WO2015068703A1 - 硬化型組成物、これを用いた硬化塗膜及びプリント配線板 - Google Patents
硬化型組成物、これを用いた硬化塗膜及びプリント配線板 Download PDFInfo
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- WO2015068703A1 WO2015068703A1 PCT/JP2014/079277 JP2014079277W WO2015068703A1 WO 2015068703 A1 WO2015068703 A1 WO 2015068703A1 JP 2014079277 W JP2014079277 W JP 2014079277W WO 2015068703 A1 WO2015068703 A1 WO 2015068703A1
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- carboxyl group
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/14—Esterification
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
- C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09D201/06—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
- C09D201/08—Carboxyl groups
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
- C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
Definitions
- the present invention is a curable composition, particularly an ultraviolet curable composition used in an ink jet system, a coating film for printed wiring boards of at least any one of a resist and a marking using the composition, and a coating composition obtained using the same.
- the present invention relates to a printed wiring board having a pattern.
- Patent Document 1 As a method of forming an etching resist, a solder resist, symbol marking, etc. on a printed wiring board, a method is known in which an ink made of a curable composition is used and the ink is cured by irradiation with active energy rays (Patent Document 1, 2).
- JP 2013-135192 A JP-A-63-252498
- Various printed wiring board curable compositions such as resist ink and marking ink formed on printed wiring boards have high adhesion on plastic substrates and conductor layers while maintaining various properties such as solder heat resistance. Hardness is required.
- a curable composition that is cured by irradiation with active energy rays as described above particularly in a printed wiring board composition that is suitable for a method of curing ink immediately after printing, adhesion on a plastic substrate and a conductor layer. It has been difficult to achieve both high performance and high hardness.
- the present invention has been made to solve the above-described problems of the prior art, and its main purpose is to maintain adhesive properties on plastic substrates and conductor layers while maintaining various properties such as solder heat resistance. Another object is to provide a curable composition that achieves both high hardness and low hardness.
- Another object of the present invention is to achieve both high adhesion and adhesion on a plastic substrate and a conductor layer while maintaining various properties such as solder heat resistance formed using such a curable composition.
- An object of the present invention is to provide a printed wiring board having a pattern cured coating film.
- the object of the present invention includes a photobase generator, a (meth) acrylate compound having an epoxy group or a (meth) acrylate compound having a carboxyl group, a photopolymerization initiator, and a thermosetting component. It was found to be achieved by the curable composition
- the curable composition of the present invention comprises (A) a photobase generator, (B-1) a (meth) acrylate compound having an epoxy group, (C) a photopolymerization initiator, (D-1) And a thermosetting component (excluding (B-1) an epoxy group-containing (meth) acrylate compound).
- the curable composition of the present invention comprises (A-1) a photobase generator having a function as a photopolymerization initiator, (B-1) a (meth) acrylate compound having an epoxy group, (D- 1) a thermosetting component (excluding (B-1) an epoxy group-containing (meth) acrylate compound).
- the (D-1) thermosetting component (excluding the (B-1) (meth) acrylate compound having an epoxy group) has at least two functional groups capable of reacting with the epoxy group.
- a compound is preferred.
- the compound having at least two functional groups capable of reacting with the epoxy group is preferably at least one of a carboxyl group-containing compound and an acid anhydride.
- the curable composition of the present invention further contains a bifunctional (meth) acrylate compound (excluding those having an epoxy group).
- the bifunctional (meth) acrylate compound (excluding those having an epoxy group) has a viscosity at 25 ° C. of 5 to 50 mPa ⁇ s.
- the curable composition of the present invention comprises (A) a photobase generator, (B-2) a (meth) acrylate compound having a carboxyl group, (C) a photopolymerization initiator, (D-2) And a thermosetting component (excluding (B-2) a carboxyl group-containing (meth) acrylate compound). Furthermore, the curable composition of the present invention comprises (A-1) a photobase generator having a function as a photopolymerization initiator, (B-2) a (meth) acrylate compound having a carboxyl group, and (D -2) a thermosetting component (excluding (B-2) a carboxyl group-containing (meth) acrylate compound).
- the (D-2) thermosetting component (excluding the (B-2) carboxyl group-containing (meth) acrylate compound) has at least two functional groups capable of reacting with the carboxyl group.
- a compound is preferred.
- the compound having at least two functional groups capable of reacting with the carboxyl group is preferably an epoxy compound.
- the epoxy compound preferably has crystallinity.
- the curable composition of the present invention preferably further contains a bifunctional (meth) acrylate compound (excluding those having a carboxyl group).
- the bifunctional (meth) acrylate compound excluding those having a carboxyl group
- the bifunctional (meth) acrylate compound preferably has a viscosity at 25 ° C. of 5 to 50 mPa ⁇ s.
- the curable composition of the present invention preferably has a viscosity at 50 ° C. of 5 to 50 mPa ⁇ s.
- the cured coating film of the present invention is obtained by irradiating light to the above curable composition.
- the printed wiring board of the present invention is characterized by having a pattern cured coating film obtained by printing the curable composition on a substrate and irradiating it with light.
- the printed wiring board of the present invention is characterized by having a pattern cured coating film obtained by printing the above-mentioned curable composition on a substrate by an ink jet printing method and irradiating it with light.
- the substrate is preferably a plastic substrate.
- a curable composition that achieves both high adhesion and adhesion on a plastic substrate and a conductor layer while maintaining various properties such as solder heat resistance.
- a pattern cured coating film that is formed using such a curable composition and that maintains various properties such as solder heat resistance, and that has both high adhesion and adhesion on a plastic substrate and a conductor layer. It becomes possible to provide the printed wiring board which has.
- the curable composition according to the first embodiment of the present invention comprises (A) a photobase generator (component A) and (B-1) a (meth) acrylate compound having an epoxy group (component B-1). And (C) a photopolymerization initiator (component C) and (D-1) a thermosetting component (excluding (B-1) an (meth) acrylate compound having an epoxy group).
- the curable composition according to the second embodiment of the present invention includes (A-1) a photobase generator having a function as a photopolymerization initiator, and (B-1) an epoxy group (meta ) Acrylate compound, and (D-1) a thermosetting component (excluding (B-1) (meth) acrylate compound having an epoxy group).
- This is a composition containing, as component (A), (A-1) a photobase generator having a function as a photopolymerization initiator.
- (C) a photopolymerization initiator may be contained. It does not have to be included.
- the curable composition according to the third embodiment of the present invention comprises (A) a photobase generator (component A) and (B-2) a (meth) acrylate compound having a carboxyl group (component B- 2), (C) a photopolymerization initiator (component C), and (D-2) a thermosetting component (excluding (B-2) a (meth) acrylate compound having a carboxyl group).
- the curable composition according to the fourth embodiment of the present invention has (A-1) a photobase generator having a function as a photopolymerization initiator, and (B-2) a carboxyl group ( A (meth) acrylate compound, and (D-2) a thermosetting component (excluding (B-2) a (meth) acrylate compound having a carboxyl group).
- This is a composition containing, as component (A), a photobase generator having a function as a photopolymerization initiator (A-1) as described above.
- (C) a photopolymerization initiator is contained. It may or may not be included.
- (meth) acrylate is a term generically referring to acrylate, methacrylate and a mixture thereof, and the same applies to other similar expressions.
- the photobase generator has a molecular structure that changes upon irradiation with light such as ultraviolet rays or visible light, One that can function as a catalyst for the addition reaction between (B-1) an epoxy group-containing (meth) acrylate compound or (B-2) a carboxyl group-containing (meth) acrylate compound and a thermosetting component by cleavage It is a compound that produces the above basic substances.
- the basic substance to be generated include secondary amines and tertiary amines.
- photobase generators include ⁇ -aminoacetophenone compounds, oxime ester compounds, acyloxyimino groups, N-formylated aromatic amino groups, N-acylated aromatic amino groups, nitrobenzyl carbamate groups, and alkoxyoxybenzyl carbamates. And compounds having a substituent such as a group. Of these, oxime ester compounds and ⁇ -aminoacetophenone compounds are preferred. As the ⁇ -aminoacetophenone compound, those having two or more nitrogen atoms are particularly preferable.
- WPBG-018 (trade name: 9-anthrylmethyl N, N'-diethylcarbamate Wako Pure Chemicals)
- WPBG-027 (trade name: (E) -1- [3- (2-hydroxyphenyl) ) -2-propenoyl] piperidine
- WPBG-082 (trade name: guanidinium2- (3-benzoylphenyl) propionate
- WPBG-140 trade name: 1- (anthraquinon-2-yl) ethyl imidazolecarboxylate) You can also.
- the ⁇ -aminoacetophenone compound has a benzoin ether bond in the molecule, and when irradiated with light, cleavage occurs in the molecule to produce a basic substance (amine) that exhibits a curing catalytic action.
- ⁇ -aminoacetophenone compounds include (4-morpholinobenzoyl) -1-benzyl-1-dimethylaminopropane (Irgacure 369, trade name, manufactured by BASF Japan Ltd.) and 4- (methylthiobenzoyl) -1-methyl.
- -1-morpholinoethane (Irgacure 907, trade name, manufactured by BASF Japan Ltd.), 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl]-
- a commercially available compound such as 1-butanone (Irgacure 379, trade name, manufactured by BASF Japan Ltd.) or a solution thereof can be used.
- any compound that generates a basic substance by light irradiation can be used.
- examples of such oxime ester compounds include CGI-325, Irgacure OXE01, Irgacure OXE02 manufactured by BASF Japan, N-1919, and NCI-831 manufactured by Adeka.
- numerator described in the patent 4344400 gazette can also be used suitably.
- Such (A) photobase generator acts as a photopolymerization initiator by irradiation with ultraviolet rays or visible light, that is, (A-1) photobase generation having a function as a photopolymerization initiator.
- An agent is preferable because the amount of the (C) photopolymerization initiator used can be suppressed.
- (A-1) is used as component (A)
- the photobase generator also acts as a photopolymerization initiator, it is possible to cure the composition more effectively by selecting a photobase generator having a different absorption wavelength from that of the photopolymerization initiator. You can increase the sex.
- Such (A) photobase generators may be used alone or in combination of two or more.
- the blending amount of the photobase generator in the curable composition is preferably 0.1 to 40 parts by mass, more preferably 0.1 to 35 parts by mass with respect to 100 parts by mass of the thermosetting component.
- the blending amount of the photobase generator is 0.1 parts by mass or less, the adhesion on the conductor layer and the pencil hardness are unfavorable.
- the expected effect becomes saturated, so it is not economical, it does not dissolve completely in the composition, the composition becomes non-uniform, and the properties deteriorate It is because there is a possibility of making it.
- (B-1) (Meth) acrylate Compound Having Epoxy Group In the curable composition according to the first or second embodiment of the present invention, (B-1) the (meth) acrylate compound having an epoxy group uses a low molecular weight material such as a monomer or an oligomer, Specifically, a material having a molecular weight in the range of 100 to 1000, preferably a molecular weight in the range of 110 to 700 is used.
- the (meth) acrylate compound having an epoxy group is a compound obtained by partially adding (meth) acrylic acid to a compound having a cyclic ether. Specific examples thereof include glycidyl acrylate and glycidyl. Methacrylate, 4-hydroxybutyl acrylate glycidyl ether (trade name: 4HBAGE), bisphenol A monoglycidyl ether monoacrylate (trade name: NK ester EA-1010N), 3,4-epoxycyclohexylmethyl methacrylate (trade name: Cyclomer M100 ) And the like.
- the (meth) acrylate compound having an epoxy group can be used singly or in combination.
- a monofunctional (meth) acrylate compound is preferably used because of easy viscosity adjustment.
- the amount of the (meth) acrylate compound having an epoxy group is preferably 5 to 50 parts by mass, more preferably 10 to 30 parts by mass in 100 parts by mass of the curable composition of the present invention.
- the compounding quantity of the (meth) acrylate which has an epoxy group is 5 mass parts or more, the adhesiveness which is the characteristics of the composition of this invention becomes more favorable.
- the blending amount is 50 parts by mass or less, an increase in the viscosity of the ink can be suppressed, and good printability can be obtained.
- (B-2) (Meth) acrylate compound having carboxyl group uses a low molecular weight material such as a monomer or an oligomer, Specifically, a material having a molecular weight in the range of 100 to 1000, preferably a molecular weight in the range of 110 to 700 is used.
- (B-2) Specific examples of the (meth) acrylate compound having a carboxyl group include 2-acryloyloxyethyl succinate (trade name: NK ester A-SA), 2-methacryloyloxyethyl phthalate (trade name) : NK ester CB-1), 2-methacryloyloxyethyl succinate (trade name: NK ester SA), ⁇ -carboxy-polycaprolactone monoacrylate (CH 2 ⁇ CHCOO— (C 5 H 10 COO) n—H, n ⁇ 2, trade name: Aronix M-5300), monohydroxyethyl acrylate phthalate (trade name: Aronix M-5400) and the like.
- Commercially available products include NK ester A-SA (trade name manufactured by Shin-Nakamura Chemical Co., Ltd.).
- the (meth) acrylate compound having a carboxyl group can be used alone or in combination.
- a monofunctional (meth) acrylate compound is preferably used because of easy viscosity adjustment.
- the amount of the (meth) acrylate compound having a carboxyl group is preferably 5 to 50 parts by mass, more preferably 10 to 30 parts by mass in 100 parts by mass of the curable composition of the present invention.
- the blending amount of the (meth) acrylate having a carboxyl group is 5 parts by mass or more, the adhesiveness that is a feature of the composition of the present invention becomes better.
- the amount is 50 parts by mass or less, an increase in the viscosity of the ink can be suppressed and good printability can be obtained.
- the curable compositions according to the first to fourth embodiments of the present invention include such a component (A), a component (B-1) or a component (B-2), and (D-1) described later. )
- Component or combination of components (D-2) has excellent adhesion to both plastic substrates and conductor circuit metals.
- resist inks for printed wiring boards etching resist ink, solder resist ink, plating
- As a resist ink it exhibits excellent substrate protection performance.
- even if it is a low exposure amount it exhibits excellent cured film properties such as solder heat resistance.
- (C) Photopolymerization initiator In the curable compositions according to the first to fourth embodiments of the present invention, (C) the photopolymerization initiator is not particularly limited, and for example, a photoradical polymerization initiator can be used.
- a photoradical polymerization initiator can be used.
- this radical photopolymerization initiator any compound can be used as long as it generates radicals by light, laser, electron beam or the like and can initiate radical polymerization reaction.
- Examples of the photopolymerization initiator include benzoin and benzoin alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; 2-hydroxy-2-methyl-1-phenyl-propane-1- Alkylphenones such as ON; acetophenones such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone; 2-methyl-1- [4 Amino such as-(methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, N, N-dimethylaminoacetophenone Acetophenones; 2-methyl Anthraquinones such as nthraquinone, 2-ethylanth
- Ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; 2,4,5-triarylimidazole dimer; Riboflavin tetrabutyrate; 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole Thiol compounds such as 2,4,6-tris-s-triazine, 2,2,2-tribromoethanol, tribromomethylphenylsulfone and the like organic halogen compounds; , Benzophenones such as 4,4'-bisdiethylaminobenzophenone or xanthones; acylphosphine such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide Finoxides; bis (cyclopentadienyl) -di-phenyl-titanium, bis
- photopolymerization initiators can be used alone or as a mixture of two or more thereof, and further, N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, pentyl-4- Photoinitiator aids such as tertiary amines such as dimethylaminobenzoate, triethylamine, triethanolamine can be added.
- Examples of commercially available photopolymerization initiators include Irgacure 261, 184, 369, 651, 500, 819, 907, 784, 2959, Darocur 1116, 1173, CGI 1700, CGI 1750, CGI 1850, CG-24-61, Lucyrin TPO, CGI-784 (above, product name manufactured by BASF Japan), DAICATII (product name manufactured by Daicel Chemical Industries), UVAC1591 (product name manufactured by Daicel UCB), Rhodesil Photoinitiator 2074 (Rhodia) Product name), Ubekrill P36 (product name made by UCB), Ezacure KIP150, KIP65LT, KIP100F, KT37, KT55, KTO46, KIP75 / B, ONE (product name made by Fratelli Lamberti), etc. It is.
- the blending ratio of the photopolymerization initiator is preferably in the range of 0.5 to 10 parts by mass in 100 parts by mass of the curable composition of the present invention.
- thermosetting component (D-1) a thermosetting component (excluding (B-1) an epoxy group-containing (meth) acrylate compound) is added to the curable composition according to the first or second embodiment of the present invention. It can be expected that adhesion and heat resistance will be improved.
- the curable composition according to the third or fourth embodiment of the present invention includes (D-2) a thermosetting component (excluding (B-2) a carboxyl group-containing (meth) acrylate compound). Addition can be expected to improve adhesion and heat resistance.
- thermosetting components used in the present invention include amino resins such as melamine resins, benzoguanamine resins, melamine derivatives, and benzoguanamine derivatives, blocked isocyanate compounds, cyclocarbonate compounds, thermosetting components having a cyclic (thio) ether group, bismaleimide, Known thermosetting resins such as carbodiimide resins can be used.
- (D-1) a compound having at least two functional groups capable of reacting with an epoxy group as a thermosetting component is preferable because adhesion and heat resistance are further improved.
- the functional group that can react with the epoxy group include a carboxyl group, an amino group, a hydroxyl group, and a thiol group.
- thermosetting component particularly preferred as the thermosetting component are carboxyl group-containing compounds and carboxylic acid anhydrides.
- carboxyl group-containing compounds and carboxylic acid anhydrides are carboxyl group-containing compounds and carboxylic acid anhydrides.
- Known polyvalent carboxylic acid compounds and carboxylic acid-containing resins can be used as the carboxyl group-containing compound. Specifically, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, fumaric acid, maleic acid, phthalic acid, isophthalic acid, terephthalic acid, 4-cyclohexene-1,2-dicarboxylic acid, trimellitic acid, 1
- Unsaturated carboxylic acids such as 1,2,3,4-butanetetracarboxylic acid and (meth) acrylic acid, and styrene, ⁇ -methylstyrene, lower alkyl (meth) acrylates having 1 to 5 carbon atoms, isobutylene, etc
- Carboxylic acid resins aliphatic diisocyanates, branched aliphatic diisocyanates, alicyclic diisocyanates, aromatic diisocyanates and other diisocyanates obtained by copolymerization with saturated group-containing compounds, and carboxyl groups such as dimethylolpropionic acid and dimethylolbutanoic acid Containing dialcohol compound, polycarbonate polyol, polyether polyol Polyester polyol, polyolefin polyol, acrylic polyol, bisphenol A alkylene oxide adduct diol, carboxyl group-containing urethane resin by polyaddition reaction of diol compounds such as compounds having phenolic hydroxyl group and alcoholic hydroxyl group, aliphatic Diisocyanate compounds such as diisocyanates, branched aliphatic diisocyanates, alicyclic diisocyanates, aromatic diisocyanates, and polycarbonate polyols, polyether polyols, polyester poly
- the compound which protected the carboxyl group of these carboxyl group containing compounds with vinyl ether from the effect which suppresses the raise of the viscosity in the long-term storage of a composition is also preferable.
- the carboxylic acid anhydride include 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4′-diphenylsulfonetetracarboxylic dianhydride, ethylene Glycol bisanhydro trimellitate, glycerin bis anhydro trimellitate monoacetate, tetrapropenyl succinic anhydride, octenyl succinic anhydride, 2,5-diketotetrahydrofuran, 1,3,3a, 4,5,9b-hexahydro -5 (tetrahydro-2,5-dioxo-3-furanyl) naphtho [1,2-c] furan-1,3-dione, 1,2,3,4
- a compound having at least two functional groups capable of reacting with a carboxyl group as the thermosetting component (D-2) is preferred because adhesion and heat resistance are further improved.
- the functional group capable of reacting with a carboxyl group include a (thio) ether group, an isocyanate group, a hydroxyl group, an amino group, a thiol group, and an oxazoline group.
- Particularly preferred is an epoxy compound because of its high reactivity with the carboxyl group and high adhesion.
- thermosetting component having a plurality of cyclic (thio) ether groups in the molecule is a compound having any one of the three, four or five-membered cyclic (thio) ether groups in the molecule or a plurality of two types of groups.
- a compound having a plurality of epoxy groups in the molecule that is, a polyfunctional epoxy compound, a compound having a plurality of oxetanyl groups in the molecule, that is, a polyfunctional oxetane compound, a compound having a plurality of thioether groups in the molecule, That is, episulfide resin etc. are mentioned.
- polyfunctional epoxy compound examples include epoxidized vegetable oils such as Adekasizer O-130P, Adekasizer O-180A, Adekasizer D-32, and Adekasizer D-55 manufactured by ADEKA; jER828, jER834 manufactured by Mitsubishi Chemical Corporation; jER1001, jER1004, EHPE3150 manufactured by Daicel Chemical Industries, Epicron 840, Epicron 850, Epicron 1050, Epicron 1050, Epitolon 2055, Epototo YD-011, YD-013, YD-127, YD-128 manufactured by Tohto Kasei Co., Ltd. D. Chemicals manufactured by Dow Chemical Company. E. R. 317, D.E. E. R.
- Brominated epoxy resins such as 714 (both trade names); jER152 and jER154 manufactured by Mitsubishi Chemical Corporation, and D.C. E. N. 431, D.D. E. N. 438, Epicron N-730, Epicron N-770, Epicron N-865 manufactured by DIC, Epototo YDCN-701, YDCN-704 manufactured by Tohto Kasei Co., Ltd. EPPN-201, EOCN-1025, EOCN manufactured by Nippon Kayaku Co., Ltd. -1020, EOCN-104S, RE-306, Sumitomo Epoxy ESCN-195X, ESCN-220, manufactured by Sumitomo Chemical Co., Ltd. E. R.
- Novolak type epoxy resins such as ECN-235 and ECN-299 (both trade names); biphenol novolak type epoxy resins such as NC-3000 and NC-3100 manufactured by Nippon Kayaku; Epicron 830 manufactured by DIC, Mitsubishi Chemical JER807 manufactured by Toto Kasei Co., Ltd. Etototo YDF-170, YDF-175, YDF-2004, etc. (all trade names) bisphenol F type epoxy resin; Toto Kasei Co., Ltd.
- Epototo ST-2004, ST-2007, ST- Hydrogenated bisphenol A type epoxy resin such as 3000 (trade name); jER604 manufactured by Mitsubishi Chemical Co., Ltd., Epotot YH-434 manufactured by Tohto Kasei Co., Ltd., Sumi-epoxy ELM-120 manufactured by Sumitomo Chemical Co., Ltd. ) Glycidylamine type epoxy resin; hydantoin type epoxy resin; Alicyclic epoxy resins GMBH made CELLOXIDE 2021, etc. (all trade names); manufactured by Mitsubishi Chemical Corporation YL-933, Dow Chemical Co. of T. E. N. , EPPN-501, EPPN-502, etc.
- novolak-type epoxy resins novolak-type epoxy resins, bixylenol-type epoxy resins, biphenol-type epoxy resins, biphenol novolac-type epoxy resins, naphthalene-type epoxy resins or mixtures thereof are particularly preferable.
- a glycidyl methacrylate copolymer epoxy resin such as CP-50S or CP-50M manufactured by NOF Corporation is also available.
- a copolymer epoxy resin of cyclohexylmaleimide and glycidyl methacrylate an epoxy compound having crystallinity is preferable since the high reactivity and the high adhesiveness become more remarkable. Examples of commercially available epoxy compounds having crystallinity include YX-4000 (manufactured by Mitsubishi Chemical Corporation).
- polyfunctional oxetane compound examples include bis [(3-methyl-3-oxetanylmethoxy) methyl] ether, bis [(3-ethyl-3-oxetanylmethoxy) methyl] ether, 1,4-bis [(3- Methyl-3-oxetanylmethoxy) methyl] benzene, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, (3-methyl-3-oxetanyl) methyl acrylate, (3-ethyl-3- In addition to polyfunctional oxetanes such as oxetanyl) methyl acrylate, (3-methyl-3-oxetanyl) methyl methacrylate, (3-ethyl-3-oxetanyl) methyl methacrylate and oligomers or copolymers thereof, oxetane alcohol and novolak resin , Poly (p-hydroxy
- Examples of the compound having a plurality of cyclic thioether groups in the molecule include bisphenol A type episulfide resin YL7000 manufactured by Mitsubishi Chemical Corporation. Moreover, episulfide resin etc. which replaced the oxygen atom of the epoxy group of the novolak-type epoxy resin with the sulfur atom using the same synthesis method can be used.
- amino resins such as melamine derivatives and benzoguanamine derivatives
- amino resins include methylol melamine compounds, methylol benzoguanamine compounds, methylol glycoluril compounds, and methylol urea compounds.
- the alkoxymethylated melamine compound, the alkoxymethylated benzoguanamine compound, the alkoxymethylated glycoluril compound and the alkoxymethylated urea compound have the methylol group of the respective methylolmelamine compound, methylolbenzoguanamine compound, methylolglycoluril compound and methylolurea compound. Obtained by conversion to an alkoxymethyl group.
- the type of the alkoxymethyl group is not particularly limited and can be, for example, a methoxymethyl group, an ethoxymethyl group, a propoxymethyl group, a butoxymethyl group, or the like.
- a melamine derivative having a formalin concentration which is friendly to the human body and the environment is preferably 0.2% or less.
- thermosetting component examples include Cymel 300, 301, 303, 370, 325, 327, 701, 266, 267, 238, 1141, 272, 202, 1156. 1158, 1123, 1170, 1174, UFR65, 300 (all manufactured by Mitsui Cyanamid), Nicalak Mx-750, Mx-032, Mx-270, Mx-280, Mx- 290, Mx-706, Mx-708, Mx-40, Mx-31, Ms-11, Mw-30, Mw-30HM, Mw-390, Mw-100LM, Mw- 750LM (all manufactured by Sanwa Chemical Co., Ltd.).
- Such a thermosetting component may be used individually by 1 type, and may be used in combination of 2 or more type.
- An isocyanate compound and a blocked isocyanate compound are compounds having a plurality of isocyanate groups or blocked isocyanate groups in one molecule.
- Examples of such a compound having a plurality of isocyanate groups or blocked isocyanate groups in one molecule include polyisocyanate compounds or blocked isocyanate compounds.
- the blocked isocyanate group is a group in which the isocyanate group is protected by the reaction with the blocking agent and temporarily inactivated, and the blocking agent is dissociated when heated to a predetermined temperature. Produces. It was confirmed that the curability and the toughness of the resulting cured product are improved by adding the polyisocyanate compound or the blocked isocyanate compound.
- polyisocyanate compound for example, aromatic polyisocyanate, aliphatic polyisocyanate or alicyclic polyisocyanate is used.
- aromatic polyisocyanate include, for example, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, o-xylylene diisocyanate, and m-xylylene diisocyanate and 2,4-tolylene dimer.
- aliphatic polyisocyanate examples include tetramethylene diisocyanate, hexamethylene diisocyanate, methylene diisocyanate, trimethylhexamethylene diisocyanate, 4,4-methylenebis (cyclohexyl isocyanate), and isophorone diisocyanate.
- alicyclic polyisocyanate examples include bicycloheptane triisocyanate.
- adducts, burettes and isocyanurates of the above-mentioned isocyanate compounds can be used.
- the blocked isocyanate compound an addition reaction product of an isocyanate compound and an isocyanate blocking agent is used.
- an isocyanate compound which can react with a blocking agent the above-mentioned polyisocyanate compound etc. are mentioned, for example.
- isocyanate blocking agent examples include phenolic blocking agents such as phenol, cresol, xylenol, chlorophenol and ethylphenol; lactam blocking agents such as ⁇ -caprolactam, ⁇ -palerolactam, ⁇ -butyrolactam and ⁇ -propiolactam; Active methylene blocking agents such as ethyl acetoacetate and acetylacetone; methanol, ethanol, propanol, butanol, amyl alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, propylene glycol monomethyl ether, benzyl Ether, methyl glycolate, butyl glycolate, diacetone alcohol, Alcohol blocking agents such as methyl acid and ethyl lactate; oxime blocking agents such as formaldehyde oxime, acetaldoxime, acetoxime, methyl e
- the blocked isocyanate compound may be commercially available, for example, Sumidur BL-3175, BL-4165, BL-1100, BL-1265, Death Module TPLS-2957, TPLS-2062, TPLS-2078, TPLS-2117.
- thermosetting component is preferably 1 to 30 parts by mass in 100 parts by mass of the curable composition of the present invention.
- the blending amount is 1 part by mass or more, sufficient toughness and heat resistance of the coating film can be obtained. On the other hand, if it is 30 mass parts or less, it can suppress that storage stability falls.
- the curable composition according to the first or second embodiment of the present invention preferably further contains a bifunctional (meth) acrylate compound (excluding those having an epoxy group).
- the curable composition according to the third or fourth embodiment of the present invention preferably further contains a bifunctional (meth) acrylate compound (excluding those having a carboxyl group).
- bifunctional (meth) acrylate excluding those having an epoxy group
- bifunctional (meth) acrylate excluding those having a carboxyl group
- 1,4-butanediol diacrylate 1,6- Diacrylates of diols such as hexanediol diacrylate, 1,9-nonanediol diacrylate, 1,10-decanediol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, Polyethylene glycol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, polypropylene glycol diacrylate, neopentyl glycol diacrylate Diol of diol obtained by adding at least one of ethylene oxide and propylene oxide to benzoate, neopentyl glycol, diacrylate of glycol such as caprolactone-modified hydroxypivalate n
- diacrylates of diols having an alkyl chain having 4 to 12 carbon atoms particularly 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,9- Nonanediol diacrylate and 1,10-decanediol diacrylate are preferred.
- the blending amount of these bifunctional acrylate compounds is preferably 20 to 80 parts by mass, more preferably 40 to 70 parts by mass in 100 parts by mass of the curable composition of the present invention.
- the blending amount of the bifunctional (meth) acrylate is 20 parts by mass or more, the ink compatibility is good.
- the blending amount is 80 parts by mass or less, the ink adhesion is good.
- the viscosity of the bifunctional (meth) acrylate compound at 25 ° C. is preferably 5 to 50 mPa ⁇ s, particularly 5 to 30 mPa ⁇ s. In this viscosity range, the handleability as a diluent of a bifunctional (meth) acrylate compound becomes good, and each component can be mixed uniformly. As a result, it can be expected that the entire surface of the coating film adheres uniformly to the substrate.
- a surface tension adjuster for adjusting film physical properties as necessary.
- Acrylic resins rubber resins, waxes, phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, crystal violet, titanium oxide, carbon black, naphthalene black, etc.
- a known and commonly used additive such as an adhesion-imparting agent such as imidazole, thiazole, triazole or silane coupling agent. Can do.
- a resin can be blended with the curable composition of the present invention within a range that does not impair the characteristics.
- skeleton is preferable.
- the polyene skeleton is preferably formed by polymerization using, for example, polybutadiene or isoprene, or both of them, in particular, the general formula (I), (In the formula, n represents 10 to 300.) It is preferable that it is comprised from the repeating unit represented by these. Due to the olefinic double bond of such repeating units, flexibility is imparted to the curable resist composition, followability to the substrate is increased, and good adhesion is obtained.
- the repeating unit represented by the general formula (I) is preferably 50% or more, and more preferably 80% or more.
- polyene skeleton of the (meth) acrylate compound has the following general formula (II), The unit represented by may be included.
- liquid polybutadiene urethane (meth) acrylate obtained by subjecting 2-hydroxyethyl (meth) acrylate to a urethane addition reaction with a hydroxyl group of liquid polybutadiene via 2,4-tolylene diisocyanate, and maleic anhydride were added.
- Examples of commercially available products include NISSO PB TE-2000, NISSO PB TEA-1000, NISSO PB TE-3000, NISSO PB TEAI-1000 (all of which are manufactured by Nippon Soda Co., Ltd.), CN301, CN303, CN307 (SARTOMER) , BAC-15 (manufactured by Osaka Organic Chemical Industry), BAC-45 (manufactured by Osaka Organic Chemical Industry), EY RESIN BR-45UAS (manufactured by Light Chemical Industry), and the like.
- (Meth) acrylate having a polyene skeleton can be used alone or in combination.
- the curable composition of this invention can mix
- Diluents include diluent solvents, photoreactive diluents, heat reactive diluents, and the like. Of these diluents, photoreactive diluents are preferred.
- Photoreactive diluents include (meth) acrylates, vinyl ethers, ethylene derivatives, styrene, chloromethylstyrene, ⁇ -methylstyrene, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, N-vinylformamide, xylyl
- examples thereof include compounds having an unsaturated double bond, oxetanyl group, and epoxy group, such as range oxetane, oxetane alcohol, 3-ethyl-3- (phenoxymethyl) oxetane, resorcinol diglycidyl ether, and the like.
- (meth) acrylates are preferable, and monofunctional (meth) acrylates are more preferable.
- monofunctional (meth) acrylates include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, 2- Examples include (meth) acrylates such as hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate, and acryloylmorpholine.
- the blending amount of these diluents is preferably 1 to 30 parts by mass in 100 parts by mass of the curable composition of the present invention.
- the curable composition of the present invention is a trifunctional or higher functional (meth) acrylate compound (excluding those having an epoxy group) or (meth) acrylate for the purpose of improving the tackiness after UV curing of the composition. (Excluding those having a carboxyl group) can be blended.
- Trifunctional or higher (meth) acrylate compounds include trimethylolpropane triacrylate, trimethylolmethane triacrylate, ethylene oxide modified trimethylolpropane triacrylate, propylene oxide modified trimethylolpropane triacrylate, epichlorohydrin modified trimethylolpropane triacrylate, penta Erythritol tetraacrylate, tetramethylol methane tetraacrylate, ethylene oxide modified phosphate triacrylate, propylene oxide modified phosphate triacrylate, epichlorohydrin modified glycerol triacrylate, dipentaerythritol hexaacrylate, ditrimethylolpropane tetraacrylate, or their silsesquioxanes
- Polyfunctional acrylate or methacrylate monomers corresponding to these are include ⁇ -caprolactone-modified trisacryloxyethyl isocyanurate. The blending amount of the trifunctional or
- the curable compositions according to the first to fourth embodiments of the present invention having the above-described components include screen printing methods, ink jet methods, dip coating methods, flow coating methods, roll coating methods, bar coater methods, curtain coating methods. It can be applied to printing methods such as law.
- the viscosity at 50 ° C. of the curable composition of the present invention is preferably 5 to 50 mPa ⁇ s, and preferably 5 to 20 mPa ⁇ s. Is more preferable. Thereby, smooth printing can be performed without applying an unnecessary load to the ink jet printer.
- the viscosity refers to a viscosity measured at normal temperature (25 ° C.) or 50 ° C. according to JIS K2283. If the viscosity at room temperature is 150 mPa ⁇ s or less, or the viscosity at 50 ° C. is 5 to 50 mPa ⁇ s, printing by the ink jet printing method is possible.
- the curable composition of the present invention when applied as an ink for an ink jet system with the above composition, it can be printed on a flexible wiring board in a roll-to-roll system. In this case, it is possible to form a pattern cured coating film at high speed by attaching a light irradiation light source described later after passing through the ink jet printer.
- the light irradiation is performed by irradiation with ultraviolet rays or active energy, but ultraviolet rays are preferable.
- a light source for light irradiation a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a xenon lamp, a metal halide lamp, or the like is appropriate.
- electron beams, ⁇ rays, ⁇ rays, ⁇ rays, X rays, neutron rays, and the like can also be used.
- the photobase generator contained in the curable resin composition is activated to cure the light irradiation part.
- the light irradiation part is cured by heating.
- the heating temperature is, for example, 80 to 200 ° C.
- the heating time is, for example, 10 to 100 minutes.
- the curable composition of the present invention is excellent in adhesion to a printed wiring board including a plastic substrate mainly composed of polyimide and the like and a conductor circuit provided thereon, and has solder heat resistance and resistance.
- Pattern cured coatings with excellent properties such as chemical properties, solvent resistance, pencil hardness, electroless gold plating resistance, and bendability can be formed.
- part means part by mass unless otherwise specified.
- Examples 1 to 13 and Comparative Examples 1 to 4 The components shown in Table 1 and Table 2 were blended in the proportions (unit: part) shown in the table, and premixed with a stirrer to prepare a curable composition.
- Viscosity at 50 ° C Viscosity of the curable compositions obtained in Examples 1 to 13 and Comparative Examples 1 to 4 at 50 ° C. and 100 rpm was measured with a cone plate viscometer (TVH-33H manufactured by Toki Sangyo Co., Ltd.). It was measured. Evaluation criteria ⁇ : Less than 20 mPa ⁇ s ⁇ : 20 mPa ⁇ s or more and 50 mPa ⁇ s or less ⁇ : More than 50 mPa ⁇ s
- Pencil hardness surface hardness 5. Using the cured coating film obtained in 1), the pencil hardness on the surface was measured according to JIS K 5600-5-4.
- the flexible copper-clad laminate was coated on the substrate using a piezo-type inkjet printer so that the film thickness was 15 ⁇ m by inkjet printing. At this time, UV temporary curing was performed with a high-pressure mercury lamp attached to the inkjet head immediately after printing. Thereafter, curing was performed by heating at 150 ° C. for 1 hour to obtain a test piece.
- the cured test piece was repeatedly bent with the protective film on the inner side under the following conditions using a MIT (Masschus Institutes of Technology) tester, and the number of cycles at which electrical conduction could not be obtained was obtained. A test was performed on three test pieces per evaluation, and an average value at which continuity could not be obtained was calculated. Test criteria and judgment criteria are as shown below.
- MIT test condition load 500 gf Angle: Angle facing 135 ° Speed: 175 times / min Tip: R 0.38 mm cylinder Evaluation criteria ⁇ : 50 times or more x: Less than 50 times
- Electroless gold plating resistance 5. Using a commercially available electroless nickel plating bath and electroless gold plating bath, under conditions of nickel 0.5 ⁇ m and gold 0.03 ⁇ m. Gold plating was performed on the cured coating film obtained in, and the surface state of the cured coating film was observed. Judgment criteria are as follows. Evaluation criteria ⁇ : No change is observed. X: Significant whitening or clouding occurred. The measurement results are shown in Tables 3 and 4.
- the curable compositions of Examples 1 to 13 according to the present invention have a touch-drying property after UV curing, adhesiveness with polyimide, adhesiveness with copper, and pencil hardness. It showed good results in all of bending resistance, solvent resistance, chemical resistance, solder heat resistance, and electroless gold plating resistance.
- the curable composition of the present invention has excellent adhesion to both the plastic substrate and the conductor circuit metal, and also has solder heat resistance, solvent resistance, chemical resistance, pencil hardness, and electroless gold plating. Fine patterns excellent in various properties such as resistance can be formed. Further, when jetting by an ink jet method, the viscosity must be low to enable jetting. In general, low-viscosity photo-curable compositions are said to have low adhesion and heat resistance characteristics, but this composition is suitable for solder resist pattern formation by the inkjet method of printed wiring boards even when the viscosity is low. Can be used. Therefore, in addition to printed wiring plate materials such as resist inks and marking inks, it can be used for applications such as UV molded article materials, optical modeling materials, and 3D inkjet materials.
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Abstract
Description
また、本発明の硬化型組成物は、(A-1)光重合開始剤としての機能を有する光塩基発生剤と、(B-1)エポキシ基を有する(メタ)アクリレート化合物と、(D-1)熱硬化成分((B-1)エポキシ基を有する(メタ)アクリレート化合物を除く)と、を含むことを特徴とするものである。
更にまた、本発明の硬化型組成物は、(A-1)光重合開始剤としての機能を有する光塩基発生剤と、(B-2)カルボキシル基を有する(メタ)アクリレート化合物と、(D-2)熱硬化成分((B-2)カルボキシル基を有する(メタ)アクリレート化合物を除く)と、を含むことを特徴とするものである。
本発明の第1の実施の形態に係る硬化型組成物は、(A)光塩基発生剤(成分A)と、(B-1)エポキシ基を有する(メタ)アクリレート化合物(成分B-1)と、(C)光重合開始剤(成分C)と、(D-1)熱硬化成分((B-1)エポキシ基を有する(メタ)アクリレート化合物を除く)と、を含む。また、本発明の第2の実施の形態に係る硬化型組成物は、(A-1)光重合開始剤としての機能を有する光塩基発生剤と、(B-1)エポキシ基を有する(メタ)アクリレート化合物と、(D-1)熱硬化成分((B-1)エポキシ基を有する(メタ)アクリレート化合物を除く)と、を含む。これは、(A)成分として、(A-1)光重合開始剤としての機能を有する光塩基発生剤を含む組成物であり、この場合、(C)光重合開始剤は含まれていても含まれていなくてもよい。
本発明の第1~第4の実施の形態に係る硬化型組成物においては、(A)光塩基発生剤は、紫外線や可視光等の光照射により分子構造が変化するか、または、分子が開裂することにより、(B-1)エポキシ基を有する(メタ)アクリレート化合物または(B-2)カルボキシル基を有する(メタ)アクリレート化合物と熱硬化成分との付加反応の触媒として機能しうる1種以上の塩基性物質を生成する化合物である。発生する塩基性物質として、例えば2級アミン、3級アミンが挙げられる。
その他の光塩基発生剤として、WPBG-018(商品名:9-anthrylmethyl N,N’-diethylcarbamate和光純薬製),WPBG-027(商品名:(E)-1-[3-(2-hydroxyphenyl)-2-propenoyl]piperidine),WPBG-082(商品名:guanidinium2-(3-benzoylphenyl)propionate), WPBG-140 (商品名:1-(anthraquinon-2-yl)ethyl imidazolecarboxylate)等を使用することもできる。
また、光塩基発生剤が光重合開始剤としても作用する場合、光塩基発生剤の吸収波長と光重合開始剤の吸収波長とが異なるものを選択する事で、より効果的に組成物の硬化性を高める事が出来る。
本発明の第1または第2の実施の形態に係る硬化型組成物においては、(B-1)エポキシ基を有する(メタ)アクリレート化合物は、モノマー又はオリゴマー等の低分子量の材料が使用され、具体的には分子量100~1000の範囲、好ましくは分子量110~700の範囲の材料が用いられる。
本発明の第3または第4の実施の形態に係る硬化型組成物においては、(B-2)カルボキシル基を有する(メタ)アクリレート化合物は、モノマー又はオリゴマー等の低分子量の材料が使用され、具体的には分子量100~1000の範囲、好ましくは分子量110~700の範囲の材料が用いられる。
本発明の第1~第4の実施の形態に係る硬化型組成物において、(C)光重合開始剤としては、特に限定されるものではなく、例えば光ラジカル重合開始剤を用いることができる。この光ラジカル重合開始剤としては、光、レーザー、電子線等によりラジカルを発生し、ラジカル重合反応を開始させられる化合物であればいずれも用いることができる。
本発明の第1または第2の実施の形態に係る硬化型組成物には、(D-1)熱硬化成分((B-1)エポキシ基を有する(メタ)アクリレート化合物を除く)を加えることにより密着性や耐熱性が向上することが期待できる。また、本発明の第3または第4の実施の形態に係る硬化型組成物には、(D-2)熱硬化成分((B-2)カルボキシル基を有する(メタ)アクリレート化合物を除く)を加えることにより密着性や耐熱性が向上することが期待できる。本発明に用いられる熱硬化成分としては、メラミン樹脂、ベンゾグアナミン樹脂、メラミン誘導体、ベンゾグアナミン誘導体等のアミノ樹脂、ブロックイソシアネート化合物、シクロカーボネート化合物、環状(チオ)エーテル基を有する熱硬化成分、ビスマレイミド、カルボジイミド樹脂等の公知の熱硬化性樹脂が使用できる。また、密着性や耐熱性がより向上することより、(D-1)熱硬化成分としてエポキシ基と反応しうる官能基を少なくとも2つ有する化合物が好ましい。エポキシ基と反応しうる官能基とはカルボキシル基、アミノ基、水酸基、チオール基などが挙げられる。(D-1)熱硬化成分として特に好ましいのは、カルボキシル基含有化合物及びカルボン酸無水物などである。カルボキシル基含有化合物として公知の多価カルボン酸化合物、カルボン酸含有樹脂が使用できる。具体的にはシュウ酸、マロン酸、コハク酸、グルタル酸、アジピン酸、フマル酸、マレイン酸、フタル酸、イソフタル酸、テレフタル酸、4-シクロヘキセン-1,2-ジカルボン酸、トリメリット酸、1,2,3,4-ブタンテトラカルボン酸、(メタ)アクリル酸等の不飽和カルボン酸と、スチレン、α-メチルスチレン、炭素原子数1~5の低級アルキル(メタ)アクリレート、イソブチレン等の不飽和基含有化合物との共重合により得られるカルボン酸樹脂、脂肪族ジイソシアネート、分岐脂肪族ジイソシアネート、脂環式ジイソシアネート、芳香族ジイソシアネート等のジイソシアネートと、ジメチロールプロピオン酸、ジメチロールブタン酸等のカルボキシル基含有ジアルコール化合物及びポリカーボネート系ポリオール、ポリエーテル系ポリオール、ポリエステル系ポリオール、ポリオレフィン系ポリオール、アクリル系ポリオール、ビスフェノールA系アルキレンオキシド付加体ジオール、フェノール性ヒドロキシル基及びアルコール性ヒドロキシル基を有する化合物等のジオール化合物の重付加反応によるカルボキシル基含有ウレタン樹脂、脂肪族ジイソシアネート、分岐脂肪族ジイソシアネート、脂環式ジイソシアネート、芳香族ジイソシアネート等のジイソシアネート化合物と、ポリカーボネート系ポリオール、ポリエーテル系ポリオール、ポリエステル系ポリオール、ポリオレフィン系ポリオール、アクリル系ポリオール、ビスフェノールA系アルキレンオキシド付加体ジオール、フェノール性ヒドロキシル基及びアルコール性ヒドロキシル基を有する化合物等のジオール化合物の重付加反応によるウレタン樹脂の末端に酸無水物を反応させてなる末端カルボキシル基含有ウレタン樹脂などが挙げられる。
また、組成物の長期保管における粘度の上昇を抑える効果があることより、これらのカルボキシル基含有化合物のカルボキシル基をビニルエーテルで保護した化合物も好ましい。カルボン酸無水物としては、具体的には、3,3’,4,4’-ビフェニルテトラカルボン酸二無水物、3,3',4,4'-ジフェニルスルホンテトラカルボン酸二無水物、エチレングリコールビスアンヒドロトリメリテート、グリセリンビスアンヒドロトリメリテートモノアセテート、テトラプロペニル無水コハク酸、オクテニルコハク酸無水物、2,5-ジケトテトラヒドロフラン、1,3,3a,4,5,9b-ヘキサヒドロ-5(テトラヒドロ-2,5-ジオキソ-3-フラニル)ナフト[1,2-c]フラン-1,3-ジオン、1,2,3,4-ブタンテトラカルボン酸二無水物、ヘキサヒドロ無水フタル酸、1,2,3,6-テトラヒドロ無水フタル酸、3,4,5,6-テトラヒドロ無水フタル酸などが挙げられる。密着性や耐熱性がより向上することより、(D-2)熱硬化成分としてカルボキシル基と反応しうる官能基を少なくとも2つ有する化合物が好ましい。カルボキシル基と反応しうる官能基とは(チオ)エーテル基、イソシアネート基、水酸基、アミノ基、チオール基、オキサゾリン基などが挙げられる。特に好ましいのは、カルボキシル基との反応性の高さや、密着性の高さからエポキシ化合物である。
芳香族ポリイソシアネートの具体例としては、例えば、4,4’-ジフェニルメタンジイソシアネート、2,4-トリレンジイソシアネート、2,6-トリレンジイソシアネート、ナフタレン-1,5-ジイソシアネート、o-キシリレンジイソシアネート、m-キシリレンジイソシアネートおよび2,4-トリレンダイマー等が挙げられる。
本発明の第1または第2の実施の形態に係る硬化型組成物は、更に、2官能(メタ)アクリレート化合物(エポキシ基を有するものを除く)を含むことが好ましい。同様に、本発明の第3または第4の実施の形態に係る硬化型組成物も、更に、2官能(メタ)アクリレート化合物(カルボキシル基を有するものを除く)を含むことが好ましい。かかる2官能(メタ)アクリレート化合物を添加することにより、硬化型組成物における各成分の相溶性をさらに向上させることができる。
(式中、nは10~300を示す。)
で表わされる繰り返し単位から構成されることが好ましい。このような繰り返し単位のオレフィン性二重結合に起因して、硬化型レジスト組成物に柔軟性が与えられ、基材への追従性が増し、良好な密着性が得られる。
希釈剤としては、希釈溶剤、光反応性希釈剤、熱反応性希釈剤等が挙げられる。これらの希釈剤の中でも光反応性希釈剤が好ましい。
光反応性希釈剤としては、(メタ)アクリレート類、ビニルエーテル類、エチレン誘導体、スチレン、クロロメチルスチレン、α-メチルスチレン、無水マレイン酸、ジシクロペンタジエン、N-ビニルピロリドン、N-ビニルホルムアミド、キシリレンジオキセタン、オキセタンアルコール、3-エチル-3-(フェノキシメチル)オキセタン、レゾルシノールジグリシジルエーテル等の不飽和二重結合やオキセタニル基、エポキシ基を有する化合物が挙げられる。
これらの中でも(メタ)アクリレート類が好ましく、さらに好ましくは単官能(メタ)アクリレート類が好ましい。単官能(メタ)アクリレート類としては、例えば、メチル(メタ)アクリレート、エチル(メタ)アクリレート、ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、ラウリル(メタ)アクリレート、ステアリル(メタ)アクリレート、2-ヒドロキシエチル(メタ)アクリレート、ヒドロキシプロピル(メタ)アクリレート、ヒドロキシブチル(メタ)アクリレート等の(メタ)アクリレート類や、アクリロイルモルホリン等を挙げることができる。
これらの希釈剤の配合量は、本発明の硬化型組成物100質量部中、1~30質量部が好ましい。
3官能以上の(メタ)アクリレート化合物としては、トリメチロールプロパントリアクリレート、トリメチロールメタントリアクリレート、エチレンオキシド変性トリメチロールプロパントリアクリレート、プロピレンオキシド変性トリメチロールプロパントリアクリレート、エピクロルヒドリン変性トリメチロールプロパントリアクリレート、ペンタエリスリトールテトラアクリレート、テトラメチロールメタンテトラアクリレート、エチレンオキシド変性リン酸トリアクリレート、プロピレンオキシド変性リン酸トリアクリレート、エピクロルヒドリン変性グリセロールトリアクリレート、ジペンタエリスリトールヘキサアクリレート、ジトリメチロールプロパンテトラアクリレート、あるいはこれらのシルセスキオキサン変性物等に代表される多官能アクリレート、あるいはこれらに対応するメタアクリレートモノマー、εカプロラクトン変性トリスアクリロキシエチルイソシアヌレートが挙げられる。当該3官能以上の多官能(メタ)アクリレート化合物の配合量は本発明の硬化型組成物100質量部中、1~40質量部が好ましい。
ここで、加熱温度は、例えば、80~200℃である。かかる加熱温度範囲とすることにより、光照射部を十分に硬化できる。加熱時間は、例えば、10~100分である。
表1及び表2に示す成分を、同表に示す割合(単位:部)にて配合し、攪拌機にて予備混合し、硬化型組成物を調製した。
実施例1~13及び比較例1~4により得られた硬化型組成物の50℃、100rpmにおける粘度をコーンプレート型粘度計(東機産業社製TVH-33H)にて測定した。
評価基準
○:20mPa・s未満
△:20mPa・s以上50mPa・s以下
×:50mPa・s超
実施例1~13及び比較例1~4により得られた硬化型組成物を30μmのアプリケーター(ERICHSEN社製)を使って銅張積層板上に塗布し、高圧水銀灯(ORC社製HMW-713)150mJ/cm2にて硬化を行った。得られたサンプルの指触乾燥性を評価した。
○:タックフリー
△:僅かにベタ付きあり
×:ベタ付きあり
実施例1~13及び比較例1~4により得られた組成物を30μmのアプリケーター(ERICHSEN社製)を使ってポリイミド基材(ユーピレックス25S)上に塗布し、高圧水銀灯(ORC社製HMW-713)150mJ/cm2にて硬化を行った。その後、150℃の熱風循環式乾燥炉にて60分間加熱処理を行った。作製したサンプルに対してクロスカットテープピール試験(JIS K5600)を実施した。
○:剥離なし
×:剥離あり
実施例1~13及び比較例1~4により得られた組成物を30μmのアプリケーター(ERICHSEN社製)を使ってFR-4基板上に塗布し、高圧水銀灯(ORC社製HMW-713)150mJ/cm2にて硬化を行った。その後、150℃の熱風循環式乾燥炉にて60分間加熱処理を行った。作製したサンプルに対してクロスカットテープピール試験(JIS K5600)を実施した。
○:剥離なし
×:剥離あり
実施例1~13及び比較例1~4により得られた硬化型組成物を30μmのアプリケーター(ERICHSEN社製)を使って銅箔上に塗布し、高圧水銀灯(ORC社製HMW-713)150mJ/cm2にて硬化を行った。その後、150℃の熱風循環式乾燥炉にて60分間加熱処理を行った。作製したサンプルに対してクロスカットテープピール試験を実施した。
○:剥離なし
×:剥離あり
5.で得られた硬化塗膜を用いて、表面における鉛筆硬度をJIS K 5600-5-4に準拠して測定を行った。
厚さ25μmのポリイミドフィルムと、厚さ12μmの銅箔により形成された櫛形の銅配線(配線パターン)とから構成されるフレキシブル銅張り積層板(長さ110mm、幅60mm、銅配線幅/銅配線間幅=200μm/200μm)を準備した。このフレキシブル銅張り積層板の基板にピエゾ型インクジェット印刷機を用いてインクジェット印刷により膜厚が15μmになるように塗布した。この時、印刷直後にインクジェットヘッドに付帯の高圧水銀灯にてUV仮硬化を行った。その後150℃で1時間の加熱により硬化を行い試験片を得た。硬化後の試験片に対して、MIT(Massachusetts Institute of Technology)試験機を用いて下記条件にて保護膜を内側にして折り曲げを繰り返し実施し、導通がとれなくなるサイクル数を求めた。1回の評価につき3試験片に対して試験を実施し、導通がとれなくなる平均値を計算した。試験基準と判定基準は以下に示す通りである。
耐MIT試験条件
荷重:500gf
角度:角対向135°
速度:175回/分
先端:R0.38mm円筒
評価基準
○:50回以上
×:50回未満
5.で得られた硬化塗膜をアセトンに30分間浸漬した後の塗膜状態を目視にて観察し、以下の基準で評価した。
評価基準
○:全く変化が認められないもの。
×:塗膜の膨潤又は剥離が認められるもの。
5.で得られた硬化塗膜を5質量%の硫酸水溶液に10分間浸漬した後の塗膜状態を目視にて観察し、以下の基準で観察した。
評価基準
○:全く変化が認められないもの。
×:塗膜の膨潤又は剥離が認められるもの。
5.で得られた硬化塗膜を、JIS C-5012の方法に準拠し、260℃のはんだ槽に10秒間浸漬後、セロハン粘着テープによるピーリング試験を行った後の塗膜状態を目視にて観察し、以下の基準で評価した。
評価基準
○:塗膜に変化がないもの。
△:塗膜が変化しているもの。
×:塗膜が剥離したもの。
市販の無電解ニッケルめっき浴及び無電解金めっき浴を用いて、ニッケル0.5μm、金0.03μmの条件で5.で得られた硬化塗膜に金めっきを行ない、硬化塗膜表面状態の観察を行った。判定基準は以下の通りである。
評価基準
○:全く変化が認められないもの。
×:顕著に白化若しくは曇りが生じたもの。
測定結果を表3及び表4に示す。
※1:TPGDA、トリプロピレングリコールジアクリレート(BASFジャパン社製)
※2:GMA(グリシジルメタクリレート)
※3:ビスフェノールAモノグリシジルエーテルモノアクリレート
※4:3,4-エポキシシクロヘキシルメチルメタアクリレート
※5:Laromer LR8863:EO変性トリメチロールプロパントリアクリレート(BASFジャパン社製)
※6:イルガキュア 819、ビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(BASFジャパン社製)
※7:トリメリット酸
※8:BYK-307、シリコン系添加剤(ビックケミー・ジャパン社製)
※9:イルガキュア OXE02、エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)(BASFジャパン社製)
※10:イルガキュア 907、2-メチル-1-(4-メチルチオフェニル)-2-モルフォリノプロパン-1-オン(BASFジャパン社製)
※11:WPBG-027、(E)-1-[3-(2-hydroxyphenyl)-2-propenoyl]piperidine(和光純薬社製)
※12:NKエステルA-SA、カルボキシル基含有単官能アクリレート(新中村化学工業社製)
※13:YX-4000、ビフェニル型ジグリシジルエーテル(三菱化学社製)
※14:jER828、ビスフェノールA型ジグリシジルエーテル(三菱化学社製)
また、インクジェット方式で噴射する場合、噴射可能とするには低粘度としなければならない。一般的に低粘度の光硬化型組成物は密着性・耐熱性などの特性が低いとされているが、本組成物は低粘度としても、プリント配線板のインクジェット方式によるソルダーレジストパターン形成に好適に用いることができる。そのため、レジストインキやマーキングインキなどのプリント配線版用材料以外にも、例えば、UV成形品材料、光造形用材料、3Dインクジェット用材料などの用途に利用可能である。
Claims (19)
- (A)光塩基発生剤と、
(B-1)エポキシ基を有する(メタ)アクリレート化合物と、
(C)光重合開始剤と、
(D-1)熱硬化成分((B-1)エポキシ基を有する(メタ)アクリレート化合物を除く)と、
を含むことを特徴とする硬化型組成物。 - (A-1)光重合開始剤としての機能を有する光塩基発生剤と、
(B-1)エポキシ基を有する(メタ)アクリレート化合物と、
(D-1)熱硬化成分((B-1)エポキシ基を有する(メタ)アクリレート化合物を除く)と、
を含むことを特徴とする硬化型組成物。 - 前記(D-1)熱硬化成分((B-1)エポキシ基を有する(メタ)アクリレート化合物を除く)がエポキシ基と反応しうる官能基を少なくとも2つ有する化合物であることを特徴とする請求項1または2に記載の硬化型組成物。
- 前記エポキシ基と反応しうる官能基を少なくとも2つ有する化合物がカルボキシル基含有化合物及び酸無水物の少なくとも何れか1種であることを特徴とする請求項3に記載の硬化型組成物。
- さらに、2官能(メタ)アクリレート化合物(エポキシ基を有するものを除く)を含むことを特徴とする請求項1または2に記載の硬化型組成物。
- 前記2官能(メタ)アクリレート化合物(エポキシ基を有するものを除く)の25℃における粘度が5~50mPa・sであることを特徴とする請求項5に記載の硬化型組成物。
- (A)光塩基発生剤と、
(B-2)カルボキシル基を有する(メタ)アクリレート化合物と、
(C)光重合開始剤と、
(D-2)熱硬化成分((B-2)カルボキシル基を有する(メタ)アクリレート化合物を除く)と、
を含むことを特徴とする硬化型組成物。 - (A-1)光重合開始剤としての機能を有する光塩基発生剤と、
(B-2)カルボキシル基を有する(メタ)アクリレート化合物と、
(D-2)熱硬化成分((B-2)カルボキシル基を有する(メタ)アクリレート化合物を除く)と、
を含むことを特徴とする硬化型組成物。 - 前記(D-2)熱硬化成分((B-2)カルボキシル基を有する(メタ)アクリレート化合物を除く)がカルボキシル基と反応しうる官能基を少なくとも2つ有する化合物であることを特徴とする請求項7または8に記載の硬化型組成物。
- 前記カルボキシル基と反応しうる官能基を少なくとも2つ有する化合物がエポキシ化合物であることを特徴とする請求項9に記載の硬化型組成物。
- 前記エポキシ化合物が結晶性を有することを特徴とする請求項10に記載の硬化型組成物。
- さらに、2官能(メタ)アクリレート化合物(カルボキシル基を有するものを除く)を含むことを特徴とする請求項7または8に記載の硬化型組成物。
- 前記2官能(メタ)アクリレート化合物(カルボキシル基を有するものを除く)の25℃における粘度が5~50mPa・sであることを特徴とする請求項12に記載の硬化型組成物。
- 50℃における粘度が5~50mPa・sであることを特徴とする請求項1、2、7または8に記載の硬化型組成物。
- 請求項1、2、7または8に記載の硬化型組成物に対して光照射することにより得られることを特徴とする硬化塗膜。
- 請求項1、2、7または8に記載の硬化型組成物が基板上に印刷され、これを光照射することにより得られるパターン硬化塗膜を有することを特徴とするプリント配線板。
- 請求項1、2、7または8に記載の硬化型組成物がインクジェット印刷法により基板上に印刷され、これを光照射することにより得られるパターン硬化塗膜を有することを特徴とするプリント配線板。
- 前記基板がプラスチック基板であることを特徴とする請求項16に記載のプリント配線板。
- 前記基板がプラスチック基板であることを特徴とする請求項17に記載のプリント配線板。
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| EP14859821.2A EP3067374A4 (en) | 2013-11-05 | 2014-11-04 | Curable composition, cured coating film using same, and printed wiring board |
| CN201480060680.4A CN105705529A (zh) | 2013-11-05 | 2014-11-04 | 固化型组合物、使用其的固化涂膜和印刷电路板 |
| US15/026,071 US10113066B2 (en) | 2013-11-05 | 2014-11-04 | Curable composition, cured coating film using same, and printed wiring board |
| KR1020167013355A KR101836752B1 (ko) | 2013-11-05 | 2014-11-04 | 경화형 조성물, 이것을 사용한 경화 도막 및 프린트 배선판 |
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| JP2013229680A JP6339346B2 (ja) | 2013-11-05 | 2013-11-05 | プリント配線板用硬化型組成物、これを用いた硬化塗膜及びプリント配線板 |
| JP2013-229680 | 2013-11-05 | ||
| JP2013229679 | 2013-11-05 |
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| WO2015068703A1 true WO2015068703A1 (ja) | 2015-05-14 |
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| US (1) | US10113066B2 (ja) |
| EP (1) | EP3067374A4 (ja) |
| KR (1) | KR101836752B1 (ja) |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108369376A (zh) * | 2015-12-25 | 2018-08-03 | 东丽株式会社 | 感光性树脂组合物、固化膜、层叠体、触控面板用构件和固化膜的制造方法 |
| WO2018159674A1 (ja) * | 2017-03-02 | 2018-09-07 | Jnc株式会社 | 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板、電子部品およびインクジェット用インク組成物 |
| WO2018159675A1 (ja) * | 2017-03-02 | 2018-09-07 | Jnc株式会社 | 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板、電子部品およびインクジェット用インク組成物 |
| EP3438212A4 (en) * | 2016-03-31 | 2020-01-08 | Taiyo Ink Mfg. Co., Ltd. | HARDENABLE COMPOSITION FOR INK JET PRINTING, HARDENED OBJECT AND PCB |
| JP2020516479A (ja) * | 2016-11-10 | 2020-06-11 | アグフア−ゲヴエルト,ナームローゼ・フエンノートシヤツプ | プリント回路板製造用はんだマスクインキジェットインキ |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6117457B1 (ja) | 2015-10-27 | 2017-04-19 | Dicグラフィックス株式会社 | 低温焼付け対応レジストインキ |
| DE102017213226A1 (de) * | 2016-09-27 | 2018-03-29 | Heidelberger Druckmaschinen Ag | Verfahren zum Herstellen eines Druckprodukts |
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| TWI772616B (zh) | 2018-03-01 | 2022-08-01 | 日商日本化藥股份有限公司 | 新穎化合物、含有該化合物之光聚合起始劑及含有該光聚合起始劑的感光性樹脂組成物 |
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| CN114907720A (zh) * | 2021-12-15 | 2022-08-16 | 常州格林感光新材料有限公司 | 一种pcb喷印字符油墨组合物及其制备方法 |
Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63252498A (ja) | 1987-04-09 | 1988-10-19 | 東洋インキ製造株式会社 | 印刷配線基板の製造方法 |
| JPH10152548A (ja) * | 1996-11-25 | 1998-06-09 | Toyo Ink Mfg Co Ltd | 塩基発生剤、硬化性組成物およびその硬化物 |
| JP2004359639A (ja) | 2003-06-06 | 2004-12-24 | Asahi Denka Kogyo Kk | オキシムエステル化合物および該化合物を含有する光重合開始剤 |
| JP2005097141A (ja) | 2003-09-24 | 2005-04-14 | Asahi Denka Kogyo Kk | 二量体オキシムエステル化合物及び該化合物を有効成分とする光重合開始剤 |
| JP2005220097A (ja) | 2004-02-06 | 2005-08-18 | Asahi Denka Kogyo Kk | チオフェン構造を有するオキシムエステル化合物及び該化合物を含有する光重合開始剤 |
| JP2006160634A (ja) | 2004-12-03 | 2006-06-22 | Asahi Denka Kogyo Kk | オキシムエステル化合物及び該化合物を含有する光重合開始剤 |
| JP2007063531A (ja) * | 2005-06-23 | 2007-03-15 | Sekisui Chem Co Ltd | 硬化性樹脂組成物、カラムスペーサ及び液晶表示素子 |
| JP2007086399A (ja) * | 2005-09-22 | 2007-04-05 | Dainippon Printing Co Ltd | 光学素子 |
| JP2008509967A (ja) | 2004-08-18 | 2008-04-03 | チバ スペシャルティ ケミカルズ ホールディング インコーポレーテッド | オキシムエステル光開始剤 |
| JP2008094770A (ja) | 2006-10-13 | 2008-04-24 | Adeka Corp | オキシムエステル化合物及び該化合物を有効成分とする光重合開始剤 |
| JP2008260909A (ja) * | 2007-03-20 | 2008-10-30 | Jsr Corp | 感放射線性保護膜形成用樹脂組成物およびその組成物から保護膜を形成する方法、ならびに液晶表示素子および固体撮像素子 |
| JP2009040762A (ja) | 2007-08-09 | 2009-02-26 | Ciba Holding Inc | オキシムエステル光開始剤 |
| JP2009083482A (ja) * | 2007-09-13 | 2009-04-23 | Asahi Kasei Electronics Co Ltd | 感光性樹脂積層体 |
| JP2009128672A (ja) * | 2007-11-26 | 2009-06-11 | Jsr Corp | 感放射線性樹脂組成物、液晶表示素子のスペーサーおよび保護膜ならびに液晶表示素子 |
| JP4344400B1 (ja) | 2009-02-16 | 2009-10-14 | 株式会社日本化学工業所 | オキシムエステル化合物及びこれらを用いた感光性樹脂組成物 |
| JP2010070614A (ja) * | 2008-09-17 | 2010-04-02 | Sekisui Chem Co Ltd | マイクロパターン形成用材料、マイクロパターン複合材及びその製造方法並びに微小3次元構造基板の製造方法 |
| WO2010110121A1 (ja) * | 2009-03-24 | 2010-09-30 | ダイセル化学工業株式会社 | ナノインプリント用硬化性組成物及び硬化物 |
| JP2011080036A (ja) | 2009-09-08 | 2011-04-21 | Nippon Steel Chem Co Ltd | 光重合開始剤及び感光性組成物 |
| JP2012014930A (ja) * | 2010-06-30 | 2012-01-19 | Sanyo Chem Ind Ltd | 感光性樹脂組成物 |
| JP2012037677A (ja) * | 2010-08-05 | 2012-02-23 | Jsr Corp | 感放射線性組成物、表示素子用スペーサー及びその形成方法 |
| JP2013135192A (ja) | 2011-12-27 | 2013-07-08 | Goo Chemical Co Ltd | ソルダーレジスト用樹脂組成物及びマーキングインク用樹脂組成物 |
| JP2014152192A (ja) * | 2013-02-05 | 2014-08-25 | Jsr Corp | 硬化膜形成用熱硬化性樹脂組成物、硬化膜形成用感放射線性樹脂組成物、硬化膜、その形成方法、半導体素子及び表示素子 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09235355A (ja) | 1996-02-28 | 1997-09-09 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物及びこれを用いた多層プリント配線板の製造方法 |
| JP2003204141A (ja) | 2002-01-08 | 2003-07-18 | Toppan Printing Co Ltd | プリント配線板とその製造方法 |
| TWI288142B (en) * | 2003-05-09 | 2007-10-11 | Taiyo Ink Mfg Co Ltd | Photocuring/thermosetting ink jet composition and printed wiring board using same |
| GB0414847D0 (en) * | 2004-07-02 | 2004-08-04 | Avecia Ltd | Process |
| WO2006129665A1 (ja) | 2005-05-30 | 2006-12-07 | Sekisui Chemical Co., Ltd. | カラムスペーサ用硬化性樹脂組成物、カラムスペーサ及び液晶表示素子 |
| JP5050707B2 (ja) * | 2006-10-18 | 2012-10-17 | 日立化成工業株式会社 | 感光性樹脂組成物及び感光性フィルム |
| JP4973868B2 (ja) * | 2007-11-13 | 2012-07-11 | 株式会社スリーボンド | 硬化性樹脂組成物および硬化方法 |
| JP5316901B2 (ja) * | 2009-12-07 | 2013-10-16 | 山栄化学株式会社 | プリント配線板及びその製造方法 |
| JP2012031240A (ja) | 2010-07-29 | 2012-02-16 | Hitachi High-Technologies Corp | 微細構造転写用の光重合性樹脂組成物 |
| US9249336B2 (en) * | 2010-09-22 | 2016-02-02 | Sekisui Chemical Co., Ltd. | Curable composition for inkjet, and method for producing electronic component |
| JP5666226B2 (ja) | 2010-09-22 | 2015-02-12 | 株式会社ニデック | 樹脂組成物 |
| JP6247148B2 (ja) | 2013-05-09 | 2017-12-13 | 積水化学工業株式会社 | インクジェット用硬化性組成物及びインクジェット塗布装置 |
-
2014
- 2014-11-04 WO PCT/JP2014/079277 patent/WO2015068703A1/ja not_active Ceased
- 2014-11-04 CN CN201480060680.4A patent/CN105705529A/zh active Pending
- 2014-11-04 KR KR1020167013355A patent/KR101836752B1/ko active Active
- 2014-11-04 CN CN201710373034.9A patent/CN107254205B/zh active Active
- 2014-11-04 EP EP14859821.2A patent/EP3067374A4/en not_active Withdrawn
- 2014-11-04 US US15/026,071 patent/US10113066B2/en active Active
Patent Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63252498A (ja) | 1987-04-09 | 1988-10-19 | 東洋インキ製造株式会社 | 印刷配線基板の製造方法 |
| JPH10152548A (ja) * | 1996-11-25 | 1998-06-09 | Toyo Ink Mfg Co Ltd | 塩基発生剤、硬化性組成物およびその硬化物 |
| JP2004359639A (ja) | 2003-06-06 | 2004-12-24 | Asahi Denka Kogyo Kk | オキシムエステル化合物および該化合物を含有する光重合開始剤 |
| JP2005097141A (ja) | 2003-09-24 | 2005-04-14 | Asahi Denka Kogyo Kk | 二量体オキシムエステル化合物及び該化合物を有効成分とする光重合開始剤 |
| JP2005220097A (ja) | 2004-02-06 | 2005-08-18 | Asahi Denka Kogyo Kk | チオフェン構造を有するオキシムエステル化合物及び該化合物を含有する光重合開始剤 |
| JP2008509967A (ja) | 2004-08-18 | 2008-04-03 | チバ スペシャルティ ケミカルズ ホールディング インコーポレーテッド | オキシムエステル光開始剤 |
| JP2006160634A (ja) | 2004-12-03 | 2006-06-22 | Asahi Denka Kogyo Kk | オキシムエステル化合物及び該化合物を含有する光重合開始剤 |
| JP2007063531A (ja) * | 2005-06-23 | 2007-03-15 | Sekisui Chem Co Ltd | 硬化性樹脂組成物、カラムスペーサ及び液晶表示素子 |
| JP2007086399A (ja) * | 2005-09-22 | 2007-04-05 | Dainippon Printing Co Ltd | 光学素子 |
| JP2008094770A (ja) | 2006-10-13 | 2008-04-24 | Adeka Corp | オキシムエステル化合物及び該化合物を有効成分とする光重合開始剤 |
| JP2008260909A (ja) * | 2007-03-20 | 2008-10-30 | Jsr Corp | 感放射線性保護膜形成用樹脂組成物およびその組成物から保護膜を形成する方法、ならびに液晶表示素子および固体撮像素子 |
| JP2009040762A (ja) | 2007-08-09 | 2009-02-26 | Ciba Holding Inc | オキシムエステル光開始剤 |
| JP2009083482A (ja) * | 2007-09-13 | 2009-04-23 | Asahi Kasei Electronics Co Ltd | 感光性樹脂積層体 |
| JP2009128672A (ja) * | 2007-11-26 | 2009-06-11 | Jsr Corp | 感放射線性樹脂組成物、液晶表示素子のスペーサーおよび保護膜ならびに液晶表示素子 |
| JP2010070614A (ja) * | 2008-09-17 | 2010-04-02 | Sekisui Chem Co Ltd | マイクロパターン形成用材料、マイクロパターン複合材及びその製造方法並びに微小3次元構造基板の製造方法 |
| JP4344400B1 (ja) | 2009-02-16 | 2009-10-14 | 株式会社日本化学工業所 | オキシムエステル化合物及びこれらを用いた感光性樹脂組成物 |
| WO2010110121A1 (ja) * | 2009-03-24 | 2010-09-30 | ダイセル化学工業株式会社 | ナノインプリント用硬化性組成物及び硬化物 |
| JP2011080036A (ja) | 2009-09-08 | 2011-04-21 | Nippon Steel Chem Co Ltd | 光重合開始剤及び感光性組成物 |
| JP2012014930A (ja) * | 2010-06-30 | 2012-01-19 | Sanyo Chem Ind Ltd | 感光性樹脂組成物 |
| JP2012037677A (ja) * | 2010-08-05 | 2012-02-23 | Jsr Corp | 感放射線性組成物、表示素子用スペーサー及びその形成方法 |
| JP2013135192A (ja) | 2011-12-27 | 2013-07-08 | Goo Chemical Co Ltd | ソルダーレジスト用樹脂組成物及びマーキングインク用樹脂組成物 |
| JP2014152192A (ja) * | 2013-02-05 | 2014-08-25 | Jsr Corp | 硬化膜形成用熱硬化性樹脂組成物、硬化膜形成用感放射線性樹脂組成物、硬化膜、その形成方法、半導体素子及び表示素子 |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP3067374A4 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108369376A (zh) * | 2015-12-25 | 2018-08-03 | 东丽株式会社 | 感光性树脂组合物、固化膜、层叠体、触控面板用构件和固化膜的制造方法 |
| CN108369376B (zh) * | 2015-12-25 | 2022-05-03 | 东丽株式会社 | 感光性树脂组合物、固化膜、层叠体、触控面板用构件和固化膜的制造方法 |
| EP3438212A4 (en) * | 2016-03-31 | 2020-01-08 | Taiyo Ink Mfg. Co., Ltd. | HARDENABLE COMPOSITION FOR INK JET PRINTING, HARDENED OBJECT AND PCB |
| JP2020516479A (ja) * | 2016-11-10 | 2020-06-11 | アグフア−ゲヴエルト,ナームローゼ・フエンノートシヤツプ | プリント回路板製造用はんだマスクインキジェットインキ |
| WO2018159674A1 (ja) * | 2017-03-02 | 2018-09-07 | Jnc株式会社 | 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板、電子部品およびインクジェット用インク組成物 |
| WO2018159675A1 (ja) * | 2017-03-02 | 2018-09-07 | Jnc株式会社 | 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板、電子部品およびインクジェット用インク組成物 |
| JPWO2018159674A1 (ja) * | 2017-03-02 | 2019-12-26 | Jnc株式会社 | 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板、電子部品およびインクジェット用インク組成物 |
| JP6996548B2 (ja) | 2017-03-02 | 2022-01-17 | Jnc株式会社 | インクジェット用インク組成物、硬化膜、硬化膜付き基板および電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3067374A1 (en) | 2016-09-14 |
| US20160237282A1 (en) | 2016-08-18 |
| KR101836752B1 (ko) | 2018-03-08 |
| KR20160076524A (ko) | 2016-06-30 |
| US10113066B2 (en) | 2018-10-30 |
| CN107254205B (zh) | 2020-08-14 |
| CN105705529A (zh) | 2016-06-22 |
| CN107254205A (zh) | 2017-10-17 |
| EP3067374A4 (en) | 2017-07-26 |
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