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WO2017163589A1 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
WO2017163589A1
WO2017163589A1 PCT/JP2017/002540 JP2017002540W WO2017163589A1 WO 2017163589 A1 WO2017163589 A1 WO 2017163589A1 JP 2017002540 W JP2017002540 W JP 2017002540W WO 2017163589 A1 WO2017163589 A1 WO 2017163589A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
formula
component
mass
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/002540
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English (en)
French (fr)
Japanese (ja)
Inventor
太樹 明道
洋介 酒井
真一 宗村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
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Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Priority to CN201780015951.8A priority Critical patent/CN108713032B/zh
Priority to KR1020187026112A priority patent/KR102666267B1/ko
Publication of WO2017163589A1 publication Critical patent/WO2017163589A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers

Definitions

  • the present invention relates to a resin composition used as NCP (Non Conductive Paste) during semiconductor mounting.
  • NCP Non Conductive Paste
  • An object of the present invention is to provide a resin composition that satisfies the above-described required properties of NCP in order to solve the above-described problems in the prior art.
  • a resin composition containing a silane coupling agent is provided.
  • the acrylate compound of the component (C) is preferably an acrylate compound represented by the formula (4).
  • the content of the acrylate compound of the component (C) is 1 to 6 masses in a total mass of 100 parts by mass of the components (A), (B), (C), and (D). Part.
  • the organic peroxide as the component (E) preferably contains at least one compound represented by the formulas (5) to (7).
  • the content of the organic peroxide of the component (E) is 0.5 to 100 parts by mass with respect to 100 parts by mass of the total mass of the components (A), (B), and (C). It is preferably 6 parts by mass.
  • the resin composition of the present invention preferably further contains (H) a compound having a flux function.
  • the compound having the flux function of the component (H) is preferably stearic acid.
  • the present invention also provides a non-conductive paste (NCP) containing the resin composition of the present invention.
  • NCP non-conductive paste
  • the present invention also provides a semiconductor device using the NCP of the present invention.
  • the resin composition of the present invention When used as an NCP, it is excellent in mountability in the TCB process, and has good moisture absorption reflow resistance, HAST resistance, and life on the stage during TCB implementation.
  • FIG. 1 is a graph showing a TCB temperature profile in an example.
  • the resin composition of the present invention contains the following (meth) acrylate compound (component (A)) and acrylate compounds (component (B), component (C)) as essential components.
  • (A) a (meth) acrylate compound represented by formula (1)
  • m + n 2.3 to 4.0
  • R 1 and R 2 are each a hydrogen atom (H) or a methyl group (CH 3 ).
  • m + n 2.3 to 4.0.
  • the compound in which R 1 and R 2 represented by the formula (1) are methyl groups is EO-modified bisphenol A dimethacrylate (2,2-Bis [4- (Methacryloxy Ethoxy) Phenyl] Propane)).
  • EO-modified means having an ethylene oxide unit (—CH 2 —CH 2 —O—) block structure.
  • the (meth) acrylate compound represented by the formula (1) acts as a component imparting liquid properties, adhesion after curing, and durability when the resin composition of the present invention is used as NCP.
  • the content of the (meth) acrylate compound represented by the formula (1) is preferably 10 to 65 parts by mass in 100 parts by mass of the total mass of the components (A), (B), (C) and (D). 13 to 60 parts by mass is more preferable.
  • the acrylate compound represented by the formula (2) is dimethylol tricyclodecane diacrylate (Dimethylol Tricyclodecane Diacrylate).
  • the acrylate compound represented by the formula (2) acts as a component imparting liquid characteristics, curability in the TCB process, and durability when the resin composition of the present invention is used as NCP.
  • the content of the acrylate compound represented by the formula (2) is 15 to 70 parts by mass in 100 parts by mass of the total mass of the components (A), (B), (C) and (D) of the resin composition of the present invention. It is preferably 20 to 67 parts by mass.
  • the acrylate compound represented by the formula (3) is a caprolactone-modified epoxy acrylate oligomer.
  • the acrylate compound represented by the formula (3) acts as a component for improving the life on the stage when TCB is performed when the resin composition of the present invention is used as NCP. This is because the functional group density is slightly lowered by blending the long-chain acrylate compound represented by the formula (3).
  • R 1 and R 2 are preferably a phenyl group, that is, the acrylate compound represented by the formula (4) is preferable for the reasons of chemical resistance and long-term durability.
  • the content of the silica filler of the component (C) is 40 to 65 parts by mass in 100 parts by mass of the total mass of each component of the film-shaped resin composition of the present invention. It is preferably 45 to 65 parts by mass.
  • the content of the acrylate compound represented by the formula (3) is 1 to 6 parts by mass in 100 parts by mass of the total mass of the components (A), (B), (C) and (D) of the resin composition of the present invention. It is preferably 2 to 5 parts by mass.
  • a (meth) acrylate compound other than the (A) (meth) acrylate compound and the (B) and (C) component acrylate compounds may be used in combination as appropriate.
  • Specific examples of (meth) acrylate compounds that can be used in combination include, for example, bifunctional polyester acrylate compounds, polyester methacrylate compounds, polyurethane acrylate compounds, polyurethane methacrylate compounds, epoxy acrylate compounds, epoxy methacrylate compounds, and 2-acryloyloxyethyl acid phosphate.
  • Cyclic structures such as phosphorus (meth) acrylate compounds such as 2-methacryloyloxyethyl acid phosphate, glycol (meth) acrylate compounds such as neopentyl glycol acrylate and neopentyl glycol dimethacrylate, dimethylol tricyclodecane dimethacrylate, etc.
  • (Meth) acrylate, isobornyl (meth) acrylate, tetrahydrofurfil Meth) acrylate, phenoxy polyethylene glycol acrylate, nonylphenol EO adduct acrylate, glycidyl (meth) acrylate, may be appropriately used in combination a monofunctional (meth) acrylates such as methacrylate.
  • the resin composition of the present invention contains a copolymer of butadiene and maleic anhydride as an essential component as the component (D).
  • the copolymer of butadiene and maleic anhydride has a polybutadiene skeleton modified with maleic anhydride.
  • the copolymer of butadiene and maleic anhydride acts as a stress relaxation component when the resin composition of the present invention is used as NCP.
  • the copolymer of butadiene and maleic anhydride is preferably liquid at room temperature for the purpose of imparting liquid properties.
  • the copolymer of butadiene and maleic anhydride preferably has a number average molecular weight (Mn) of 500 to 5000, more preferably 1000 to 4000.
  • the content of the copolymer of the component (D) is 5 to 30 parts by mass in 100 parts by mass of the total mass of the components (A), (B), (C) and (D) of the resin composition of the present invention. It is preferably 7 to 27 parts by mass.
  • the resin composition of the present invention contains an organic peroxide as an essential component as the component (E).
  • the organic peroxide of component (E) is a mixture of (A) methacrylate compound, (B) and (C) acrylate compound, and (D) component during the heat curing of the resin composition of the present invention. Promotes the coalescence reaction.
  • organic peroxide of a component As an organic peroxide of a component, the organic peroxide which has a peroxyester structure or a dialkyl peroxide structure is used.
  • organic peroxide having a peroxyester structure or a dialkyl peroxide structure compounds represented by the formulas (5) to (7) are preferably used.
  • the compound represented by Formula (5) is dicumyl peroxide
  • the compound represented by Formula (6) is t-butylperoxybenzoate
  • Formula (7) is t-hexylperoxybenzoate.
  • the above-mentioned organic peroxide may be used alone or in combination of two or more.
  • the content of the organic peroxide of the component (E) is 0.5 to 100 parts by mass with respect to 100 parts by mass of the total mass of the (meth) acrylate compound of the component (A) and the acrylate compounds of the components (B) and (C).
  • the amount is preferably 6 parts by mass, and more preferably 0.6 to 5 parts by mass.
  • an organic peroxide having a structure other than a peroxyester structure or a dialkyl peroxide structure may be appropriately used in combination.
  • organic peroxides that can be used in combination include, for example, benzoyl peroxide, p-menthane hydroperoxide, methyl ethyl ketone peroxide, di-2-ethylhexyl peroxydicarbonate, 1,1-di (t-butyl). Peroxy) -2-methylcyclohexane and the like.
  • silica filler of the component (F) is added as an essential component for the purpose of improving the reliability of the mounted semiconductor package when the resin composition of the present invention is used as an NCP.
  • the silica filler as the component (F) preferably has an average particle size of 1 ⁇ m or less for reasons such as permeability to a narrow gap and prevention of impact on the semiconductor chip.
  • the silica filler as the component (F) preferably has an average particle size of 0.1 ⁇ m or more for the purpose of maintaining liquid properties.
  • the silica filler as component (F) preferably has an average particle size of 0.1 to 0.7 ⁇ m.
  • the shape of the filler is not particularly limited, and may be any shape such as a spherical shape, an indeterminate shape, and a flake shape. When the shape of the filler is other than spherical, the average particle diameter of the filler means the average maximum diameter of the filler.
  • the silica filler that has been surface-treated with a silane coupling agent or the like may be used as the silica filler.
  • a silica filler that has been subjected to surface treatment is used, an effect of preventing aggregation of the silica filler is expected.
  • the content of the component (F) is preferably 40 to 65 parts by mass, and 45 to 65 parts by mass in 100 parts by mass of the total mass of each component of the resin composition of the present invention. More preferably.
  • silane coupling agent of component (G) is added for the purpose of improving adhesion to an IC chip or a substrate when the resin composition of the present invention is used as an NCP.
  • silane coupling agent of component (G) various silane coupling agents such as epoxy, amino, vinyl, methacrylic, acrylic, mercapto and the like can be used. Among these, an epoxy silane coupling agent having an epoxy group and a methacrylic silane coupling agent having a methacryl group are preferable because of high adhesion.
  • epoxy silane coupling agent examples include 3-glycidoxypropyltrimethoxysilane (trade name: KBM403, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidoxypropyltriethoxysilane (trade name: KBE-403). , Manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidoxypropylmethyldiethoxysilane (trade name: KBE-402, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidoxypropylmethyldimethoxysilane (trade name: KBM402, Shin-Etsu Chemical) Etc.).
  • methacrylic silane coupling agents include 3-methacryloxypropyltrimethoxysilane (trade name: KBM503, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-methacryloxypropylmethyldimethoxysilane (trade name: KBM502, Shin-Etsu Chemical Co., Ltd.) Company-made), 3-methacryloxypropylmethyldiethoxysilane (trade name: KBE502, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-methacryloxypropyltriethoxysilane (trade name: KBE503, manufactured by Shin-Etsu Chemical Co., Ltd.), etc. .
  • the content of the silane coupling agent of the component (G) is 0.05 to 1 part by mass in 100 parts by mass of the total mass of each component of the resin composition of the present invention.
  • the amount is 0.1 to 0.8 parts by mass.
  • the resin composition of the present invention may contain the components described below as needed in addition to the components (A) to (G).
  • the component (H) component is a component that forms a flux activator when the resin composition of the present invention is used as an NCP.
  • the compound of the component (H) is contained, when the resin composition of the present invention is used as NCP, electrical connectivity and its reliability are improved.
  • Examples of the compound (H) having a flux function include 8-quinolinol, malonic acid, succinic acid, maleic acid, glutaric acid, suberic acid, adipic acid, sebacic acid, stearic acid and other carboxylic acids, diphenylguanidine odor, and the like.
  • Examples thereof include hydrobromide, cyclohexylamine hydrobromide, diethylamine hydrochloride, triethanolamine hydrobromide, monoethanolamine hydrobromide and the like.
  • stearic acid is preferable for the reason of promoting solder wetting and stability of life.
  • the content varies depending on the flux activity, but when the stearic acid is used as the component (H), the (meth) acrylate compound of the component (A), ( It is preferably 0.5 to 7 parts by mass, and preferably 1 to 5 parts by mass, with respect to 100 parts by mass of the total mass of the acrylate compound of components B) and (C) and the copolymer of component (D). It is more preferable.
  • the resin composition of the present invention may further contain components other than the components (A) to (H) as necessary.
  • Specific examples of such components include an antifoaming agent, a surface conditioner, a rheology conditioner, a colorant, a plasticizer, a dispersant, and an anti-settling agent.
  • you may contain an epoxy resin for the objective of adhesiveness and durability provision.
  • the epoxy resin contained for this purpose may be either a liquid epoxy resin or a solid epoxy resin.
  • Preferred epoxy resins are bisphenol F type epoxy resin and aminophenol type epoxy resin. When an epoxy resin is included, an epoxy resin curing agent and an epoxy resin curing accelerator are included as necessary.
  • elastomers may be included for the purpose of adjusting the elastic modulus and stress of the resin composition of the present invention
  • other solid resins may be included for the purpose of adjusting the viscosity, toughness and the like of the resin composition of the present invention. Also good.
  • the type and amount of each compounding agent are as usual.
  • the resin composition of the present invention can be prepared by a conventional method.
  • the components (A) to (G), the component (H) to be blended as necessary, and other compounding agents are added or sequentially added, and dispersed in a dispersing device such as a kneader, three rolls, or a ball mill. , Mix.
  • the resin composition of the present invention When used as an NCP, it is excellent in mountability in the TCB process, and has good moisture absorption reflow resistance, HAST resistance, and life on the stage during TCB implementation.
  • the resin composition of the present invention can be mounted in a short time and has high productivity.
  • the resin composition of the present invention containing the component (H) has a flux effect and is excellent in solder connectivity.
  • the procedure for using the resin composition of the present invention is shown below.
  • the resin composition of the present invention is applied to a position on the substrate where the semiconductor chip is mounted using a dispenser or the like.
  • a semiconductor chip is mounted by heat pressure welding (TCB) to a chip mounting position on the substrate using a flip chip bonder or the like.
  • TCB condition is not particularly limited, the TCB condition can be appropriately selected depending on the semiconductor chip size, bump material, number of bumps, and the like.
  • the heating temperature is preferably 50 to 300 ° C.
  • the time is 1 to 20 seconds
  • the pressure is preferably 5 to 450 N.
  • the semiconductor device of the present invention is not particularly limited as long as the resin composition of the present invention is used as NCP at the time of manufacturing the semiconductor device.
  • Specific examples of the semiconductor device of the present invention include a semiconductor device having a flip chip structure.
  • the flip chip has a protruding electrode called a bump, and is connected to an electrode such as a substrate through the electrode.
  • Examples of the bump material include solder, gold, and copper.
  • Substrates connected to the flip chip include single layers such as FR-4 or laminated organic substrates, inorganic substrates such as silicon, glass, ceramics, etc., with gold or tin plating on copper and copper, solder layers, etc.
  • the formed electrode is used.
  • a memory device such as a DRAM (Dynamic Random Access Memory), a processor device such as a CPU (Central Processing Unit) GPU (Graphics Processing Unit), an LED (Light Emitting Diode), or the like.
  • a driver IC used for (Liquid Crystal Display) and the like.
  • Examples 1 to 26, Comparative Examples 1 to 4 Each raw material was mixed and dispersed using a three-roll mill so that the blending ratio shown in the following table was obtained, thereby preparing a resin composition.
  • surface represents the mass part.
  • the components used in preparing the resin composition are as follows.
  • (A1) Trade name BPE-100 (in formula (1), R 1 and R 2 are methyl groups, m + n 2.6), manufactured by Shin-Nakamura Chemical Co., Ltd.)
  • (A2) Trade name BPE-80N (in formula (1), R 1 and R 2 are methyl groups, m + n 2.3), manufactured by Shin-Nakamura Chemical Co., Ltd.)
  • (C) acrylate compound represented by formula (4) Product name EBECRYL3708, Daicel Ornex Co., Ltd.
  • E3 t-butylperoxybenzoate, trade name Perbutyl (registered trademark) Z, 10 hour half-life temperature 104.3 ° C.
  • E′1 Benzoyl peroxide, trade name Nyper (registered trademark) BW, 10-hour half-life temperature 73.6 ° C.
  • the resin composition produced by the above procedure was used as NCP, and a test chip was mounted on the organic substrate by the following procedure.
  • the test chip has a size of 7.3 mm ⁇ 7.3 mm ⁇ 0.125 mm (t), and 544 bumps each having a solder layer formed on a 30 ⁇ m ⁇ 30 ⁇ m ⁇ 30 ⁇ m Cu pillar are provided.
  • the organic substrate for mounting the test chip has a size of 17.0 mm ⁇ 17.0 mm ⁇ 0.9 mm (t), and is provided with an electrode made of Cu subjected to OSP processing.
  • the resin composition prepared by the above procedure was applied in an X pattern onto an organic substrate using a 23G size needle using a dispenser (trade name Super ⁇ II V5, manufactured by Musashi Engineering Co., Ltd.).
  • a dispenser trade name Super ⁇ II V5, manufactured by Musashi Engineering Co., Ltd.
  • the test chip and the organic substrate were heated and pressed (TCB).
  • the stage temperature of the flip chip bonder was set to 70 ° C.
  • the load was set to 25 N
  • the TCB temperature profile shown in FIG. 1 was set.
  • a thermocouple 50 ⁇ m ⁇
  • test piece In the test, the test piece after application was allowed to stand on a flip chip bonder at 70 ° C. for a predetermined time (10, 60, 120, 180 minutes), and then the resin composition was cured and connected with TCB. After TCB, the test piece was completed by heating at 165 ° C. for 1 hour. Five test pieces were prepared for each standing time, and the following evaluation was performed.
  • SAT Observation Void / delamination of the prepared specimen was observed by a reflection method using an ultrasonic flaw detector (Scanning Acoustic Tomography, SAT). A product with a white-like shadow confirmed on an income image was regarded as a defective product.
  • the description in the table indicates the number of defective samples / number of measurement samples (the same applies hereinafter).
  • the resistance value of the produced test piece was measured using a resistance value measuring pad provided on the substrate. If even one sample failed, the connection state was marked as x. A product showing a resistance value of 28 to 32 ⁇ was accepted, and a product showing a resistance value of less than 28 ⁇ or more than 32 ⁇ was regarded as a defective product.
  • test piece (Hygroscopic reflow test) The test piece (5 test pieces) produced by the above procedure was allowed to stand for 192 hours under the condition of 30 ° C./60% RH (JEDEC level 3 (MRT L.3) moisture absorption condition) to absorb moisture. After that, it was passed through a reflow furnace having a maximum temperature of 260 ° C. three times. After the moisture absorption reflow, the SAT observation and the resistance value were measured in the same procedure as described above.
  • Examples 1 to 26 the results of the mountability test, the moisture absorption reflow test, and the HAST test were all good.
  • Examples 1 and 2 are examples in which the silane coupling agent of component (G) was changed.
  • Examples 4 to 7 are examples in which the organic peroxide of the component (E) was changed.
  • Examples 8 and 9 are examples in which the methacrylate compound as the component (A) was changed.
  • Examples 11 to 20 are examples in which the blending ratio of each component was changed.
  • Examples 21 and 22 are examples in which an epoxy resin was added as the component (I), and Examples 23, 24, and 26 were examples in which a compound having a flux function was further added as the component (H). .
  • Example 25 the component (H) was added without adding the component (I).
  • Comparative Example 1 is an example that does not contain the component (G) silane coupling agent.
  • the SAT observation and resistance value of one test piece were defective. Further, in the moisture absorption reflow test (left for 180 minutes), SAT observation of one test piece was a defective product. Therefore, the HAST test was not performed.
  • Comparative Examples 2 and 3 are examples in which an organic peroxide having no peroxyester structure or dialkyl peroxide structure was used as the (E′1) component and the (E′2) component. (Observation, resistance value) all 5 test pieces were defective. Therefore, the moisture absorption reflow test and HAST test were not performed.
  • Comparative Example 4 is an example not containing the copolymer of the component (D), and SAT observation and resistance values of all 5 test pieces were defective in the mountability evaluation (left for 180 minutes). Therefore, the moisture absorption reflow test and the HAST test were not performed on the test piece left for 180 minutes, but were performed on the test piece left for 120 minutes.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/JP2017/002540 2016-03-24 2017-01-25 樹脂組成物 Ceased WO2017163589A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201780015951.8A CN108713032B (zh) 2016-03-24 2017-01-25 树脂组合物
KR1020187026112A KR102666267B1 (ko) 2016-03-24 2017-01-25 수지 조성물

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JP2016-059895 2016-03-24
JP2016059895A JP6715634B2 (ja) 2016-03-24 2016-03-24 樹脂組成物

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JP (1) JP6715634B2 (zh)
KR (1) KR102666267B1 (zh)
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TW (1) TWI716541B (zh)
WO (1) WO2017163589A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021177379A1 (ja) * 2020-03-03 2021-09-10 デンカ株式会社 組成物

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7126129B2 (ja) * 2017-03-07 2022-08-26 パナソニックＩｐマネジメント株式会社 アンダーフィル用熱硬化性組成物及び半導体装置
JP7238259B2 (ja) * 2018-03-16 2023-03-14 三菱ケミカル株式会社 プリプレグ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003212956A (ja) * 2002-01-28 2003-07-30 Daicel Ucb Co Ltd エポキシ（メタ）アクリレート、その製造方法、活性エネルギー線硬化型エポキシ（メタ）アクリレート組成物、硬化物及びその用途
JP2010009743A (ja) * 2009-10-13 2010-01-14 Dic Corp 光ディスク用紫外線硬化型組成物及び光ディスク
JP2015017169A (ja) * 2013-07-10 2015-01-29 ナミックス株式会社 先供給型半導体封止剤および半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002121259A (ja) * 2000-10-19 2002-04-23 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物、半導体装置の製造方法及び半導体装置
CN102471426B (zh) * 2009-07-22 2013-10-30 日立化成株式会社 光固化性树脂组合物和其固化物、树脂片材和其制造法以及显示装置
JP2013016473A (ja) * 2011-06-10 2013-01-24 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP6207348B2 (ja) * 2013-11-08 2017-10-04 ナミックス株式会社 樹脂組成物、先供給型半導体封止剤および半導体装置
JP2015117266A (ja) * 2013-12-17 2015-06-25 スリーボンドファインケミカル株式会社 光硬化性組成物
WO2015133386A1 (ja) * 2014-03-04 2015-09-11 積水化学工業株式会社 電子部品実装用接着剤及びフリップチップ実装用接着フィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003212956A (ja) * 2002-01-28 2003-07-30 Daicel Ucb Co Ltd エポキシ（メタ）アクリレート、その製造方法、活性エネルギー線硬化型エポキシ（メタ）アクリレート組成物、硬化物及びその用途
JP2010009743A (ja) * 2009-10-13 2010-01-14 Dic Corp 光ディスク用紫外線硬化型組成物及び光ディスク
JP2015017169A (ja) * 2013-07-10 2015-01-29 ナミックス株式会社 先供給型半導体封止剤および半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021177379A1 (ja) * 2020-03-03 2021-09-10 デンカ株式会社 組成物
JPWO2021177379A1 (zh) * 2020-03-03 2021-09-10
JP7652755B2 (ja) 2020-03-03 2025-03-27 デンカ株式会社 組成物

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