WO2018135565A1 - Method for manufacturing liquid crystal panel - Google Patents

Abstract

[Problem] To provide a method for manufacturing a liquid crystal panel, whereby masking treatment that accompanies etching treatment can be made unnecessary, and the effect of side etching can be kept to a minimum. [Solution] The method for manufacturing a liquid crystal panel according to the present invention includes at least a modified-line formation step, a groove formation step, an etching step, and a cutting step. In the modified-line formation step, a modified line formed along a shape intended cutting line corresponding to the shape of a liquid crystal panel, the modified line having the property of being more readily etched than other locations, is formed on an array substrate and a color filter substrate. In the groove formations step, a groove is formed in the color filter substrate along a terminal part intended cutting line for excluding a region of the color filter substrate that faces an electrode terminal part of the array substrate.

Description

Liquid crystal panel manufacturing method

The present invention relates to a method of manufacturing a liquid crystal panel for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multi-cavity processing for multi-planarizing a liquid crystal panel formed by bonding an array substrate and a color filter substrate.

Generally, when manufacturing liquid crystal panels, a method (so-called multi-sided) is widely used in which a plurality of liquid crystal panels are manufactured simultaneously with a pair of glass base materials, and then the glass base material is divided into a single liquid crystal panel. It has been. And when dividing | segmenting a glass base material, methods, such as a scribe break, a laser ablation process, and an etching process, were often used.

However, when a scribe break is employed, it is difficult to form a panel having a rounded outline. In laser ablation processing, problems such as slow processing speed and contamination due to ablation debris are likely to occur. Furthermore, in the etching process, it is necessary to separately perform an appropriate masking process in order to protect the electrode terminal portion of the array substrate from the etching solution, and thus it may be difficult to improve the production efficiency.

Therefore, some conventional techniques employ an etching process that is devised so that the electrode terminal portion is also masked at the same time when the etchant is applied to the color filter substrate (see, for example, Patent Document 1). ). By adopting such a configuration, a separate process is not required for protecting the electrode terminal portion, and the electrode terminal portion is reliably protected.

Japanese Unexamined Patent Publication No. 2016-224201

However, in the above-described prior art, it is no longer necessary to independently perform a process for protecting the electrode terminal portion, but it is still necessary to perform a masking process on the glass base material in the etching process, and after the etching process, This had to be peeled off. In addition, in consideration of the influence of side etching that proceeds in a direction perpendicular to the thickness direction of the glass base material, it is necessary to provide a space between the liquid crystal panels in the glass base material. It was.

An object of the present invention is to provide a liquid crystal panel manufacturing method that can eliminate the masking process associated with the etching process and can minimize the influence of side etching.

The method for producing a liquid crystal panel according to the present invention is to obtain a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multi-cavity processing for multi-planarizing a liquid crystal panel formed by bonding an array substrate and a color filter substrate. The liquid crystal panel manufacturing method includes at least a modified line forming step, a groove forming step, an etching step, and a cutting step.

In the modified line forming step, the modified line is formed on the array substrate and the color filter substrate along the planned cutting line corresponding to the shape of the liquid crystal panel, and is more easily etched than other portions. To form a reforming line. As a typical example of the method for forming the modified line, filament processing by a picosecond laser or a femtosecond laser can be cited. The width of the reforming line is preferably set to approximately 10 μm or less.

In the groove forming step, a groove is formed in the color filter substrate along a terminal portion cutting planned line for removing a region of the color filter substrate facing the electrode terminal portion of the array substrate. Examples of the method for forming the groove include a scribing process using a wheel cutter and a laser processing process in which a focus is set so as to cut only the color filter substrate.

In the etching step, the array substrate and the color filter substrate are etched while being prevented from being cut at the shape cutting planned line and the terminal portion cutting planned line. As the etching process proceeds, the cutting groove and the like may penetrate in the thickness direction in the shape cutting planned line and the terminal portion cutting planned line, so the shape cutting planned line and the terminal at a slow etching rate of 3 μm / min or less. It is preferable to perform the etching process while confirming the state of the partial cutting planned line.

In the cutting step, after the etching process, cutting is performed at the shape cutting planned line and the terminal section cutting planned line. After the etching process, the shape cutting planned line and the terminal section cutting planned line are substantially cut, so that complete cutting can be realized by applying a slight mechanical pressure or thermal stress. Is possible. By applying a minute pressing force, applying a minute ultrasonic vibration, or heating, it is possible to realize complete cutting without fouling the glass substrate for multiple surfaces.

In the present invention, masking for selectively etching only the shape cutting planned line and the terminal portion cutting planned line is performed in order to perform the etching process after making the shape cutting planned line and the terminal portion cutting planned line easy to cut in advance. No processing is required. In addition, since the shape cutting planned line and the terminal section cutting planned line are easily cut in advance, the etching amount can be significantly reduced compared with the case where the entire thickness direction is etched, so that the influence of side etching is minimized. Can be suppressed. As a result, it is possible to use the glass substrate for multi-chamfering with the liquid crystal panels arranged close to each other, and the chamfering efficiency is improved.

In the liquid crystal panel manufacturing method described above, it is preferable that the modification line has a perforated shape having a plurality of through holes or a plurality of modified holes formed by a pulse laser beam. Because the planned cutting line of the liquid crystal panel is processed by a pulse laser, even if the contour of the liquid crystal panel contains complicated, curved or minute curved parts, or an opening is formed in the liquid crystal panel It becomes possible to realize appropriate processing.

In addition, the liquid crystal panel manufacturing method according to the present invention is to obtain a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multi-surface processing for multi-surface processing of a liquid crystal panel formed by bonding an array substrate and a color filter substrate. This liquid crystal panel manufacturing method includes at least a modified line forming step, an etching step, a cutting step, and a terminal portion forming step.

In the modified line forming step, the modified line is formed on the array substrate and the color filter substrate along the planned cutting line corresponding to the shape of the liquid crystal panel, and is more easily etched than other portions. To form a reforming line. As a typical example of the method for forming the modified line, filament processing by a picosecond laser or a femtosecond laser can be cited. The width of the reforming line is preferably set to approximately 10 μm or less.

In the etching step, the array substrate and the color filter substrate are etched while being prevented from being cut along the shape cutting planned line. As the etching process progresses, the cutting groove and the like may penetrate the thickness cutting line in the thickness direction, so the etching process is performed while confirming the state of the shape cutting planned line at a slow etching rate of 10 μm / min or less. It is preferable to carry out.

In the cutting step, after the etching process, cutting is performed at the shape cutting planned line. After the etching process, it is substantially cut along the shape cutting planned line. Further, a modified region exists at the center in the thickness direction, and the glass substrate is easily cut. For this reason, complete cutting can be realized by applying a slight mechanical pressure or thermal stress. For example, by applying a minute pressing force, applying a minute ultrasonic vibration, or heating, complete cutting can be realized without fouling the glass substrate for multiple surfaces.

In the terminal portion forming step, the color filter substrate is removed along a terminal portion cutting planned line for removing the color filter substrate facing the region where the electrode terminal portions are formed on the array substrate. The electrode terminal portion is formed on the main surface of the array substrate facing the color filter substrate on the array substrate, and the electrode terminal portion is exposed by removing the color filter substrate. Note that the terminal portion forming step can be performed at an arbitrary timing as long as it is at least after the etching step. For example, it may be performed before or after the cutting step, or simultaneously with the cutting step.

In the present invention, since the etching process is performed after the shape cutting planned line is easily cut in advance, a masking process for selectively etching only the shape cutting planned line is unnecessary. In addition, since the shape cutting planned line is easily cut in advance, the etching amount can be remarkably reduced as compared with the case where the entire thickness direction is etched, thereby minimizing the influence of side etching. It becomes possible. As a result, it is possible to use the glass substrate for multi-chamfering with the liquid crystal panels arranged close together, and the chamfering efficiency is improved.

In the liquid crystal panel manufacturing method described above, it is preferable that the modification line has a perforated shape having a plurality of through holes or a plurality of modified holes formed by a pulse laser beam. Since the planned cutting line of the liquid crystal panel is processed with a pulse laser, even if the contour of the liquid crystal panel contains complex or curved parts, or the liquid crystal panel has openings, appropriate processing Can be realized.

Further, it is preferable that the terminal portion forming step includes a groove forming step and a breaking step. The groove forming step is a process of forming a groove in the color filter substrate along the terminal portion cutting planned line. The break step is a step of applying a pressing force to the groove formed along the terminal portion cutting planned line together with the shape cutting planned line in the cutting step. By performing the process of processing the terminal portion simultaneously with the division of the liquid crystal panel, the production efficiency is further improved.

According to the present invention, in the manufacture of the liquid crystal panel, the masking process accompanying the etching process is unnecessary, and the influence of side etching can be suppressed to the minimum.

It is a figure which shows schematic structure of the liquid crystal panel which concerns on one Embodiment of this invention. It is a figure which shows schematic structure of the glass base material for multiple chamfering containing a some liquid crystal panel. It is a figure which shows the outline of the laser processing with respect to the multi-chamfer glass base material. It is a figure which shows the outline of the scribe break process with respect to the multi-chamfer glass base material. It is a figure which shows an example of the etching apparatus applied to this invention. It is a figure which shows the variation of the etching process applied to this invention. It is a figure which shows the outline of the glass base material for multiple chamfers of the parted state. It is a figure which shows the characteristic of a structure of a liquid crystal panel. It is a figure which shows an example of the etching apparatus applied to this invention. It is a figure which shows the variation of the etching process applied to this invention. It is a figure which shows the state of the shape cutting planned line by which the etching process was carried out. It is a figure which shows the outline of the glass base material for multiple chamfers of the parted state. It is a figure which shows the characteristic of a structure of a liquid crystal panel. It is a figure which shows other embodiment in the division | segmentation of a liquid crystal panel.

FIG. 1A shows a schematic configuration of a liquid crystal panel 10 according to an embodiment of the present invention. As shown in the figure, the liquid crystal panel 10 is configured such that an array substrate 12 and a color filter substrate 14 are bonded together with a liquid crystal layer interposed therebetween. Since the configurations of the array substrate 12 and the color filter substrate 14 can be the same as known configurations, the description thereof is omitted here.

The array substrate 12 has an electrode terminal portion 122 provided so as to extend from a region bonded to the color filter substrate 14. A plurality of electric circuits are connected to the electrode terminal portion 122, and the liquid crystal panel 10 and these electric circuits are housed in a housing, so that, for example, a smartphone 100 as shown in FIG. Composed.

Subsequently, an example of a method for manufacturing the liquid crystal panel 10 will be described. As shown in FIGS. 2A and 2B, the liquid crystal panel 10 is generally manufactured as a multi-chamfering glass base material 50 including a plurality of them, and the multi-chamfering glass base material 50 is divided. By doing so, a single liquid crystal panel 10 is obtained. In this embodiment, for the sake of convenience, a description will be given of processing for a multi-chamfer glass base material 50 in which six liquid crystal panels 10 are arranged in a matrix of 3 rows and 2 columns. However, the liquid crystal panel included in the multi-chamfer glass base material 50 The number of 10 can be increased or decreased as appropriate.

As shown in FIGS. 3 (A) to 3 (C), first, the glass substrate 50 for multi-face chamfering is provided with the reforming line 20 along the shape cutting planned line corresponding to the shape (contour) of the liquid crystal panel 10. It is formed. The modification line 20 includes a plurality of filaments formed by a light beam pulse (a beam diameter of about 1 to 5 μm) irradiated from a pulse laser such as a picosecond laser (wavelength 515 nm) or a femtosecond laser (1030 nm). It is a filament array in which layers are arranged. The light beam from the pico laser has a depth of focus deeper than a range including at least both the array substrate 12 and the color filter substrate 14. For this reason, the modification line 20 for dividing the liquid crystal panel 10 is formed simultaneously on both the array substrate 12 and the color filter substrate 14.

In principle, it is possible to process both the array substrate 12 and the color filter substrate 14 with one laser at the same time. However, if this causes a problem in the liquid crystal layer, the array substrate 12 is viewed from the array substrate 12 side. By forming the reforming line 20 only on the color filter substrate 14 and forming the reforming line 20 only on the color filter substrate 14 from the color filter substrate 14 side, the occurrence of defects in the liquid crystal layer can be easily suppressed.

In this embodiment, the reforming line 20 has a perforated shape having a plurality of through holes or modified layers as shown in FIG. The reforming line 20 has a property that it is more easily etched than other portions of the multi-chamfer glass base material 50. Of course, the shape of the reforming line 20 is not limited to the shape as shown in FIG. 3 (C), and may have other shapes.

Subsequently, as shown in FIGS. 4A to 4C, a region facing the electrode terminal portion 122 of the array substrate 12 in the color filter substrate 14 is removed from the multi-chamfered glass base material 50 as shown in FIGS. The process of forming the terminal part cutting groove 30 is performed. In this embodiment, the scribe wheel (wheel cutter) 250 forms the terminal portion cutting groove 30 inside the region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12. The terminal portion cutting groove 30 is formed along a terminal portion cutting planned line in order to remove a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12.

When the formation of the terminal portion cutting groove 30 by the scribe wheel 250 is finished, as shown in FIG. 5, the multi-chamfered glass base material 50 is introduced into the etching apparatus 300 and etched with an etching solution containing hydrofluoric acid and hydrochloric acid. Is given. In the etching apparatus 300, the multi-chamfering glass base material 50 is transported by the transport roller, and an etching solution is brought into contact with one or both surfaces of the multi-chamfering glass base material 50 in the etching chamber, whereby the multi-chamfering glass base material 50 is contacted. An etching process for 50 is performed. In addition, since a cleaning chamber for washing away the etchant adhering to the multi-surface glass base material 50 is provided in the subsequent stage of the etching chamber in the etching apparatus 300, the multi-surface glass base material 50 is removed from the etchant. In this state, it is discharged from the etching apparatus 300.

As an example of a method of bringing the etching solution into contact with the multi-chamfer glass base material 50, as shown in FIG. 6A, the etchant is applied to the multi-chamfer glass base material 50 in each etching chamber 302 of the etching apparatus 300. Spray etching for spraying. Further, instead of spray etching, as shown in FIG. 6 (B), in the overflow type etching chamber 304, a structure in which the glass substrate 50 for multi-faces is conveyed while contacting the overflowed etching solution is adopted. Is also possible.

Furthermore, as shown in FIG. 6 (C), dip type etching is employed in which one or a plurality of multi-surface glass base materials 50 stored in a carrier are immersed in an etching tank 306 in which an etching solution is stored. It is also possible to do.

In any case, it is important that the shape cutting planned line and the terminal portion cutting planned groove penetrate in the thickness direction and the multi-chamfer glass base material 50 is not divided during the etching process. It is. For this reason, during the etching process (particularly in the latter half of the etching process), it is necessary to slow the etching rate and accurately control the etching amount. In this embodiment, the etching process proceeds at a slow rate of 3 μm / min or less with a thin hydrofluoric acid of 2% by weight or less, but is not limited to this method.

If the etching rate is not slowed down in the whole etching process but is gradually increased while initially adopting a faster etching rate, it is possible to shorten the etching process time. For example, a configuration in which the hydrofluoric acid concentration in the etching solution is lowered as the process proceeds to the subsequent stage of the etching apparatus 300 may be employed.

When the multi-chamfer glass base material 50 passes through the etching apparatus 300, the reforming line 20 and the terminal portion cutting groove 30 are etched. In the reforming line 20, the etching solution penetrates faster than other portions, and the glass is melted along this line, so that the color filter substrate can be easily cut by the reforming line 20. Further, even if a scratch or the like is generated at the time of laser irradiation, the scratch is easily lost.

In the multi-chamfer glass base material 50, the modified line 20 is formed by laser filament processing, and the modified line is further etched to modify the multi-chamfer glass base material 50 with a slight mechanical pressure. The quality line 20 can be divided. For example, by applying a minute pressing force to the multi-chamfering glass base material 50 or applying microscopic ultrasonic vibration, the multi-chamfering glass base material 50 is not soiled as shown in FIG. It is possible to divide.

Since the etching process does not completely cut it, it is possible to prevent the occurrence of a problem such that the end faces of the liquid crystal panel 10 separated during the etching collide with each other and are damaged. Further, the multi-chamfered glass base material 50 in an incompletely cut state after the etching process can be transported as it is (in a large format). Furthermore, since the etching solution does not reach the electrode terminal portion, it is not necessary to protect the electrode terminal portion with a masking agent having etching resistance. In addition, since at least the central portion of the end face of the liquid crystal panel 10 is etched, the strength (for example, bending strength) of the liquid crystal panel is higher than when cutting is performed only by laser processing.

8A to 8C show a schematic configuration of the liquid crystal panel 10 after the division. As shown in the figure, the end surface of the liquid crystal panel 10 is substantially perpendicular to the main surface. For example, the taper width (L1 to L4 in FIG. 8C) generated on each end face of the array substrate 12 and the color filter substrate 14 each having a plate thickness of about 0.15 mm to 0.25 mm is 50 μm or less (mostly 20 to 35 μm).

As described above, when the liquid crystal panel 10 is manufactured, the influence of side etching hardly occurs. Therefore, it is possible to design the glass substrate 50 for multi-sided drawing in which the liquid crystal panels 10 are arranged close to each other. For example, if there are gaps of about 10 μm in total with a laser width of 2 μm + α, it is possible to properly separate the glass substrate for multi-face 50 into a single liquid crystal panel 10.

Subsequently, another embodiment of the present invention will be described with reference to FIGS. In this embodiment, the steps up to the formation of the reforming line 20 are the same as those described above, and a description thereof will be omitted. Hereinafter, after the reforming line 20 is formed will be described.

When the formation of the reforming line 20 is completed, as shown in FIG. 9, the multi-chamfered glass base material 50 is introduced into the etching apparatus 300 and is subjected to an etching process with an etching solution containing hydrofluoric acid and hydrochloric acid. In the etching apparatus 300, the multi-chamfering glass base material 50 is transported by the transport roller, and an etching solution is brought into contact with one or both surfaces of the multi-chamfering glass base material 50 in the etching chamber, whereby the multi-chamfering glass base material 50 is contacted. An etching process for 50 is performed. In addition, since a cleaning chamber for washing away the etchant adhering to the multi-surface glass base material 50 is provided in the subsequent stage of the etching chamber in the etching apparatus 300, the multi-surface glass base material 50 is removed from the etchant. In this state, it is discharged from the etching apparatus 300.

As an example of a method of bringing the etching solution into contact with the multi-chamfering glass base material 50, as shown in FIG. 10A, the etching solution is applied to the multi-chamfering glass base material 50 in each etching chamber 302 of the etching apparatus 300. Spray etching for spraying. Further, instead of spray etching, as shown in FIG. 10 (B), the overflow type etching chamber 304 adopts a configuration in which the glass substrate 50 for multi-face drawing is conveyed while being in contact with the overflowed etching solution. Is also possible.

Furthermore, as shown in FIG. 10 (C), dip type etching is employed in which one or a plurality of multi-surface glass base materials 50 stored in a carrier are immersed in an etching tank 306 in which an etching solution is stored. It is also possible to do.

In any case, it is important that the shape cutting planned line does not penetrate in the thickness direction during the etching process and the multi-chamfer glass base material 50 is not divided. For this reason, during the etching process (particularly in the latter half of the etching process), it is necessary to slow the etching rate and accurately control the etching amount. In this embodiment, the etching process proceeds at a slow rate of 10 μm / min or less with 2% by weight or less of thin hydrofluoric acid, but the present invention is not limited to this method.

If the etching rate is not slowed down in the whole etching process but is gradually increased while initially adopting a faster etching rate, it is possible to shorten the etching process time. For example, it is preferable to adopt a configuration in which the concentration of hydrofluoric acid in the etching solution is lowered within a range of about 1 to 10% by weight as the process proceeds to the subsequent stage of the etching apparatus 300.

When the multi-chamfer glass base material 50 passes through the etching apparatus 300, the modified line 20 is etched. In the reforming line 20, the etchant permeates faster than other portions, and the glass is melted along this line, so that the planned cutting groove 26 is formed. Further, even when a scratch or the like is generated inside the array substrate 12 and the color filter substrate 14 at the time of laser irradiation, the scratch is easily lost. The planned cutting groove 26 is not an isotropic groove formed by normal etching, and the aspect ratio in the depth direction is larger than the width direction. For this reason, even if it is the glass base material 50 for multiple chamfers where each liquid crystal panel adjoins, the cutting planned groove | channel 26 can be formed, without affecting the liquid crystal panel 10. FIG. The planned cutting groove 26 is formed in the array substrate 12 or the color filter substrate 14 so as not to penetrate completely in the thickness direction. At this time, the thickness of the lower portion of the planned cutting groove 26 is preferably 100 μm or less. When the plate thickness exceeds 100 μm, it may be difficult to divide in the cutting step.

In the multi-chamfered glass base material 50, the strength of the shape cutting planned line is reduced due to the planned cutting groove 26 and the modified region (modified line 20) existing below the planned cutting groove 26. For this reason, it is possible to divide the multi-chamfering glass base material 50 in the reforming line 20 only by applying a slight mechanical pressure to the planned cutting line. Specifically, it can be divided by applying a minute pressing force to the multi-chamfer glass base material 50 or applying a minute ultrasonic vibration. In this embodiment, the liquid crystal panel 10 was divided using a pressing instrument 60 as shown in FIG. The pressing instrument 60 has a rod shape and has a spherical rotating jig 62 at the tip. The rotating jig 62 is rotatably supported at the distal end portion of the pressing instrument 60. The rotating jig 62 is configured to rotate by moving the pressing tool 60 along the planned cutting line while pressing the pressing tool 60 against the planned cutting groove 26. When a stress is applied to the modified region below the planned cutting groove 26 by the pressing tool 60, a crack occurs and the liquid crystal panel 10 can be divided. By using the pressing instrument 60, it is possible to divide the liquid crystal panel 10 while preventing the multi-chamfered glass base material 50 from being soiled or contacting the end surfaces.

Subsequently, a cutting process for removing a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12 is performed. In this embodiment, a scribe wheel (wheel cutter) 250 cuts the inner side of a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12 along a terminal portion cutting planned line. A terminal part cutting groove 30 is formed in the color filter substrate 14 along the terminal part cutting planned line by the scribe wheel 250. Furthermore, the color filter substrate 14 can be removed in the terminal portion cutting groove 30 by applying a pressing force to the terminal portion cutting groove 30 with the pressing tool 60 or the like.

In this embodiment, since the multi-chamfer glass base material 50 is not completely cut by the etching process, there is a problem that the end faces of the liquid crystal panel 10 separated during the etching collide and are damaged. Is prevented. Further, the multi-chamfered glass base material 50 in an incompletely cut state after the etching process can be transported as it is (in a large format). Furthermore, since the etching solution does not reach the electrode terminal portion 122, it is not necessary to protect the electrode terminal portion with a masking agent having etching resistance. In addition, since at least the central portion of the end face of the liquid crystal panel 10 is etched, the strength (for example, bending strength) of the liquid crystal panel is higher than when cutting is performed only by laser processing.

FIGS. 13A to 13C show a schematic configuration of the liquid crystal panel 10 after the division. As shown in the figure, the end surface of the liquid crystal panel 10 is substantially perpendicular to the main surface. For example, the taper width (L1 to L3 in FIG. 13C) generated on each end face of the array substrate 12 and the color filter substrate 14 each having a plate thickness of about 0.15 mm to 0.25 mm is 50 μm or less (mostly 20 to 35 μm).

As described above, when the liquid crystal panel 10 is manufactured, the influence of side etching hardly occurs. Therefore, it is possible to design the glass substrate 50 for multi-sided drawing in which the liquid crystal panels 10 are arranged close to each other. For example, if there are gaps of about 10 μm in total with a laser width of 2 μm + α, it is possible to properly separate the glass substrate for multi-face 50 into a single liquid crystal panel 10. Further, the shape of the liquid crystal panel is not limited to that of the present embodiment, and for example, a liquid crystal panel having a notch can be used.

Further, in the above-described embodiment, after the liquid crystal panel 10 is divided from the multi-chamfer glass base material 50, the color filter substrate 14 is removed in the region facing the electrode terminal portion 122. However, the color filter substrate 14 is cut. Can be performed at an arbitrary timing. For example, as shown in FIGS. 14 (A) and 14 (B), a terminal cutting groove is formed along the terminal portion cutting planned line using a scribe wheel 250 with respect to the glass substrate 50 for multi-chamfer after etching treatment. 30 is formed. And as shown in FIG.14 (C), when dividing the liquid crystal panel 10 along the shape cutting planned line, by applying a pressing force not only to the shape cutting planned line but also to the terminal cutting groove 30, The division of the liquid crystal panel 10 and the processing of the electrode terminal portion can be performed simultaneously. Further, once the terminal cutting groove 30 is formed, the color filter substrate 14 can be removed at an arbitrary timing in a subsequent process, for example, without being simultaneously with the division of the liquid crystal panel 10.

The description of the above-described embodiment is an example in all respects, and should be considered as not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

10-Liquid crystal panel 12-Array substrate 14-Color filter substrate 20-Modification line 30-Terminal cutting groove 50-Multi-chamfer glass substrate 100-Smartphone 122-Electrode terminal 250-Scribe wheel 300-Etching device 302, 304—Etching chamber 306—Etching tank

Claims (5)

A method for producing a liquid crystal panel for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multiple chamfering for multi-planarizing a liquid crystal panel formed by laminating an array substrate and a color filter substrate,
A modified line that is formed along a planned cutting line corresponding to the shape of the liquid crystal panel with respect to the array substrate and the color filter substrate, and has a property that is more easily etched than other portions. A reforming line forming step for forming
A groove forming step for forming a groove along a terminal portion cutting planned line for removing a region facing the electrode terminal portion of the array substrate in the color filter substrate with respect to the color filter substrate;
An etching step for performing an etching process while preventing the array substrate and the color filter substrate from being cut at the shape cutting planned line and the terminal portion cutting planned line,
After the etching process, a cutting step for cutting at the shape cutting planned line and the terminal portion cutting planned line;
A liquid crystal panel manufacturing method comprising at least 2. The method of manufacturing a liquid crystal panel according to claim 1, wherein the modification line has a plurality of through holes formed by a pulse laser beam or a perforation having a plurality of modification holes. A method for producing a liquid crystal panel for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multiple chamfering for multi-planarizing a liquid crystal panel formed by laminating an array substrate and a color filter substrate,
A modified line that is formed along a planned cutting line corresponding to the shape of the liquid crystal panel with respect to the array substrate and the color filter substrate, and has a property that is more easily etched than other portions. A reforming line forming step for forming
An etching step for performing an etching process while preventing the array substrate and the color filter substrate from being cut at the shape cutting planned line,
After the etching process, a cutting step for cutting at the shape cutting planned line,
A terminal portion forming step of cutting the color filter substrate along a terminal portion cutting planned line for removing the color filter substrate facing the region where the electrode terminal portion is formed in the array substrate;
A liquid crystal panel manufacturing method comprising at least 4. The liquid crystal panel manufacturing method according to claim 3, wherein the reforming line has a plurality of through holes formed by a pulse laser beam or a perforation having a plurality of reforming holes. The terminal part forming step includes a groove forming step of forming a groove along the terminal part cutting planned line;
A breaking step of applying a pressing force to the groove formed along the terminal portion cutting planned line together with the shape cutting planned line in the cutting step;
The method for producing a liquid crystal panel according to claim 1, comprising:

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