WO2015166796A1 - フラットケーブル用補強テープ及びフラットケーブル - Google Patents
フラットケーブル用補強テープ及びフラットケーブル Download PDFInfo
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- WO2015166796A1 WO2015166796A1 PCT/JP2015/061410 JP2015061410W WO2015166796A1 WO 2015166796 A1 WO2015166796 A1 WO 2015166796A1 JP 2015061410 W JP2015061410 W JP 2015061410W WO 2015166796 A1 WO2015166796 A1 WO 2015166796A1
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- reinforcing tape
- flat
- adhesive layer
- layer
- flat cable
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
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- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
- C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
- C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C09J167/025—Polyesters derived from dicarboxylic acids and dihydroxy compounds containing polyether sequences
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/302—Applications of adhesives in processes or use of adhesives in the form of films or foils for bundling cables
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Definitions
- the present invention relates to a flat cable reinforcing tape and a flat cable.
- This flat cable is manufactured by a method in which a plurality of conductors are sandwiched in parallel between two covering materials and integrated by heating or the like.
- This flat cable has a region where the conductor is exposed at the end in the longitudinal direction for connection to a connector or the like. Since the strength of this exposed region is lower than that of other regions and it is difficult to connect to a connector or the like as it is, the strength of the exposed region is compensated by adhering a reinforcing tape to one surface side. (See JP-A-6-275137 and JP-A-2008-218252).
- the present invention has been made based on the circumstances as described above, and uses a flat cable reinforcing tape and a flat cable reinforcing tape that can maintain a sufficient adhesive force for a long period of time in a high temperature and high humidity environment.
- the object is to provide a flat cable.
- the invention made in order to solve the above-mentioned problems is a flat cable reinforcing tape comprising a base material layer mainly composed of a resin and an adhesive layer laminated on one surface side of the base material layer.
- the layer contains a thermoplastic resin and a polycarbodiimide compound, and the polycarbodiimide compound has an isocyanate group.
- a flat cable comprising one or more conductors and a pair of covering materials sandwiching the one or more conductors, and at the end in the longitudinal direction,
- the flat cable reinforcing tape further includes an area where one or a plurality of conductors are exposed, and is laminated so that the adhesive layer adheres to one surface side of the exposed area.
- a reinforcing tape and a flat cable that can maintain a sufficient adhesive force for a long time in a high temperature and high humidity environment are provided.
- FIG. 3 is a schematic cross-sectional view taken along line X1-X1 of FIG.
- the present invention is a flat cable reinforcing tape comprising a base layer comprising a resin as a main component and an adhesive layer laminated on one side of the base layer, wherein the adhesive layer comprises a thermoplastic resin and a poly A carbodiimide compound is contained, and the polycarbodiimide compound has an isocyanate group.
- cross-linking or the like occurs between the polycarbodiimide compounds or between the polycarbodiimide compounds and the thermoplastic resin in the presence of water due to the isocyanate groups of the polycarbodiimide compound, and the heat resistance of the adhesive layer It is thought that the property improves. Moreover, it is thought that hydrolysis of a thermoplastic resin is suppressed when the carbodiimide group of a carbodiimide compound reacts with the water
- the content of the polycarbodiimide compound with respect to 100 parts by mass of the thermoplastic resin is preferably 0.5 parts by mass or more and 10 parts by mass or less.
- said heat resistance and a hydrolysis inhibitory effect improve more because content of a polycarbodiimide compound is the said range.
- the polycarbodiimide compound may further have an alicyclic structure.
- a steric hindrance arises in a polycarbodiimide compound etc. because a polycarbodiimide compound further has an alicyclic structure.
- the heat resistance of the adhesive layer is further improved.
- the thermoplastic resin may be a thermoplastic polyester.
- the mechanical strength of a contact bonding layer improves because the said thermoplastic resin is thermoplastic polyester.
- the processing of the adhesive layer is easy and can be manufactured at low cost.
- the main component of the base material layer is preferably polyethylene terephthalate.
- the main component of the base material layer is polyethylene terephthalate, so that the manufacturing cost can be suppressed while increasing the strength of the base material layer.
- the present invention is a flat cable including one or a plurality of conductors and a pair of covering materials sandwiching the one or a plurality of conductors, wherein the region where the one or the plurality of conductors are exposed at an end portion in the longitudinal direction. And a flat cable further comprising the flat cable reinforcing tape laminated so that the adhesive layer adheres to one surface side of the exposed region.
- the reinforcing tape is provided in the exposed area of the conductor, the reinforcing tape is stably bonded to the exposed area for a long time under a high temperature and high humidity environment.
- the flat cable has high stability in a high temperature and high humidity environment.
- the main component of the outermost layer of the covering material is preferably polyphenylene sulfide.
- the main component of the outermost layer of the covering material is polyphenylene sulfide, so that the heat resistance of the covering material is improved and it is more suitable for an environment such as a high temperature.
- the isocyanate group and carbodiimide group of the polycarbodiimide compound interact with sulfur atoms in the polyphenylene sulfide, and adhesion between the coating material and the adhesive layer is achieved. Power is improved.
- the “main component” is a component having the highest content (for example, a component containing 50% by mass or more).
- FIG. 1 is a schematic cross-sectional view showing a flat cable reinforcing tape according to an embodiment of the present invention.
- the flat cable reinforcing tape 1 in FIG. 1 is obtained by laminating an adhesive layer 3 on one surface side of a base material layer 2. For example, the reinforcing tape 1 is bonded to the end 6a of the conductor 6 in an exposed area A of a flat cable 4 (FIGS. 2 and 3) described later.
- the base material layer 2 has a resin as a main component. Moreover, the base material layer 2 may contain other components other than the said resin in the range which does not impair the effect of this invention.
- the resin may have any mechanical strength that can reinforce the exposed region. Moreover, it is preferable to have electrical insulation.
- the resin for example, Polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate; Polyamide resins such as nylon 6, nylon 66 and nylon 610; polyolefin resins such as polyethylene and polypropylene; Acrylic resins such as polycarbonate, polystyrene, polyacrylate, polymethacrylate, polymethylmethacrylate; Polyimide resins such as polyimide, polyamideimide, and polyesterimide; Examples include polyarylate, polyethersulfone, polyphenylene sulfide, polyether-etherketone, and polyethersulfide.
- the resin is preferably a polyester resin, more preferably polyethylene terephthalate, from the viewpoint of mechanical strength, processability, and cost.
- the length dimension and the width dimension of the base material layer 2 can be set as appropriate according to the application.
- the base material layer 2 may be subjected to a surface treatment in order to improve the adhesiveness with the adhesive layer 3.
- a surface treatment include corona treatment.
- a polar functional group such as a hydroxyl group or a carbonyl group is introduced on the surface of the resin film 2 to impart hydrophilicity.
- the surface treatment can also be performed by other methods such as a chemical treatment.
- a primer layer (adhesion imparting layer) may be further laminated on the surface of the base material layer 2 on which the adhesive layer 3 is laminated.
- a primer layer adhesiveness imparting layer
- the thing similar to resin illustrated in the said base material layer 2, or a urethane resin can be used, for example.
- a colored layer may be further laminated on the surface of the base material layer 2.
- This colored layer may be laminated on any surface of the base material layer 2.
- the design property of the said reinforcement tape 1 improves by further laminating
- the resin or urethane resin exemplified in the base material layer 2 can be formed by mixing a pigment, a dye or the like.
- the upper limit of the average thickness of the primer layer and the colored layer is preferably 50 ⁇ m, more preferably 30 ⁇ m.
- the lower limit of the average thickness is preferably 0.5 ⁇ m, and more preferably 1 ⁇ m. If the average thickness exceeds the upper limit, the thickness of the end portion of the flat cable or the like increases unnecessarily, and connection to a connector or the like may be difficult. On the contrary, when the average thickness is less than the lower limit, the adhesion may not be sufficiently improved or the colored layer may be easily damaged.
- the adhesive layer 3 is a layer laminated on one surface side of the base material layer 2. With this adhesive layer 3, the reinforcing tape 1 is adhered to an exposed region such as a flat cable.
- the adhesive layer 3 contains a thermoplastic resin and a polycarbodiimide compound.
- the adhesive layer 3 may contain other components as long as the effects of the present invention are not impaired.
- thermoplastic resin is not particularly limited as long as it has adhesiveness and can be mixed with a polycarbodiimide compound.
- thermoplastic resin the same thing as the said base material layer 2 is mentioned.
- a thermoplastic polyester is preferable, and a thermoplastic polyester elastomer or polyethylene terephthalate is more preferable.
- the adhesive layer 3 preferably contains these resins as main components.
- the polycarbodiimide compound has an isocyanate group and a carbodiimide group.
- Examples of such a polycarbodiimide compound include compounds in which a hydrogen atom of polycarbodiimide is substituted with an isocyanate group.
- polycarbodiimide examples include polycarbodiimide having only a chain hydrocarbon group and an isocyanate group, and polycarbodiimide having an alicyclic structure or an aromatic ring structure in addition to these groups.
- polycarbodiimide having only the chain hydrocarbon group and the isocyanate group examples include poly (1,6-hexamethylenecarbodiimide), poly (diisopropylcarbodiimide) and the like.
- polycarbodiimide further having the alicyclic structure examples include poly (4,4′-methylenebiscyclohexylcarbodiimide), poly (1,3-cyclohexylenecarbodiimide), poly (1,4-cyclohexylenecarbodiimide), and poly ( 4,4′-dicyclohexylmethanecarbodiimide) and the like.
- polycarbodiimide further having an aromatic ring structure
- the polycarbodiimide compound preferably has an alicyclic structure and more preferably has a cyclohexyl group from the viewpoint of achieving both workability and heat resistance.
- the upper limit of the isocyanate group content in the polycarbodiimide compound is preferably 5% by mass, and more preferably 3% by mass.
- 0.5 mass% is preferred and 1 mass% is more preferred.
- the content rate exceeds the said upper limit, a crosslinking reaction etc. will become excess and there exists a possibility that the workability of the contact bonding layer 3 may fall.
- the content is less than the lower limit, the adhesive force of the adhesive layer 3 under high temperature and high humidity may not be sufficiently maintained.
- the upper limit of the content of the polycarbodiimide compound in the adhesive layer 3 is preferably 10 parts by weight, more preferably 8 parts by weight, and even more preferably 7 parts by weight with respect to 100 parts by weight of the thermoplastic resin.
- a minimum of content of a polycarbodiimide compound 0.5 mass part is preferred to 100 mass parts of the above-mentioned thermoplastic resin, 1 mass part is more preferred, and 2 mass parts is still more preferred.
- adhesive layer 3 may contain include, for example, resins other than thermoplastic resins, flame retardants, flame retardant aids, pigments, antioxidants, hiding agents, lubricants, processing stabilizers, plasticizers, foaming Agents and the like.
- the flame retardant imparts flame retardancy to the adhesive layer 3.
- the flame retardant include halogen flame retardants such as chlorine flame retardant and bromine flame retardant.
- the flame retardant aid improves the flame retardancy of the adhesive layer 3 more.
- Examples of the flame retardant aid include antimony trioxide.
- the pigment is for coloring the adhesive layer 3.
- Various known pigments can be used as the pigment, and examples thereof include titanium oxide.
- the antioxidant prevents the adhesion layer 3 from being oxidized.
- Various known antioxidants can be used as the antioxidant, and examples thereof include phenolic antioxidants.
- the upper limit of the average thickness of the adhesive layer 3 is preferably 100 ⁇ m, more preferably 80 ⁇ m.
- the lower limit of the average thickness of the adhesive layer 3 is preferably 10 ⁇ m, and more preferably 30 ⁇ m. If the average thickness of the adhesive layer 3 exceeds the above upper limit, the adhesion between the conductor and the like may be reduced. On the other hand, if the average thickness of the adhesive layer 3 is less than the lower limit, the adhesiveness of the adhesive layer 3 itself may not be sufficiently secured.
- the base material layer 2 and the adhesive layer 3 are respectively extruded into a film shape, and these are laminated and laminated by heat, and the base material layer 2 and the adhesive layer 3 are co-extruded. Examples thereof include a method of directly extruding the adhesive layer 3 on the base material layer 2.
- the upper limit of the laminating temperature is preferably 130 ° C, more preferably 110 ° C.
- 60 ° C is preferred and 70 ° C is more preferred. If the lamination temperature exceeds the above upper limit, the base material layer 2 and the adhesive layer 3 may be thermally deformed. On the contrary, when the lamination temperature is less than the lower limit, the base material layer 2 and the adhesive layer 3 may not be sufficiently bonded.
- the upper limit of the laminating speed is preferably 50 m / min, more preferably 40 m / min.
- the lower limit of the lamination speed is preferably 5 m / min, and more preferably 10 m / min. If the laminating speed exceeds the above upper limit, the base material layer 2 and the adhesive layer 3 may not be sufficiently bonded. On the contrary, when the lamination speed is less than the lower limit, the productivity of the reinforcing tape 1 may be reduced.
- the reinforcing tape 1 includes a base material layer 2 and an adhesive layer 3, and the adhesive layer 3 contains a polycarbodiimide compound. Moreover, this polycarbodiimide compound has an isocyanate group and a carbodiimide group. Each of the isocyanate group and the carbodiimide group can react with water, and can bind to the thermoplastic resin of the adhesive layer 3 or the like. Therefore, deterioration of the adhesive layer 3 due to moisture in the air is reduced, and the heat resistance of the adhesive layer 3 is improved. As a result, the reinforcing tape 1 can maintain the adhesive force for a long time in a high temperature and high humidity environment.
- the covering material 5 functions as a protective film for the flat cable 4.
- the covering material 5 is used to improve wear resistance, voltage resistance, and the like.
- the covering material 5 may be a single layer or a multilayer.
- covering material 5 may contain other components, such as a flame retardant.
- Examples of the main component of the covering material 5 include resins similar to those exemplified in the base material layer 2. Among these, polyphenylene sulfide is preferable from the viewpoint of excellent heat resistance. In particular, it is preferable that the outermost layer, which is a layer bonded to the reinforcing tape 1, has polyphenylene sulfide as a main component.
- the length dimension and the width dimension of the covering material 5 may be set as appropriate according to the application. As a minimum of average thickness of coating material 5, 6 micrometers is preferred, 9 micrometers is more preferred, and 12 micrometers is still more preferred. If the average thickness is less than the lower limit, sufficient rigidity may not be ensured. On the other hand, the upper limit of the average thickness of the covering material 5 is preferably 75 ⁇ m, more preferably 50 ⁇ m, and still more preferably 40 ⁇ m. If the average thickness is larger than the upper limit, sufficient flexibility may not be ensured.
- the plurality of conductors 6 are sandwiched between a pair of covering materials 5 and arranged over the entire length of the flat cable 4 in the longitudinal direction. End portions 6 a existing in the exposed regions A of these conductors 6 are exposed without being covered with the covering material 5.
- the end 6a is a portion that connects the conductor 6 of the flat cable 4 to a connection terminal provided on a printed circuit board, an electronic component, or the like.
- These conductors 6 are made of a conductive metal such as copper, tin-plated annealed copper, or nickel-plated annealed copper.
- a foil-like conductive metal is preferable.
- the average thickness of the conductor 6 may be determined according to the amount of current to be used. For example, when the conductor 6 has a foil shape, the average thickness is set to 20 ⁇ m or more and 100 ⁇ m or less.
- the lower limit of the peel strength immediately after bonding of the adhesive layer 3 to the coating material 5 is preferably 15 N / 10 mm, more preferably 25 N / 10 mm, further preferably 40 N / 10 mm, and particularly preferably 45 N / 10 mm.
- the peel strength is a value measured according to JIS-K-6854-2 (1999) “Adhesive—Peeling Adhesive Strength Test Method—Part 2: 180 degree peeling”.
- the lower limit of the peel strength for the coating material 5 of the adhesive layer 3 after 120 hours has passed after bonding in an environment of temperature 85 ° C. and humidity 85% is preferably 7 N / 10 mm, more preferably 20 N / 10 mm, and 40 N / 10 mm. Is more preferable, and 45 N / 10 mm is particularly preferable.
- the lower limit of the peel strength for the coating material 5 of the adhesive layer 3 after 240 hours has elapsed after bonding in an environment of temperature 85 ° C. and humidity 85% is preferably 5 N / 10 mm, more preferably 20 N / 10 mm, and 40 N / 10 mm. Is more preferable, and 45 N / 10 mm is particularly preferable.
- the lower limit of the peel strength for the coating material 5 of the adhesive layer 3 after 500 hours has passed after bonding in an environment of temperature 85 ° C. and humidity 85% is preferably 5 N / 10 mm, more preferably 15 N / 10 mm, and 40 N / 10 mm. Is more preferable, and 45 N / 10 mm is particularly preferable.
- the lower limit of the peel strength with respect to the coating material 5 of the adhesive layer 3 after adhesion of 1,000 hours after bonding in an environment of temperature 85 ° C. and humidity 85% is preferably 5 N / 10 mm, more preferably 15 N / 10 mm, and 30 N / 10 mm is more preferable, and 40 N / 10 mm is particularly preferable.
- the reinforcing tape 1 may not be sufficiently adhered to the cable body 7 and may lack stability in a high-temperature and high-humidity environment.
- the flat cable 5 is manufactured by, for example, a step of forming the cable body 7 by laminating the covering material 5, the conductor 6, and the covering material 5 in this order and integrating them by pressure heating (hereinafter referred to as “cable body forming step”). And a step of bonding the reinforcing tape 1 to both ends of the cable body 7 (hereinafter also referred to as “reinforcing tape bonding step”).
- the conductor 6 is sandwiched between the pair of covering materials 5. Specifically, the conductor 6 is laminated on the surface of the covering material 5, and the covering material 5 is further laminated on the surface. As shown in FIGS. 2 and 3, the pair of covering materials 5 has a length in the longitudinal direction shorter than that of the conductor 6, and the conductor 6 is exposed at both ends. Subsequently, the pair of covering materials 5 sandwiching the conductor 6 is heated from above and below by a heating laminator or the like, whereby the pair of covering materials 5 are bonded to the conductor 6 to form the cable body 7.
- the reinforcing tape 1 is bonded to both ends of the cable body 7. Specifically, the reinforcing tape 1 is disposed on the back surface side of the cable body 7 (the lower side in FIG. 3) so as to contact both the conductor 6 and the covering material 5, and heated from the reinforcing tape side by a heater or the like. Then, the reinforcing tape 1 is bonded to the cable body 7. As this heater, a publicly known one can be used.
- the upper limit of the heating temperature is preferably 250 ° C and more preferably 220 ° C. On the other hand, as a minimum of the above-mentioned heating temperature, 100 ° C is preferred and 120 ° C is more preferred. If the heating temperature exceeds the upper limit, the reinforcing tape 1 and the cable body 7 may be thermally deformed. Conversely, when the heating temperature is less than the lower limit, the adhesion between the reinforcing tape 1 and the cable body 7 becomes insufficient, and the reinforcing tape 1 may be easily peeled off.
- the upper limit of the heating time is preferably 10 seconds, and more preferably 7 seconds.
- the lower limit of the heating time is preferably 1 second, and more preferably 2 seconds. If the heating time exceeds the upper limit, the reinforcing tape 1 and the cable body 7 may be thermally deformed. On the contrary, when the heating time is less than the lower limit, the adhesion between the reinforcing tape 1 and the cable body 7 becomes insufficient, and the reinforcing tape 1 may be easily peeled off.
- the upper limit of the pressure during the heating is preferably 0.8 MPa, more preferably 0.6 MPa.
- the lower limit of the pressure during the heating is preferably 0.01 MPa, and more preferably 0.05 MPa. If the heating pressure exceeds the upper limit, the conductor 6 may be damaged in the cable body 7. On the contrary, when the pressure at the time of the heating is less than the lower limit, the adhesion between the reinforcing tape 1 and the cable body 7 becomes insufficient, and the reinforcing tape 1 may be easily peeled off from the cable body 7.
- the flat cable 4 it has the exposed area
- the reinforcing tape 1 By adhering the reinforcing tape 1 in this manner, the end portion 6a of the conductor 6 is protected and the strength of the exposed region A is improved. Further, since the reinforcing tape 1 can maintain a sufficient adhesive force for a long time even in a high temperature and high humidity environment, the flat cable 4 can be suitably used for a passenger car or the like.
- the covering material may be a multilayer.
- the composition of these layers may be the same or different, but the innermost layer in contact with the conductor is preferably a coating adhesive layer.
- This covering adhesive layer has a role of adhering the multilayer covering material to the conductor. Examples of the material for the covering adhesive layer include the thermoplastic resins mentioned in the adhesive layer.
- the coating material is a multilayer
- stacking, etc. can be reduced.
- this laminate the same procedures and conditions as those for the laminate for bonding the base material layer and the adhesive layer can be applied.
- a conductor is laminated on a covering material, and a case where a covering material is laminated on this conductor has been described as an example, but the covering material is coextruded so as to sandwich the conductor, You may perform formation of a coating
- a copper foil or the like is adhered on one surface of the covering material, and a conductor may be formed on the covering material by etching the copper foil or the like, and masking is performed on one surface of the covering material, Thereafter, the conductor may be formed on the covering material by plating.
- the flat cable manufacturing method may further include a step of cutting the cable body into an arbitrary length after forming the cable body.
- an area where the conductor is exposed may be provided in addition to both ends of the cable body, and the cable body may be cut within the exposed area.
- covering material may be cut
- known methods can be employed as the cable body cutting method and the covering material peeling method.
- Resin compositions A2, A3, and CA1 to 4 were prepared in the same manner as the resin composition A1 except that the types and addition amounts of polycarbodiimide compounds shown in Table 1 were used.
- Stabagzol P is a polycarbodiimide compound having no isocyanate group.
- the polycarbodiimide compound is not added in resin composition CA4.
- Example 1 ⁇ Creating a reinforcing tape>
- a film having an average thickness of 188 ⁇ m made of polyethylene terephthalate (Lumirror: Toray Industries, Inc.) was subjected to corona treatment to form a base material layer.
- an adhesive layer was formed by extruding a film having an average thickness of 0.1 mm using the resin composition A1 as a material.
- the adhesive layer is laminated on the surface of the base material layer subjected to corona treatment, and the base material layer and the adhesive layer are adhered and reinforced by heating from both the base material layer side and the adhesive layer side using a heater. Created a tape.
- the heating conditions at the time of adhesion were such that the temperature on the base material layer side and the adhesive layer side was 100 ° C., and the laminating speed was 10 m / min.
- Examples 2 and 3 Comparative Examples 1 to 4
- a reinforcing tape was prepared in the same manner as in Example 1 except that a resin composition of the type shown in Table 2 was used as the adhesive layer.
- the peel strength was measured in accordance with JIS-K-6854-2 (1999) “Adhesive—Peeling adhesive strength test method—Part 2: 180 degree peeling”. Table 2 shows the measurement results and the average value of the three points.
- Table 3 shows the locations where peeling occurred in the above test.
- A indicates that the base material layer, the PPS film, and the adhesive layer did not peel, and the PPS film was broken and peeled.
- B1 indicates that the adhesive layer and the base material layer are not separated, but are separated between the adhesive layer and the PPS film.
- B2 indicates that there is no separation between the PPS film and the adhesive layer, but there is a separation between the adhesive layer and the base material layer.
- the reinforcing tapes of Examples 1 to 3 tended to have a high adhesive force immediately after bonding and a high adhesive force after 1,000 hours.
- the reinforcing tape of Example 3 is excellent in adhesive strength.
- the reinforcing tape of the comparative example tended to be inferior both in the adhesive force immediately after bonding and after 1,000 hours.
- the reinforcing tape of Example 3 in particular shows a high adhesive force with both the base material layer and the PPS film even after a long period of time.
- ⁇ Conductor adhesive strength> A nickel-plated rectangular conductor with a width of 0.3 mm and a thickness of 0.035 mm is placed on the reinforcing tape, and the pressing time is 2 seconds and the pressing pressure is 0.3 MPa by hot pressing at 215 ° C. on the reinforcing tape side and 110 ° C. on the conductor side. Glued. The 180 ° peel strength for one conductor core was determined and used as the conductor adhesive strength. In Examples 1 to 3 and Comparative Example 4, MFR measurement and conductor adhesion strength were also evaluated. These results are summarized in Table 4.
- a flat cable reinforcing tape capable of maintaining a sufficient adhesive force for a long period of time in a high temperature and high humidity environment and a flat cable using the flat cable reinforcing tape.
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
Description
本発明は、樹脂を主成分とする基材層及びこの基材層の一方の面側に積層される接着層を備えるフラットケーブル用補強テープであって、上記接着層が、熱可塑性樹脂及びポリカルボジイミド化合物を含有し、上記ポリカルボジイミド化合物がイソシアネート基を有する。
その結果、当該フラットケーブルは高温及び高湿環境下における高い安定性を有する。
以下、図面を参照しつつ本発明に係るフラットケーブル用補強テープ及びフラットケーブルを説明する。なお、本発明は、これらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等な意味及び範囲内で全ての変更が含まれることが意図される。
図1は、本発明の一実施形態に係るフラットケーブル用補強テープを示す模式的断面図である。
基材層2は、樹脂を主成分とする。また、基材層2は、本発明の効果を損なわない範囲で、上記樹脂以外のその他の成分を含んでいてもよい。
ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート等のポリエステル系樹脂;
ナイロン6、ナイロン66、ナイロン610等のポリアミド系樹脂、ポリエチレン、ポリプロピレン等のポリオレフィン系樹脂;
ポリカーボネート、ポリスチレン、ポリアクリレート、ポリメタクリレート、ポリメチルメタクリレート等のアクリル系樹脂;
ポリイミド、ポリアミドイミド、ポリエステルイミド等のポリイミド系樹脂;
ポリアリレート、ポリエーテルサルフォン、ポリフェニレンサルファイド、ポリエーテル-エーテルケトン、ポリエーテルサルファイドなどが挙げられる。
接着層3は基材層2の一方の面側に積層される層である。この接着層3により、補強テープ1はフラットケーブル等の露出領域に接着される。
上記熱可塑性樹脂は、接着性を有し、ポリカルボジイミド化合物と混合できるものであれば特に限定されない。上記熱可塑性樹脂としては、上記基材層2と同様のものが挙げられる。これらの中で、熱可塑性ポリエステルが好ましく、熱可塑性ポリエステル系エラストマー又はポリエチレンテレフタレートがより好ましい。接着層3は、これらの樹脂を主成分とすることが好ましい。
上記ポリカルボジイミド化合物はイソシアネート基及びカルボジイミド基を有する。このようなポリカルボジイミド化合物としては、例えばポリカルボジイミドの水素原子をイソシアネート基で置換した化合物等が挙げられる。
接着層3が含有してもよいその他の成分としては、例えば熱可塑性樹脂以外の樹脂、難燃剤、難燃助剤、顔料、酸化防止剤、隠蔽剤、滑剤、加工安定剤、可塑剤、発泡剤等が挙げられる。
補強テープ1の製造方法としては、例えば基材層2及び接着層3をそれぞれフィルム状に押出成形し、これらを重ねて熱によりラミネートする方法、基材層2及び接着層3を共押出する方法、基材層2の上に接着層3を直接押し出す方法等が挙げられる。
補強テープ1は、基材層2及び接着層3を備え、この接着層3がポリカルボジイミド化合物を含有する。また、このポリカルボジイミド化合物はイソシアネート基及びカルボジイミド基を有する。このイソシアネート基及びカルボジイミド基のそれぞれが水と反応でき、また接着層3の熱可塑性樹脂等と結合できる。そのため、空気中の水分による接着層3の劣化が低減され、接着層3の耐熱性が向上する。これらの結果、補強テープ1は高温高湿の環境下において長期間接着力を維持できる。
図2及び図3のフラットケーブル4は複数の導体6及びこの複数の導体6を狭持する一対の被覆材5を備える。また、フラットケーブル4は長手方向の両端部には導体6が露出した露出領域Aを有し、この露出領域Aの一方の面側に、接着層3が接着するよう積層された補強テープ1をさらに備える。なお、図2及び図3においては、図1の当該補強テープ1と同様な要素等については同一の符号を付し、以下における重複説明を省略する。
被覆材5はフラットケーブル4の保護膜として機能するものである。この被覆材5は耐摩耗性、耐電圧性などを向上させるために用いられる。被覆材5は単層であってもよく、多層であってもよい。また、被覆材5は難燃剤等のその他の成分を含有してもよい。
複数の導体6は、一対の被覆材5に狭持され、フラットケーブル4の長手方向の全長にわたって配置されている。これらの導体6の露出領域Aに存在する端部6aは、被覆材5に覆われずに露出している。端部6aは、フラットケーブル4の導体6をプリント基板、電子部品等に設けられた接続端子と接続する部分である。
フラットケーブル5の製造方法は、例えば被覆材5、導体6、及び被覆材5をこの順に積層し、加圧加熱により一体化することでケーブル本体7を形成する工程(以下、「ケーブル本体形成工程」ともいう)、及びケーブル本体7の両端部に補強テープ1を接着する工程(以下、「補強テープ接着工程」ともいう)を備える。
ケーブル本体形成工程では、まず一対の被覆材5で導体6を狭持する。具体的には、被覆材5の表面に導体6を積層し、さらにその表面に被覆材5を積層する。この一対の被覆材5は、図2及び図3に示すように長手方向の長さが導体6よりも短く、両端側で導体6が露出する。続いて、この一対の被覆材5で導体6を狭持したものを加熱ラミネータ等により上下から熱することで、一対の被覆材5が導体6に接着されケーブル本体7が形成される。
補強テープ接着工程では、ケーブル本体7の両端に補強テープ1を接着する。具体的には、ケーブル本体7の裏面側(図3の下側)において、導体6及び被覆材5の両方に接するように補強テープ1を配設し、補強テープ側からヒーター等により加熱することで補強テープ1をケーブル本体7に接着する。このヒーターとしては、公知のものを用いることができる。
フラットケーブル4によれば、長手方向の端部に導体6が露出する露出領域Aを有し、この露出領域の一方の面側に補強テープ1が接着される。このように補強テープ1が接着されることで、導体6の端部6aが保護されると共に、露出領域Aの強度が向上する。また、補強テープ1は高温及び高湿の環境下でも十分な接着力を長期間維持できるため、フラットケーブル4は乗用車等に好適に用いることができる。
今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記実施形態の構成に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内での全ての変更が含まれることが意図される。
<合成例1(樹脂組成物A1の調製)>
熱可塑性樹脂としての熱可塑性ポリエステル系エラストマー(バイロンGM400:東洋紡社)100質量部にイソシアネート基を有するポリカルボジイミド化合物としてカルボジライトLA1(日清紡ケミカル社)0.5質量部を添加し、2軸混合機を用いて均一に混合することで樹脂組成物A1を調製した。
樹脂組成物A2、A3及びCA1~CA4は、表1に示す種類及び添加量のポリカルボジイミド化合物を用いた以外は上記樹脂組成物A1と同様の操作によって調製した。ここで、スタバグゾールP(ラインケミー社)はイソシアネート基を有しないポリカルボジイミド化合物である。なお、樹脂組成物CA4ではポリカルボジイミド化合物を添加していない。
<補強テープの作成>
ポリエチレンテレフタレート(ルミラー:東レ社)を材料とする平均厚さ188μmのフィルムの片面にコロナ処理を施し、基材層を形成した。また、樹脂組成物A1を材料として平均厚さ0.1mmのフィルムを押出成形し、接着層を形成した。次いで、基材層のコロナ処理が施された面上に接着層を重ね、ヒーターを用い、基材層側及び接着層側の両面から加熱することで基材層及び接着層を接着し、補強テープを作成した。この接着時の加熱条件は、基材層側及び接着層側の温度が100℃、ラミネート速度が10m/分であった。
接着層として、表2に示す種類の樹脂組成物を用いた以外は上記実施例1と同様の操作により補強テープを作成した。
<評価用サンプルの作成>
上記補強テープを厚さ25μmのポリフェニレンサルファイド(PPS)(トレリナ:東レ社)のフィルムに重ね、ヒーターを用い補強テープ側及びPPSフィルム側の両面から加熱することで補強テープとPPSフィルムとを接着し、評価用サンプルを作成した。この接着時の加熱及び加圧条件は、補強テープ側及びPPSフィルム側の温度が215℃、加熱時間が5秒、加熱時の圧力が0.4MPaであった。
接着力は、上記評価用サンプルを温度85℃、湿度85%の環境下に置き、補強テープ接着直後、接着から120時間後、接着から240時間後、接着から500時間後、接着から1,000時間後における剥離強度を3点ずつ測定することで評価した。
合成例1と同様に操作して、熱可塑性ポリエステル系エラストマー(バイロンGM400:東洋紡社)100質量部にカルボジライトLA1(日清紡ケミカル社)を3、5、7、10及び12質量部を添加した5種類の樹脂組成物A4~A8を調製した。得られた各樹脂組成物のメルトフローレート(MFR)をJISK7210に準じて測定した。各樹脂組成物におけるカルボジライトLA1の添加量及びMFRの値を表4に示す。
実施例1と同様にして、接着層に樹脂組成物A4~A8を用いた補強テープを作成した。
実施例1と同様にして、上記補強テープとPPSフィルムとを接着し、PPSとの接着評価用サンプルを作成した。接着力は上記評価用サンプルを温度85℃、湿度85%の環境下に置き、補強テープ接着直後及び接着から1,000時間後における剥離強度を3点ずつ測定し、その平均値で評価した。
上記補強テープに、幅0.3mm、厚さ0.035mmのニッケルめっきした平角導体を載せ、補強テープ側215℃、導体側110℃の熱プレスで、プレス時間2秒、プレス圧力0.3MPaで接着した。導体1芯についての180°剥離強度を求め、導体接着力とした。なお、実施例1~3及び比較例4についてもMFRの測定と導体接着力の評価を行った。これらの結果をまとめて表4に示した。
2 基材層
3 接着層
4 フラットケーブル
5 被覆材
6 導体
6a 導体の端部
7 ケーブル本体
A 露出領域
Claims (7)
- 樹脂を主成分とする基材層及びこの基材層の一方の面側に積層される接着層を備えるフラットケーブル用補強テープであって、
上記接着層が、熱可塑性樹脂及びポリカルボジイミド化合物を含有し、
上記ポリカルボジイミド化合物がイソシアネート基を有するフラットケーブル用補強テープ。 - 上記熱可塑性樹脂100質量部に対するポリカルボジイミド化合物の含有量が、0.5質量部以上10質量部以下である請求項1に記載のフラットケーブル用補強テープ。
- 上記ポリカルボジイミド化合物が脂環構造をさらに有する請求項1又は請求項2に記載のフラットケーブル用補強テープ。
- 上記熱可塑性樹脂が熱可塑性ポリエステルである請求項1、請求項2又は請求項3のいずれかに記載のフラットケーブル用補強テープ。
- 上記基材層の主成分がポリエチレンテレフタレートである請求項1から請求項4のいずれか1項に記載のフラットケーブル用補強テープ。
- 1又は複数の導体及びこの1又は複数の導体を狭持する一対の被覆材を備えるフラットケーブルであって、
長手方向の端部に、上記1又は複数の導体が露出する領域を有し、
上記露出領域の一方の面側に上記接着層が接着するよう積層された請求項1に記載のフラットケーブル用補強テープをさらに備えるフラットケーブル。 - 上記被覆材の最外層の主成分がポリフェニレンサルファイドである請求項6に記載のフラットケーブル。
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| CN201580017173.7A CN106164202A (zh) | 2014-04-28 | 2015-04-14 | 扁平电缆用增强带及扁平电缆 |
| JP2015543173A JP6515808B2 (ja) | 2014-04-28 | 2015-04-14 | フラットケーブル |
| DE112015002031.4T DE112015002031T5 (de) | 2014-04-28 | 2015-04-14 | Verstärkungsband für Flachkabel und Flachkabel |
| US15/127,799 US20170110219A1 (en) | 2014-04-28 | 2015-04-14 | Reinforcing tape for flat cable and flat cable |
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| JP (1) | JP6515808B2 (ja) |
| CN (1) | CN106164202A (ja) |
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| JP2021068591A (ja) * | 2019-10-24 | 2021-04-30 | 東京特殊電線株式会社 | フラットケーブル |
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| CN113632180A (zh) * | 2019-03-29 | 2021-11-09 | 株式会社自动网络技术研究所 | 配线部件 |
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- 2015-04-14 DE DE112015002031.4T patent/DE112015002031T5/de not_active Ceased
- 2015-04-14 CN CN201580017173.7A patent/CN106164202A/zh active Pending
- 2015-04-14 US US15/127,799 patent/US20170110219A1/en not_active Abandoned
- 2015-04-14 JP JP2015543173A patent/JP6515808B2/ja active Active
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Also Published As
| Publication number | Publication date |
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| DE112015002031T5 (de) | 2017-03-02 |
| CN106164202A (zh) | 2016-11-23 |
| JPWO2015166796A1 (ja) | 2017-04-20 |
| US20170110219A1 (en) | 2017-04-20 |
| JP6515808B2 (ja) | 2019-05-22 |
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