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WO2018147205A1 - Procédé de prétraitement pour placage, procédé de placage, article pré-traité pour placage et article plaqué - Google Patents

Procédé de prétraitement pour placage, procédé de placage, article pré-traité pour placage et article plaqué Download PDF

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Publication number
WO2018147205A1
WO2018147205A1 PCT/JP2018/003725 JP2018003725W WO2018147205A1 WO 2018147205 A1 WO2018147205 A1 WO 2018147205A1 JP 2018003725 W JP2018003725 W JP 2018003725W WO 2018147205 A1 WO2018147205 A1 WO 2018147205A1
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Prior art keywords
plating
plated
acid
silane coupling
coupling agent
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Ceased
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PCT/JP2018/003725
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English (en)
Japanese (ja)
Inventor
竹林　仁
太田　直人
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Toyo Tanso Co Ltd
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Toyo Tanso Co Ltd
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Priority to JP2018553162A priority Critical patent/JP6513308B2/ja
Publication of WO2018147205A1 publication Critical patent/WO2018147205A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated

Definitions

  • the present invention relates to a pretreatment method for plating, a plating method, a pretreatment product for plating, and a plated product.
  • Patent Document 1 As a method for plating graphite, a pretreatment for plating that oxidizes or heats the surface of a member to be plated is performed. A method is described. There are a wide variety of stains on the member to be plated such as metal, and electrolytic degreasing as described in Non-Patent Document 1 used for removal and surface activation is well known. Although one may be considered, when the member to be plated is a carbon material, the effect is not recognized so much and the adhesion reliability is poor.
  • the plating film is formed by the conventional pretreatment. Even so, the adhesion was small and the reliability was poor.
  • the main object of the present invention is to improve the adhesion of a plating film formed on a member to be plated having a surface inert to plating to the member to be plated.
  • the silane coupling agent is chemically bonded to the surface of the member to be plated.
  • At least one of a plurality of functional groups of a polyfunctional compound capable of forming a chelate complex with a metal ion constituting the plating film is chemically bonded to the silane coupling agent.
  • a functional group capable of chelating complex with the metal constituting the plating film is arranged on the surface of the member to be plated.
  • the plating pretreatment method according to the present invention even if the member to be plated is a member having a surface that is inactive to plating, high adhesion to the member to be plated and uniform plating Formation of the film can be realized.
  • the polyfunctional compound preferably has a plurality of carboxyl groups.
  • the polyfunctional compound has three or more functional groups capable of binding to metal ions constituting the plating film.
  • the polyfunctional compound is ethylenediaminetetraacetic acid, ethylenediamine-N, N′-diacetic acid, ethylenediamine-N, N′-diacetic acid-N, N′-dipropionic acid hydrate.
  • Hydroxyethylethylenediaminetriacetic acid diethylenetriaminepentaacetic acid, triethylenetetraminehexaacetic acid, diethylenetriaminepentaacetic acid, nitrilotriacetic acid, hydroxyethyliminodiacetic acid, L-aspartic acid-NNN-diacetic acid, hydroxyiminodisuccinic acid, trans -1,2-diaminocyclohexane-N, N, N ', N'-tetraacetic acid monohydrate, O, O'-bis (2-aminoethyl) ethylene glycol-N, N, N', N'- It is preferably at least one selected from the group consisting of tetraacetic acid.
  • a silane coupling agent a silane having at least one functional group selected from the group consisting of a primary amino group, an epoxy group and an isocyanate group in at least one of the chain and the terminal It is preferable to use a coupling agent.
  • an inorganic member capable of introducing a hydroxyl group may be used as a member to be plated.
  • a carbon material in the plating pretreatment method according to the present invention, a carbon material, an aluminum nitride material, or a silicon nitride material may be used as a member to be plated.
  • carbon material includes “graphite material”.
  • a pretreatment process for performing the plating pretreatment method according to the present invention is performed.
  • a plating process for forming a plating film is performed by plating the surface of the member to be plated that has undergone the pretreatment process.
  • the plating method according to the present invention it is preferable to perform a step of oxidizing the surface of the member to be plated in the pretreatment step.
  • the pre-plating product according to the present invention includes a member to be plated, a silane coupling agent chemically bonded to the surface of the member to be plated, and a plating film in which at least one of a plurality of functional groups is bonded to the silane coupling agent. And a polyfunctional compound capable of forming a chelate complex.
  • the plated product according to the present invention constitutes a plated film in which a member to be plated, a silane coupling agent chemically bonded to the surface of the member to be plated, and at least one of a plurality of functional groups are bonded to the silane coupling agent.
  • the adhesion of a plating film formed on a member to be plated having a surface inactive to plating to the member to be plated can be improved.
  • a plating method for plating a member to be plated includes a pretreatment step of bonding a chelating agent to the surface of the member to be plated, and plating the surface of the member to be plated to which the chelating agent is bonded. And a plating step for forming a plating film.
  • the chelating agent is composed of a polyfunctional compound capable of forming a chelate complex with the metal constituting the plating film.
  • the polyfunctional compound preferably has a plurality of carboxyl groups.
  • the polyfunctional compound preferably has three or more functional groups that can bind to the metal constituting the plating film, and more preferably has four or more functional groups. However, if the number of functional groups that can be bonded to the metal constituting the plating film is too large, the metal cannot be properly provided due to steric hindrance, and thus the plating film may not be formed properly. Accordingly, the compound capable of forming a chelate complex preferably has 6 or less functional groups capable of binding to the metal constituting the plating film.
  • polyfunctional compounds preferably used include ethylenediaminetetraacetic acid, ethylenediamine-N, N′-diacetic acid, ethylenediamine-N, N′-diacetic acid-N, N′-dipropionic acid hydrate, hydroxyethyl Ethylenediaminetriacetic acid, diethylenetriaminepentaacetic acid, triethylenetetraminehexaacetic acid, diethylenetriaminepentaacetic acid, nitrilotriacetic acid, hydroxyethyliminodiacetic acid, L-aspartic acid-NNN-diacetic acid, hydroxyiminodisuccinic acid, trans-1, 2-diaminocyclohexane-N, N, N ′, N′-tetraacetic acid monohydrate, O, O′-bis (2-aminoethyl) ethylene glycol-N, N, N ′, N′-tetraacetic acid, etc. Is mentioned
  • the member to be plated which is a member to be plated is not particularly limited.
  • an inorganic member into which a hydroxyl group can be introduced may be used.
  • specific examples of the member to be plated include a carbon material, an aluminum nitride material, a silicon nitride material, and the like.
  • the shape dimension of the member to be plated is not particularly limited.
  • the member to be plated may be, for example, a sheet shape, a powder shape, a spherical shape, a rectangular parallelepiped shape, a cubic shape, a column shape, or the like.
  • the silane coupling agent can be appropriately selected according to the member to be plated and the polyfunctional compound.
  • Examples of the silane coupling agent preferably used when the member to be plated is graphite include, for example, an epoxy silane coupling agent, an amino silane coupling agent, and an isocyanate silane coupling agent.
  • a silane coupling agent having at least one functional group selected from the group consisting of a primary amino group, an epoxy group, and an isocyanate group in the chain and at least one of the ends is more preferably used.
  • An amino-based silane coupling agent having an amino group is more preferably used.
  • Specific examples of amino-based silane coupling agents having an amino group at the end include, for example, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyl Examples include trimethoxysilane, 3-aminopropyltrimethoxysilane, and 3-aminopropyltriethoxysilane.
  • silane coupling agent Only one kind of the silane coupling agent may be used, or a plurality of kinds may be used.
  • a condensing agent In order to promote the reaction between the silane coupling agent and the polyfunctional compound, a condensing agent may be used.
  • the condensing agent preferably used include, for example, a triazine condensing agent, a carbodiimide condensing agent, an imidazole condensing agent, a phosphonium condensing agent, a uronium condensing agent, a hauronium condensing agent, and the like.
  • triazine-based condensing agents are more preferably used.
  • Specific examples of the triazine-based condensing agent include, for example, DMT-MM (4- (4,6-Dimethoxy-1,3,5-triazin-2-yl) -4-methylmorpholine Chloride n-Hydrate) and the like. .
  • ⁇ Plating treatment> when plating is performed on a member to be plated, first, pre-plating treatment is performed. Specifically, the silane coupling agent is chemically bonded to the surface of the member to be plated. At least one of a plurality of functional groups of a polyfunctional compound capable of forming a chelate complex with a metal ion constituting the plating film is chemically bonded to the silane coupling agent.
  • the polyfunctional compound is preferably bonded to the surface of the member to be plated so that three or more functional groups capable of binding to the metal constituting the plating film are formed, and the functional group capable of binding to the metal constituting the plating film More preferably, the polyfunctional compound is bonded to the surface of the member to be plated so that four or more are formed.
  • the silane coupling agent When it is difficult to directly bond the silane coupling agent to the surface of the member to be plated, it is preferable to subject the surface of the member to be plated to oxidation prior to the treatment of the surface of the member to be plated with the silane coupling agent. . By doing so, since a hydroxyl group can be arranged on the surface of the member to be plated, the silane coupling agent is easily bonded.
  • the method of oxidation treatment is not particularly limited. For example, wet oxidation treatment may be performed using nitric acid, hydrochloric acid, sulfuric acid, or a mixed acid of two or more thereof, or oxygen plasma oxidation treatment may be performed.
  • the above-mentioned condensing agent may be used.
  • the pre-plating treatment includes a member to be plated, a silane coupling agent bonded to the member to be plated, and a polyfunctional compound capable of forming a chelate complex with the metal ions constituting the plating film bonded to the silane coupling agent.
  • a member to be plated a silane coupling agent bonded to the member to be plated
  • a polyfunctional compound capable of forming a chelate complex with the metal ions constituting the plating film bonded to the silane coupling agent a polyfunctional compound capable of forming a chelate complex with the metal ions constituting the plating film bonded to the silane coupling agent.
  • a plated film is formed by plating the surface of the member to be plated to which the polyfunctional compound is bonded. That is, after performing the pretreatment process which performs the pretreatment method mentioned above, the plating process which forms a plating film is performed.
  • the plating can be performed, for example, by an electrolytic plating method or an electroless plating method.
  • the type of plating film is not particularly limited.
  • the plating film is, for example, Cu plating film, Ni plating film, Fe plating film, Cr plating film, Ag plating film, Au plating film, Pd plating film, Sn plating film, Cu, Ni, Fe, Cr, Ag, Au, It may be a plating film made of an alloy containing at least one element selected from the group consisting of Pd and Sn. Moreover, you may form the laminated body of a some plating film.
  • FIG. 1 shows a plating process in the case of using graphite as a member to be plated, 3-aminopropyltrimethoxysilane as a silane coupling agent, DMT-MM as a condensing agent, and EDTA as a polyfunctional compound.
  • FIG. 2 is a schematic cross-sectional view of the manufactured plated product.
  • the plated article 1 includes a member to be plated 10 and a plating film 11 provided on the surface of the member to be plated 10.
  • the metal constituting the plating film 11 and the polyfunctional compound are bonded to the surface 10a of the member to be plated 10 on which the plating film 11 is formed.
  • this polyfunctional compound the adhesion, uniformity and homogeneity between the member to be plated 10 and the plating film 11 are improved.
  • the polyfunctional compound capable of forming a chelate complex with the metal constituting the plating film 11 is arranged on the surface of the plating pretreatment object. Therefore, by using the plating pretreatment method of this embodiment, even if the member to be plated 10 is a member having a surface that is inactive with respect to the plating film, the high adhesion of the plating film 11 to the member to be plated 10. A uniform and uniform plating film 11 can be formed.
  • the polyfunctional compound capable of forming a chelate complex has three or more functional groups capable of binding to the metal constituting the plating film 11. It is preferable to have four or more.
  • the plating method of the present embodiment for example, when the surface of the member to be plated 10 is smooth, that is, when the arithmetic average roughness (Ra) defined in JIS B0601-2001 is small, The plating film 11 having high adhesion can be formed.
  • the arithmetic average roughness (Ra) of the member to be plated 10 may be, for example, 5 ⁇ m or less, 3 or less, or 1 or less.
  • Example 1 An isotropic graphite material (IG-43: CIP-A manufactured by Toyo Tanso Co., Ltd.) was immersed in a 0.5 M nitric acid aqueous solution at room temperature for 1 hour, washed with water and dried. Next, it was immersed in a methanol solution containing 1% by mass of 3-aminopropyltrimethoxysilane (silane coupling agent: CP-A) for 1 hour to introduce aminopropyl groups.
  • silane coupling agent: CP-A 3-aminopropyltrimethoxysilane
  • methanol containing 1 mmol of ethylenediaminetetraacetic acid (EDTA: chelating agent) and 1.1-fold mol of triazine-based condensing agent (DMT-MM) as a condensing agent is an isotropic graphite material having aminopropyl groups introduced. It was immersed in the solution and allowed to react for another hour, washed with diluted hydrochloric acid and dried to obtain a graphite material having EDTA introduced on the surface. Electrolytic copper plating was performed on the graphite material having the EDTA introduced on the surface thereof to obtain a graphite material coated with a copper plating film having a thickness of 8 ⁇ m.
  • the plating film had a homogeneous film quality.
  • the adhesion of the obtained plated film was evaluated by cutting a right-angled lattice pattern in accordance with the crosscut test described in JIS K5600-5-6-1999, the number of peeling was 0/25 cells.
  • the plated film was peeled off at the cut edges and intersections, but the state was judged as 2 according to the classification method described in JIS.
  • Example 2 A graphite material having EDTA introduced on the surface was obtained in the same manner as in Example 1 except that the isotropic graphite material was changed to CIP-B (ISEM-8 manufactured by Toyo Tanso Co., Ltd.). Electrolytic copper plating was performed on the graphite material in which EDTA was introduced on the surface to obtain a graphite material coated with a copper plating film. There was no unevenness in the plating film, and the plating film had a homogeneous film quality. The resulting plated film had a crosscut test result of 0/25 and a classification of 2.
  • Example 3 CIP-A was immersed in a 1.0 M nitric acid aqueous solution at room temperature for 1 hour, washed with water and dried. Next, it was immersed in a methanol solution containing 1% by mass of CP-A for 1 hour to introduce aminopropyl groups. Thereafter, the isotropic graphite material into which the aminopropyl group was introduced was immersed in a methanol solution containing 1 mmol of EDTA and 1.1-fold mol of DMT-MM as a condensing agent, and further reacted for 1 hour. After washing and drying, a graphite material having EDTA introduced on the surface was obtained.
  • Electrolytic copper plating was performed on the graphite material having the EDTA introduced on the surface thereof to obtain a graphite material coated with a copper plating film having a thickness of 8 ⁇ m. There was no unevenness in the plating film, and the plating film had a homogeneous film quality. The resulting plated film had a crosscut test result of 0/25 and a classification of 1.
  • Example 4 CIP-A was immersed in a 1.0 M nitric acid aqueous solution at room temperature for 1 hour, washed with water and dried. Next, it was immersed in a methanol solution containing 1% by mass of N-2 (aminoethyl) 3-aminopropylmethyldimethoxysilane (silane coupling agent: CP-B) for 1 hour to introduce aminopropyl groups.
  • silane coupling agent: CP-B silane coupling agent
  • the isotropic graphite material into which the aminopropyl group was introduced was converted to 1 mmol of trans-1,2-diaminocyclohexane-N, N, N ′, N′-tetraacetic acid monohydrate (CyDTA: chelating agent), Graphite in which CyDTA is introduced on the surface by immersing in a methanol solution containing 1.1-fold moles of triazine-based condensing agent (DMT-MM) as a condensing agent, reacting for 1 hour, washing and drying with dilute hydrochloric acid Obtained material.
  • CyDTA chelating agent
  • Electrolytic copper plating was performed on the graphite material having CyDTA introduced on the surface thereof to obtain a graphite material coated with a copper plating film having a thickness of 8 ⁇ m. There was no unevenness in the plating film, and the plating film had a homogeneous film quality. The resulting plated film had a crosscut test result of 0/25 and a classification of 0.
  • Example 5 A graphite material coated with a copper plating film was obtained in the same manner as in Example 3 except that 3-glycidoxypropyltrimethoxysilane (CP-C) was used as the silane coupling agent.
  • CP-C 3-glycidoxypropyltrimethoxysilane
  • Example 6 A graphite material coated with a copper plating film was obtained in the same manner as in Example 4 except that the plating method was electroless plating. Electroless plating was washed with water CIP-A, was immersed in the pretreatment solution PdCl 2 as the SnCl 2 and activator as a sensitizer is added, copper sulfate as the source of copper ions, EDTA as a complexing agent Used and reduced with formaldehyde. The substrate surface was coated with copper having a uniform thickness of 2 ⁇ m. The resulting plated film had a crosscut test result of 0/25 and a classification of 1.
  • Example 7 A graphite material coated with copper was obtained in the same manner as in Example 4 except that the chelating agent was diethylenetriaminepentaacetic acid (DTPA). The resulting plated film had a crosscut test result of 0/25 and a classification of 0. (Example 8) Coated with copper in the same manner as in Example 4 except that the chelating agent was O, O′-bis (2-aminoethyl) ethylene glycol-N, N, N ′, N′-tetraacetic acid (EGTA). A graphite material was obtained. The resulting plated film had a crosscut test result of 0/25 and a classification of 1.
  • DTPA diethylenetriaminepentaacetic acid
  • Example 9 A graphite material coated with copper was obtained in the same manner as in Example 4 except that the chelating agent was triethylenetetramine hexaacetic acid (TTHA). The resulting plated film had a crosscut test result of 0/25 and a classification of 0.
  • TTHA triethylenetetramine hexaacetic acid
  • Comparative Example 7 The surface treatment was not performed on CIP-B, and electroless copper plating was performed in the same manner as in Comparative Example 2.
  • the crosscut test result of the plating film was 12/25, and the classification was 5.
  • Plated object 10 Plated member 10a: Surface of the member to be plated 11: Plated film

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

La présente invention a pour objet d'améliorer l'adhésivité entre un élément à plaquer ayant une surface inerte au placage, et un film de placage formé sur l'élément à plaquer. Plus précisément, l'invention concerne un procédé de liaison chimique d'un agent de couplage au silane à la surface d'un élément à plaquer. L'agent de couplage au silane est chimiquement lié à au moins l'un des multiples groupements fonctionnels d'un composé polyfonctionnel capable de former un complexe chélaté avec des ions métalliques qui forment un film de placage.
PCT/JP2018/003725 2017-02-13 2018-02-05 Procédé de prétraitement pour placage, procédé de placage, article pré-traité pour placage et article plaqué Ceased WO2018147205A1 (fr)

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JP2018553162A JP6513308B2 (ja) 2017-02-13 2018-02-05 めっきの前処理方法、めっき方法、めっき前処理物及びめっき物

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JP2017024451 2017-02-13
JP2017-024451 2017-02-13

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Publication number Priority date Publication date Assignee Title
JPWO2021166709A1 (fr) * 2020-02-20 2021-08-26
JP2022132189A (ja) * 2021-02-26 2022-09-07 Jsr株式会社 多層配線基板の製造方法、積層膜形成用キット及び組成物
JP2022132188A (ja) * 2021-02-26 2022-09-07 Jsr株式会社 多層配線基板の製造方法、積層膜形成用キット及び組成物

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WO2004024984A1 (fr) * 2002-09-10 2004-03-25 Nikko Materials Co., Ltd. Procede de galvanoplastie et agent de pre-traitement
JP2010109202A (ja) * 2008-10-31 2010-05-13 Fujitsu Ltd 回路基板の製造方法及び回路基板
JP5857386B2 (ja) * 2011-09-02 2016-02-10 地方独立行政法人 大阪市立工業研究所 無電解めっきの前処理皮膜形成用組成物

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JP5087763B2 (ja) * 2005-09-13 2012-12-05 国立大学法人 香川大学 金属被膜を有するプラスチック成形体とその製造方法およびそれらを用いた物品
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Publication number Priority date Publication date Assignee Title
JPH0456776A (ja) * 1990-06-25 1992-02-24 Hitachi Chem Co Ltd 無電解めっきの前処理液
WO2004024984A1 (fr) * 2002-09-10 2004-03-25 Nikko Materials Co., Ltd. Procede de galvanoplastie et agent de pre-traitement
JP2010109202A (ja) * 2008-10-31 2010-05-13 Fujitsu Ltd 回路基板の製造方法及び回路基板
JP5857386B2 (ja) * 2011-09-02 2016-02-10 地方独立行政法人 大阪市立工業研究所 無電解めっきの前処理皮膜形成用組成物

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021166709A1 (fr) * 2020-02-20 2021-08-26
WO2021166709A1 (fr) * 2020-02-20 2021-08-26 東京エレクトロン株式会社 Procédé de traitement de liquide de substrat et dispositif de traitement de liquide de substrat
US20230055960A1 (en) * 2020-02-20 2023-02-23 Tokyo Electron Limited Substrate liquid processing method and substrate liquid processing apparatus
JP7451676B2 (ja) 2020-02-20 2024-03-18 東京エレクトロン株式会社 基板液処理方法及び基板液処理装置
JP2022132189A (ja) * 2021-02-26 2022-09-07 Jsr株式会社 多層配線基板の製造方法、積層膜形成用キット及び組成物
JP2022132188A (ja) * 2021-02-26 2022-09-07 Jsr株式会社 多層配線基板の製造方法、積層膜形成用キット及び組成物
JP7648560B2 (ja) 2021-02-26 2025-03-18 Jsr株式会社 多層配線基板の製造方法、積層膜形成用キット及び組成物
JP7682819B2 (ja) 2021-02-26 2025-05-26 Jsr株式会社 多層配線基板の製造方法、積層膜形成用キット及び組成物

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JPWO2018147205A1 (ja) 2019-02-14
TW201840910A (zh) 2018-11-16

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