WO2018098651A1 - Integrated circuit system and packaging method therefor - Google Patents

Abstract

An integrated circuit system and a packaging method therefor. The integrated circuit system packaging method comprises the steps of curing: a first carrier (120) and a second carrier (220) are provided opposite each other, both a first component group (110) on the first carrier (120) and a second component group (210) on the second carrier (220) are arranged between the first carrier (120) and the second carrier (220), a molding material (300) is provided between the first carrier (120) and the second carrier (220), the first component group (110) and the second component group (210) respectively contact the molding material (300), and the molding material (300) is cured so that the first component group (110) and the second component group (210) respectively are mounted on either side of the molding material (300); detachment: the first carrier (120) is detached from the first component group (110) and the molding material (300), and the second carrier (220) is detached from the second component group (210) and the molding material (300); and connection: a connecting hole (310) is manufactured in the molding material, an electrically-conductive layer (400) is manufactured, the electrically-conductive layer (400) is inserted into the connecting hole (310), and the electrically-conductive layer (400) electrically connects the first component group (110) to the second component group (210). The integrated circuit system can integrate an increased number of functions, has a high production efficiency, and is inexpensive.

Description

Integrated circuit system and packaging method Technical field

The invention belongs to the field of electronics, and in particular relates to an integrated circuit system and a packaging method.

Background technique

Traditional multi-element, chip system packages are typically packaged in system units. A plurality of electronic components, flip chips or wires constituting a system are mounted on one surface or one side of a substrate containing a circuit, and then encapsulated in a molded plastic. It is then soldered or plugged into the board with other required electronic components and chips to form a fully functional integrated circuit system. It is often required to be connected to the circuit port of the substrate by bonding or flip-chip, and then connected to the circuit board. The materials are used in a large amount, the process is complicated, the production cost is high, and a large number of materials with different characteristics are used. It is also easy to induce a variety of thermomechanical stress problems at the interface of each material.

Summary of the invention

Based on this, the present invention overcomes the deficiencies of the prior art, and provides an integrated circuit system and a packaging method, which can integrate more devices on an integrated circuit system, obtain more functions, and have a small overall system size, high production efficiency, and low cost. low.

Its technical solutions are as follows:

An integrated circuit system packaging method comprising the steps of: curing: a first carrier and a second carrier are oppositely disposed, a first device group on the first carrier and a second device group on the second carrier are located in the Between the first carrier and the second carrier, a molding material is disposed between the first carrier and the second carrier, and the first device group and the second device group are respectively in contact with the molding material Curing the molding material such that the first device group and the second device group are respectively mounted on both sides of the molding material; detaching: the first carrier from the first device group and the Disengaging the molding material to detach the second carrier from the second device group and the molding material; connecting: forming a connection hole in the molding material, and forming a conductive layer to extend the conductive layer The connection hole, the conductive layer will be The first device group is electrically coupled to the second device group.

In one embodiment, the first device group is mounted to the first carrier by a thermosensitive adhesive material, and in the detaching step, heating or cooling the thermosensitive adhesive material to make the first The carrier is detached from the first device group; or/and the second device group is mounted to the second carrier by a heat-sensitive adhesive material, and in the detaching step, the heat-sensitive adhesive is heated or cooled a material that disengages the second carrier from the second device set.

In one embodiment, the integrated circuit system packaging method further includes: in the curing step, providing an intermediate layer between the first carrier and the second carrier to distribute the molding material to the first Between a carrier and the intermediate layer, and between the second carrier and the intermediate layer, the molding material is cured such that the intermediate layer is embedded in the molding material.

In one embodiment, the intermediate layer is a flexible circuit board; or, at least two flexible circuit boards are stacked to form the intermediate layer; or the intermediate layer is a shielding layer; or, the intermediate layer The electronic component itself constitutes an electrical connection between the intermediate layer and the first device group or the second device.

In one embodiment, the intermediate layer is provided with a base circuit layer electrically connecting the base circuit layer to the first device group or electrically connecting the base circuit layer to the second device group.

In one embodiment, the molding material is a silicone molded plastic, or a molded resin.

In one embodiment, the integrated circuit system packaging method further includes: the first device group, the second device group, and the molding material constituting a substrate, after the detaching step, at two of the substrates The first circuit layer and the second circuit layer are respectively fabricated on the side, the first circuit layer is electrically connected to the first device group, and the second circuit layer is electrically connected to the second device group.

In one of the embodiments, the pins of the devices of the first device group are oriented toward the first carrier, and the pins of the devices of the second device group are oriented toward the second carrier.

In one embodiment, the first circuit layer is provided with a first connection port, and a device is mounted on the first circuit layer to electrically connect the device to the first connection port; or The second circuit layer is provided with a second connection port, and the device is mounted on the second circuit layer to electrically connect the device to the second connection port.

In one embodiment, the integrated circuit system packaging method further includes: before the curing step, fabricating a first circuit layer on the first carrier, and setting a first device group on the first circuit layer, the a circuit layer electrically connected to the first device group; in the detaching step, the first circuit layer and the first device group are both detached from the first carrier, the first circuit layer and The first device group is commonly mounted on the molding material; or/and, before the curing step, forming a second circuit layer on the second carrier and a second device group on the second circuit layer, The second circuit layer is electrically connected to the second device group; in the detaching step, the second circuit layer and the second device group are both separated from the first carrier, and the second circuit A layer and the second device group are mounted together on the molding material.

In one embodiment, the first device group, the second device group, and the molding material constitute a substrate having an area greater than 10,000 square centimeters.

In one embodiment, the first device group or/and the second device group includes an invalid device for making the first device group or/and the second device group The density distribution of the device in the distribution of the molding material is balanced to prevent warpage of the molding material.

In one embodiment, the first device group and the second device group are staggered on both sides of the molding material such that the first device group and the second device group are in the molding material. The density of the side distribution is balanced to avoid warpage of the molding material.

In one embodiment, at least two of the first device groups are disposed on the first carrier, and at least two of the second device groups are disposed on the second carrier, through the curing step, After the detaching step and the connecting step, the first device group, the second device group, and the molding material constitute a substrate, and the substrate is cut into at least two circuit boards.

In one of the embodiments, the first device group includes at least one device, and the second device group includes at least one device, the device being a chip or a separate electronic component.

An integrated circuit system comprising: a first device group detached from a first carrier, a second device group detached from a second carrier, and a cured molding material; wherein a molding material is located in the first device group And the second device group, the first device group and the second device group are in contact with the molding material, and the first device group and the second device group are respectively mounted on the molding material On both sides, the molding material is provided with a connection hole and a conductive layer, and the conductive layer extends into the connection hole, The conductive layer electrically connects the first device group to the second device group.

In one embodiment, the molding material is a silicone molded plastic, or a molded resin.

In one embodiment, the first device group, the second device group, and the molding material constitute a substrate, and two sides of the substrate are respectively provided with a first circuit layer and a second circuit layer, A first circuit layer is electrically coupled to the first device group, and the second circuit layer is electrically coupled to the second device group.

In one embodiment, the first circuit layer is provided with a first connection port, the first circuit layer is provided with a device, and the device is electrically connected to the first connection port; or, the second The circuit layer is provided with a second connection port, the second circuit layer is provided with a device, and the device is electrically connected to the second connection port.

In one embodiment, the integrated circuit system further includes an intermediate layer disposed between the first device group and the second device group, the intermediate layer being embedded in the molding material.

In one embodiment, the intermediate layer is a flexible circuit board; or at least two flexible circuit boards are stacked to form the intermediate layer; or the intermediate layer is a shielding layer; or the intermediate layer itself An electronic component is formed that electrically connects the intermediate layer to the first device group or the second device.

In one embodiment, the intermediate layer is provided with a base circuit layer electrically connecting the base circuit layer to the first device group or electrically connecting the base circuit layer to the second device group.

In one of the embodiments, the first device group includes at least one device, and the second device group includes at least one device, the device being a chip or a separate electronic component.

In one embodiment, the first device group or/and the second device group includes an invalid device for making the first device group or/and the second device group The device distributes the density on both sides of the molding material to avoid warping of the molding material.

The beneficial effects of the invention are:

1. An integrated circuit system packaging method comprising the steps of: (1) curing: a first carrier and a second carrier are oppositely disposed, a first device group on the first carrier and a second device group on the second carrier Located between the first carrier and the second carrier, a molding material is disposed between the first carrier and the second carrier, and the first device group and the second device group are respectively Contacting the molding material to cure the molding material, and mounting the first device group and the second device group to the molding material Both sides of the material; (2) detachment: detaching the first carrier from the first device group and the molding material, and the second carrier from the second device group and the molding material Disengagement; (3) wiring: making a connection hole in the molding material, and forming a conductive layer to extend the conductive layer into the connection hole, the conductive layer to the first device group and the second layer The device group is electrically connected. The portion of the conductive layer that protrudes into the connection hole may be attached only to the inner wall of the connection hole, or may completely or partially fill the connection hole.

Traditionally, devices can only be placed on one side of the board. During the curing process of the package layer, due to the large difference in thermal expansion coefficient of various materials, a large thermal stress is generated at the junction of the chip and the substrate, which affects the mechanical reliability of the chip system. In order to ensure the mechanical properties of the system, the mechanical properties of the substrate have to be enhanced, resulting in the necessity of using a thicker substrate, and the overall system size is thus increased. In the newer fan-out system packaging technology, because the chips of multiple systems need to be processed simultaneously on a large-sized panel, during the curing process of the encapsulation layer, because of the thermal expansion coefficient of the encapsulation layer material, the chip and the substrate material. Differences can easily cause panel warpage, which seriously affects the yield of the process and limits the line width accuracy that can be achieved. In the present invention, the substrate may be omitted, and the first device group and the second device group are respectively disposed on both sides of the molding material, and the devices accommodated are greatly increased, and the devices on both sides can be electrically connected to each other through the connection holes, and the devices can be on both sides. The number of connection points on the surface is increased, the transmission bandwidth and the operation speed are increased, and high system integration is obtained. Moreover, the devices on both sides of the molding material are electrically connected by means of connecting holes, and the connecting holes are opened in the molding material without occupying extra space; in particular, for ultra-thin circuit boards, flexible circuit boards, and wearable device boards And the like, the method of the present invention can well maintain the overall ultra-thin, flexible characteristics of the obtained integrated circuit system.

The cured molding material plays a role of supporting and fixing. During the curing of the molding material, the second device group of the first device group is simultaneously mounted on the molding material, and the device group device is symmetrically placed on the two outer surfaces of the molding material. , can reduce the thermo-mechanical stress, which is of great significance for parallel processing on large-size panels.

The traditional system packaging process rearranges the device on a carrier into a large-sized panel or wafer, and then places the molding material to encapsulate. After the molding material is cured, the molding material containing all the devices is completely detached and used as a new substrate. Perform the subsequent process. Because of the large difference in thermo-mechanical properties between the device material silicon and the molding material, after curing from the carrier, the substrate will have a large warpage, which seriously affects the implementation of the subsequent process. In the present invention, the first device group and the second device group are respectively mounted on both sides of the molding material, and the density of the devices on both sides is kept as balanced as possible, so that the warpage of the substrate formed after the molding material is cured can be effectively reduced.

Moreover, the first device group and the second device group are disposed on the first carrier and the second carrier, and the flow operation is performed on the large-area panel, and the process involved is simple and the production efficiency is high. Moreover, by using the first carrier and the second carrier, it is ensured that the two outer surfaces of the molding material after detachment are flat, and the subsequent process can be performed without additional surface planarization treatment.

2. The first device group is mounted on the first carrier by a thermosensitive adhesive material, and in the detaching step, heating or cooling the thermosensitive adhesive material to cause the first carrier and the first a device group is detached; or/and the second device group is mounted to the second carrier by a thermosensitive adhesive material, and in the detaching step, the thermosensitive adhesive material is heated or cooled to cause the The second carrier is detached from the second device group. If necessary, the first device group, or the second device group, or a colleague may be pasted with the heat sensitive material to paste the first device group and the second device group, and when heated or cooled, the first carrier is detached, or the second carrier is detached, Or the first carrier and the second carrier are simultaneously detached to prepare for the wiring step. The use of a heat sensitive material reduces the mechanical stress of the detachment step, without damaging the device set or scratching the surface.

3. In the curing step, an intermediate layer is disposed between the first carrier and the second carrier such that the molding material is distributed between the first carrier and the intermediate layer, and Between the second carrier and the intermediate layer, the molding material is cured such that the intermediate layer is embedded in the molding material without occupying extra space. Adding an intermediate layer before the molding material is uncured can improve the performance of the integrated circuit system, and can impart different characteristics to the intermediate layer as needed, so that the final high integrated circuit system can obtain better characteristics. For example, the intermediate layer can be a circuit layer. The carrier can improve the integration of the integrated circuit system after being electrically connected.

4. The intermediate layer is a flexible circuit board; or, at least two flexible circuit boards are stacked to form the intermediate layer; and a circuit board is disposed between the molding materials as an intermediate layer to expand the function of the entire integrated circuit system. The use of a flexible circuit layer and the use of the integrated circuit system packaging method of the present invention can be made very thin, and the resulting system as a whole can still maintain flexible performance.

Alternatively, the intermediate layer is a shielding layer; avoiding the first device group and the second device on both sides of the molding material The work of the components does not interfere with each other, ensuring the performance of the entire integrated circuit system.

Alternatively, the intermediate layer itself constitutes an electronic component that is electrically connected to the first device group or the second device. Including but not limited to antennas, capacitors, etc., can extend the circuit function, and does not occupy extra space.

5. The intermediate layer is provided with a base circuit layer, and in the step of connecting, the base circuit layer may be electrically connected to the first device group through a connection hole, or/and the base circuit layer and the The second device group is electrically connected. The first device group, the second device group, and the intermediate layer are similar to multilayer circuits, which can increase circuit functions. The base circuit layer may be disposed on one side of the intermediate layer facing the first device group, or facing one side of the second device group, or embedded in the intermediate layer, or both sides of the intermediate layer.

6. The molding material is a moldable molding material such as silicone molded plastic (R ₂ SiO _x ) or molded resin, including but not limited to polyimide, or polydimethylsiloxane, or poly pair. Xylene. These materials have good fluidity and can be filled with a gap between the first carrier and the second carrier, and the curing operation is simple and facilitates production.

7. The method further includes: forming, by the first device group, the second device group, and the molding material, a substrate after curing, after the detaching step, respectively forming a first circuit on both sides of the substrate And a second circuit layer electrically connecting the first circuit layer and the first device group, and electrically connecting the second circuit layer and the second device group. The first circuit layer, the first device group, the second circuit layer, and the second device group are electrically connected to expand the circuit function. If the first device group is disposed on the first carrier, the pre-existing partial electrical connection between the first device groups may be performed, and the first circuit layer may be extended to extend the original connection; or may be between the first device groups. There is no electrical connection in advance, and electrical connection is made through the first circuit layer. When the second device group is disposed on the second carrier, a partial electrical connection may be pre-existing between the second device groups, and the second circuit layer may be extended to extend the original connection; or the second device group may be pre-existed without electricity. Connection, electrical connection through the second circuit layer.

8. The pins of the device of the first device group face the first carrier, the pins of the device of the second device group face the second carrier. After the detachment step, the pins of the device are naturally exposed on both sides of the substrate, so that the first circuit layer and the second circuit layer are separately formed on both sides of the substrate, and the first circuit is formed. a layer electrically connected to the first device group, the second circuit layer and the second device The pieces are electrically connected. In this way, the first circuit layer may be directly formed on the surface of the molding material, or the first circuit layer may be electrically connected to the circuit board through the pins of the device after the first circuit layer is disposed on the other circuit board. a first circuit layer; the second circuit layer may be directly formed on the surface of the molding material, or the second circuit layer may be disposed on the other circuit board, and the second device group is electrically connected to the device through the pins of the device. The second circuit layer of the board.

9. Before the curing step, forming a first circuit layer on the first carrier, and providing a first device group on the first circuit layer, the first circuit layer being electrically connected to the first device group; In the detaching step, the first circuit layer and the first device group are both detached from the first carrier, and the first circuit layer and the first device group are commonly mounted on the molding material. And/or, before the curing step, fabricating a second circuit layer on the second carrier, and providing a second device group on the second circuit layer, the second circuit layer and the second device group Connecting in the detaching step, the second circuit layer and the second device group are both detached from the first carrier, and the second circuit layer and the second device group are commonly mounted on the On the molding material.

The above "or/and" means that, as needed, the first circuit layer may be separately fabricated, or the second circuit layer may be separately fabricated, or the first circuit layer and the second circuit layer may be simultaneously formed. For example, the method of simultaneously fabricating the first circuit layer and the second circuit layer is: before placing the first device group and the second device group on each of the first carrier and the second carrier, the first carrier and the second carrier The first circuit layer and the second circuit layer are respectively provided in advance, respectively corresponding to the first device group and the second device group, and the placing process comprises aligning the first device group and the second device group respectively. The circuit layer and the second circuit layer electrically connect the first circuit layer to the first device group, and the second circuit layer is electrically connected to the second device group. After the electrical connection is fixed by appropriate thermal or chemical treatment, the steps of curing, detaching, and wiring are continued, except that it is no longer necessary to make additional circuit layers on the outer surfaces of both sides of the substrate formed after detachment, simply by making A connection hole connecting the first circuit layer and the second circuit layer. In this case, the bonding material is disposed between the first carrier, the second carrier, and the first circuit layer and the second circuit layer, so that after the detachment, the first circuit layer and the second circuit layer remain The two outer surfaces of the formed substrate. In the manufacturing method, the circuit layer is formed before the molding material is solidified, and the first circuit layer and the second circuit layer are generally made on the first carrier and the second carrier surface which are more flat and stronger than the molding material, which can be easily fabricated. Thinner line width The distance between the wiring can increase the bandwidth and speed of data communication; because the electrical connection is fixed before the molding material is cured, the relative position of the chip during the curing process can be avoided, which makes the electrical connection of the circuit layer extremely difficult.

10. The first circuit layer is provided with a first connection port, and the device is mounted on the first circuit layer to electrically connect the device with the first connection port; the first circuit layer is reserved for expansion. The first connection port has an expansion function, and after the first circuit layer is fabricated, the device can be repositioned according to different needs, wherein the device can be a chip or an electronic component.

Alternatively, the second circuit layer is provided with a second connection port, and the device is mounted on the second circuit layer to electrically connect the device to the second connection port. The second circuit layer is reserved with a second connection port for expansion, and has an expansion function, and after the second circuit layer is fabricated, the device can be re-mounted according to different needs, wherein the device can be a chip or an electronic component. The chip is a die or a chip after the die is packaged.

11. The first device group comprises at least one device, the second device group comprises at least one device, the device being a chip or a separate electronic component. After completing a production process, it is possible to complete the installation of chips and electronic components at the same time with high efficiency. The first device group and the second device group comprise more than one device, and the devices of the same group are all disposed on the carrier, and are uniformly installed and processed in parallel through the steps of curing, detaching, and connecting, and the efficiency is high.

12. Locating at least two of the first device groups on the first carrier, and at least two of the second device groups on the second carrier, after the curing step, the detaching step, and the After the connecting step, the first device group, the second device group, and the molding material constitute a substrate, and the substrate is cut into at least two circuit boards. First, the devices of the first device group and the second device group are mounted with a plurality of sets of the first device group and the second device group are simultaneously fixedly mounted by the molding material, and the connection holes and the conductive layer are simultaneously fabricated, and finally cut into circuits of a desired size. Board, high production efficiency.

It may be that the first device group is at least two, the second device group is at least two, and each of the circuit boards includes at least one of the first device group or at least one of the second device groups. It is also possible to provide only one of the first device groups or only one second device group, and if necessary, the different boards that are tailored respectively comprise several devices in the first device group, or include the second device group. Several Device.

13. The area of the substrate is greater than 10,000 square centimeters. According to the integrated circuit system package structure and method of the present invention, a large-plane circuit board can be fabricated to avoid warpage, ensure the performance of a large-plane circuit board, and at the same time reduce the cost of manufacturing a large-plane circuit board. A large-scale substrate composed of a first device group, a second device group, and a molding material can be fabricated, and at the same time, warpage of a large-sized substrate can be avoided, and the possibility of continuing the subsequent process on the large substrate can be ensured. Quality, reducing production costs.

14. The first device group or/and the second device group includes an inactive device for causing the device of the first device group or/and the second device group to be in the forming The density distribution on both sides of the material is balanced to avoid warpage of the molding material. The device composition of the first device group and the second device group is often determined by the function to be implemented, and the size, size, and number may vary greatly. If only effective devices are used, the substrate may be formed due to uneven material distribution of the device. There are different thermo-mechanical stresses on both sides and there may be warpage during the manufacturing process. The invalid device may be separately set in the first device group, or the invalid device may be separately set in the second device group, or the invalid device may be provided in the first device group and the second device group, as needed. In the present invention, in addition to setting the first device group and the second device group to realize the circuit function of the whole system, an invalid chip is added, and the invalid chip can offset the difference in volume and occupied area between different devices, so that the entire molding material is made. The surface is balanced by the density occupied by the device, further reducing the warpage, reducing the difficulty of the manufacturing process, and improving the fabrication precision of the wiring circuit layer. Especially for large-size substrates, the use of ineffective devices can greatly reduce the possible warpage of large-sized substrates during fabrication.

15. The first device group and the second device group are staggered on both sides of the molding material to balance the density distribution of the devices of the first device group and the second device group on both sides of the molding material. Avoid warping of the molding material. The device groups are staggered on the surface of the molding material to avoid possible warpage of the formed large-sized substrate during the manufacturing process. The device components of the first device group and the second device group are often determined by the functions to be implemented, and the size and number may vary greatly. If only valid devices are used, the number of device groups placed increases as the size of the formed substrate increases. Increasing, if only the same device group is placed on the same side of the substrate, because the uneven distribution of the device materials causes different thermo-mechanical stresses on both sides of the formed substrate, the substrate is increased during the manufacturing process. The warpage will also increase. In the present invention, the first device group and the second device group may be alternately discharged on the first carrier and the second carrier, such that The density of the devices on both sides of the substrate formed is more uniform, and the stresses on both sides of the substrate after the first carrier and the second carrier are separated are more symmetrical, and warpage is less likely to occur. The warpage of the formed large-sized substrate during the manufacturing process can be reduced, the difficulty of the manufacturing process can be reduced, and the fabrication precision of the wiring circuit layer can be improved.

DRAWINGS

1 is a schematic structural diagram 1 of a chip packaging method according to an embodiment of the present invention;

2 is a schematic structural diagram 2 of a chip packaging method according to an embodiment of the present invention;

3 is a schematic structural diagram 3 of a chip packaging method according to an embodiment of the present invention;

4 is a schematic structural diagram 4 of a chip packaging method according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram 5 of a chip packaging method according to an embodiment of the present invention; FIG.

6 is a schematic structural diagram 6 of a chip packaging method according to an embodiment of the present invention;

7 is a schematic structural diagram 7 of a chip packaging method according to an embodiment of the present invention;

FIG. 8 is a schematic structural diagram 8 of a chip packaging method according to an embodiment of the present invention; FIG.

FIG. 9 is a schematic structural diagram 9 of a chip packaging method according to an embodiment of the present invention.

Description of the reference signs:

110, a first device group, 120, a first carrier, 130, 230, a thermosensitive adhesive material, 140, a first circuit layer, 210, a second device group, 220, a second carrier, 240, a second circuit layer, 300, molding material, 310, connection hole, 400, conductive layer, 500, intermediate layer, 510, base circuit layer.

detailed description

The present invention will be further described in detail below, but embodiments of the invention are not limited thereto.

The integrated circuit system includes: a first device group 110 detached from the first carrier 120, a second device group 210 detached from the second carrier 220, and a cured molding material 300 as shown in FIGS. 1 to 6; The molding material 300 is located between the first device group 110 and the second device group 210, the first device group 110 and the second device group 210 are in contact with the molding material 300, and the first device group 110 and the second device group 210 are respectively mounted on On both sides of the molding material 300, the molding material 300 is provided with a connection hole 310 and a conductive layer 400. The conductive layer 400 extends into the connection hole 310. The conductive layer 400 connects the first device group 110 and the second device. Group 210 is electrically connected. The conductive layer 400 extending into the connection hole 310 may be attached only to the inner wall of the connection hole 310, or the connection hole 310 may be completely or partially filled. Here, the case where the conductive layer 400 is attached only to the inner wall of the connection hole 310 is as shown in FIG.

As shown in FIG. 6, the first device group 110, the second device group 210, and the molding material 300 constitute a substrate, and the first circuit layer 140 and the second circuit layer 240 are respectively disposed on two sides of the substrate, and the first circuit layer 140 is The first device group 110 is electrically connected, and the second circuit layer 240 is electrically connected to the second device group 210.

An intermediate layer 500 is disposed between the first carrier 120 and the second carrier 220, and the intermediate layer 500 is embedded in the molding material 300. The intermediate layer 500 is provided with a base circuit layer 510 electrically connecting the base circuit layer 510 to the first device group 110 or electrically connecting the base circuit layer 510 to the second device group 210. A base circuit layer 510 may be disposed on both sides of the intermediate layer 500, or a base circuit layer 510 may be disposed on one of the sides. The first device group 110, the second device group 210, and the intermediate layer 500 are similar to multilayer circuits, and can increase circuit functions. The base circuit layer 510 may be provided on one side of the intermediate layer 500 facing the first device group 110, or facing one side of the second device group 210, or embedded in the intermediate layer 500, or both sides of the intermediate layer 500. It is not limited to the embodiment, and the intermediate layer 500 is a flexible circuit board; or, at least two flexible circuit boards are stacked to form the intermediate layer 500; and the circuit board is disposed between the molding materials 300 as the intermediate layer 500, and the whole is extended. The function of an integrated circuit system. The use of a flexible circuit layer and the use of the integrated circuit system packaging method of the present invention can be made very thin, and the resulting system as a whole can still maintain flexible performance. Alternatively, the intermediate layer 500 is a shielding layer; the first device group 110 and the second device group 210 on both sides of the molding material 300 are prevented from interfering with each other to ensure the working performance of the entire integrated circuit system. Alternatively, the intermediate layer 500 itself constitutes an electronic component that electrically connects the intermediate layer 500 with the first device group 110 or the second device. Including but not limited to antennas, capacitors, etc., can extend the circuit function, and does not occupy extra space.

The molding material 300 is a moldable molding material such as silicone molded plastic (R ₂ SiO _x ) or a molded resin including, but not limited to, polyimide, or polydimethylsiloxane, or a pair, as needed. Xylene. These materials have good fluidity, can fill the gap between the first carrier 120 and the second carrier 220, and the curing operation is simple, which is advantageous for production.

In addition, the first circuit layer 140 is provided with a first connection port, and the first circuit layer 140 is provided with a device. The device is electrically connected to the first connection port; or the second circuit layer 240 is provided with a second connection port, the second circuit layer 240 is attached with a device, and the device is electrically connected to the second connection port. The first connection port and the second connection port are not shown in the figure.

The first device group 110 includes at least one device, and the second device group 210 includes at least one device, the device being a chip or a separate electronic component. Among them, electronic components include, but are not limited to, a store owner, a capacitor, an inductor, a triode, and a diode. After completing a production process, it is possible to complete the installation of chips and electronic components at the same time with high efficiency. The first device group 110 and the second device group 210 comprise more than one device, and the devices of the same group are disposed on the carrier, and are uniformly installed and processed in parallel through the steps of curing, detaching, and connecting, and the efficiency is high.

Invalid devices are included in the first device group 110 or/and the second device group 210 for equalizing the density of the devices of the first device group 110 or/and the second device group 210 in the molding material 300, avoiding molding materials 300 warps occur.

The area of the substrate is greater than 10,000 square centimeters. According to the integrated circuit system packaging method of the present invention, a large-plane circuit board can be fabricated to avoid warpage, ensure the possibility and quality of the subsequent process on the large substrate, and reduce the manufacturing cost.

The main steps of the integrated circuit system packaging method include:

(1) Curing: As shown in FIG. 2, the first carrier 120 and the second carrier 220 are oppositely disposed, and the first device group 110 on the first carrier 120 and the second device group 210 on the second carrier 220 are both located first. Between the carrier 120 and the second carrier 220; as shown in FIG. 3, a molding material 300 is disposed between the first carrier 120 and the second carrier 220; as shown in FIG. 4, the first device group 110 and the second device group 210 Contacting the molding material 300 respectively, curing the molding material 300, and mounting the first device group 110 and the second device group 210 on both sides of the molding material 300;

(2) detachment: as shown in FIG. 5, the first carrier 120 is detached from the first device group 110 and the molding material 300, and the second carrier 220 is detached from the second device group 210 and the molding material 300;

(3) Wiring: As shown in FIG. 6, a connection hole 310 is formed in the molding material 300; as shown in FIG. 7, a conductive layer 400 is formed, and the conductive layer 400 is extended into the connection hole 310, and the conductive layer 400 is the first device. Group 110 is electrically coupled to the second device group 210. The conductive layer 400 extending into the connection hole 310 may be attached only to the inner wall of the connection hole 310, or the connection hole 310 may be completely or partially filled.

The conventional circuit board is provided with a device on only one side. In the present invention, the first device group 110 and the second device group 210 are respectively disposed on both sides of the molding material 300, and the devices accommodated are greatly increased, and the devices on both sides can be electrically connected through the connection holes 310. Connections, connection points increase, transmission bandwidth, and operation speed are improved, and the obtained integrated circuit system has high performance. Moreover, the devices on both sides of the molding material 300 are electrically connected by means of the connection holes 310. The connection holes 310 are opened in the molding material 300 without occupying extra space; in particular, for ultra-thin circuit boards, flexible circuit boards, and wearable The circuit board of the device, etc., using the method of the present invention, can well maintain the ultra-thin and flexible characteristics of the integrated circuit system.

As needed, as shown in FIGS. 1 to 4, the first device group 110 is mounted to the first carrier 120 by the heat-sensitive adhesive material 130, 230, and in the detaching step, the heat-sensitive adhesive material 130 is heated or cooled, 230, detaching the first carrier 120 from the first device group 110; or/and, the second device group 210 is mounted to the second carrier 220 by the thermosensitive adhesive material 130, 230, in the detaching step, heating or cooling the thermal The bonding material 130, 230 disengages the second carrier 220 from the second device group 210. The first device group 110 or the second device group 210 may be pasted with a heat sensitive material, or the first device group 110 and the second device group 210 may be pasted together as needed, and when heated or cooled, the first carrier 120 is detached, or The second carrier 220 is detached, or the first carrier 120 and the second carrier 220 are simultaneously detached, in preparation for the wiring step.

When the intermediate layer 500 is required to be disposed, in the curing step, as shown in FIG. 8, an intermediate layer 500 is disposed between the first carrier 120 and the second carrier 220 to distribute the molding material 300 on the first carrier 120 and the intermediate layer 500. Between and between the second carrier 220 and the intermediate layer 500, the molding material 300 is cured so that the intermediate layer 500 is embedded in the molding material 300 without taking up extra space. Adding the intermediate layer 500 before the molding material 300 is uncured can improve the performance of the integrated circuit system, and can impart different characteristics to the intermediate layer 500 as needed, so that the final high integrated circuit system can obtain better characteristics. Then, the first circuit layer 140 and the second circuit layer 240 are formed on both sides of the substrate, as shown in FIG. The illustrated connection hole 310 and conductive layer 400 directly connect the first circuit layer 140, the second circuit layer 240, and the base circuit layer 510, but are merely simplified descriptions, and in other embodiments, there may be more complicated wiring possibilities. The connection hole 310 and the conductive layer 400 may connect only the first circuit layer 140, the second circuit layer 240, and the base. Any one or two of the circuit layers 510 are then electrically connected by a plurality of connection holes 310 through the conductive layer 400 on the surface of the substrate, thereby electrically connecting several circuit layers.

As shown in FIGS. 7 and 9, the pins of the devices of the first device group 110 are oriented toward the first carrier 120, and the pins of the devices of the second device group 210 are oriented toward the second carrier 220. After the step of disengaging, the pins of the device of the first device group 110 and the pins of the device of the second device group 210 are exposed on both sides of the substrate, so that the first circuit layer 140 and the first circuit layer are respectively fabricated on both sides of the substrate. The second circuit layer 240 electrically connects the first circuit layer 140 with the first device group 110 and electrically connects the second circuit layer 240 with the second device group 210. The first circuit layer 140 may be directly formed on the surface of the molding material 300, or after the first circuit layer 140 is disposed on another circuit board, the first device group is electrically connected to the circuit board through the pins of the device. a circuit layer 140; the second circuit layer 240 may be directly formed on the surface of the molding material 300, or the second circuit layer 240 may be disposed on another circuit board, and the second device group is electrically connected through the pins of the device. The second circuit layer 240 of the circuit board is inserted. Further, the first device group 110 and the second device group 210 are embedded in the molding material 300. After curing, the two sides of the molding material 300 are flat, which facilitates superimposing other circuit boards on the side or superimposing a plurality of integrated circuit systems.

In addition, the first circuit layer 140 is provided with a first connection port, and the device is mounted on the first circuit layer 140 to electrically connect the device with the first connection port; the first circuit layer 140 is reserved with the first connection for expansion. The line port has an extended function, and after the first circuit layer 140 is fabricated, the device can be repositioned according to different needs. Or/and, the second circuit layer 240 is provided with a second connection port, and the device is mounted on the second circuit layer 240 to electrically connect the device to the second connection port. The second circuit layer 240 is reserved with a second connection port for expansion, and has an expansion function. After the second circuit layer 240 is fabricated, the device can be re-mounted according to different needs, wherein the device can be a chip or an electronic component. The device may be a chip or an electronic component, and the chip includes but is not limited to a die or a chip after the die is packaged.

Furthermore, the first device group 110 or/and the second device group 210 includes an ineffective device for equalizing the density of the devices of the first device group 110 or/and the second device group 210 in the molding material 300. The molding material 300 is prevented from warping. The traditional circuit board, the device composition of the first device group and the second device group are often determined by the functions to be implemented, and the size and number may vary greatly. If only effective devices are used, the device materials may be unevenly distributed due to uneven distribution of device materials. There are no sides on the formed substrate The same thermomechanical stress may still be warped during the manufacturing process. In the present invention, in addition to setting the first device group 110 and the second device group 210 to realize the circuit function of the whole system, an invalid chip is added, and the invalid chip can offset the gap between the different devices and the occupied area, so that the whole The surface of the molding material 300 is balanced by the density occupied by the device to avoid warpage. The first device group 110, or the second device group 210, or the first device group 110 and the second device group 210 may be provided with an invalid chip at the same time. The arrangement positions of the devices of the first device group 110 and the second device group 210 may be pre-designed, and then an invalid device is added, and the position of the invalid device is simulated to facilitate balance and avoid warpage. Invalid devices are not shown in the figure.

The at least two first device groups 110 are disposed on the first carrier 120, and the at least two second device groups 210 are disposed on the second carrier 220. After the curing step, the detaching step, and the wiring step, the first device group 110, The second device group 210 and the molding material 300 constitute a substrate. After the processes of curing, detachment, wiring, and fabrication of the first and second circuit layers 240 are completed, the substrate is finally cut into at least two circuit boards. In this manner, the devices of the first device group 110 and the second device group 210 are first mounted with a plurality of sets of the first device group 110 and the second device group 210 are simultaneously fixedly mounted by the molding material 300, and the connection holes 310 and the conductive layer 400 are simultaneously fabricated. Finally, the board is cut to the required size and the production efficiency is high.

The first device group 110 is at least two, and the second device group 210 is at least two, and each circuit board includes at least one first device group 110 or at least one second device group 210. It is also possible to provide only one first device group 110 or only one second device group 210, and the different circuit boards after cutting include a plurality of devices in the first device group 110 or include the second device group 210, respectively. Several devices in .

The first device group 110, the second device group 210, and the molding material 300 constitute a substrate. After the detaching step, the first circuit layer 140 and the second circuit layer 240 are respectively formed on both sides of the substrate, and the first circuit layer 140 is The first device group 110 is electrically connected to electrically connect the second circuit layer 240 with the second device group 210. The first circuit layer 140, the first device group 110, the second circuit layer 240, and the second device group 210 are electrically connected to expand circuit functions. When the first device group 110 is disposed on the first carrier 120, the first device group 110 may be electrically connected to each other, and the first circuit layer 140 may be extended to extend the original connection; or the first device group may be used. There is no electrical connection between 110 in advance, and the first circuit layer 140 is Now connected. When the second device group 210 is disposed on the second carrier 220, the second device group 210 may be electrically connected to each other, and the second circuit layer 240 may be extended to extend the original connection; or may be between the second device group 210. Electrical connections are made through the second circuit layer 240 without prior electrical connections.

The technical features of the above embodiments may be arbitrarily combined. For the sake of brevity of description, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, It is considered to be the range described in this specification.

The above embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.

Claims (24)

An integrated circuit system packaging method, comprising the steps of: Curing: the first carrier and the second carrier are oppositely disposed, and the first device group on the first carrier and the second device group on the second carrier are both located between the first carrier and the second carrier Forming a molding material between the first carrier and the second carrier, the first device group and the second device group are respectively in contact with the molding material, and the molding material is cured to make the first a device group and the second device group are respectively mounted on both sides of the molding material; Disengaging: detaching the first carrier from the first device group and the molding material, and detaching the second carrier from the second device group and the molding material; Wiring: a connection hole is formed in the molding material, and a conductive layer is formed to extend the conductive layer into the connection hole, and the conductive layer electrically connects the first device group and the second device group. The integrated circuit system packaging method according to claim 1, wherein said first device group is mounted on said first carrier by a thermosensitive adhesive material, and said heat is heated or cooled in said detaching step a sensitive adhesive material to detach the first carrier from the first device group; Or/and, the second device group is mounted to the second carrier by a thermosensitive adhesive material, and in the detaching step, heating or cooling the thermosensitive adhesive material to cause the second carrier to The second device group is detached. The integrated circuit system packaging method according to claim 1, further comprising: in said curing step, providing an intermediate layer between said first carrier and said second carrier to cause said molding material Distributing between the first carrier and the intermediate layer, and between the second carrier and the intermediate layer, curing the molding material such that the intermediate layer is embedded in the molding material. The integrated circuit system packaging method according to claim 3, wherein the intermediate layer is a flexible circuit board; or, at least two layers of flexible circuit boards are stacked to form the intermediate layer; Or the intermediate layer is a shielding layer; Alternatively, the intermediate layer itself constitutes an electronic component that is electrically connected to the first device group or the second device. The integrated circuit system packaging method according to claim 3, wherein said intermediate layer is provided with a base circuit layer, said base circuit layer is electrically connected to said first device group, or said base is electrically The road layer is electrically connected to the second device group. The integrated circuit system packaging method according to claim 1, wherein the molding material is a silicone molded plastic or a molded resin. The integrated circuit system packaging method according to claim 1, further comprising: said first device group, said second device group, and said molding material constituting a substrate, after said detaching step, Forming a first circuit layer and a second circuit layer on both sides of the substrate, electrically connecting the first circuit layer and the first device group, and electrically connecting the second circuit layer and the second device connection. The integrated circuit system packaging method according to claim 7, wherein a pin of the device of the first device group faces the first carrier, and a pin of the device of the second device group faces the second carrier . The integrated circuit system packaging method according to claim 7, wherein the first circuit layer is provided with a first connection port, and the device is mounted on the first circuit layer to make the device and the first connection Line port electrical connection; Alternatively, the second circuit layer is provided with a second connection port, and the device is mounted on the second circuit layer to electrically connect the device to the second connection port. The method of packaging an integrated circuit system according to claim 1, further comprising: Before the curing step, forming a first circuit layer on the first carrier, and providing a first device group on the first circuit layer, the first circuit layer being electrically connected to the first device group; In the step of disengaging, the first circuit layer and the first device group are both separated from the first carrier, and the first circuit layer and the first device group are jointly mounted on the molding material; Or/and, before the curing step, fabricating a second circuit layer on the second carrier, and providing a second device group on the second circuit layer, the second circuit layer being electrically connected to the second device group; In the detaching step, the second circuit layer and the second device group are both detached from the first carrier, and the second circuit layer and the second device group are commonly mounted on the molding material on. The integrated circuit system packaging method according to any one of claims 1 to 10, wherein the first device group, the second device group, and the molding material constitute a substrate, and an area of the substrate is larger than 10,000 square centimeters. The integrated circuit system packaging method according to claim 11, wherein said first device group or/and said second device group includes an invalid device, and said invalid device is for causing said first device group Or / and the device of the second device group balance the density of the distribution of the molding material to avoid warpage of the molding material. The integrated circuit system packaging method according to claim 11, wherein said first device group and said second device group are alternately discharged on both sides of a molding material to cause said first device group and said second device The devices of the device group are uniformly distributed in density on both sides of the molding material to prevent warpage of the molding material. The integrated circuit system packaging method according to any one of claims 1 to 10, wherein at least two of said first device groups are disposed on said first carrier, and at least two said second device groups are provided Provided on the second carrier, after the curing step, the detaching step, and the wiring step, the first device group, the second device group, and the molding material constitute a substrate The substrate is cut into at least two boards. The integrated circuit system packaging method according to any one of claims 1 to 10, wherein the first device group includes at least one device, the second device group includes at least one device, and the device is a chip or an independent device. Electronic component. An integrated circuit system comprising: a first device group detached from a first carrier, a second device group detached from a second carrier, and a cured molding material; Wherein a molding material is located between the first device group and the second device group, the first device group and the second device group are in contact with the molding material, the first device group and the a second device group is respectively mounted on two sides of the molding material, the molding material is provided with a connection hole, and a conductive layer, the conductive layer extends into the connection hole, the conductive layer will be the first A device group is electrically coupled to the second device group. The integrated circuit system of claim 16 wherein said molding material is a silicone molded plastic or a molded resin. The integrated circuit system according to claim 16, wherein said first device group, said second device group, and said molding material constitute a substrate, and both sides of said substrate are respectively provided a first circuit layer, a second circuit layer, the first circuit layer being electrically connected to the first device group, and the second circuit layer being electrically connected to the second device group. The integrated circuit system according to claim 16, wherein said first circuit layer is provided with a first connection port, said first circuit layer is provided with a device, and said device is electrically connected to said first connection port connection; Alternatively, the second circuit layer is provided with a second connection port, the second circuit layer is provided with a device, and the device is electrically connected to the second connection port. The integrated circuit system according to claim 16, further comprising: an intermediate layer disposed between said first device group and said second device group, said intermediate layer being embedded in said molding material . The integrated circuit system of claim 20 wherein said intermediate layer is a flexible circuit board; Alternatively, at least two layers of flexible circuit boards are stacked to form the intermediate layer; Or the intermediate layer is a shielding layer; Alternatively, the intermediate layer itself constitutes an electronic component that is electrically connected to the first device group or the second device. The integrated circuit system according to claim 20, wherein said intermediate layer is provided with a base circuit layer electrically connecting said base circuit layer to said first device group, or said base circuit layer The second device group is electrically connected. The integrated circuit system according to any one of claims 16 to 22, wherein said first device group comprises at least one device, said second device group comprises at least one device, and the device is a chip or a separate electronic component . The integrated circuit system according to any one of claims 16 to 22, wherein said first device group or/and said second device group includes an invalid device, said invalid device for making said A device group or/and a device of the second device group are distributed in density on both sides of the molding material to prevent warpage of the molding material.

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