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WO2014030276A1 - Lampe à ampoule et dispositif d'éclairage - Google Patents

Lampe à ampoule et dispositif d'éclairage Download PDF

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Publication number
WO2014030276A1
WO2014030276A1 PCT/JP2013/002921 JP2013002921W WO2014030276A1 WO 2014030276 A1 WO2014030276 A1 WO 2014030276A1 JP 2013002921 W JP2013002921 W JP 2013002921W WO 2014030276 A1 WO2014030276 A1 WO 2014030276A1
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WO
WIPO (PCT)
Prior art keywords
substrate
led
metal
light
shaped lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/002921
Other languages
English (en)
Japanese (ja)
Inventor
直紀 田上
敏明 倉地
功幸 長浜
考志 大村
健太 渡邉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of WO2014030276A1 publication Critical patent/WO2014030276A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the present invention relates to a light bulb shaped lamp and a lighting device, for example, a light bulb shaped lamp using a semiconductor light emitting element and a lighting device using the same.
  • LEDs Light Emitting Diodes
  • LEDs Light Emitting Diodes
  • LED lamp there is a bulb-shaped LED lamp (bulb-shaped LED lamp).
  • bulb-shaped LED lamp an LED module including a substrate and a plurality of LEDs mounted on the substrate is used.
  • Patent Document 1 discloses a conventional bulb-type LED lamp.
  • a bulb-type LED lamp having a configuration simulating an incandescent bulb has been studied.
  • a bulb-type LED lamp having a configuration in which the LED module is held hollow at the center position in the globe using the same globe (glass bulb) used for an incandescent bulb has been studied.
  • a metal support (stem) configured to extend from the opening of the globe toward the center of the globe is disposed, and the LED module is fixed to the top of the metal support.
  • the LED module is patterned on the surface of the substrate, the plurality of LED chips mounted on the surface of the substrate (the surface on the top of the globe), the phosphor-containing resin that collectively seals the plurality of LED chips, and the surface of the substrate.
  • Metal wiring is patterned on the surface of the substrate, the plurality of LED chips mounted on the surface of the substrate (the surface on the top of the globe), the phosphor-containing resin that collectively seals the plurality of LED chips, and the surface of the substrate.
  • connection portion module electrode
  • the connecting portion electrically connects the through hole provided in the substrate, and the two lead wires inserted into the through hole from the back surface to the front surface of the substrate and the metal wiring (electrode terminal). It is comprised with solder.
  • the LED chip and the metal wiring are provided only on the surface of the substrate, basically, Only the insulation distance between the connecting portion (module electrode) and the metal column needs to be noted.
  • a conductive member such as an LED chip or metal wiring is provided on the back surface (surface on the metal support side) of the substrate, the conductive member (LED chip or metal wiring) on the back surface side of the substrate and the metal support column. It is necessary to secure an insulation distance between the two.
  • the present invention has been made in order to solve such a problem.
  • the LED module is fixed to a metal column, and the conductive member (LED or the like) of the LED module is formed on the metal column side.
  • Another object of the present invention is to provide a light bulb shaped lamp and a lighting device that can easily ensure a predetermined withstand voltage.
  • one aspect of a light bulb shaped lamp according to the present invention includes a translucent glove, a metal support provided to extend inward of the glove, and a glove disposed in the glove.
  • a light emitting module fixed to the metal column the light emitting module comprising: a substrate; and a plurality of first light emitting elements provided on a first surface of the substrate on the metal column side; A metal wiring formed on the first surface; and an insulating sealing member that seals the plurality of first light emitting elements and the metal wiring, and the metal column among the conductive members of the light emitting module.
  • the thickness from the conductive member having the shortest distance from the surface to the surface of the sealing member is a thickness that satisfies a predetermined withstand voltage.
  • the conductive member having a shortest distance from the metal support may be the metal wiring.
  • the shortest distance may be a distance between the metal support and the metal wiring on the first surface.
  • the sealing member is a silicone resin and the predetermined withstand voltage is 1.5 kV, the thickness is 0.15 mm or more. Also good.
  • the sealing member is a silicone resin and the predetermined withstand voltage is 4.0 kV, the thickness is 0.40 mm or more. Also good.
  • the sealing member may be low melting point glass.
  • a wavelength conversion material may be contained in the sealing member.
  • a plurality of second light emitting elements are provided on a second surface which is a surface opposite to the first surface of the substrate. It is good.
  • the substrate includes a main substrate on which the plurality of first light emitting elements are provided on the surface, and a sub substrate on which the plurality of second light emitting elements are provided on the surface.
  • the main substrate and the sub-substrate may be arranged such that back surfaces on which the plurality of first light emitting elements and the plurality of second light emitting elements are not provided are opposed to each other.
  • an aspect of the lighting device according to the present invention includes any one of the above light bulb shaped lamps.
  • FIG. 1 is a side view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 4 is a diagram showing a configuration of a light bulb shaped lamp according to an embodiment of the present invention, where (a) is a top view, and (b), (c), (d), and (e) are cross-sectional views. .
  • FIG. 5 is an enlarged cross-sectional view of an LED in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 5 is an enlarged cross-sectional view of an LED in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 6 is an enlarged cross-sectional view of a main part of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 7 is an enlarged cross-sectional view of a main part of a light bulb shaped lamp according to a first modification of the embodiment of the present invention.
  • FIG. 8 is an enlarged cross-sectional view of a main part of a light bulb shaped lamp according to a second modification of the embodiment of the present invention.
  • FIG. 9 is a diagram illustrating a configuration of a light bulb shaped lamp according to a third modification of the embodiment of the present invention, in which (a) is a top view, and (b), (c), (d), and (e) are illustrated. It is sectional drawing.
  • FIG. 10 is a cross-sectional view of a light bulb shaped lamp according to another modification of the embodiment of the present invention.
  • FIG. 11 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.
  • FIG. 1 is a side view of a light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the present embodiment.
  • the upper side of the paper is the front of the light bulb shaped lamp 1
  • the lower side of the paper is the rear of the light bulb shaped lamp 1
  • the left and right sides of the paper are the sides of the light bulb shaped lamp 1.
  • “rear” refers to the direction of the base with respect to the substrate of the LED module
  • “front” refers to the direction of the opposite side of the base with respect to the substrate of the LED module. That is, the “side” means a direction parallel to the main surface of the substrate of the LED module.
  • the alternate long and short dash line drawn in the vertical direction of the drawing indicates the lamp axis J (center axis) of the light bulb shaped lamp 1.
  • the lamp axis J is an axis serving as a rotation center when the light bulb shaped lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base.
  • the light bulb shaped lamp 1 is an example of a light source for illumination, and is a light bulb shaped LED lamp (LED light bulb) that is a substitute for a light bulb shaped fluorescent lamp or an incandescent light bulb.
  • the light bulb shaped lamp 1 includes a translucent globe 10, LED modules 20a and 20b that are light sources, a base 30 that receives power from the outside of the lamp, a metal support 40, a support base 50, a resin case 60, a lead Line 70 and lighting circuit 80 are provided.
  • the bulb-shaped lamp 1 includes an envelope formed by the globe 10, the resin case 60 (first case portion 61), and the base 30. Moreover, the light bulb shaped lamp 1 in the present embodiment is configured to have a brightness equivalent to the 60 W type.
  • the globe 10 is a translucent cover that houses the LED modules 20a and 20b and transmits light from the LED modules 20a and 20b to the outside of the lamp.
  • the light of the LED modules 20 a and 20 b that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted to the outside of the globe 10.
  • the globe 10 in the present embodiment is made of a material that is transparent to the light from the LED modules 20a and 20b.
  • a globe 10 for example, a glass bulb (clear bulb) made of silica glass that is transparent to visible light can be used.
  • the LED modules 20 a and 20 b housed in the globe 10 can be viewed from the outside of the globe 10.
  • the globe 10 has a shape in which one end is closed in a spherical shape and an opening 11 is provided at the other end.
  • the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is formed at a position away from the center of the sphere.
  • a glass bulb having the same shape as a general incandescent bulb can be used.
  • a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.
  • the globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function.
  • a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 10.
  • the material of the globe 10 is not limited to a glass material, and a resin material such as a synthetic resin such as acrylic (PMMA) or polycarbonate (PC) may be used.
  • the LED modules 20a and 20b are light emitting modules that have LEDs (LED chips) and emit light when electric power is supplied to the LEDs via the lead wires.
  • the LED modules 20 a and 20 b are held in the hollow inside the globe 10 by the metal support 40.
  • the LED modules 20a and 20b are preferably arranged at a spherical central position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large).
  • the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to a general incandescent light bulb using a conventional filament coil. .
  • the base 30 is a power receiving unit that receives power for causing the LEDs of the LED modules 20 a and 20 b to emit light from the outside of the light bulb shaped lamp 1.
  • the base 30 receives AC power through two contacts, and the power received by the base 30 is input to the power input unit of the lighting circuit 80 via a lead wire.
  • AC power is supplied to the base 30 from a commercial power supply (AC 100 V).
  • the base 30 is attached to a socket of a lighting fixture (lighting device) and receives AC power from the socket. Thereby, the light bulb shaped lamp 1 (LED modules 20a and 20b) is turned on.
  • the base 30 has a metal bottomed cylindrical shape (cap shape), and includes a shell portion whose outer peripheral surface is a male screw and an eyelet portion attached to the shell portion via an insulating portion.
  • a screwing portion for screwing with the socket of the lighting device is formed on the outer peripheral surface of the base 30, and a screwing portion for screwing with the resin case 60 is formed on the inner peripheral surface of the base 30.
  • the type of the base 30 is not particularly limited, but in the present embodiment, a screwed-type Edison type (E type) base is used.
  • E type screwed-type Edison type
  • a plug-type base may be used as the base 30.
  • the metal column 40 is a metal stem provided so as to extend from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10, and serves as a holding member that holds the LED modules 20 a and 20 b in the globe 10. Function. One end of the metal column 40 is connected to the LED modules 20 a and 20 b, and the other end is connected to the support base 50.
  • the metal column 40 also functions as a heat radiating member for radiating heat generated in the LED modules 20a and 20b to the base 30 side. Therefore, the metal support 40 is composed of a metal material having a high thermal conductivity, for example, aluminum (Al), copper (Cu) or iron (Fe) having a thermal conductivity of about 237 [W / m ⁇ K] as a main component. Therefore, the heat radiation efficiency by the metal support
  • the metal support column 40 is configured by, for example, integrally molding a main shaft portion 41 and a fixed portion 42.
  • the main shaft portion 41 is a cylindrical member having a constant cross-sectional area.
  • One end of the main shaft portion 41 is connected to the fixed portion 42, and the other end is connected to the support base 50.
  • the fixing part 42 has a fixing surface to which the LED modules 20a and 20b are fixed, and this fixing surface is in contact with the back surfaces of the substrates of the LED modules 20a and 20b.
  • the fixing portion 42 further has a protruding portion that protrudes from the fixing surface, and this protruding portion fits into a through hole provided in the substrate of the LED modules 20a and 20b.
  • the LED modules 20a and 20b and the fixing surface of the fixing portion 42 are bonded with, for example, an adhesive of a resin such as a silicone resin.
  • the fixing part 42 of the metal column 40 has a cross-sectional area perpendicular to the lamp axis J (width in the direction perpendicular to the lamp axis J) larger than the main axis part 41 of the metal column 40.
  • pillar 40 has a cross section perpendicular
  • the fixing portion 42 of the metal support column 40 has a wider width in the LED element array direction of the LED modules 20 a and 20 b and in the LED array direction in the element array.
  • the metal strut 40 has the largest cross-sectional area perpendicular to the lamp axis J on the fixing surface of the fixing portion 42 in contact with the substrates of the LED modules 20a and 20b.
  • the metal column 40 configured in this manner, it is possible to suppress the vignetting of the LED module 20b by the metal column 40 while widening the heat dissipation path from the LED module 20b to the metal column 40. That is, since the metal support column 40 has a shape in which the width thereof is increased near the LED modules 20a and 20b, the heat generated in the LED modules 20a and 20b can be efficiently released to the wide metal support column 40. , It is possible to suppress a decrease in luminous efficiency and lifetime of the LED.
  • the metal support column 40 has a shape whose width becomes narrower as it moves away from the LED modules 20a and 20b, it is possible to suppress the vignetting of the light of the LED modules 20a and 20b by the metal support column 40 and to improve the light extraction efficiency. The decrease can be suppressed.
  • the fixing surface of the fixing portion 42 of the metal support column 40 is surface-treated so as to reflect the light of the LED of the LED module 20b.
  • the surface of the metal column 40 is configured to have a light reflectance of 30% or more with respect to light emitted from the element rows of the LEDs 22a and 22b and the element row of the LEDs 32.
  • the substrate 21 is fixed to the metal column 40 so that the back surface is in contact with the metal column 40.
  • the shape of the metal support column 40 is a tapered shape in which the width of the LED element rows of the LED modules 20a and 20b in the LED modules 20a and 20b gradually increases toward the substrate 21. It may be a shape.
  • the fixing portion 42 of the metal support column 40 has a shape that widens toward the substrate 21.
  • the metal support column 40 is not limited to this as long as the metal support column 40 has a shape in which the width of the LED element rows of the LED modules 20a and 20b extends toward the substrate 21 as a whole. In other words, the metal support column 40 only needs to have a shape in which the width of the metal support column 40 in the arrangement direction of the LED element rows of the LED modules 20a and 20b is the maximum at the portion in contact with the LED modules 20a and 20b.
  • the width of the LED element rows of the LED modules 20 a and 20 b is constant toward the substrate 21, and the main shaft portion 41 of the metal column 40 has a width toward the substrate 21. It may have a widening shape. Further, both the main shaft portion 41 and the fixed portion 42 of the metal support column 40 may have a shape whose width increases toward the substrate 21.
  • the support base (support plate) 50 is a support member that supports the metal support column 40 and is fixed to the resin case 60.
  • the support base 50 is configured to be connected to the opening end of the opening 11 of the globe 10 and close the opening 11 of the globe 10.
  • the support base 50 is formed of a disk-shaped member having a stepped portion on the periphery, and the opening end of the opening 11 of the globe 10 is in contact with the stepped portion. And in this level
  • the support base 50 is made of a metal material having a high thermal conductivity such as aluminum, so that the heat radiation efficiency of the LED modules 20a and 20b that thermally conducts the metal support column 40 by the support base 50. Is increased. As a result, it is possible to further suppress the decrease in the luminous efficiency and the lifetime of the LED due to the temperature increase.
  • pillar 40 may be integrally shape
  • the resin case 60 is an insulating case (circuit holder) for insulating the metal support column 40 and the base 30 and accommodating the lighting circuit 80.
  • the resin case 60 has a first case portion 61 having a large-diameter cylindrical shape and a first case having a small-diameter cylindrical shape. 2 case part 62 is comprised.
  • the resin case 60 is formed by, for example, polybutylene terephthalate (PBT).
  • the second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 30, and a screwing portion for screwing with the base 30 is formed on the outer peripheral surface of the second case portion 62. ing.
  • the two lead wires 70 are a pair of lead wires for supplying power for lighting the LED modules 20a and 20b from the lighting circuit 80 to the LED modules 20a and 20b. From the wire-like metal wires such as copper wires Can be configured. Each lead wire 70 is disposed in the globe 10, one end is electrically connected to the external terminals of the LED modules 20 a and 20 b, and the other end is electrically connected to the power output unit of the lighting circuit 80, in other words, the base 30. Has been.
  • the two lead wires 70 are, for example, vinyl wires composed of a metal core wire and an insulating resin that covers the core wire, and the LED modules 20a and 20b are not covered with the insulating resin and the surface is exposed. It is electrically connected via the core wire. At this time, the core wire may not be covered with the insulating resin between the portion of the two lead wires 70 protruding from the surface of the substrate 21 and the portion protruding from the back surface of the substrate 21 by 3 mm or less.
  • the lighting circuit 80 is a drive circuit (circuit unit) for lighting the LEDs of the LED modules 20 a and 20 b and is covered with a resin case 60.
  • the lighting circuit 80 includes a circuit that converts AC power fed from the base 30 into DC power, and supplies the converted DC power to the LEDs of the LED modules 20 a and 20 b via the two lead wires 70.
  • the lighting circuit 80 includes, for example, a circuit board and a plurality of circuit elements (electronic components) mounted on the circuit board.
  • the circuit board is a printed board on which metal wiring is patterned, and electrically connects a plurality of circuit elements mounted on the circuit board.
  • the circuit board is arranged in a posture in which the main surface is orthogonal to the lamp axis.
  • the circuit elements are, for example, various capacitors, resistor elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, diodes, or integrated circuit elements, and the lighting circuit 80 is a circuit element among these circuit elements. It is configured by selecting as appropriate.
  • the light bulb shaped lamp 1 is not necessarily provided with the lighting circuit 80.
  • the lighting circuit 80 is not limited to a smoothing circuit, and a dimming circuit, a booster circuit, and the like can be appropriately selected and combined.
  • FIG. 4 is a diagram showing a configuration around the LED module in the light bulb shaped lamp 1 according to the present embodiment.
  • 4A is a plan view when the LED module 20a is viewed from above with the globe 10 removed from the light bulb shaped lamp 1.
  • FIG. 4B is a cross-sectional view of the light bulb shaped lamp 1 cut along the line AA ′ in FIG. 4A
  • FIG. 4C is a line BB ′ in FIG.
  • FIG. 4D is a cross-sectional view of the light bulb shaped lamp 1 cut along the line CC ′ of FIG. 4A.
  • E is a cross-sectional view of the bulb-type lamp 1 cut along the line DD ′ in (a).
  • the LED module 20a is a main light emitting module (first light emitting module) that mainly emits light toward the front and sides, and has a COB (Chip On Board) structure in which a bare chip is directly mounted on the surface of the substrate 21. .
  • first light emitting module main light emitting module
  • COB Chip On Board
  • the LED module 20b is a sub light emitting module (second light emitting module) that emits light mainly toward the rear and side, and has a COB structure in which a bare chip is directly mounted on the back surface of the substrate 21.
  • the substrate 21 is both a substrate in the LED module 20a and a substrate in the LED module 20b.
  • the back surface of the substrate 21 is a first surface that is a surface on the metal strut 40 side (base side), and the surface of the substrate 21 is a second surface that is a surface on the globe 10 side.
  • the LED chip mounted on the back surface (first surface) of the substrate 21 is a first light emitting element
  • the LED chip mounted on the surface (second surface) of the substrate 21 is a second light emitting element.
  • the LED module 20a includes a substrate 21, a plurality of LEDs 22a and 22b (second light emitting elements) provided on the surface (second surface) of the substrate 21, sealing members 23a and 23b (second sealing member), Metal wiring 24a, 24b and 26 (second metal wiring), wires 25a and 25b (second wire), a conductive adhesive member 27 (second conductive adhesive member) and a terminal 28 (second terminal) are provided. .
  • the LED module 20b includes a substrate 21, a plurality of LEDs 32 (first light-emitting elements) provided on the back surface (first surface) of the substrate 21, a sealing member 33 (first sealing member), and a metal wiring.
  • 34 and 36 first metal wiring
  • a wire 35 first wire
  • a conductive adhesive member 37 first conductive adhesive member
  • a terminal 38 first terminal
  • the two LED modules 20a and 20b may be considered as one LED module.
  • the LED module includes a substrate 21, a plurality of LEDs mounted in a row on each of the front and back surfaces of the substrate 21, and a sealing member that collectively seals each LED row.
  • the substrate 21 can be a translucent substrate or a non-translucent substrate, for example, a ceramic substrate made of aluminum oxide (alumina) or aluminum nitride, a resin substrate, a glass substrate, a flexible substrate, or a resin-coated metal.
  • the substrate 21 is a rectangular mounting substrate (LED mounting substrate) for mounting the LEDs 22a, 22b, and 32.
  • the substrate 21 is preferably composed of a white substrate such as a white alumina substrate having a low light transmittance with respect to light emitted from the LEDs 22a, 22b, and 32, for example, 10% or less, or a metal substrate.
  • a white substrate such as a white alumina substrate having a low light transmittance with respect to light emitted from the LEDs 22a, 22b, and 32, for example, 10% or less, or a metal substrate.
  • the light transmittance of the substrate 21 is high, in the LED module 20a, a part of the light of the LEDs 22a and 22b on the front surface side of the substrate 21 passes through the substrate 21 and then is emitted from the back surface side of the substrate 21.
  • the LED module 20 b a part of the light of the LED 32 on the back surface side of the substrate 21 is emitted from the front surface side of the substrate 21 after passing through the substrate 21. Therefore, in the light bulb shaped lamp 1, color unevenness occurs with respect to light extracted from the base side and the opposite side. On the other hand, such color unevenness can be suppressed by reducing the light transmittance of the substrate 21. Further, since an inexpensive white substrate can be used, the cost of the light bulb shaped lamp 1 can be reduced.
  • a translucent substrate can be used as the substrate 21.
  • a ceramic substrate made of polycrystalline alumina having a total transmittance of 90% or more for visible light can be used as the substrate 21.
  • Two through holes 21b penetrating the substrate 21 are provided at both ends of the substrate 21 in the long side direction. These two through holes 21b constitute terminals 28 and 38 for connecting the lead wire 70 for power feeding and the LED modules 20a and 20b. Each of the two through holes 21b extends from the back surface to the front surface of the substrate 21. The lead wire 70 is inserted.
  • one through hole 21 a that penetrates the substrate 21 is provided in the central portion of the substrate 21, one through hole 21 a that penetrates the substrate 21 is provided.
  • the through hole 21a is for fixing the LED modules 20a and 20b to the metal support column 40, and a protrusion 42b of the metal support column 40 is fitted into the through hole 21a.
  • the through hole 21 a and the protrusion 42 b have a rectangular shape in plan view, and function as a position restricting portion for determining the position and orientation of the substrate 21.
  • the through hole 21a may not be provided.
  • the LEDs 22a, 22b, and 32 are semiconductor light emitting elements that emit light with a predetermined power, and are examples of conductive members.
  • a plurality of LEDs 22a and 22b are mounted on the surface of the substrate 21, respectively.
  • the plurality of LEDs 22a are linearly arranged at the same pitch in the long side direction of the substrate 21, and are orthogonal to the short side direction of the substrate 21, that is, the arrangement direction of the LEDs 22a in the element row of the LED 22a as an element row (light emitting element group).
  • a plurality are arranged in the direction.
  • the plurality of LEDs 22b are linearly arranged at the same pitch in the long side direction of the substrate 21, and the arrangement direction of the LEDs 22b in the short side direction of the substrate 21, that is, the element row of the LED 22b, as an element row (light emitting element group).
  • the plurality of element rows of the LED 22 b are arranged so as to be positioned between the two element rows of the LED 22 a in the short side direction of the substrate 21.
  • the plurality of LEDs 22a are connected in series in each element row, and are connected in parallel in the element rows.
  • the plurality of LEDs 22b are also connected in series in each element row, and are connected in parallel in the element rows.
  • the element rows of the LED 22a and the element rows of the LED 22b are also connected in parallel.
  • the plurality of LEDs 22a and 22b are arranged so that, for example, the interval (pitch) between adjacent LEDs in the element row is 1.8 mm. And the space
  • a plurality of LEDs 32 are mounted on the back surface of the substrate 21.
  • the plurality of LEDs 32 are arranged in a straight line at the same pitch in the long side direction of the substrate 21, and are orthogonal to the arrangement direction of the LEDs 32 in the short side direction of the substrate 21, that is, the LED 32 element row, as an element row (light emitting element group).
  • a plurality are arranged in the direction.
  • the plurality of LEDs 32 are connected in series in each element row, and are connected in parallel in the element rows.
  • the front-side LED 22a is disposed so as to face the rear-side LED 32 with the substrate 21 in between.
  • the entire lower surface of the LED 22a in contact with the substrate 21 is arranged so as to face the entire lower surface of the LED 32 in contact with the substrate 21.
  • the entire LED 22a is present in the region above the LED 32, and the entire LED 32 is present in the region below the LED 22a. Therefore, LED22a is arrange
  • LED22b is arrange
  • the entire lower surface of the LED 22b in contact with the substrate 21 is disposed so as to face the fixing surface of the fixing portion 42 of the metal support column 40.
  • the entire LED 22 b exists in the upper region of the fixing surface of the fixing portion 42 of the metal support column 40.
  • the LEDs 22b are mounted so that all the LEDs in the element row of the LED 22b face the fixing surface of the fixing portion 42 of the metal support column 40.
  • the LED 22b is one of the element rows of the LED 22b. Only the LED of the part may be mounted so as to face the fixing surface of the fixing part 42 of the metal support column 40.
  • LEDs 22a, 22b, and 32 bare chips that emit monochromatic visible light in all directions, that is, sideward, upward, and downward can be used.
  • the LEDs 22a, 22b, and 32 emit, for example, 20% of the total light amount on the side, 60% of the total light amount on the upper side, and 20% of the total light amount on the lower side.
  • the LEDs 22a, 22b, and 32 are rectangular (square) blue LED chips that emit blue light when energized, for example, each side having a length of about 0.35 mm (350 ⁇ m).
  • the blue LED chip for example, a gallium nitride based semiconductor light emitting device having a central wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.
  • FIG. 5 is an enlarged cross-sectional view around the LED (LED chip) in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • the periphery of the LED 22a is illustrated, but the same applies to the LEDs 22b and 32.
  • the LED 22 a includes a sapphire substrate 122 a and a plurality of nitride semiconductor layers 122 b that are stacked on the sapphire substrate 122 a and have different compositions.
  • a cathode electrode 122c and an anode electrode 122d are provided at both ends of the upper surface of the nitride semiconductor layer 122b.
  • a wire bond portion 122e is provided on the cathode electrode 122c, and a wire bond portion 122f is provided on the anode electrode 122d.
  • the cathode electrode 122c of one LED 22a and the anode electrode 122d of the other LED 22a are connected by a wire 25a through wire bond portions 122e and 122f.
  • the LED 22a is fixed on the substrate 21 with a translucent chip bonding material 122g so that the surface on the sapphire substrate 122a side faces the front surface or the back surface of the substrate 21.
  • a translucent chip bonding material 122g a silicone resin containing a filler composed of metal oxide can be used.
  • the sealing member 23a is an insulating member that seals the LED 22a and the metal wiring 24a in the element row of the LED 22a.
  • the sealing member 23a is formed so as to cover the LED 22a and the metal wiring 24a.
  • the sealing member 23a is linearly formed so as to collectively seal one row of the plurality of LEDs 22a along the arrangement direction of the plurality of LEDs 22a constituting the element row.
  • a plurality of sealing members 23a are formed along the arrangement direction of the element rows, and individually seal different element rows.
  • the sealing member 23a includes a phosphor that is a light wavelength conversion material, and also functions as a wavelength conversion member that converts the wavelength of light emitted from the LED 22a.
  • the sealing member 23a is composed of a wavelength conversion material that converts the wavelength of light emitted from the LED 22a and an insulating resin material containing the wavelength conversion material.
  • the wavelength conversion material phosphor particles that are excited by light emitted from the LED 22a and emit light of a desired color (wavelength) can be used.
  • the phosphor particles when the LED 22a is a blue LED that emits blue light, phosphor particles that convert the wavelength of the blue light into yellow light are used in order to emit white light from the sealing member 23a.
  • YAG (yttrium / aluminum / garnet) -based yellow phosphor particles can be used as the phosphor particles.
  • a part of blue light emitted from the LED 22a is wavelength-converted into yellow light by the yellow phosphor particles contained in the sealing member 23a. That is, the yellow phosphor particles emit fluorescent light using blue light as excitation light.
  • the blue light which was not absorbed by the yellow phosphor particles (the wavelength was not converted) and the yellow light which was wavelength-converted by the yellow phosphor particles were diffused and mixed in the sealing member 23a.
  • the white light is emitted from the sealing member 23a.
  • a transparent resin material such as silicone resin or an organic material such as fluorine resin
  • a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin is used as the sealing member 23a.
  • an inorganic material such as a low melting point glass or a sol-gel glass can be used as the material of the sealing member 23a containing the phosphor particles.
  • a light diffusing material such as silica particles may be dispersed in the sealing member 23a.
  • the sealing member 23b is formed adjacent to the sealing member 23a on the surface (second surface) of the substrate 21.
  • the two sealing members 23 b are formed so as to be positioned between the two sealing members 23 a in the short side direction of the substrate 21.
  • the sealing member 23b has the same configuration as the sealing member 23a, and is formed so as to seal the LED 22b and the metal wiring 24b in the element row of the LED 22b and cover the LED 22b and the metal wiring 24b.
  • the sealing member 23b is linearly formed so as to collectively seal one row of the plurality of LEDs 22b along the arrangement direction of the plurality of LEDs 22b constituting the element row. Further, a plurality of sealing members 23b are formed along the arrangement direction of the element rows, and different element rows are individually sealed.
  • the sealing member 23b includes a phosphor that is a light wavelength conversion material, and also functions as a wavelength conversion member that converts the wavelength of light emitted from the LED 22b.
  • the sealing member 23b includes a wavelength conversion material that converts the wavelength of light emitted from the LED 22b and an insulating resin material that contains the wavelength conversion material.
  • the wavelength conversion material the same material as the sealing member 23a can be used.
  • a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin can be used as the sealing member 23b.
  • the sealing member 33 is formed on the back surface (first surface) of the substrate 21.
  • two sealing members 33 are formed, each facing the two sealing members 23a with the substrate 21 in between.
  • the sealing member 33 has the same configuration as the sealing member 23a, and is formed so as to seal the LED 32 and the metal wiring 34 in the element row of the LED 32 and cover the LED 32 and the metal wiring 34.
  • the sealing member 33 is linearly formed so as to collectively seal one row of the plurality of LEDs 32 along the arrangement direction of the plurality of LEDs 32 constituting the element row. Further, a plurality of sealing members 33 are formed along the arrangement direction of the element rows, and different element rows are individually sealed.
  • the sealing member 33 includes a phosphor that is a light wavelength conversion material, similarly to the sealing member 23a, and also functions as a wavelength conversion member that converts the wavelength of light emitted from the LED 32.
  • the sealing member 33 includes a wavelength conversion material that converts the wavelength of light emitted from the LED 32 and an insulating resin material that contains the wavelength conversion material.
  • the same material as the sealing member 23a can be used.
  • a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin is used as the sealing member 33.
  • a material in which predetermined phosphor particles are dispersed in low melting point glass can be used.
  • each of the sealing members 23a, 23b, and 33 is formed to have a length of 24 mm, a line width of 1.6 mm, and a center maximum height of 0.7 mm, for example.
  • the sealing members 23a, 23b and 33 in the present embodiment are configured such that the mass concentration of the silicone resin is 70 to 80 wt%.
  • the LED module 20a has an element array of a plurality of LEDs 22a and an element array of a plurality of LEDs 22b
  • the LED module 20b has an element array of a plurality of LEDs 32.
  • the LED module 20a has an element array of the LEDs 22a provided on the surface of the substrate 21, and the LEDs 22a are arranged so as to face the LEDs 32 with the substrate 21 interposed therebetween.
  • substrate 21 is reflected or absorbed by LED22a facing LED32, and is light-shielded, and is not emitted as the light of LED module 20a.
  • the light of the LED 22a that is transmitted through the substrate 21 and is emitted from the back surface of the substrate 21 is reflected or absorbed by the LED 32 facing the LED 22a to be blocked, and is not emitted as light of the LED module 20b. Therefore, color unevenness can be suppressed for light emitted in all directions by the LED modules 20a and 20b.
  • each sealing member 23a, 23b, and 33 may be formed so as to individually cover the LEDs 22a, 22b, and 32, instead of sealing a plurality of LEDs at once.
  • each sealing member 23a, 23b, and 33 can be formed in a substantially hemispherical shape.
  • the metal wires 24a, 24b, 26, 34, and 36 are conductive metal wires through which a current for emitting light from the LED flows, and are examples of conductive members.
  • the metal wirings 24 a and 24 b are patterned in a predetermined shape on the surface (second surface) of the substrate 21.
  • a plurality of metal wirings 24a are formed to electrically connect a plurality of LEDs 22a in the element array of the LEDs 22a in series.
  • Each of the plurality of metal wirings 24a is formed in an island shape between adjacent LEDs 22a in the element row.
  • a plurality of metal wirings 24b are formed to electrically connect a plurality of LEDs 22b in the element row of the LEDs 22b in series.
  • Each of the plurality of metal wirings 24b is formed in an island shape between adjacent LEDs 22b in the element row.
  • the metal wiring 34 is patterned in a predetermined shape on the back surface (first surface) of the substrate 21.
  • a plurality of metal wirings 34 are formed in order to electrically connect a plurality of LEDs 32 in the element array of the LEDs 32 in series.
  • Each of the plurality of metal wirings 34 is formed in an island shape between the LEDs 32 adjacent in the element row.
  • Two metal wirings 26 are formed in a predetermined shape at both ends of the substrate 21 in order to electrically connect the element rows of the LEDs 22a and 22b and the terminals 28 in parallel. These two metal wirings 26 are formed on the surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 22a and 22b.
  • the metal wiring 26 extends in the arrangement direction of the element rows, and protrudes toward the element row at a portion adjacent to the element rows of the LEDs 22a and 22b.
  • the protruding portion of the metal wiring 26 becomes a connection portion with the wires 25a and 25b from the LEDs 22a and 22b located at the extreme ends.
  • two metal wirings 36 are formed in a predetermined shape at both ends of the substrate 21 in order to electrically connect the element array of the LED 32 and the terminal 38 in parallel. These two metal wirings 36 are formed on the back surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 32.
  • the metal wiring 36 extends in the arrangement direction of the element rows, and protrudes toward the element row at a portion adjacent to the element row of the LED 32.
  • the protruding portion of the metal wiring 36 becomes a connection portion with the wire 35 from the LED 32.
  • the metal wirings 24a, 24b, 26, 34 and 36 are simultaneously patterned using the same metal material.
  • a metal material of the metal wirings 24a, 24b, 26, 34, and 36 for example, silver (Ag), tungsten (W), copper (Cu), or the like can be used.
  • the surface of the metal wirings 24a, 24b and 26 may be plated with nickel (Ni) / gold (Au) or the like.
  • the metal wirings 24a, 24b, 26, 34, and 36 may be made of different metal materials or may be formed in separate steps.
  • a glass film made of a glass material (glass coat film) or a resin film made of a resin material (resin coat film). It is preferable to coat by. Thereby, the insulation in LED module 20a and 20b can be improved.
  • the terminals 28 and 38 are connection terminals in the LED modules 20a and 20b, and are examples of conductive members.
  • the terminal 28 is a power supply electrode provided with the conductive adhesive member 27, for example, a solder electrode to be soldered, and the surface of the substrate 21 so as to surround the through hole 21b and the opening on the surface side of the substrate 21 of the through hole 21b. And a connection land formed in a predetermined shape.
  • Two terminals 28 are formed corresponding to each of the two metal wirings 26.
  • the pair of terminals 28 are formed integrally with the corresponding metal wiring 26 and are connected by being in contact with the corresponding metal wiring 26.
  • One wiring pattern is constituted by such a corresponding set of metal wirings 26 and terminals 28.
  • the terminal 28 is a power supply unit of the LED module 20a, and receives power from the outside of the LED module 20a in order to cause the LEDs 22a and 22b to emit light, and receives the received power through the metal wires 24a, 24b and 26 and the wires 25a and 25b. To the LEDs 22a and 22b.
  • the terminal 38 is a power supply electrode on which the conductive adhesive member 37 is provided, and is formed in a predetermined shape on the back surface of the substrate 21 so as to surround the through hole 21b and the opening on the back surface side of the substrate 21 of the through hole 21b. And a connecting land.
  • Two terminals 38 are formed corresponding to each of the two metal wirings 36.
  • the pair of terminals 38 are formed integrally with the corresponding metal wiring 36 and are connected by being in contact with the corresponding metal wiring 36.
  • One wiring pattern is constituted by such a corresponding set of metal wirings 36 and terminals 38.
  • the terminal 38 is a power supply unit of the LED module 20b, and receives power from the outside of the LED module 20b in order to cause the LED 32 to emit light. To do.
  • the terminals 28 and 38 are arranged so as to be substantially concentric. Also, the terminals 28 and 38 are patterned simultaneously with these metal wirings using the same metal material as the metal wirings 24a, 24b, 26, 34 and 36.
  • the wires 25a, 25b, and 35 are conductive metal wirings in the LED modules 20a and 20b, and are examples of conductive members.
  • the wire 25a is an electric wire for connecting the LED 22a and the metal wiring 26, and the LED 22a and the metal wiring 24a, and is, for example, a gold wire. As described with reference to FIG. 5, the wire 25a allows wire bonding between the wire bonding portions 122e and 122f provided on the upper surface of the LED 22a and the metal wiring 24a or the metal wiring 26 formed adjacent to both sides of the LED 22a. Has been.
  • the wire 25b has the same configuration as the wire 25a, and is an electric wire for connecting the LED 22b and the metal wiring 26, and the LED 22b and the metal wiring 24b, and is, for example, a gold wire.
  • the wire 35 has the same configuration as that of the wire 25a and is an electric wire for connecting the LED 32 and the metal wiring 36 and the LED 32 and the metal wiring 34.
  • the wires 25a, 25b, and 35 are embedded in the sealing members 23a, 23b, and 35, respectively, so as not to be exposed from the sealing members 23a, 23b, and 33, for example.
  • the conductive adhesive members 27 and 37 are also examples of conductive members.
  • the conductive adhesive member 27 is a conductive adhesive such as solder or silver paste that connects the terminal 28 to the lead wire 70.
  • the conductive adhesive member 27 is provided in contact with both the terminal 28 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 28.
  • the conductive adhesive member 27 is provided so as to close the opening on the surface side of the substrate 21 of the through hole 21b.
  • the conductive adhesive member 37 is a conductive adhesive that connects the terminal 38 to the lead wire 70.
  • the conductive adhesive member 37 is provided in contact with both the terminal 38 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 38.
  • the conductive adhesive member 37 is provided so as to close the opening on the back surface side of the substrate 21 of the through hole 21b.
  • the conductive adhesive member 27 may be covered with an insulating resin.
  • the insulating resin may be a white resin having a low light transmittance with respect to the light emitted from the LEDs 22a, 22b and 32, for example, 10% or less.
  • the two lead wires 70 and the terminals 38 are connected by the conductive adhesive member 27. It is formed by connecting and connecting the two lead wires 70 and the terminal 28 by the conductive adhesive member 37.
  • the lead wire 70 is provided so as to be inserted from the opening on the back surface side of the through hole 21b and protrude from the opening on the front surface side of the through hole 21b.
  • a conductive adhesive member 37 is provided so as to be in contact with both the rear surface side portion of the lead wire 70 and the terminal 38, and the conductive adhesive member 27 is provided so as to be in contact with both the front surface portion and the terminal 28.
  • the terminal 28 and the terminal 38 are connected by the lead wire 70.
  • the terminals 28 and 38 are connected to the same lead wire 70, and the plurality of LEDs 22 a and 22 b on the front surface of the substrate 21 and the plurality of LEDs 32 on the back surface of the substrate 21 are connected in parallel to the lead wire 70. That is, the LED module 20 a and the LED module 20 b are electrically connected in parallel via the pair of lead wires 70.
  • the current supplied to the one lead wire 70 on the plus side includes the conductive adhesive member 27, the terminal 28, the metal wiring 26, the LEDs 22a and 22b, the metal wirings 24a and 24b, and It passes through the wires 25a and 25b and is output from the other negative lead wire 70.
  • the current supplied to one plus-side lead wire 70 passes through the conductive adhesive member 37, the terminal 38, the metal wiring 36, the LED 32, the metal wiring 34, and the wire 35, and the other side. It is output from the negative lead wire 70.
  • the back surface of the substrate 21 and the fixed surface of the fixing portion 42 of the metal support column 40 are brought into contact with each other. These members are not provided. Therefore, on the back surface of the substrate 21, the element rows of the plurality of LEDs 32 are provided so as to sandwich the fixing portion 42, and the interval between the element rows is the element row sandwiching the fixing portion 42 of the metal column 40 and the interval between other element rows. It is getting bigger.
  • the conductive adhesive members 27 and 37 are provided apart from each other with a space in the through hole 21b.
  • the conductive adhesive members 27 and 37 may be provided as a single adhesive member instead of separate members. That is, one conductive member may be provided continuously in the through hole 21 b, on the surface of the substrate 21, and on the back surface of the substrate 21 so as to contact the terminals 28 and 38 and the lead wire 70. .
  • the tip of the lead wire 70 is provided so as to be exposed on the surface of the conductive adhesive member 27, but it may be completely covered with the conductive adhesive member 27. In this case, since the contact area between the lead wire 70 and the conductive adhesive member 27 increases, the connection between the two can be strengthened.
  • the power supply to the LED modules 20a and 20b is simply performed by connecting the lead wire 70 to both of the two terminals 28 and 38 by the conductive adhesive members 27 and 37 through the through hole 21b.
  • the lead wire 70 is connected to one of the terminals 28 and 38 and the terminal 28 and the terminal 38 are connected by a via hole or the like
  • a configuration such as a via hole or the like that connects the terminal 28 and the terminal 38 is unnecessary. It becomes.
  • the number of lead wires 70 can be halved compared to a configuration in which separate lead wires 70 are connected to the terminals 28 and 38. As a result, the light bulb shaped lamp 1 having a simple structure can be realized.
  • FIG. 6 is an enlarged cross-sectional view of a main part of the light bulb shaped lamp according to the embodiment of the present invention taken along the line EE ′ of FIG.
  • the LED lamp is required to have a predetermined withstand voltage, but when the LED module having the substrate on which the LED and the metal wiring are mounted is fixed to the metal column, the conductive member such as the LED or the metal wiring on the substrate. When the surface on which is formed is brought into contact with the metal column, it is difficult to ensure a predetermined withstand voltage.
  • the space distance between the LED or the metal wiring and the metal support can be secured above a certain level, it is possible to ensure a predetermined withstand voltage.
  • the LED module (substrate) cannot be enlarged in a limited space in the globe 10, and it is difficult to ensure a sufficient space distance between the LED and the metal wiring and the metal support.
  • a predetermined dielectric strength is secured by using a sealing member 33 formed on the back surface (first surface) of the substrate 21 in the LED module 20b, Of the conductive members of the module 20b, the thickness from the conductive member having the shortest distance from the metal column 40 to the surface of the sealing member 33 is configured to satisfy a predetermined withstand voltage.
  • the conductive member having the shortest distance from the metal support column 40 is the metal wiring 34. Therefore, the thickness (distance) L from the metal wiring 34 to the surface of the sealing member 33 is a predetermined withstand voltage. It is comprised so that it may become the thickness which satisfy
  • the shortest distance between the metal column 40 and the metal wiring 34 is the distance between the metal column 40 and the metal wiring 34 on the back surface (first surface) of the substrate 21. That is, the shortest distance between the metal column 40 and the metal wiring 34 is a creeping distance (insulating distance) from the metal column 40 to the metal wiring 34 along the back surface (first surface) of the substrate 21.
  • the sealing member 33 is a silicone resin
  • the dielectric breakdown voltage (dielectric breakdown strength) of the silicone resin is 10 kV / mm, for example, when trying to satisfy a dielectric breakdown voltage of 1.5 kV
  • the thickness L of the sealing member 33 from the metal wiring 34 to the surface of the sealing member 33 is preferably 0.15 mm or more.
  • the thickness L of the said sealing member 33 from the metal wiring 34 to the surface of the sealing member 33 shall be 0.40 mm or more. In Japan, a withstand voltage of 1.0 to 1.5 kV or more is required, and in the United States, a withstand voltage of 4.0 kV or more is required.
  • the substrate 21 is formed from the conductive member (for example, the metal wiring 34) whose position from the metal column 40 is the shortest distance.
  • the thickness of the sealing member 33 up to the surface of the sealing member 33 formed on the back surface of the substrate is a thickness that satisfies a predetermined withstand voltage.
  • FIG. 7 is an enlarged cross-sectional view of a main part of a light bulb shaped lamp according to Modification 1 of the embodiment of the present invention.
  • FIG. 7 corresponds to FIG.
  • the shape of the fixing portion 42 of the metal column 40 is a tapered shape whose width is widened toward the substrate 21.
  • the shape of the portion 42 ⁇ / b> A may be a shape having a constant width toward the substrate 21.
  • the spatial distance between the conductive member (for example, the metal wiring 34) and the metal column 40 in the LED modules 20 a and 20 b is further reduced as compared with the configuration shown in FIG. 6. Even in such a case, a predetermined withstand voltage can be ensured by making the thickness L of the sealing member 33 shown in FIG. 7 equal to or greater than the thickness L of the sealing member 33 shown in FIG. Can do.
  • FIG. 8 is an enlarged cross-sectional view of a main part of a light bulb shaped lamp according to a second modification of the embodiment of the present invention.
  • FIG. 8 also corresponds to FIG.
  • the LED 32 and the metal wiring 34 are configured such that the centers thereof coincide with the center (line axis) of the sealing member 33.
  • the thickness of the stop member 33 in the direction perpendicular to the line axis was the same on both sides.
  • the center of the LED 32 and the metal wiring 34 is configured not to be aligned with the center (line axis) of the sealing member 33.
  • the thickness of the member 33 in the direction perpendicular to the line axis is different on both sides. That is, as shown in FIG. 8, the thickness L1 of the sealing member 33 from the metal wiring 34 on one side to the surface of the sealing member 33, and the thickness L1 from the metal wiring 34 on the other side to the surface of the sealing member 33.
  • the thickness L2 of the sealing member 33 is different.
  • the thickness L1 of the sealing member 33 on the side close to the metal column 40 is the thickness of the sealing member 33 on the side far from the metal column 40. It is larger than L2 (L1> L2).
  • a predetermined withstand voltage can be ensured by setting the thickness L1 of the sealing member 33 shown in FIG. 8 to be equal to or larger than the thickness L of the sealing member 33 shown in FIG. Can do.
  • the predetermined dielectric strength can be ensured by setting the thickness L2 of the sealing member 33 to be equal to or greater than the thickness L of the sealing member 33 shown in FIG. it can.
  • the light bulb shaped lamp 1 of the above-described embodiment forms two LED modules 20a and 20b by providing a light source and wiring for emitting light on both the front surface and the back surface of one substrate 21, and the light bulb shaped lamp 1 The light was extracted to the globe side and the base side.
  • a light emitting element and wiring for emitting light are individually provided on the surfaces of two separate substrates, and the back surfaces of the two substrates are bonded to form one substrate 21. Also with this configuration, light can be extracted to the globe side and the base side of the light bulb shaped lamp 1.
  • the light bulb shaped lamp 1 according to this modification is the above-described implementation in that the substrate 21 of the LED module is configured by bonding two substrates each having a light emitting element and a wiring for emitting light on the surface thereof with an adhesive. It differs from the light bulb shaped lamp 1 of the form.
  • the difference from the light bulb shaped lamp 1 of the above-described embodiment will be described in detail.
  • FIG. 9 is a plan view when the LED module is viewed from above with the globe removed from the light bulb shaped lamp according to this modification.
  • 9B is a cross-sectional view of the same light bulb shaped lamp cut along the line AA ′ in FIG. 9A
  • FIG. 9C is a cross section taken along the line BB ′ in FIG.
  • FIG. 9D is a cross-sectional view of the same light bulb shaped lamp
  • FIG. 9D is a cross sectional view of the light bulb shaped lamp cut along the line CC ′ in FIG. 9A
  • FIG. 9 corresponds to FIG.
  • the LED module 120a in this modification is a main light emitting module (first light emitting module) that emits light mainly toward the front and sides, and has a COB structure in which a bare chip is directly mounted on the surface of the substrate 29.
  • the LED module 120b in this modification is a secondary light emitting module (second light emitting module) that emits light mainly toward the rear and side, and has a COB structure in which a bare chip is directly mounted on the surface of the substrate 39. is there.
  • second light emitting module secondary light emitting module
  • the LED module 120a includes a substrate 29 (second substrate) which is an example of a main substrate, a plurality of LEDs 22a and 22b (second light emitting elements) provided on the surface (second surface) of the substrate 29, and a sealing member.
  • 23a and 23b second sealing member
  • metal wiring 24a, 24b and 26 second metal wiring
  • wires 25a and 25b second wire
  • conductive adhesive member 27 second conductive adhesive member
  • terminals 28 second terminal
  • the LED module 120b includes a substrate 39 (first substrate) which is an example of a sub-substrate, a plurality of LEDs 32 (first light emitting elements) provided on the surface (first surface) of the substrate 39, and a sealing member. 33 (first sealing member), metal wirings 34 and 36 (first metal wiring), wire 35 (first wire), conductive adhesive member 37 (first conductive adhesive member) and terminal 38 (first terminal) And.
  • the substrates 29 and 39 have the same configuration and shape as each other, and the back surfaces of the substrates 29 and 39 are bonded together by an adhesive 90 to form one substrate 21.
  • a translucent substrate or a non-translucent substrate can be used.
  • the substrate 29 is a rectangular mounting substrate for mounting the LEDs 22a and 22b
  • the substrate 39 is a rectangular mounting substrate for mounting the LEDs 32.
  • the substrates 29 and 39 are preferably made of a white substrate such as a white alumina substrate having a low light transmittance with respect to the light emitted from the LEDs 22a, 22b and 32, for example, 10% or less.
  • the substrate 29 and 39, LED 22a, having 50% or more reflectivity with respect to light emitted from 22b and 32, the main component Al 2 O 3, MgO, SiO , and one of TiO 2 It can be composed of a substrate.
  • substrate 21 can be made low, and the color nonuniformity of the light emitted from LED module 120a and 120b can be suppressed.
  • substrate can be used for the board
  • the through hole 29b constitutes a terminal 28 for connecting the lead wire 70 for power feeding and the LED module 120a
  • the through hole 39b is a terminal 38 for connecting the lead wire 70 for power feeding and the LED module 120b. Is configured.
  • the through holes 29 b and 39 b are arranged so as to be continuous to form the through hole 21 b of the substrate 21. Therefore, one lead wire 70 is inserted through one continuous through hole 29b and 39b.
  • One through hole 29 a that penetrates the substrate 29 is provided in the central part of the substrate 29, and one through hole 39 a that penetrates the substrate 39 is also provided in the central part of the substrate 39.
  • the through holes 29 a and 39 a are for fixing the LED modules 120 a and 120 b to the metal support column 40, and are arranged so as to form one through hole 21 a of the substrate 21. Therefore, the protrusion 42b of the metal support column 40 is fitted into the continuous through holes 29a and 39a.
  • the through hole 21a and the protrusion 42b function as a position restricting portion for determining the position and orientation of the substrate 21 as described above.
  • the adhesive 90 is provided between the back surface of the substrate 29 and the back surface of the substrate 39 and adheres both, and is made of, for example, a resin such as a silicone resin or a metal paste such as an Ag paste.
  • a resin such as a silicone resin
  • a metal paste such as an Ag paste.
  • the thermal conductivity between the substrate 29 and the substrate 39 is increased and the thermal conductivity as the substrate 21 is increased, so that the heat dissipation efficiency of the substrate 21 can be increased.
  • the light shielding property of the adhesive 90 that is, the light shielding property of the substrate 21 can be improved, color unevenness due to light traveling from the front surface to the back surface of the substrates 29 and 39 can also be suppressed.
  • the adhesive 90 prevents at least a part of the space between the through holes 29b and 39b between the back surface of the substrate 29 and the back surface of the substrate 39 so that the lead wire 70 does not interfere with the insertion of the through holes 29b and 39b. Is not provided.
  • the adhesive 90 prevents the through holes 29a and 39a between the back surface of the substrate 29 and the back surface of the substrate 39 from interfering with the fitting of the through holes 29a and 39a and the protrusions of the metal support column 40. It is not provided in all the spaces between.
  • a plurality of LEDs 22a and 22b, sealing members 23a and 23b, metal wirings 24a, 24b and 26, wires 25a and 25b, and terminals 28 are on the surface of the substrate 29.
  • a plurality of LEDs 32, a sealing member 33, metal wirings 34 and 36, wires 35 and terminals 38 are provided on the surface of the substrate 39.
  • the two lead wires 70 and the terminal 28 are connected by the conductive adhesive member 27, and the two lead wires 70 and the terminal 38 are connected by the conductive adhesive member 37. Is connected. Therefore, the LED modules 120a and 120b can be easily manufactured as compared with the case where a light source and wiring for emitting light are provided on both the front and back surfaces of one substrate 29.
  • the position from the metal column 40 among the conductive members of the LED modules 120a and 120b is the shortest distance as in the light bulb shaped lamp 1 according to the above embodiment.
  • the thickness from the conductive member (the metal wiring 34 in this modification) to the surface of the sealing member 33 is configured to satisfy a predetermined withstand voltage.
  • a light bulb shaped lamp having a wide light distribution angle and capable of suppressing a decrease in the life of the LED is realized. Can do.
  • the substrate 21 is composed of a substrate 29 provided with element rows of LEDs 22a and 22b on the surface and a substrate 39 provided with element rows of LEDs 32 on the surface.
  • the substrates 29 and 39 are arranged so that the back surfaces of the LED 22a and 22b and the LED 32 are not provided with the back surfaces thereof.
  • the LED module 120b may be bonded and fixed to the metal support column 40.
  • the LED modules 120a and 120b can be manufactured simply by preparing the separate substrates 29 and 39 and individually providing the respective members on the respective surfaces, and then bonding them, so that the LED modules 120a and 120b can be manufactured. Can be made easier.
  • the light bulb shaped lamp 1 that is easy to manufacture can be realized.
  • the LED module 120b is directly attached to the metal support column 40, and heat generated by the LED module 120b is transferred to the metal support column 40.
  • the LED module 120a is indirectly attached to the metal support column 40 via the LED module 120b, and the heat generated by the LED module 120a is indirectly transferred to the metal support column 40 via the LED module 120b.
  • An adhesive 90 as a heat conducting member is provided between the LED modules 120a and 120b.
  • the adhesive 90 is any one of a heat conductive resin, a ceramic paste, and a metal paste.
  • the heat dissipation efficiency and light shielding performance of the substrate 21 can be improved, so that the light emission efficiency and lifetime of the LEDs 22a, 22b and 32 are further suppressed, and at the same time, the color unevenness of the light emitted from the LED modules 120a and 120b is further suppressed. can do.
  • the metal support column 40 may penetrate the through hole 39 b of the substrate 39 and contact the back surface of the substrate 29. That is, the through-hole 39b may be formed so as to be fitted to the entire fixing portion 42 of the metal column 40, and the fixing surface of the fixing portion 42 of the metal column 40 and the back surface of the substrate 29 may be bonded by the adhesive 90. . Thereby, fixation to the metal support
  • the LED module 120a is bonded and fixed to the metal column 40 to shorten the heat radiation path from the substrate 29 to the metal column 40, and the inner wall of the through hole 39b of the substrate 39 and the fixing portion 42 of the metal column 40 are greased or the like.
  • the heat dissipation path from the substrate 39 to the metal column 40 can be widened by contacting through the heat conducting member. As a result, it is possible to further suppress the decrease in luminous efficiency and the lifetime of the LEDs 22a, 22b and 32.
  • the LED modules 20a and 20b are configured to emit white light by the blue LED and the yellow phosphor, but are not limited thereto.
  • a phosphor-containing resin containing a red phosphor and a green phosphor may be used so that white light is emitted by combining this with a blue LED.
  • the LEDs 22a, 22b, and 32 may be LEDs that emit light other than blue.
  • the phosphor particles may be a combination of phosphor particles that emit light in three primary colors (red, green, and blue).
  • a wavelength conversion material other than the phosphor particles may be used.
  • the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light.
  • a material containing a substance that emits light may be used.
  • the sealing members 23a, 22b, and 33 are formed linearly along the LED element rows, but are formed in a circular shape so as to cover all the LED element rows. It doesn't matter.
  • the LED is exemplified as the light emitting element.
  • a semiconductor light emitting element such as a semiconductor laser
  • an EL element such as an organic EL (Electro Luminescence) or an inorganic EL
  • other solid light emitting elements are used. May be.
  • the LED module has a COB type configuration in which the LED chip is directly mounted on the substrate, but is not limited thereto.
  • a package type LED element in which an LED chip is mounted in a cavity (concave portion) of a resin-molded container and a phosphor-containing resin is enclosed in the cavity, a metal wiring is formed on the LED element.
  • a surface mount device (SMD: Surface Mount Device) LED module configured by mounting a plurality on a substrate may be used.
  • LED element arrays are provided on the front surface and the back surface of the substrate 21 respectively.
  • LED element arrays may be provided only on the back surface of the substrate 21.
  • the LED module includes the substrate 21, a plurality of LEDs (first light emitting elements) provided only on the back surface of the substrate 21 (the first surface that is the surface on the metal column 40 side), and the first surface. And a plurality of LEDs (first light-emitting elements) and an insulating sealing member that seals the metal wiring.
  • the LED arrangement direction is parallel in the LED element arrays on the front and back surfaces of the substrate, and the predetermined direction included in the plane of the substrate intersects, for example, is orthogonal to the alignment direction.
  • the short side direction of the substrate is shown as an example of this direction, the predetermined direction is not limited to the short side direction.
  • the LED element array is provided on the surface of the substrate other than above the metal support.
  • the LED may be provided only above the metal support. .
  • the metal column has a width in the LED element array direction in the LED module as well as a width in the LED module array direction toward the substrate. It will be bigger. However, as long as at least the width of the LED element row in the LED module increases toward the substrate, the width of the LED in the LED module row may be constant toward the substrate. , May be smaller.
  • the lead wire is provided outside the metal column.
  • the lead wire 70 is provided so as to pierce the substrate from the back surface side of the substrate, but may be provided so as to pierce from the front surface side of the substrate.
  • the present invention can also be realized as an illumination device including the above-described light bulb shaped lamp.
  • the lighting device 100 is configured as a lighting device including the light bulb shaped lamp 1 and a lighting fixture (lighting fixture) 200 to which the light bulb shaped lamp 1 is attached.
  • the lighting device 200 is for turning off and lighting the light bulb shaped lamp 1 and includes, for example, a device main body 210 attached to the ceiling and a lamp cover 220 covering the light bulb shaped lamp 1.
  • the appliance main body 210 has a socket 211 to which the cap of the light bulb shaped lamp 1 is attached and which supplies power to the light bulb shaped lamp 1.
  • a translucent plate may be provided in the opening of the lamp cover 220.
  • the present invention is useful as a light bulb shaped lamp that replaces a conventional incandescent light bulb and the like, and can be widely used in lighting devices and the like.
  • the light bulb shaped lamp according to the present invention is suitable for a high output type light bulb shaped lamp because both insulation and high heat dissipation can be achieved.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

Selon l'invention, une lampe à ampoule (1) est équipée : d'un globe translucide (10) ; d'un support métallique (40) conçu pour s'étendre vers la partie intérieure du globe (10) ; de modules DEL (20a, 20b) agencés à l'intérieur du globe (10) et fixés au support métallique (40). Les modules DEL (20a, 20b) possèdent : un substrat (21) ; une pluralité de DEL (32) fournies sur une première surface, qui est la surface du substrat (21) sur la partie latérale du support métallique (40) ; un câblage métallique (34) formé sur la première surface ; un élément d'isolation et d'étanchéité (33) qui protège la pluralité de DEL (32), ainsi que le câblage métallique (34). La distance entre la surface de l'élément d'étanchéité (33) et l'élément conducteur figurant parmi les éléments conducteurs des modules DEL (20a, 20b), se trouvant le plus près du support métallique (40), satisfait à une tension diélectrique prescrite.
PCT/JP2013/002921 2012-08-22 2013-05-02 Lampe à ampoule et dispositif d'éclairage Ceased WO2014030276A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-183435 2012-08-22
JP2012183435 2012-08-22

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Publication Number Publication Date
WO2014030276A1 true WO2014030276A1 (fr) 2014-02-27

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021168255A (ja) * 2020-04-10 2021-10-21 コイズミ照明株式会社 電子装置
US20230324016A1 (en) * 2022-04-07 2023-10-12 Globe Electric Company Inc. Duo led light fixture with a downlight source and an optionally operable upper light source

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Publication number Priority date Publication date Assignee Title
JP2009010109A (ja) * 2007-06-27 2009-01-15 Namics Corp 発光ダイオードチップの封止体の製造方法
JP2009231397A (ja) * 2008-03-20 2009-10-08 Toshiba Lighting & Technology Corp 照明装置
WO2012011279A1 (fr) * 2010-07-20 2012-01-26 パナソニック株式会社 Lampe en forme d'ampoule
WO2012060106A1 (fr) * 2010-11-04 2012-05-10 パナソニック株式会社 Lampe du type ampoule et dispositif d'éclairage
JP2012181969A (ja) * 2011-02-28 2012-09-20 Toshiba Lighting & Technology Corp 電球形発光素子ランプ及び照明器具

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Publication number Priority date Publication date Assignee Title
JP2009010109A (ja) * 2007-06-27 2009-01-15 Namics Corp 発光ダイオードチップの封止体の製造方法
JP2009231397A (ja) * 2008-03-20 2009-10-08 Toshiba Lighting & Technology Corp 照明装置
WO2012011279A1 (fr) * 2010-07-20 2012-01-26 パナソニック株式会社 Lampe en forme d'ampoule
WO2012060106A1 (fr) * 2010-11-04 2012-05-10 パナソニック株式会社 Lampe du type ampoule et dispositif d'éclairage
JP2012181969A (ja) * 2011-02-28 2012-09-20 Toshiba Lighting & Technology Corp 電球形発光素子ランプ及び照明器具

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021168255A (ja) * 2020-04-10 2021-10-21 コイズミ照明株式会社 電子装置
JP7428575B2 (ja) 2020-04-10 2024-02-06 コイズミ照明株式会社 電子装置
US20230324016A1 (en) * 2022-04-07 2023-10-12 Globe Electric Company Inc. Duo led light fixture with a downlight source and an optionally operable upper light source
US12092302B2 (en) * 2022-04-07 2024-09-17 Globe Electric Company Inc. LED light fixture with downlight and upper light sources
US12486973B2 (en) 2022-04-07 2025-12-02 Globe Electric Company Inc. LED light fixture with forward and rear light sources

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