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WO2018135565A1 - Procédé de fabrication de panneaux à cristaux liquides - Google Patents

Procédé de fabrication de panneaux à cristaux liquides Download PDF

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Publication number
WO2018135565A1
WO2018135565A1 PCT/JP2018/001345 JP2018001345W WO2018135565A1 WO 2018135565 A1 WO2018135565 A1 WO 2018135565A1 JP 2018001345 W JP2018001345 W JP 2018001345W WO 2018135565 A1 WO2018135565 A1 WO 2018135565A1
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WO
WIPO (PCT)
Prior art keywords
liquid crystal
crystal panel
line
cutting
color filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/001345
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English (en)
Japanese (ja)
Inventor
真吾 茅野
哲孝 堂園
寛之 山内
康宏 柏原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NSC Co Ltd
Original Assignee
NSC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2017008725A external-priority patent/JP6519044B2/ja
Priority claimed from JP2017232348A external-priority patent/JP6534105B2/ja
Application filed by NSC Co Ltd filed Critical NSC Co Ltd
Priority to CN201880019033.7A priority Critical patent/CN110418996A/zh
Publication of WO2018135565A1 publication Critical patent/WO2018135565A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements

Definitions

  • the present invention relates to a method of manufacturing a liquid crystal panel for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multi-cavity processing for multi-planarizing a liquid crystal panel formed by bonding an array substrate and a color filter substrate.
  • liquid crystal panels when manufacturing liquid crystal panels, a method (so-called multi-sided) is widely used in which a plurality of liquid crystal panels are manufactured simultaneously with a pair of glass base materials, and then the glass base material is divided into a single liquid crystal panel. It has been. And when dividing
  • some conventional techniques employ an etching process that is devised so that the electrode terminal portion is also masked at the same time when the etchant is applied to the color filter substrate (see, for example, Patent Document 1). ). By adopting such a configuration, a separate process is not required for protecting the electrode terminal portion, and the electrode terminal portion is reliably protected.
  • An object of the present invention is to provide a liquid crystal panel manufacturing method that can eliminate the masking process associated with the etching process and can minimize the influence of side etching.
  • the method for producing a liquid crystal panel according to the present invention is to obtain a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multi-cavity processing for multi-planarizing a liquid crystal panel formed by bonding an array substrate and a color filter substrate.
  • the liquid crystal panel manufacturing method includes at least a modified line forming step, a groove forming step, an etching step, and a cutting step.
  • the modified line is formed on the array substrate and the color filter substrate along the planned cutting line corresponding to the shape of the liquid crystal panel, and is more easily etched than other portions.
  • a reforming line As a typical example of the method for forming the modified line, filament processing by a picosecond laser or a femtosecond laser can be cited.
  • the width of the reforming line is preferably set to approximately 10 ⁇ m or less.
  • a groove is formed in the color filter substrate along a terminal portion cutting planned line for removing a region of the color filter substrate facing the electrode terminal portion of the array substrate.
  • the method for forming the groove include a scribing process using a wheel cutter and a laser processing process in which a focus is set so as to cut only the color filter substrate.
  • the array substrate and the color filter substrate are etched while being prevented from being cut at the shape cutting planned line and the terminal portion cutting planned line.
  • the cutting groove and the like may penetrate in the thickness direction in the shape cutting planned line and the terminal portion cutting planned line, so the shape cutting planned line and the terminal at a slow etching rate of 3 ⁇ m / min or less. It is preferable to perform the etching process while confirming the state of the partial cutting planned line.
  • the cutting step after the etching process, cutting is performed at the shape cutting planned line and the terminal section cutting planned line.
  • the shape cutting planned line and the terminal section cutting planned line are substantially cut, so that complete cutting can be realized by applying a slight mechanical pressure or thermal stress. Is possible.
  • a minute pressing force By applying a minute ultrasonic vibration, or heating, it is possible to realize complete cutting without fouling the glass substrate for multiple surfaces.
  • masking for selectively etching only the shape cutting planned line and the terminal portion cutting planned line is performed in order to perform the etching process after making the shape cutting planned line and the terminal portion cutting planned line easy to cut in advance. No processing is required.
  • the shape cutting planned line and the terminal section cutting planned line are easily cut in advance, the etching amount can be significantly reduced compared with the case where the entire thickness direction is etched, so that the influence of side etching is minimized. Can be suppressed.
  • the modification line has a perforated shape having a plurality of through holes or a plurality of modified holes formed by a pulse laser beam. Because the planned cutting line of the liquid crystal panel is processed by a pulse laser, even if the contour of the liquid crystal panel contains complicated, curved or minute curved parts, or an opening is formed in the liquid crystal panel It becomes possible to realize appropriate processing.
  • the liquid crystal panel manufacturing method is to obtain a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multi-surface processing for multi-surface processing of a liquid crystal panel formed by bonding an array substrate and a color filter substrate.
  • This liquid crystal panel manufacturing method includes at least a modified line forming step, an etching step, a cutting step, and a terminal portion forming step.
  • the modified line is formed on the array substrate and the color filter substrate along the planned cutting line corresponding to the shape of the liquid crystal panel, and is more easily etched than other portions.
  • a reforming line As a typical example of the method for forming the modified line, filament processing by a picosecond laser or a femtosecond laser can be cited.
  • the width of the reforming line is preferably set to approximately 10 ⁇ m or less.
  • the array substrate and the color filter substrate are etched while being prevented from being cut along the shape cutting planned line.
  • the cutting groove and the like may penetrate the thickness cutting line in the thickness direction, so the etching process is performed while confirming the state of the shape cutting planned line at a slow etching rate of 10 ⁇ m / min or less. It is preferable to carry out.
  • cutting is performed at the shape cutting planned line. After the etching process, it is substantially cut along the shape cutting planned line. Further, a modified region exists at the center in the thickness direction, and the glass substrate is easily cut. For this reason, complete cutting can be realized by applying a slight mechanical pressure or thermal stress. For example, by applying a minute pressing force, applying a minute ultrasonic vibration, or heating, complete cutting can be realized without fouling the glass substrate for multiple surfaces.
  • the color filter substrate is removed along a terminal portion cutting planned line for removing the color filter substrate facing the region where the electrode terminal portions are formed on the array substrate.
  • the electrode terminal portion is formed on the main surface of the array substrate facing the color filter substrate on the array substrate, and the electrode terminal portion is exposed by removing the color filter substrate.
  • the terminal portion forming step can be performed at an arbitrary timing as long as it is at least after the etching step. For example, it may be performed before or after the cutting step, or simultaneously with the cutting step.
  • the etching process is performed after the shape cutting planned line is easily cut in advance, a masking process for selectively etching only the shape cutting planned line is unnecessary.
  • the shape cutting planned line is easily cut in advance, the etching amount can be remarkably reduced as compared with the case where the entire thickness direction is etched, thereby minimizing the influence of side etching. It becomes possible. As a result, it is possible to use the glass substrate for multi-chamfering with the liquid crystal panels arranged close together, and the chamfering efficiency is improved.
  • the modification line has a perforated shape having a plurality of through holes or a plurality of modified holes formed by a pulse laser beam. Since the planned cutting line of the liquid crystal panel is processed with a pulse laser, even if the contour of the liquid crystal panel contains complex or curved parts, or the liquid crystal panel has openings, appropriate processing Can be realized.
  • the terminal portion forming step includes a groove forming step and a breaking step.
  • the groove forming step is a process of forming a groove in the color filter substrate along the terminal portion cutting planned line.
  • the break step is a step of applying a pressing force to the groove formed along the terminal portion cutting planned line together with the shape cutting planned line in the cutting step.
  • the masking process accompanying the etching process is unnecessary, and the influence of side etching can be suppressed to the minimum.
  • FIG. 1 It is a figure which shows schematic structure of the liquid crystal panel which concerns on one Embodiment of this invention. It is a figure which shows schematic structure of the glass base material for multiple chamfering containing a some liquid crystal panel. It is a figure which shows the outline of the laser processing with respect to the multi-chamfer glass base material. It is a figure which shows the outline of the scribe break process with respect to the multi-chamfer glass base material. It is a figure which shows an example of the etching apparatus applied to this invention. It is a figure which shows the variation of the etching process applied to this invention. It is a figure which shows the outline of the glass base material for multiple chamfers of the parted state.
  • FIG. 1A shows a schematic configuration of a liquid crystal panel 10 according to an embodiment of the present invention.
  • the liquid crystal panel 10 is configured such that an array substrate 12 and a color filter substrate 14 are bonded together with a liquid crystal layer interposed therebetween. Since the configurations of the array substrate 12 and the color filter substrate 14 can be the same as known configurations, the description thereof is omitted here.
  • the array substrate 12 has an electrode terminal portion 122 provided so as to extend from a region bonded to the color filter substrate 14.
  • a plurality of electric circuits are connected to the electrode terminal portion 122, and the liquid crystal panel 10 and these electric circuits are housed in a housing, so that, for example, a smartphone 100 as shown in FIG. Composed.
  • the liquid crystal panel 10 is generally manufactured as a multi-chamfering glass base material 50 including a plurality of them, and the multi-chamfering glass base material 50 is divided. By doing so, a single liquid crystal panel 10 is obtained.
  • a description will be given of processing for a multi-chamfer glass base material 50 in which six liquid crystal panels 10 are arranged in a matrix of 3 rows and 2 columns.
  • the liquid crystal panel included in the multi-chamfer glass base material 50 The number of 10 can be increased or decreased as appropriate.
  • the glass substrate 50 for multi-face chamfering is provided with the reforming line 20 along the shape cutting planned line corresponding to the shape (contour) of the liquid crystal panel 10. It is formed.
  • the modification line 20 includes a plurality of filaments formed by a light beam pulse (a beam diameter of about 1 to 5 ⁇ m) irradiated from a pulse laser such as a picosecond laser (wavelength 515 nm) or a femtosecond laser (1030 nm). It is a filament array in which layers are arranged.
  • the light beam from the pico laser has a depth of focus deeper than a range including at least both the array substrate 12 and the color filter substrate 14. For this reason, the modification line 20 for dividing the liquid crystal panel 10 is formed simultaneously on both the array substrate 12 and the color filter substrate 14.
  • the reforming line 20 has a perforated shape having a plurality of through holes or modified layers as shown in FIG.
  • the reforming line 20 has a property that it is more easily etched than other portions of the multi-chamfer glass base material 50.
  • the shape of the reforming line 20 is not limited to the shape as shown in FIG. 3 (C), and may have other shapes.
  • a region facing the electrode terminal portion 122 of the array substrate 12 in the color filter substrate 14 is removed from the multi-chamfered glass base material 50 as shown in FIGS.
  • the process of forming the terminal part cutting groove 30 is performed.
  • the scribe wheel (wheel cutter) 250 forms the terminal portion cutting groove 30 inside the region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12.
  • the terminal portion cutting groove 30 is formed along a terminal portion cutting planned line in order to remove a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12.
  • the multi-chamfered glass base material 50 is introduced into the etching apparatus 300 and etched with an etching solution containing hydrofluoric acid and hydrochloric acid. Is given.
  • the etching apparatus 300 the multi-chamfering glass base material 50 is transported by the transport roller, and an etching solution is brought into contact with one or both surfaces of the multi-chamfering glass base material 50 in the etching chamber, whereby the multi-chamfering glass base material 50 is contacted. An etching process for 50 is performed.
  • the multi-surface glass base material 50 is removed from the etchant. In this state, it is discharged from the etching apparatus 300.
  • the etchant is applied to the multi-chamfer glass base material 50 in each etching chamber 302 of the etching apparatus 300.
  • Spray etching for spraying.
  • FIG. 6 (B) a structure in which the glass substrate 50 for multi-faces is conveyed while contacting the overflowed etching solution is adopted. Is also possible.
  • dip type etching is employed in which one or a plurality of multi-surface glass base materials 50 stored in a carrier are immersed in an etching tank 306 in which an etching solution is stored. It is also possible to do.
  • the etching process proceeds at a slow rate of 3 ⁇ m / min or less with a thin hydrofluoric acid of 2% by weight or less, but is not limited to this method.
  • the etching rate is not slowed down in the whole etching process but is gradually increased while initially adopting a faster etching rate, it is possible to shorten the etching process time.
  • a configuration in which the hydrofluoric acid concentration in the etching solution is lowered as the process proceeds to the subsequent stage of the etching apparatus 300 may be employed.
  • the reforming line 20 and the terminal portion cutting groove 30 are etched.
  • the etching solution penetrates faster than other portions, and the glass is melted along this line, so that the color filter substrate can be easily cut by the reforming line 20. Further, even if a scratch or the like is generated at the time of laser irradiation, the scratch is easily lost.
  • the modified line 20 is formed by laser filament processing, and the modified line is further etched to modify the multi-chamfer glass base material 50 with a slight mechanical pressure.
  • the quality line 20 can be divided. For example, by applying a minute pressing force to the multi-chamfering glass base material 50 or applying microscopic ultrasonic vibration, the multi-chamfering glass base material 50 is not soiled as shown in FIG. It is possible to divide.
  • the etching process does not completely cut it, it is possible to prevent the occurrence of a problem such that the end faces of the liquid crystal panel 10 separated during the etching collide with each other and are damaged. Further, the multi-chamfered glass base material 50 in an incompletely cut state after the etching process can be transported as it is (in a large format). Furthermore, since the etching solution does not reach the electrode terminal portion, it is not necessary to protect the electrode terminal portion with a masking agent having etching resistance. In addition, since at least the central portion of the end face of the liquid crystal panel 10 is etched, the strength (for example, bending strength) of the liquid crystal panel is higher than when cutting is performed only by laser processing.
  • the end surface of the liquid crystal panel 10 is substantially perpendicular to the main surface.
  • the taper width (L1 to L4 in FIG. 8C) generated on each end face of the array substrate 12 and the color filter substrate 14 each having a plate thickness of about 0.15 mm to 0.25 mm is 50 ⁇ m or less (mostly 20 to 35 ⁇ m).
  • the glass substrate 50 for multi-sided drawing in which the liquid crystal panels 10 are arranged close to each other. For example, if there are gaps of about 10 ⁇ m in total with a laser width of 2 ⁇ m + ⁇ , it is possible to properly separate the glass substrate for multi-face 50 into a single liquid crystal panel 10.
  • the multi-chamfered glass base material 50 is introduced into the etching apparatus 300 and is subjected to an etching process with an etching solution containing hydrofluoric acid and hydrochloric acid.
  • the multi-chamfering glass base material 50 is transported by the transport roller, and an etching solution is brought into contact with one or both surfaces of the multi-chamfering glass base material 50 in the etching chamber, whereby the multi-chamfering glass base material 50 is contacted.
  • An etching process for 50 is performed.
  • the multi-surface glass base material 50 is removed from the etchant. In this state, it is discharged from the etching apparatus 300.
  • the etching solution is applied to the multi-chamfering glass base material 50 in each etching chamber 302 of the etching apparatus 300.
  • Spray etching for spraying.
  • the overflow type etching chamber 304 adopts a configuration in which the glass substrate 50 for multi-face drawing is conveyed while being in contact with the overflowed etching solution. Is also possible.
  • dip type etching is employed in which one or a plurality of multi-surface glass base materials 50 stored in a carrier are immersed in an etching tank 306 in which an etching solution is stored. It is also possible to do.
  • the etching process proceeds at a slow rate of 10 ⁇ m / min or less with 2% by weight or less of thin hydrofluoric acid, but the present invention is not limited to this method.
  • the etching rate is not slowed down in the whole etching process but is gradually increased while initially adopting a faster etching rate, it is possible to shorten the etching process time.
  • the modified line 20 is etched.
  • the etchant permeates faster than other portions, and the glass is melted along this line, so that the planned cutting groove 26 is formed.
  • the planned cutting groove 26 is not an isotropic groove formed by normal etching, and the aspect ratio in the depth direction is larger than the width direction. For this reason, even if it is the glass base material 50 for multiple chamfers where each liquid crystal panel adjoins, the cutting planned groove
  • the planned cutting groove 26 is formed in the array substrate 12 or the color filter substrate 14 so as not to penetrate completely in the thickness direction.
  • the thickness of the lower portion of the planned cutting groove 26 is preferably 100 ⁇ m or less. When the plate thickness exceeds 100 ⁇ m, it may be difficult to divide in the cutting step.
  • the strength of the shape cutting planned line is reduced due to the planned cutting groove 26 and the modified region (modified line 20) existing below the planned cutting groove 26. For this reason, it is possible to divide the multi-chamfering glass base material 50 in the reforming line 20 only by applying a slight mechanical pressure to the planned cutting line. Specifically, it can be divided by applying a minute pressing force to the multi-chamfer glass base material 50 or applying a minute ultrasonic vibration.
  • the liquid crystal panel 10 was divided using a pressing instrument 60 as shown in FIG.
  • the pressing instrument 60 has a rod shape and has a spherical rotating jig 62 at the tip.
  • the rotating jig 62 is rotatably supported at the distal end portion of the pressing instrument 60.
  • the rotating jig 62 is configured to rotate by moving the pressing tool 60 along the planned cutting line while pressing the pressing tool 60 against the planned cutting groove 26.
  • a stress is applied to the modified region below the planned cutting groove 26 by the pressing tool 60, a crack occurs and the liquid crystal panel 10 can be divided.
  • the pressing instrument 60 it is possible to divide the liquid crystal panel 10 while preventing the multi-chamfered glass base material 50 from being soiled or contacting the end surfaces.
  • a cutting process for removing a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12 is performed.
  • a scribe wheel (wheel cutter) 250 cuts the inner side of a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12 along a terminal portion cutting planned line.
  • a terminal part cutting groove 30 is formed in the color filter substrate 14 along the terminal part cutting planned line by the scribe wheel 250.
  • the color filter substrate 14 can be removed in the terminal portion cutting groove 30 by applying a pressing force to the terminal portion cutting groove 30 with the pressing tool 60 or the like.
  • the multi-chamfer glass base material 50 is not completely cut by the etching process, there is a problem that the end faces of the liquid crystal panel 10 separated during the etching collide and are damaged. Is prevented. Further, the multi-chamfered glass base material 50 in an incompletely cut state after the etching process can be transported as it is (in a large format). Furthermore, since the etching solution does not reach the electrode terminal portion 122, it is not necessary to protect the electrode terminal portion with a masking agent having etching resistance. In addition, since at least the central portion of the end face of the liquid crystal panel 10 is etched, the strength (for example, bending strength) of the liquid crystal panel is higher than when cutting is performed only by laser processing.
  • FIGS. 13A to 13C show a schematic configuration of the liquid crystal panel 10 after the division.
  • the end surface of the liquid crystal panel 10 is substantially perpendicular to the main surface.
  • the taper width (L1 to L3 in FIG. 13C) generated on each end face of the array substrate 12 and the color filter substrate 14 each having a plate thickness of about 0.15 mm to 0.25 mm is 50 ⁇ m or less (mostly 20 to 35 ⁇ m).
  • the glass substrate 50 for multi-sided drawing in which the liquid crystal panels 10 are arranged close to each other. For example, if there are gaps of about 10 ⁇ m in total with a laser width of 2 ⁇ m + ⁇ , it is possible to properly separate the glass substrate for multi-face 50 into a single liquid crystal panel 10. Further, the shape of the liquid crystal panel is not limited to that of the present embodiment, and for example, a liquid crystal panel having a notch can be used.
  • the color filter substrate 14 is removed in the region facing the electrode terminal portion 122.
  • the color filter substrate 14 is cut. Can be performed at an arbitrary timing. For example, as shown in FIGS. 14 (A) and 14 (B), a terminal cutting groove is formed along the terminal portion cutting planned line using a scribe wheel 250 with respect to the glass substrate 50 for multi-chamfer after etching treatment. 30 is formed.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Surface Treatment Of Glass (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)

Abstract

Le problème décrit par la présente invention est de fournir un procédé de fabrication d'un panneau à cristaux liquides, dans lequel un un traitement de masquage qui accompagne un traitement de gravure peut être rendu inutile, et l'effet de gravure latérale peut être maintenu à un minimum. [Solution] le procédé de fabrication d'un panneau à cristaux liquides selon la présente invention comprend au moins une étape de formation de ligne modifiée, une étape de formation de rainure, une étape de gravure et une étape de découpe. Dans l'étape de formation de ligne modifiée, une ligne modifiée formée le long d'une ligne de coupe prévue de forme correspondant à la forme d'un panneau à cristaux liquides, la ligne modifiée ayant la propriété d'être plus facilement gravée que d'autres emplacements, est formée sur un substrat de réseau et un substrat de filtre coloré. Dans l'étape de formation de rainure, une rainure est formée dans le substrat de filtre coloré le long d'une ligne de coupe prévue de partie de borne pour exclure une région du substrat de filtre coloré qui fait face à une partie de borne d'électrode du substrat de réseau.
PCT/JP2018/001345 2017-01-20 2018-01-18 Procédé de fabrication de panneaux à cristaux liquides Ceased WO2018135565A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201880019033.7A CN110418996A (zh) 2017-01-20 2018-01-18 液晶面板制造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-008725 2017-01-20
JP2017008725A JP6519044B2 (ja) 2017-01-20 2017-01-20 液晶パネル製造方法
JP2017232348A JP6534105B2 (ja) 2017-12-04 2017-12-04 液晶パネル製造方法
JP2017-232348 2017-12-04

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WO2018135565A1 true WO2018135565A1 (fr) 2018-07-26

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