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WO2015152134A1 - 樹脂組成物、接着フィルム、および半導体装置 - Google Patents

樹脂組成物、接着フィルム、および半導体装置 Download PDF

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Publication number
WO2015152134A1
WO2015152134A1 PCT/JP2015/059873 JP2015059873W WO2015152134A1 WO 2015152134 A1 WO2015152134 A1 WO 2015152134A1 JP 2015059873 W JP2015059873 W JP 2015059873W WO 2015152134 A1 WO2015152134 A1 WO 2015152134A1
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Prior art keywords
resin composition
component
adhesive film
thermal conductivity
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2015/059873
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English (en)
French (fr)
Japanese (ja)
Inventor
寛史 高杉
津与志 黒川
順 戸島
一生 青木
慎 寺木
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Namics Corp
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Namics Corp
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Application filed by Namics Corp filed Critical Namics Corp
Priority to KR1020167029585A priority Critical patent/KR102076888B1/ko
Priority to CN201580012034.5A priority patent/CN106103530B/zh
Publication of WO2015152134A1 publication Critical patent/WO2015152134A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H10W40/251—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Definitions

  • the present invention relates to a resin composition, an adhesive film, and a semiconductor device, and in particular, a resin composition and an adhesive film that are excellent in heat dissipation and capable of forming a highly reliable semiconductor device, and the resin composition and adhesive film.
  • the present invention relates to a manufactured semiconductor device.
  • the amount of heat generated from heating elements such as modules and electronic components has increased as the functionality and density of modules and electronic components have increased.
  • the heat from these heating elements is transmitted to the substrate or the like and radiated.
  • an adhesive having a high thermal conductivity is used as an adhesive between the heating element and the substrate.
  • the adhesive film of the high heat conductivity is used instead of the adhesive agent from the ease of handling.
  • the above-mentioned adhesive film requires not only thermal conductivity but also insulation, heat resistance and connection reliability (adhesion strength).
  • the thermal conductivity can be improved by using a large amount of high thermal conductivity filler in the adhesive film, but the amount of resin component in the adhesive film is relatively reduced as the filler filling amount increases. Therefore, there is a problem that it becomes difficult to obtain a desired adhesive strength.
  • the problem of the adhesive strength fall accompanying the increase in the filler filling amount is not limited to the adhesive film having a high thermal conductivity, but also occurs when, for example, the composition is filled with a filler from the viewpoint of reducing the thermal expansion coefficient.
  • An epoxy resin oriented to high thermal conductivity it has sufficient film forming properties and stretchability to be applied to processes such as film molding and coating, and has various physical properties such as thermal conductivity, heat resistance, and flexibility.
  • An epoxy resin having a biphenyl skeleton as an excellent epoxy resin (Patent Document 1), which is easy to manufacture despite the introduction of mesogenic groups, has excellent solubility in organic solvents, toughness, and thermal conductivity
  • An epoxy resin (Patent Document 2) that gives a cured product having excellent properties is disclosed.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a resin composition excellent in thermal conductivity, adhesiveness, and film moldability, particularly a resin composition excellent in thermal conductivity after curing. It is to be.
  • the present invention relates to a resin composition, an adhesive film, and a semiconductor device that have solved the above problems by having the following configuration.
  • A an aminophenol type epoxy resin
  • B at least one selected from the group consisting of a phenoxy resin and a thermoplastic elastomer
  • C a high thermal conductive inorganic filler
  • component 1 mass A resin composition, wherein the component (B) is 0.5 to 5 parts by mass with respect to parts.
  • an adhesive film that is excellent in thermal conductivity and adhesiveness, and particularly excellent in thermal conductivity after curing.
  • a highly reliable semiconductor device can be provided by a cured body of an adhesive film excellent in thermal conductivity, adhesiveness, and thermal conductivity.
  • the resin composition of the present invention comprises (A) an aminophenol type epoxy resin, (B) at least one selected from the group consisting of a phenoxy resin and a thermoplastic elastomer, and (C) a highly thermally conductive inorganic filler,
  • the component (B) is 0.5 to 5 parts by mass with respect to 1 part by mass of the component A).
  • (C) high thermal conductive inorganic filler means an inorganic filler of 5 W / m ⁇ K or more.
  • the aminophenol type epoxy resin as the component (A) in the present invention is obtained by epoxidizing various aminophenols by a known method.
  • aminophenols include 2-aminophenol, 3-aminophenol, 4-aminophenol, 2-amino-m-cresol, 2-amino-p-cresol, 3-amino-o-cresol, 4-amino Examples include aminophenols such as -m-cresol and 6-amino-m-cresol, and aminocresols, but are not limited thereto.
  • (A) component has the following chemical formula (1):
  • An aminophenol type epoxy resin represented by the formula (1) is preferable because the cured resin composition has high thermal conductivity.
  • the aminophenol type epoxy resin product name: 630
  • a component may be individual or may use 2 or more types together.
  • the phenoxy resin as the component (B) is not particularly limited, and includes a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a bisphenol acetophenone skeleton, a novolak skeleton, a biphenyl skeleton, a fluorene skeleton, a dicyclopentadiene skeleton, a norbornene skeleton, Examples thereof include those having one or more skeletons selected from naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, and trimethylcyclohexane skeleton.
  • Mitsubishi Chemical made flexible phenoxy resin Product name: YL7178, glass transition temperature: 15 degreeC
  • thermoplastic elastomer of component (B) urethane rubber, acrylic rubber, silicone rubber, vinyl alkyl ether rubber, polyvinyl alcohol rubber, polyvinyl pyrrolidone rubber, polyacrylamide rubber, cellulose rubber, natural rubber, butadiene rubber, chloroprene rubber, styrene ⁇ Butadiene rubber (SBR), acrylonitrile butadiene rubber (NBR), styrene / ethylene / butadiene / styrene rubber, styrene / isoprene / styrene rubber, styrene / isobutylene rubber, isoprene rubber, polyisobutylene rubber, butyl rubber, (meth) acrylic acid Synthetic acrylic rubber, styrene-butadiene block copolymer (SBS), styrene-ethylene / butylene-styrene block, obtained by polymerization of monomers containing al
  • thermoplastic elastomer of the component (B) As a commercial product of the thermoplastic elastomer of the component (B), there is an acrylic ester copolymer (product name: SG790, glass transition temperature: ⁇ 32 ° C.) manufactured by Nagase ChemteX. (B) A component may be individual or may use 2 or more types together.
  • the component (B) preferably has a glass transition temperature (Tg) of less than 50 ° C. in order to give the resin composition a film moldability and an appropriate flexibility to the cured resin composition. Furthermore, from the viewpoint of film moldability and adhesiveness of the resin composition, the component (B) is more preferably a phenoxy resin having a glass transition temperature (Tg) of less than 50 ° C.
  • a heat conductivity is 5 W / m * K or more
  • a general inorganic filler can be used from a viewpoint of maintaining insulation.
  • Component (C) the thermal conductivity from the viewpoint of insulating properties and thermal expansion coefficient, MgO, Al 2 O 3, AlN, BN, diamond filler, ZnO, and at least one or more selected from the group consisting of SiC Inorganic fillers are preferred. In addition, you may carry out an insulation process to ZnO and SiC as needed.
  • component (C) Commercially available products of component (C) include magnesium oxide powder (product names: SMO-5, SMO-1, SMO-02, SMO-2) manufactured by Sakai Chemical Industry, and alumina (Al 2 O 3 ) powder manufactured by Showa Denko (product name). : CBA09S), Denki Kagaku Kogyo Alumina (Al 2 O 3 ) powder (Product Name: DAW-03, ASFP-20).
  • the average particle diameter of component (C) (if it is not granular, the average maximum diameter) is not particularly limited, but is 0.05 to 50 ⁇ m to uniformly disperse component (C) in the resin composition. In addition, it is preferable. If it is less than 0.05 ⁇ m, the viscosity of the resin composition increases and the moldability may deteriorate. If it exceeds 50 ⁇ m, it may be difficult to uniformly disperse the component (C) in the resin composition.
  • the average particle diameter of the component (C) is measured by a dynamic light scattering nanotrack particle size analyzer.
  • a component may be individual or may use 2 or more types together.
  • the component (A) is preferably 1.5 to 15 parts by mass and more preferably 2 to 10 parts by mass with respect to 100 parts by mass of the resin composition (excluding the solvent).
  • the component (B) is 0.5 to 5 parts by mass with respect to 1 part by mass of the component (A) from the viewpoints of film moldability of the resin composition, thermal conductivity of the cured resin composition, and heat resistance. is there. If the component (B) is less than 0.5 part by mass relative to 1 part by mass of the component (A), the resin composition cannot be formed into a film, and if it exceeds 5 parts by mass, the cured resin composition Thermal conductivity is lowered.
  • the total of (A) and (B) is 100 parts by mass of the resin composition (excluding the solvent) from the viewpoint of film moldability, adhesiveness, and thermal conductivity of the resin composition after curing. On the other hand, it is preferably 4 to 20 parts by mass.
  • Component (C) is a resin composition (excluding the solvent) from the viewpoint of the adhesiveness of the resin composition, the insulating properties of the cured resin composition, and the coefficient of thermal expansion: 40 to 95 parts per 100 parts by mass. It is preferable that it is a mass part. (C) When a component exceeds 95 mass parts, the adhesive force of a resin composition will fall easily. On the other hand, when the component (C) is less than 40 parts by mass, the heat conductivity of the cured resin composition may be insufficient even if the thermal conductivity of the highly thermally conductive inorganic filler is high.
  • the resin composition further includes (D) a cured product.
  • the component (D) include phenolic curing agents, acid anhydride curing agents, amine curing agents, imidazole curing agents, carboxylic acid dihydrazide curing agents, phenolic curing agents, amine curing agents, and acids. It is preferable that it is at least one selected from the group consisting of an anhydride-based curing agent and an imidazole-based curing agent.
  • a phenolic curing agent is more preferable from the viewpoint of adhesiveness of the resin composition, and an acid anhydride-based curing agent is more preferable from the viewpoint of fluidity and adhesiveness of the resin composition. From the viewpoint of the storage stability of the resin composition, an imidazole curing agent is more preferable.
  • phenolic curing agent examples include phenol novolak and cresol novolak, and phenol novolak is preferable.
  • phenolic curing agents have a slower curing speed than other curing agents such as acid anhydride curing agents, amine curing agents, imidazole curing agents, etc. When the curing rate of the resin composition becomes too fast, it can be used for the purpose of delaying the curing rate of the resin composition by using a phenolic curing agent in combination.
  • Acid anhydrides include tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic acid anhydride, hydrogenated methylnadic acid anhydride, trialkyltetrahydrophthalic anhydride, Methylcyclohexene tetracarboxylic dianhydride, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, ethylene glycol bisanhydro trimellitate, glycerin bis (anhydro trimellitate) mono Acetate, dodecenyl succinic anhydride, aliphatic dibasic polyanhydride, chlorendic anhydride, methylbutenyl tetrahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, methyl
  • Examples of amine-based curing agents include chain aliphatic amines, cycloaliphatic amines, aliphatic aromatic amines, aromatic amines, and the like, and aromatic amines are preferred.
  • Examples of the carboxylic acid dihydrazide curing agent include adipic acid dihydrazide, isophthalic acid dihydrazide, sebacic acid dihydrazide, dodecanoic acid dihydrazide, and adipic acid dihydrazide is preferable.
  • a microencapsulated imidazole compound curing agent and an amine adduct type curing agent are preferable from the viewpoint of storage stability of the resin composition, and are dispersed in a liquid epoxy resin such as liquid bisphenol A type.
  • a microencapsulated imidazole compound curing agent is more preferable from the viewpoints of workability, curing speed, and storage stability of the resin composition.
  • imidazole curing agents examples include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2,4- Diamino-6- [2′-methylimidazolyl- (1 ′)] ethyl-s-triazine, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2, And 3-dihydro-1H-pyrrolo [1,2-a] benzimidazole can be mentioned, and 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)] ethyl-s-triazine, 2 , 4-Diamino-6- [2'-undecylimidazolyl- (1)]-ethyl-s-triazine, 2 4-di
  • component (D) Commercially available products of component (D) include Meiwa Kasei phenol curing agents (product names: MEH8000, MEH8005), Mitsubishi Chemical acid anhydrides (grade: YH306, YH307), Hitachi Chemical 3 or 4-methyl-hexahydroanhydride.
  • Phthalic acid (Product name: HN-5500), Nippon Kayaku amine curing agent (Product name: Kayahard AA), Nippon Finechem adipic acid dihydrazide (Product name: ADH), Asahi Kasei E-materials microencapsulated imidazole compound curing agent (Product names: HX3722, HX3742, HX3932HP, HX3941HP), Ajinomoto Fine Techno's amine adduct type curing agent (Product name: PN-40J), Shikoku Kasei Kogyo 2-ethyl-4-methylimidazole (Product name: 2E4MZ), etc.
  • (B) component is these product names The present invention is not limited.
  • a component may be individual or may use 2 or more types together.
  • the component (D) is preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the resin composition (excluding the solvent) from the viewpoint of storage stability and curability of the resin composition.
  • the resin composition contains additives such as coupling agents, tackifiers, antifoaming agents, flow regulators, film-forming aids, dispersants, and organic solvents as long as the effects of the present invention are not impaired. Can be included.
  • the organic solvent examples include aromatic solvents such as toluene and xylene, ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone.
  • the organic solvents may be used alone or in combination of two or more.
  • the amount of the organic solvent used is not particularly limited, but it is preferably used so that the solid content is 20 to 50% by mass.
  • the resin composition preferably has a viscosity range of 200 to 3000 mPa ⁇ s. The viscosity is a value measured using an E-type viscometer at a rotation speed of 10 rpm and 25 ° C.
  • a resin composition is suitable for forming an adhesive film.
  • a resin composition can be obtained by dissolving or dispersing a raw material containing the components (A) to (C) in an organic solvent.
  • a device for dissolving or dispersing these raw materials is not particularly limited, and a lykai machine, a three-roll mill, a ball mill, a planetary mixer, a bead mill, etc. equipped with a stirring and heating device can be used. . Moreover, you may use combining these apparatuses suitably.
  • the adhesive film can be obtained by applying the above resin composition to a desired support and then drying.
  • the support is not particularly limited, and examples thereof include metal foils such as copper and aluminum, organic films such as polyester resins, polyethylene resins, and polyethylene terephthalate resins.
  • the support may be release-treated with a silicone compound or the like.
  • the method for applying the resin composition to the support is not particularly limited, but the microgravure method, the slot die method, and the doctor blade method are preferable from the viewpoint of thinning and film thickness control.
  • the slot die method an adhesive film having a thickness after thermosetting of 10 to 300 ⁇ m can be obtained.
  • the drying conditions can be appropriately set according to the type and amount of the organic solvent used in the resin composition, the thickness of the coating, and the like, for example, at 50 to 120 ° C. for about 1 to 30 minutes. Can do.
  • the adhesive film thus obtained has good storage stability.
  • the adhesive film can be peeled from the support at a desired timing.
  • the adhesive film can be thermally cured at 130 to 200 ° C. for 30 to 180 minutes to adhere the adherend.
  • the cured adhesive film releases the heat from the adherend that is the heating element to the adherend side that is the heat receiving body, It plays the role of heat transfer to dissipate heat on the adherend side which is a heat receiver.
  • the cured adhesive film plays a role of relieving stress caused by a difference in thermal expansion coefficient between the adherend as a heating element and the adherend as a heat receiving body.
  • the thickness of the adhesive film is preferably 10 ⁇ m to 300 ⁇ m, more preferably 10 ⁇ m to 100 ⁇ m, and still more preferably 10 ⁇ m to 50 ⁇ m. If it is less than 10 ⁇ m, the desired insulating property may not be obtained. When it exceeds 300 ⁇ m, there is a possibility that heat dissipation of the adherend that generates heat cannot be sufficiently performed. As the thickness of the adhesive film is reduced, the distance between the adherend that is the heating element and the adherend that is the heat receiving body is shortened. Therefore, from the viewpoint of efficient heat conduction, the thinner the thickness of the adhesive film Is preferred.
  • the cured adhesive film has a thermal conductivity of 2 W / m ⁇ K or more. Moreover, when the heat conductivity of the cured adhesive film is less than 2 W / m ⁇ K, heat transfer from the heating element to the heat receiver may be insufficient.
  • the volume resistivity and thermal conductivity of the cured adhesive film can be controlled by the type and content of the component (C).
  • the peel strength of the cured adhesive film is preferably more than 5 N / cm. When the peel strength of the cured adhesive film exceeds 5 N / cm, the reliability of the semiconductor device using the cured adhesive film can be increased.
  • the cured adhesive film preferably has a volume resistivity of 1 ⁇ 10 10 ⁇ ⁇ cm or more.
  • the volume resistivity of the cured adhesive film is less than 1 ⁇ 10 10 ⁇ ⁇ cm, the insulation required for the semiconductor device may not be satisfied.
  • the semiconductor device of the present invention uses the cured body of the adhesive film described above.
  • a highly reliable semiconductor device can be provided by a cured body of an adhesive film excellent in thermal conductivity and adhesive strength.
  • a heating element such as a module or an electronic component and a heat receiving body such as a substrate are bonded with a cured product of an adhesive film, or the heat of a substrate that receives heat from the heating element, Furthermore, what adhered the heat sink etc. which receive heat with the hardened
  • Examples 1 to 12 Comparative Examples 1 to 4
  • Tables 1 and 2 After metering and blending the components (A), (B) and an appropriate amount of toluene, they are put into a reaction kettle heated to 80 ° C. and rotated at a rotation speed of 150 rpm. Under normal pressure mixing for 3 hours, a clear was prepared.
  • Component (C), component (D) and other components were added to the prepared clear and dispersed by a planetary mixer to prepare a resin composition for an adhesive film.
  • FIG. 1 the schematic diagram for demonstrating the method of scraping application
  • spacers are stacked in two rows on a PET film with a release agent so as to have an appropriate thickness, and then attached with an adhesive tape (FIG. 1 (A)).
  • An appropriate amount of the composition for an adhesive film is poured onto a PET film with a release agent (FIG. 1B).
  • a slide glass is placed on the spacer, and the adhesive film composition is scraped and applied (FIGS. 1C to 1E).
  • the obtained adhesive film was cured under the conditions of 180 ° C. ⁇ 60 minutes and 0.1 MPa using a vacuum press.
  • the cured adhesive film was cut into 10 ⁇ 10 mm to prepare a test piece for measuring thermal conductivity.
  • the thermal conductivity of the prepared test piece for measuring thermal conductivity was measured with a thermal conductivity meter (Xe flash analyzer, model number: LFA447 Nanoflash) manufactured by NETZSCH. Tables 1 and 2 show the measurement results of thermal conductivity.
  • a copper foil having one surface roughened was prepared. Copper foil was bonded to both surfaces of the adhesive film obtained in the same manner as in the evaluation of thermal conductivity with the roughened surface inside. Using a vacuum press machine, thermocompression bonding was performed under the conditions of 180 ° C. ⁇ 60 minutes and 0.1 MPa, and cured. This cured body was cut into a width of 10 mm to prepare a sample for peel strength measurement.
  • the obtained adhesive film composition is placed on a 50 ⁇ m thick PET film with a release agent so that the width is 20 cm and the film thickness after drying is 30 to 200 ⁇ m. And applied.
  • the applied adhesive film composition was dried at 80 ° C. for 20 minutes.
  • This film was wound up on a reel having a diameter of 50 mm and a width of 40 cm, and film formability was evaluated. “5” if it does not break even when folded, “4” if it breaks partially when folded, “3” if it breaks when folded, “2” if it becomes a film but easily breaks, The case where it was not possible to use it was set to “1”. Tables 1 and 2 show the film formability results.
  • Comparative Example 1 using a naphthalene type epoxy resin instead of an aminophenol type epoxy resin had a low thermal conductivity.
  • the comparative example 2 which used the naphthalene type polyfunctional epoxy resin instead of the aminophenol type epoxy resin also had low thermal conductivity.
  • the comparative example 3 which used the bisphenol A type epoxy resin instead of the aminophenol type epoxy resin also had low heat conductivity.
  • Comparative Example 4 in which the component (B) was too small relative to the component (A) the composition for an adhesive film could not be formed into a film, and the thermal conductivity and peel strength could not be measured.
  • the resin composition of the present invention is excellent in thermal conductivity, adhesiveness and film moldability, and in particular, can provide a resin composition excellent in thermal conductivity after curing.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Adhesive Tapes (AREA)
PCT/JP2015/059873 2014-03-31 2015-03-30 樹脂組成物、接着フィルム、および半導体装置 Ceased WO2015152134A1 (ja)

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KR1020167029585A KR102076888B1 (ko) 2014-03-31 2015-03-30 수지 조성물, 접착 필름, 및 반도체 장치
CN201580012034.5A CN106103530B (zh) 2014-03-31 2015-03-30 树脂组合物、粘接膜和半导体装置

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JP2014071145A JP2015193687A (ja) 2014-03-31 2014-03-31 樹脂組成物、接着フィルム、および半導体装置

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CN111876111A (zh) * 2020-07-29 2020-11-03 武汉市三选科技有限公司 一种高导热率的底部填充胶及其制备方法

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JP6934637B2 (ja) * 2017-06-08 2021-09-15 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、金属張積層板、プリント配線板、及び金属張積層板の製造方法
JP7394782B2 (ja) * 2018-11-20 2023-12-08 太陽ホールディングス株式会社 高耐電圧放熱絶縁性樹脂組成物、およびそれを用いた電子部品
JP7582200B2 (ja) 2019-09-30 2024-11-13 株式会社レゾナック 半導体用接着剤、半導体用接着剤シート、及び半導体装置の製造方法

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