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WO2019080871A1 - Dispositif de masque et ensemble de masque de celui-ci, et plaque de masque - Google Patents

Dispositif de masque et ensemble de masque de celui-ci, et plaque de masque

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Publication number
WO2019080871A1
WO2019080871A1 PCT/CN2018/111651 CN2018111651W WO2019080871A1 WO 2019080871 A1 WO2019080871 A1 WO 2019080871A1 CN 2018111651 W CN2018111651 W CN 2018111651W WO 2019080871 A1 WO2019080871 A1 WO 2019080871A1
Authority
WO
WIPO (PCT)
Prior art keywords
mask
holes
hole
shape
shielding member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/111651
Other languages
English (en)
Chinese (zh)
Inventor
苏君海
龚建国
吴俊雄
冉应刚
柯贤军
李建华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Truly Huizhou Smart Display Ltd
Original Assignee
Truly Huizhou Smart Display Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Truly Huizhou Smart Display Ltd filed Critical Truly Huizhou Smart Display Ltd
Publication of WO2019080871A1 publication Critical patent/WO2019080871A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation

Definitions

  • the present application relates to the field of organic light-emitting display manufacturing technology, and in particular to a mask device, a mask assembly thereof, and a mask.
  • the most influential process of the AMOLED (Active-matrix organic light emitting diode) production process is the evaporation process.
  • the basic process of the evaporation process is to heat the organic material to evaporate the organic material.
  • the through holes etched by the high-precision fine mask are evaporated onto the glass substrate to form a light-emitting unit.
  • the evaporated organic material is evaporated onto the substrate through the through holes of the effective area of the mask to form an AA (Aive Area) area of the display screen, and the AA area is also referred to as a display area, that is,
  • the effective area of the mask corresponds to the AA area of the display.
  • the conventional mask is usually designed as Divide (in the form of a single strip) to correspond to a certain product model, and finally, a plurality of masks are separately soldered to the mask frame to correspond to the product layout of the substrate.
  • the mask Since the mask is in the form of a single strip, it is usually necessary to etch the effective area of the mask in the etch effective area of the mask and etch the Dummy (reserved area) of different shapes around the effective area to ensure masking. Under the influence of the tensioning force of the template, the mechanical properties of the effective area and the reserved area are as uniform as possible, and the deformation is reduced; however, the manufacturing process of such a single mask is complicated, and multiple exposures are usually required to respectively etch the effective area. Etching holes and etched holes in the reserved area;
  • the mask usually needs to be designed according to the specific product model, and then etched, and since the mask manufacturing cycle is usually long and the product model of the display is updated faster, this method cannot quickly correspond to the market. product demand;
  • the final typesetting of the substrate can only correspond to a certain product model, and the idle position in the typesetting cannot be reasonably utilized, so that the utilization rate of the glass substrate typesetting is low, resulting in high production cost.
  • a mask device a mask assembly thereof, and a mask are provided.
  • a mask device comprising: a mask assembly and a mask frame, the mask assembly comprising a mask and a shutter;
  • the edge of the mask is connected to the mask frame
  • each of the through holes is uniformly formed on the mask plate, the shape of each of the through holes is the same, and each of the through holes is equal in size, and the shielding member is provided with a plurality of through holes;
  • the shielding member abuts the masking plate, and each of the through holes is respectively aligned with a portion of the through hole on the masking plate, and the through opening communicates with each of the aligned through holes.
  • the shielding member blocks the remaining portion of the through hole provided on the mask.
  • each of the openings has the same shape.
  • At least two of the ports of each of the ports have different shapes.
  • the shape of the opening is an irregular shape.
  • the shutter is a shield film.
  • each of the through holes is disposed in a rectangular array.
  • At least two of the through ports have different shapes, the shape of the opening is irregular, and the shielding member is a shielding film, and each of the through holes is Rectangular array settings.
  • a mask assembly comprising a mask and a shutter
  • each of the through holes is uniformly formed on the mask plate, the shape of each of the through holes is the same, and each of the through holes is equal in size, and the shielding member is provided with a plurality of through holes;
  • the shielding member abuts the masking plate, and each of the through holes is respectively aligned with a portion of the through hole on the masking plate, and the through opening communicates with each of the aligned through holes.
  • the shielding member blocks the remaining portion of the through hole provided on the mask.
  • each of the openings has the same shape.
  • At least two of the ports of each of the ports have different shapes.
  • the edge of the mask plate is disposed to be connected to a mask frame, the mask plate is uniformly provided with a plurality of through holes, each of the through holes has the same shape, and each of the through holes The dimensions are equal.
  • the mask device, the mask assembly, the mask plate, and the mask frame are provided with only one mask plate, and the mask plate is a whole, and a through hole is uniformly formed thereon, and the mask plate is blocked by the shielding member.
  • the evaporation material is vapor-deposited through the port and the through hole to form a display area corresponding to the shape of the port.
  • the mask plate does not need to set different reserved areas according to different display areas, and only needs to be etched as a whole to reduce etching. The process reduces the complexity of the process.
  • the through-holes are uniformly formed in the mask plate as a whole, the mechanical properties of the portions of the mask plate tend to be uniform, and the deformation is effectively reduced, so that the vapor deposition effect is better, and on the other hand,
  • the nozzles of different shapes are arranged, so that the mask device can simultaneously evaporate display areas of different shapes, effectively utilize the idle position, improve the utilization ratio of the glass substrate, improve the evaporation efficiency, and effectively reduce the production cost, and further, corresponding to different displays.
  • the corresponding occlusion members can be set, and the mask can be redesigned to quickly adapt to the product update requirements.
  • FIG. 1 is a perspective exploded structural view of a mask device of an embodiment
  • FIG. 2 is a schematic view showing a structure of a mask of an embodiment
  • Fig. 3 is a schematic view showing the structure of a shutter of an embodiment.
  • a mask device includes a mask assembly and a mask frame, the mask assembly including a mask and a shutter; an edge of the mask is coupled to the mask frame; a plurality of through holes are uniformly formed on the film plate, the shape of each of the through holes is the same, and each of the through holes is equal in size, and the shielding member is provided with a plurality of openings; the shielding member abuts against the mask
  • Each of the through holes is respectively aligned with a portion of the through hole on the mask plate, and the through port is in communication with each of the aligned through holes, and the shielding member is disposed on the mask plate The remaining portion of the upper through hole.
  • a mask assembly includes a mask plate and a shutter; the mask plate is uniformly provided with a plurality of through holes, each of the through holes has the same shape, and each of the through holes has the same size.
  • the shielding member is provided with a plurality of openings; the shielding member abuts the masking plate, and each of the through holes is respectively aligned with a portion of the through hole on the masking plate, and the through opening is Each of the aligned through holes is in communication, and the shielding member blocks the remaining portion of the through hole on the mask.
  • a mask is disposed, the edge of the mask is disposed to be connected to a mask frame, and the mask is uniformly provided with a plurality of through holes, each of the through holes has the same shape, and each of the The through holes are equal in size.
  • only one mask plate is disposed on the mask frame, and the mask plate is a whole, and a through hole is uniformly formed thereon, and the mask plate is shielded by the shielding member, so that the vapor deposition material passes through the mouth and the through hole.
  • the hole is vapor-deposited into a display area corresponding to the shape of the port.
  • the mask plate does not need to set different reserved areas according to different display areas, and only needs to be etched as a whole, thereby reducing the etching process and reducing the process complexity.
  • the through-holes are uniformly formed in the mask plate as a whole, the mechanical properties of the portions of the mask plate tend to be uniform, and the deformation is effectively reduced, so that the vapor deposition effect is better.
  • the mask is masked.
  • the membrane device can simultaneously vaporize display areas of different shapes, effectively utilize the idle position, improve the utilization ratio of the glass substrate, improve the evaporation efficiency, and effectively reduce the production cost.
  • only the corresponding occlusion is set. You can quickly adapt to product update needs without having to redesign the mask.
  • a mask device 10 including: a mask assembly 20 and a mask frame 300, the mask assembly 20 includes a mask 100 and a shutter 200; The edge of the mask plate 100 is connected to the mask frame 300.
  • the mask plate 100 is uniformly provided with a plurality of through holes 101.
  • the shape of each of the through holes 101 is the same, and each of the through holes 101 is
  • the shielding member 200 is provided with a plurality of openings 201; the shielding member 200 abuts against the masking plate 100, and the portions of the opening ports 201 respectively aligned with the masking plate 100 are
  • the through hole 101 communicates with the aligned through holes 101, and the shutter 200 blocks the remaining portion of the through hole 101 on the mask plate 100.
  • the mask 100 is formed by etching to form a through hole 101 for vapor-depositing a pixel pattern, and the evaporated organic material is evaporated onto the substrate through the via hole 101 to form a pixel.
  • the through hole 101 is The hole is etched, for example, the through hole 101 is an evaporation hole.
  • the widths of the through holes 101 are equal.
  • the apertures of the through holes 101 are equal, since the through holes 101 on the mask 100 are uniformly disposed, and the shapes are the same and the dimensions are equal, so that the vaporized pixels are formed.
  • the mask 100 does not need to etch different types of reserved regions according to different display regions, but etches the vias 101 in a full-page manner, and only needs to be exposed once after etching, which reduces the etching process and reduces the process.
  • the complexity is effective in reducing the production cost of the mask 100.
  • the position between the openings 201 of the shielding member 200 corresponds to the reserved area of the mask 100, and the opening 201 of the shielding member 200 corresponds to the effective evaporation area of the mask 100, that is, the mask 100
  • the through hole 101 is uniformly formed in the effective evaporation zone and the reserved area, so that the mask 100 does not need to etch the reserved area according to the shape of the display area, and only the entire mask 100 needs to be etched, thereby reducing the process.
  • the complexity is effective in reducing the production cost of the mask 100.
  • the mask 100 and the shutter 200 are stacked, and the shutter 200 is used to block the mask 100.
  • the shutter 200 is used to block a part of the through holes 101 on the mask 100, so that the organic The material is evaporated on the substrate through the through opening 201 and the unobstructed through hole 101.
  • the shape of the opening 201 corresponds to the shape of the display area of the display screen, that is, the organic material is shielded by the shielding member 200, so that the organic material
  • the material passes only through the through hole 101 corresponding to the position of the port 201, and is evaporated onto the substrate, so that a display area having the same shape as that of the port 201 is formed on the substrate, and the portion of the mask 100 that is blocked by the blocking member 200 is A reserved area in which the position on the substrate corresponding to the reserved area is not evaporated.
  • the corresponding shielding member 200 can be disposed, and the corresponding shape and size of the opening 201 can be disposed on the shielding member 200, and the masking plate 100 can be redesigned, and the product updating requirement can be quickly adapted.
  • the position of the port 201 on the shielding member 200 can be flexibly adjusted to reduce the idle position and reduce the area of the reserved area, so that one evaporation can evaporate more display areas, improve the utilization rate of the glass substrate, and improve Evaporation efficiency and effective reduction of production costs.
  • a mask frame 300 corresponds to a mask 100.
  • a mask frame 300 is only connected to a mask 100.
  • a mask frame 300 is only soldered to a mask 100. That is, the mask 100 integrally covers the mask frame 300.
  • the mask 100 covers the entire edge of the mask frame 300, thus avoiding soldering the plurality of masks 100 to the mask frame 300, respectively.
  • the structure of the mask device 10 is made more compact, and the production efficiency of the mask device 10 is effectively improved. Since the mask plate 100 is integrally provided with the through holes 101, the overall mechanical properties of the mask plate 100 tend to be uniform, so that the mask plate 100 effectively reduces deformation when the tension is applied to the net, effectively avoids wrinkles and reduces steaming.
  • the plated product has a luminescent pixel color mixing, which makes the evaporation effect better.
  • connection between the mask frame 300 and the mask 100 can be implemented by the prior art, and the connection between the mask frame 300 and the mask 100 is not reduced to one due to the number of the mask 100. However, it becomes impossible to implement, and the specific connection between the two is not cumbersome in the present embodiment.
  • each of the through holes 201 has the same shape.
  • each of the through holes 201 has the same size.
  • the width of each of the through holes 201 is the same, so that a plurality of passes of the same shape and size are provided.
  • the port 201 enables the plurality of display areas to be vapor-deposited at the same time by the mask device 10, thereby effectively improving the evaporation efficiency and improving the production efficiency. Further, since the mask 101 is uniformly formed with the through holes 101 as a whole, the mask 100 is made.
  • the shape and distance of the through holes 101 of the upper portions are the same, so that the number of pixels and the pixel size of the plurality of display regions which are evaporated are the same, so that the display screens respectively made by the plurality of display areas respectively have the same pixel parameters. , effectively improve the vapor deposition accuracy.
  • At least two of the ports 201 of each of the ports 201 have different shapes, for example, The shape of the port 201 is different.
  • at least three of the ports 201 have different shapes, that is, at least two of the ports 201 formed in the shutter 200 are different in shape.
  • different display screens have different display shapes or sizes. According to the conventional mask 100, different display areas cannot be simultaneously evaporated on the glass substrate, resulting in low vapor deposition efficiency.
  • the display areas of different shapes can be simultaneously evaporated on the glass substrate to meet the requirements of different display screens, and on the other hand, different shapes
  • the port 201 is opened on the same shielding member 200.
  • the spacing of the port 201 can be adjusted by appropriately setting the position of the port 201, and the area of the free area can be reduced, so that the number of the ports 201 on the shielding member 200 is more.
  • the overall area of the port 201 is larger, so that more display regions can be vapor-deposited on the glass substrate in one vapor deposition, the vapor deposition efficiency is improved, and the glass substrate is fully utilized, and the utilization of the glass substrate is improved. rate.
  • the pitches of the through holes 101 on the same mask 100 are the same, the shapes, sizes, and pitches of the different display regions formed by evaporation are the same, that is, thereby The differently shaped displays will be based on the same separation rate or based on the same PPI.
  • the shape of the opening 201 formed on the same shielding member 200 includes a rectangle, a circle, and a square. Then, by the same evaporation, a rectangular display area, a circular display area, and a square display area can be formed on the glass substrate.
  • each display area formed by evaporation is cut, specifically, cut along the unvaporized area between the display areas, and correspondingly made into a rectangular display, a circular display and a square display
  • a rectangular display can be applied to electronic devices such as mobile phones and tablets
  • a circular display can be applied to an electronic watch
  • a square display can be applied to an electronic watch or other electronic device using a square display.
  • the shape, size and spacing of the through holes 101 on the mask 100 can be used according to different product PPI settings, corresponding to different PPI products, using the mask 100 corresponding to the PPI.
  • the same mask 100 can be used for products of different shapes based on the same PPI. In this way, based on the same PPI, only one mask 100 needs to be produced, and the shielding member 200 with different ports 201 is vapor-deposited into display areas of different shapes, and it is not necessary to etch different masks for different PPIs and different shapes of display areas.
  • the diaphragm 100 can thus effectively reduce the cost of the mask 100.
  • the shape of the port 201 is an irregular shape.
  • at least one of the ports 201 of each of the ports 201 has an irregular shape.
  • the cross-sectional shape of the port 201 is irregular.
  • the irregular shape is an irregular shape and an irregular shape.
  • the conventional shape may be a shape of a commonly used display screen such as a circle, a square, and a rectangle.
  • the irregular shape may be a shape formed by a part of a regular shape protrusion, or may be a shape formed by a partial shape of a regular shape. .
  • the irregular shape of the opening 201 is provided on the shielding member 200, which can adapt to the evaporation requirement of the shaped display area, and can better cooperate with the other openings 201 to reduce the spacing between the openings 201, so that the idle position is The area is reduced, so that the number of the ports 201 on one of the shielding members 200 is increased, thereby increasing the evaporation efficiency and further improving the utilization rate of the glass substrate.
  • the shutter 200 is a shield film.
  • the shielding film has a small thickness and is relatively soft in material and can sufficiently abut against the surface of the reserved area of the mask 100.
  • the shielding film is attached to the surface of the reserved area of the mask 100.
  • the shielding film can fully block the second through hole 101 of the reserved area, and avoid evaporation of the organic material at a position corresponding to the reserved area of the substrate. Further, since the shielding film has a small thickness, the overall thickness of the masking device 10 can be made smaller, and the evaporation effect of the masking device 10 is further improved.
  • the shutter 200 is a shielding piece.
  • the shielding sheet has a small thickness and has a large hardness, and has better meshing precision, so that the evaporation precision of the display area is higher.
  • the thickness of the shielding member 200 is 0.03 mm to 0.1 mm.
  • the thickness of the shielding member 200 is 0.05 mm to 0.008 mm. Therefore, since the shielding member 200 has a small thickness and has good flexibility, it can fully abut against the masking plate 100, so that the abutment between the two is tighter, so that the shielding member 200 faces the masking plate 100. The occlusion effect is better.
  • the blocking effect of the shielding member 200 on the masking plate 100 is better, for example, the thickness of the shielding member 200 and the masking plate 100 are
  • the material of the shielding member 200 is the same as that of the masking plate 100. That is, the shielding member 200 is made of the same material as the masking plate 100, so that the shielding member 200 can be made
  • the mask 100 has the same or similar mechanical properties, and has the same deformation or tensile force between the two, so that the shielding member 200 can fully abut the mask 100, so that the shielding member 200 faces the mask 100.
  • the occlusion effect is better.
  • the shielding member 200 is made of the same material as the masking plate 100, and is also formed by etching, that is, the opening 201 of the shielding member 200 is formed by etching, for example, the shielding member 200.
  • the port 201 is formed by laser etching.
  • each of the through holes 101 is disposed in a rectangular array.
  • each of the through holes 101 is equidistantly disposed, for example, the row spacing of each of the through holes 101 is equal, for example, the column pitch of each of the through holes 101 is equal, for example, the row spacing and the column pitch of each of the through holes 101.
  • the distribution of the through holes 101 on the mask 100 is more uniform on the one hand, which is advantageous for making the overall mechanical properties of the mask 100 more uniform, and avoiding wrinkles and deformation of the mask 100, so that the evaporation effect is more uniform.
  • the display panel has the same PPI on the same glass substrate, and the PPI of the display screen is the same, and the product consistency is better.
  • a mask assembly including a mask plate and a shutter; the mask plate is uniformly provided with a plurality of through holes, each of the through holes has the same shape, and each of the through holes The apertures are equal in size, and the shielding member is provided with a plurality of openings; the shielding member abuts the masking plate, and each of the through holes is respectively aligned with a portion of the through hole on the masking plate, and The through port is in communication with each of the aligned through holes, and the blocking member blocks the remaining portion of the through hole on the mask.
  • the mask assembly in this embodiment can be applied to the mask device in any of the above embodiments.
  • each of the ports has the same shape.
  • at least two of the ports in each of the ports have different shapes.
  • a mask is provided, the edge of the mask is disposed to be connected to a mask frame, and the mask is uniformly provided with a plurality of through holes, each of the through holes having the same shape And each of the through holes has the same size.
  • the mask is used to cover the edge of one of the mask frames, so that when the vapor deposition is performed, only one mask is disposed on the mask frame, and it is not necessary to solder a plurality of masks.
  • the mask assembly in this embodiment can be applied to the mask device in any of the above embodiments, or to the mask assembly in any of the above embodiments.
  • a mask assembly is provided. Please refer to FIG. 2 and FIG. 3, including a mask 100 and a shutter 200.
  • the mask 100 is uniformly provided with a plurality of through holes 101;
  • the shielding member 200 is in contact with the masking plate 100.
  • the shielding member 200 is provided with a plurality of openings 201.
  • Each of the openings 201 has an irregular shape, and the through opening 201 is aligned with the masking plate. a portion of the through hole 101 on the 100, and the through hole 201 communicates with each of the aligned through holes 101, and the shielding member 200 blocks the remaining portion of the through hole 101 on the mask plate 100. .
  • the mask 100 includes a plurality of reserved areas 120 and a plurality of effective evaporation zones 110, each of the reserved areas. 120 is disposed outside each of the effective evaporation zones 110, the shape of the port 201 matches the shape of the effective evaporation zone 110, and the port 201 is aligned with the effective evaporation zone 110;
  • the through hole 101 includes a plurality of first through holes 101a and a plurality of second through holes 101b. Each of the first through holes 101a is uniformly formed in the effective vapor deposition zone 110, and each of the second through holes 101b is uniformly opened.
  • the through hole 201 is in communication with each of the first through holes 101a, and the shielding member 200 is disposed in each of the second through holes 101b.
  • the mask assembly is divided into a reserved area 120 and an effective evaporation zone 110.
  • the effective evaporation zone 110 is an effective evaporation zone for vapor deposition to form effective pixels, for example, effective evaporation.
  • the region 110 is used for vapor deposition of the pixel pattern, and the evaporated organic material is evaporated onto the substrate through the first via hole 101a of the effective evaporation region 110, and the first via hole 101a is a pixel hole for evaporating the organic material. Penetrate and vapor deposit on the substrate.
  • the reserved area 120 is a non-vapor deposition area, and the reserved area 120 may also be referred to as a Dummy area.
  • the reserved area 120 can be regarded as an area formed by the mask assembly extending outside the effective evaporation zone 110, and the reserved area 120 is not used for evaporation.
  • each of the reserved areas 120 is respectively provided with a second through hole 101b, but the second through hole 101b is not used for evaporation, that is, the second through hole 101b does not pass through the evaporated organic material, in use.
  • the second through hole 101b of the reserved area 120 can be blocked by providing a barrier film in the reserved area 120 to prevent the evaporated organic material from passing through the second through hole 101b of the reserved area 120. That is to say, in the mask assembly of the present embodiment, the evaporation of the pixel pattern is performed only in the effective evaporation region 110 during the evaporation process, and the reserved region 120 does not vaporize the pixel pattern.
  • the effective vapor deposition zone 110 has an irregular shape, that is, the effective vapor deposition zone 110 is a profiled vapor deposition zone, and the profiled vapor deposition zone 110 is vapor deposited on the substrate to form a shaped pixel pattern. It is also the shaped AA area.
  • the shape of the port 201 is the same as the shape of the effective evaporation zone 110, and the size of the port 201 is equal to the size of the effective evaporation zone 110, for example, the cross section of the port 201
  • the shape of the effective evaporation zone 110 is the same, for example, the projection shape of the port 201 on the mask 100 is the same as the shape of the effective evaporation zone 110, and the port The projection of 201 on the mask 100 coincides with the effective evaporation zone 110.
  • the port 201 when the vapor deposition is performed, the port 201 is aligned with the effective vapor deposition zone 110, so that the first through holes 101a are aligned with the port 201, and the shielding member 200 abuts on the reserved area 120, and will be reserved.
  • the second through hole 101b of the region 120 is shielded, so that the evaporated organic material can be evaporated on the substrate through the port 201 and the first through hole 101a, and the second through hole 101b of the reserved region 120 is blocked, and the substrate is
  • the position corresponding to the reserved area 120 does not evaporate the organic material, and since the port 201 is better aligned with the effective evaporation zone 110, the shape of the AA zone is more accurate, thereby making the evaporation effect better.
  • the shape of the shutter 200 matches the shape of the reserved area 120, and the shutter 200 is aligned with the pre- Reservation area 120.
  • the shape of the shielding member 200 is the same as the shape of the reserved area 120.
  • the size of the shielding member 200 is equal to the size of the reserved area 120, so that the shape and reservation of the shielding member 200 are reserved.
  • the shapes of the regions 120 are equal, so that the shutter 200 is easily aligned with the reserved area 120, and the second through holes 101b of the reserved area 120 can be sufficiently completely shielded, thereby making the evaporation effect better.
  • the mask sheet 100 is further prevented from being wrinkled.
  • the shape of the second through hole 101b and the first through hole 101a are The shape is the same, and the size of the second through hole 101b is equal to the size of the first through hole 101a, and the interval between the second through holes 101b is equal to the distance between the first through holes 101a. .
  • the reserved area 120 defines the second through hole 101b, since the shape of the second through hole 101b is the same as the shape of the first through hole 101a, the size of the second through hole 101b is equal to the size of the first through hole 101a, and the second The spacing between the through holes 101b is equal to the spacing between the first through holes 101a, and therefore, the reserved area 120 has the same structure as the effective vapor deposition area 110, and therefore, the reserved area 120 has the effective evaporation area 110.
  • the reserved region 120 and the effective vapor deposition zone 110 have the same stress characteristics, so that the reserved region 120 and the effective vapor deposition zone 110 are not easily wrinkled under the influence of the tensioning force, thereby effectively avoiding pixel color mixing, thereby making it possible to avoid pixel color mixing.
  • the evaporation effect is better, and the yield of AMOLED is improved.
  • each of the first through holes 101a is disposed in a rectangular array
  • the second through holes 101b are disposed in a rectangular array
  • a row spacing of the second through holes 101b is different from that of the first through holes 101a.
  • the row spacing is equal
  • the column pitch of the second via hole 101b is equal to the column pitch of the first via hole 101a
  • at least a portion of the second via hole 101b is aligned with the first via hole 101.
  • the first through holes 101a are aligned, for example, at least one row of the second through holes 101b is aligned with a row of the first through holes 101a, for example, at least one column of the second through holes 101b is aligned with a row of the first through holes 101a That is, a portion of the second through holes 101b corresponding to the first through holes 101a in the reserved area 120, each row is aligned with a row of first through holes 101a, and each column is aligned with a column of the first through holes 101a.
  • each of the first through holes 101a is arranged in a plurality of rows and columns, and the row spacing between the first through holes 101a of the adjacent two rows is equal, and the first through holes of the adjacent two columns
  • the column spacings between 101a are equal
  • each of the second through holes 101b is arranged in a plurality of rows and columns, and the row spacing of the second through holes 101b is equal to the row spacing of the first through holes 101a, and the second through holes 101b are
  • the column pitch is equal to the column pitch of the first via hole 101a, and for the second via hole 101b partially aligned with the first via hole 101a, each row of the second via hole 101b is aligned with one row of the first via hole 101a, each column
  • the second through hole 101b is aligned with the first row of the first through holes 101a, such that the distribution structure of the second through holes 101b of the reserved area 120 is the same as that of the first through holes 101a of the effective vapor deposition zone 110, so that the reserved The region 120 has the
  • the row spacing of the first via holes 101a is equal to the column pitch, that is, the row spacing of the first via holes 101a is equal to the column pitch of the first via holes 101a, which is in the effective evaporation region 110 in this embodiment.
  • the first through holes 101a are equally spaced in the lateral direction and the longitudinal direction.
  • the row spacing of the second through holes 101b is equal to the column spacing.
  • the row spacing of the second through holes 101b is equal to the second through holes 101b.
  • the column spacing, the second through holes 101b of the reserved area 120 are also equally spaced in the lateral direction and the longitudinal direction, so that the opening distances between the reserved area 120 and the effective evaporation area 110 are equal, which is advantageous for further avoiding the mask.
  • the components produce wrinkles under the influence of the tensioning force, which further makes the evaporation effect better.
  • the effective evaporation zone 110 has an irregular shape.
  • the reserved area 120 is a hollow hollow irregular shape, and the shape of the reserved area 120 matches the shape of the effective vapor deposition area 110, and the reserved area 120 surrounds the irregular shape.
  • the vapor deposition zone 110 is such that, by the vapor deposition of the effective vapor deposition zone 110, an irregularly shaped pixel region is formed on the substrate, and the display area of the corresponding display screen is irregular.
  • the positional accuracy of the first through hole 101a is less than 10 ⁇ m, for example, the width of the first through hole 101a is greater than or equal to 20 ⁇ m, for example, the width of the first through hole 101a. Less than or equal to 30 ⁇ m.
  • the positional accuracy of the second through hole 101b is less than 10 ⁇ m, for example, the width of the second through hole 101b is greater than or equal to 20 ⁇ m, for example, the width of the second through hole 101b is less than or equal to 30 ⁇ m.
  • the second through hole 101b penetrates through two opposite surfaces of the reserved area 120, that is, the second through hole 101b is a through hole, and both ends of the second through hole 101b are transparent.
  • the structure of the second through hole 101b is made the same as that of the first through hole 101a, so that the reserved area 120 has the same mechanical properties as the effective vapor deposition area 110, so that the reserved area 120 and the effective evaporation area 110 are It is not easy to produce wrinkles between them, effectively avoiding pixel color mixing, which makes the evaporation effect better.
  • the via 101 on the mask assembly may be formed by etching.
  • the second The through hole 101b is a non-permeate hole.
  • the second through hole 101b is provided with a stopper film.
  • the two ends of the second through hole 101b are not transparent, specifically, the mask assembly is performed.
  • the second via hole 101b is formed by half etching on the reserved region 120, and the effective vapor deposition region 110 is completely etched to form the first via hole 101a, that is, when the reserved region 120 is etched, the second pass
  • the stopper film is etched in the hole 101b so that the two ends of the second through hole 101b are not transparent, and thus, the reserved area 120 is provided with the second through hole of the same shape and size as the first through hole 101a of the effective vapor deposition zone 110.
  • the reserved area 120 has the same mechanical properties as the effective vapor deposition zone 110, effectively avoiding wrinkles, and since the second through hole 101b is not transparent, the organic material after evaporation can be effectively prevented from passing, therefore, It is possible to avoid bits on the corresponding substrate of the reserved area 120 The organic material vapor deposition, thus making vapor deposition better.
  • the first through hole 101a may be a circular hole, a square hole or a polygonal hole for vapor deposition to form different pixel patterns.
  • the first through hole 101a and the second pass The holes 101b each have a circular cross section, and the apertures of the first through holes 101a and the apertures of the second through holes 101b are equal.
  • the first through hole 101a and the second through hole 101b are respectively circular in cross section.
  • the first through hole 101a and the second through hole 101b are respectively circular holes.
  • the first through hole 101a and the second through hole 101b respectively have a square cross section, and the width of the first through hole 101a and the width of the second through hole 101b are equal.
  • the first through hole 101a and the second through hole 101b are respectively square in cross section.
  • the first through hole 101a and the second through hole 101b are square holes, respectively.
  • the first through hole 101a and the second through hole 101b respectively have a polygonal cross section, and the width of the first through hole 101a and the width of the second through hole 101b are equal.
  • the cross-sections of the first through hole 101a and the second through hole 101b are respectively polygonal, and for example, the first through hole 101a and the second through hole 101b are polygonal holes, respectively.
  • the first through hole 101a is a circular hole, a square hole or a polygonal hole.
  • the first through hole 101a can also be an irregularly shaped through hole 101, which is not cumbersome in this embodiment, so that it can adapt to different pixels.
  • the vapor deposition requirement of the pattern in addition, since the second through hole 101b has the same shape as the first through hole 101a, the reserved area 120 and the effective vapor deposition area 110 have the same stress characteristics, so that the reserved area 120 and the effective evaporation are performed.
  • the area 110 is not easy to produce wrinkles under the influence of the tensioning force, and the pixel color mixing is effectively avoided, so that the evaporation effect is better.
  • the effective evaporation zone may be multiple, for example, two effective evaporation zones, two effective evaporation zones are adjacently disposed, and the reserved zone is disposed outside the two effective evaporation zones. And between two effective evaporation zones. For another example, there are three effective vapor deposition zones, and, for example, four effective vapor deposition zones. For the implementation of the plurality of effective vapor deposition zones, it is not cumbersome to describe in the embodiment that the number of the effective vapor deposition zones can be etched on the mask device according to the display requirements of the display screen, and the reserved area is set and effectively steamed.
  • the first through holes of the plating zone are shaped, sized, and spaced apart by the second through holes such that the reserved regions and the effective vapor deposition zones have the same stress characteristics.
  • the entire mask 100 is integrally formed with a through hole, and the pixel is opened only in the effective evaporation region of the conventional mask 100, and the pixel is opened in the effective evaporation portion of the entire mask 100.
  • the shape of the pixel opening of the non-active area (reserved area) is the same, and the entire mask 100 is completely filled with the through holes, so that the distribution of the through holes of the entire mask 100 is relatively uniform, so that the mask 100 is effective.
  • the overall mechanical properties of the vapor deposition zone and the reserved zone are consistent.
  • the effective vapor deposition zone and the reserved zone have the same performance parameters in the elastic modulus and the shear modulus, thereby making the high-precision fine mask 100 function in the tensioning force.
  • the lower deformation is consistent, and the high-precision fine mask 100 is prevented from being wrinkled, and the product luminescent pixel mixed by evaporation is reduced.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

La présente invention concerne un dispositif de masque (10), comprenant un ensemble de masque (200) et un cadre de masque (300), l'ensemble de masque (20) comprenant une plaque de masque (100) et un composant de blindage (200), le bord de la plaque de masque (100) étant relié au cadre de masque (300) ; la plaque de masque (100) est ouverte à intervalles réguliers sur celle-ci via de multiples orifices traversants (101, 101a, 101b), chaque orifice traversant (101, 101a, 101b) ayant la même forme, et chaque trou traversant (101, 101a, 101b) ayant la même taille, tandis que le composant de blindage (200) est ouvert avec de multiples ports traversants (201) ; le composant de blindage (200) vient en butée contre la plaque de masque (100), et chaque port traversant (201) est aligné avec une partie des orifices traversants (101, 101a, 101b) correspondants sur la plaque de masque (100), les ports traversants (201) communiquant avec chaque orifice traversant aligné (101, 101a, 101b), tandis que le composant de blindage (200) protège la partie restante des orifices traversants (101, 101a, 101b) sur la plaque de masque (100). L'invention concerne en outre un ensemble de masque (20) et une plaque de masque (100).
PCT/CN2018/111651 2017-10-25 2018-10-24 Dispositif de masque et ensemble de masque de celui-ci, et plaque de masque Ceased WO2019080871A1 (fr)

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CN201711006716.2A CN107653435A (zh) 2017-10-25 2017-10-25 掩膜装置及其掩膜组件、掩膜板

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CN111788327A (zh) * 2018-02-27 2020-10-16 夏普株式会社 成膜用掩模以及使用其之显示装置的制造方法
CN109023238B (zh) * 2018-08-30 2021-01-22 京东方科技集团股份有限公司 一种掩膜板及蒸镀装置
CN109306450B (zh) * 2018-11-28 2020-04-28 武汉华星光电半导体显示技术有限公司 蒸镀用掩模板组
KR102704885B1 (ko) * 2018-11-29 2024-09-11 삼성디스플레이 주식회사 마스크 조립체 및 이의 제조 방법
CN109763096A (zh) * 2019-03-19 2019-05-17 光驰科技(上海)有限公司 一种自带膜系切换功能的基板装载板及其镀膜方法
CN109750256B (zh) 2019-03-25 2020-12-18 京东方科技集团股份有限公司 掩膜组件的制备方法、掩膜组件
CN111172495A (zh) 2020-01-22 2020-05-19 京东方科技集团股份有限公司 掩模板及其制备方法、掩模板组件
CN112647041B (zh) * 2020-12-16 2023-06-27 业成科技（成都）有限公司 镀膜修正掩膜板及蒸镀系统
CN113106388A (zh) * 2021-04-14 2021-07-13 昆山国显光电有限公司 掩膜版及掩膜版的制作方法
CN114752885A (zh) * 2022-04-06 2022-07-15 重庆臻宝实业有限公司 一种能够减少半导体镀膜应力残留的纹理挡板
CN115394203A (zh) * 2022-09-13 2022-11-25 友达光电（昆山）有限公司 显示面板、显示装置及其制造方法
CN115627444B (zh) * 2022-11-02 2024-09-24 合肥维信诺科技有限公司 掩膜版组件及掩膜版组件的搬运方法
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