multiple second through holes 61c and multiple first through holes E3 to press one die D. For example, to press one die D, the pressing unit 66 may supply gas to multiple first through holes E3 via multiple second through holes 61c as shown in FIG. 7(A), or may insert a pin 66d as shown in FIG. 8. One die D can be pressed at multiple points. It is also possible to divide the multiple points into multiple groups and press them in sequence.

The pin drive mechanism 66e shown in Figure 8 has an actuator that drives the pin 66d. Before the first moving unit 68 moves the pressing unit 66 and the carrier holding unit 61 relatively in the X-axis and Y-axis directions to change the die D pressed by the pressing unit 66, the pin 66d is withdrawn from the first through hole E3 and the second through hole 61c. The pin 66d is then inserted into the first through hole E3 via the second through hole 61c and presses the die D.

The foregoing describes embodiments of the joining device and joining method according to the present disclosure, but the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. Naturally, these also fall within the technical scope of the present disclosure.

This application claims priority based on Patent Application No. 2024-078159, filed with the Japan Patent Office on May 13, 2024, and the entire contents of Patent Application No. 2024-078159 are incorporated herein by reference.

60 Bonding device 61 Carrier holding part 61a First surface 61b Second surface 61c Second through-hole 62 Substrate holding part 66 Pressing part 66c Gas supply mechanism 66d Pin 66e Pin driving mechanism 68 First moving part W Target substrate D Die E Carrier E1 Carrier substrate E2 Resin film E3 First through-hole

Claims (9)

1. A bonding apparatus for separating a plurality of dies from a carrier and bonding the dies to a target substrate, comprising:
the carrier has a carrier substrate, a plurality of first through holes penetrating the carrier substrate in a thickness direction, and a resin film provided on the carrier substrate, and the plurality of dies are mounted on the resin film;
the bonding apparatus includes a carrier holding unit that holds the carrier, a pressing unit that presses the die by supplying gas to the first through hole or by inserting a pin into the first through hole, and a first moving unit that relatively moves the pressing unit and the carrier holding unit to change the die pressed by the pressing unit,
the carrier holding portion has a first surface against which the carrier abuts, a second surface facing opposite to the first surface, and a plurality of second through holes penetrating between the first surface and the second surface;
The pressing unit has a gas supply mechanism that supplies gas to the first through hole via the second through hole, or a pin drive mechanism that inserts a pin into the first through hole via the second through hole. The joining device according to claim 1, wherein the pressing unit includes the gas supply mechanism. The joining device described in claim 2, wherein the opening of the second through hole is smaller than the opening of the first through hole at the boundary between the carrier holding portion and the carrier and is positioned inside the opening of the first through hole. The joining device described in claim 2, wherein the pressing portion has a sealing member that abuts against the second surface of the carrier holding portion. The joining device according to claim 1, wherein the pressing unit includes the pin drive mechanism. The bonding device described in claim 1, wherein the carrier holding portion has suction grooves on the first surface that vacuum-suck the carrier substrate, and the suction grooves are provided between adjacent second through holes. The joining device described in claim 1, wherein the first through holes and the second through holes are connected in a one-to-one relationship at the boundary between the carrier holding portion and the carrier. The joining device described in claim 1, wherein the pressing unit uses a plurality of the second through holes and a plurality of the first through holes to press one of the dies. A bonding method using the bonding apparatus described in any one of claims 1 to 8 to separate multiple dies from the carrier and bond them to the target substrate.