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WO2014030275A1 - Lampe en forme d'ampoule et dispositif d'éclairage - Google Patents

Lampe en forme d'ampoule et dispositif d'éclairage Download PDF

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Publication number
WO2014030275A1
WO2014030275A1 PCT/JP2013/002920 JP2013002920W WO2014030275A1 WO 2014030275 A1 WO2014030275 A1 WO 2014030275A1 JP 2013002920 W JP2013002920 W JP 2013002920W WO 2014030275 A1 WO2014030275 A1 WO 2014030275A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
led
substrate
light
leds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/002920
Other languages
English (en)
Japanese (ja)
Inventor
敏明 倉地
功幸 長浜
直紀 田上
考志 大村
健太 渡邉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
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Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of WO2014030275A1 publication Critical patent/WO2014030275A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • the present invention relates to a light bulb shaped lamp and a lighting device, for example, a light bulb shaped lamp using a semiconductor light emitting element and a lighting device using the same.
  • LEDs Light Emitting Diodes
  • LED lamp there is a bulb-shaped LED lamp (bulb-shaped LED lamp).
  • bulb-shaped LED lamp an LED module including a substrate and a plurality of LEDs mounted on the substrate is used.
  • Patent Document 1 discloses a conventional bulb-type LED lamp.
  • a heat sink is used to dissipate heat generated by the LED, and the LED module is fixed to the heat sink.
  • a metal casing that functions as a heat sink is provided between a hemispherical globe and a base, and the LED module is placed on the upper surface of the metal casing. ing.
  • the LED module used for the bulb-type LED lamp is usually configured to extract light from only one side of the substrate (the surface on which the LED is mounted). Therefore, even if the above-described replacement configuration is used, the luminous flux toward the base side of the bulb-type LED lamp is low, and it is difficult to realize a wide light distribution angle.
  • another LED module that emits light toward the base can be added to the back surface (the surface on which the LED is not mounted) of the substrate of one LED module.
  • the present invention has been made to solve such a problem, and an object thereof is to provide a light bulb shaped lamp and a lighting device having a wide light distribution angle over a long period of time.
  • an aspect of a light bulb shaped lamp according to the present invention includes a translucent glove, a support column provided to extend inward of the glove, and the glove.
  • a main light emitting module and a sub light emitting module fixed to the support; a driving circuit for supplying power to the main light emitting module and the sub light emitting module; the main light emitting module, the sub light emitting module, and the driving circuit;
  • the main light emitting module is provided with a plurality of light emitting elements that are provided side by side on the surface of the substrate and connected in series between the pair of lead wires.
  • the sub-light-emitting module includes a plurality of light-emitting elements that are provided side by side on the back surface of the substrate and connected in series between the pair of lead wires.
  • a second light emitting element group wherein the main light emitting module and the sub light emitting module are electrically connected in parallel via the pair of lead wires, and the number of the light emitting elements of the main light emitting module is the sub light emitting module Unlike the number of light emitting elements, the forward voltage of the first light emitting element group is substantially the same as the forward voltage of the second light emitting element group.
  • the forward voltage of the light emitting elements of the first light emitting element group is substantially the same as the forward voltage of the light emitting elements of the second light emitting element group
  • the number of light emitting elements in one light emitting element group may be the same as the number of light emitting elements in the second light emitting element group.
  • the forward voltage of the light emitting elements of the first light emitting element group is different from the forward voltage of the light emitting elements of the second light emitting element group, and the first light emitting element.
  • the number of light emitting elements in the group may be different from the number of light emitting elements in the second light emitting element group.
  • the substrate includes: a main substrate on which the first light emitting element group is provided on a surface; and a sub substrate on which the second light emitting element group is provided on the surface.
  • the main substrate and the sub-substrate may be arranged such that back surfaces not provided with the first light emitting element group and the second light emitting element group are opposed to each other.
  • the main light emitting module further includes a Zener diode electrically connected in parallel with the first light emitting element group
  • the sub light emitting module further includes: A Zener diode electrically connected in parallel with the second light emitting element group may be included.
  • the main light emitting module has at least two or more first light emitting element groups, and the sub light emitting module has at least two or more second light emitting elements. It has an element group.
  • a current value flowing through the main light emitting module may be higher than a current value flowing through the sub light emitting module.
  • an aspect of the lighting device according to the present invention is characterized by including the above-described light bulb shaped lamp.
  • a light bulb shaped lamp and a lighting device having a wide light distribution angle over a long period of time can be realized.
  • FIG. 1 is a side view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 4 is a diagram showing a configuration of a light bulb shaped lamp according to an embodiment of the present invention, where (a) is a top view, and (b), (c), (d), and (e) are cross-sectional views. .
  • FIG. 5 is an enlarged cross-sectional view of an LED in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 5 is an enlarged cross-sectional view of an LED in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 6 is a plan view of the LED module of the light bulb shaped lamp according to the embodiment of the present invention, where (a) is a top view and (b) is a bottom view.
  • FIG. 7 is a plan view of an LED module of a light bulb shaped lamp according to a modification of the embodiment of the present invention, where (a) is a top view and (b) is a bottom view.
  • FIG. 8 is a diagram showing a configuration of a light bulb shaped lamp according to a modification of the embodiment of the present invention, where (a) is a top view, and (b), (c), (d), and (e) are cross sections.
  • FIG. FIG. 9 is a cross-sectional view of a modification of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 10 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.
  • FIG. 1 is a side view of a light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the present embodiment.
  • the upper side of the paper is the front of the light bulb shaped lamp 1
  • the lower side of the paper is the rear of the light bulb shaped lamp 1
  • the left and right sides of the paper are the sides of the light bulb shaped lamp 1.
  • “rear” refers to the direction of the base with respect to the substrate of the LED module
  • “front” refers to the direction of the opposite side of the base with respect to the substrate of the LED module. That is, the “side” means a direction parallel to the main surface of the substrate of the LED module.
  • the alternate long and short dash line drawn in the vertical direction of the drawing indicates the lamp axis J (center axis) of the light bulb shaped lamp 1.
  • the lamp axis J is an axis serving as a rotation center when the light bulb shaped lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base.
  • the light bulb shaped lamp 1 is an example of a light source for illumination, and is a light bulb shaped LED lamp (LED light bulb) that is a substitute for a light bulb shaped fluorescent lamp or an incandescent light bulb.
  • the light bulb shaped lamp 1 includes a translucent globe 10, LED modules 20a and 20b that are light sources, a base 30 that receives power from the outside of the lamp, a support column 40, a support base 50, a resin case 60, a lead wire 70 and a lighting circuit 80.
  • the bulb-shaped lamp 1 includes an envelope formed by the globe 10, the resin case 60 (first case portion 61), and the base 30.
  • the globe 10 houses the LED modules 20a and 20b.
  • the globe 10 is a light-transmitting globe that is made of a material that is transparent to the light from the LED modules 20a and 20b, and transmits the light from the LED modules 20a and 20b to the outside of the lamp.
  • a globe 10 can be a glass bulb (clear bulb) made of silica glass that is transparent to visible light.
  • the LED modules 20 a and 20 b housed in the globe 10 can be viewed from the outside of the globe 10.
  • the shape of the globe 10 is a shape in which one end is closed in a spherical shape and an opening 11 is provided at the other end.
  • the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is formed at a position away from the center of the sphere.
  • a glass bulb having the same shape as a general incandescent bulb can be used.
  • a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.
  • the globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function.
  • a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 10.
  • the globe 10 does not need to be made of silica glass.
  • a globe 10 made of a resin material such as acrylic may be used.
  • the LED modules 20a and 20b are light emitting modules that have LEDs (LED chips) and emit light when electric power is supplied to the LEDs via the lead wires.
  • the LED modules 20 a and 20 b are held in the hollow inside the globe 10 by the support column 40.
  • the LED modules 20a and 20b are preferably arranged at a spherical central position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large).
  • the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to a general incandescent light bulb using a conventional filament coil. .
  • the LED modules 20a and 20b are arranged so that the main surfaces (front surface and back surface) of the substrate intersect the lamp axis, for example, substantially perpendicular.
  • the LED module 20 a emits light toward the front of the light bulb shaped lamp 1
  • the LED module 20 b emits light toward the rear of the light bulb shaped lamp 1.
  • the base 30 is a power receiving unit that receives electric power for causing the LEDs of the LED modules 20 a and 20 b to emit light from the outside of the light bulb shaped lamp 1.
  • the base 30 receives AC power through two contacts, and the power received by the base 30 is input to the power input unit of the lighting circuit 80 via a lead wire.
  • the base 30 is attached to a socket of a lighting fixture (lighting device), and turns on the light bulb shaped lamp 1 (LED modules 20a and 20b) by receiving power from the socket.
  • the base 30 is E-shaped, and a screwing portion for screwing into the socket of the lighting device is formed on the outer peripheral surface thereof, and a screwing portion for screwing the resin case 60 on the inner peripheral surface thereof. Is formed.
  • the base 30 has a bottomed cylindrical shape made of metal.
  • an E26 type or E17 type base or the like can be used as a screw-in type Edison type (E type) base.
  • a plug-type base may be used as the base 30.
  • the support column 40 is a stem provided so as to extend from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10, and functions as a holding member that holds the LED modules 20 a and 20 b in the globe 10.
  • One end of the column 40 is connected to the LED modules 20 a and 20 b, and the other end is connected to the support base 50.
  • the support column 40 also functions as a heat radiating member for radiating heat generated in the LED modules 20a and 20b to the base 30 side. Accordingly, the heat radiation efficiency of the support column 40 can be increased by forming the support column 40 from a metal material having a high thermal conductivity, for example, aluminum having a thermal conductivity of 237 [W / m ⁇ K]. As a result, it is possible to suppress a decrease in light emission efficiency and lifetime of the LED due to temperature rise.
  • pillar 40 can also be comprised with resin etc.
  • the support column 40 is configured by, for example, integrally molding a main shaft portion 41 and a fixed portion 42.
  • the main shaft portion 41 is a cylindrical member having a constant cross-sectional area.
  • One end of the main shaft portion 41 is connected to the fixed portion 42, and the other end is connected to the support base 50.
  • the fixing part 42 has a fixing surface to which the LED modules 20a and 20b are fixed, and this fixing surface is in contact with the back surfaces of the substrates of the LED modules 20a and 20b.
  • the fixing portion 42 further has a protruding portion that protrudes from the fixing surface, and this protruding portion fits into a through hole provided in the substrate of the LED modules 20a and 20b.
  • the LED modules 20a and 20b and the fixed surface are bonded to each other with a resin adhesive such as a silicone resin.
  • the surface of the support column 40 preferably has a light reflectance of 30% or more with respect to the light emitted from the LEDs of the LED modules 20a and 20b.
  • pillar 40 has as a main component any one of Al, Cu, and Fe.
  • the support base (support plate) 50 is a support member that supports the support column 40 and is fixed to the resin case 60.
  • the support base 50 is configured to be connected to the opening end of the opening 11 of the globe 10 and close the opening 11 of the globe 10.
  • the support base 50 is formed of a disk-shaped member having a stepped portion on the periphery, and the opening end of the opening 11 of the globe 10 is in contact with the stepped portion. And in this level
  • the support base 50 is made of a metal material having a high thermal conductivity such as aluminum, like the support column 40, so that the heat radiation efficiency of the LED modules 20a and 20b that conduct the heat of the support column 40 by the support table 50 is increased. It is done. As a result, it is possible to further suppress the decrease in light emission efficiency and lifetime of the LED due to temperature rise.
  • the resin case 60 is an insulating case (circuit holder) that insulates the support column 40 and the base 30 and houses the lighting circuit 80.
  • the resin case 60 has a large-diameter cylindrical first case portion 61 and a small-diameter cylindrical second.
  • the case part 62 is comprised.
  • the resin case 60 can be molded by, for example, polybutylene terephthalate (PBT).
  • the second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 30, and a screwing portion for screwing with the base 30 is formed on the outer peripheral surface of the second case portion 62. ing.
  • the two lead wires 70 are a pair of lead wires for supplying power for lighting the LED modules 20a and 20b from the lighting circuit 80 to the LED modules 20a and 20b. From the wire-like metal wires such as copper wires Can be configured. Each lead wire 70 is disposed in the globe 10, one end is electrically connected to the external terminals of the LED modules 20 a and 20 b, and the other end is electrically connected to the power output unit of the lighting circuit 80, in other words, the base 30. Has been.
  • the lead wire 70 also functions as a support portion that supports the LED modules 20a and 20b by being partly connected to the external terminals of the LED modules 20a and 20b.
  • the two lead wires 70 are, for example, vinyl wires composed of a metal core wire and an insulating resin that covers the core wire, and the LED modules 20a and 20b are not covered with the insulating resin and the surface is exposed. It is electrically connected via the core wire. At this time, the core wire may not be covered with the insulating resin between the portion of the two lead wires 70 protruding from the surface of the substrate 21 and the portion protruding from the back surface of the substrate 21 by 3 mm or less.
  • the lighting circuit 80 is a circuit unit for lighting the LEDs of the LED modules 20a and 20b, and includes a plurality of circuit elements and a circuit board on which each circuit element is mounted.
  • the lighting circuit 80 includes a circuit that converts AC power fed from the base 30 into DC power, and supplies the converted DC power to the LEDs of the LED modules 20 a and 20 b via the two lead wires 70.
  • the light bulb shaped lamp 1 is not necessarily provided with the lighting circuit 80.
  • the lighting circuit 80 is not limited to a smoothing circuit, and a dimming circuit, a booster circuit, and the like can be appropriately selected and combined.
  • FIG. 4 the detailed configuration of the LED modules 20a and 20b and the connection relationship between the LED modules 20a and 20b and the lead wire 70 will be described with reference to FIGS. 4, 5, and 6.
  • FIG. 4 the detailed configuration of the LED modules 20a and 20b and the connection relationship between the LED modules 20a and 20b and the lead wire 70 will be described with reference to FIGS. 4, 5, and 6.
  • FIG. 4 is a diagram showing a configuration of the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 5 is an enlarged cross-sectional view of LEDs in the LED modules 20a and 20b of the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 6 is a plan view of the LED modules 20a and 20b of the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 4A is a plan view when the LED module 20a is viewed from above with the globe 10 removed from the light bulb shaped lamp 1.
  • FIG. 4B is a cross-sectional view of the light bulb shaped lamp 1 cut along the line AA ′ in FIG. 4A
  • FIG. 4C is a line BB ′ in FIG.
  • FIG. 4D is a cross-sectional view of the light bulb shaped lamp 1 cut along the line CC ′ of FIG. 4A.
  • (E) is a cross-sectional view of the bulb-type lamp 1 cut along the line DD ′ in (a).
  • FIG. 6A is a plan view when the LED module 20a is viewed from above (the surface side of the substrate) in a state where the sealing member is removed from the LED module 20a.
  • FIG. 6B is a plan view when the LED module 20b is viewed from above (the back side of the substrate) with the sealing member removed from the LED module 20b.
  • the LED module 20a is an example of a main light emitting module (first light emitting module), and has a COB (Chip On Board) structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 21.
  • the LED module 20b is an example of a sub light emitting module (second light emitting module) and has a COB structure in which a bare chip is directly mounted on the back surface (the other main surface) of the substrate 21.
  • the LED module 20a includes a substrate 21, a plurality of LEDs 22 provided on the surface of the substrate 21, a Zener diode 31a, a sealing member 23, metal wires 24 and 26, a wire 25, a conductive adhesive member 27, and terminals (external terminals). 28).
  • the LED module 20b includes a substrate 21, a plurality of LEDs 32 provided on the back surface of the substrate 21, a Zener diode 31b, a sealing member 33, metal wires 34 and 36, a wire 35, a conductive adhesive member 37, and a terminal 38. And.
  • the substrate 21 can be a translucent substrate or a non-translucent substrate, such as a ceramic substrate made of aluminum oxide (alumina) or aluminum nitride, a metal substrate, a resin substrate, a glass substrate, a flexible substrate, an alumina substrate, or the like. It is.
  • the substrate 21 is a rectangular mounting substrate (LED mounting substrate) for mounting the LEDs 22 and 32.
  • the substrate 21 is preferably composed of a white substrate such as a white alumina substrate having a low light transmittance with respect to the light emitted from the LEDs 22 and 32, for example, 10% or less, or a metal substrate.
  • the substrate 21 has a light reflectance of 50% or more with respect to the light emitted from the LEDs 22 and 32, and is composed of a substrate mainly composed of any one of Al 2 O 3 , MgO, SiO, and TiO 2. be able to.
  • the light transmittance of the substrate 21 is high, a part of the light of the LED 22 on the front surface side of the substrate 21 is emitted from the back surface side of the substrate 21 in the LED module 20 a after passing through the substrate 21.
  • the LED module 20 b a part of the light of the LED 32 on the back surface side of the substrate 21 is emitted from the front surface side of the substrate 21 after passing through the substrate 21. Therefore, in the light bulb shaped lamp 1, color unevenness occurs with respect to light extracted from the base side and the opposite side. On the other hand, such color unevenness can be suppressed by reducing the light transmittance of the substrate 21. Further, since an inexpensive white substrate can be used, the cost of the light bulb shaped lamp 1 can be reduced.
  • Two through holes 21b that penetrate from the front surface to the back surface of the substrate 21 are provided at both ends of the long side direction of the substrate 21. These two through holes 21b constitute terminals 28 and 38 for connecting the power supply lead wire 70 and the LED modules 20a and 20b, and the lead wire 70 is inserted into each of the two through holes 21b. .
  • one through hole 21 a that penetrates from the front surface to the back surface of the substrate 21 is provided.
  • the through-hole 21a is for fixing the LED modules 20a and 20b to the support column 40, and the protruding portion 42b of the support column 40 is fitted into the through-hole 21a.
  • the through hole 21a may not be provided.
  • the substrate 21 preferably has a light reflectance of 50% or more with respect to light emitted from the element array of the LED 22 and the element array of the LED 32. Then, the substrate 21, Al 2 O 3, MgO, SiO, and it is preferable that a main component one of TiO 2. Thereby, the light transmittance of the board
  • substrate 21 can be made low and the color nonuniformity of the light emitted from LED module 20a and 20b can be suppressed. Further, it is possible to reduce the cost of the light bulb shaped lamp 1 by using a low-cost white substrate for the substrate 21.
  • the back surface of the substrate 21 is bonded and fixed to the column 40 so as to be in contact with the column 40, and the LED modules 20a and 20b are directly fixed to the column 40.
  • substrate 21 can be improved.
  • a plurality of LEDs 22 are mounted on the surface of the substrate 21.
  • the plurality of LEDs 22 includes a plurality of element rows arranged in a straight line at the same pitch in the long side direction of the substrate 21 in a direction perpendicular to the short side direction of the substrate 21, that is, the arrangement direction of the LEDs 22 in the element row of the LED 22. They are arranged so that they are lined up.
  • the plurality of LEDs 22 are connected in series between the two terminals 28 (between the pair of lead wires 70) in the element row, and are connected in parallel between the two terminals 28 (between the pair of lead wires 70) in the element row. It is connected.
  • This element row is an example of the first light emitting element group.
  • the distance (pitch) between adjacent LEDs 22 in the element row is 1.8 mm
  • the distance between the LED 22 in one element row and the LED 22 in the other element row in the adjacent element row is, for example, 4 mm. It is arranged to become.
  • the plurality of LEDs 22 are configured by LEDs 22 having substantially the same current-voltage characteristics, specifically LEDs 22 having substantially the same forward voltage (threshold voltage) Vf, for example, LEDs 22 having a forward voltage of 3.3V. And each of the element row
  • a plurality of LEDs 32 are mounted on the back surface of the substrate 21.
  • the plurality of LEDs 32 includes a plurality of element rows arranged in a straight line at the same pitch in the long side direction of the substrate 21 in a direction perpendicular to the short side direction of the substrate 21, that is, the arrangement direction of the LEDs 32 in the element row of the LED 32. They are arranged so that they are lined up.
  • the plurality of LEDs 32 are connected in series between the two terminals 38 (between the pair of lead wires 70) in the element row, and are parallel between the two terminals 38 (between the pair of lead wires 70) in the element row. It is connected.
  • This element row is an example of the second light emitting element group.
  • the plurality of LEDs 32 are configured by LEDs 32 having substantially the same current-voltage characteristics, specifically, LEDs 32 having substantially the same forward voltage Vf, for example, LEDs 32 having a forward voltage of 3.3V. And each of the element row
  • the LEDs 22 and 32 are bare chips that emit monochromatic visible light in all directions, that is, laterally, upwardly and downwardly.
  • the LEDs 22 and 32 emit, for example, 20% of the total amount of light laterally, 60% of the total amount of light upward, and 20% of the total amount of light downward.
  • the LEDs 22 and 32 are rectangular (square) blue LED chips that emit blue light when energized, for example, having a side length of about 0.35 mm (350 ⁇ m).
  • the blue LED chip for example, a gallium nitride based semiconductor light emitting device having a central wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.
  • the LEDs 22 and 32 include a sapphire substrate 122a and a plurality of nitride semiconductor layers 122b that are stacked on the sapphire substrate 122a and have different compositions.
  • a cathode electrode 122c and an anode electrode 122d are provided at both ends of the upper surface of the nitride semiconductor layer 122b.
  • a wire bond portion 122e is provided on the cathode electrode 122c, and a wire bond portion 122f is provided on the anode electrode 122d.
  • the cathode electrode 122c of one LED 22 and the anode electrode 122d of the other LED 22 are connected by a wire 25 via wire bond portions 122e and 122f.
  • the LEDs 22 and 32 are fixed on the substrate 21 with a translucent chip bonding material 122g so that the surface on the sapphire substrate 122a side faces the front surface or the back surface of the substrate 21.
  • a translucent chip bonding material 122g a silicone resin containing a filler composed of metal oxide can be used.
  • the back surface of the substrate 21 and the fixed surface of the fixing portion 42 of the support column 40 are brought into contact with each other. These members are not provided. Therefore, on the back surface of the substrate 21, the element rows of the plurality of LEDs 32 are provided so as to sandwich the fixing portion 42. It is getting bigger.
  • the number of element rows of the LED 32 is smaller than the number of element rows of the LED 22, and the total number of LEDs 32 is smaller than the total number of LEDs 22. Therefore, there is a concern that the LEDs 32 and 22 may have different lifetimes due to different input current amounts.
  • the LEDs 22 and 32 have substantially the same forward voltage Vf, and the number of the LEDs 22 in the element array of the LED 22 and the number of the LEDs 32 in the element array of the LED 32 are the same. Accordingly, when the element array of the LED 22 and the element array of the LED 32 are regarded as one LED, each has substantially the same forward voltage Vf. Thereby, the amount of input current can be made substantially the same between the element array of the LED 22 and the element array of the LED 32 that are connected in parallel, and variation in life can be suppressed. That is, the LED modules 20a and 20b can be prevented from changing the lifetime of the LEDs.
  • the sealing member 23 is a conversion member that converts the wavelength of light emitted from the LED 22, and is formed to cover the LED 22.
  • the sealing member 23 is a sealing resin composed of a wavelength conversion material that converts the wavelength of light emitted from the LED 22 and a resin material containing the wavelength conversion material.
  • the wavelength conversion material phosphor particles that are excited by light emitted from the LED 22 to emit light of a desired color (wavelength) can be used, or light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment. It is also possible to use a material containing a substance that emits light having a wavelength different from that of the absorbed light. Note that a light diffusing material such as silica particles may be dispersed in the sealing member 23.
  • phosphor particles when the LED 22 is a blue LED that emits blue light, phosphor particles that convert the wavelength of the blue light into yellow light are used in order to emit white light from the sealing member 23.
  • YAG (yttrium / aluminum / garnet) -based yellow phosphor particles can be used as the phosphor particles.
  • the blue light which was not absorbed by the yellow phosphor particles (the wavelength was not converted) and the yellow light which was wavelength-converted by the yellow phosphor particles were diffused and mixed in the sealing member 23.
  • the white light is emitted from the sealing member 23.
  • green phosphor particles, red phosphor particles, and the like may be used as the phosphor particles.
  • the LED 22 is an LED 22 that emits ultraviolet light
  • a combination of phosphor particles that emit light in the three primary colors (red, green, and blue) is used.
  • the resin material containing the phosphor particles a transparent resin material such as a silicone resin, an organic material such as a fluorine-based resin, and an inorganic material such as low-melting glass and sol-gel glass can be used.
  • the sealing member 23 having the above-described configuration is formed linearly along the arrangement direction of the plurality of LEDs 22 constituting the element row, and collectively seals the element rows of the LED 22. At the same time, a plurality of sealing members 23 are formed along the arrangement direction of the element rows, and individually seal different element rows.
  • Each sealing member 23 has a length of 24 mm, a line width of 1.6 mm, and a center maximum height of 0.7 mm, for example.
  • the sealing member 33 is a conversion member that converts the wavelength of light emitted by the LED 32 and is formed so as to cover the LED 32.
  • the sealing member 33 is a sealing resin composed of a wavelength conversion material that converts the wavelength of light emitted from the LED 32 and a resin material that contains the wavelength conversion material.
  • the wavelength conversion material phosphor particles that are excited by the light emitted from the LED 32 to emit light of a desired color (wavelength) can be used, or light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment. It is also possible to use a material containing a substance that emits light having a wavelength different from that of the absorbed light.
  • the sealing member 33 is formed linearly along the arrangement direction of the plurality of LEDs 32 constituting the element row, and collectively seals the element rows of the LED 32. At the same time, a plurality of sealing members 33 are formed along the arrangement direction of the element rows, and individually seal different element rows.
  • each sealing member 23 and 33 may be formed so as to individually cover the LEDs 22a, 22b and 32, instead of sealing a plurality of LEDs at once.
  • each sealing member 23 and 33 can be formed in a substantially hemispherical shape.
  • the Zener diode 31 a is a protective element that protects the LED 22 by passing a current when an electrostatic voltage or the like having a reverse polarity is generated in the LED 22 in the manufacture of the LED module 20 a, and is mounted on the surface of the substrate 21.
  • the Zener diode 31a is disposed between the element rows of the LED 22 in a direction orthogonal to the arrangement direction of the LEDs 22 in the element row of the LED 22.
  • the Zener diode 31a is connected between the two terminals 28 by the metal wiring 26 so as to be electrically connected in parallel with the element rows of the plurality of LEDs 22.
  • the Zener diode 31b is a protective element that protects the LED 32 by passing a current when an electrostatic voltage of reverse polarity is generated in the LED 32 in the manufacture of the LED module 20b, and is mounted on the back surface of the substrate 21. ing.
  • the Zener diode 31b is disposed between the element rows of the LED 32 in a direction orthogonal to the arrangement direction of the LEDs 32 in the element row of the LED 32.
  • the Zener diode 31b is connected between the two terminals 38 by the metal wiring 36 so as to be electrically connected in parallel with the element rows of the plurality of LEDs 32.
  • Two metal wirings 26 are formed in an island shape in a predetermined shape at both ends of the substrate 21 in order to electrically connect the element array of the LED 22 and the Zener diode 31a and the terminal 28 in parallel. These two metal wirings 26 are formed on the surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 22 and the Zener diodes 31a.
  • the metal wiring 26 protrudes toward the element row at a portion adjacent to the element row of the LED 22 and the Zener diode 31 a on the surface of the substrate 21.
  • the protruding portion of the metal wiring 26 serves as a connection portion between the LED 22 and the wire 25 from the Zener diode 31a.
  • two metal wirings 36 are formed in an island shape in a predetermined shape at both ends of the substrate 21 in order to electrically connect the element array of the LED 32 and the Zener diode 31b and the terminal 38 in parallel. These two metal wirings 36 are formed on the back surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 32 and the Zener diodes 31b.
  • the metal wiring 36 protrudes toward the element row on the back surface of the substrate 21 at a portion adjacent to the element row of the LED 32 and the Zener diode 31b.
  • the protruding portion of the metal wiring 36 becomes a connection portion with the wire 35 from the LED 32 and the Zener diode 31b.
  • the terminal 28 is a power supply electrode provided with the conductive adhesive member 27, for example, a solder electrode to be soldered, and the surface of the substrate 21 so as to surround the through hole 21b and the opening on the surface side of the substrate 21 of the through hole 21b. And a connection land formed in a predetermined shape.
  • Two terminals 28 are formed corresponding to each of the two metal wirings 26.
  • the pair of terminals 28 are formed integrally with the corresponding metal wiring 26 and are connected by being in contact with the corresponding metal wiring 26.
  • One wiring pattern is constituted by such a corresponding set of metal wirings 26 and terminals 28.
  • the terminal 28 is a power supply unit of the LED module 20a, and receives power from the outside of the LED module 20a in order to cause the LED 22 to emit light, and supplies the received power to each LED 22 via the metal wirings 26 and 24 and the wire 25. .
  • the terminal 38 is a power supply electrode on which the conductive adhesive member 37 is provided, and is formed in a predetermined shape on the back surface of the substrate 21 so as to surround the through hole 21b and the opening on the back surface side of the substrate 21 of the through hole 21b. And a connecting land.
  • Two terminals 38 are formed corresponding to each of the two metal wirings 36.
  • the pair of terminals 38 are formed integrally with the corresponding metal wiring 36 and are connected by being in contact with the corresponding metal wiring 36.
  • One wiring pattern is constituted by such a corresponding set of metal wirings 36 and terminals 38.
  • the terminal 38 is a power feeding unit of the LED module 20b, and receives power from the outside of the LED module 20b in order to cause the LED 32 to emit light, and supplies the received power to each LED 32 via the metal wirings 36 and 34 and the wire 35. .
  • the terminals 28 and 38 are arranged so as to be substantially concentric.
  • a plurality of metal wirings 24 are formed in a predetermined shape on the surface of the substrate 21 in order to electrically connect the plurality of LEDs 22 in series.
  • the plurality of metal wirings 24 are formed in an island shape on the surface of the substrate 21 between the LEDs 22 adjacent in the element array.
  • a plurality of metal wirings 34 are formed in a predetermined shape on the back surface of the substrate 21 in order to electrically connect the plurality of LEDs 32 in series.
  • the plurality of metal wirings 34 are formed in an island shape between the LEDs 32 adjacent in the element row on the back surface of the substrate 21.
  • the metal wirings 26 and 24 and the terminal 28 having the above-described configuration are simultaneously patterned with the same metal material.
  • the metal material for example, silver (Ag), tungsten (W), copper (Cu), or the like can be used.
  • the metal wirings 26 and 24 and the surface of the terminal 28 may be plated with nickel (Ni) / gold (Au) or the like.
  • the metal wirings 26 and 24 and the terminal 28 may be comprised by a different metal material, and may be formed in a separate process.
  • the metal wirings 36 and 34 and the terminal 38 are simultaneously patterned with the same metal material.
  • the wire 25 is an electric wire for connecting the LED 22 and the metal wiring 26 or the LED 22 and the metal wiring 24, and is, for example, a gold wire. As described with reference to FIG. 5, by this wire 25, each of the wire bonding portions 122 e and 122 f provided on the upper surface of the LED 22 and the metal wiring 26 or the metal wiring 24 formed adjacent to both sides of the LED 22 are wire-bonded. Has been.
  • the entire wire 25 is embedded in the sealing member 23 so as not to be exposed from the sealing member 23, for example.
  • the wire 35 is an electric wire for connecting the LED 32 and the metal wiring 36 or the LED 32 and the metal wiring 34. As described with reference to FIG. 5, the wire 35 allows wire bonding between the wire bonding portions 122 e and 122 f provided on the upper surface of the LED 32 and the metal wiring 36 or the metal wiring 34 formed adjacent to both sides of the LED 32. Has been.
  • the entire wire 35 is embedded in the sealing member 33 so as not to be exposed from the sealing member 33, for example.
  • the conductive adhesive member 27 is a conductive adhesive such as solder or silver paste that connects the terminal 28 to the lead wire 70.
  • the conductive adhesive member 27 is provided in contact with both the terminal 28 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 28.
  • the conductive adhesive member 27 is provided so as to close the opening on the surface side of the substrate 21 of the through hole 21b.
  • the conductive adhesive member 37 is a conductive adhesive that connects the terminal 38 to the lead wire 70.
  • the conductive adhesive member 37 is provided in contact with both the terminal 38 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 38.
  • the conductive adhesive member 37 is provided so as to close the opening on the back surface side of the substrate 21 of the through hole 21b.
  • the conductive adhesive member 27 may be covered with an insulating resin.
  • the insulating resin may be a white resin having a low light transmittance with respect to the light emitted from the LEDs 22 and 32, for example, 10% or less.
  • the two lead wires 70 and the terminals 38 are connected by the conductive adhesive member 27. It is formed by connecting and connecting the two lead wires 70 and the terminal 28 by the conductive adhesive member 37.
  • the lead wire 70 is provided so as to be inserted from the opening on the back surface side of the through hole 21b and protrude from the opening on the front surface side of the through hole 21b.
  • a conductive adhesive member 37 is provided so as to be in contact with both the rear surface side portion of the lead wire 70 and the terminal 38, and the conductive adhesive member 27 is provided so as to be in contact with both the front surface portion and the terminal 28.
  • the terminal 28 and the terminal 38 are connected by the lead wire 70.
  • the terminals 28 and 38 are connected to the same lead wire 70, and the plurality of LEDs 22 on the surface of the substrate 21 and the plurality of LEDs 32 on the back surface of the substrate 21 are connected in parallel to the lead wire 70. That is, the LED module 20 a and the LED module 20 b are electrically connected in parallel via the pair of lead wires 70.
  • the current supplied to one positive lead wire 70 passes through the conductive adhesive member 27, the terminal 28, the metal wiring 26, the LED 22 and the metal wiring 24, and the other negative voltage. Is output from the lead wire 70 on the side.
  • the current supplied to one positive-side lead wire 70 passes through the conductive adhesive member 37, the terminal 38, the metal wiring 36, the LED 32, and the metal wiring 34, and the other negative-side lead wire 70. Output from the lead wire 70.
  • the conductive adhesive members 27 and 37 are provided apart from each other with a space in the through hole 21b.
  • the conductive adhesive members 27 and 37 may be provided as a single adhesive member instead of separate members. That is, one conductive member may be provided continuously in the through hole 21 b, on the surface of the substrate 21, and on the back surface of the substrate 21 so as to contact the terminals 28 and 38 and the lead wire 70. .
  • the tip of the lead wire 70 is provided so as to be exposed on the surface of the conductive adhesive member 27, but it may be completely covered with the conductive adhesive member 27. In this case, since the contact area between the lead wire 70 and the conductive adhesive member 27 increases, the connection between the two can be strengthened.
  • the light bulb shaped lamp 1 includes the translucent globe 10, the support column 40 provided so as to extend inward of the globe 10, and the support column 40.
  • LED modules 20a and 20b fixed to the.
  • the light bulb shaped lamp 1 further includes a lighting circuit 80 for supplying power to the LED modules 20a and 20b, and a pair of lead wires 70 for electrically connecting the LED modules 20a and 20b and the lighting circuit 80.
  • the LED module 20 a is provided side by side on the surface of the substrate 21, and has an element array of LEDs 22 including a plurality of LEDs 22 connected in series between a pair of lead wires 70.
  • the LED module 20 b is provided side by side on the back surface of the substrate 21, and has an LED 32 element array including a plurality of LEDs 32 connected in series between a pair of lead wires 70.
  • the LED modules 20 a and 20 b (element row of the LED 22 and element row of the LED 32) are electrically connected in parallel via a pair of lead wires 70.
  • the number of LEDs 22 in the LED module 20a is different from the number of LEDs 32 in the LED module 20b, and the forward voltage of the element row of the LED 22 is substantially the same as the forward voltage of the element row of the LED 32.
  • the LED module 20a has at least two element rows of the LEDs 22, and the LED module 20b has at least two element rows of the LEDs 32.
  • the LED module 20a and the LED module 20b are connected in parallel to the LED22 element array and the LED32 element array, and the LED22 element array and the LED32 element array have the same forward voltage. Therefore, the lifetime of the element array of the LED 22 and the element array of the LED 32, that is, the LED modules 20a and 20b can be made uniform, and the occurrence of a situation where only one of the LED modules on the front surface side and the back surface side of the substrate 21 emits light is suppressed. Can do. As a result, a wide light distribution angle can be maintained over a long period of time.
  • the current value flowing through the LED module 20a is higher than the current value flowing through the LED module 20b. That is, the LED module 20a has a higher luminous flux than the LED module 20b.
  • the light of the LED module 20b that is, the light on the base side is blocked by the base 30, the resin case (circuit case), etc., so that light loss occurs. Therefore, by setting the luminous flux of the LED module 20a higher than that of the LED module 20b, for example, when the LED modules 20a and 20b are designed with the same number of chips, the luminous flux of the light bulb shaped lamp can be increased.
  • the forward voltage of the LED 22 is substantially the same as the forward voltage of the LED 32, and the number of LEDs 22 in the element row of the LED 22 is equal to the number of LEDs 32 in the element row of the LED 32. The same.
  • the forward voltage of the element array of the LED 22 and the forward voltage of the element array of the LED 32 can be easily aligned.
  • the light bulb shaped lamp 1 of the present embodiment power is supplied to the LED modules 20a and 20b simply by connecting the lead wire 70 through the through-hole 21b to the two terminals 28 and 38 by the conductive adhesive members 27 and 37. It is realized by connecting with. Therefore, compared to a configuration in which the lead wire 70 is connected to one of the terminals 28 and 38 and the terminal 28 and the terminal 38 are connected by a via hole or the like, a configuration of a via hole or the like that connects the terminal 28 and the terminal 38 is unnecessary. It becomes.
  • the number of lead wires 70 can be halved compared to a configuration in which separate lead wires 70 are connected to the terminals 28 and 38. As a result, the light bulb shaped lamp 1 having a simple structure can be realized.
  • the forward voltage of the LED 22 is substantially the same as the forward voltage of the LED 32, and the number of LEDs 22 in the element row of the LED 22 is equal to the number of LEDs 32 in the element row of the LED 32. Made the same. However, as shown in the plan view of the LED modules 20a and 20b in FIG. 7, the forward voltage of the LED 22 is different from the forward voltage of the LED 32, and the number of LEDs 22 in the element row of the LED 22 is the number of LEDs 32 in the element row of the LED 32. And may be different.
  • the forward voltage of the LED 22 is smaller than the forward voltage of the LED 32, and the number of LEDs 22 in the element row of the LED 22 may be larger than the number of LEDs 32 in the element row of the LED 32. Even in this case, the forward voltage of the element array of the LED 22 and the forward voltage of the element array of the LED 22 can be made substantially the same so that the lifetimes of the LED modules 20a and 20b can be made uniform.
  • FIG. 7A is a plan view when the LED module 20a is viewed from above (on the surface side of the substrate 21) with the sealing member removed from the LED module 20a.
  • 7B is a plan view when the LED module 20b is viewed from above (the back side of the substrate 21) with the sealing member removed from the LED module 20b.
  • the forward voltage of the LED 22 is substantially the same as the forward voltage of the LED 32, and the number of LEDs 22 in the element row of the LED 22 is equal to the number of LEDs 32 in the element row of the LED 32. Made the same. However, if the forward voltage of the LED 22 element row and the forward voltage of the LED 22 element row can be made substantially the same by providing a resistance or the like in the LED element row, the forward voltage of the LEDs 22 and 32 and the LED 22 and 32 The number of LEDs in the element row may be any.
  • the forward voltage of the LED 22 is made smaller than the forward voltage of the LED 32
  • the number of the LEDs 22 in the element array of the LED 22 is equal to the number of the LEDs 32 in the element array of the LED 32
  • a resistor is connected only to the element array of the LED 22 Also good.
  • the number of LEDs 22 in the element array of LED22 is made smaller than the number of LEDs 32 in the element array of LED32, the forward voltage of LED22 and the forward voltage of LED32 are made substantially the same, and a resistor is connected only to the element array of LED22. May be.
  • the relationship between the LED element array and the forward voltage may be reversed to that described above with respect to the LEDs 22 and 32, and a resistor may be connected only to the LED 32 element array. At this time, a diode that does not emit light (dummy light emitting element) or the like may be used as the resistor.
  • the light bulb shaped lamp 1 of the above embodiment forms two LED modules 20a and 20b by providing a light source and wiring for emitting light on both the front and back surfaces of a single substrate 21. It was assumed that light was extracted to the base side and the opposite side. However, it is also possible to provide a light source and wiring for emitting light separately on the surfaces of two separate substrates, and bond the back surfaces of the two substrates to form one substrate 21. The light can be extracted. Therefore, the light bulb shaped lamp according to this modification is the above-described embodiment in that the substrate 21 of the LED module is configured by bonding two substrates each having a light source and wiring for emitting light on the surface thereof with an adhesive. Different from the light bulb shaped lamp 1 of Hereinafter, the difference from the light bulb shaped lamp 1 of the above-described embodiment will be described in detail.
  • FIG. 8 is a diagram showing a configuration of a light bulb shaped lamp according to a modification of the embodiment of the present invention.
  • FIG. 8 is a top view when the LED module 120a is seen from the top in the state which remove
  • 8B is a cross-sectional view of the same light bulb shaped lamp cut along the line AA ′ in FIG. 8A.
  • FIG. 8C is a cross-sectional view taken along the line BB ′ in FIG.
  • FIG. 8D is a cross-sectional view of the light bulb shaped lamp cut along the line CC ′
  • FIG. 8D is a cross sectional view of the light bulb shaped lamp cut along the line CC ′ in FIG. ) Is a cross-sectional view of the same light bulb shaped lamp cut along the line DD ′ in FIG.
  • the LED module 120a is an example of a main light emitting module (first light emitting module), and has a COB structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 29.
  • the LED module 120b is an example of a sub light emitting module (second light emitting module), and has a COB structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 39.
  • the LED module 120a includes a substrate 29, a plurality of LEDs 22 provided on the surface of the substrate 29, a Zener diode (not shown), a sealing member 23, metal wirings 24 and 26, a wire 25, a conductive adhesive member 27, and a terminal. 28.
  • the LED module 120b includes a substrate 39, a plurality of LEDs 32 provided on the surface of the substrate 39, a Zener diode (not shown), a sealing member 33, metal wirings 34 and 36, a wire 35, and a conductive adhesive member 37. And a terminal 38.
  • the substrate 29 is an example of a main substrate, and the substrate 39 is an example of a sub substrate.
  • the substrates 29 and 39 have the same configuration and shape as each other, and the back surfaces of the substrates 29 and 39 are bonded together by an adhesive 90 to form one substrate 21.
  • a light-transmitting substrate or a non-light-transmitting substrate can be used, for example, a ceramic substrate made of aluminum oxide or aluminum nitride, a metal substrate, a resin substrate, a glass substrate, a flexible substrate, or the like.
  • the substrate 29 is a rectangular mounting substrate for mounting the LEDs 22, and the substrate 39 is a rectangular mounting substrate for mounting the LEDs 32.
  • the substrates 29 and 39 are preferably made of a white substrate such as a white alumina substrate having a low light transmittance with respect to the light emitted from the LEDs 22 and 32, for example, 10% or less.
  • the substrates 29 and 39 are substrates that have a light reflectance of 50% or more with respect to the light emitted from the LEDs 22 and 32 and are mainly composed of any one of Al 2 O 3 , MgO, SiO, and TiO 2. Can be configured.
  • substrate 21 can be made low, and the color nonuniformity of the light emitted from LED module 120a and 120b can be suppressed.
  • substrate can be used for the board
  • Two through holes 29b are provided at both ends in the long side direction of the substrate 29 so as to penetrate from the front surface to the back surface of the substrate 29.
  • Two through-holes 39b penetrating toward are provided.
  • the through hole 29b constitutes a terminal 28 for connecting the lead wire 70 for power feeding and the LED module 120a
  • the through hole 39b is a terminal 38 for connecting the lead wire 70 for power feeding and the LED module 120b.
  • the through holes 29 b and 39 b are arranged so as to be continuous to form the through hole 21 b of the substrate 21. Therefore, one lead wire 70 is inserted through one continuous through hole 29b and 39b.
  • One through-hole 29 a that penetrates from the front surface of the substrate 29 toward the back surface is provided in the central portion of the substrate 29, and one penetration that penetrates from the front surface of the substrate 39 toward the back surface also in the central portion of the substrate 39.
  • a hole 39a is provided.
  • the through holes 29 a and 39 a are for fixing the LED modules 120 a and 120 b to the support column 40, and are arranged so as to form one through hole 21 a of the substrate 21. Accordingly, the protrusion 42b of the support column 40 is fitted into the continuous through holes 29a and 39a.
  • the adhesive 90 is provided between the back surface of the substrate 29 and the back surface of the substrate 39 and adheres both, and is made of, for example, a resin such as a silicone resin or a metal paste such as an Ag paste.
  • a resin such as a silicone resin
  • a metal paste such as an Ag paste.
  • the thermal conductivity between the substrate 29 and the substrate 39 is increased and the thermal conductivity as the substrate 21 is increased, so that the heat dissipation efficiency of the substrate 21 can be increased.
  • the light shielding property of the adhesive 90 that is, the light shielding property of the substrate 21 can be improved, color unevenness due to light traveling from the front surface to the back surface of the substrates 29 and 39 can also be suppressed.
  • the adhesive 90 prevents at least a part of the space between the through holes 29b and 39b between the back surface of the substrate 29 and the back surface of the substrate 39 so that the lead wire 70 does not interfere with the insertion of the through holes 29b and 39b. Is not provided. Further, the adhesive 90 does not interfere with the fitting between the through holes 29a and 39a and the protrusions of the support column 40, and between the through holes 29a and 39a between the back surface of the substrate 29 and the back surface of the substrate 39. It is not provided in all of the spaces.
  • the LED modules 120a and 120b in FIG. 8 In the manufacture of the LED modules 120a and 120b in FIG. 8, first, a plurality of LEDs 22, a Zener diode, a sealing member 23, metal wirings 24 and 26, wires 25, and terminals 28 are provided on the surface of the substrate 29. Similarly, a plurality of LEDs 32, Zener diodes, sealing members 33, metal wirings 34 and 36, wires 35 and terminals 38 are provided on the surface of the substrate 39. Then, after the substrates 29 and 39 are bonded by the adhesive 90, the two lead wires 70 and the terminal 28 are connected by the conductive adhesive member 27, and the two lead wires 70 and the terminal 38 are connected by the conductive adhesive member 37. Is connected. Therefore, the LED modules 120a and 120b can be easily manufactured as compared with the case where a light source and wiring for emitting light are provided on both the front and back surfaces of one substrate 29.
  • a light bulb shaped lamp having a wide light distribution angle can be realized for the same reason as the light bulb shaped lamp 1 of the above embodiment.
  • the substrate 21 is composed of a substrate 29 provided with an element array of LEDs 22 on the surface and a substrate 39 provided with an element array of LEDs 32 on the surface.
  • the substrates 29 and 39 are arranged so that the back surfaces of the LED 22 and the LED 32 that are not provided with the element rows face each other.
  • the LED module 120b may be bonded and fixed to the support column 40.
  • the LED modules 120a and 120b can be manufactured simply by preparing the separate substrates 29 and 39 and individually providing the respective members on the respective surfaces, and then bonding them, so that the LED modules 120a and 120b can be manufactured. Can be made easier. As a result, a light bulb shaped lamp that is easy to manufacture can be realized.
  • the LED module 120a further includes a Zener diode electrically connected in parallel with the element array of the LED 22.
  • the LED module 120b further includes a Zener diode electrically connected in parallel with the element array of the LED 32.
  • the Zener diodes are individually provided, so that the LEDs 22 and 32 can be protected from electrostatic voltage or the like.
  • the LED module 120b is directly attached to the support column 40, and heat generated by the LED module 120b is transferred to the support column 40.
  • the LED module 120a is indirectly attached to the support
  • An adhesive 90 as a heat conducting member is provided between the LED modules 120a and 120b.
  • the adhesive 90 is any one of a heat conductive resin, a ceramic paste, and a metal paste.
  • the heat dissipation efficiency and light shielding performance of the substrate 21 can be improved, so that the light emission efficiency and lifetime of the LEDs 22 and 32 are further suppressed, and at the same time, the color unevenness of the light emitted by the LED modules 120a and 120b is further suppressed. Can do.
  • the substrate 39 has a through-hole 39b that penetrates from the front surface to the back surface of the substrate 39, and the support column 40 penetrates the through-hole 39b of the substrate 39. You may contact the back side. That is, the through hole 39 b may be formed so as to fit the entire fixing portion 42 of the support column 40, and the fixing surface of the fixing portion 42 of the support column 40 and the back surface of the substrate 29 may be bonded by the adhesive 90. Thereby, the LED modules 120a and 120b can be easily fixed to the support column 40, and a light bulb shaped lamp that can be easily manufactured can be realized.
  • the LED module 120a is bonded and fixed to the support column 40 to shorten the heat dissipation path from the substrate 29 to the support column 40, and the inner wall of the through hole 39b of the substrate 39 and the fixing portion 42 of the support column 40 are thermally conductive such as grease.
  • the heat dissipation path from the substrate 39 to the support column 40 can be widened by contacting through the member. As a result, it is possible to further suppress a decrease in the light emission efficiency and lifetime of the LEDs 22 and 32.
  • the light bulb shaped lamp according to the present invention has been described based on the embodiment and the modification.
  • the present invention is not limited to the embodiment and the modification.
  • the present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention.
  • the LED is exemplified as the light emitting element.
  • a semiconductor light emitting element such as a semiconductor laser
  • an EL element such as an organic EL (Electro Luminescence) or an inorganic EL, and other light emitting elements are used. It may be used.
  • the LED module has a COB type configuration in which the LED is directly mounted on the substrate, but is not limited thereto.
  • a package-type LED SMD: Surface Mount Device
  • an LED chip is mounted in a cavity (concave) of a resin-molded container and a phosphor-containing resin is enclosed in the cavity.
  • a plurality of element rows are provided on each of the front and back surfaces of the substrate.
  • only one element row may be provided.
  • the LED arrangement direction is parallel in the LED element arrays on the front and back surfaces of the substrate, and the predetermined direction included in the plane of the substrate intersects, for example, is orthogonal to the alignment direction.
  • the short side direction of the substrate is shown as an example of this direction, the predetermined direction is not limited to the short side direction.
  • the support column has a shape in which the width of the LED element array is widened in the direction toward the front of the light bulb shaped lamp, that is, in the direction from the support base toward the LED module. did.
  • the support column may have a shape in which the width of the LED element array is narrowed in the direction toward the front of the light bulb shaped lamp.
  • the lead wire is provided outside the support column.
  • a cavity is provided in the support column 40B.
  • a part of the lead wire may be disposed through the cavity of the support column 40B.
  • the lead wire 70 is provided so as to pierce the substrate from the back surface side of the substrate, but may be provided so as to pierce from the front surface side of the substrate by wrapping around to the front surface side of the substrate.
  • the LED element row is configured from LEDs arranged in a row, but is configured from LEDs arranged in a zigzag shape or the like in which the row is folded in the middle. May be.
  • the present invention can also be realized as an illumination device including the above-described light bulb shaped lamp.
  • the lighting device 100 may be configured to include the above-described light bulb shaped lamp 1 and a lighting fixture (lighting fixture) 200 to which the light bulb shaped lamp 1 is attached.
  • the lighting device 200 is for turning off and lighting the light bulb shaped lamp 1 and includes, for example, a device main body 210 attached to the ceiling and a lamp cover 220 covering the light bulb shaped lamp 1.
  • the appliance main body 210 has a socket 211 to which the cap of the light bulb shaped lamp 1 is attached and which supplies power to the light bulb shaped lamp 1.
  • a translucent plate may be provided in the opening of the lamp cover 220.
  • the present invention is useful as a light bulb shaped lamp that replaces a conventional incandescent light bulb and the like, and can be widely used in lighting devices and the like.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne une lampe en forme d'ampoule (1) qui est pourvue : d'un globe (10) ; d'une broche de support (40) ; de modules de DEL (20a, 20b) ; d'un circuit d'allumage (80) ; et d'une paire de fils de sortie (70). Le module de DEL (20a) comprend un ensemble d'éléments de DEL (22), ledit ensemble d'éléments étant composé d'une pluralité de DEL (22) qui sont disposées sur la surface avant d'un substrat (21) et raccordées en série entre la paire de fils de sortie (70). Le module de DEL (20b) comprend un ensemble d'éléments de DEL (32), ledit ensemble d'éléments étant composé d'une pluralité de DEL (32) qui sont disposées sur la surface arrière du substrat (21) et raccordées en série entre la paire de fils de sortie (70). Le module de DEL (20a) et le module de DEL (20b) sont raccordés respectivement en parallèle l'un avec l'autre via la paire de fils de sortie (70). Le nombre de DEL (22) dans le module de DEL (20a) est différent du nombre de DEL (32) dans le module de DEL (20b). La tension directe de l'ensemble d'éléments de DEL (22) est généralement égale à la tension directe de l'ensemble d'éléments de DEL (32).
PCT/JP2013/002920 2012-08-21 2013-05-02 Lampe en forme d'ampoule et dispositif d'éclairage Ceased WO2014030275A1 (fr)

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JP2012-182292 2012-08-21

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3715699A1 (fr) * 2019-03-29 2020-09-30 GaN Power Technology Co., Ltd. Ampoule à del
WO2024227634A1 (fr) * 2023-05-04 2024-11-07 Signify Holding B.V. Source d'éclairage à base de diode électroluminescente, del, comprenant deux chaînes de del pour émettre de la lumière, ainsi que dispositif d'éclairage à base de del

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010157459A (ja) * 2008-12-31 2010-07-15 Keiji Iimura Ｌｅｄランプおよび電球形ｌｅｄランプ
WO2012060106A1 (fr) * 2010-11-04 2012-05-10 パナソニック株式会社 Lampe du type ampoule et dispositif d'éclairage

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010157459A (ja) * 2008-12-31 2010-07-15 Keiji Iimura Ｌｅｄランプおよび電球形ｌｅｄランプ
WO2012060106A1 (fr) * 2010-11-04 2012-05-10 パナソニック株式会社 Lampe du type ampoule et dispositif d'éclairage

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3715699A1 (fr) * 2019-03-29 2020-09-30 GaN Power Technology Co., Ltd. Ampoule à del
WO2024227634A1 (fr) * 2023-05-04 2024-11-07 Signify Holding B.V. Source d'éclairage à base de diode électroluminescente, del, comprenant deux chaînes de del pour émettre de la lumière, ainsi que dispositif d'éclairage à base de del

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