WO2017061638A1 - Dispositif mems, boîtier mems le comprenant, et terminal utilisateur - Google Patents
Dispositif mems, boîtier mems le comprenant, et terminal utilisateur Download PDFInfo
- Publication number
- WO2017061638A1 WO2017061638A1 PCT/KR2015/010530 KR2015010530W WO2017061638A1 WO 2017061638 A1 WO2017061638 A1 WO 2017061638A1 KR 2015010530 W KR2015010530 W KR 2015010530W WO 2017061638 A1 WO2017061638 A1 WO 2017061638A1
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- WIPO (PCT)
- Prior art keywords
- mems device
- masses
- mems
- capacitance
- moving electrodes
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B5/00—Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
- G01C19/5733—Structural details or topology
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/14—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of gyroscopes
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Definitions
- the present invention relates to a MEMS device, and more particularly, to a comb-type sensing type MEMS device, a MEMS package including the same, and a user terminal.
- MEMS Micro Electro Mechanical Systems
- military applications such as satellites, missiles, and unmanned aerial vehicles, and for camera shake, mobile phones, cameras, camcorders, and mobile phones, such as air bags, electronic stability controls, and black boxes for vehicles. It is used for various purposes such as motion sensing and navigation for game consoles.
- the parallel-type sensing MEMS device does not generate resonance at a desired frequency due to the squeeze film damping effect, and reduces the resonance frequency. In order to attenuate the influence of external noise, a high resonance frequency is required. In addition, the parallel sensing MEMS device has poor linearity due to the pull-in effect.
- An object of the present invention is to provide a comb sensing MEMS device capable of obtaining a high resonance frequency.
- Another technical problem of the present invention is to provide a comb sensing MEMS device capable of improving linearity and stability.
- Another technical problem of the present invention is to provide a MEMS package and a user terminal including the above-described MEMS device.
- each of the plurality of first mass connected to the fixing portion by a spring, the first direction facing each other in the first direction, and the spring A plurality of moving electrodes connected to a first mass of and having a comb structure and provided with a Coriolis force, the plurality of moving electrodes move separately from the plurality of first masses It is possible.
- the plurality of moving electrodes may be used for Yaw axis sensing.
- the device further comprises a plurality of second masses connected to the fixing part by springs and opposed to each other in a second direction, wherein the plurality of first masses and the The plurality of second masses may be coupled to each other.
- the apparatus further includes a plurality of fixed electrode groups corresponding to the respective moving electrodes and having a comb structure, wherein each fixed electrode group comprises a first capacitor constituting a first capacitor. It may include a second fixed electrode constituting the fixed electrode and the second capacitor.
- the capacitance of the first capacitor and the capacitance of the second capacitor may increase or decrease oppositely.
- the change amounts of capacitances of the plurality of first capacitors may be added together and processed, or the change amounts of capacitances of the plurality of second capacitors may be added together and processed.
- the plurality of moving electrodes when a rotation in a predetermined direction is provided, the plurality of moving electrodes may move in different directions.
- the plurality of moving electrodes when acceleration in a predetermined direction is provided, the plurality of moving electrodes may move in the same direction.
- MEMS package according to another aspect of the present invention for solving the above technical problem includes any one of the above-described MEMS device.
- a user terminal according to another aspect of the present invention for solving the above technical problem includes any one of the above-described MEMS device.
- the MEMS device of the present invention when a Coriolis force is provided, the force is sensed by using a movable electrode which is separated from the mass, not the entire mass, and is movable, so that the mass of the moving structure is reduced, resulting in a high resonance frequency. can do.
- the linearity is improved, and the pull-in voltage is reduced, thereby making the MEMS device more stable.
- FIG. 1 is a plan view schematically showing a MEMS device according to an embodiment of the present invention.
- FIG. 2 is a plan view schematically showing the operation of the MEMS device of FIG. 1 when rotation in a predetermined direction is provided.
- FIG. 3 is a diagram schematically showing a change in capacitance of the MEMS device of FIG. 1 when rotation in a predetermined direction is provided.
- FIG. 4 is a plan view schematically illustrating the operation of the MEMS device of FIG. 1 when acceleration in a predetermined direction is provided.
- FIG. 5 is a diagram schematically showing a change in capacitance of the MEMS device of FIG. 1 when acceleration in a predetermined direction is provided.
- FIG. 6 is a diagram schematically illustrating a MEMS package including a MEMS device according to an embodiment of the present invention.
- FIGS. 7-8 are schematic diagrams of sensor hubs including MEMS devices in accordance with embodiments of the present invention.
- FIG. 9 is a diagram schematically illustrating a user terminal including a MEMS device according to an embodiment of the present invention.
- first, second, etc. are used to describe various elements, components and / or sections, these elements, components and / or sections are of course not limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Therefore, the first device, the first component, or the first section mentioned below may be a second device, a second component, or a second section within the technical spirit of the present invention.
- a device described as "below or beneath” of another device may be placed “above” of another device.
- the exemplary term “below” can encompass both an orientation of above and below.
- the device may be oriented in other directions as well, in which case spatially relative terms may be interpreted according to orientation.
- a gyro sensor will be described as an example among various MEMS devices.
- the present invention is not limited thereto, and a person having ordinary knowledge in the technical field to which the present invention belongs is not only a gyro sensor but also a comb-type sensing base such as an acceleration sensor, a pressure sensor, a microphone, and the like. It will be appreciated that any MEMS device may be applied substantially the same without changing its technical spirit or essential features.
- FIG. 1 is a plan view schematically showing a MEMS device according to an embodiment of the present invention.
- the MEMS device 100 includes a plurality of mass bodies 110 to 140, fixed parts 150, moving electrodes 115 and 125, fixed electrode groups 170 and 180, and springs 161 to 163. It includes.
- the plurality of masses 110 to 140 include a plurality of first masses 110 and 120 and a plurality of second masses 130 and 140.
- the plurality of first masses 110 and 120 oppose each other in a first direction (eg, the horizontal direction in FIG. 1), and the plurality of second masses 130 and 140 may correspond to a second direction (eg, FIG. In the vertical direction of one phase).
- the plurality of mass bodies 110 to 140 may be connected to the central fixing part 150 by a spring 162.
- the plurality of masses 110 to 140 may be directly coupled to each other by the spring 161.
- the plurality of first masses 110 and 120 may be used for pitch axis sensing, and the plurality of second masses 130 and 140 may be used for roll axis sensing, but is not limited thereto.
- the plurality of moving electrodes 115 and 125 may be disposed inside the plurality of first mass bodies 110 and 120. By removing a predetermined region inside each of the first masses 110 and 120, an internal space of a groove or an opening may be formed in each of the first masses 110 and 120. In addition, the moving electrodes 115 and 125 may be formed in the space. The moving electrodes 115 and 125 may be connected to the first mass bodies 110 and 120 by springs 163. Substantially the same as the plurality of first mass bodies 110 and 120, the plurality of moving electrodes 115 and 125 may also face each other. The plurality of moving electrodes 115 and 125 may be used for Yaw axis sensing, but are not limited thereto.
- the plurality of fixed electrode groups 170 and 180 may include a first fixed electrode group 170 and a second fixed electrode group 180.
- the first fixed electrode group 170 may be disposed corresponding to the first moving electrode 115
- the second fixed electrode group 180 may be disposed corresponding to the second moving electrode 125.
- Each of the fixed electrode groups 170 and 180 may include first fixed electrodes 171 and 181 disposed above and second fixed electrodes 173 and 183 disposed below.
- the plurality of fixed electrodes 171, 173, 181, and 183 and the plurality of moving electrodes 115 and 125 may be disposed on the same plane.
- the plurality of fixed electrodes 171, 173, 175, and 177 and the plurality of moving electrodes 115 and 125 have a comb structure and may be coupled to each other.
- the first fixed electrodes 171, 181 together with the respective moving electrodes 115, 125 constitute a first capacitor
- the second fixed electrodes 173, 183 correspond with the respective moving electrodes 115, 125.
- the plurality of masses 110 to 140, the plurality of moving electrodes 115 and 125, and the plurality of fixed electrodes 171, 173, 175, and 177 may include silicon or metal, but are not limited thereto.
- the springs 161 to 163 may support the plurality of masses 110 to 140 and the plurality of moving electrodes 125 and 145, respectively.
- the driving electrode may be disposed adjacent to the plurality of second mass bodies 130 and 140.
- the masses 110 to 140 may vibrate by the electrostatic force generated from the driving electrode.
- the plurality of masses 110 to 140 may be driven in different directions, respectively, in parallel with the vertical direction or the horizontal direction of FIG. 1, for example. Since the moving electrodes 115 and 125 are connected to the first masses 110 and 120 by the springs 163, the moving electrodes 115 and 125 may also vibrate together with the first masses 110 and 120.
- the driving electrode may be disposed adjacent to the plurality of first mass bodies 110 and 120.
- the plurality of moving electrodes 115 and 125 may move apart from the plurality of first masses 110 and 120.
- the capacitance of the first capacitor and the capacitance of the second capacitor may increase or decrease in opposite directions. That is, when the capacitance of the first capacitor is increased, the capacitance of the second capacitor is decreased, and when the capacitance of the first capacitor is decreased, the capacitance of the second capacitor may be increased.
- the direction and magnitude of the angular velocity may be sensed using the increase or decrease of the capacitance.
- the shape and arrangement of the fixed electrodes 171, 173, 175, and 177 may be variously modified according to embodiments, within the scope of not changing the technical spirit or essential features of the present invention.
- FIG. 2 is a plan view schematically showing the operation of the MEMS device of FIG. 1 when rotation in a predetermined direction is provided.
- the plurality of moving electrodes 115 and 125 move in different directions by the Coriolis force. As illustrated, the plurality of moving electrodes 115 and 125 may move toward the outside of the MEMS device 100, respectively, but are not limited thereto, and may move the inside of the MEMS device 100 according to the direction of rotation provided. You can also move toward each other.
- FIG. 3 is a diagram schematically showing a change in capacitance of the MEMS device of FIG. 1 when rotation in a predetermined direction is provided.
- first fixed electrodes 171 and 181 may be disposed on the plurality of moving electrodes 115 and 125, and second fixed electrodes 173 and 183 may be disposed below the moving electrodes 115 and 125.
- the plurality of moving electrodes 115, 125 includes a plurality of fingers 116, 126, and each of the fixed electrodes 171, 173, 175, 177 also includes a plurality of fingers 172, 174, 182, 184. can do.
- the fingers 116, 126 of the plurality of moving electrodes 115, 125 and the fingers 172, 174, 182, 184 of the plurality of fixed electrodes 171, 173, 175, 177 are alternately disposed at predetermined intervals. Can be arranged.
- the fingers 172 and 174 of the first fixed electrodes 171 and 181 and the fingers 174 and 184 of the second fixed electrodes 173 and 183 may be asymmetrically formed, for example, in the horizontal direction on FIG. 3. have.
- the fingers 116 and 126 of the moving electrodes 115 and 125 are first fixed. Since the spacing between the fingers 172, 182 of the electrodes 171, 181 decreases, the capacitance of the first capacitor increases, and the fingers 116, 126 of the moving electrodes 115, 125 and the second fixed electrode 173, As the spacing between fingers 174 and 184 of 183 increases, the capacitance of the second capacitor is reduced.
- FIG. 4 is a plan view schematically illustrating the operation of the MEMS device of FIG. 1 when acceleration in a predetermined direction is provided.
- the plurality of moving electrodes 115 and 125 move in the same direction by the inertial force. As shown, the plurality of moving electrodes 115, 125 may move together toward one side of the MEMS device 100, but is not limited thereto, and the other movement of the MEMS device 100 may vary depending on the direction of acceleration provided. It can also move together towards the side.
- FIG. 5 is a diagram schematically showing a change in capacitance of the MEMS device of FIG. 1 when acceleration in a predetermined direction is provided.
- the fingers 116 and the first fixed electrode group 170 of the moving electrode 115 are moved. Since the spacing between the fingers 172 of the first fixed electrode 171 decreases, the capacitance of the first capacitor on the side of the first fixed electrode group 170 increases, but the fingers 126 and the second of the moving electrode 125 are increased. Since the distance between the fingers 182 of the first fixed electrode 181 of the fixed electrode group 180 is increased, the capacitance of the first capacitor on the side of the second fixed electrode group 180 is reduced. In contrast to the first capacitor, the capacitance of the second capacitor on the side of the first fixed electrode group 170 decreases, but the capacitance of the second capacitor on the side of the second fixed electrode group 180 increases.
- the finger 116 and the first fixed electrode group 170 of the moving electrode 115 are moved. Since the spacing between the fingers 172 of the first fixed electrode 171 of the first electrode 171 increases, the capacitance of the first capacitor on the side of the first fixed electrode group 170 decreases, but the finger 126 and the first of the movable electrode 125 Since the spacing between the fingers 182 of the first fixed electrode 181 of the second fixed electrode group 180 decreases, the capacitance of the first capacitor on the side of the second fixed electrode group 180 increases. In contrast to the first capacitor, the capacitance of the second capacitor on the side of the first fixed electrode group 170 increases, but the capacitance of the second capacitor on the side of the second fixed electrode group 180 will decrease.
- the amount of change in capacitance of the plurality of first capacitors and / or the amount of change in capacitance of the plurality of second capacitors may be summed and processed. As a result, the accuracy of the angular velocity measurement can be increased, and the influence by external acceleration can be reduced.
- the fingers 116 and 126 of the plurality of moving electrodes 115 and 125 and the fingers 172, 174 and the fingers of the plurality of fixed electrodes 171, 173, 175 and 177 are illustrated.
- the shape and arrangement of the 182 and 184 may be variously modified according to the embodiment within the scope that does not change the technical spirit or essential features of the present invention.
- FIG. 6 is a diagram schematically illustrating a MEMS package including a MEMS device according to an embodiment of the present invention.
- the MEMS package 1000 includes a PCB substrate 1100, a MEMS device 1200 stacked on the PCB substrate 1100, and an ASIC device 1300.
- the MEMS device 1200 may be formed substantially the same as the MEMS device 100 described with reference to FIG. 1. 6 illustrates a wire bonding method, but the present invention is not limited thereto, and a flip chip method may be used.
- FIGS. 7-8 are schematic diagrams of sensor hubs including MEMS devices in accordance with embodiments of the present invention.
- the sensor hub 2000 may include a processing device 2100, a MEMS device 2200, and an application specific integrated circuit (ASIC) device 2300.
- the MEMS device 2200 may be formed substantially the same as the MEMS device 100 described with reference to FIG. 1.
- the ASIC device 2300 may process the sensing signal of the MEMS device 2200.
- the processing device 2100 may function as a coprocessor for professionally performing sensor data processing on behalf of the application processor.
- the sensor hub 3000 may include a plurality of MEMS devices 3200 and 3400 and a plurality of ASIC devices 3300 and 3500. At least one of the plurality of MEMS devices 3200 and 3400 may be formed substantially the same as the MEMS device 100 described with reference to FIG. 1.
- the first MEMS device 3200 may be an acceleration sensor
- the second MEMS device 3400 may be a gyro sensor, but is not limited thereto.
- the plurality of ASIC devices 3300 and 3500 may process sensing signals of the corresponding MEMS devices 3200 and 3400, respectively.
- the processing device 3100 may function as a coprocessor for professionally performing sensor data processing on behalf of the application processor. Unlike shown, three or more MEMS devices and ASIC devices may be provided within the sensor hub 3000.
- FIG. 9 is a diagram schematically illustrating a user terminal including a MEMS device according to an embodiment of the present invention.
- the user terminal 200 may include a wireless communication unit 4100, an A / V input unit 4200, a user input unit 4300, a sensing unit 4400, an output unit 4500, a storage unit 4600, and the like.
- the interface unit 4700 includes a control unit 4800 and a power supply unit 4900.
- the wireless communication unit 4100 may wirelessly communicate with an external device.
- the wireless communication unit 4100 may wirelessly communicate with an external device using various wireless communication methods such as mobile communication, WiBro, Wi-Fi, Bluetooth, Zigbee, ultrasonic wave, infrared ray, and RF (Radio Frequency). Can be.
- the wireless communication unit 4100 may transmit data and / or information received from the external device to the controller 4800, and may transmit data and / or information transmitted from the controller 4800 to the external device.
- the wireless communication unit 4100 may include a mobile communication module 4110 and a short range communication module 4120.
- the wireless communication unit 4100 may include the location information module 4130 to obtain location information of the user terminal 4000.
- Location information of the user terminal 4000 may be provided from, for example, a GPS positioning system, a WiFi positioning system, a cellular positioning system, or a beacon positioning system, but is not limited thereto. Location information may be provided.
- the wireless communication unit 4100 may transfer the location information received from the positioning system to the controller 4800.
- the A / V input unit 4200 is for inputting a video or audio signal and may include a camera module 4210 and a microphone module 4220.
- the camera module 4210 may include, for example, an image sensor such as a complementary metal oxide semiconductor (CMOS) sensor, a charge coupled device (CCD) sensor, or the like.
- CMOS complementary metal oxide semiconductor
- CCD charge coupled device
- the user input unit 4300 receives various information from the user.
- the user input unit 4300 may include input means such as a key, a button, a switch, a touch pad, and a wheel.
- input means such as a key, a button, a switch, a touch pad, and a wheel.
- a touch screen may be configured.
- the sensor unit 4400 detects a state of the user terminal 4000 or a state of the user.
- the sensing unit 4400 may include sensing means such as a touch sensor, a proximity sensor, a pressure sensor, a vibration sensor, a geomagnetic sensor, a gyro sensor, an acceleration sensor, and a biometric sensor.
- the sensing unit 240 may be used for user input.
- the output unit 4500 notifies the user of various information.
- the output unit 4500 may output information in the form of text, video or audio.
- the output unit 4500 may include a display module 4510 and a speaker module 4520.
- the display module 4510 may be provided in a PDP, LCD, TFT LCD, OLED, flexible display, three-dimensional display, electronic ink display, or any form well known in the art.
- the output unit 4500 may further comprise any form of output means well known in the art.
- the storage unit 4600 stores various data and commands.
- the storage unit 4600 may store system software and various applications for the operation of the user terminal 4000.
- the storage unit 4600 may include a RAM, a ROM, an EPROM, an EEPROM, a flash memory, a hard disk, a removable disk, or any type of computer readable recording medium well known in the art.
- the interface unit 4700 serves as a path to an external device connected to the user terminal 4000.
- the interface unit 4700 receives data and / or information from an external device or receives power and transmits the data and / or information to components inside the user terminal 4000, or transmits data and / or information inside the user terminal 4000 to an external device. It can transmit power or supply internal power.
- the interface unit 4700 includes, for example, a wired / wireless headset port, a charging port, a wired / wireless data port, a memory card port, a universal serial bus (USB) port, and an identification module. Port may be connected to a connected device, an audio input / output (I / O) port, a video input / output (I / O) port, or the like.
- the controller 4800 controls other components to control the overall operation of the user terminal 4000.
- the controller 4800 may execute system software and various applications stored in the storage 4600.
- the controller 2800 may include an integrated circuit such as a microprocessor, a microcontroller, a digital signal processing core, a graphics processing core, an application processor, or the like.
- the power supply unit 4900 may include a wireless communication unit 4100, an A / V input unit 4200, a user input unit 4300, a sensor unit 4400, an output unit 4500, a storage unit 4600, an interface unit 4700, Supply power for the operation of the controller 4800.
- the power supply 4900 may include an internal battery.
- the MEMS device 100 described with reference to FIG. 1 or the sensor hubs 2000 and 3000 described with reference to FIGS. 7 to 8 may be provided in the sensor unit 4400.
- the method described in connection with an embodiment of the present invention may be implemented as a software module performed by a processor.
- the software module may reside in RAM, ROM, EPROM, EEPROM, flash memory, hard disk, removable disk, CD-ROM, or any form of computer readable recording medium well known in the art. .
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- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Manufacturing & Machinery (AREA)
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- Acoustics & Sound (AREA)
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Abstract
L'invention concerne un dispositif à microsystème électromécanique (MEMS), un boîtier MEMS le comprenant, et un terminal utilisateur. Le dispositif MEMS comprend : une partie de fixation ; une pluralité de premières masses qui sont connectées à la partie de fixation au moyen de ressorts et se font face dans une première direction ; et une pluralité d'électrodes mobiles qui sont connectées à chaque première masse au moyen de ressorts et présentent une structure en peigne, les électrodes mobiles pouvant être séparées des premières masses et se déplacer lorsque la force de Coriolis s'applique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/KR2015/010530 WO2017061638A1 (fr) | 2015-10-06 | 2015-10-06 | Dispositif mems, boîtier mems le comprenant, et terminal utilisateur |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/KR2015/010530 WO2017061638A1 (fr) | 2015-10-06 | 2015-10-06 | Dispositif mems, boîtier mems le comprenant, et terminal utilisateur |
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| Publication Number | Publication Date |
|---|---|
| WO2017061638A1 true WO2017061638A1 (fr) | 2017-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/KR2015/010530 Ceased WO2017061638A1 (fr) | 2015-10-06 | 2015-10-06 | Dispositif mems, boîtier mems le comprenant, et terminal utilisateur |
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| WO (1) | WO2017061638A1 (fr) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112744779A (zh) * | 2019-10-30 | 2021-05-04 | 台湾积体电路制造股份有限公司 | 微机电系统及其制造方法 |
| TWI736428B (zh) * | 2020-03-23 | 2021-08-11 | 台灣積體電路製造股份有限公司 | Mems結構及其形成方法 |
| CN115727840A (zh) * | 2021-08-31 | 2023-03-03 | 华为技术有限公司 | 惯性传感器和电子设备 |
| US11993512B2 (en) | 2019-10-30 | 2024-05-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dual micro-electro mechanical system and manufacturing method thereof |
| WO2025029531A1 (fr) * | 2023-07-28 | 2025-02-06 | Lawrence Semiconductor Research Laboratory, Inc. | Structure d'ancrage |
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| US20080053224A1 (en) * | 2004-03-12 | 2008-03-06 | Matsushita Electric Works, Ltd. | Gyro Sensor And Sensor Apparatus Using Same |
| US20080210005A1 (en) * | 2005-07-05 | 2008-09-04 | Thales | Micro-Machined Gyrometric Sensor For Differential Measurement of the Movement of Vibrating Masses |
| US20110030473A1 (en) * | 2009-08-04 | 2011-02-10 | Cenk Acar | Micromachined inertial sensor devices |
| KR20110134492A (ko) * | 2009-03-26 | 2011-12-14 | 센서다이내믹스 아게 | 서로 수직한 세 공간축에 대한 회전 움직임을 측정하기 위한 마이크로 자이로스코프 |
| JP2014240821A (ja) * | 2013-06-12 | 2014-12-25 | 株式会社デンソー | センサ装置 |
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| US20080053224A1 (en) * | 2004-03-12 | 2008-03-06 | Matsushita Electric Works, Ltd. | Gyro Sensor And Sensor Apparatus Using Same |
| US20080210005A1 (en) * | 2005-07-05 | 2008-09-04 | Thales | Micro-Machined Gyrometric Sensor For Differential Measurement of the Movement of Vibrating Masses |
| KR20110134492A (ko) * | 2009-03-26 | 2011-12-14 | 센서다이내믹스 아게 | 서로 수직한 세 공간축에 대한 회전 움직임을 측정하기 위한 마이크로 자이로스코프 |
| US20110030473A1 (en) * | 2009-08-04 | 2011-02-10 | Cenk Acar | Micromachined inertial sensor devices |
| JP2014240821A (ja) * | 2013-06-12 | 2014-12-25 | 株式会社デンソー | センサ装置 |
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| CN112744779A (zh) * | 2019-10-30 | 2021-05-04 | 台湾积体电路制造股份有限公司 | 微机电系统及其制造方法 |
| CN112744779B (zh) * | 2019-10-30 | 2024-02-23 | 台湾积体电路制造股份有限公司 | 微机电系统及其制造方法 |
| US11993512B2 (en) | 2019-10-30 | 2024-05-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dual micro-electro mechanical system and manufacturing method thereof |
| TWI736428B (zh) * | 2020-03-23 | 2021-08-11 | 台灣積體電路製造股份有限公司 | Mems結構及其形成方法 |
| CN115727840A (zh) * | 2021-08-31 | 2023-03-03 | 华为技术有限公司 | 惯性传感器和电子设备 |
| WO2025029531A1 (fr) * | 2023-07-28 | 2025-02-06 | Lawrence Semiconductor Research Laboratory, Inc. | Structure d'ancrage |
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