WO2014162387A1 - Wire connection structure and electrical device - Google Patents

Abstract

Provided is a wire connection structure in which at least a first surface of a substrate (100) is formed from an insulator. A conductor (20) is formed on the first surface. The conductor (20) is covered by a sealing film (210). The sealing film (210) is, for example, an aluminum oxide film. An opening (212) is formed in the sealing film (210). The opening (212) is positioned above a part (an end, for example) of the conductor (20) in a planar view. A wire (30) is connected to the conductor (20). The wire (30) is connected to the conductor (20) by passing one end (32) of said wire (30) through the opening (212).

Description

Wire connection structure and electrical equipment

The present invention relates to a wire connection structure and an electrical device.

Electrical devices such as light-emitting devices are used in a state where they are electrically connected to other components such as control elements. One of the connection methods used here uses a bonding wire (hereinafter referred to as a wire).

For example, Patent Document 1 discloses connecting an organic EL (Electroluminescence) panel and a driving IC (Integrated Circuit) with a wire. In Patent Document 1, the driving IC is disposed on the sealing resin of the organic EL panel.

International Publication No. 2010/106637

When providing a conductor on the substrate, a cover may be provided to protect this conductor. On the other hand, when a covering is provided, it is difficult to electrically connect this conductor to another conductor.

As a problem to be solved by the present invention, for example, when a conductor on a substrate is covered with a covering, the conductor is electrically connected to another conductor.

The invention according to claim 1 includes a substrate and a wire,
The substrate has a conductor and a covering covering the conductor,
The wire connection structure is characterized in that the wire passes through the opening of the covering and is connected to the conductor.

The invention according to claim 9 is a functional component having a substrate, a conductor formed on the substrate, and a covering covering the conductor;
A wire connected to the functional component;
With
The wire is an electrical device that is connected to the conductor through an opening provided in the covering.

The above-described object and other objects, features, and advantages will be further clarified by a preferred embodiment described below and the following drawings attached thereto.

(A) is a top view which shows the connection structure of the wire which concerns on Embodiment 1, (b) is AA sectional drawing of (a). (A) is a top view which shows the connection structure of the wire which concerns on Embodiment 2, (b) is AA sectional drawing of (a). FIG. 3 is a plan view illustrating a configuration of a light-emitting device included in the electric apparatus according to Example 1. FIG. 4 is a cross-sectional view taken along line AA in FIG. 3. FIG. 4 is a sectional view taken along the line CC of FIG. 3. FIG. 4 is a sectional view taken along line BB in FIG. 3. It is a figure which shows the modification of FIG. It is a figure which shows the connection structure of a light-emitting device and an electrical component. FIG. 6 is a diagram illustrating a configuration of an electrical device according to a second embodiment. FIG. 6 is a diagram illustrating a configuration of an electrical device according to a third embodiment. FIG. 6 is a plan view illustrating a configuration of an electric device according to a fourth embodiment. It is a perspective view of an electric equipment. FIG. 9 is a cross-sectional view illustrating a configuration of an electric device according to a fifth embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

(Embodiment 1)
FIG. 1A is a plan view showing a wire connection structure according to the first embodiment, and FIG. 1B is a cross-sectional view taken along the line AA in FIG. In the embodiment, at least the first surface of the substrate 100 is formed of an insulator. A conductor 20 is formed on the first surface. The conductor 20 is covered with a sealing film 210 (covering body). The sealing film 210 is, for example, an aluminum oxide film. An opening 212 is formed in the sealing film 210. The opening 212 is located on a part (for example, one end) of the conductor 20 in a plan view. A wire 30 is connected to the conductor 20. The wire 30 is connected to the conductor 20 by having one end 32 passing through the opening 212. The wire 30 is made of, for example, copper, but may be made of another metal (for example, Au).

In the example shown in FIG. 1A, the conductor 20 is a wiring. The shape (outer shape) of the conductor 20 has a short side direction and a long side direction. The short direction is the width direction of the conductor 20, and the long direction corresponds to the length direction of the conductor 20. The opening 212 crosses the conductor 20 in the width direction (Y direction in FIG. 1A). Specifically, the opening 212 is linear, intersects with the conductor 20, and has an intersection. The length of the opening 212 is longer than the width of the conductor 20. The one end 32 of the wire 30 covers the opening 212 in the width direction of the opening 212 (X direction in FIG. 1A). That is, the size of one end 32 (also referred to as one end portion) of the wire 30 in the width direction of the opening 212 is larger than the width of the opening 212. In the width direction of the conductor 20, one end of the wire covers the conductor 20. Note that a part of the opening 212 may be configured by the surface layer of the conductor 20 being recessed or bent.

According to this embodiment, the conductor 20 is protected by the sealing film 210. Since the opening 212 is provided in the sealing film 210, the one end 32 of the wire 30 can be connected to the conductor 20.

Further, when the conductor 20 is connected to a moisture-sensitive element such as an organic EL element, if the opening 212 is provided, moisture may be transmitted to the element through the conductor 20. On the other hand, in this embodiment, one end 32 of the wire 30 covers the opening 212. For this reason, even if the opening 212 is provided in the sealing film 210, it is possible to suppress the sealing ability of the sealing film 210 against the organic EL element from being reduced due to the opening 212 being provided in the sealing film 210.

The opening 212 crosses the conductor 20 in the width direction (Y direction in FIG. 1A). For this reason, the opening 212 can be formed by moving the jig while being in contact with the sealing film 210. In this case, the opening 212 can be easily formed.

(Embodiment 2)
FIG. 2A is a plan view showing a wire connection structure according to the second embodiment. The present embodiment is the same as the wire connection structure according to the first embodiment, except that the width of the opening 212 is small and the entire opening 212 is covered by the one end 32 of the wire 30. In the example of this figure, the opening 212 shows a case where the wire 30 is formed by penetrating the sealing film 210. When connecting the wire 30 to the conductor 20, one end of the wire 30 is minutely vibrated by ultrasonic waves or the like to crack or break through the sealing film 210. At this time, an opening 212 is formed in the sealing film 210. Further, when the wire 30 is connected, the portion of the sealing film 210 above the connection portion of the conductor 20 is made thinner than the other portions so that the sealing film 210 is easily cracked or pierced. It doesn't matter. Further, not only in the present embodiment but also in the covering body in Embodiment 1 and the examples described later, a part of the covering body may be formed thinner than the other parts.

FIG. 2B is a cross-sectional view taken along the line AA in FIG. In the example shown in this figure, the outer peripheral edge of one end 32 of the wire 30 is located outside the outer peripheral edge of the opening 212 in the sealing film 210, and the sealing film on the outer peripheral edge of the opening 212 or outside thereof. It is arranged on 210. A part of the sealing film 210 located below the one end 32 of the wire 30 includes a part of the sealing film 210 that is a ridge or a part of the sealing film 210 having unevenness. That is, the surface roughness of this part of the sealing film 210 is larger than the surface roughness of the other part of the sealing film 210. This is because when the one end 32 of the wire 30 is connected to the conductor 20, the one end 32 of the wire 30 pushes a part of the sealing film 210 to the outer peripheral edge of the substrate 100, but the opening 212 is formed. This is because wrinkles and irregularities are formed by a part of the sealing film 210 that has been removed. At this time, a part of the sealing film 210 may be broken and left in the opening 212. In the first embodiment, such a structure may be used.

Also in this embodiment, since the opening 212 is provided in the sealing film 210, the one end 32 of the wire 30 can be connected to the conductor 20. One end 32 of the wire 30 covers the entire opening 212. For this reason, even if the opening 212 is provided in the sealing film 210, it can further suppress that the sealing capability of the sealing film 210 falls.

In the first and second embodiments described above, when the conductor 20 is formed of a metal material such as Al, the sealing film 210 is an oxide film formed on the surface layer of the conductor 20 (for example, an oxide film such as aluminum oxide, It may be a naturally formed oxide film or the like. In this case, the opening 212 is formed in the oxide film.

(Example 1)
FIG. 3 is a plan view illustrating a configuration of the light emitting device 10 (functional component) included in the electric apparatus according to the first embodiment. 4 is a cross-sectional view taken along line AA in FIG. 3, FIG. 5 is a cross-sectional view taken along line CC in FIG. 3, and FIG. 6 is a cross-sectional view taken along line BB in FIG. The electric apparatus according to the present embodiment includes a light emitting device 10 and an electric component 70 (shown in FIG. 8).

The light emitting device 10 is, for example, a display or a lighting device. When the light emitting device 10 is a lighting device, the light emitting device 10 may include the first electrode 110, the organic layer 140, and the second electrode 150 to realize color rendering. In the light emitting device 10 as the lighting device, the first electrode 110, the organic layer 140, and the second electrode 150 may be formed on one surface without forming the partition wall 170 as a structure to be described later. In addition, in the following description, the case where the light-emitting device 10 is a display is illustrated.

The light emitting device 10 includes a substrate 100, a first electrode 110 (lower electrode), an organic EL element, an insulating layer 120, a plurality of first openings 122, a plurality of second openings 124, a plurality of lead wires 130, an organic layer 140, a first layer. It has two electrodes 150 (upper electrode), a plurality of lead wires 160, and a plurality of partition walls 170. The insulating layer 120 and the partition 170 are an example of a structure formed over a substrate. The organic EL element is composed of a laminate in which the organic layer 140 is sandwiched between the first electrode 110 and the second electrode 150. This organic EL element is located between the plurality of partition walls 170. That is, the organic EL element and the lead wiring 160 are located on the first surface side of the substrate 100. And the light emission part is comprised by the organic EL element.

The substrate 100 is formed of, for example, glass or a resin material, but may be formed of other materials. The substrate 100 may have flexibility.

The first electrode 110 is formed on the first surface side of the substrate 100 and extends in a line shape in the first direction (Y direction in FIG. 3). The first electrode 110 is a transparent electrode made of an inorganic material such as ITO (Indium Thin Oxide) or IZO (indium zinc oxide), or a conductive polymer such as a polythiophene derivative. The first electrode 110 is formed as a part of the conductor (first conductor). The first electrode 110 may be a metal thin film that is thin enough to transmit light. The end of the first electrode 110 is connected to the lead wiring 130. In the illustrated example, the first conductor is a layer in which the first electrode 110 and the lead wiring 130 are stacked.

The lead wiring 130 is a wiring that connects the first electrode 110 and the outside including electric components such as a driving IC. The lead wire 130 is a metal wire made of a metal material or an alloy such as ITO, IZO, Al, Cr, or Ag, which is an oxidized conductive material, but is a wire formed of a conductive material other than metal. There may be. Further, the lead wiring 130 may have a laminated structure in which a plurality of layers are stacked. In this case, one layer of the lead wiring may be formed of the first conductor, and one layer of the first electrode 110 and the lead wiring 130 may be continuously formed of the first conductor. For example, the lead-out wiring 130 may have a configuration in which an alloy layer of Ni and Mo, an alloy layer of Mo and Nb, an Al layer, and an alloy layer of Ni and Mo are stacked in this order. The lead-out wiring 130 may have a configuration in which an alloy layer of Ni and Nb, an alloy layer of Al and Nd, and an alloy layer of Mo and Nb are stacked in this order.

In the example shown in FIG. 3, the lead wiring 132 and the lead wiring 130 are formed in this order on the substrate 100. The lead-out wiring 132 is formed of the same material as that of the first electrode 110. In the example shown in the drawing, the lead wires 130 and 132 are formed up to the vicinity of the first opening 122 closest to the lead wire 130. In the illustrated example, the first electrode 110 is covered with the insulating layer 120, but at least a part of the lead wiring 130 and the lead wiring 132 electrically connected to the first electrode 110 is covered with the insulating layer 120. It doesn't matter.

The insulating layer 120 is formed on and between the plurality of first electrodes 110 as shown in FIGS. The insulating layer 120 is a photosensitive resin such as a polyimide resin, and is formed in a desired pattern by being exposed and developed. As the insulating layer 120, for example, a positive photosensitive resin is used. The insulating layer 120 may be a resin other than a polyimide resin, for example, an epoxy resin or an acrylic resin.

A plurality of first openings 122 and a plurality of second openings 124 are formed in the insulating layer 120. The first opening 122 is located at the intersection of the second conductor 152 that becomes the first electrode 110 and the second electrode 150 in plan view. A portion of the second conductor 152 located in the first opening 122 serves as the second electrode 150. The plurality of first openings 122 are provided at predetermined intervals. The plurality of first openings 122 are arranged in the direction in which the first electrode 110 extends. The plurality of first openings 122 are also arranged in the extending direction of the second conductor 152. For this reason, the plurality of first openings 122 are arranged to form a matrix.

The second opening 124 is located at one end of each of the plurality of second conductors 152 in plan view. The second openings 124 are arranged along one side of the matrix formed by the first openings 122. When viewed in a direction along one side (for example, the Y direction in FIG. 3), the second openings 124 are arranged at a predetermined interval in the direction along the first electrode 110. The lead wiring 160 or a part of the lead wiring 160 is exposed from the second opening 124.

Note that the insulating layer 120 having the first opening 122 and the insulating layer 120 having the second opening 124 may be formed of the same material or different materials. Alternatively, the insulating layer 120 having the second opening 124 may be formed on the outer peripheral side of the substrate 100 with respect to the insulating layer 120 having the first opening 122. The insulating layer 120 having the first opening 122 and the insulating layer 120 having the second opening 124 may be continuous layers or separated layers (separated layers).

In the region overlapping with the first opening 122, an organic layer 140 is formed. The organic layer 140 is formed by stacking, for example, a hole transport layer, a light emitting layer, and an electron transport layer. In the following description, a part of the organic layer refers to, for example, a hole transport layer, a light emitting layer, an electron transport layer, a hole injection layer described later, or an electron injection layer. The hole transport layer is in contact with the first electrode 110, and the electron transport layer is in contact with the second electrode 150. In this way, the organic layer 140 is sandwiched between the first electrode 110 and the second electrode 150.

A hole injection layer may be formed between the first electrode 110 and the hole transport layer, or an electron injection layer may be formed between the second electrode 150 and the electron transport layer. . Also, not all of the above layers are necessary. For example, when recombination of holes and electrons occurs in the electron transport layer, the light-emitting layer is unnecessary because the electron transport layer also functions as the light-emitting layer. In addition, at least one of the first electrode 110, the hole injection layer, the hole transport layer, the electron transport layer, the electron injection layer, and the second conductor 152 to be the second electrode 150 is an inkjet method or the like. It may be formed using a coating method. Further, an electron injection layer made of an inorganic material such as LiF may be provided between the organic layer 140 and the second electrode 150.

In the example shown in FIG. 4 and FIG. 5, each layer constituting the organic layer 140 is shown to protrude to the outside of the first opening 122. And as shown in FIG. 5, each layer which comprises the organic layer 140 may be continuously formed between the adjacent 1st opening 122 in the direction where the partition 170 is extended, or continuously. It may not be formed. However, as shown in FIG. 6, the organic layer 140 is not formed in the second opening 124.

As described above, the organic layer 140 is sandwiched between the first electrode 110 and the second electrode 150. As shown in FIGS. 3 to 6, the second electrode 150 is formed above the organic layer 140 and extends in a second direction (X direction in FIG. 3) intersecting the first direction. The second electrode 150 is electrically connected to the organic layer 140. For example, the second electrode 150 may be formed on the organic layer 140 or may be formed on a conductive layer formed on the organic layer 140. The second conductor 152 serving as the second electrode 150 is a metal layer formed of a metal material such as Ag or Al, or a layer formed of an oxidized conductive material such as IZO. The light emitting device 10 includes a plurality of second conductors 152 that are parallel to each other. One second conductor 152 is formed in a direction passing over the plurality of first openings 122. The second conductor 152 is connected to the lead wiring 160. In the illustrated example, the end portion of the second conductor 152 is positioned on the second opening 124, whereby the second conductor 152 and the lead-out wiring 160 are connected in the second opening 124.

In the example of FIG. 3, a lead wire 162 is formed under the lead wire 160. In the example shown in FIG. 3, the width of the lead wiring 162 is larger than the width of the lead wiring 160, but may be small. The lead wires 160 and 162 are formed in a region where the first electrode 110 and the lead wires 130 and 132 are not formed on the first surface side of the substrate 100. The lead wiring 160 may be formed simultaneously with the lead wiring 130, for example, or may be formed in a separate process from the lead wiring 130. Similarly, the lead wiring 162 may be formed simultaneously with the lead wiring 132, for example, or may be formed in a separate process from the lead wiring 132.

The lead-out wiring 162 is formed of the same or different material as the material constituting the first electrode 110. Here, as an example of the same type of material, when the first electrode 110 is formed of ITO, which is an oxidized conductive material, an oxide conductive material such as ITO having the same or different composition as the ITO constituting the first electrode 110, or IZO. Materials. Examples of different materials include metal materials such as Al.

A part of one end side (light emitting part side) of the lead wiring 160 is covered with the insulating layer 120 and exposed through the second opening 124. In the second opening 124, the second conductor 152 is connected to the lead wiring 160. A part of the other end side (outer peripheral side of the substrate) of the lead wiring 160 is drawn to the outside of the insulating layer 120. That is, the other end side of the lead wiring 160 is exposed from the insulating layer 120.

A partition wall 170 is formed between the adjacent second conductors 152. The partition wall 170 extends in parallel with the second conductor 152, that is, in the second direction. The base of the partition wall 170 is, for example, the insulating layer 120. The partition 170 is, for example, a photosensitive resin such as a polyimide resin, and is formed in a desired pattern by being exposed and developed. The partition wall 170 is formed using, for example, a negative photosensitive resin. The partition wall 170 may be made of a resin other than a polyimide resin, for example, an inorganic material such as an epoxy resin, an acrylic resin, or silicon dioxide.

The partition wall 170 has a trapezoidal cross-sectional shape (reverse trapezoid). That is, the width of the upper surface of the partition wall 170 is larger than the width of the lower surface of the partition wall 170. Therefore, by forming the partition wall 170 in front of the second conductor 152 (second electrode 150), the second conductor 152 is formed on the first surface s side of the substrate 100 using a vapor deposition method or a sputtering method. The plurality of second electrodes 150 can be formed in a lump by forming them on one surface. Since the second conductor 152 formed on one surface is divided by the partition wall 170, a plurality of second conductors 152 are provided on the organic layer 140. The position at which the second conductor 152 is divided includes, for example, the insulating layer 120 that is the base of the partition 170, the side surface of the partition 170, or the like. Then, by changing the extending direction of the partition wall 170, the second conductor 152 can be patterned into a free shape such as a stripe shape, a dot shape, an icon shape, or a curve. Note that a second conductor 152 is formed on the partition wall 170.

Further, when the organic layer 140 is made of a coating material, the organic layer 140 is formed by applying the coating material to the plurality of first openings 122. When the coating material is applied to the plurality of first openings 122, the partition 170 is connected to the first openings 122 on both sides of the partition 170, and the first opening on one side of the partition 170 is connected to each other. It may have a function of preventing the organic layer 140 from being continuously formed from 122 to the first opening 122 on the other side. In this case, the partition wall 170 is formed before the organic layer 140.

A sealing film 210 is formed above the second conductor 152. The sealing film 210 is an aluminum oxide film, for example, and is formed using, for example, an ALD (Atomic Layer Deposition) method. In the example shown in this figure, the sealing film 210 is formed on the second conductor 152, but another film may exist between the second conductor 152 and the sealing film 210. The film thickness of the sealing film 210 is, for example, not less than 10 nm and not more than 30 nm. A film formed by the ALD method has high step coverage. Here, the step coverage means the uniformity of the film thickness in a portion where there is a step. High step coverage means that film thickness uniformity is high even in a stepped portion, and low step coverage means that film thickness uniformity is low in a stepped portion. As shown in FIG. 3, the sealing film 210 covers the insulating layer 120, the extraction wiring 160, and the extraction wiring 130. Note that the sealing film 210 may be formed using a film formation method other than the ALD method, for example, a CVD method.

The lead wire 130 and the lead wire 160 correspond to the conductor 20 in the embodiment. As shown in FIG. 8, the lead wiring 130 and the lead wiring 160 are connected to the electrical component 70, for example, the control IC via the wire 30. The wire 30 passes through the opening 212 provided in the sealing film 210 and is connected to different lead wires 130 (or lead wires 160).

The opening 212 may be formed when the wire 30 is connected to the lead wiring 130 and the lead wiring 160. As described above, when the wire 30 is connected to the lead-out wiring 130 and the lead-out wiring 160, one end portion of the wire 30 is microvibrated by ultrasonic waves or the like to crack or break through the sealing film 210. At this time, an opening 212 is formed in the sealing film 210.

Further, in order to easily form or break a crack in the sealing film 210 by the connection of the wire 30, a part of the sealing film 210 that is on the connection portion with the wire 30 of the lead-out wirings 130 and 160 is replaced with another part. It may be formed thinner than the portion. All the thinly formed portions of the sealing film 210 may be located in the opening 212, or a part may be located outside the opening 212. As long as a crack or the like is generated in the sealing film 210 and the wire 30 can pass through the sealing film 210, the thickness and distribution of the sealing film 210 are not particularly limited.

In the example shown in the figure, the substrate 100 has a polygonal shape such as a square, a rectangle, or a rectangle. This polygon includes a shape with rounded corners. A plurality of end portions (part) of the lead wires 130 and 132 and end portions (part) of the lead wires 160 and 162 are arranged in parallel along one side of the substrate 100. Therefore, at least one of the end portions of the lead wires 130 and 132 and the end portions of the lead wires 160 and 162 is positioned in parallel inside one opening 212. In the opening 212, the end portions of the lead wirings 130 and 132 and the end portions of the lead wirings 160 and 162 are exposed or appear with respect to the sealing film 210.

However, as shown in FIG. 7, the opening 212 may be provided individually for each of the end portions of the lead wires 130 and 132 and the end portions of the lead wires 160 and 162. In this case, it can suppress that the one end 32 of the adjacent wire 30 mutually short-circuits.

3 and 7, the wire 30 to be connected to the first electrode 110 is connected to the lead wire 130 through the opening 212, and the wire 30 to be connected to the second electrode 150 is The lead wire 160 is connected to the lead wire 160 through the opening 212.

Next, a method for manufacturing the light emitting device 10 will be described. First, a conductive layer to be the first electrode 110 is formed on the substrate 100, and this conductive layer is selectively removed using etching (for example, dry etching or wet etching). As a result, the first electrode 110 and the lead wires 132 and 162 are formed on the substrate 100.

Next, a conductive layer to be the lead wirings 130 and 160 is formed on the substrate 100, the first electrode 110, and the lead wiring 162, and the conductive layer is etched (for example, dry etching or wet etching). Selectively remove. Thereby, the lead wires 130 and 160 are formed.

Next, an insulating layer is formed on the substrate 100, the first electrode 110, and the lead wires 130 and 160, and this insulating layer is selectively removed using etching (for example, dry etching or wet etching). Thereby, the insulating layer 120, the first opening 122, and the second opening 124 are formed. For example, when the insulating layer 120 is formed of polyimide, the insulating layer 120 is subjected to heat treatment. Thereby, imidation of the insulating layer 120 proceeds.

Next, an insulating film to be the partition wall 170 is formed on the insulating layer 120, and this insulating film is selectively removed using etching (for example, dry etching or wet etching). Thereby, the partition 170 is formed. In the case where the partition 170 is formed using a photosensitive insulating film, the cross-sectional shape of the partition 170 can be changed to an inverted trapezoid by adjusting the conditions during exposure and development.

When the partition wall 170 is a negative resist, the portion of the negative resist irradiated with the irradiation light from the exposure light source is cured. The partition 170 is formed by dissolving and removing the uncured portion of the negative resist with a developer.

Next, each layer to be an organic layer is sequentially formed in the first opening 122. Among these layers, at least the hole injection layer is formed using a coating method such as spray coating, dispenser coating, inkjet, or printing. In this case, the coating material enters the first opening 122, and the coating material is dried, whereby the above-described layers are formed. As a coating material used in the coating method, a polymer material, a polymer material containing a low-molecular material, or the like is suitable. As the coating material, for example, a polyalkylthiophene derivative, a polyaniline derivative, triphenylamine, a sol-gel film of an inorganic compound, an organic compound film containing a Lewis acid, a conductive polymer, or the like can be used. The remaining layers (for example, electron transport layers) of the organic layer 140 are formed by a vapor deposition method. However, these layers may also be formed using any of the above-described coating methods.

Next, the second electrode 150 is formed on the organic layer 140 by using, for example, a vapor deposition method or a sputtering method.

Note that at least one of the layers other than the organic layer 140, for example, the first electrode 110, the insulating layer 120, the lead-out wiring 130, the lead-out wiring 160, the second electrode 150, and the partition wall 170 is also formed using any of the above-described coating methods. It may be formed.

Next, the sealing film 210 is formed using the method described above. Thereafter, a resist pattern is formed on the sealing film 210, and the sealing film 210 is selectively etched (for example, dry etching or wet etching) using the resist pattern as a mask. Thereby, an opening 212 is formed in the sealing film 210. Note that the opening 212 may be formed by moving the jig in contact with the sealing film 210. Note that in the case where a part of the sealing film 210 is formed thinner than the other part, the etching time of the sealing film 210 may be shortened and etching may be stopped before opening.

Thereafter, the wire 30 is connected to each of the plurality of lead wires 130 and the plurality of lead wires 160.

Also in this embodiment, since the opening 212 is provided in the sealing film 210, the one end 32 of the wire 30 can be connected to the conductor 20. One end 32 of the wire 30 covers the opening 212. For this reason, even if the opening 212 is provided in the sealing film 210, it can suppress that the sealing capability of the sealing film 210 falls.

Moreover, compared with the case where the light-emitting device 10 and the electrical component 70 are connected using a flexible substrate, the width | variety of the part which does not become a light emission area among the edges of the light-emitting device 10 can be narrowed.

(Example 2)
FIG. 9 is a diagram illustrating the configuration of the electrical device according to the second embodiment. The electrical device according to the present embodiment has the same configuration as the electrical device according to the first embodiment except for the following points. In the drawing, the drawing of the lead wires 130 and 132, the lead wires 160 and 162, and the sealing film 210 is omitted.

First, the light emitting device 10 has a sealing resin layer 300. The sealing resin layer 300 is formed using, for example, a mold. A circuit board 75 is formed on the sealing resin layer 300. The circuit board 75 has a control IC. The lead wires 130 and 160 of the light emitting device 10 are connected to the circuit board 75 via the wires 30.

Also in this embodiment, since the opening 212 is provided in the sealing film 210, the one end 32 of the wire 30 can be connected to the conductor 20. One end 32 of the wire 30 covers the opening 212. For this reason, even if the opening 212 is provided in the sealing film 210, it can suppress that the sealing capability of the sealing film 210 falls.

(Example 3)
FIG. 10 is a diagram illustrating the configuration of the electrical device according to the third embodiment. The electrical device according to the present embodiment has the same configuration as the electrical device according to the second embodiment, except that the sealing plate 102 is used instead of the sealing resin layer 300.

Specifically, a plurality of electrical components 70 such as a semiconductor package are provided on the sealing plate 102. A conductor 20 is provided on the sealing plate 102. In this embodiment, the conductor 20 is a wiring and is connected to the electrical component 70. One end 32 of the wire 30 is connected to the lead wiring 130 (or the lead wiring 160), and the other end of the wire 30 is connected to the conductor 20 on the sealing plate 102. The connection between the first conductor 20 and the wire 30 can also be confirmed by the same method as in the embodiment.

Also in this embodiment, since the opening 212 is provided in the sealing film 210, the one end 32 of the wire 30 can be connected to the conductor 20. One end 32 of the wire 30 covers the opening 212. For this reason, even if the opening 212 is provided in the sealing film 210, it can suppress that the sealing capability of the sealing film 210 falls.

Example 4
FIG. 11 is a plan view illustrating the configuration of the electrical device according to the fourth embodiment. FIG. 12 is a perspective view of the electrical apparatus. The electric apparatus according to the present embodiment has a configuration in which a plurality of light emitting devices 10 are arranged in a matrix. The gap between adjacent light emitting devices 10 is as narrow as possible. The light emitting device 10 has the configuration shown in any one of the second and third embodiments. For this reason, the width | variety of the part which does not become a light emission area | region among the edges of the light-emitting device 10 is narrow, As a result, even if it makes several light-emitting devices 10 light-emit simultaneously, the boundary of the light-emitting device 10 is not conspicuous. For this reason, one image can be displayed using the plurality of light emitting devices 10.

The external connection unit 60 is provided near the light emitting devices 10 arranged in a matrix. The external connection unit 60 is a part for connecting an electrical device to the outside. The external connection unit 60 and the light emitting device 10 located next to the external connection unit 60 are connected to each other through the wire 30. In addition, each of the plurality of light emitting devices 10 is electrically connected to the light emitting device 10 located adjacent thereto via a wire 30. Therefore, the light emitting device 10 that is not located next to the external connection unit 60 among the plurality of light emitting devices 10 can be electrically connected to the external connection unit 60 via the other light emitting devices 10.

Also in this embodiment, since the opening 212 is provided in the sealing film 210, the one end 32 of the wire 30 can be connected to the conductor 20. One end 32 of the wire 30 covers the opening 212. For this reason, even if the opening 212 is provided in the sealing film 210, it can suppress that the sealing capability of the sealing film 210 falls.

Furthermore, since the width of the portion of the edge of the light emitting device 10 that does not become the light emitting region can be narrowed, even if a plurality of light emitting devices 10 emit light simultaneously, the boundaries of the light emitting devices 10 are not noticeable. Therefore, one image can be displayed using the plurality of light emitting devices 10.

(Example 5)
FIG. 13 is a cross-sectional view illustrating the configuration of the electrical device according to the fifth embodiment. The electric apparatus according to the present embodiment has a liquid crystal display unit. In the liquid crystal display unit, a liquid crystal layer 52 is provided between a transparent substrate 54 and a transparent substrate 56, and the liquid crystal layer 52 is sealed with a sealing layer 57. In this embodiment, since the opening 212 is provided in the oxide film formed on the conductor 20 or the protective film (coating film) that protects the conductor 20, one end 32 of the wire 30 is connected to the conductor 20. Can do. One end 32 of the wire 30 covers the opening 212. For this reason, even if the opening 212 is provided in the oxide film or the protective film, the physical properties such as the increase in the conductivity of the conductor 20 can be suppressed. The oxide film described above is a metal oxide film such as aluminum oxide when the conductor 20 is formed of a metal material such as Al. The protective film described above is formed of an inorganic material such as Ni, Mo, or Nb. Examples of protective films include a single layer made of Ni and Mo material, a single layer made of Mo and Ni, a single layer made of Ni and Nb material, and a single layer made of Mo and Nb material. It may be a single layer or a laminate in which two or more of these single layers are laminated. You may make it function as a protective film and may provide other functions, such as covering the conductor 20. FIG. The illustration of the oxide film, protective film, and opening 212 is omitted.

An electrical component 70 is mounted on the transparent substrate 54. The electrical component 70 is a control IC for the liquid crystal display unit. The electrical component 70 is connected to a wiring (conductor 20) provided on the transparent substrate 54. The end portion of the first conductor 20 is connected to the external connection terminal 72 through the wire 30. The electrical component 70 and the wire 30 are sealed with a sealing resin 58. In plan view, the end of the external connection terminal 72 is located outside the sealing resin 58.

Also in this embodiment, since the opening 212 is provided in the sealing film 210, the one end 32 of the wire 30 can be connected to the conductor 20. One end 32 of the wire 30 covers the opening 212. For this reason, even if the opening 212 is provided in the sealing film 210, it can suppress that the sealing capability of the sealing film 210 falls.

As mentioned above, although embodiment and the Example were described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable. In addition, each technical matter described in each embodiment may be combined with a technical matter described in another embodiment, and these combinations are also the invention of the present application.

Claims (10)

A substrate and a wire,
The substrate has a conductor and a covering covering the conductor,
The wire connection structure, wherein the wire passes through the opening of the covering and connects to the conductor. The wire connection structure according to claim 1, wherein an end portion of the wire on the conductor side covers an opening of the covering body. 3. The wire connection structure according to claim 2, wherein an end of the wire on the conductor side covers the entire opening of the covering. The wire connection structure according to claim 3, wherein the opening of the covering is linear. 5. The wire connection structure according to claim 4, wherein the covering located around the opening has a ridge or an unevenness. A plurality of the conductors are arranged in parallel on the substrate,
6. The wire connection structure according to claim 5, wherein the different wires are connected to each of the plurality of conductors. The wire connection structure according to claim 6, wherein the conductor is connected to an organic EL element formed on the substrate. The wire connection structure according to claim 7, wherein the conductor is connected to an electrical component via the wire. 9. The wire connection structure according to claim 8, wherein the covering is a sealing film. A functional component having a substrate, a conductor formed on the substrate, and a covering covering the conductor;
A wire connected to the functional component;
With
The electric device is characterized in that the wire is connected to the conductor through an opening provided in the covering.

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