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WO2014030276A1 - Bulb lamp and illumination device - Google Patents

Bulb lamp and illumination device Download PDF

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Publication number
WO2014030276A1
WO2014030276A1 PCT/JP2013/002921 JP2013002921W WO2014030276A1 WO 2014030276 A1 WO2014030276 A1 WO 2014030276A1 JP 2013002921 W JP2013002921 W JP 2013002921W WO 2014030276 A1 WO2014030276 A1 WO 2014030276A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
led
metal
light
shaped lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/002921
Other languages
French (fr)
Japanese (ja)
Inventor
直紀 田上
敏明 倉地
功幸 長浜
考志 大村
健太 渡邉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of WO2014030276A1 publication Critical patent/WO2014030276A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the present invention relates to a light bulb shaped lamp and a lighting device, for example, a light bulb shaped lamp using a semiconductor light emitting element and a lighting device using the same.
  • LEDs Light Emitting Diodes
  • LEDs Light Emitting Diodes
  • LED lamp there is a bulb-shaped LED lamp (bulb-shaped LED lamp).
  • bulb-shaped LED lamp an LED module including a substrate and a plurality of LEDs mounted on the substrate is used.
  • Patent Document 1 discloses a conventional bulb-type LED lamp.
  • a bulb-type LED lamp having a configuration simulating an incandescent bulb has been studied.
  • a bulb-type LED lamp having a configuration in which the LED module is held hollow at the center position in the globe using the same globe (glass bulb) used for an incandescent bulb has been studied.
  • a metal support (stem) configured to extend from the opening of the globe toward the center of the globe is disposed, and the LED module is fixed to the top of the metal support.
  • the LED module is patterned on the surface of the substrate, the plurality of LED chips mounted on the surface of the substrate (the surface on the top of the globe), the phosphor-containing resin that collectively seals the plurality of LED chips, and the surface of the substrate.
  • Metal wiring is patterned on the surface of the substrate, the plurality of LED chips mounted on the surface of the substrate (the surface on the top of the globe), the phosphor-containing resin that collectively seals the plurality of LED chips, and the surface of the substrate.
  • connection portion module electrode
  • the connecting portion electrically connects the through hole provided in the substrate, and the two lead wires inserted into the through hole from the back surface to the front surface of the substrate and the metal wiring (electrode terminal). It is comprised with solder.
  • the LED chip and the metal wiring are provided only on the surface of the substrate, basically, Only the insulation distance between the connecting portion (module electrode) and the metal column needs to be noted.
  • a conductive member such as an LED chip or metal wiring is provided on the back surface (surface on the metal support side) of the substrate, the conductive member (LED chip or metal wiring) on the back surface side of the substrate and the metal support column. It is necessary to secure an insulation distance between the two.
  • the present invention has been made in order to solve such a problem.
  • the LED module is fixed to a metal column, and the conductive member (LED or the like) of the LED module is formed on the metal column side.
  • Another object of the present invention is to provide a light bulb shaped lamp and a lighting device that can easily ensure a predetermined withstand voltage.
  • one aspect of a light bulb shaped lamp according to the present invention includes a translucent glove, a metal support provided to extend inward of the glove, and a glove disposed in the glove.
  • a light emitting module fixed to the metal column the light emitting module comprising: a substrate; and a plurality of first light emitting elements provided on a first surface of the substrate on the metal column side; A metal wiring formed on the first surface; and an insulating sealing member that seals the plurality of first light emitting elements and the metal wiring, and the metal column among the conductive members of the light emitting module.
  • the thickness from the conductive member having the shortest distance from the surface to the surface of the sealing member is a thickness that satisfies a predetermined withstand voltage.
  • the conductive member having a shortest distance from the metal support may be the metal wiring.
  • the shortest distance may be a distance between the metal support and the metal wiring on the first surface.
  • the sealing member is a silicone resin and the predetermined withstand voltage is 1.5 kV, the thickness is 0.15 mm or more. Also good.
  • the sealing member is a silicone resin and the predetermined withstand voltage is 4.0 kV, the thickness is 0.40 mm or more. Also good.
  • the sealing member may be low melting point glass.
  • a wavelength conversion material may be contained in the sealing member.
  • a plurality of second light emitting elements are provided on a second surface which is a surface opposite to the first surface of the substrate. It is good.
  • the substrate includes a main substrate on which the plurality of first light emitting elements are provided on the surface, and a sub substrate on which the plurality of second light emitting elements are provided on the surface.
  • the main substrate and the sub-substrate may be arranged such that back surfaces on which the plurality of first light emitting elements and the plurality of second light emitting elements are not provided are opposed to each other.
  • an aspect of the lighting device according to the present invention includes any one of the above light bulb shaped lamps.
  • FIG. 1 is a side view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 4 is a diagram showing a configuration of a light bulb shaped lamp according to an embodiment of the present invention, where (a) is a top view, and (b), (c), (d), and (e) are cross-sectional views. .
  • FIG. 5 is an enlarged cross-sectional view of an LED in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 5 is an enlarged cross-sectional view of an LED in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 6 is an enlarged cross-sectional view of a main part of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 7 is an enlarged cross-sectional view of a main part of a light bulb shaped lamp according to a first modification of the embodiment of the present invention.
  • FIG. 8 is an enlarged cross-sectional view of a main part of a light bulb shaped lamp according to a second modification of the embodiment of the present invention.
  • FIG. 9 is a diagram illustrating a configuration of a light bulb shaped lamp according to a third modification of the embodiment of the present invention, in which (a) is a top view, and (b), (c), (d), and (e) are illustrated. It is sectional drawing.
  • FIG. 10 is a cross-sectional view of a light bulb shaped lamp according to another modification of the embodiment of the present invention.
  • FIG. 11 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.
  • FIG. 1 is a side view of a light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the present embodiment.
  • the upper side of the paper is the front of the light bulb shaped lamp 1
  • the lower side of the paper is the rear of the light bulb shaped lamp 1
  • the left and right sides of the paper are the sides of the light bulb shaped lamp 1.
  • “rear” refers to the direction of the base with respect to the substrate of the LED module
  • “front” refers to the direction of the opposite side of the base with respect to the substrate of the LED module. That is, the “side” means a direction parallel to the main surface of the substrate of the LED module.
  • the alternate long and short dash line drawn in the vertical direction of the drawing indicates the lamp axis J (center axis) of the light bulb shaped lamp 1.
  • the lamp axis J is an axis serving as a rotation center when the light bulb shaped lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base.
  • the light bulb shaped lamp 1 is an example of a light source for illumination, and is a light bulb shaped LED lamp (LED light bulb) that is a substitute for a light bulb shaped fluorescent lamp or an incandescent light bulb.
  • the light bulb shaped lamp 1 includes a translucent globe 10, LED modules 20a and 20b that are light sources, a base 30 that receives power from the outside of the lamp, a metal support 40, a support base 50, a resin case 60, a lead Line 70 and lighting circuit 80 are provided.
  • the bulb-shaped lamp 1 includes an envelope formed by the globe 10, the resin case 60 (first case portion 61), and the base 30. Moreover, the light bulb shaped lamp 1 in the present embodiment is configured to have a brightness equivalent to the 60 W type.
  • the globe 10 is a translucent cover that houses the LED modules 20a and 20b and transmits light from the LED modules 20a and 20b to the outside of the lamp.
  • the light of the LED modules 20 a and 20 b that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted to the outside of the globe 10.
  • the globe 10 in the present embodiment is made of a material that is transparent to the light from the LED modules 20a and 20b.
  • a globe 10 for example, a glass bulb (clear bulb) made of silica glass that is transparent to visible light can be used.
  • the LED modules 20 a and 20 b housed in the globe 10 can be viewed from the outside of the globe 10.
  • the globe 10 has a shape in which one end is closed in a spherical shape and an opening 11 is provided at the other end.
  • the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is formed at a position away from the center of the sphere.
  • a glass bulb having the same shape as a general incandescent bulb can be used.
  • a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.
  • the globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function.
  • a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 10.
  • the material of the globe 10 is not limited to a glass material, and a resin material such as a synthetic resin such as acrylic (PMMA) or polycarbonate (PC) may be used.
  • the LED modules 20a and 20b are light emitting modules that have LEDs (LED chips) and emit light when electric power is supplied to the LEDs via the lead wires.
  • the LED modules 20 a and 20 b are held in the hollow inside the globe 10 by the metal support 40.
  • the LED modules 20a and 20b are preferably arranged at a spherical central position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large).
  • the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to a general incandescent light bulb using a conventional filament coil. .
  • the base 30 is a power receiving unit that receives power for causing the LEDs of the LED modules 20 a and 20 b to emit light from the outside of the light bulb shaped lamp 1.
  • the base 30 receives AC power through two contacts, and the power received by the base 30 is input to the power input unit of the lighting circuit 80 via a lead wire.
  • AC power is supplied to the base 30 from a commercial power supply (AC 100 V).
  • the base 30 is attached to a socket of a lighting fixture (lighting device) and receives AC power from the socket. Thereby, the light bulb shaped lamp 1 (LED modules 20a and 20b) is turned on.
  • the base 30 has a metal bottomed cylindrical shape (cap shape), and includes a shell portion whose outer peripheral surface is a male screw and an eyelet portion attached to the shell portion via an insulating portion.
  • a screwing portion for screwing with the socket of the lighting device is formed on the outer peripheral surface of the base 30, and a screwing portion for screwing with the resin case 60 is formed on the inner peripheral surface of the base 30.
  • the type of the base 30 is not particularly limited, but in the present embodiment, a screwed-type Edison type (E type) base is used.
  • E type screwed-type Edison type
  • a plug-type base may be used as the base 30.
  • the metal column 40 is a metal stem provided so as to extend from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10, and serves as a holding member that holds the LED modules 20 a and 20 b in the globe 10. Function. One end of the metal column 40 is connected to the LED modules 20 a and 20 b, and the other end is connected to the support base 50.
  • the metal column 40 also functions as a heat radiating member for radiating heat generated in the LED modules 20a and 20b to the base 30 side. Therefore, the metal support 40 is composed of a metal material having a high thermal conductivity, for example, aluminum (Al), copper (Cu) or iron (Fe) having a thermal conductivity of about 237 [W / m ⁇ K] as a main component. Therefore, the heat radiation efficiency by the metal support
  • the metal support column 40 is configured by, for example, integrally molding a main shaft portion 41 and a fixed portion 42.
  • the main shaft portion 41 is a cylindrical member having a constant cross-sectional area.
  • One end of the main shaft portion 41 is connected to the fixed portion 42, and the other end is connected to the support base 50.
  • the fixing part 42 has a fixing surface to which the LED modules 20a and 20b are fixed, and this fixing surface is in contact with the back surfaces of the substrates of the LED modules 20a and 20b.
  • the fixing portion 42 further has a protruding portion that protrudes from the fixing surface, and this protruding portion fits into a through hole provided in the substrate of the LED modules 20a and 20b.
  • the LED modules 20a and 20b and the fixing surface of the fixing portion 42 are bonded with, for example, an adhesive of a resin such as a silicone resin.
  • the fixing part 42 of the metal column 40 has a cross-sectional area perpendicular to the lamp axis J (width in the direction perpendicular to the lamp axis J) larger than the main axis part 41 of the metal column 40.
  • pillar 40 has a cross section perpendicular
  • the fixing portion 42 of the metal support column 40 has a wider width in the LED element array direction of the LED modules 20 a and 20 b and in the LED array direction in the element array.
  • the metal strut 40 has the largest cross-sectional area perpendicular to the lamp axis J on the fixing surface of the fixing portion 42 in contact with the substrates of the LED modules 20a and 20b.
  • the metal column 40 configured in this manner, it is possible to suppress the vignetting of the LED module 20b by the metal column 40 while widening the heat dissipation path from the LED module 20b to the metal column 40. That is, since the metal support column 40 has a shape in which the width thereof is increased near the LED modules 20a and 20b, the heat generated in the LED modules 20a and 20b can be efficiently released to the wide metal support column 40. , It is possible to suppress a decrease in luminous efficiency and lifetime of the LED.
  • the metal support column 40 has a shape whose width becomes narrower as it moves away from the LED modules 20a and 20b, it is possible to suppress the vignetting of the light of the LED modules 20a and 20b by the metal support column 40 and to improve the light extraction efficiency. The decrease can be suppressed.
  • the fixing surface of the fixing portion 42 of the metal support column 40 is surface-treated so as to reflect the light of the LED of the LED module 20b.
  • the surface of the metal column 40 is configured to have a light reflectance of 30% or more with respect to light emitted from the element rows of the LEDs 22a and 22b and the element row of the LEDs 32.
  • the substrate 21 is fixed to the metal column 40 so that the back surface is in contact with the metal column 40.
  • the shape of the metal support column 40 is a tapered shape in which the width of the LED element rows of the LED modules 20a and 20b in the LED modules 20a and 20b gradually increases toward the substrate 21. It may be a shape.
  • the fixing portion 42 of the metal support column 40 has a shape that widens toward the substrate 21.
  • the metal support column 40 is not limited to this as long as the metal support column 40 has a shape in which the width of the LED element rows of the LED modules 20a and 20b extends toward the substrate 21 as a whole. In other words, the metal support column 40 only needs to have a shape in which the width of the metal support column 40 in the arrangement direction of the LED element rows of the LED modules 20a and 20b is the maximum at the portion in contact with the LED modules 20a and 20b.
  • the width of the LED element rows of the LED modules 20 a and 20 b is constant toward the substrate 21, and the main shaft portion 41 of the metal column 40 has a width toward the substrate 21. It may have a widening shape. Further, both the main shaft portion 41 and the fixed portion 42 of the metal support column 40 may have a shape whose width increases toward the substrate 21.
  • the support base (support plate) 50 is a support member that supports the metal support column 40 and is fixed to the resin case 60.
  • the support base 50 is configured to be connected to the opening end of the opening 11 of the globe 10 and close the opening 11 of the globe 10.
  • the support base 50 is formed of a disk-shaped member having a stepped portion on the periphery, and the opening end of the opening 11 of the globe 10 is in contact with the stepped portion. And in this level
  • the support base 50 is made of a metal material having a high thermal conductivity such as aluminum, so that the heat radiation efficiency of the LED modules 20a and 20b that thermally conducts the metal support column 40 by the support base 50. Is increased. As a result, it is possible to further suppress the decrease in the luminous efficiency and the lifetime of the LED due to the temperature increase.
  • pillar 40 may be integrally shape
  • the resin case 60 is an insulating case (circuit holder) for insulating the metal support column 40 and the base 30 and accommodating the lighting circuit 80.
  • the resin case 60 has a first case portion 61 having a large-diameter cylindrical shape and a first case having a small-diameter cylindrical shape. 2 case part 62 is comprised.
  • the resin case 60 is formed by, for example, polybutylene terephthalate (PBT).
  • the second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 30, and a screwing portion for screwing with the base 30 is formed on the outer peripheral surface of the second case portion 62. ing.
  • the two lead wires 70 are a pair of lead wires for supplying power for lighting the LED modules 20a and 20b from the lighting circuit 80 to the LED modules 20a and 20b. From the wire-like metal wires such as copper wires Can be configured. Each lead wire 70 is disposed in the globe 10, one end is electrically connected to the external terminals of the LED modules 20 a and 20 b, and the other end is electrically connected to the power output unit of the lighting circuit 80, in other words, the base 30. Has been.
  • the two lead wires 70 are, for example, vinyl wires composed of a metal core wire and an insulating resin that covers the core wire, and the LED modules 20a and 20b are not covered with the insulating resin and the surface is exposed. It is electrically connected via the core wire. At this time, the core wire may not be covered with the insulating resin between the portion of the two lead wires 70 protruding from the surface of the substrate 21 and the portion protruding from the back surface of the substrate 21 by 3 mm or less.
  • the lighting circuit 80 is a drive circuit (circuit unit) for lighting the LEDs of the LED modules 20 a and 20 b and is covered with a resin case 60.
  • the lighting circuit 80 includes a circuit that converts AC power fed from the base 30 into DC power, and supplies the converted DC power to the LEDs of the LED modules 20 a and 20 b via the two lead wires 70.
  • the lighting circuit 80 includes, for example, a circuit board and a plurality of circuit elements (electronic components) mounted on the circuit board.
  • the circuit board is a printed board on which metal wiring is patterned, and electrically connects a plurality of circuit elements mounted on the circuit board.
  • the circuit board is arranged in a posture in which the main surface is orthogonal to the lamp axis.
  • the circuit elements are, for example, various capacitors, resistor elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, diodes, or integrated circuit elements, and the lighting circuit 80 is a circuit element among these circuit elements. It is configured by selecting as appropriate.
  • the light bulb shaped lamp 1 is not necessarily provided with the lighting circuit 80.
  • the lighting circuit 80 is not limited to a smoothing circuit, and a dimming circuit, a booster circuit, and the like can be appropriately selected and combined.
  • FIG. 4 is a diagram showing a configuration around the LED module in the light bulb shaped lamp 1 according to the present embodiment.
  • 4A is a plan view when the LED module 20a is viewed from above with the globe 10 removed from the light bulb shaped lamp 1.
  • FIG. 4B is a cross-sectional view of the light bulb shaped lamp 1 cut along the line AA ′ in FIG. 4A
  • FIG. 4C is a line BB ′ in FIG.
  • FIG. 4D is a cross-sectional view of the light bulb shaped lamp 1 cut along the line CC ′ of FIG. 4A.
  • E is a cross-sectional view of the bulb-type lamp 1 cut along the line DD ′ in (a).
  • the LED module 20a is a main light emitting module (first light emitting module) that mainly emits light toward the front and sides, and has a COB (Chip On Board) structure in which a bare chip is directly mounted on the surface of the substrate 21. .
  • first light emitting module main light emitting module
  • COB Chip On Board
  • the LED module 20b is a sub light emitting module (second light emitting module) that emits light mainly toward the rear and side, and has a COB structure in which a bare chip is directly mounted on the back surface of the substrate 21.
  • the substrate 21 is both a substrate in the LED module 20a and a substrate in the LED module 20b.
  • the back surface of the substrate 21 is a first surface that is a surface on the metal strut 40 side (base side), and the surface of the substrate 21 is a second surface that is a surface on the globe 10 side.
  • the LED chip mounted on the back surface (first surface) of the substrate 21 is a first light emitting element
  • the LED chip mounted on the surface (second surface) of the substrate 21 is a second light emitting element.
  • the LED module 20a includes a substrate 21, a plurality of LEDs 22a and 22b (second light emitting elements) provided on the surface (second surface) of the substrate 21, sealing members 23a and 23b (second sealing member), Metal wiring 24a, 24b and 26 (second metal wiring), wires 25a and 25b (second wire), a conductive adhesive member 27 (second conductive adhesive member) and a terminal 28 (second terminal) are provided. .
  • the LED module 20b includes a substrate 21, a plurality of LEDs 32 (first light-emitting elements) provided on the back surface (first surface) of the substrate 21, a sealing member 33 (first sealing member), and a metal wiring.
  • 34 and 36 first metal wiring
  • a wire 35 first wire
  • a conductive adhesive member 37 first conductive adhesive member
  • a terminal 38 first terminal
  • the two LED modules 20a and 20b may be considered as one LED module.
  • the LED module includes a substrate 21, a plurality of LEDs mounted in a row on each of the front and back surfaces of the substrate 21, and a sealing member that collectively seals each LED row.
  • the substrate 21 can be a translucent substrate or a non-translucent substrate, for example, a ceramic substrate made of aluminum oxide (alumina) or aluminum nitride, a resin substrate, a glass substrate, a flexible substrate, or a resin-coated metal.
  • the substrate 21 is a rectangular mounting substrate (LED mounting substrate) for mounting the LEDs 22a, 22b, and 32.
  • the substrate 21 is preferably composed of a white substrate such as a white alumina substrate having a low light transmittance with respect to light emitted from the LEDs 22a, 22b, and 32, for example, 10% or less, or a metal substrate.
  • a white substrate such as a white alumina substrate having a low light transmittance with respect to light emitted from the LEDs 22a, 22b, and 32, for example, 10% or less, or a metal substrate.
  • the light transmittance of the substrate 21 is high, in the LED module 20a, a part of the light of the LEDs 22a and 22b on the front surface side of the substrate 21 passes through the substrate 21 and then is emitted from the back surface side of the substrate 21.
  • the LED module 20 b a part of the light of the LED 32 on the back surface side of the substrate 21 is emitted from the front surface side of the substrate 21 after passing through the substrate 21. Therefore, in the light bulb shaped lamp 1, color unevenness occurs with respect to light extracted from the base side and the opposite side. On the other hand, such color unevenness can be suppressed by reducing the light transmittance of the substrate 21. Further, since an inexpensive white substrate can be used, the cost of the light bulb shaped lamp 1 can be reduced.
  • a translucent substrate can be used as the substrate 21.
  • a ceramic substrate made of polycrystalline alumina having a total transmittance of 90% or more for visible light can be used as the substrate 21.
  • Two through holes 21b penetrating the substrate 21 are provided at both ends of the substrate 21 in the long side direction. These two through holes 21b constitute terminals 28 and 38 for connecting the lead wire 70 for power feeding and the LED modules 20a and 20b. Each of the two through holes 21b extends from the back surface to the front surface of the substrate 21. The lead wire 70 is inserted.
  • one through hole 21 a that penetrates the substrate 21 is provided in the central portion of the substrate 21, one through hole 21 a that penetrates the substrate 21 is provided.
  • the through hole 21a is for fixing the LED modules 20a and 20b to the metal support column 40, and a protrusion 42b of the metal support column 40 is fitted into the through hole 21a.
  • the through hole 21 a and the protrusion 42 b have a rectangular shape in plan view, and function as a position restricting portion for determining the position and orientation of the substrate 21.
  • the through hole 21a may not be provided.
  • the LEDs 22a, 22b, and 32 are semiconductor light emitting elements that emit light with a predetermined power, and are examples of conductive members.
  • a plurality of LEDs 22a and 22b are mounted on the surface of the substrate 21, respectively.
  • the plurality of LEDs 22a are linearly arranged at the same pitch in the long side direction of the substrate 21, and are orthogonal to the short side direction of the substrate 21, that is, the arrangement direction of the LEDs 22a in the element row of the LED 22a as an element row (light emitting element group).
  • a plurality are arranged in the direction.
  • the plurality of LEDs 22b are linearly arranged at the same pitch in the long side direction of the substrate 21, and the arrangement direction of the LEDs 22b in the short side direction of the substrate 21, that is, the element row of the LED 22b, as an element row (light emitting element group).
  • the plurality of element rows of the LED 22 b are arranged so as to be positioned between the two element rows of the LED 22 a in the short side direction of the substrate 21.
  • the plurality of LEDs 22a are connected in series in each element row, and are connected in parallel in the element rows.
  • the plurality of LEDs 22b are also connected in series in each element row, and are connected in parallel in the element rows.
  • the element rows of the LED 22a and the element rows of the LED 22b are also connected in parallel.
  • the plurality of LEDs 22a and 22b are arranged so that, for example, the interval (pitch) between adjacent LEDs in the element row is 1.8 mm. And the space
  • a plurality of LEDs 32 are mounted on the back surface of the substrate 21.
  • the plurality of LEDs 32 are arranged in a straight line at the same pitch in the long side direction of the substrate 21, and are orthogonal to the arrangement direction of the LEDs 32 in the short side direction of the substrate 21, that is, the LED 32 element row, as an element row (light emitting element group).
  • a plurality are arranged in the direction.
  • the plurality of LEDs 32 are connected in series in each element row, and are connected in parallel in the element rows.
  • the front-side LED 22a is disposed so as to face the rear-side LED 32 with the substrate 21 in between.
  • the entire lower surface of the LED 22a in contact with the substrate 21 is arranged so as to face the entire lower surface of the LED 32 in contact with the substrate 21.
  • the entire LED 22a is present in the region above the LED 32, and the entire LED 32 is present in the region below the LED 22a. Therefore, LED22a is arrange
  • LED22b is arrange
  • the entire lower surface of the LED 22b in contact with the substrate 21 is disposed so as to face the fixing surface of the fixing portion 42 of the metal support column 40.
  • the entire LED 22 b exists in the upper region of the fixing surface of the fixing portion 42 of the metal support column 40.
  • the LEDs 22b are mounted so that all the LEDs in the element row of the LED 22b face the fixing surface of the fixing portion 42 of the metal support column 40.
  • the LED 22b is one of the element rows of the LED 22b. Only the LED of the part may be mounted so as to face the fixing surface of the fixing part 42 of the metal support column 40.
  • LEDs 22a, 22b, and 32 bare chips that emit monochromatic visible light in all directions, that is, sideward, upward, and downward can be used.
  • the LEDs 22a, 22b, and 32 emit, for example, 20% of the total light amount on the side, 60% of the total light amount on the upper side, and 20% of the total light amount on the lower side.
  • the LEDs 22a, 22b, and 32 are rectangular (square) blue LED chips that emit blue light when energized, for example, each side having a length of about 0.35 mm (350 ⁇ m).
  • the blue LED chip for example, a gallium nitride based semiconductor light emitting device having a central wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.
  • FIG. 5 is an enlarged cross-sectional view around the LED (LED chip) in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • the periphery of the LED 22a is illustrated, but the same applies to the LEDs 22b and 32.
  • the LED 22 a includes a sapphire substrate 122 a and a plurality of nitride semiconductor layers 122 b that are stacked on the sapphire substrate 122 a and have different compositions.
  • a cathode electrode 122c and an anode electrode 122d are provided at both ends of the upper surface of the nitride semiconductor layer 122b.
  • a wire bond portion 122e is provided on the cathode electrode 122c, and a wire bond portion 122f is provided on the anode electrode 122d.
  • the cathode electrode 122c of one LED 22a and the anode electrode 122d of the other LED 22a are connected by a wire 25a through wire bond portions 122e and 122f.
  • the LED 22a is fixed on the substrate 21 with a translucent chip bonding material 122g so that the surface on the sapphire substrate 122a side faces the front surface or the back surface of the substrate 21.
  • a translucent chip bonding material 122g a silicone resin containing a filler composed of metal oxide can be used.
  • the sealing member 23a is an insulating member that seals the LED 22a and the metal wiring 24a in the element row of the LED 22a.
  • the sealing member 23a is formed so as to cover the LED 22a and the metal wiring 24a.
  • the sealing member 23a is linearly formed so as to collectively seal one row of the plurality of LEDs 22a along the arrangement direction of the plurality of LEDs 22a constituting the element row.
  • a plurality of sealing members 23a are formed along the arrangement direction of the element rows, and individually seal different element rows.
  • the sealing member 23a includes a phosphor that is a light wavelength conversion material, and also functions as a wavelength conversion member that converts the wavelength of light emitted from the LED 22a.
  • the sealing member 23a is composed of a wavelength conversion material that converts the wavelength of light emitted from the LED 22a and an insulating resin material containing the wavelength conversion material.
  • the wavelength conversion material phosphor particles that are excited by light emitted from the LED 22a and emit light of a desired color (wavelength) can be used.
  • the phosphor particles when the LED 22a is a blue LED that emits blue light, phosphor particles that convert the wavelength of the blue light into yellow light are used in order to emit white light from the sealing member 23a.
  • YAG (yttrium / aluminum / garnet) -based yellow phosphor particles can be used as the phosphor particles.
  • a part of blue light emitted from the LED 22a is wavelength-converted into yellow light by the yellow phosphor particles contained in the sealing member 23a. That is, the yellow phosphor particles emit fluorescent light using blue light as excitation light.
  • the blue light which was not absorbed by the yellow phosphor particles (the wavelength was not converted) and the yellow light which was wavelength-converted by the yellow phosphor particles were diffused and mixed in the sealing member 23a.
  • the white light is emitted from the sealing member 23a.
  • a transparent resin material such as silicone resin or an organic material such as fluorine resin
  • a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin is used as the sealing member 23a.
  • an inorganic material such as a low melting point glass or a sol-gel glass can be used as the material of the sealing member 23a containing the phosphor particles.
  • a light diffusing material such as silica particles may be dispersed in the sealing member 23a.
  • the sealing member 23b is formed adjacent to the sealing member 23a on the surface (second surface) of the substrate 21.
  • the two sealing members 23 b are formed so as to be positioned between the two sealing members 23 a in the short side direction of the substrate 21.
  • the sealing member 23b has the same configuration as the sealing member 23a, and is formed so as to seal the LED 22b and the metal wiring 24b in the element row of the LED 22b and cover the LED 22b and the metal wiring 24b.
  • the sealing member 23b is linearly formed so as to collectively seal one row of the plurality of LEDs 22b along the arrangement direction of the plurality of LEDs 22b constituting the element row. Further, a plurality of sealing members 23b are formed along the arrangement direction of the element rows, and different element rows are individually sealed.
  • the sealing member 23b includes a phosphor that is a light wavelength conversion material, and also functions as a wavelength conversion member that converts the wavelength of light emitted from the LED 22b.
  • the sealing member 23b includes a wavelength conversion material that converts the wavelength of light emitted from the LED 22b and an insulating resin material that contains the wavelength conversion material.
  • the wavelength conversion material the same material as the sealing member 23a can be used.
  • a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin can be used as the sealing member 23b.
  • the sealing member 33 is formed on the back surface (first surface) of the substrate 21.
  • two sealing members 33 are formed, each facing the two sealing members 23a with the substrate 21 in between.
  • the sealing member 33 has the same configuration as the sealing member 23a, and is formed so as to seal the LED 32 and the metal wiring 34 in the element row of the LED 32 and cover the LED 32 and the metal wiring 34.
  • the sealing member 33 is linearly formed so as to collectively seal one row of the plurality of LEDs 32 along the arrangement direction of the plurality of LEDs 32 constituting the element row. Further, a plurality of sealing members 33 are formed along the arrangement direction of the element rows, and different element rows are individually sealed.
  • the sealing member 33 includes a phosphor that is a light wavelength conversion material, similarly to the sealing member 23a, and also functions as a wavelength conversion member that converts the wavelength of light emitted from the LED 32.
  • the sealing member 33 includes a wavelength conversion material that converts the wavelength of light emitted from the LED 32 and an insulating resin material that contains the wavelength conversion material.
  • the same material as the sealing member 23a can be used.
  • a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin is used as the sealing member 33.
  • a material in which predetermined phosphor particles are dispersed in low melting point glass can be used.
  • each of the sealing members 23a, 23b, and 33 is formed to have a length of 24 mm, a line width of 1.6 mm, and a center maximum height of 0.7 mm, for example.
  • the sealing members 23a, 23b and 33 in the present embodiment are configured such that the mass concentration of the silicone resin is 70 to 80 wt%.
  • the LED module 20a has an element array of a plurality of LEDs 22a and an element array of a plurality of LEDs 22b
  • the LED module 20b has an element array of a plurality of LEDs 32.
  • the LED module 20a has an element array of the LEDs 22a provided on the surface of the substrate 21, and the LEDs 22a are arranged so as to face the LEDs 32 with the substrate 21 interposed therebetween.
  • substrate 21 is reflected or absorbed by LED22a facing LED32, and is light-shielded, and is not emitted as the light of LED module 20a.
  • the light of the LED 22a that is transmitted through the substrate 21 and is emitted from the back surface of the substrate 21 is reflected or absorbed by the LED 32 facing the LED 22a to be blocked, and is not emitted as light of the LED module 20b. Therefore, color unevenness can be suppressed for light emitted in all directions by the LED modules 20a and 20b.
  • each sealing member 23a, 23b, and 33 may be formed so as to individually cover the LEDs 22a, 22b, and 32, instead of sealing a plurality of LEDs at once.
  • each sealing member 23a, 23b, and 33 can be formed in a substantially hemispherical shape.
  • the metal wires 24a, 24b, 26, 34, and 36 are conductive metal wires through which a current for emitting light from the LED flows, and are examples of conductive members.
  • the metal wirings 24 a and 24 b are patterned in a predetermined shape on the surface (second surface) of the substrate 21.
  • a plurality of metal wirings 24a are formed to electrically connect a plurality of LEDs 22a in the element array of the LEDs 22a in series.
  • Each of the plurality of metal wirings 24a is formed in an island shape between adjacent LEDs 22a in the element row.
  • a plurality of metal wirings 24b are formed to electrically connect a plurality of LEDs 22b in the element row of the LEDs 22b in series.
  • Each of the plurality of metal wirings 24b is formed in an island shape between adjacent LEDs 22b in the element row.
  • the metal wiring 34 is patterned in a predetermined shape on the back surface (first surface) of the substrate 21.
  • a plurality of metal wirings 34 are formed in order to electrically connect a plurality of LEDs 32 in the element array of the LEDs 32 in series.
  • Each of the plurality of metal wirings 34 is formed in an island shape between the LEDs 32 adjacent in the element row.
  • Two metal wirings 26 are formed in a predetermined shape at both ends of the substrate 21 in order to electrically connect the element rows of the LEDs 22a and 22b and the terminals 28 in parallel. These two metal wirings 26 are formed on the surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 22a and 22b.
  • the metal wiring 26 extends in the arrangement direction of the element rows, and protrudes toward the element row at a portion adjacent to the element rows of the LEDs 22a and 22b.
  • the protruding portion of the metal wiring 26 becomes a connection portion with the wires 25a and 25b from the LEDs 22a and 22b located at the extreme ends.
  • two metal wirings 36 are formed in a predetermined shape at both ends of the substrate 21 in order to electrically connect the element array of the LED 32 and the terminal 38 in parallel. These two metal wirings 36 are formed on the back surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 32.
  • the metal wiring 36 extends in the arrangement direction of the element rows, and protrudes toward the element row at a portion adjacent to the element row of the LED 32.
  • the protruding portion of the metal wiring 36 becomes a connection portion with the wire 35 from the LED 32.
  • the metal wirings 24a, 24b, 26, 34 and 36 are simultaneously patterned using the same metal material.
  • a metal material of the metal wirings 24a, 24b, 26, 34, and 36 for example, silver (Ag), tungsten (W), copper (Cu), or the like can be used.
  • the surface of the metal wirings 24a, 24b and 26 may be plated with nickel (Ni) / gold (Au) or the like.
  • the metal wirings 24a, 24b, 26, 34, and 36 may be made of different metal materials or may be formed in separate steps.
  • a glass film made of a glass material (glass coat film) or a resin film made of a resin material (resin coat film). It is preferable to coat by. Thereby, the insulation in LED module 20a and 20b can be improved.
  • the terminals 28 and 38 are connection terminals in the LED modules 20a and 20b, and are examples of conductive members.
  • the terminal 28 is a power supply electrode provided with the conductive adhesive member 27, for example, a solder electrode to be soldered, and the surface of the substrate 21 so as to surround the through hole 21b and the opening on the surface side of the substrate 21 of the through hole 21b. And a connection land formed in a predetermined shape.
  • Two terminals 28 are formed corresponding to each of the two metal wirings 26.
  • the pair of terminals 28 are formed integrally with the corresponding metal wiring 26 and are connected by being in contact with the corresponding metal wiring 26.
  • One wiring pattern is constituted by such a corresponding set of metal wirings 26 and terminals 28.
  • the terminal 28 is a power supply unit of the LED module 20a, and receives power from the outside of the LED module 20a in order to cause the LEDs 22a and 22b to emit light, and receives the received power through the metal wires 24a, 24b and 26 and the wires 25a and 25b. To the LEDs 22a and 22b.
  • the terminal 38 is a power supply electrode on which the conductive adhesive member 37 is provided, and is formed in a predetermined shape on the back surface of the substrate 21 so as to surround the through hole 21b and the opening on the back surface side of the substrate 21 of the through hole 21b. And a connecting land.
  • Two terminals 38 are formed corresponding to each of the two metal wirings 36.
  • the pair of terminals 38 are formed integrally with the corresponding metal wiring 36 and are connected by being in contact with the corresponding metal wiring 36.
  • One wiring pattern is constituted by such a corresponding set of metal wirings 36 and terminals 38.
  • the terminal 38 is a power supply unit of the LED module 20b, and receives power from the outside of the LED module 20b in order to cause the LED 32 to emit light. To do.
  • the terminals 28 and 38 are arranged so as to be substantially concentric. Also, the terminals 28 and 38 are patterned simultaneously with these metal wirings using the same metal material as the metal wirings 24a, 24b, 26, 34 and 36.
  • the wires 25a, 25b, and 35 are conductive metal wirings in the LED modules 20a and 20b, and are examples of conductive members.
  • the wire 25a is an electric wire for connecting the LED 22a and the metal wiring 26, and the LED 22a and the metal wiring 24a, and is, for example, a gold wire. As described with reference to FIG. 5, the wire 25a allows wire bonding between the wire bonding portions 122e and 122f provided on the upper surface of the LED 22a and the metal wiring 24a or the metal wiring 26 formed adjacent to both sides of the LED 22a. Has been.
  • the wire 25b has the same configuration as the wire 25a, and is an electric wire for connecting the LED 22b and the metal wiring 26, and the LED 22b and the metal wiring 24b, and is, for example, a gold wire.
  • the wire 35 has the same configuration as that of the wire 25a and is an electric wire for connecting the LED 32 and the metal wiring 36 and the LED 32 and the metal wiring 34.
  • the wires 25a, 25b, and 35 are embedded in the sealing members 23a, 23b, and 35, respectively, so as not to be exposed from the sealing members 23a, 23b, and 33, for example.
  • the conductive adhesive members 27 and 37 are also examples of conductive members.
  • the conductive adhesive member 27 is a conductive adhesive such as solder or silver paste that connects the terminal 28 to the lead wire 70.
  • the conductive adhesive member 27 is provided in contact with both the terminal 28 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 28.
  • the conductive adhesive member 27 is provided so as to close the opening on the surface side of the substrate 21 of the through hole 21b.
  • the conductive adhesive member 37 is a conductive adhesive that connects the terminal 38 to the lead wire 70.
  • the conductive adhesive member 37 is provided in contact with both the terminal 38 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 38.
  • the conductive adhesive member 37 is provided so as to close the opening on the back surface side of the substrate 21 of the through hole 21b.
  • the conductive adhesive member 27 may be covered with an insulating resin.
  • the insulating resin may be a white resin having a low light transmittance with respect to the light emitted from the LEDs 22a, 22b and 32, for example, 10% or less.
  • the two lead wires 70 and the terminals 38 are connected by the conductive adhesive member 27. It is formed by connecting and connecting the two lead wires 70 and the terminal 28 by the conductive adhesive member 37.
  • the lead wire 70 is provided so as to be inserted from the opening on the back surface side of the through hole 21b and protrude from the opening on the front surface side of the through hole 21b.
  • a conductive adhesive member 37 is provided so as to be in contact with both the rear surface side portion of the lead wire 70 and the terminal 38, and the conductive adhesive member 27 is provided so as to be in contact with both the front surface portion and the terminal 28.
  • the terminal 28 and the terminal 38 are connected by the lead wire 70.
  • the terminals 28 and 38 are connected to the same lead wire 70, and the plurality of LEDs 22 a and 22 b on the front surface of the substrate 21 and the plurality of LEDs 32 on the back surface of the substrate 21 are connected in parallel to the lead wire 70. That is, the LED module 20 a and the LED module 20 b are electrically connected in parallel via the pair of lead wires 70.
  • the current supplied to the one lead wire 70 on the plus side includes the conductive adhesive member 27, the terminal 28, the metal wiring 26, the LEDs 22a and 22b, the metal wirings 24a and 24b, and It passes through the wires 25a and 25b and is output from the other negative lead wire 70.
  • the current supplied to one plus-side lead wire 70 passes through the conductive adhesive member 37, the terminal 38, the metal wiring 36, the LED 32, the metal wiring 34, and the wire 35, and the other side. It is output from the negative lead wire 70.
  • the back surface of the substrate 21 and the fixed surface of the fixing portion 42 of the metal support column 40 are brought into contact with each other. These members are not provided. Therefore, on the back surface of the substrate 21, the element rows of the plurality of LEDs 32 are provided so as to sandwich the fixing portion 42, and the interval between the element rows is the element row sandwiching the fixing portion 42 of the metal column 40 and the interval between other element rows. It is getting bigger.
  • the conductive adhesive members 27 and 37 are provided apart from each other with a space in the through hole 21b.
  • the conductive adhesive members 27 and 37 may be provided as a single adhesive member instead of separate members. That is, one conductive member may be provided continuously in the through hole 21 b, on the surface of the substrate 21, and on the back surface of the substrate 21 so as to contact the terminals 28 and 38 and the lead wire 70. .
  • the tip of the lead wire 70 is provided so as to be exposed on the surface of the conductive adhesive member 27, but it may be completely covered with the conductive adhesive member 27. In this case, since the contact area between the lead wire 70 and the conductive adhesive member 27 increases, the connection between the two can be strengthened.
  • the power supply to the LED modules 20a and 20b is simply performed by connecting the lead wire 70 to both of the two terminals 28 and 38 by the conductive adhesive members 27 and 37 through the through hole 21b.
  • the lead wire 70 is connected to one of the terminals 28 and 38 and the terminal 28 and the terminal 38 are connected by a via hole or the like
  • a configuration such as a via hole or the like that connects the terminal 28 and the terminal 38 is unnecessary. It becomes.
  • the number of lead wires 70 can be halved compared to a configuration in which separate lead wires 70 are connected to the terminals 28 and 38. As a result, the light bulb shaped lamp 1 having a simple structure can be realized.
  • FIG. 6 is an enlarged cross-sectional view of a main part of the light bulb shaped lamp according to the embodiment of the present invention taken along the line EE ′ of FIG.
  • the LED lamp is required to have a predetermined withstand voltage, but when the LED module having the substrate on which the LED and the metal wiring are mounted is fixed to the metal column, the conductive member such as the LED or the metal wiring on the substrate. When the surface on which is formed is brought into contact with the metal column, it is difficult to ensure a predetermined withstand voltage.
  • the space distance between the LED or the metal wiring and the metal support can be secured above a certain level, it is possible to ensure a predetermined withstand voltage.
  • the LED module (substrate) cannot be enlarged in a limited space in the globe 10, and it is difficult to ensure a sufficient space distance between the LED and the metal wiring and the metal support.
  • a predetermined dielectric strength is secured by using a sealing member 33 formed on the back surface (first surface) of the substrate 21 in the LED module 20b, Of the conductive members of the module 20b, the thickness from the conductive member having the shortest distance from the metal column 40 to the surface of the sealing member 33 is configured to satisfy a predetermined withstand voltage.
  • the conductive member having the shortest distance from the metal support column 40 is the metal wiring 34. Therefore, the thickness (distance) L from the metal wiring 34 to the surface of the sealing member 33 is a predetermined withstand voltage. It is comprised so that it may become the thickness which satisfy
  • the shortest distance between the metal column 40 and the metal wiring 34 is the distance between the metal column 40 and the metal wiring 34 on the back surface (first surface) of the substrate 21. That is, the shortest distance between the metal column 40 and the metal wiring 34 is a creeping distance (insulating distance) from the metal column 40 to the metal wiring 34 along the back surface (first surface) of the substrate 21.
  • the sealing member 33 is a silicone resin
  • the dielectric breakdown voltage (dielectric breakdown strength) of the silicone resin is 10 kV / mm, for example, when trying to satisfy a dielectric breakdown voltage of 1.5 kV
  • the thickness L of the sealing member 33 from the metal wiring 34 to the surface of the sealing member 33 is preferably 0.15 mm or more.
  • the thickness L of the said sealing member 33 from the metal wiring 34 to the surface of the sealing member 33 shall be 0.40 mm or more. In Japan, a withstand voltage of 1.0 to 1.5 kV or more is required, and in the United States, a withstand voltage of 4.0 kV or more is required.
  • the substrate 21 is formed from the conductive member (for example, the metal wiring 34) whose position from the metal column 40 is the shortest distance.
  • the thickness of the sealing member 33 up to the surface of the sealing member 33 formed on the back surface of the substrate is a thickness that satisfies a predetermined withstand voltage.
  • FIG. 7 is an enlarged cross-sectional view of a main part of a light bulb shaped lamp according to Modification 1 of the embodiment of the present invention.
  • FIG. 7 corresponds to FIG.
  • the shape of the fixing portion 42 of the metal column 40 is a tapered shape whose width is widened toward the substrate 21.
  • the shape of the portion 42 ⁇ / b> A may be a shape having a constant width toward the substrate 21.
  • the spatial distance between the conductive member (for example, the metal wiring 34) and the metal column 40 in the LED modules 20 a and 20 b is further reduced as compared with the configuration shown in FIG. 6. Even in such a case, a predetermined withstand voltage can be ensured by making the thickness L of the sealing member 33 shown in FIG. 7 equal to or greater than the thickness L of the sealing member 33 shown in FIG. Can do.
  • FIG. 8 is an enlarged cross-sectional view of a main part of a light bulb shaped lamp according to a second modification of the embodiment of the present invention.
  • FIG. 8 also corresponds to FIG.
  • the LED 32 and the metal wiring 34 are configured such that the centers thereof coincide with the center (line axis) of the sealing member 33.
  • the thickness of the stop member 33 in the direction perpendicular to the line axis was the same on both sides.
  • the center of the LED 32 and the metal wiring 34 is configured not to be aligned with the center (line axis) of the sealing member 33.
  • the thickness of the member 33 in the direction perpendicular to the line axis is different on both sides. That is, as shown in FIG. 8, the thickness L1 of the sealing member 33 from the metal wiring 34 on one side to the surface of the sealing member 33, and the thickness L1 from the metal wiring 34 on the other side to the surface of the sealing member 33.
  • the thickness L2 of the sealing member 33 is different.
  • the thickness L1 of the sealing member 33 on the side close to the metal column 40 is the thickness of the sealing member 33 on the side far from the metal column 40. It is larger than L2 (L1> L2).
  • a predetermined withstand voltage can be ensured by setting the thickness L1 of the sealing member 33 shown in FIG. 8 to be equal to or larger than the thickness L of the sealing member 33 shown in FIG. Can do.
  • the predetermined dielectric strength can be ensured by setting the thickness L2 of the sealing member 33 to be equal to or greater than the thickness L of the sealing member 33 shown in FIG. it can.
  • the light bulb shaped lamp 1 of the above-described embodiment forms two LED modules 20a and 20b by providing a light source and wiring for emitting light on both the front surface and the back surface of one substrate 21, and the light bulb shaped lamp 1 The light was extracted to the globe side and the base side.
  • a light emitting element and wiring for emitting light are individually provided on the surfaces of two separate substrates, and the back surfaces of the two substrates are bonded to form one substrate 21. Also with this configuration, light can be extracted to the globe side and the base side of the light bulb shaped lamp 1.
  • the light bulb shaped lamp 1 according to this modification is the above-described implementation in that the substrate 21 of the LED module is configured by bonding two substrates each having a light emitting element and a wiring for emitting light on the surface thereof with an adhesive. It differs from the light bulb shaped lamp 1 of the form.
  • the difference from the light bulb shaped lamp 1 of the above-described embodiment will be described in detail.
  • FIG. 9 is a plan view when the LED module is viewed from above with the globe removed from the light bulb shaped lamp according to this modification.
  • 9B is a cross-sectional view of the same light bulb shaped lamp cut along the line AA ′ in FIG. 9A
  • FIG. 9C is a cross section taken along the line BB ′ in FIG.
  • FIG. 9D is a cross-sectional view of the same light bulb shaped lamp
  • FIG. 9D is a cross sectional view of the light bulb shaped lamp cut along the line CC ′ in FIG. 9A
  • FIG. 9 corresponds to FIG.
  • the LED module 120a in this modification is a main light emitting module (first light emitting module) that emits light mainly toward the front and sides, and has a COB structure in which a bare chip is directly mounted on the surface of the substrate 29.
  • the LED module 120b in this modification is a secondary light emitting module (second light emitting module) that emits light mainly toward the rear and side, and has a COB structure in which a bare chip is directly mounted on the surface of the substrate 39. is there.
  • second light emitting module secondary light emitting module
  • the LED module 120a includes a substrate 29 (second substrate) which is an example of a main substrate, a plurality of LEDs 22a and 22b (second light emitting elements) provided on the surface (second surface) of the substrate 29, and a sealing member.
  • 23a and 23b second sealing member
  • metal wiring 24a, 24b and 26 second metal wiring
  • wires 25a and 25b second wire
  • conductive adhesive member 27 second conductive adhesive member
  • terminals 28 second terminal
  • the LED module 120b includes a substrate 39 (first substrate) which is an example of a sub-substrate, a plurality of LEDs 32 (first light emitting elements) provided on the surface (first surface) of the substrate 39, and a sealing member. 33 (first sealing member), metal wirings 34 and 36 (first metal wiring), wire 35 (first wire), conductive adhesive member 37 (first conductive adhesive member) and terminal 38 (first terminal) And.
  • the substrates 29 and 39 have the same configuration and shape as each other, and the back surfaces of the substrates 29 and 39 are bonded together by an adhesive 90 to form one substrate 21.
  • a translucent substrate or a non-translucent substrate can be used.
  • the substrate 29 is a rectangular mounting substrate for mounting the LEDs 22a and 22b
  • the substrate 39 is a rectangular mounting substrate for mounting the LEDs 32.
  • the substrates 29 and 39 are preferably made of a white substrate such as a white alumina substrate having a low light transmittance with respect to the light emitted from the LEDs 22a, 22b and 32, for example, 10% or less.
  • the substrate 29 and 39, LED 22a, having 50% or more reflectivity with respect to light emitted from 22b and 32, the main component Al 2 O 3, MgO, SiO , and one of TiO 2 It can be composed of a substrate.
  • substrate 21 can be made low, and the color nonuniformity of the light emitted from LED module 120a and 120b can be suppressed.
  • substrate can be used for the board
  • the through hole 29b constitutes a terminal 28 for connecting the lead wire 70 for power feeding and the LED module 120a
  • the through hole 39b is a terminal 38 for connecting the lead wire 70 for power feeding and the LED module 120b. Is configured.
  • the through holes 29 b and 39 b are arranged so as to be continuous to form the through hole 21 b of the substrate 21. Therefore, one lead wire 70 is inserted through one continuous through hole 29b and 39b.
  • One through hole 29 a that penetrates the substrate 29 is provided in the central part of the substrate 29, and one through hole 39 a that penetrates the substrate 39 is also provided in the central part of the substrate 39.
  • the through holes 29 a and 39 a are for fixing the LED modules 120 a and 120 b to the metal support column 40, and are arranged so as to form one through hole 21 a of the substrate 21. Therefore, the protrusion 42b of the metal support column 40 is fitted into the continuous through holes 29a and 39a.
  • the through hole 21a and the protrusion 42b function as a position restricting portion for determining the position and orientation of the substrate 21 as described above.
  • the adhesive 90 is provided between the back surface of the substrate 29 and the back surface of the substrate 39 and adheres both, and is made of, for example, a resin such as a silicone resin or a metal paste such as an Ag paste.
  • a resin such as a silicone resin
  • a metal paste such as an Ag paste.
  • the thermal conductivity between the substrate 29 and the substrate 39 is increased and the thermal conductivity as the substrate 21 is increased, so that the heat dissipation efficiency of the substrate 21 can be increased.
  • the light shielding property of the adhesive 90 that is, the light shielding property of the substrate 21 can be improved, color unevenness due to light traveling from the front surface to the back surface of the substrates 29 and 39 can also be suppressed.
  • the adhesive 90 prevents at least a part of the space between the through holes 29b and 39b between the back surface of the substrate 29 and the back surface of the substrate 39 so that the lead wire 70 does not interfere with the insertion of the through holes 29b and 39b. Is not provided.
  • the adhesive 90 prevents the through holes 29a and 39a between the back surface of the substrate 29 and the back surface of the substrate 39 from interfering with the fitting of the through holes 29a and 39a and the protrusions of the metal support column 40. It is not provided in all the spaces between.
  • a plurality of LEDs 22a and 22b, sealing members 23a and 23b, metal wirings 24a, 24b and 26, wires 25a and 25b, and terminals 28 are on the surface of the substrate 29.
  • a plurality of LEDs 32, a sealing member 33, metal wirings 34 and 36, wires 35 and terminals 38 are provided on the surface of the substrate 39.
  • the two lead wires 70 and the terminal 28 are connected by the conductive adhesive member 27, and the two lead wires 70 and the terminal 38 are connected by the conductive adhesive member 37. Is connected. Therefore, the LED modules 120a and 120b can be easily manufactured as compared with the case where a light source and wiring for emitting light are provided on both the front and back surfaces of one substrate 29.
  • the position from the metal column 40 among the conductive members of the LED modules 120a and 120b is the shortest distance as in the light bulb shaped lamp 1 according to the above embodiment.
  • the thickness from the conductive member (the metal wiring 34 in this modification) to the surface of the sealing member 33 is configured to satisfy a predetermined withstand voltage.
  • a light bulb shaped lamp having a wide light distribution angle and capable of suppressing a decrease in the life of the LED is realized. Can do.
  • the substrate 21 is composed of a substrate 29 provided with element rows of LEDs 22a and 22b on the surface and a substrate 39 provided with element rows of LEDs 32 on the surface.
  • the substrates 29 and 39 are arranged so that the back surfaces of the LED 22a and 22b and the LED 32 are not provided with the back surfaces thereof.
  • the LED module 120b may be bonded and fixed to the metal support column 40.
  • the LED modules 120a and 120b can be manufactured simply by preparing the separate substrates 29 and 39 and individually providing the respective members on the respective surfaces, and then bonding them, so that the LED modules 120a and 120b can be manufactured. Can be made easier.
  • the light bulb shaped lamp 1 that is easy to manufacture can be realized.
  • the LED module 120b is directly attached to the metal support column 40, and heat generated by the LED module 120b is transferred to the metal support column 40.
  • the LED module 120a is indirectly attached to the metal support column 40 via the LED module 120b, and the heat generated by the LED module 120a is indirectly transferred to the metal support column 40 via the LED module 120b.
  • An adhesive 90 as a heat conducting member is provided between the LED modules 120a and 120b.
  • the adhesive 90 is any one of a heat conductive resin, a ceramic paste, and a metal paste.
  • the heat dissipation efficiency and light shielding performance of the substrate 21 can be improved, so that the light emission efficiency and lifetime of the LEDs 22a, 22b and 32 are further suppressed, and at the same time, the color unevenness of the light emitted from the LED modules 120a and 120b is further suppressed. can do.
  • the metal support column 40 may penetrate the through hole 39 b of the substrate 39 and contact the back surface of the substrate 29. That is, the through-hole 39b may be formed so as to be fitted to the entire fixing portion 42 of the metal column 40, and the fixing surface of the fixing portion 42 of the metal column 40 and the back surface of the substrate 29 may be bonded by the adhesive 90. . Thereby, fixation to the metal support
  • the LED module 120a is bonded and fixed to the metal column 40 to shorten the heat radiation path from the substrate 29 to the metal column 40, and the inner wall of the through hole 39b of the substrate 39 and the fixing portion 42 of the metal column 40 are greased or the like.
  • the heat dissipation path from the substrate 39 to the metal column 40 can be widened by contacting through the heat conducting member. As a result, it is possible to further suppress the decrease in luminous efficiency and the lifetime of the LEDs 22a, 22b and 32.
  • the LED modules 20a and 20b are configured to emit white light by the blue LED and the yellow phosphor, but are not limited thereto.
  • a phosphor-containing resin containing a red phosphor and a green phosphor may be used so that white light is emitted by combining this with a blue LED.
  • the LEDs 22a, 22b, and 32 may be LEDs that emit light other than blue.
  • the phosphor particles may be a combination of phosphor particles that emit light in three primary colors (red, green, and blue).
  • a wavelength conversion material other than the phosphor particles may be used.
  • the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light.
  • a material containing a substance that emits light may be used.
  • the sealing members 23a, 22b, and 33 are formed linearly along the LED element rows, but are formed in a circular shape so as to cover all the LED element rows. It doesn't matter.
  • the LED is exemplified as the light emitting element.
  • a semiconductor light emitting element such as a semiconductor laser
  • an EL element such as an organic EL (Electro Luminescence) or an inorganic EL
  • other solid light emitting elements are used. May be.
  • the LED module has a COB type configuration in which the LED chip is directly mounted on the substrate, but is not limited thereto.
  • a package type LED element in which an LED chip is mounted in a cavity (concave portion) of a resin-molded container and a phosphor-containing resin is enclosed in the cavity, a metal wiring is formed on the LED element.
  • a surface mount device (SMD: Surface Mount Device) LED module configured by mounting a plurality on a substrate may be used.
  • LED element arrays are provided on the front surface and the back surface of the substrate 21 respectively.
  • LED element arrays may be provided only on the back surface of the substrate 21.
  • the LED module includes the substrate 21, a plurality of LEDs (first light emitting elements) provided only on the back surface of the substrate 21 (the first surface that is the surface on the metal column 40 side), and the first surface. And a plurality of LEDs (first light-emitting elements) and an insulating sealing member that seals the metal wiring.
  • the LED arrangement direction is parallel in the LED element arrays on the front and back surfaces of the substrate, and the predetermined direction included in the plane of the substrate intersects, for example, is orthogonal to the alignment direction.
  • the short side direction of the substrate is shown as an example of this direction, the predetermined direction is not limited to the short side direction.
  • the LED element array is provided on the surface of the substrate other than above the metal support.
  • the LED may be provided only above the metal support. .
  • the metal column has a width in the LED element array direction in the LED module as well as a width in the LED module array direction toward the substrate. It will be bigger. However, as long as at least the width of the LED element row in the LED module increases toward the substrate, the width of the LED in the LED module row may be constant toward the substrate. , May be smaller.
  • the lead wire is provided outside the metal column.
  • the lead wire 70 is provided so as to pierce the substrate from the back surface side of the substrate, but may be provided so as to pierce from the front surface side of the substrate.
  • the present invention can also be realized as an illumination device including the above-described light bulb shaped lamp.
  • the lighting device 100 is configured as a lighting device including the light bulb shaped lamp 1 and a lighting fixture (lighting fixture) 200 to which the light bulb shaped lamp 1 is attached.
  • the lighting device 200 is for turning off and lighting the light bulb shaped lamp 1 and includes, for example, a device main body 210 attached to the ceiling and a lamp cover 220 covering the light bulb shaped lamp 1.
  • the appliance main body 210 has a socket 211 to which the cap of the light bulb shaped lamp 1 is attached and which supplies power to the light bulb shaped lamp 1.
  • a translucent plate may be provided in the opening of the lamp cover 220.
  • the present invention is useful as a light bulb shaped lamp that replaces a conventional incandescent light bulb and the like, and can be widely used in lighting devices and the like.
  • the light bulb shaped lamp according to the present invention is suitable for a high output type light bulb shaped lamp because both insulation and high heat dissipation can be achieved.

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  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

A bulb lamp (1) is equipped with: a translucent globe (10); a metal strut (40) provided so as to extend towards the inside of the globe (10); and LED modules (20a, 20b) arranged inside the globe (10) and fixed to the metal strut (40). The LED modules (20a, 20b) have: a substrate (21); a plurality of LEDs (32) provided to a first surface, which is the surface of the substrate (21) on the side of the metal strut (40); metal wiring (34) formed on the first surface; and an insulating sealing member (33) that seals the plurality of LEDs (32) and the metal wiring (34). The distance to the surface of the sealing member (33) from the conductive member among the conductive members of the LED modules (20a, 20b) that is in the position at the shortest distance from the metal strut (40) satisfies a prescribed dielectric voltage.

Description

電球形ランプ及び照明装置Light bulb shaped lamp and lighting device

　本発明は、電球形ランプ及び照明装置に関し、例えば、半導体発光素子を用いた電球形ランプ及びこれを用いた照明装置に関する。 The present invention relates to a light bulb shaped lamp and a lighting device, for example, a light bulb shaped lamp using a semiconductor light emitting element and a lighting device using the same.

　ＬＥＤ（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）等の半導体発光素子は、高効率及び長寿命であることから、各種ランプの新しい光源として期待されており、ＬＥＤを光源とするＬＥＤランプの研究開発が進められている。 Semiconductor light emitting devices such as LEDs (Light Emitting Diodes) are expected to be new light sources for various lamps because of their high efficiency and long life, and research and development of LED lamps using LEDs as light sources are being promoted.

　このようなＬＥＤランプとしては、電球形のＬＥＤランプ（電球形ＬＥＤランプ）があり、電球形ＬＥＤランプでは、基板と、基板上に実装された複数のＬＥＤとを備えるＬＥＤモジュールが用いられる。例えば、特許文献１には、従来の電球形ＬＥＤランプが開示されている。 As such an LED lamp, there is a bulb-shaped LED lamp (bulb-shaped LED lamp). In the bulb-shaped LED lamp, an LED module including a substrate and a plurality of LEDs mounted on the substrate is used. For example, Patent Document 1 discloses a conventional bulb-type LED lamp.

特開２００６－３１３７１７号公報JP 2006-313717 A

　近年、白熱電球を模した構成の電球形ＬＥＤランプが検討されている。例えば、白熱電球に用いられるグローブ（ガラスバルブ）と同様のものを用いて、グローブ内の中心位置にＬＥＤモジュールを中空保持する構成の電球形ＬＥＤランプが検討されている。具体的には、グローブの開口からグローブの中心に向かって延びるように構成された金属支柱（ステム）を配設し、この金属支柱の頂部にＬＥＤモジュールを固定する。ＬＥＤモジュールは、基板と、基板の表面（グローブの頂部側の面）に実装された複数のＬＥＤチップと、複数のＬＥＤチップを一括封止する蛍光体含有樹脂と、基板の表面にパターン形成された金属配線とを備えている。また、グローブ内には、ＬＥＤモジュールに給電するための２本のリード線が配設されており、ＬＥＤモジュールは、２本のリード線と電気的に接続される接続部（モジュール電極）を有する。具体的に、接続部は、基板に設けられた貫通孔と、基板の裏面から表面に向かって貫通孔に挿通させた２本のリード線と金属配線（電極端子）とを電気的に接続する半田とによって構成されている。 In recent years, a bulb-type LED lamp having a configuration simulating an incandescent bulb has been studied. For example, a bulb-type LED lamp having a configuration in which the LED module is held hollow at the center position in the globe using the same globe (glass bulb) used for an incandescent bulb has been studied. Specifically, a metal support (stem) configured to extend from the opening of the globe toward the center of the globe is disposed, and the LED module is fixed to the top of the metal support. The LED module is patterned on the surface of the substrate, the plurality of LED chips mounted on the surface of the substrate (the surface on the top of the globe), the phosphor-containing resin that collectively seals the plurality of LED chips, and the surface of the substrate. Metal wiring. In addition, two lead wires for supplying power to the LED module are disposed in the globe, and the LED module has a connection portion (module electrode) that is electrically connected to the two lead wires. . Specifically, the connecting portion electrically connects the through hole provided in the substrate, and the two lead wires inserted into the through hole from the back surface to the front surface of the substrate and the metal wiring (electrode terminal). It is comprised with solder.

　ところで、ＬＥＤランプには所定の絶縁耐圧が要求されているが、このような構成の電球形ＬＥＤランプでは、基板の表面のみにＬＥＤチップ及び金属配線が設けられているので、基本的には、接続部（モジュール電極）と金属支柱との間の絶縁距離のみに留意すればよい。 By the way, although a predetermined withstand voltage is required for the LED lamp, in the light bulb shaped LED lamp having such a configuration, since the LED chip and the metal wiring are provided only on the surface of the substrate, basically, Only the insulation distance between the connecting portion (module electrode) and the metal column needs to be noted.

　しかしながら、基板の裏面（金属支柱側の面）にＬＥＤチップや金属配線等の導電部材が設けられた構成の電球形ＬＥＤランプでは、基板裏面側の導電部材（ＬＥＤチップ又は金属配線）と金属支柱との間の絶縁距離を確保する必要がある。 However, in a light bulb-type LED lamp having a configuration in which a conductive member such as an LED chip or metal wiring is provided on the back surface (surface on the metal support side) of the substrate, the conductive member (LED chip or metal wiring) on the back surface side of the substrate and the metal support column. It is necessary to secure an insulation distance between the two.

　この場合、金属支柱を細くすることで、基板裏面側の導電部材と金属支柱との絶縁距離を大きくすることができるが、放熱の役割を担っている金属支柱はＬＥＤモジュールとの接触面積をある程度確保する必要がある。したがって、単純に金属支柱を細くするということもできない。 In this case, it is possible to increase the insulation distance between the conductive member on the back side of the substrate and the metal support by making the metal support thinner, but the metal support that plays a role of heat dissipation has a certain contact area with the LED module. It is necessary to secure. Therefore, it is not possible to simply make the metal column thin.

　このように、金属支柱にＬＥＤモジュールが固定された構成の電球形ＬＥＤランプでは、ＬＥＤモジュールの金属支柱側（口金側）に導電部材を形成すると、所定の絶縁耐圧を確保することが難しいという問題がある。 Thus, in the light bulb-type LED lamp having a configuration in which the LED module is fixed to the metal column, it is difficult to ensure a predetermined withstand voltage when the conductive member is formed on the metal column side (base side) of the LED module. There is.

　本発明は、このような問題を解決するためになされたものであり、ＬＥＤモジュールが金属支柱に固定され、かつＬＥＤモジュールの導電部材（ＬＥＤ等）が金属支柱側に形成された構成であっても、所定の絶縁耐圧を容易に確保できる電球形ランプ及び照明装置を提供することを目的とする。 The present invention has been made in order to solve such a problem. The LED module is fixed to a metal column, and the conductive member (LED or the like) of the LED module is formed on the metal column side. Another object of the present invention is to provide a light bulb shaped lamp and a lighting device that can easily ensure a predetermined withstand voltage.

　上記目的を達成するために、本発明に係る電球形ランプの一態様は、透光性のグローブと、前記グローブの内方に向かって延びるように設けられた金属支柱と、前記グローブ内に配置され、前記金属支柱に固定された発光モジュールとを備え、前記発光モジュールは、基板と、前記基板の前記金属支柱側の面である第１の面に設けられた複数の第１発光素子と、前記第１の面に形成された金属配線と、前記複数の第１発光素子及び前記金属配線を封止する絶縁性の封止部材とを有し、前記発光モジュールの導電部材のうち前記金属支柱からの位置が最短距離となっている導電部材から前記封止部材の表面までの厚さが、所定の絶縁耐圧を満たす厚さであることを特徴とする。 In order to achieve the above object, one aspect of a light bulb shaped lamp according to the present invention includes a translucent glove, a metal support provided to extend inward of the glove, and a glove disposed in the glove. A light emitting module fixed to the metal column, the light emitting module comprising: a substrate; and a plurality of first light emitting elements provided on a first surface of the substrate on the metal column side; A metal wiring formed on the first surface; and an insulating sealing member that seals the plurality of first light emitting elements and the metal wiring, and the metal column among the conductive members of the light emitting module. The thickness from the conductive member having the shortest distance from the surface to the surface of the sealing member is a thickness that satisfies a predetermined withstand voltage.

　また、本発明に係る電球形ランプの一態様において、前記金属支柱からの位置が最短距離となっている前記導電部材は、前記金属配線である、としてもよい。 Further, in an aspect of the light bulb shaped lamp according to the present invention, the conductive member having a shortest distance from the metal support may be the metal wiring.

　また、本発明に係る電球形ランプの一態様において、前記最短距離は、前記第１の面上における前記金属支柱と前記金属配線との距離である、としてもよい。 Further, in an aspect of the light bulb shaped lamp according to the present invention, the shortest distance may be a distance between the metal support and the metal wiring on the first surface.

　また、本発明に係る電球形ランプの一態様において、前記封止部材がシリコーン樹脂であり、前記所定の絶縁耐圧が１．５ｋＶである場合、前記厚さは、０．１５ｍｍ以上である、としてもよい。 Further, in one aspect of the light bulb shaped lamp according to the present invention, when the sealing member is a silicone resin and the predetermined withstand voltage is 1.5 kV, the thickness is 0.15 mm or more. Also good.

　また、本発明に係る電球形ランプの一態様において、前記封止部材がシリコーン樹脂であり、前記所定の絶縁耐圧が４．０ｋＶである場合、前記厚さは、０．４０ｍｍ以上である、としてもよい。 Also, in one aspect of the light bulb shaped lamp according to the present invention, when the sealing member is a silicone resin and the predetermined withstand voltage is 4.0 kV, the thickness is 0.40 mm or more. Also good.

　また、本発明に係る電球形ランプの一態様において、前記封止部材は、低融点ガラスである、としてもよい。 Further, in one aspect of the light bulb shaped lamp according to the present invention, the sealing member may be low melting point glass.

　また、本発明に係る電球形ランプの一態様において、前記封止部材内に波長変換材が含有されている、としてもよい。 Further, in one aspect of the light bulb shaped lamp according to the present invention, a wavelength conversion material may be contained in the sealing member.

　また、本発明に係る電球形ランプの一態様において、さらに、前記基板の前記第１の面とは反対側の面である第２の面に、複数の第２発光素子が設けられている、としてもよい。 Further, in one aspect of the light bulb shaped lamp according to the present invention, a plurality of second light emitting elements are provided on a second surface which is a surface opposite to the first surface of the substrate. It is good.

　また、本発明に係る電球形ランプの一態様において、前記基板は、前記複数の第１発光素子が表面に設けられた主基板と、前記複数の第２発光素子が表面に設けられた副基板とから構成され、前記主基板及び前記副基板は、前記複数の第１発光素子及び前記複数の第２発光素子が設けられていない裏面同士が対向するように配置されている、としてもよい。 Further, in one aspect of the light bulb shaped lamp according to the present invention, the substrate includes a main substrate on which the plurality of first light emitting elements are provided on the surface, and a sub substrate on which the plurality of second light emitting elements are provided on the surface. The main substrate and the sub-substrate may be arranged such that back surfaces on which the plurality of first light emitting elements and the plurality of second light emitting elements are not provided are opposed to each other.

　また、本発明に係る照明装置の一態様は、上記いずれかの電球形ランプを備えることを特徴とする。 Further, an aspect of the lighting device according to the present invention includes any one of the above light bulb shaped lamps.

　本発明によれば、所定の絶縁耐圧を容易に確保できる電球形ランプを実現することができる。 According to the present invention, it is possible to realize a light bulb shaped lamp that can easily ensure a predetermined withstand voltage.

図１は、本発明の実施の形態に係る電球形ランプの側面図である。FIG. 1 is a side view of a light bulb shaped lamp according to an embodiment of the present invention. 図２は、本発明の実施の形態に係る電球形ランプの分解斜視図である。FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention. 図３は、本発明の実施の形態に係る電球形ランプの断面図である。FIG. 3 is a cross-sectional view of the light bulb shaped lamp according to the embodiment of the present invention. 図４は、本発明の実施の形態に係る電球形ランプの構成を示す図であり、（ａ）は上面図、（ｂ）、（ｃ）、（ｄ）及び（ｅ）は断面図である。FIG. 4 is a diagram showing a configuration of a light bulb shaped lamp according to an embodiment of the present invention, where (a) is a top view, and (b), (c), (d), and (e) are cross-sectional views. . 図５は、本発明の実施の形態に係る電球形ランプのＬＥＤモジュールにおけるＬＥＤの拡大断面図である。FIG. 5 is an enlarged cross-sectional view of an LED in the LED module of the light bulb shaped lamp according to the embodiment of the present invention. 図６は、本発明の実施の形態に係る電球形ランプの要部拡大断面図である。FIG. 6 is an enlarged cross-sectional view of a main part of the light bulb shaped lamp according to the embodiment of the present invention. 図７は、本発明の実施の形態の変形例１に係る電球形ランプの要部拡大断面図である。FIG. 7 is an enlarged cross-sectional view of a main part of a light bulb shaped lamp according to a first modification of the embodiment of the present invention. 図８は、本発明の実施の形態の変形例２に係る電球形ランプの要部拡大断面図である。FIG. 8 is an enlarged cross-sectional view of a main part of a light bulb shaped lamp according to a second modification of the embodiment of the present invention. 図９は、本発明の実施の形態の変形例３に係る電球形ランプの構成を示す図であり、（ａ）は上面図、（ｂ）、（ｃ）、（ｄ）及び（ｅ）は断面図である。FIG. 9 is a diagram illustrating a configuration of a light bulb shaped lamp according to a third modification of the embodiment of the present invention, in which (a) is a top view, and (b), (c), (d), and (e) are illustrated. It is sectional drawing. 図１０は、本発明の実施の形態の他の変形例に係る電球形ランプの断面図である。FIG. 10 is a cross-sectional view of a light bulb shaped lamp according to another modification of the embodiment of the present invention. 図１１は、本発明の実施の形態に係る照明装置の概略断面図である。FIG. 11 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.

　以下、本発明の実施の形態について、図面を用いて詳細に説明する。なお、以下で説明する実施の形態は、いずれも本発明の好ましい一具体例を示すものである。以下の実施の形態で示される数値、形状、材料、構成要素、構成要素の配置位置及び接続形態などは、一例であり、本発明を限定する主旨ではない。よって、以下の実施の形態における構成要素のうち、本発明の最上位概念を示す独立請求項に記載されていない構成要素については、任意の構成要素として説明される。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Each of the embodiments described below shows a preferred specific example of the present invention. Numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of constituent elements, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

　なお、各図は、模式図であり、必ずしも厳密に図示されたものではない。また、各図において、同じ構成部材については同じ符号を付している。 Each figure is a schematic diagram and is not necessarily shown strictly. Moreover, in each figure, the same code | symbol is attached | subjected about the same structural member.

　［電球形ランプの全体構成］
　まず、本発明の実施の形態に係る電球形ランプ１の全体構成について、図１～図３を参照しながら説明する。 [Overall configuration of bulb-type lamp]
First, the overall configuration of a light bulb shaped lamp 1 according to an embodiment of the present invention will be described with reference to FIGS.

　図１は、本実施の形態に係る電球形ランプ１の側面図である。図２は、本実施の形態に係る電球形ランプ１の分解斜視図である。図３は、本実施の形態に係る電球形ランプ１の断面図である。 FIG. 1 is a side view of a light bulb shaped lamp 1 according to the present embodiment. FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the present embodiment. FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the present embodiment.

　なお、図１～図３において、紙面上方が電球形ランプ１の前方であり、紙面下方が電球形ランプ１の後方であり、紙面左右が電球形ランプ１の側方である。ここで、本明細書において、「後方」とは、ＬＥＤモジュールの基板を基準として口金側の方向のことであり、「前方」とは、ＬＥＤモジュールの基板を基準として口金と反対側の方向のことであり、「側方」とは、ＬＥＤモジュールの基板の主面と平行な方向のことである。また、図１及び図３において、紙面上下方向に沿って描かれた一点鎖線は電球形ランプ１のランプ軸Ｊ（中心軸）を示している。ランプ軸Ｊとは、電球形ランプ１を照明装置（不図示）のソケットに取り付ける際の回転中心となる軸であり、口金の回転軸と一致している。 1 to 3, the upper side of the paper is the front of the light bulb shaped lamp 1, the lower side of the paper is the rear of the light bulb shaped lamp 1, and the left and right sides of the paper are the sides of the light bulb shaped lamp 1. Here, in this specification, “rear” refers to the direction of the base with respect to the substrate of the LED module, and “front” refers to the direction of the opposite side of the base with respect to the substrate of the LED module. That is, the “side” means a direction parallel to the main surface of the substrate of the LED module. 1 and 3, the alternate long and short dash line drawn in the vertical direction of the drawing indicates the lamp axis J (center axis) of the light bulb shaped lamp 1. The lamp axis J is an axis serving as a rotation center when the light bulb shaped lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base.

　電球形ランプ１は、照明用光源の一例であって、電球形蛍光灯又は白熱電球の代替品となる電球形ＬＥＤランプ（ＬＥＤ電球）である。電球形ランプ１は、透光性のグローブ１０と、光源であるＬＥＤモジュール２０ａ及び２０ｂと、ランプ外部から電力を受ける口金３０と、金属支柱４０と、支持台５０と、樹脂ケース６０と、リード線７０と、点灯回路８０とを備える。 The light bulb shaped lamp 1 is an example of a light source for illumination, and is a light bulb shaped LED lamp (LED light bulb) that is a substitute for a light bulb shaped fluorescent lamp or an incandescent light bulb. The light bulb shaped lamp 1 includes a translucent globe 10, LED modules 20a and 20b that are light sources, a base 30 that receives power from the outside of the lamp, a metal support 40, a support base 50, a resin case 60, a lead Line 70 and lighting circuit 80 are provided.

　電球形ランプ１は、グローブ１０と樹脂ケース６０（第１ケース部６１）と口金３０とによって外囲器が構成されている。また、本実施の形態における電球形ランプ１は、６０Ｗ形相当の明るさとなるように構成されている。 The bulb-shaped lamp 1 includes an envelope formed by the globe 10, the resin case 60 (first case portion 61), and the base 30. Moreover, the light bulb shaped lamp 1 in the present embodiment is configured to have a brightness equivalent to the 60 W type.

　以下、本実施の形態に係る電球形ランプ１の各構成要素について詳細に説明する。 Hereinafter, each component of the light bulb shaped lamp 1 according to the present embodiment will be described in detail.

　［グローブ］
　グローブ１０は、ＬＥＤモジュール２０ａ及び２０ｂを収納するとともに、ＬＥＤモジュール２０ａ及び２０ｂからの光をランプ外部に透光する透光性カバーである。グローブ１０の内面に入射したＬＥＤモジュール２０ａ及び２０ｂの光は、グローブ１０を透過してグローブ１０の外部へと取り出される。 [Glove]
The globe 10 is a translucent cover that houses the LED modules 20a and 20b and transmits light from the LED modules 20a and 20b to the outside of the lamp. The light of the LED modules 20 a and 20 b that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted to the outside of the globe 10.

　本実施の形態におけるグローブ１０は、ＬＥＤモジュール２０ａ及び２０ｂからの光に対して透明な材料によって構成されている。このようなグローブ１０としては、例えば可視光に対して透明なシリカガラス製のガラスバルブ（クリアバルブ）とすることができる。この場合、グローブ１０内に収納されたＬＥＤモジュール２０ａ及び２０ｂは、グローブ１０の外側から視認することができる。 The globe 10 in the present embodiment is made of a material that is transparent to the light from the LED modules 20a and 20b. As such a globe 10, for example, a glass bulb (clear bulb) made of silica glass that is transparent to visible light can be used. In this case, the LED modules 20 a and 20 b housed in the globe 10 can be viewed from the outside of the globe 10.

　図２に示すように、グローブ１０の形状は、一端が球状に閉塞され、他端に開口部１１を有する形状である。具体的に、グローブ１０の形状は、中空の球の一部が、球の中心部から遠ざかる方向に伸びながら狭まったような形状であり、球の中心部から遠ざかった位置に開口部１１が形成されている。このような形状のグローブ１０としては、一般的な白熱電球と同様の形状のガラスバルブを用いることができる。例えば、グローブ１０として、Ａ形、Ｇ形又はＥ形等のガラスバルブを用いることができる。 As shown in FIG. 2, the globe 10 has a shape in which one end is closed in a spherical shape and an opening 11 is provided at the other end. Specifically, the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is formed at a position away from the center of the sphere. Has been. As the globe 10 having such a shape, a glass bulb having the same shape as a general incandescent bulb can be used. For example, a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.

　なお、グローブ１０は、必ずしも可視光に対して透明である必要はなく、グローブ１０に光拡散機能を持たせてもよい。例えば、シリカや炭酸カルシウム等の光拡散材を含有する樹脂や白色顔料等をグローブ１０の内面又は外面の全面に塗布することによって乳白色の光拡散膜を形成してもよい。また、グローブ１０の材質としては、ガラス材に限らず、アクリル（ＰＭＭＡ）やポリカーボネート（ＰＣ）等の合成樹脂等による樹脂材を用いてもよい。 Note that the globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function. For example, a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 10. Further, the material of the globe 10 is not limited to a glass material, and a resin material such as a synthetic resin such as acrylic (PMMA) or polycarbonate (PC) may be used.

　［ＬＥＤモジュール］
　ＬＥＤモジュール２０ａ及び２０ｂは、ＬＥＤ（ＬＥＤチップ）を有し、リード線７０を介してＬＥＤに電力が供給されることにより発光する発光モジュールである。ＬＥＤモジュール２０ａ及び２０ｂは、金属支柱４０によってグローブ１０内の中空に保持されている。 [LED module]
The LED modules 20a and 20b are light emitting modules that have LEDs (LED chips) and emit light when electric power is supplied to the LEDs via the lead wires. The LED modules 20 a and 20 b are held in the hollow inside the globe 10 by the metal support 40.

　ＬＥＤモジュール２０ａ及び２０ｂは、グローブ１０によって形成される球形状の中心位置（例えば、グローブ１０の内径が大きい径大部分の内部）に配置されることが好ましい。このように、グローブ１０の中心位置にＬＥＤモジュール２０ａ及び２０ｂが配置されることにより、電球形ランプ１の配光特性は、従来のフィラメントコイルを用いた一般白熱電球と近似した配光特性となる。 The LED modules 20a and 20b are preferably arranged at a spherical central position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large). Thus, by arranging the LED modules 20a and 20b at the center position of the globe 10, the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to a general incandescent light bulb using a conventional filament coil. .

　なお、ＬＥＤモジュール２０ａ及び２０ｂの詳細な構成については後述する。 The detailed configuration of the LED modules 20a and 20b will be described later.

　［口金］
　口金３０は、ＬＥＤモジュール２０ａ及び２０ｂのＬＥＤを発光させるための電力を電球形ランプ１の外部から受ける受電部である。口金３０は、二接点によって交流電力を受電し、口金３０で受電した電力はリード線を介して点灯回路８０の電力入力部に入力される。例えば、口金３０には商用電源（ＡＣ１００Ｖ）から交流電力が供給される。具体的には、口金３０は、照明器具（照明装置）のソケットに取り付けられてソケットから交流電力を受ける。これにより、電球形ランプ１（ＬＥＤモジュール２０ａ及び２０ｂ）が点灯する。 [Base]
The base 30 is a power receiving unit that receives power for causing the LEDs of the LED modules 20 a and 20 b to emit light from the outside of the light bulb shaped lamp 1. The base 30 receives AC power through two contacts, and the power received by the base 30 is input to the power input unit of the lighting circuit 80 via a lead wire. For example, AC power is supplied to the base 30 from a commercial power supply (AC 100 V). Specifically, the base 30 is attached to a socket of a lighting fixture (lighting device) and receives AC power from the socket. Thereby, the light bulb shaped lamp 1 (LED modules 20a and 20b) is turned on.

　口金３０は、金属製の有底筒体形状（キャップ状）であり、外周面が雄ネジとなっているシェル部と、シェル部に絶縁部を介して装着されたアイレット部とを備える。口金３０の外周面には照明装置のソケットに螺合させるための螺合部が形成され、口金３０の内周面には樹脂ケース６０に螺合させるための螺合部が形成されている。 The base 30 has a metal bottomed cylindrical shape (cap shape), and includes a shell portion whose outer peripheral surface is a male screw and an eyelet portion attached to the shell portion via an insulating portion. A screwing portion for screwing with the socket of the lighting device is formed on the outer peripheral surface of the base 30, and a screwing portion for screwing with the resin case 60 is formed on the inner peripheral surface of the base 30.

　口金３０の種類は、特に限定されるものではないが、本実施の形態では、ねじ込み型のエジソンタイプ（Ｅ型）の口金を用いている。口金３０として、例えば、Ｅ２６形又はＥ１７形、又はＥ１６形等を用いることができる。なお、口金３０として、差し込み型の口金を用いてもよい。 The type of the base 30 is not particularly limited, but in the present embodiment, a screwed-type Edison type (E type) base is used. As the base 30, for example, E26 type, E17 type, E16 type, or the like can be used. Note that a plug-type base may be used as the base 30.

　［金属支柱］
　金属支柱４０は、グローブ１０の開口部１１の近傍からグローブ１０の内方に向かって延びるように設けられた金属製のステムであり、グローブ１０内でＬＥＤモジュール２０ａ及び２０ｂを保持する保持部材として機能する。金属支柱４０の一端はＬＥＤモジュール２０ａ及び２０ｂに接続され、他端は支持台５０に接続されている。 [Metal support]
The metal column 40 is a metal stem provided so as to extend from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10, and serves as a holding member that holds the LED modules 20 a and 20 b in the globe 10. Function. One end of the metal column 40 is connected to the LED modules 20 a and 20 b, and the other end is connected to the support base 50.

　金属支柱４０は、ＬＥＤモジュール２０ａ及び２０ｂで発生する熱を口金３０側に放熱させるための放熱部材としても機能する。したがって、金属支柱４０を熱伝導率の高い金属材料、例えば熱伝導率が約２３７［Ｗ／ｍ・Ｋ］のアルミニウム（Ａｌ）、銅（Ｃｕ）又は鉄（Ｆｅ）を主成分として構成することで、金属支柱４０による放熱効率を高めることができる。その結果、温度上昇によるＬＥＤの発光効率の低下及び寿命の低下を抑制することができる。金属支柱４０の金属材料としては、アルミニウム合金の他に銅等を用いて構成しても構わない。また、金属支柱４０として、樹脂等からなる支柱の表面に金属膜を形成したものを用いても構わない。 The metal column 40 also functions as a heat radiating member for radiating heat generated in the LED modules 20a and 20b to the base 30 side. Therefore, the metal support 40 is composed of a metal material having a high thermal conductivity, for example, aluminum (Al), copper (Cu) or iron (Fe) having a thermal conductivity of about 237 [W / m · K] as a main component. Therefore, the heat radiation efficiency by the metal support | pillar 40 can be improved. As a result, it is possible to suppress a decrease in luminous efficiency and lifetime of the LED due to temperature rise. As a metal material of the metal column 40, copper or the like may be used in addition to the aluminum alloy. In addition, as the metal support 40, a support having a metal film formed on the surface of a support made of resin or the like may be used.

　金属支柱４０は、主軸部４１と、固定部４２とが例えば一体成型されて構成されている。主軸部４１は、断面積が一定の円柱部材である。主軸部４１の一端は固定部４２に接続されており、他端は支持台５０に接続されている。固定部４２は、ＬＥＤモジュール２０ａ及び２０ｂが固定される固定面を有し、この固定面がＬＥＤモジュール２０ａ及び２０ｂの基板の裏面と接する。固定部４２は、さらに、固定面から突出する突起部を有し、この突起部はＬＥＤモジュール２０ａ及び２０ｂの基板に設けられた貫通孔と嵌合する。ＬＥＤモジュール２０ａ及び２０ｂと固定部４２の固定面とは、例えばシリコーン樹脂等の樹脂の接着剤により接着される。 The metal support column 40 is configured by, for example, integrally molding a main shaft portion 41 and a fixed portion 42. The main shaft portion 41 is a cylindrical member having a constant cross-sectional area. One end of the main shaft portion 41 is connected to the fixed portion 42, and the other end is connected to the support base 50. The fixing part 42 has a fixing surface to which the LED modules 20a and 20b are fixed, and this fixing surface is in contact with the back surfaces of the substrates of the LED modules 20a and 20b. The fixing portion 42 further has a protruding portion that protrudes from the fixing surface, and this protruding portion fits into a through hole provided in the substrate of the LED modules 20a and 20b. The LED modules 20a and 20b and the fixing surface of the fixing portion 42 are bonded with, for example, an adhesive of a resin such as a silicone resin.

　金属支柱４０の固定部４２は、ランプ軸Ｊと垂直な断面の面積（ランプ軸Ｊと垂直な方向の幅）が金属支柱４０の主軸部４１より大きい。そして、金属支柱４０の固定部４２は、電球形ランプ１の前方に向かう方向、つまり支持台５０からＬＥＤモジュール２０ａ及び２０ｂの基板に向かう方向（近付く方向）において、ランプ軸Ｊと垂直な断面の面積が大きくなる形状を持つ。言い換えると、金属支柱４０の固定部４２は、電球形ランプ１の前方に向かう方向において、ＬＥＤモジュール２０ａ及び２０ｂのＬＥＤの素子列の並び方向及び素子列内でのＬＥＤの並び方向の幅が広がる形状を持つ。したがって、金属支柱４０は、ＬＥＤモジュール２０ａ及び２０ｂの基板と接する固定部４２の固定面において、ランプ軸Ｊと垂直な断面の面積が最大となっている。 The fixing part 42 of the metal column 40 has a cross-sectional area perpendicular to the lamp axis J (width in the direction perpendicular to the lamp axis J) larger than the main axis part 41 of the metal column 40. And the fixing | fixed part 42 of the metal support | pillar 40 has a cross section perpendicular | vertical to the lamp | ramp axis | shaft J in the direction which goes to the front of the lightbulb-shaped lamp 1, ie, the direction which goes to the board | substrate of LED module 20a and 20b from the support stand 50. It has a shape that increases the area. In other words, in the direction toward the front of the light bulb shaped lamp 1, the fixing portion 42 of the metal support column 40 has a wider width in the LED element array direction of the LED modules 20 a and 20 b and in the LED array direction in the element array. With shape. Therefore, the metal strut 40 has the largest cross-sectional area perpendicular to the lamp axis J on the fixing surface of the fixing portion 42 in contact with the substrates of the LED modules 20a and 20b.

　このように構成された金属支柱４０によれば、ＬＥＤモジュール２０ｂから金属支柱４０への放熱経路を広くしつつ、金属支柱４０によるＬＥＤモジュール２０ｂの光のケラレを抑えることができる。すなわち、金属支柱４０はＬＥＤモジュール２０ａ及び２０ｂの近くでその幅が広くなる形状を有するので、ＬＥＤモジュール２０ａ及び２０ｂで発生した熱を幅の広い金属支柱４０に効率的に逃がすことが可能になり、ＬＥＤの発光効率の低下及び寿命の低下を抑制することができる。また、金属支柱４０は、ＬＥＤモジュール２０ａ及び２０ｂから離れるに従ってその幅が狭くなる形状を有するので、ＬＥＤモジュール２０ａ及び２０ｂの光の金属支柱４０によるケラレを抑制することができ、光の取り出し効率の低下を抑制することができる。 According to the metal column 40 configured in this manner, it is possible to suppress the vignetting of the LED module 20b by the metal column 40 while widening the heat dissipation path from the LED module 20b to the metal column 40. That is, since the metal support column 40 has a shape in which the width thereof is increased near the LED modules 20a and 20b, the heat generated in the LED modules 20a and 20b can be efficiently released to the wide metal support column 40. , It is possible to suppress a decrease in luminous efficiency and lifetime of the LED. In addition, since the metal support column 40 has a shape whose width becomes narrower as it moves away from the LED modules 20a and 20b, it is possible to suppress the vignetting of the light of the LED modules 20a and 20b by the metal support column 40 and to improve the light extraction efficiency. The decrease can be suppressed.

　金属支柱４０の固定部４２の固定面は、ＬＥＤモジュール２０ｂのＬＥＤの光を反射するように表面処理が施されていることが好ましい。これにより、ＬＥＤモジュール２０ｂの口金３０側に向かう光を固定部４２の固定面で反射させて、ＬＥＤモジュール２０ｂの光として有効に取り出すことが可能になる。例えば、金属支柱４０の表面は、ＬＥＤ２２ａ及び２２ｂの素子列並びにＬＥＤ３２の素子列から発せられる光に対して光反射率３０％以上を有するように構成される。 It is preferable that the fixing surface of the fixing portion 42 of the metal support column 40 is surface-treated so as to reflect the light of the LED of the LED module 20b. As a result, light directed toward the base 30 side of the LED module 20b can be reflected by the fixing surface of the fixing portion 42 and effectively extracted as light of the LED module 20b. For example, the surface of the metal column 40 is configured to have a light reflectance of 30% or more with respect to light emitted from the element rows of the LEDs 22a and 22b and the element row of the LEDs 32.

　また、本実施の形態では、基板２１は、裏面が金属支柱４０と接するように金属支柱４０に固定されている。これにより、ＬＥＤモジュール２０ａ及び２０ｂの放熱効率を高めることができるので、温度上昇によるＬＥＤの発光効率の低下及び寿命の低下を抑制することができる。 In the present embodiment, the substrate 21 is fixed to the metal column 40 so that the back surface is in contact with the metal column 40. Thereby, since the thermal radiation efficiency of LED module 20a and 20b can be improved, the fall of the luminous efficiency of LED by the temperature rise and the fall of a lifetime can be suppressed.

　なお、本実施の形態において、金属支柱４０の形状は、基板２１に向かってＬＥＤモジュール２０ａ及び２０ｂのＬＥＤの素子列の並び方向の幅が漸次広がるテーパ形状であるとしたが、階段状に広がる形状であってもよい。 In the present embodiment, the shape of the metal support column 40 is a tapered shape in which the width of the LED element rows of the LED modules 20a and 20b in the LED modules 20a and 20b gradually increases toward the substrate 21. It may be a shape.

　また、本実施の形態では、金属支柱４０の固定部４２は基板２１に向かって幅が広がる形状とした。しかし、金属支柱４０が全体として基板２１に向かってＬＥＤモジュール２０ａ及び２０ｂのＬＥＤの素子列の並び方向の幅が広がる形状を有するものであれば、これに限られない。言い換えると、金属支柱４０は、ＬＥＤモジュール２０ａ及び２０ｂと接触する部分でＬＥＤモジュール２０ａ及び２０ｂのＬＥＤの素子列の並び方向の金属支柱４０の幅が最大となる形状であればよい。例えば、金属支柱４０の固定部４２はＬＥＤモジュール２０ａ及び２０ｂのＬＥＤの素子列の並び方向の幅が基板２１に向かって一定であり、金属支柱４０の主軸部４１が基板２１に向かって幅の広がる形状を有してもよい。また、金属支柱４０の主軸部４１及び固定部４２の両方が基板２１に向かって幅の広がる形状を有してもよい。 Further, in the present embodiment, the fixing portion 42 of the metal support column 40 has a shape that widens toward the substrate 21. However, the metal support column 40 is not limited to this as long as the metal support column 40 has a shape in which the width of the LED element rows of the LED modules 20a and 20b extends toward the substrate 21 as a whole. In other words, the metal support column 40 only needs to have a shape in which the width of the metal support column 40 in the arrangement direction of the LED element rows of the LED modules 20a and 20b is the maximum at the portion in contact with the LED modules 20a and 20b. For example, in the fixing portion 42 of the metal column 40, the width of the LED element rows of the LED modules 20 a and 20 b is constant toward the substrate 21, and the main shaft portion 41 of the metal column 40 has a width toward the substrate 21. It may have a widening shape. Further, both the main shaft portion 41 and the fixed portion 42 of the metal support column 40 may have a shape whose width increases toward the substrate 21.

　［支持台］
　支持台（支持板）５０は、金属支柱４０を支持する支持部材であり、樹脂ケース６０に固定されている。支持台５０は、グローブ１０の開口部１１の開口端に接続されてグローブ１０の開口部１１を塞ぐように構成されている。具体的に、支持台５０は、周縁に段差部を有する円盤状部材で構成されており、その段差部にはグローブ１０の開口部１１の開口端が当接されている。そして、この段差部において、支持台５０と樹脂ケース６０とグローブ１０の開口部１１の開口端とは、接着剤によって固着されている。 [Support stand]
The support base (support plate) 50 is a support member that supports the metal support column 40 and is fixed to the resin case 60. The support base 50 is configured to be connected to the opening end of the opening 11 of the globe 10 and close the opening 11 of the globe 10. Specifically, the support base 50 is formed of a disk-shaped member having a stepped portion on the periphery, and the opening end of the opening 11 of the globe 10 is in contact with the stepped portion. And in this level | step-difference part, the support stand 50, the resin case 60, and the opening end of the opening part 11 of the globe 10 are adhere | attached with the adhesive agent.

　支持台５０は、金属支柱４０と同様に、アルミニウム等の熱伝導率の高い金属材料により構成されることで、支持台５０による金属支柱４０を熱伝導したＬＥＤモジュール２０ａ及び２０ｂの熱の放熱効率が高められる。その結果、温度上昇によるＬＥＤの発光効率の低下及び寿命の低下をさらに抑制することができる。なお、支持台５０と金属支柱４０とは同一の金型により一体的に成形されていてもよい。 Similarly to the metal support column 40, the support base 50 is made of a metal material having a high thermal conductivity such as aluminum, so that the heat radiation efficiency of the LED modules 20a and 20b that thermally conducts the metal support column 40 by the support base 50. Is increased. As a result, it is possible to further suppress the decrease in the luminous efficiency and the lifetime of the LED due to the temperature increase. In addition, the support base 50 and the metal support | pillar 40 may be integrally shape | molded by the same metal mold | die.

　［樹脂ケース］
　樹脂ケース６０は、金属支柱４０と口金３０とを絶縁すると共に点灯回路８０を収納するための絶縁ケース（回路ホルダ）であり、大径円筒状の第１ケース部６１と、小径円筒状の第２ケース部６２とから構成されている。樹脂ケース６０は、例えば、ポリブチレンテレフタレート（ＰＢＴ）によって成形されている。 [Resin case]
The resin case 60 is an insulating case (circuit holder) for insulating the metal support column 40 and the base 30 and accommodating the lighting circuit 80. The resin case 60 has a first case portion 61 having a large-diameter cylindrical shape and a first case having a small-diameter cylindrical shape. 2 case part 62 is comprised. The resin case 60 is formed by, for example, polybutylene terephthalate (PBT).

　第１ケース部６１の外表面は外気に露出しているので、樹脂ケース６０に伝導した熱は、主に第１ケース部６１から放熱される。第２ケース部６２は、外周面が口金３０の内周面と接触するように構成されており、第２ケース部６２の外周面には口金３０と螺合するための螺合部が形成されている。 Since the outer surface of the first case portion 61 is exposed to the outside air, the heat conducted to the resin case 60 is mainly dissipated from the first case portion 61. The second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 30, and a screwing portion for screwing with the base 30 is formed on the outer peripheral surface of the second case portion 62. ing.

　［リード線］
　２本のリード線７０は、ＬＥＤモジュール２０ａ及び２０ｂを点灯させるための電力を点灯回路８０からＬＥＤモジュール２０ａ及び２０ｂに供給するためのリード線対であり、銅線等の針金状の金属電線より構成することができる。各リード線７０は、グローブ１０内に配置され、一端がＬＥＤモジュール２０ａ及び２０ｂの外部端子と電気的に接続され、他端が点灯回路８０の電力出力部、言い換えると口金３０と電気的に接続されている。 [Lead]
The two lead wires 70 are a pair of lead wires for supplying power for lighting the LED modules 20a and 20b from the lighting circuit 80 to the LED modules 20a and 20b. From the wire-like metal wires such as copper wires Can be configured. Each lead wire 70 is disposed in the globe 10, one end is electrically connected to the external terminals of the LED modules 20 a and 20 b, and the other end is electrically connected to the power output unit of the lighting circuit 80, in other words, the base 30. Has been.

　２本のリード線７０は、金属の芯線とこの芯線を被覆する絶縁性樹脂とで構成される例えばビニル線であり、ＬＥＤモジュール２０ａ及び２０ｂとは絶縁性樹脂で被覆されておらず表面がむき出しにされた芯線を介して電気的に接続される。このとき、２本のリード線７０における基板２１の表面から突き出した部分と、基板２１の裏面から３ｍｍ以下だけ突き出した部分とでは芯線が絶縁性樹脂によって被覆されていなくてもよい。 The two lead wires 70 are, for example, vinyl wires composed of a metal core wire and an insulating resin that covers the core wire, and the LED modules 20a and 20b are not covered with the insulating resin and the surface is exposed. It is electrically connected via the core wire. At this time, the core wire may not be covered with the insulating resin between the portion of the two lead wires 70 protruding from the surface of the substrate 21 and the portion protruding from the back surface of the substrate 21 by 3 mm or less.

　なお、リード線７０のＬＥＤモジュール２０ａ及び２０ｂとの接続関係の詳細については後述する。 The details of the connection relationship between the lead wire 70 and the LED modules 20a and 20b will be described later.

　［点灯回路］
　点灯回路８０は、ＬＥＤモジュール２０ａ及び２０ｂのＬＥＤを点灯させるための駆動回路（回路ユニット）であり、樹脂ケース６０によって覆われている。点灯回路８０は、口金３０から給電された交流電力を直流電力に変換する回路を含み、２本のリード線７０を介して変換後の直流電力をＬＥＤモジュール２０ａ及び２０ｂのＬＥＤに供給する。 [Lighting circuit]
The lighting circuit 80 is a drive circuit (circuit unit) for lighting the LEDs of the LED modules 20 a and 20 b and is covered with a resin case 60. The lighting circuit 80 includes a circuit that converts AC power fed from the base 30 into DC power, and supplies the converted DC power to the LEDs of the LED modules 20 a and 20 b via the two lead wires 70.

　点灯回路８０は、例えば、回路基板と、回路基板に実装された複数の回路素子（電子部品）とによって構成される。回路基板は、金属配線がパターン形成されたプリント基板であり、当該回路基板に実装された複数の回路素子同士を電気的に接続する。本実施の形態において、回路基板は、主面がランプ軸と直交する姿勢で配置されている。また、回路素子は、例えば、各種コンデンサ、抵抗素子、整流回路素子、コイル素子、チョークコイル（チョークトランス）、ノイズフィルタ、ダイオード又は集積回路素子であり、点灯回路８０は、これらの回路素子の中から適宜選択して構成される。 The lighting circuit 80 includes, for example, a circuit board and a plurality of circuit elements (electronic components) mounted on the circuit board. The circuit board is a printed board on which metal wiring is patterned, and electrically connects a plurality of circuit elements mounted on the circuit board. In the present embodiment, the circuit board is arranged in a posture in which the main surface is orthogonal to the lamp axis. The circuit elements are, for example, various capacitors, resistor elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, diodes, or integrated circuit elements, and the lighting circuit 80 is a circuit element among these circuit elements. It is configured by selecting as appropriate.

　なお、電球形ランプ１は、必ずしも点灯回路８０を備える必要はない。例えば、照明器具又は電池等から電球形ランプ１に直接直流電力が供給される場合には、電球形ランプ１は、点灯回路８０を備えなくてもよい。また、点灯回路８０は、平滑回路に限られるものではなく、調光回路及び昇圧回路等も適宜選択して組み合わせて構成することができる。 Note that the light bulb shaped lamp 1 is not necessarily provided with the lighting circuit 80. For example, when direct-current power is directly supplied to the light bulb shaped lamp 1 from a lighting fixture or a battery, the light bulb shaped lamp 1 may not include the lighting circuit 80. Further, the lighting circuit 80 is not limited to a smoothing circuit, and a dimming circuit, a booster circuit, and the like can be appropriately selected and combined.

　［ＬＥＤモジュールの詳細構成］
　次に、ＬＥＤモジュール２０ａ及び２０ｂの詳細な構成と、ＬＥＤモジュール２０ａ及び２０ｂ並びにリード線７０の接続関係とについて、図４を用いて説明する。 [Detailed configuration of LED module]
Next, the detailed configuration of the LED modules 20a and 20b and the connection relationship between the LED modules 20a and 20b and the lead wire 70 will be described with reference to FIG.

　図４は、本実施の形態に係る電球形ランプ１におけるＬＥＤモジュール周辺の構成を示す図である。なお、図４の（ａ）は電球形ランプ１においてグローブ１０を除いた状態でＬＥＤモジュール２０ａを上方から見たときの平面図である。そして、図４の（ｂ）は（ａ）のＡ－Ａ’線に沿って切断した同電球形ランプ１の断面図であり、図４の（ｃ）は（ａ）のＢ－Ｂ’線に沿って切断した同電球形ランプ１の断面図であり、図４の（ｄ）は（ａ）のＣ－Ｃ’線に沿って切断した同電球形ランプ１の断面図であり、図４の（ｅ）は（ａ）のＤ－Ｄ’線に沿って切断した同電球形ランプ１の断面図である。 FIG. 4 is a diagram showing a configuration around the LED module in the light bulb shaped lamp 1 according to the present embodiment. 4A is a plan view when the LED module 20a is viewed from above with the globe 10 removed from the light bulb shaped lamp 1. FIG. 4B is a cross-sectional view of the light bulb shaped lamp 1 cut along the line AA ′ in FIG. 4A, and FIG. 4C is a line BB ′ in FIG. FIG. 4D is a cross-sectional view of the light bulb shaped lamp 1 cut along the line CC ′ of FIG. 4A. (E) is a cross-sectional view of the bulb-type lamp 1 cut along the line DD ′ in (a).

　ＬＥＤモジュール２０ａは、主として前方及び側方に向けて光を放出する主発光モジュール（第１発光モジュール）であり、ベアチップが直接基板２１の表面上に実装されたＣＯＢ（Ｃｈｉｐ　Ｏｎ　Ｂｏａｒｄ）構造である。 The LED module 20a is a main light emitting module (first light emitting module) that mainly emits light toward the front and sides, and has a COB (Chip On Board) structure in which a bare chip is directly mounted on the surface of the substrate 21. .

　一方、ＬＥＤモジュール２０ｂは、主として後方及び側方に向けて光を放出する副発光モジュール（第２発光モジュール）であり、ベアチップが直接基板２１の裏面上に実装されたＣＯＢ構造である。 On the other hand, the LED module 20b is a sub light emitting module (second light emitting module) that emits light mainly toward the rear and side, and has a COB structure in which a bare chip is directly mounted on the back surface of the substrate 21.

　つまり、本実施の形態において、基板２１は、ＬＥＤモジュール２０ａにおける基板でもあり、ＬＥＤモジュール２０ｂにおける基板でもある。本実施の形態において、基板２１の裏面は、金属支柱４０側（口金側）の面である第１の面であり、基板２１の表面は、グローブ１０側の面である第２の面である。また、基板２１の裏面（第１の面）に実装されたＬＥＤチップは第１発光素子であり、基板２１の表面（第２の面）に実装されたＬＥＤチップは第２発光素子である。 That is, in the present embodiment, the substrate 21 is both a substrate in the LED module 20a and a substrate in the LED module 20b. In the present embodiment, the back surface of the substrate 21 is a first surface that is a surface on the metal strut 40 side (base side), and the surface of the substrate 21 is a second surface that is a surface on the globe 10 side. . Further, the LED chip mounted on the back surface (first surface) of the substrate 21 is a first light emitting element, and the LED chip mounted on the surface (second surface) of the substrate 21 is a second light emitting element.

　ＬＥＤモジュール２０ａは、基板２１と、基板２１の表面（第２の面）上に設けられた複数のＬＥＤ２２ａ及び２２ｂ（第２発光素子）、封止部材２３ａ及び２３ｂ（第２封止部材）、金属配線２４ａ、２４ｂ及び２６（第２金属配線）、ワイヤー２５ａ及び２５ｂ（第２ワイヤー）、導電性接着部材２７（第２導電性接着部材）並びに端子２８（第２端子）とを備えている。 The LED module 20a includes a substrate 21, a plurality of LEDs 22a and 22b (second light emitting elements) provided on the surface (second surface) of the substrate 21, sealing members 23a and 23b (second sealing member), Metal wiring 24a, 24b and 26 (second metal wiring), wires 25a and 25b (second wire), a conductive adhesive member 27 (second conductive adhesive member) and a terminal 28 (second terminal) are provided. .

　一方、ＬＥＤモジュール２０ｂは、基板２１と、基板２１の裏面（第１の面）上に設けられた複数のＬＥＤ３２（第１発光素子）、封止部材３３（第１封止部材）、金属配線３４及び３６（第１金属配線）、ワイヤー３５（第１ワイヤー）、導電性接着部材３７（第１導電性接着部材）並びに端子３８（第１端子）とを備えている。 On the other hand, the LED module 20b includes a substrate 21, a plurality of LEDs 32 (first light-emitting elements) provided on the back surface (first surface) of the substrate 21, a sealing member 33 (first sealing member), and a metal wiring. 34 and 36 (first metal wiring), a wire 35 (first wire), a conductive adhesive member 37 (first conductive adhesive member), and a terminal 38 (first terminal).

　なお、本実施の形態では、２つのＬＥＤモジュール２０ａ及び２０ｂを合わせて１つのＬＥＤモジュールと考えてもよい。この場合、ＬＥＤモジュールは、基板２１と、基板２１の表面及び裏面の各々に列状に実装された複数のＬＥＤと、各ＬＥＤの列を一括封止する封止部材とによって構成される。 In the present embodiment, the two LED modules 20a and 20b may be considered as one LED module. In this case, the LED module includes a substrate 21, a plurality of LEDs mounted in a row on each of the front and back surfaces of the substrate 21, and a sealing member that collectively seals each LED row.

　［基板］
　基板２１は、透光性基板又は非透光性基板を用いることができ、例えば酸化アルミニウム（アルミナ）若しくは窒化アルミニウム等からなるセラミック基板、樹脂基板、ガラス基板、フレキシブル基板、又は樹脂被膜された金属基板（メタルベース基板）等である。基板２１は、ＬＥＤ２２ａ、２２ｂ及び３２を実装するための矩形状の実装基板（ＬＥＤ実装用基板）である。基板２１は、長辺の長さをＬ１とし、短辺の長さをＬ２とし、厚みをｄとすると、例えばＬ１＝２６ｍｍ、Ｌ２＝１３ｍｍ、ｄ＝１ｍｍとすることができる。 [substrate]
The substrate 21 can be a translucent substrate or a non-translucent substrate, for example, a ceramic substrate made of aluminum oxide (alumina) or aluminum nitride, a resin substrate, a glass substrate, a flexible substrate, or a resin-coated metal. A substrate (metal base substrate) or the like. The substrate 21 is a rectangular mounting substrate (LED mounting substrate) for mounting the LEDs 22a, 22b, and 32. The substrate 21 can be, for example, L1 = 26 mm, L2 = 13 mm, and d = 1 mm, where L1 is the long side length, L2 is the short side length, and d is the thickness.

　基板２１は、ＬＥＤ２２ａ、２２ｂ及び３２から発せられる光に対して光透過率が低く例えば１０％以下の白色アルミナ基板等の白色基板又は金属基板等で構成されることが好ましい。例えば、基板２１は、ＬＥＤ２２ａ、２２ｂ及び３２から発せられる光に対して光反射率５０％以上を有し、Ａｌ2Ｏ3、ＭｇＯ、ＳｉＯ、及びＴｉＯ2のいずれかを主成分とする基板で構成することができる。基板２１の光透過率が高い場合、ＬＥＤモジュール２０ａにおいて、基板２１の表面側のＬＥＤ２２ａ及び２２ｂの光の一部が基板２１を通過した後、基板２１の裏面側から発せられる。同様に、ＬＥＤモジュール２０ｂにおいて、基板２１の裏面側のＬＥＤ３２の光の一部が基板２１を通過した後、基板２１の表面側から発せられる。したがって、電球形ランプ１において、口金側及びそれと反対側から取り出される光について色ムラが発生する。これに対し、基板２１の光透過率を低くすることでこのような色ムラを抑制することができる。また、安価な白色基板を用いることができるので、電球形ランプ１の低コスト化を実現できる。 The substrate 21 is preferably composed of a white substrate such as a white alumina substrate having a low light transmittance with respect to light emitted from the LEDs 22a, 22b, and 32, for example, 10% or less, or a metal substrate. For example, the substrate 21, LED 22a, having 50% or more reflectivity with respect to light emitted from 22b and 32, Al 2 O 3, MgO , SiO, and one of TiO 2 in the substrate mainly Can be configured. When the light transmittance of the substrate 21 is high, in the LED module 20a, a part of the light of the LEDs 22a and 22b on the front surface side of the substrate 21 passes through the substrate 21 and then is emitted from the back surface side of the substrate 21. Similarly, in the LED module 20 b, a part of the light of the LED 32 on the back surface side of the substrate 21 is emitted from the front surface side of the substrate 21 after passing through the substrate 21. Therefore, in the light bulb shaped lamp 1, color unevenness occurs with respect to light extracted from the base side and the opposite side. On the other hand, such color unevenness can be suppressed by reducing the light transmittance of the substrate 21. Further, since an inexpensive white substrate can be used, the cost of the light bulb shaped lamp 1 can be reduced.

　但し、基板２１の表面及び裏面の一方にのみＬＥＤチップを実装する場合、基板２１として、透光性基板を用いることもできる。例えば、基板２１として、可視光に対する全透過率が９０％以上である多結晶アルミナからなるセラミックス基板を用いることも可能である。これにより、基板２１の表面及び裏面のいずれか一方のみにＬＥＤチップを実装した場合でも、ＬＥＤチップが発する光は基板２１を透過するので、ＬＥＤチップが実装されていない面からも光を放出させることができる。 However, when the LED chip is mounted only on one of the front surface and the back surface of the substrate 21, a translucent substrate can be used as the substrate 21. For example, a ceramic substrate made of polycrystalline alumina having a total transmittance of 90% or more for visible light can be used as the substrate 21. Thereby, even when the LED chip is mounted on only one of the front surface and the back surface of the substrate 21, the light emitted from the LED chip is transmitted through the substrate 21, so that the light is also emitted from the surface where the LED chip is not mounted. be able to.

　基板２１の長辺方向の両端部には基板２１を貫通する２つの貫通孔２１ｂが設けられている。これら２つの貫通孔２１ｂは給電用のリード線７０とＬＥＤモジュール２０ａ及び２０ｂとを接続するための端子２８及び３８を構成し、２つの貫通孔２１ｂのそれぞれには基板２１の裏面から表面に向かってリード線７０が挿通されている。 Two through holes 21b penetrating the substrate 21 are provided at both ends of the substrate 21 in the long side direction. These two through holes 21b constitute terminals 28 and 38 for connecting the lead wire 70 for power feeding and the LED modules 20a and 20b. Each of the two through holes 21b extends from the back surface to the front surface of the substrate 21. The lead wire 70 is inserted.

　基板２１の中央部には基板２１を貫通する１つの貫通孔２１ａが設けられている。この貫通孔２１ａは、ＬＥＤモジュール２０ａ及び２０ｂを金属支柱４０に固定するためのものであり、貫通孔２１ａには金属支柱４０の突起部４２ｂが嵌合されている。貫通孔２１ａ及び突起部４２ｂは平面視が矩形状であり、基板２１の位置や向きを決定するための位置規制部として機能する。 In the central portion of the substrate 21, one through hole 21 a that penetrates the substrate 21 is provided. The through hole 21a is for fixing the LED modules 20a and 20b to the metal support column 40, and a protrusion 42b of the metal support column 40 is fitted into the through hole 21a. The through hole 21 a and the protrusion 42 b have a rectangular shape in plan view, and function as a position restricting portion for determining the position and orientation of the substrate 21.

　なお、貫通孔２１ａがなくても接着剤によりＬＥＤモジュール２０ａ及び２０ｂの金属支柱４０への固定は可能である。したがって、貫通孔２１ａは設けられなくても構わない。 In addition, even if there is no through-hole 21a, it is possible to fix the LED modules 20a and 20b to the metal column 40 with an adhesive. Therefore, the through hole 21a may not be provided.

　［ＬＥＤ］
　ＬＥＤ２２ａ、２２ｂ及び３２は、所定の電力により発光する半導体発光素子であって、導電部材の一例である。 [LED]
The LEDs 22a, 22b, and 32 are semiconductor light emitting elements that emit light with a predetermined power, and are examples of conductive members.

　ＬＥＤ２２ａ及び２２ｂは、それぞれ基板２１の表面の上に複数実装されている。複数のＬＥＤ２２ａは、基板２１の長辺方向に同一ピッチで直線状に配列されており、素子列（発光素子群）として基板２１の短辺方向つまりＬＥＤ２２ａの素子列におけるＬＥＤ２２ａの並び方向と直交する方向に複数本並べられるように配設されている。同様に、複数のＬＥＤ２２ｂは、基板２１の長辺方向に同一ピッチで直線状に配列されており、素子列（発光素子群）として基板２１の短辺方向つまりＬＥＤ２２ｂの素子列におけるＬＥＤ２２ｂの並び方向と直交する方向に複数本並べられるように配設されている。このとき、ＬＥＤ２２ｂの素子列の複数本は、基板２１の短辺方向においてＬＥＤ２２ａの２つの素子列の間に位置するように配設されている。 A plurality of LEDs 22a and 22b are mounted on the surface of the substrate 21, respectively. The plurality of LEDs 22a are linearly arranged at the same pitch in the long side direction of the substrate 21, and are orthogonal to the short side direction of the substrate 21, that is, the arrangement direction of the LEDs 22a in the element row of the LED 22a as an element row (light emitting element group). A plurality are arranged in the direction. Similarly, the plurality of LEDs 22b are linearly arranged at the same pitch in the long side direction of the substrate 21, and the arrangement direction of the LEDs 22b in the short side direction of the substrate 21, that is, the element row of the LED 22b, as an element row (light emitting element group). Are arranged in a direction orthogonal to each other. At this time, the plurality of element rows of the LED 22 b are arranged so as to be positioned between the two element rows of the LED 22 a in the short side direction of the substrate 21.

　複数のＬＥＤ２２ａは、各素子列内において直列接続されており、かつ、素子列同士において並列接続されている。同様に、複数のＬＥＤ２２ｂも、各素子列において直列接続されており、かつ、素子列同士において並列接続されている。さらに、ＬＥＤ２２ａの素子列及びＬＥＤ２２ｂの素子列同士も並列接続されている。 The plurality of LEDs 22a are connected in series in each element row, and are connected in parallel in the element rows. Similarly, the plurality of LEDs 22b are also connected in series in each element row, and are connected in parallel in the element rows. Furthermore, the element rows of the LED 22a and the element rows of the LED 22b are also connected in parallel.

　複数のＬＥＤ２２ａ及び２２ｂは、例えば、素子列内において隣り合うＬＥＤの間隔（ピッチ）が１．８ｍｍとなるように配設されている。そして、隣り合うＬＥＤ２２ａの素子列とＬＥＤ２２ｂの素子列とにおいて隣り合うＬＥＤの間隔が例えば４ｍｍとなるように配設されている。 The plurality of LEDs 22a and 22b are arranged so that, for example, the interval (pitch) between adjacent LEDs in the element row is 1.8 mm. And the space | interval of LED which adjoins in the element row | line | column of LED22a and the element row | line | column of LED22b is arrange | positioned so that it may be set to 4 mm.

　一方、ＬＥＤ３２は、基板２１の裏面の上に複数実装されている。複数のＬＥＤ３２は、基板２１の長辺方向に同一ピッチで直線状に配列されており、素子列（発光素子群）として基板２１の短辺方向つまりＬＥＤ３２の素子列におけるＬＥＤ３２の並び方向と直交する方向に複数本並べられるように配設されている。複数のＬＥＤ３２は、各素子列内において直列接続されており、かつ、素子列同士において並列接続されている。 On the other hand, a plurality of LEDs 32 are mounted on the back surface of the substrate 21. The plurality of LEDs 32 are arranged in a straight line at the same pitch in the long side direction of the substrate 21, and are orthogonal to the arrangement direction of the LEDs 32 in the short side direction of the substrate 21, that is, the LED 32 element row, as an element row (light emitting element group). A plurality are arranged in the direction. The plurality of LEDs 32 are connected in series in each element row, and are connected in parallel in the element rows.

　表面側のＬＥＤ２２ａは、基板２１を挟んで裏面側のＬＥＤ３２と対向するように配置されている。例えば、ＬＥＤ２２ａの基板２１と接する下面の全面がＬＥＤ３２の基板２１と接する下面の全面と対向するように配置されている。この場合、ＬＥＤ２２ａはその全体がＬＥＤ３２の上方の領域内に存在し、ＬＥＤ３２はその全体がＬＥＤ２２ａの下方の領域内に存在する。したがって、ＬＥＤ２２ａは、基板２１及びＬＥＤ３２を挟んで封止部材３３と対向するように配置され、ＬＥＤ３２は、基板２１及びＬＥＤ２２ａを挟んで封止部材２３ａと対向するように配置される。 The front-side LED 22a is disposed so as to face the rear-side LED 32 with the substrate 21 in between. For example, the entire lower surface of the LED 22a in contact with the substrate 21 is arranged so as to face the entire lower surface of the LED 32 in contact with the substrate 21. In this case, the entire LED 22a is present in the region above the LED 32, and the entire LED 32 is present in the region below the LED 22a. Therefore, LED22a is arrange | positioned so that the board | substrate 21 and LED32 may be pinched, and it may oppose the sealing member 33, and LED32 may be arrange | positioned so that the board | substrate 21 and LED22a may be pinched | interposed.

　ＬＥＤ２２ｂは、基板２１を挟んで金属支柱４０の固定部４２の固定面と対向するように配置されている。例えば、ＬＥＤ２２ｂの基板２１と接する下面の全面が金属支柱４０の固定部４２の固定面と対向するように配置されている。この場合、ＬＥＤ２２ｂはその全体が金属支柱４０の固定部４２の固定面の上方領域内に存在する。 LED22b is arrange | positioned so that the fixed surface of the fixing | fixed part 42 of the metal support | pillar 40 may be opposed on both sides of the board | substrate 21. FIG. For example, the entire lower surface of the LED 22b in contact with the substrate 21 is disposed so as to face the fixing surface of the fixing portion 42 of the metal support column 40. In this case, the entire LED 22 b exists in the upper region of the fixing surface of the fixing portion 42 of the metal support column 40.

　なお、本実施の形態では、ＬＥＤ２２ｂは、ＬＥＤ２２ｂの素子列の全てのＬＥＤが金属支柱４０の固定部４２の固定面と対向するように実装されているが、ＬＥＤ２２ｂは、ＬＥＤ２２ｂの素子列の一部のＬＥＤのみが金属支柱４０の固定部４２の固定面と対向するように実装されていてもよい。 In this embodiment, the LEDs 22b are mounted so that all the LEDs in the element row of the LED 22b face the fixing surface of the fixing portion 42 of the metal support column 40. However, the LED 22b is one of the element rows of the LED 22b. Only the LED of the part may be mounted so as to face the fixing surface of the fixing part 42 of the metal support column 40.

　ＬＥＤ２２ａ、２２ｂ及び３２としては、全方位、つまり側方、上方及び下方に向けて単色の可視光を発するベアチップを用いることができる。ＬＥＤ２２ａ、２２ｂ及び３２は、例えば、側方に全光量の２０％、上方に全光量の６０％、下方に全光量の２０％の光を発する。 As the LEDs 22a, 22b, and 32, bare chips that emit monochromatic visible light in all directions, that is, sideward, upward, and downward can be used. The LEDs 22a, 22b, and 32 emit, for example, 20% of the total light amount on the side, 60% of the total light amount on the upper side, and 20% of the total light amount on the lower side.

　ＬＥＤ２２ａ、２２ｂ及び３２は、例えば一辺の長さが約０．３５ｍｍ（３５０μｍ）で、通電されることで青色光を発する矩形状（正方形）の青色ＬＥＤチップである。青色ＬＥＤチップとしては、例えばＩｎＧａＮ系の材料によって構成された、中心波長が４４０ｎｍ～４７０ｎｍの窒化ガリウム系の半導体発光素子を用いることができる。 The LEDs 22a, 22b, and 32 are rectangular (square) blue LED chips that emit blue light when energized, for example, each side having a length of about 0.35 mm (350 μm). As the blue LED chip, for example, a gallium nitride based semiconductor light emitting device having a central wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.

　ここで、本実施の形態で用いられるＬＥＤ２２ａ、２２ｂ及び３２について、図５を用いて説明する。図５は、本発明の実施の形態に係る電球形ランプのＬＥＤモジュールにおけるＬＥＤ（ＬＥＤチップ）周辺の拡大断面図である。なお、図５では、ＬＥＤ２２ａの周辺を図示しているが、ＬＥＤ２２ｂ及び３２においても同様である。 Here, the LEDs 22a, 22b and 32 used in the present embodiment will be described with reference to FIG. FIG. 5 is an enlarged cross-sectional view around the LED (LED chip) in the LED module of the light bulb shaped lamp according to the embodiment of the present invention. In FIG. 5, the periphery of the LED 22a is illustrated, but the same applies to the LEDs 22b and 32.

　ＬＥＤ２２ａは、図５に示すように、サファイア基板１２２ａと、サファイア基板１２２ａ上に積層された、互いに異なる組成から構成される複数の窒化物半導体層１２２ｂとを有する。 As shown in FIG. 5, the LED 22 a includes a sapphire substrate 122 a and a plurality of nitride semiconductor layers 122 b that are stacked on the sapphire substrate 122 a and have different compositions.

　窒化物半導体層１２２ｂの上面の両端部には、カソード電極１２２ｃとアノード電極１２２ｄとが設けられている。そして、カソード電極１２２ｃの上にはワイヤーボンド部１２２ｅが設けられ、アノード電極１２２ｄの上にはワイヤーボンド部１２２ｆが設けられている。例えば、隣り合うＬＥＤ２２ａにおいて、一方のＬＥＤ２２ａのカソード電極１２２ｃと他方のＬＥＤ２２ａのアノード電極１２２ｄとは、ワイヤーボンド部１２２ｅ及び１２２ｆを介して、ワイヤー２５ａにより接続されている。 A cathode electrode 122c and an anode electrode 122d are provided at both ends of the upper surface of the nitride semiconductor layer 122b. A wire bond portion 122e is provided on the cathode electrode 122c, and a wire bond portion 122f is provided on the anode electrode 122d. For example, in adjacent LEDs 22a, the cathode electrode 122c of one LED 22a and the anode electrode 122d of the other LED 22a are connected by a wire 25a through wire bond portions 122e and 122f.

　ＬＥＤ２２ａは、サファイア基板１２２ａ側の面が基板２１の表面又は裏面と対向するように、透光性のチップボンディング材１２２ｇにより基板２１の上に固定されている。チップボンディング材１２２ｇには、酸化金属から構成されるフィラーを含有したシリコーン樹脂等を用いることができる。チップボンディング材１２２ｇに透光性材料を使用することにより、ＬＥＤ２２ａの側面から出る光の損失を低減することができ、チップボンディング材１２２ｇによる影の発生を抑制することができる。 The LED 22a is fixed on the substrate 21 with a translucent chip bonding material 122g so that the surface on the sapphire substrate 122a side faces the front surface or the back surface of the substrate 21. For the chip bonding material 122g, a silicone resin containing a filler composed of metal oxide can be used. By using a translucent material for the chip bonding material 122g, loss of light emitted from the side surface of the LED 22a can be reduced, and generation of shadows by the chip bonding material 122g can be suppressed.

　［封止部材］
　封止部材２３ａは、ＬＥＤ２２ａの素子列におけるＬＥＤ２２ａ及び金属配線２４ａを封止する絶縁性部材である。封止部材２３ａは、ＬＥＤ２２ａ及び金属配線２４ａを覆うように形成されている。本実施の形態において、封止部材２３ａは、素子列を構成する複数のＬＥＤ２２ａの配列方向に沿って、複数のＬＥＤ２２ａの一列分を一括封止するように直線状に形成されている。また、封止部材２３ａは、素子列の配列方向に沿って複数本形成され、異なる素子列を個別に封止している。 [Sealing member]
The sealing member 23a is an insulating member that seals the LED 22a and the metal wiring 24a in the element row of the LED 22a. The sealing member 23a is formed so as to cover the LED 22a and the metal wiring 24a. In the present embodiment, the sealing member 23a is linearly formed so as to collectively seal one row of the plurality of LEDs 22a along the arrangement direction of the plurality of LEDs 22a constituting the element row. A plurality of sealing members 23a are formed along the arrangement direction of the element rows, and individually seal different element rows.

　また、封止部材２３ａは、光波長変換材である蛍光体を含み、ＬＥＤ２２ａが発する光を波長変換する波長変換部材としても機能する。封止部材２３ａは、ＬＥＤ２２ａが発する光の波長を変換する波長変換材と、波長変換材を含有する絶縁性の樹脂材料とから構成される。波長変換材としては、ＬＥＤ２２ａが発する光によって励起されて所望の色（波長）の光を放出する蛍光体粒子を用いることができる。 Further, the sealing member 23a includes a phosphor that is a light wavelength conversion material, and also functions as a wavelength conversion member that converts the wavelength of light emitted from the LED 22a. The sealing member 23a is composed of a wavelength conversion material that converts the wavelength of light emitted from the LED 22a and an insulating resin material containing the wavelength conversion material. As the wavelength conversion material, phosphor particles that are excited by light emitted from the LED 22a and emit light of a desired color (wavelength) can be used.

　蛍光体粒子としては、ＬＥＤ２２ａが青色光を発する青色ＬＥＤである場合、封止部材２３ａから白色光を出射させるために、青色光を黄色光に波長変換する蛍光体粒子が用いられる。例えば、蛍光体粒子としてＹＡＧ（イットリウム・アルミニウム・ガーネット）系の黄色蛍光体粒子を用いることができる。これにより、ＬＥＤ２２ａが発した青色光の一部は、封止部材２３ａに含まれる黄色蛍光体粒子によって黄色光に波長変換される。つまり、黄色蛍光体粒子が青色光を励起光として蛍光発光する。そして、黄色蛍光体粒子に吸収されなかった（波長変換されなかった）青色光と、黄色蛍光体粒子によって波長変換された黄色光とは、封止部材２３ａの中で拡散及び混合されることにより、封止部材２３ａから白色光となって出射される。 As the phosphor particles, when the LED 22a is a blue LED that emits blue light, phosphor particles that convert the wavelength of the blue light into yellow light are used in order to emit white light from the sealing member 23a. For example, YAG (yttrium / aluminum / garnet) -based yellow phosphor particles can be used as the phosphor particles. Thereby, a part of blue light emitted from the LED 22a is wavelength-converted into yellow light by the yellow phosphor particles contained in the sealing member 23a. That is, the yellow phosphor particles emit fluorescent light using blue light as excitation light. And the blue light which was not absorbed by the yellow phosphor particles (the wavelength was not converted) and the yellow light which was wavelength-converted by the yellow phosphor particles were diffused and mixed in the sealing member 23a. The white light is emitted from the sealing member 23a.

　また、蛍光体粒子を含有する封止部材２３ａの材料としては、シリコーン樹脂等の透明樹脂材料又はフッ素系樹脂等の有機材を用いることができる。本実施の形態では、封止部材２３ａとして、シリコーン樹脂に所定の蛍光体粒子を分散させた蛍光体含有樹脂を用いている。あるいは、蛍光体粒子を含有する封止部材２３ａの材料としては、低融点ガラス又はゾルゲルガラス等の無機材等を用いることもできる。なお、封止部材２３ａには、シリカ粒子等の光拡散材が分散されていてもよい。 Further, as the material of the sealing member 23a containing the phosphor particles, a transparent resin material such as silicone resin or an organic material such as fluorine resin can be used. In the present embodiment, a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin is used as the sealing member 23a. Alternatively, as the material of the sealing member 23a containing the phosphor particles, an inorganic material such as a low melting point glass or a sol-gel glass can be used. Note that a light diffusing material such as silica particles may be dispersed in the sealing member 23a.

　封止部材２３ｂは、基板２１の表面（第２の面）上において、封止部材２３ａに隣接して形成される。本実施の形態では、２本の封止部材２３ｂが、基板２１の短辺方向において２つの封止部材２３ａの間に位置するように形成されている。 The sealing member 23b is formed adjacent to the sealing member 23a on the surface (second surface) of the substrate 21. In the present embodiment, the two sealing members 23 b are formed so as to be positioned between the two sealing members 23 a in the short side direction of the substrate 21.

　封止部材２３ｂは、封止部材２３ａと同様の構成であり、ＬＥＤ２２ｂの素子列におけるＬＥＤ２２ｂ及び金属配線２４ｂを封止し、ＬＥＤ２２ｂ及び金属配線２４ｂを覆うように形成されている。本実施の形態において、封止部材２３ｂは、素子列を構成する複数のＬＥＤ２２ｂの配列方向に沿って、複数のＬＥＤ２２ｂの一列分を一括封止するように直線状に形成されている。また、封止部材２３ｂは、素子列の配列方向に沿って複数本形成され、異なる素子列を個別に封止している。 The sealing member 23b has the same configuration as the sealing member 23a, and is formed so as to seal the LED 22b and the metal wiring 24b in the element row of the LED 22b and cover the LED 22b and the metal wiring 24b. In the present embodiment, the sealing member 23b is linearly formed so as to collectively seal one row of the plurality of LEDs 22b along the arrangement direction of the plurality of LEDs 22b constituting the element row. Further, a plurality of sealing members 23b are formed along the arrangement direction of the element rows, and different element rows are individually sealed.

　また、封止部材２３ｂは、封止部材２３ａと同様に、光波長変換材である蛍光体を含み、ＬＥＤ２２ｂが発する光を波長変換する波長変換部材としても機能する。封止部材２３ｂは、ＬＥＤ２２ｂが発する光の波長を変換する波長変換材と、波長変換材を含有する絶縁性の樹脂材料とから構成される。波長変換材としては、封止部材２３ａと同様のものを用いることができる。例えば、封止部材２３ｂとして、シリコーン樹脂に所定の蛍光体粒子を分散させた蛍光体含有樹脂を用いることができる。 Further, like the sealing member 23a, the sealing member 23b includes a phosphor that is a light wavelength conversion material, and also functions as a wavelength conversion member that converts the wavelength of light emitted from the LED 22b. The sealing member 23b includes a wavelength conversion material that converts the wavelength of light emitted from the LED 22b and an insulating resin material that contains the wavelength conversion material. As the wavelength conversion material, the same material as the sealing member 23a can be used. For example, a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin can be used as the sealing member 23b.

　封止部材３３は、基板２１の裏面（第１の面）上に形成される。本実施の形態では、２本の封止部材３３が形成されており、各々が基板２１を挟んで２本の封止部材２３ａの各々と対向している。 The sealing member 33 is formed on the back surface (first surface) of the substrate 21. In the present embodiment, two sealing members 33 are formed, each facing the two sealing members 23a with the substrate 21 in between.

　封止部材３３は、封止部材２３ａと同様の構成であり、ＬＥＤ３２の素子列におけるＬＥＤ３２及び金属配線３４を封止し、ＬＥＤ３２及び金属配線３４を覆うように形成されている。本実施の形態において、封止部材３３は、素子列を構成する複数のＬＥＤ３２の配列方向に沿って、複数のＬＥＤ３２の一列分を一括封止するように直線状に形成されている。また、封止部材３３は、素子列の配列方向に沿って複数本形成され、異なる素子列を個別に封止している。 The sealing member 33 has the same configuration as the sealing member 23a, and is formed so as to seal the LED 32 and the metal wiring 34 in the element row of the LED 32 and cover the LED 32 and the metal wiring 34. In the present embodiment, the sealing member 33 is linearly formed so as to collectively seal one row of the plurality of LEDs 32 along the arrangement direction of the plurality of LEDs 32 constituting the element row. Further, a plurality of sealing members 33 are formed along the arrangement direction of the element rows, and different element rows are individually sealed.

　また、封止部材３３は、封止部材２３ａと同様に、光波長変換材である蛍光体を含み、ＬＥＤ３２が発する光を波長変換する波長変換部材としても機能する。封止部材３３は、ＬＥＤ３２が発する光の波長を変換する波長変換材と、波長変換材を含有する絶縁性の樹脂材料とから構成される。波長変換材としては、封止部材２３ａと同様のものを用いることができる。本実施の形態では、封止部材３３として、シリコーン樹脂に所定の蛍光体粒子を分散させた蛍光体含有樹脂を用いている。また、封止部材３３として、低融点ガラスに所定の蛍光体粒子が分散されたものを用いることもできる。 Also, the sealing member 33 includes a phosphor that is a light wavelength conversion material, similarly to the sealing member 23a, and also functions as a wavelength conversion member that converts the wavelength of light emitted from the LED 32. The sealing member 33 includes a wavelength conversion material that converts the wavelength of light emitted from the LED 32 and an insulating resin material that contains the wavelength conversion material. As the wavelength conversion material, the same material as the sealing member 23a can be used. In the present embodiment, as the sealing member 33, a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin is used. Further, as the sealing member 33, a material in which predetermined phosphor particles are dispersed in low melting point glass can be used.

　本実施の形態において、１本あたりの封止部材２３ａ、２３ｂ及び３３は、例えば、長さが２４ｍｍ、線幅が１．６ｍｍ、中心最大高さが０．７ｍｍとなるように形成されている。また、本実施の形態における封止部材２３ａ、２３ｂ及び３３は、シリコーン樹脂の質量濃度が７０～８０ｗｔ％となるように構成されている。 In the present embodiment, each of the sealing members 23a, 23b, and 33 is formed to have a length of 24 mm, a line width of 1.6 mm, and a center maximum height of 0.7 mm, for example. . Further, the sealing members 23a, 23b and 33 in the present embodiment are configured such that the mass concentration of the silicone resin is 70 to 80 wt%.

　このように、本実施の形態では、ＬＥＤモジュール２０ａが複数のＬＥＤ２２ａの素子列及び複数のＬＥＤ２２ｂの素子列を有し、ＬＥＤモジュール２０ｂが複数のＬＥＤ３２の素子列を有する。これにより、電球形ランプ１は基板２１の両面から光を発するので、電球形ランプ１の前方及び後方から光が取り出され、白熱電球に近似した広い配光角を有する電球形ランプを実現することができる。 Thus, in this embodiment, the LED module 20a has an element array of a plurality of LEDs 22a and an element array of a plurality of LEDs 22b, and the LED module 20b has an element array of a plurality of LEDs 32. Thereby, since the light bulb shaped lamp 1 emits light from both surfaces of the substrate 21, light is extracted from the front and rear of the light bulb shaped lamp 1, and a light bulb shaped lamp having a wide light distribution angle similar to an incandescent light bulb is realized. Can do.

　また、本実施の形態において、ＬＥＤモジュール２０ａは基板２１の表面上に設けられたＬＥＤ２２ａの素子列を有し、ＬＥＤ２２ａは基板２１を挟んでＬＥＤ３２と対向するように配置されている。これにより、基板２１を透過して基板２１の表面から発せられるＬＥＤ３２の光は、ＬＥＤ３２と対向するＬＥＤ２２ａにより反射又は吸収されて遮光され、ＬＥＤモジュール２０ａの光として発せられない。同様に、基板２１を透過して基板２１の裏面から発せられるＬＥＤ２２ａの光は、ＬＥＤ２２ａと対向するＬＥＤ３２により反射又は吸収されて遮光され、ＬＥＤモジュール２０ｂの光として発せられない。したがって、ＬＥＤモジュール２０ａ及び２０ｂにより全方位に発せられる光について色ムラを抑制することができる。 Further, in the present embodiment, the LED module 20a has an element array of the LEDs 22a provided on the surface of the substrate 21, and the LEDs 22a are arranged so as to face the LEDs 32 with the substrate 21 interposed therebetween. Thereby, the light of LED32 which permeate | transmits the board | substrate 21 and is emitted from the surface of the board | substrate 21 is reflected or absorbed by LED22a facing LED32, and is light-shielded, and is not emitted as the light of LED module 20a. Similarly, the light of the LED 22a that is transmitted through the substrate 21 and is emitted from the back surface of the substrate 21 is reflected or absorbed by the LED 32 facing the LED 22a to be blocked, and is not emitted as light of the LED module 20b. Therefore, color unevenness can be suppressed for light emitted in all directions by the LED modules 20a and 20b.

　なお、封止部材２３ａ、２３ｂ及び３３は、複数のＬＥＤを一括封するのではなく、各ＬＥＤ２２ａ、２２ｂ及び３２を個別に覆うように形成してもよい。この場合、各封止部材２３ａ、２３ｂ及び３３は、略半球状に形成することができる。 Note that the sealing members 23a, 23b, and 33 may be formed so as to individually cover the LEDs 22a, 22b, and 32, instead of sealing a plurality of LEDs at once. In this case, each sealing member 23a, 23b, and 33 can be formed in a substantially hemispherical shape.

　［金属配線］
　金属配線２４ａ、２４ｂ、２６、３４及び３６は、ＬＥＤを発光するための電流が流れる導電性金属配線であって、導電部材の一例である。 [Metal wiring]
The metal wires 24a, 24b, 26, 34, and 36 are conductive metal wires through which a current for emitting light from the LED flows, and are examples of conductive members.

　金属配線２４ａ及び２４ｂは、基板２１の表面（第２の面）上に、所定形状にパターン形成される。 The metal wirings 24 a and 24 b are patterned in a predetermined shape on the surface (second surface) of the substrate 21.

　金属配線２４ａは、ＬＥＤ２２ａの素子列における複数のＬＥＤ２２ａ同士を電気的に直列接続するために複数形成されている。複数の金属配線２４ａの各々は、素子列内で隣り合うＬＥＤ２２ａの間に島状に形成されている。 A plurality of metal wirings 24a are formed to electrically connect a plurality of LEDs 22a in the element array of the LEDs 22a in series. Each of the plurality of metal wirings 24a is formed in an island shape between adjacent LEDs 22a in the element row.

　金属配線２４ｂは、ＬＥＤ２２ｂの素子列における複数のＬＥＤ２２ｂ同士を電気的に直列接続するために複数形成されている。複数の金属配線２４ｂの各々は、素子列内で隣り合うＬＥＤ２２ｂの間に島状に形成されている。 A plurality of metal wirings 24b are formed to electrically connect a plurality of LEDs 22b in the element row of the LEDs 22b in series. Each of the plurality of metal wirings 24b is formed in an island shape between adjacent LEDs 22b in the element row.

　金属配線３４は、基板２１の裏面（第１の面）上に、所定形状にパターン形成される。金属配線３４は、ＬＥＤ３２の素子列における複数のＬＥＤ３２同士を電気的に直列接続するために複数形成されている。複数の金属配線３４の各々は、素子列内で隣り合うＬＥＤ３２の間に島状に形成されている。 The metal wiring 34 is patterned in a predetermined shape on the back surface (first surface) of the substrate 21. A plurality of metal wirings 34 are formed in order to electrically connect a plurality of LEDs 32 in the element array of the LEDs 32 in series. Each of the plurality of metal wirings 34 is formed in an island shape between the LEDs 32 adjacent in the element row.

　金属配線２６は、ＬＥＤ２２ａ及び２２ｂの素子列と端子２８とを電気的に並列接続するために、基板２１の両端部に所定形状で２つ形成されている。これら２つの金属配線２６は、基板２１の表面において、複数のＬＥＤ２２ａ及び２２ｂの素子列を挟み込むように形成されている。 Two metal wirings 26 are formed in a predetermined shape at both ends of the substrate 21 in order to electrically connect the element rows of the LEDs 22a and 22b and the terminals 28 in parallel. These two metal wirings 26 are formed on the surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 22a and 22b.

　具体的に、金属配線２６は、素子列の並び方向に延設されているととともに、ＬＥＤ２２ａ及び２２ｂの素子列と隣り合う部分で素子列に向かって突出している。この金属配線２６の突出部は、最端に位置するＬＥＤ２２ａ及び２２ｂからのワイヤー２５ａ及び２５ｂとの接続箇所となる。 Specifically, the metal wiring 26 extends in the arrangement direction of the element rows, and protrudes toward the element row at a portion adjacent to the element rows of the LEDs 22a and 22b. The protruding portion of the metal wiring 26 becomes a connection portion with the wires 25a and 25b from the LEDs 22a and 22b located at the extreme ends.

　同様に、金属配線３６は、ＬＥＤ３２の素子列と端子３８とを電気的に並列接続するために、基板２１の両端部に所定形状で２つ形成されている。これら２つの金属配線３６は、基板２１の裏面において、複数のＬＥＤ３２の素子列を挟み込むように形成されている。 Similarly, two metal wirings 36 are formed in a predetermined shape at both ends of the substrate 21 in order to electrically connect the element array of the LED 32 and the terminal 38 in parallel. These two metal wirings 36 are formed on the back surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 32.

　具体的に、金属配線３６は、素子列の並び方向に延設されているととともに、ＬＥＤ３２の素子列と隣り合う部分で素子列に向かって突出している。この金属配線３６の突出部は、ＬＥＤ３２からのワイヤー３５との接続箇所となる。 Specifically, the metal wiring 36 extends in the arrangement direction of the element rows, and protrudes toward the element row at a portion adjacent to the element row of the LED 32. The protruding portion of the metal wiring 36 becomes a connection portion with the wire 35 from the LED 32.

　金属配線２４ａ、２４ｂ、２６、３４及び３６は同じ金属材料を用いて同時にパターン形成される。金属配線２４ａ、２４ｂ、２６、３４及び３６の金属材料としては、例えば、銀（Ａｇ）、タングステン（Ｗ）又は銅（Ｃｕ）等を用いることができる。なお、金属配線２４ａ、２４ｂ及び２６の表面に、ニッケル（Ｎｉ）／金（Ａｕ）等のメッキ処理を施しても構わない。なお、金属配線２４ａ、２４ｂ、２６、３４及び３６は、異なる金属材料により構成されていてもよいし、別々の工程で形成されてもよい。 The metal wirings 24a, 24b, 26, 34 and 36 are simultaneously patterned using the same metal material. As a metal material of the metal wirings 24a, 24b, 26, 34, and 36, for example, silver (Ag), tungsten (W), copper (Cu), or the like can be used. Note that the surface of the metal wirings 24a, 24b and 26 may be plated with nickel (Ni) / gold (Au) or the like. The metal wirings 24a, 24b, 26, 34, and 36 may be made of different metal materials or may be formed in separate steps.

　また、封止部材２３ａ、２３ｂ及び３３から露出する金属配線２６及び３６については、端子２８及び３８を除いて、ガラス材によるガラス膜（ガラスコート膜）又は樹脂材による樹脂膜（樹脂コート膜）によって被覆することが好ましい。これにより、ＬＥＤモジュール２０ａ及び２０ｂにおける絶縁性を向上させることができる。 Further, for the metal wirings 26 and 36 exposed from the sealing members 23a, 23b and 33, except for the terminals 28 and 38, a glass film made of a glass material (glass coat film) or a resin film made of a resin material (resin coat film). It is preferable to coat by. Thereby, the insulation in LED module 20a and 20b can be improved.

　［端子］
　端子２８及び３８は、ＬＥＤモジュール２０ａ及び２０ｂにおける接続端子であって、導電部材の一例である。 [Terminal]
The terminals 28 and 38 are connection terminals in the LED modules 20a and 20b, and are examples of conductive members.

　端子２８は、導電性接着部材２７が設けられる給電電極、例えば半田付けが行われる半田電極であり、貫通孔２１ｂと、貫通孔２１ｂの基板２１の表面側の開口を囲むように基板２１の表面に所定形状で形成された接続用ランドとから構成されている。端子２８は、２つの金属配線２６のそれぞれに対応して２つ形成されている。この一対の端子２８は、それぞれ対応する金属配線２６と一体化して形成され、対応する金属配線２６と接することで接続されている。このような対応する１組の金属配線２６及び端子２８により１つの配線パターンが構成されている。 The terminal 28 is a power supply electrode provided with the conductive adhesive member 27, for example, a solder electrode to be soldered, and the surface of the substrate 21 so as to surround the through hole 21b and the opening on the surface side of the substrate 21 of the through hole 21b. And a connection land formed in a predetermined shape. Two terminals 28 are formed corresponding to each of the two metal wirings 26. The pair of terminals 28 are formed integrally with the corresponding metal wiring 26 and are connected by being in contact with the corresponding metal wiring 26. One wiring pattern is constituted by such a corresponding set of metal wirings 26 and terminals 28.

　端子２８は、ＬＥＤモジュール２０ａの給電部であって、ＬＥＤ２２ａ及び２２ｂを発光させるために、ＬＥＤモジュール２０ａの外部から電力を受け、受けた電力を金属配線２４ａ、２４ｂ及び２６並びにワイヤー２５ａ及び２５ｂを介して各ＬＥＤ２２ａ及び２２ｂに供給する。 The terminal 28 is a power supply unit of the LED module 20a, and receives power from the outside of the LED module 20a in order to cause the LEDs 22a and 22b to emit light, and receives the received power through the metal wires 24a, 24b and 26 and the wires 25a and 25b. To the LEDs 22a and 22b.

　同様に、端子３８は、導電性接着部材３７が設けられる給電電極であり、貫通孔２１ｂと、貫通孔２１ｂの基板２１の裏面側の開口を囲むように基板２１の裏面に所定形状で形成された接続用ランドとから構成されている。端子３８は、２つの金属配線３６のそれぞれに対応して２つ形成されている。この一対の端子３８は、それぞれ対応する金属配線３６と一体化して形成され、対応する金属配線３６と接することで接続されている。このような対応する１組の金属配線３６及び端子３８により１つの配線パターンが構成されている。 Similarly, the terminal 38 is a power supply electrode on which the conductive adhesive member 37 is provided, and is formed in a predetermined shape on the back surface of the substrate 21 so as to surround the through hole 21b and the opening on the back surface side of the substrate 21 of the through hole 21b. And a connecting land. Two terminals 38 are formed corresponding to each of the two metal wirings 36. The pair of terminals 38 are formed integrally with the corresponding metal wiring 36 and are connected by being in contact with the corresponding metal wiring 36. One wiring pattern is constituted by such a corresponding set of metal wirings 36 and terminals 38.

　端子３８は、ＬＥＤモジュール２０ｂの給電部であって、ＬＥＤ３２を発光させるために、ＬＥＤモジュール２０ｂの外部から電力を受け、受けた電力を金属配線３４及び３６並びにワイヤー３５を介して各ＬＥＤ３２に供給する。 The terminal 38 is a power supply unit of the LED module 20b, and receives power from the outside of the LED module 20b in order to cause the LED 32 to emit light. To do.

　端子２８及び３８は、概略同心となるように配置されている。また、端子２８及び３８は、金属配線２４ａ、２４ｂ、２６、３４及び３６と同じ金属材料を用いて、これらの金属配線と同時にパターン形成される。 The terminals 28 and 38 are arranged so as to be substantially concentric. Also, the terminals 28 and 38 are patterned simultaneously with these metal wirings using the same metal material as the metal wirings 24a, 24b, 26, 34 and 36.

　［ワイヤー］
　ワイヤー２５ａ、２５ｂ及び３５は、ＬＥＤモジュール２０ａ及び２０ｂにおける導電性金属配線であって、導電部材の一例である。 [wire]
The wires 25a, 25b, and 35 are conductive metal wirings in the LED modules 20a and 20b, and are examples of conductive members.

　ワイヤー２５ａは、ＬＥＤ２２ａと金属配線２６、及び、ＬＥＤ２２ａと金属配線２４ａとを接続するための電線であり、例えば、金ワイヤーである。図５で説明したように、このワイヤー２５ａにより、ＬＥＤ２２ａの上面に設けられたワイヤーボンド部１２２ｅ及び１２２ｆのそれぞれとＬＥＤ２２ａの両側に隣接して形成された金属配線２４ａ又は金属配線２６とがワイヤボンディングされている。 The wire 25a is an electric wire for connecting the LED 22a and the metal wiring 26, and the LED 22a and the metal wiring 24a, and is, for example, a gold wire. As described with reference to FIG. 5, the wire 25a allows wire bonding between the wire bonding portions 122e and 122f provided on the upper surface of the LED 22a and the metal wiring 24a or the metal wiring 26 formed adjacent to both sides of the LED 22a. Has been.

　ワイヤー２５ｂは、ワイヤー２５ａと同様の構成であり、ＬＥＤ２２ｂと金属配線２６、及び、ＬＥＤ２２ｂと金属配線２４ｂとを接続するための電線であり、例えば、金ワイヤーである。 The wire 25b has the same configuration as the wire 25a, and is an electric wire for connecting the LED 22b and the metal wiring 26, and the LED 22b and the metal wiring 24b, and is, for example, a gold wire.

　ワイヤー３５は、ワイヤー２５ａと同様の構成であり、ＬＥＤ３２と金属配線３６、及び、ＬＥＤ３２と金属配線３４とを接続するための電線である。 The wire 35 has the same configuration as that of the wire 25a and is an electric wire for connecting the LED 32 and the metal wiring 36 and the LED 32 and the metal wiring 34.

　ワイヤー２５ａ、２５ｂ及び３５は、例えば、封止部材２３ａ、２３ｂ及び３３から露出しないように、全体が封止部材２３ａ、２３ｂ及び３５の中にそれぞれ埋め込まれる。 The wires 25a, 25b, and 35 are embedded in the sealing members 23a, 23b, and 35, respectively, so as not to be exposed from the sealing members 23a, 23b, and 33, for example.

　［導電性接着部材］
　導電性接着部材２７及び３７も、導電部材の一例である。 [Conductive adhesive member]
The conductive adhesive members 27 and 37 are also examples of conductive members.

　導電性接着部材２７は、端子２８をリード線７０と接続する半田又は銀ペースト等の導電性接着剤である。導電性接着部材２７は、端子２８の表面上でリード線７０の一端の側面を被覆するように、端子２８及びリード線７０の両方に接して設けられている。導電性接着部材２７は、貫通孔２１ｂの基板２１の表面側の開口を塞ぐように設けられている。 The conductive adhesive member 27 is a conductive adhesive such as solder or silver paste that connects the terminal 28 to the lead wire 70. The conductive adhesive member 27 is provided in contact with both the terminal 28 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 28. The conductive adhesive member 27 is provided so as to close the opening on the surface side of the substrate 21 of the through hole 21b.

　同様に、導電性接着部材３７は、端子３８をリード線７０と接続する導電性接着剤である。導電性接着部材３７は、端子３８の表面上でリード線７０の一端の側面を被覆するように、端子３８及びリード線７０の両方に接して設けられている。導電性接着部材３７は、貫通孔２１ｂの基板２１の裏面側の開口を塞ぐように設けられている。 Similarly, the conductive adhesive member 37 is a conductive adhesive that connects the terminal 38 to the lead wire 70. The conductive adhesive member 37 is provided in contact with both the terminal 38 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 38. The conductive adhesive member 37 is provided so as to close the opening on the back surface side of the substrate 21 of the through hole 21b.

　ここで、導電性接着部材２７は、絶縁性樹脂によって被覆されていてもよい。そして、この絶縁性樹脂が、ＬＥＤ２２ａ、２２ｂ及び３２から発せられる光に対して光透過率が低く例えば１０％以下の白色樹脂であってもよい。 Here, the conductive adhesive member 27 may be covered with an insulating resin. The insulating resin may be a white resin having a low light transmittance with respect to the light emitted from the LEDs 22a, 22b and 32, for example, 10% or less.

　図４のＬＥＤモジュール２０ａ及び２０ｂは、導電性接着部材２７及び３７を除く各部材を基板２１の表面及び裏面上に設けた後、導電性接着部材２７により２つのリード線７０と端子３８とを接続し、導電性接着部材３７により２つのリード線７０と端子２８とを接続することで形成される。このとき、リード線７０と端子３８との電気的な接続では、まず、リード線７０が貫通孔２１ｂの裏面側の開口から挿入されて貫通孔２１ｂの表面側の開口から突き出るように設けられる。その後、そのリード線７０の裏面側の部分と端子３８との両方に接するように導電性接着部材３７が設けられ、表面側の部分と端子２８との両方に接するように導電性接着部材２７が設けられる。したがって、リード線７０により端子２８と端子３８とが接続される。そして、同じリード線７０に端子２８及び３８が接続されて、基板２１表面の複数のＬＥＤ２２ａ及び２２ｂと、基板２１裏面の複数のＬＥＤ３２とはリード線７０に並列接続される。つまり、ＬＥＤモジュール２０ａとＬＥＤモジュール２０ｂとは、一対のリード線７０を介して電気的に並列接続される。 In the LED modules 20a and 20b in FIG. 4, after the members except the conductive adhesive members 27 and 37 are provided on the front surface and the back surface of the substrate 21, the two lead wires 70 and the terminals 38 are connected by the conductive adhesive member 27. It is formed by connecting and connecting the two lead wires 70 and the terminal 28 by the conductive adhesive member 37. At this time, in the electrical connection between the lead wire 70 and the terminal 38, first, the lead wire 70 is provided so as to be inserted from the opening on the back surface side of the through hole 21b and protrude from the opening on the front surface side of the through hole 21b. Thereafter, a conductive adhesive member 37 is provided so as to be in contact with both the rear surface side portion of the lead wire 70 and the terminal 38, and the conductive adhesive member 27 is provided so as to be in contact with both the front surface portion and the terminal 28. Provided. Therefore, the terminal 28 and the terminal 38 are connected by the lead wire 70. The terminals 28 and 38 are connected to the same lead wire 70, and the plurality of LEDs 22 a and 22 b on the front surface of the substrate 21 and the plurality of LEDs 32 on the back surface of the substrate 21 are connected in parallel to the lead wire 70. That is, the LED module 20 a and the LED module 20 b are electrically connected in parallel via the pair of lead wires 70.

　また、図４のＬＥＤモジュール２０ａでは、一方のプラス側のリード線７０に供給された電流は、導電性接着部材２７、端子２８、金属配線２６、ＬＥＤ２２ａ及び２２ｂ、金属配線２４ａ及び２４ｂ、並びに、ワイヤー２５ａ及び２５ｂを通過し、他方のマイナス側のリード線７０から出力される。同様に、ＬＥＤモジュール２０ｂでは、一方のプラス側のリード線７０に供給された電流は、導電性接着部材３７、端子３８、金属配線３６、ＬＥＤ３２、金属配線３４及びワイヤー３５を通過し、他方のマイナス側のリード線７０から出力される。 Further, in the LED module 20a of FIG. 4, the current supplied to the one lead wire 70 on the plus side includes the conductive adhesive member 27, the terminal 28, the metal wiring 26, the LEDs 22a and 22b, the metal wirings 24a and 24b, and It passes through the wires 25a and 25b and is output from the other negative lead wire 70. Similarly, in the LED module 20b, the current supplied to one plus-side lead wire 70 passes through the conductive adhesive member 37, the terminal 38, the metal wiring 36, the LED 32, the metal wiring 34, and the wire 35, and the other side. It is output from the negative lead wire 70.

　また、図４のＬＥＤモジュール２０ｂでは、基板２１の裏面と金属支柱４０の固定部４２の固定面とを接触させるため、基板２１の裏面の固定面と接する部分にはＬＥＤ３２及び封止部材３３等の各部材が設けられていない。したがって、基板２１の裏面において、複数のＬＥＤ３２の素子列は固定部４２を挟むように設けられており、素子列の間隔は金属支柱４０の固定部４２を挟む素子列で他の素子列の間隔より大きくなっている。 Further, in the LED module 20b of FIG. 4, the back surface of the substrate 21 and the fixed surface of the fixing portion 42 of the metal support column 40 are brought into contact with each other. These members are not provided. Therefore, on the back surface of the substrate 21, the element rows of the plurality of LEDs 32 are provided so as to sandwich the fixing portion 42, and the interval between the element rows is the element row sandwiching the fixing portion 42 of the metal column 40 and the interval between other element rows. It is getting bigger.

　なお、図４のＬＥＤモジュール２０ａ及び２０ｂでは、導電性接着部材２７及び３７は貫通孔２１ｂ内の空間を隔てて離れて設けられるとした。しかし、複数のＬＥＤ２２ａ、２２ｂ及び３２はリード線７０に対して並列接続されるため、導電性接着部材２７及び３７は接していても特に問題はない。したがって、導電性接着部材２７及び３７は別々の部材でなく、一体となって１つの接着部材として設けられていても構わない。つまり、１つの導電性部材が、端子２８及び３８並びにリード線７０と接するように、貫通孔２１ｂ内と、基板２１の表面上と、基板２１の裏面上とに連続して設けられてもよい。 In the LED modules 20a and 20b in FIG. 4, the conductive adhesive members 27 and 37 are provided apart from each other with a space in the through hole 21b. However, since the plurality of LEDs 22a, 22b and 32 are connected in parallel to the lead wire 70, there is no particular problem even if the conductive adhesive members 27 and 37 are in contact with each other. Therefore, the conductive adhesive members 27 and 37 may be provided as a single adhesive member instead of separate members. That is, one conductive member may be provided continuously in the through hole 21 b, on the surface of the substrate 21, and on the back surface of the substrate 21 so as to contact the terminals 28 and 38 and the lead wire 70. .

　また、図４のＬＥＤモジュール２０ａでは、リード線７０の先端が導電性接着部材２７の表面で露出するように設けられるとしたが、導電性接着部材２７により完全に被覆されていてもよい。この場合には、リード線７０と導電性接着部材２７との接触面積が増加するため、両者の接続を強固にすることができる。 Further, in the LED module 20 a of FIG. 4, the tip of the lead wire 70 is provided so as to be exposed on the surface of the conductive adhesive member 27, but it may be completely covered with the conductive adhesive member 27. In this case, since the contact area between the lead wire 70 and the conductive adhesive member 27 increases, the connection between the two can be strengthened.

　また、本実施の形態において、ＬＥＤモジュール２０ａ及び２０ｂへの給電は、単に、リード線７０を、貫通孔２１ｂを通して導電性接着部材２７及び３７により２つの端子２８及び３８の両方と接続することで実現される。したがって、端子２８及び３８のいずれかにリード線７０を接続し、ビアホール等により端子２８と端子３８とを接続する構成と比較して、端子２８と端子３８とを接続するビアホール等の構成が不要となる。また、端子２８及び３８に別々のリード線７０を接続する構成と比較してリード線７０の数を半分にすることができる。その結果、簡素な構造の電球形ランプ１を実現することができる。 In the present embodiment, the power supply to the LED modules 20a and 20b is simply performed by connecting the lead wire 70 to both of the two terminals 28 and 38 by the conductive adhesive members 27 and 37 through the through hole 21b. Realized. Therefore, compared to a configuration in which the lead wire 70 is connected to one of the terminals 28 and 38 and the terminal 28 and the terminal 38 are connected by a via hole or the like, a configuration such as a via hole or the like that connects the terminal 28 and the terminal 38 is unnecessary. It becomes. In addition, the number of lead wires 70 can be halved compared to a configuration in which separate lead wires 70 are connected to the terminals 28 and 38. As a result, the light bulb shaped lamp 1 having a simple structure can be realized.

　［電球形ランプ１の特徴構成］
　次に、本実施の形態に係る電球形ランプ１における特徴的な構成の一つについて、図６を用いて説明する。図６は、図４（ａ）のＥ－Ｅ’線における本発明の実施の形態に係る電球形ランプの要部拡大断面図である。 [Characteristic configuration of bulb-type lamp 1]
Next, one characteristic configuration of the light bulb shaped lamp 1 according to the present embodiment will be described with reference to FIG. FIG. 6 is an enlarged cross-sectional view of a main part of the light bulb shaped lamp according to the embodiment of the present invention taken along the line EE ′ of FIG.

　上述のように、ＬＥＤランプには所定の絶縁耐圧が要求されるが、ＬＥＤや金属配線が実装された基板を有するＬＥＤモジュールを金属支柱に固定する際、基板におけるＬＥＤや金属配線等の導電部材が形成された面を金属支柱に接触させると、所定の絶縁耐圧を確保することが難しい。 As described above, the LED lamp is required to have a predetermined withstand voltage, but when the LED module having the substrate on which the LED and the metal wiring are mounted is fixed to the metal column, the conductive member such as the LED or the metal wiring on the substrate. When the surface on which is formed is brought into contact with the metal column, it is difficult to ensure a predetermined withstand voltage.

　この場合、ＬＥＤや金属配線と金属支柱との間の空間距離を一定以上確保することができれば、所定の絶縁耐圧を確保することも可能ではある。しかしながら、グローブ１０内の限られたスペースではＬＥＤモジュール（基板）を大きくすることができず、ＬＥＤや金属配線と金属支柱との間の空間距離を十分に確保することが難しい。 In this case, if the space distance between the LED or the metal wiring and the metal support can be secured above a certain level, it is possible to ensure a predetermined withstand voltage. However, the LED module (substrate) cannot be enlarged in a limited space in the globe 10, and it is difficult to ensure a sufficient space distance between the LED and the metal wiring and the metal support.

　このような課題に対して、本発明者らが鋭意検討した結果、ＬＥＤモジュールにおける絶縁性の封止部材を利用することで所定の絶縁耐圧を確保することができるという知見を得ることができた。 As a result of intensive studies by the present inventors on such a problem, it was possible to obtain knowledge that a predetermined withstand voltage can be secured by using an insulating sealing member in the LED module. .

　すなわち、基板におけるＬＥＤや金属配線等の導電部材が形成された面（実装面）が金属支柱に接触された構成のランプにおいて、スペースが限られ上記空間距離が小さいような場合であっても、絶縁性の封止部材の厚さを所望の厚さに規定することで所定の絶縁耐圧を確保することができるという着想を得るに至った。 That is, in a lamp having a configuration in which a surface (mounting surface) on which a conductive member such as LED or metal wiring is formed on a substrate is in contact with a metal support, even when the space is limited and the space distance is small, It came to the idea that a predetermined withstand voltage can be ensured by regulating the thickness of the insulating sealing member to a desired thickness.

　本実施の形態では、図６に示すように、ＬＥＤモジュール２０ｂにおける基板２１の裏面（第１の面）に形成された封止部材３３を利用して所定の絶縁耐圧を確保しており、ＬＥＤモジュール２０ｂの導電部材のうち金属支柱４０からの位置が最短距離となっている導電部材から封止部材３３の表面までの厚さが所定の絶縁耐圧を満たす厚さとなるように構成されている。 In the present embodiment, as shown in FIG. 6, a predetermined dielectric strength is secured by using a sealing member 33 formed on the back surface (first surface) of the substrate 21 in the LED module 20b, Of the conductive members of the module 20b, the thickness from the conductive member having the shortest distance from the metal column 40 to the surface of the sealing member 33 is configured to satisfy a predetermined withstand voltage.

　図６では、金属支柱４０からの位置が最短距離となっている導電部材は金属配線３４であるので、金属配線３４から封止部材３３の表面までの厚さ（距離）Ｌが所定の絶縁耐圧を満たす厚さとなるように構成されている。この場合、金属支柱４０と金属配線３４との最短距離は、基板２１の裏面（第１の面）上における金属支柱４０と金属配線３４との距離である。つまり、金属支柱４０と金属配線３４との最短距離は、基板２１の裏面（第１の面）に沿った金属支柱４０から金属配線３４までの沿面距離（絶縁距離）である。 In FIG. 6, the conductive member having the shortest distance from the metal support column 40 is the metal wiring 34. Therefore, the thickness (distance) L from the metal wiring 34 to the surface of the sealing member 33 is a predetermined withstand voltage. It is comprised so that it may become the thickness which satisfy | fills. In this case, the shortest distance between the metal column 40 and the metal wiring 34 is the distance between the metal column 40 and the metal wiring 34 on the back surface (first surface) of the substrate 21. That is, the shortest distance between the metal column 40 and the metal wiring 34 is a creeping distance (insulating distance) from the metal column 40 to the metal wiring 34 along the back surface (first surface) of the substrate 21.

　より具体的には、封止部材３３がシリコーン樹脂である場合、シリコーン樹脂の絶縁破壊電圧（絶縁破壊強度）は、１０ｋＶ／ｍｍであるので、例えば１．５ｋＶの絶縁耐圧を満たそうとすると、金属配線３４から封止部材３３の表面までの当該封止部材３３の厚さＬは、０．１５ｍｍ以上とすることが好ましい。また、４．０ｋＶの絶縁耐圧を満たそうとすると、金属配線３４から封止部材３３の表面までの当該封止部材３３の厚さＬは、０．４０ｍｍ以上とすることが好ましい。なお、日本では、１．０～１．５ｋＶ以上の絶縁耐圧が要求され、米国では、４．０ｋＶ以上の絶縁耐圧が要求される。 More specifically, when the sealing member 33 is a silicone resin, since the dielectric breakdown voltage (dielectric breakdown strength) of the silicone resin is 10 kV / mm, for example, when trying to satisfy a dielectric breakdown voltage of 1.5 kV, The thickness L of the sealing member 33 from the metal wiring 34 to the surface of the sealing member 33 is preferably 0.15 mm or more. Moreover, when it is going to satisfy the withstand voltage of 4.0 kV, it is preferable that the thickness L of the said sealing member 33 from the metal wiring 34 to the surface of the sealing member 33 shall be 0.40 mm or more. In Japan, a withstand voltage of 1.0 to 1.5 kV or more is required, and in the United States, a withstand voltage of 4.0 kV or more is required.

　以上、本実施の形態に係る電球形ランプ１によれば、ＬＥＤモジュール２０ａ及び２０ｂの導電部材のうち金属支柱４０からの位置が最短距離となっている導電部材（例えば金属配線３４）から基板２１の裏面に形成された封止部材３３の表面までの当該封止部材３３の厚さが所定の絶縁耐圧を満たす厚さとなっている。これにより、ＬＥＤモジュール２０ａ及び２０ｂにおける当該導電部材と金属支柱４０との空間距離が小さくて当該導電部材と金属支柱４０との絶縁距離が十分に確保できないような場合であっても、封止部材３３が強化絶縁の役割を果たし、絶縁破壊を抑制することが可能となる。この結果、所定の絶縁耐圧を容易に確保できる電球形ランプを実現することができる。 As described above, according to the light bulb shaped lamp 1 according to the present embodiment, among the conductive members of the LED modules 20a and 20b, the substrate 21 is formed from the conductive member (for example, the metal wiring 34) whose position from the metal column 40 is the shortest distance. The thickness of the sealing member 33 up to the surface of the sealing member 33 formed on the back surface of the substrate is a thickness that satisfies a predetermined withstand voltage. As a result, even if the spatial distance between the conductive member and the metal column 40 in the LED modules 20a and 20b is small and the insulation distance between the conductive member and the metal column 40 cannot be sufficiently secured, the sealing member 33 plays the role of reinforced insulation, and it becomes possible to suppress dielectric breakdown. As a result, a light bulb shaped lamp that can easily ensure a predetermined withstand voltage can be realized.

　（変形例１）
　次に、本実施の形態の変形例１に係る電球形ランプについて、図７を用いて説明する。図７は、本発明の実施の形態の変形例１に係る電球形ランプの要部拡大断面図である。なお、図７は、図６に対応する図である。 (Modification 1)
Next, a light bulb shaped lamp according to the first modification of the present embodiment will be described with reference to FIG. FIG. 7 is an enlarged cross-sectional view of a main part of a light bulb shaped lamp according to Modification 1 of the embodiment of the present invention. FIG. 7 corresponds to FIG.

　上記の実施の形態における電球形ランプ１では、金属支柱４０の固定部４２の形状が基板２１に向かって幅の広がるテーパ形状であるとしたが、図７に示すように、金属支柱４０Ａの固定部４２Ａの形状が基板２１に向かって幅が一定の形状であっても構わない。 In the light bulb shaped lamp 1 in the above-described embodiment, the shape of the fixing portion 42 of the metal column 40 is a tapered shape whose width is widened toward the substrate 21. However, as shown in FIG. The shape of the portion 42 </ b> A may be a shape having a constant width toward the substrate 21.

　図７に示すような構成では、図６に示す構成と比べて、ＬＥＤモジュール２０ａ及び２０ｂにおける導電部材（例えば金属配線３４）と金属支柱４０との空間距離がさらに小さくなる。このような場合であっても、図７に示す封止部材３３の厚さＬを図６に示す封止部材３３の厚さＬと同じ以上とすることにより、所定の絶縁耐圧を確保することができる。 In the configuration as shown in FIG. 7, the spatial distance between the conductive member (for example, the metal wiring 34) and the metal column 40 in the LED modules 20 a and 20 b is further reduced as compared with the configuration shown in FIG. 6. Even in such a case, a predetermined withstand voltage can be ensured by making the thickness L of the sealing member 33 shown in FIG. 7 equal to or greater than the thickness L of the sealing member 33 shown in FIG. Can do.

　（変形例２）
　次に、本実施の形態の変形例２に係る電球形ランプについて、図８を用いて説明する。図８は、本発明の実施の形態の変形例２に係る電球形ランプの要部拡大断面図である。なお、図８も、図６に対応する図である。 (Modification 2)
Next, a light bulb shaped lamp according to Modification 2 of the present embodiment will be described with reference to FIG. FIG. 8 is an enlarged cross-sectional view of a main part of a light bulb shaped lamp according to a second modification of the embodiment of the present invention. FIG. 8 also corresponds to FIG.

　上記の実施の形態における電球形ランプ１では、図６に示すように、ＬＥＤ３２及び金属配線３４が、その中心が封止部材３３の中心（ライン軸）に一致するように構成されており、封止部材３３におけるライン軸に垂直な方向の厚さは両側で同じであった。 In the light bulb shaped lamp 1 in the above embodiment, as shown in FIG. 6, the LED 32 and the metal wiring 34 are configured such that the centers thereof coincide with the center (line axis) of the sealing member 33. The thickness of the stop member 33 in the direction perpendicular to the line axis was the same on both sides.

　これに対して、本変形例では、図８に示すように、ＬＥＤ３２及び金属配線３４の中心が封止部材３３の中心（ライン軸）と一致しない（ズレる）ように構成されており、封止部材３３におけるライン軸に垂直な方向の厚さは両側で異なっている。すなわち、図８に示すように、一方側における金属配線３４から封止部材３３の表面までの当該封止部材３３の厚さＬ１と、他方側における金属配線３４から封止部材３３の表面までの当該封止部材３３の厚さＬ２とが異なっており、本変形例では、金属支柱４０に近い側における封止部材３３の厚さＬ１が金属支柱４０に遠い側における封止部材３３の厚さＬ２よりも大きくなっている（Ｌ１＞Ｌ２）。 On the other hand, in this modified example, as shown in FIG. 8, the center of the LED 32 and the metal wiring 34 is configured not to be aligned with the center (line axis) of the sealing member 33. The thickness of the member 33 in the direction perpendicular to the line axis is different on both sides. That is, as shown in FIG. 8, the thickness L1 of the sealing member 33 from the metal wiring 34 on one side to the surface of the sealing member 33, and the thickness L1 from the metal wiring 34 on the other side to the surface of the sealing member 33. The thickness L2 of the sealing member 33 is different. In this modification, the thickness L1 of the sealing member 33 on the side close to the metal column 40 is the thickness of the sealing member 33 on the side far from the metal column 40. It is larger than L2 (L1> L2).

　このような場合であっても、図８に示す封止部材３３の厚さＬ１を図６に示す封止部材３３の厚さＬと同じ以上とすることにより、所定の絶縁耐圧を確保することができる。 Even in such a case, a predetermined withstand voltage can be ensured by setting the thickness L1 of the sealing member 33 shown in FIG. 8 to be equal to or larger than the thickness L of the sealing member 33 shown in FIG. Can do.

　なお、Ｌ１＜Ｌ２の場合であっても、封止部材３３の厚さＬ２を図６に示す封止部材３３の厚さＬと同じ以上とすることにより、所定の絶縁耐圧を確保することができる。 Even in the case of L1 <L2, the predetermined dielectric strength can be ensured by setting the thickness L2 of the sealing member 33 to be equal to or greater than the thickness L of the sealing member 33 shown in FIG. it can.

　（変形例３）
　次に、本実施の形態の変形例３に係る電球形ランプについて説明する。 (Modification 3)
Next, a light bulb shaped lamp according to Modification 3 of the present embodiment will be described.

　上記の実施の形態の電球形ランプ１は、１つの基板２１の表面及び裏面の両面に光源及びこれを発光させる配線を設けることで、２つのＬＥＤモジュール２０ａ及び２０ｂを構成し、電球形ランプ１のグローブ側と口金側とに光を取り出した。これに対し、本変形例では、２つの別々の基板の表面に個別に発光素子及びこれを発光させる配線を設け、２つの基板の裏面を貼り合わせて１つの基板２１としている。この構成によっても、電球形ランプ１のグローブ側と口金側とに光を取り出すことができる。したがって、本変形例に係る電球形ランプ１は、ＬＥＤモジュールの基板２１がそれぞれ表面に発光素子及びこれを発光させる配線を備える２つの基板を接着剤で接着して構成される点で上記の実施の形態の電球形ランプ１と異なる。以下、上記の実施の形態の電球形ランプ１と異なる点を中心に詳述する。 The light bulb shaped lamp 1 of the above-described embodiment forms two LED modules 20a and 20b by providing a light source and wiring for emitting light on both the front surface and the back surface of one substrate 21, and the light bulb shaped lamp 1 The light was extracted to the globe side and the base side. On the other hand, in this modification, a light emitting element and wiring for emitting light are individually provided on the surfaces of two separate substrates, and the back surfaces of the two substrates are bonded to form one substrate 21. Also with this configuration, light can be extracted to the globe side and the base side of the light bulb shaped lamp 1. Therefore, the light bulb shaped lamp 1 according to this modification is the above-described implementation in that the substrate 21 of the LED module is configured by bonding two substrates each having a light emitting element and a wiring for emitting light on the surface thereof with an adhesive. It differs from the light bulb shaped lamp 1 of the form. Hereinafter, the difference from the light bulb shaped lamp 1 of the above-described embodiment will be described in detail.

　図９の（ａ）は本変形例に係る電球形ランプにおいてグローブを除いた状態でＬＥＤモジュールを上方から見たときの平面図である。図９の（ｂ）は（ａ）のＡ－Ａ’線に沿って切断した同電球形ランプの断面図であり、図９の（ｃ）は（ａ）のＢ－Ｂ’線に沿って切断した同電球形ランプの断面図であり、図９の（ｄ）は（ａ）のＣ－Ｃ’線に沿って切断した同電球形ランプの断面図であり、図９の（ｅ）は（ａ）のＤ－Ｄ’線に沿って切断した同電球形ランプの断面図である。なお、図９は、図４に対応する図である。 (A) of FIG. 9 is a plan view when the LED module is viewed from above with the globe removed from the light bulb shaped lamp according to this modification. 9B is a cross-sectional view of the same light bulb shaped lamp cut along the line AA ′ in FIG. 9A, and FIG. 9C is a cross section taken along the line BB ′ in FIG. FIG. 9D is a cross-sectional view of the same light bulb shaped lamp, and FIG. 9D is a cross sectional view of the light bulb shaped lamp cut along the line CC ′ in FIG. 9A, and FIG. It is sectional drawing of the same lightbulb-shaped lamp cut | disconnected along DD 'line of (a). FIG. 9 corresponds to FIG.

　本変形例におけるＬＥＤモジュール１２０ａは、主として前方及び側方に向けて光を放出する主発光モジュール（第１発光モジュール）であり、ベアチップが直接基板２９の表面上に実装されたＣＯＢ構造である。 The LED module 120a in this modification is a main light emitting module (first light emitting module) that emits light mainly toward the front and sides, and has a COB structure in which a bare chip is directly mounted on the surface of the substrate 29.

　一方、本変形例におけるＬＥＤモジュール１２０ｂは、主として後方及び側方に向けて光を放出する副発光モジュール（第２発光モジュール）であり、ベアチップが直接基板３９の表面上に実装されたＣＯＢ構造である。 On the other hand, the LED module 120b in this modification is a secondary light emitting module (second light emitting module) that emits light mainly toward the rear and side, and has a COB structure in which a bare chip is directly mounted on the surface of the substrate 39. is there.

　ＬＥＤモジュール１２０ａは、主基板の一例である基板２９（第２基板）と、基板２９の表面（第２の面）上に設けられた複数のＬＥＤ２２ａ及び２２ｂ（第２発光素子）、封止部材２３ａ及び２３ｂ（第２封止部材）、金属配線２４ａ、２４ｂ及び２６（第２金属配線）、ワイヤー２５ａ及び２５ｂ（第２ワイヤー）、導電性接着部材２７（第２導電性接着部材）並びに端子２８（第２端子）とを備えている。 The LED module 120a includes a substrate 29 (second substrate) which is an example of a main substrate, a plurality of LEDs 22a and 22b (second light emitting elements) provided on the surface (second surface) of the substrate 29, and a sealing member. 23a and 23b (second sealing member), metal wiring 24a, 24b and 26 (second metal wiring), wires 25a and 25b (second wire), conductive adhesive member 27 (second conductive adhesive member) and terminals 28 (second terminal).

　一方、ＬＥＤモジュール１２０ｂは、副基板の一例である基板３９（第１基板）と、基板３９の表面（第１の面）上に設けられた複数のＬＥＤ３２（第１発光素子）、封止部材３３（第１封止部材）、金属配線３４及び３６（第１金属配線）、ワイヤー３５（第１ワイヤー）、導電性接着部材３７（第１導電性接着部材）並びに端子３８（第１端子）とを備えている。 On the other hand, the LED module 120b includes a substrate 39 (first substrate) which is an example of a sub-substrate, a plurality of LEDs 32 (first light emitting elements) provided on the surface (first surface) of the substrate 39, and a sealing member. 33 (first sealing member), metal wirings 34 and 36 (first metal wiring), wire 35 (first wire), conductive adhesive member 37 (first conductive adhesive member) and terminal 38 (first terminal) And.

　［基板］
　基板２９及び３９は、互いに同様の構成及び形状を有し、接着剤９０により互いの裏面が接着されて１つの基板２１を構成している。基板２９及び３９は、透光性基板又は非透光性基板を用いることができ、例えばアルミナ又は窒化アルミニウム等からなるセラミック基板、樹脂基板、ガラス基板、フレキシブル基板、又は樹脂被膜された金属基板（メタルベース基板）等である。基板２９はＬＥＤ２２ａ及び２２ｂを実装するための矩形状の実装基板であり、基板３９はＬＥＤ３２を実装するための矩形状の実装基板である。 [substrate]
The substrates 29 and 39 have the same configuration and shape as each other, and the back surfaces of the substrates 29 and 39 are bonded together by an adhesive 90 to form one substrate 21. For the substrates 29 and 39, a translucent substrate or a non-translucent substrate can be used. For example, a ceramic substrate made of alumina or aluminum nitride, a resin substrate, a glass substrate, a flexible substrate, or a resin-coated metal substrate ( Metal base substrate). The substrate 29 is a rectangular mounting substrate for mounting the LEDs 22a and 22b, and the substrate 39 is a rectangular mounting substrate for mounting the LEDs 32.

　基板２９及び３９は、ＬＥＤ２２ａ、２２ｂ及び３２から発せられる光に対して光透過率が低く例えば１０％以下の白色アルミナ基板等の白色基板で構成されることが好ましい。例えば、基板２９及び３９は、ＬＥＤ２２ａ、２２ｂ及び３２から発せられる光に対して光反射率５０％以上を有し、Ａｌ2Ｏ3、ＭｇＯ、ＳｉＯ、及びＴｉＯ2のいずれかを主成分とする基板で構成することができる。これにより、基板２１としての光透過率を低くしてＬＥＤモジュール１２０ａ及び１２０ｂから発せられる光の色ムラを抑制することができる。また、基板２９及び３９に低コストの白色基板を用いて電球形ランプを低コスト化することができる。 The substrates 29 and 39 are preferably made of a white substrate such as a white alumina substrate having a low light transmittance with respect to the light emitted from the LEDs 22a, 22b and 32, for example, 10% or less. For example, the substrate 29 and 39, LED 22a, having 50% or more reflectivity with respect to light emitted from 22b and 32, the main component Al 2 O 3, MgO, SiO , and one of TiO 2 It can be composed of a substrate. Thereby, the light transmittance as the board | substrate 21 can be made low, and the color nonuniformity of the light emitted from LED module 120a and 120b can be suppressed. Moreover, the low cost white board | substrate can be used for the board | substrates 29 and 39, and a bulb-type lamp can be reduced in cost.

　基板２９の長辺方向の両端部には基板２９を貫通する２つの貫通孔２９ｂが設けられており、基板３９の長辺方向の両端部にも基板３９を貫通する２つの貫通孔３９ｂが設けられている。貫通孔２９ｂは、給電用のリード線７０とＬＥＤモジュール１２０ａとを接続するための端子２８を構成し、貫通孔３９ｂは、給電用のリード線７０とＬＥＤモジュール１２０ｂとを接続するための端子３８を構成している。貫通孔２９ｂ及び３９ｂは、連続するように配置されて基板２１の貫通孔２１ｂを構成している。したがって、１つのリード線７０は、連続する１つの貫通孔２９ｂ及び３９ｂを挿通している。 Two through holes 29b penetrating the substrate 29 are provided at both end portions in the long side direction of the substrate 29, and two through holes 39b penetrating the substrate 39 are also provided at both end portions in the long side direction of the substrate 39. It has been. The through hole 29b constitutes a terminal 28 for connecting the lead wire 70 for power feeding and the LED module 120a, and the through hole 39b is a terminal 38 for connecting the lead wire 70 for power feeding and the LED module 120b. Is configured. The through holes 29 b and 39 b are arranged so as to be continuous to form the through hole 21 b of the substrate 21. Therefore, one lead wire 70 is inserted through one continuous through hole 29b and 39b.

　基板２９の中央部には基板２９を貫通する１つの貫通孔２９ａが設けられており、基板３９の中央部にも基板３９を貫通する１つの貫通孔３９ａが設けられている。貫通孔２９ａ及び３９ａは、ＬＥＤモジュール１２０ａ及び１２０ｂを金属支柱４０に固定するためのものであり、連続するように配置されて基板２１の１つの貫通孔２１ａを構成している。したがって、金属支柱４０の突起部４２ｂは、連続する貫通孔２９ａ及び３９ａと嵌合される。貫通孔２１ａ及び突起部４２ｂは、上述のように、基板２１の位置や向きを決定するための位置規制部として機能する。 One through hole 29 a that penetrates the substrate 29 is provided in the central part of the substrate 29, and one through hole 39 a that penetrates the substrate 39 is also provided in the central part of the substrate 39. The through holes 29 a and 39 a are for fixing the LED modules 120 a and 120 b to the metal support column 40, and are arranged so as to form one through hole 21 a of the substrate 21. Therefore, the protrusion 42b of the metal support column 40 is fitted into the continuous through holes 29a and 39a. The through hole 21a and the protrusion 42b function as a position restricting portion for determining the position and orientation of the substrate 21 as described above.

　［接着剤］
　接着剤９０は、基板２９の裏面と基板３９の裏面との間に設けられ、両者を接着するものであり、例えばシリコーン樹脂等の樹脂又はＡｇペースト等の金属ペースト等により構成されている。金属ペーストの場合、基板２９と基板３９との間での熱伝導率を高めて基板２１としての熱伝導率が高められるので、基板２１の放熱効率を高めることができる。その結果、温度上昇によるＬＥＤ２２ａ、２２ｂ及び３２の発光効率及び寿命の低下を抑制することができる。また、接着剤９０の遮光性つまり基板２１の遮光性を高めることができるので、基板２９及び３９の表面から裏面に向かう光による色ムラも抑制することができる。 [adhesive]
The adhesive 90 is provided between the back surface of the substrate 29 and the back surface of the substrate 39 and adheres both, and is made of, for example, a resin such as a silicone resin or a metal paste such as an Ag paste. In the case of the metal paste, the thermal conductivity between the substrate 29 and the substrate 39 is increased and the thermal conductivity as the substrate 21 is increased, so that the heat dissipation efficiency of the substrate 21 can be increased. As a result, it is possible to suppress a decrease in luminous efficiency and lifetime of the LEDs 22a, 22b, and 32 due to a temperature rise. In addition, since the light shielding property of the adhesive 90, that is, the light shielding property of the substrate 21 can be improved, color unevenness due to light traveling from the front surface to the back surface of the substrates 29 and 39 can also be suppressed.

　接着剤９０は、リード線７０が貫通孔２９ｂ及び３９ｂを挿通することを邪魔しないように、基板２９の裏面と基板３９の裏面との間における貫通孔２９ｂ及び３９ｂの間の空間の少なくとも一部には設けられていない。また、接着剤９０は、貫通孔２９ａ及び３９ａと金属支柱４０の突起部とが嵌合することを邪魔しないように、基板２９の裏面と基板３９の裏面との間における貫通孔２９ａ及び３９ａの間の空間の全てにおいても設けられていない。 The adhesive 90 prevents at least a part of the space between the through holes 29b and 39b between the back surface of the substrate 29 and the back surface of the substrate 39 so that the lead wire 70 does not interfere with the insertion of the through holes 29b and 39b. Is not provided. In addition, the adhesive 90 prevents the through holes 29a and 39a between the back surface of the substrate 29 and the back surface of the substrate 39 from interfering with the fitting of the through holes 29a and 39a and the protrusions of the metal support column 40. It is not provided in all the spaces between.

　図９に示すＬＥＤモジュール１２０ａ及び１２０ｂの製造では、まず、複数のＬＥＤ２２ａ及び２２ｂ、封止部材２３ａ及び２３ｂ、金属配線２４ａ、２４ｂ及び２６、ワイヤー２５ａ及び２５ｂ並びに端子２８が基板２９の表面の上に設けられる。同様に、複数のＬＥＤ３２、封止部材３３、金属配線３４及び３６、ワイヤー３５並びに端子３８が基板３９の表面の上に設けられる。その後、基板２９及び３９が接着剤９０により接着された後、導電性接着部材２７により２つのリード線７０と端子２８とが接続され、導電性接着部材３７により２つのリード線７０と端子３８とが接続される。したがって、１つの基板２９の表面及び裏面の両面に光源及びこれを発光させる配線を設ける場合と比較して、ＬＥＤモジュール１２０ａ及び１２０ｂの製造を容易にすることができる。 In the manufacture of the LED modules 120a and 120b shown in FIG. 9, first, a plurality of LEDs 22a and 22b, sealing members 23a and 23b, metal wirings 24a, 24b and 26, wires 25a and 25b, and terminals 28 are on the surface of the substrate 29. Provided. Similarly, a plurality of LEDs 32, a sealing member 33, metal wirings 34 and 36, wires 35 and terminals 38 are provided on the surface of the substrate 39. Then, after the substrates 29 and 39 are bonded by the adhesive 90, the two lead wires 70 and the terminal 28 are connected by the conductive adhesive member 27, and the two lead wires 70 and the terminal 38 are connected by the conductive adhesive member 37. Is connected. Therefore, the LED modules 120a and 120b can be easily manufactured as compared with the case where a light source and wiring for emitting light are provided on both the front and back surfaces of one substrate 29.

　以上、本変形例に係る電球形ランプによれば、上記の実施の形態に係る電球形ランプ１と同様に、ＬＥＤモジュール１２０ａ及び１２０ｂの導電部材のうち金属支柱４０からの位置が最短距離となっている導電部材（本変形例でも金属配線３４）から封止部材３３の表面までの厚さが所定の絶縁耐圧を満たす厚さとなるように構成されている。これにより、上記の実施の形態と同様に、所定の絶縁耐圧を容易に確保できる電球形ランプを実現することができる。 As described above, according to the light bulb shaped lamp according to the present modification, the position from the metal column 40 among the conductive members of the LED modules 120a and 120b is the shortest distance as in the light bulb shaped lamp 1 according to the above embodiment. The thickness from the conductive member (the metal wiring 34 in this modification) to the surface of the sealing member 33 is configured to satisfy a predetermined withstand voltage. Thereby, similarly to the above-described embodiment, it is possible to realize a light bulb shaped lamp that can easily ensure a predetermined withstand voltage.

　また、本変形例によれば、上記の実施の形態における電球形ランプ１と同様に、広い配光角を有し、ＬＥＤの寿命の低下を抑制することが可能な電球形ランプを実現することができる。 Moreover, according to this modification, similarly to the light bulb shaped lamp 1 in the above embodiment, a light bulb shaped lamp having a wide light distribution angle and capable of suppressing a decrease in the life of the LED is realized. Can do.

　さらに、本変形例では、基板２１が、ＬＥＤ２２ａ及び２２ｂの素子列が表面に設けられた基板２９と、ＬＥＤ３２の素子列が表面に設けられた基板３９とから構成される。そして、基板２９及び３９が、ＬＥＤ２２ａ及び２２ｂの素子列並びにＬＥＤ３２の素子列を設けていない裏面同士が互いに対向するように配置されている。このとき、ＬＥＤモジュール１２０ｂが、金属支柱４０に対し接着固定されていてもよい。これにより、別々の基板２９及び３９を用意して、それぞれの表面に個別に各部材を設けた後、それらを接着するだけでＬＥＤモジュール１２０ａ及び１２０ｂを製造できるので、ＬＥＤモジュール１２０ａ及び１２０ｂの製造を容易にすることができる。その結果、製造が容易な電球形ランプ１を実現することができる。 Furthermore, in this modification, the substrate 21 is composed of a substrate 29 provided with element rows of LEDs 22a and 22b on the surface and a substrate 39 provided with element rows of LEDs 32 on the surface. The substrates 29 and 39 are arranged so that the back surfaces of the LED 22a and 22b and the LED 32 are not provided with the back surfaces thereof. At this time, the LED module 120b may be bonded and fixed to the metal support column 40. As a result, the LED modules 120a and 120b can be manufactured simply by preparing the separate substrates 29 and 39 and individually providing the respective members on the respective surfaces, and then bonding them, so that the LED modules 120a and 120b can be manufactured. Can be made easier. As a result, the light bulb shaped lamp 1 that is easy to manufacture can be realized.

　さらに、本変形例では、ＬＥＤモジュール１２０ｂが、金属支柱４０に直接的に取り付けられ、ＬＥＤモジュール１２０ｂで発生した熱を金属支柱４０に伝熱する。そして、ＬＥＤモジュール１２０ａが、ＬＥＤモジュール１２０ｂを介して金属支柱４０に間接的に取り付けられ、ＬＥＤモジュール１２０ａで発生した熱を、ＬＥＤモジュール１２０ｂを介して金属支柱４０に間接的に伝熱する。そして、ＬＥＤモジュール１２０ａ及び１２０ｂの間に、熱伝導部材としての接着剤９０が設けられている。この接着剤９０は、熱伝導性樹脂、セラミックペースト、及び金属ペーストのいずれかである。これにより、基板２１の放熱効率及び遮光性を高めることができるので、ＬＥＤ２２ａ、２２ｂ及び３２の発光効率及び寿命の低下をさらに抑制し、同時にＬＥＤモジュール１２０ａ及び１２０ｂが発する光の色ムラをさらに抑制することができる。 Furthermore, in this modification, the LED module 120b is directly attached to the metal support column 40, and heat generated by the LED module 120b is transferred to the metal support column 40. Then, the LED module 120a is indirectly attached to the metal support column 40 via the LED module 120b, and the heat generated by the LED module 120a is indirectly transferred to the metal support column 40 via the LED module 120b. An adhesive 90 as a heat conducting member is provided between the LED modules 120a and 120b. The adhesive 90 is any one of a heat conductive resin, a ceramic paste, and a metal paste. As a result, the heat dissipation efficiency and light shielding performance of the substrate 21 can be improved, so that the light emission efficiency and lifetime of the LEDs 22a, 22b and 32 are further suppressed, and at the same time, the color unevenness of the light emitted from the LED modules 120a and 120b is further suppressed. can do.

　なお、本変形例において、金属支柱４０が基板３９の貫通孔３９ｂを突き抜けて基板２９の裏面と接していてもよい。つまり、貫通孔３９ｂが金属支柱４０の固定部４２の全体と嵌合するように形成され、金属支柱４０の固定部４２の固定面と基板２９の裏面とが接着剤９０により接着されてもよい。これにより、ＬＥＤモジュール１２０ａ及び１２０ｂの金属支柱４０への固定が容易になり、製造が容易な電球形ランプを実現することができる。また、ＬＥＤモジュール１２０ａを金属支柱４０に対し接着固定して基板２９から金属支柱４０への放熱経路を短くし、また基板３９の貫通孔３９ｂの内壁と金属支柱４０の固定部４２とをグリース等の熱伝導部材を介して接触させて基板３９から金属支柱４０への放熱経路を広くできる。その結果、ＬＥＤ２２ａ、２２ｂ及び３２の発光効率の低下及び寿命の低下をさらに抑制することができる。 In this modified example, the metal support column 40 may penetrate the through hole 39 b of the substrate 39 and contact the back surface of the substrate 29. That is, the through-hole 39b may be formed so as to be fitted to the entire fixing portion 42 of the metal column 40, and the fixing surface of the fixing portion 42 of the metal column 40 and the back surface of the substrate 29 may be bonded by the adhesive 90. . Thereby, fixation to the metal support | pillar 40 of LED module 120a and 120b becomes easy, and it can implement | achieve a light bulb shaped lamp with easy manufacture. Further, the LED module 120a is bonded and fixed to the metal column 40 to shorten the heat radiation path from the substrate 29 to the metal column 40, and the inner wall of the through hole 39b of the substrate 39 and the fixing portion 42 of the metal column 40 are greased or the like. The heat dissipation path from the substrate 39 to the metal column 40 can be widened by contacting through the heat conducting member. As a result, it is possible to further suppress the decrease in luminous efficiency and the lifetime of the LEDs 22a, 22b and 32.

　（その他）
　以上、本発明に係る電球形ランプについて、実施の形態及びその変形例に基づいて説明したが、本発明は、これらの実施の形態及び変形例に限定されるものではない。 (Other)
Although the light bulb shaped lamp according to the present invention has been described based on the embodiments and the modifications thereof, the present invention is not limited to these embodiments and modifications.

　また、上記の実施の形態及び変形例において、ＬＥＤモジュール２０ａ及び２０ｂは、青色ＬＥＤと黄色蛍光体とによって白色光を放出するように構成したが、これに限らない。例えば、赤色蛍光体及び緑色蛍光体を含有する蛍光体含有樹脂を用いて、これと青色ＬＥＤと組み合わせることによりに白色光を放出するように構成しても構わない。 Further, in the above-described embodiments and modifications, the LED modules 20a and 20b are configured to emit white light by the blue LED and the yellow phosphor, but are not limited thereto. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used so that white light is emitted by combining this with a blue LED.

　また、ＬＥＤ２２ａ、２２ｂ及び３２は、青色以外の色を発光するＬＥＤを用いても構わない。例えば、ＬＥＤ２２ａ、２２ｂ及び３２として紫外線発光のＬＥＤチップを用いる場合、蛍光体粒子としては、三原色（赤色、緑色、青色）に発光する各色蛍光体粒子を組み合わせたものを用いることができる。さらに、蛍光体粒子以外の波長変換材を用いてもよく、例えば、波長変換材として、半導体、金属錯体、有機染料、顔料など、ある波長の光を吸収し、吸収した光とは異なる波長の光を発する物質を含んでいる材料を用いてもよい。 The LEDs 22a, 22b, and 32 may be LEDs that emit light other than blue. For example, when an LED chip that emits ultraviolet light is used as the LEDs 22a, 22b, and 32, the phosphor particles may be a combination of phosphor particles that emit light in three primary colors (red, green, and blue). Furthermore, a wavelength conversion material other than the phosphor particles may be used. For example, the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light. A material containing a substance that emits light may be used.

　また、上記の実施の形態及び変形例において、封止部材２３ａ、２２ｂ及び３３は、ＬＥＤの素子列に沿って直線状に形成したが、ＬＥＤの素子列を全て覆うように円形状に形成しても構わない。 Further, in the above-described embodiments and modifications, the sealing members 23a, 22b, and 33 are formed linearly along the LED element rows, but are formed in a circular shape so as to cover all the LED element rows. It doesn't matter.

　また、上記の実施の形態及び変形例において、発光素子としてＬＥＤを例示したが、半導体レーザ等の半導体発光素子、有機ＥＬ（Ｅｌｅｃｔｒｏ　Ｌｕｍｉｎｅｓｃｅｎｃｅ）や無機ＥＬ等のＥＬ素子、その他の固体発光素子を用いてもよい。 In the above embodiments and modifications, the LED is exemplified as the light emitting element. However, a semiconductor light emitting element such as a semiconductor laser, an EL element such as an organic EL (Electro Luminescence) or an inorganic EL, and other solid light emitting elements are used. May be.

　また、上記の実施の形態及び変形例において、ＬＥＤモジュールは基板上にＬＥＤチップを直接実装したＣＯＢ型の構成としたが、これに限らない。例えば、樹脂成型された容器のキャビティ（凹部）の中にＬＥＤチップを実装して当該キャビティ内に蛍光体含有樹脂を封入したパッケージ型のＬＥＤ素子を用いて、このＬＥＤ素子を金属配線が形成された基板上に複数個実装することで構成された表面実装型（ＳＭＤ：Ｓｕｒｆａｃｅ　Ｍｏｕｎｔ　Ｄｅｖｉｃｅ）のＬＥＤモジュールを用いても構わない。 Further, in the above-described embodiments and modifications, the LED module has a COB type configuration in which the LED chip is directly mounted on the substrate, but is not limited thereto. For example, using a package type LED element in which an LED chip is mounted in a cavity (concave portion) of a resin-molded container and a phosphor-containing resin is enclosed in the cavity, a metal wiring is formed on the LED element. Alternatively, a surface mount device (SMD: Surface Mount Device) LED module configured by mounting a plurality on a substrate may be used.

　また、上記の実施の形態及び変形例において、基板２１の表面及び裏面のそれぞれにＬＥＤの素子列が設けたが、基板２１の裏面にのみＬＥＤの素子列を設けても構わない。この場合、ＬＥＤモジュールは、基板２１と、基板２１の裏面（金属支柱４０側の面である第１の面）にのみ設けられた複数のＬＥＤ（第１発光素子）と、前記第１の面に形成された金属配線と、複数のＬＥＤ（第１発光素子）及び金属配線を封止する絶縁性の封止部材とを有する構成となる。 In the above-described embodiments and modifications, LED element arrays are provided on the front surface and the back surface of the substrate 21 respectively. However, LED element arrays may be provided only on the back surface of the substrate 21. In this case, the LED module includes the substrate 21, a plurality of LEDs (first light emitting elements) provided only on the back surface of the substrate 21 (the first surface that is the surface on the metal column 40 side), and the first surface. And a plurality of LEDs (first light-emitting elements) and an insulating sealing member that seals the metal wiring.

　また、上記の実施の形態及び変形例において、基板の表面及び裏面のＬＥＤの素子列でＬＥＤの並び方向は平行であり、この並び方向と交差、例えば直交し、基板の面内に含まれる所定の方向の一例として基板の短辺方向を示したが、所定の方向は短辺方向に限られない。 Further, in the above-described embodiment and modification, the LED arrangement direction is parallel in the LED element arrays on the front and back surfaces of the substrate, and the predetermined direction included in the plane of the substrate intersects, for example, is orthogonal to the alignment direction. Although the short side direction of the substrate is shown as an example of this direction, the predetermined direction is not limited to the short side direction.

　また、上記の実施の形態及び変形例において、基板の表面においては、金属支柱の上方以外にもＬＥＤの素子列が設けられるとしたが、金属支柱の上方にのみＬＥＤが設けられていてもよい。 In the above-described embodiment and modification, the LED element array is provided on the surface of the substrate other than above the metal support. However, the LED may be provided only above the metal support. .

　また、上記の実施の形態及び変形例において、金属支柱は、ＬＥＤモジュールのＬＥＤの素子列の並び方向の幅だけでなく、ＬＥＤモジュールの素子列内でのＬＥＤの並び方向の幅も基板に向かって大きくなるとした。しかし、少なくともＬＥＤモジュールのＬＥＤの素子列の並び方向の幅が基板に向かって大きくなれば、ＬＥＤモジュールの素子列内でのＬＥＤの並び方向の幅は基板に向かって一定であってもよいし、小さくなってもよい。 Further, in the above-described embodiments and modifications, the metal column has a width in the LED element array direction in the LED module as well as a width in the LED module array direction toward the substrate. It will be bigger. However, as long as at least the width of the LED element row in the LED module increases toward the substrate, the width of the LED in the LED module row may be constant toward the substrate. , May be smaller.

　また、上記の実施の形態及び変形例において、リード線は金属支柱の外部に設けられるとしたが、図１０に示す電球形ランプ１Ｂの断面図に示されるように、金属支柱４０Ｂ内に空洞が設けられ、リード線の一部は金属支柱４０Ｂの空洞内を通って配設されていてもよい。この場合、リード線７０は、支持台５０から直接金属支柱４０Ｂ内の空洞に入った後、ＬＥＤモジュールの近傍で金属支柱の上部側面から飛び出してＬＥＤモジュールと接続される。これにより、ＬＥＤモジュールの光がリード線により遮光されるのを低減することができる。図１０において、リード線７０は、基板の裏面側から基板に突き刺すように設けられているが、基板の表面側まで回り込ませて基板の表面側から突き刺すように設けられていてもよい。 In the above embodiment and modification, the lead wire is provided outside the metal column. However, as shown in the cross-sectional view of the light bulb shaped lamp 1B shown in FIG. 10, there is a cavity in the metal column 40B. A part of the lead wire may be provided through the cavity of the metal support column 40B. In this case, after the lead wire 70 directly enters the cavity in the metal support 40B from the support base 50, it jumps out from the upper side surface of the metal support in the vicinity of the LED module and is connected to the LED module. Thereby, it can reduce that the light of an LED module is shielded by a lead wire. In FIG. 10, the lead wire 70 is provided so as to pierce the substrate from the back surface side of the substrate, but may be provided so as to pierce from the front surface side of the substrate.

　また、本発明は、上記の電球形ランプを備える照明装置として実現することもできる。例えば、図１１に示すように、本発明に係る照明装置１００として、上記の電球形ランプ１と、当該電球形ランプ１が取り付けられる点灯器具（照明器具）２００とを備える照明装置として構成することができる。この場合、点灯器具２００は、電球形ランプ１の消灯及び点灯を行うものであり、例えば、天井に取り付けられる器具本体２１０と、電球形ランプ１を覆うランプカバー２２０とを備える。このうち、器具本体２１０は、電球形ランプ１の口金が装着されるとともに電球形ランプ１に給電を行うソケット２１１を有する。なお、ランプカバー２２０の開口部に透光性プレートを設けてもよい。 Moreover, the present invention can also be realized as an illumination device including the above-described light bulb shaped lamp. For example, as shown in FIG. 11, the lighting device 100 according to the present invention is configured as a lighting device including the light bulb shaped lamp 1 and a lighting fixture (lighting fixture) 200 to which the light bulb shaped lamp 1 is attached. Can do. In this case, the lighting device 200 is for turning off and lighting the light bulb shaped lamp 1 and includes, for example, a device main body 210 attached to the ceiling and a lamp cover 220 covering the light bulb shaped lamp 1. Among these, the appliance main body 210 has a socket 211 to which the cap of the light bulb shaped lamp 1 is attached and which supplies power to the light bulb shaped lamp 1. A translucent plate may be provided in the opening of the lamp cover 220.

　その他、本発明の趣旨を逸脱しない限り、当業者が思いつく各種変形を本実施の形態及び変形例に施したもの、又は、実施の形態及び変形例における構成要素を組み合わせて構築される形態も、本発明の範囲内に含まれる。 In addition, as long as it does not deviate from the gist of the present invention, various modifications conceived by those skilled in the art are applied to the present embodiment and the modified examples, or a form constructed by combining the constituent elements in the embodiments and modified examples, It is included within the scope of the present invention.

　本発明は、従来の白熱電球等を代替する電球形ランプとして有用であり、照明装置等において広く利用することができる。特に、本発明に係る電球形ランプは、絶縁性の確保と高放熱性との両立を図ることができるので、高出力用タイプの電球形ランプに適している。 The present invention is useful as a light bulb shaped lamp that replaces a conventional incandescent light bulb and the like, and can be widely used in lighting devices and the like. In particular, the light bulb shaped lamp according to the present invention is suitable for a high output type light bulb shaped lamp because both insulation and high heat dissipation can be achieved.

　１、１Ｂ　電球形ランプ
　１０　グローブ
　１１　開口部
　２０ａ、２０ｂ、１２０ａ、１２０ｂ　ＬＥＤモジュール
　２１、２９、３９　基板
　２１ａ、２１ｂ、２９ａ、２９ｂ、３９ａ、３９ｂ　貫通孔
　２２ａ、２２ｂ、３２　ＬＥＤ
　２３ａ、２３ｂ、３３　封止部材
　２４ａ、２４ｂ、２６、３４、３６　金属配線
　２５ａ、２５ｂ、３５　ワイヤー
　２７、３７　導電性接着部材
　２８、３８　端子
　３０　口金
　４０、４０Ａ、４０Ｂ　金属支柱
　４１　主軸部
　４２、４２Ａ　固定部
　４２ｂ　突起部
　５０　支持台
　６０　樹脂ケース
　６１　第１ケース部
　６２　第２ケース部
　７０　リード線
　８０　点灯回路
　９０　接着剤
　１００　照明装置
　１２２ａ　サファイア基板
　１２２ｂ　窒化物半導体層
　１２２ｃ　カソード電極
　１２２ｄ　アノード電極
　１２２ｅ、１２２ｆ　ワイヤーボンド部
　１２２ｇ　チップボンディング材
　２００　点灯器具
　２１０　器具本体
　２１１　ソケット
　２２０　ランプカバー 1, 1B Bulb-shaped lamp 10 Globe 11 Opening 20a, 20b, 120a, 120b LED module 21, 29, 39 Substrate 21a, 21b, 29a, 29b, 39a, 39b Through hole 22a, 22b, 32 LED
23a, 23b, 33 Sealing member 24a, 24b, 26, 34, 36 Metal wiring 25a, 25b, 35 Wire 27, 37 Conductive adhesive member 28, 38 Terminal 30 Base 40, 40A, 40B Metal column 41 Main shaft part 42, 42A Fixed portion 42b Protruding portion 50 Support base 60 Resin case 61 First case portion 62 Second case portion 70 Lead wire 80 Lighting circuit 90 Adhesive 100 Illuminating device 122a Sapphire substrate 122b Nitride semiconductor layer 122c Cathode electrode 122d Anode electrode 122e, 122f Wire bond part 122g Chip bonding material 200 Lighting fixture 210 Appliance main body 211 Socket 220 Lamp cover

Claims (10)

　透光性のグローブと、
　前記グローブの内方に向かって延びるように設けられた金属支柱と、
　前記グローブ内に配置され、前記金属支柱に固定された発光モジュールとを備え、
　前記発光モジュールは、基板と、前記基板の前記金属支柱側の面である第１の面に設けられた複数の第１発光素子と、前記第１の面に形成された金属配線と、前記複数の第１発光素子及び前記金属配線を封止する絶縁性の封止部材とを有し、
　前記発光モジュールの導電部材のうち前記金属支柱からの位置が最短距離となっている導電部材から前記封止部材の表面までの厚さが、所定の絶縁耐圧を満たす厚さである
　電球形ランプ。 Translucent gloves,
A metal column provided to extend inward of the globe,
A light emitting module disposed in the globe and fixed to the metal support;
The light emitting module includes a substrate, a plurality of first light emitting elements provided on a first surface that is a surface of the substrate on the metal support side, a metal wiring formed on the first surface, and the plurality of light emitting modules. An insulating sealing member for sealing the first light emitting element and the metal wiring,
The light bulb shaped lamp, wherein a thickness from a conductive member having a shortest distance from the metal support to a surface of the sealing member among conductive members of the light emitting module is a thickness satisfying a predetermined withstand voltage. 　前記金属支柱からの位置が最短距離となっている前記導電部材は、前記金属配線である
　請求項１に記載の電球形ランプ。 The light bulb shaped lamp according to claim 1, wherein the conductive member having the shortest distance from the metal column is the metal wiring. 　前記最短距離は、前記第１の面上における前記金属支柱と前記金属配線との距離である
　請求項２に記載の電球形ランプ。 The light bulb shaped lamp according to claim 2, wherein the shortest distance is a distance between the metal column and the metal wiring on the first surface. 　前記封止部材がシリコーン樹脂であり、前記所定の絶縁耐圧が１．５ｋＶである場合、
　前記厚さは、０．１５ｍｍ以上である
　請求項１～３のいずれか１項に記載の電球形ランプ。 When the sealing member is a silicone resin and the predetermined withstand voltage is 1.5 kV,
The light bulb shaped lamp according to any one of claims 1 to 3, wherein the thickness is 0.15 mm or more. 　前記封止部材がシリコーン樹脂であり、前記所定の絶縁耐圧が４．０ｋＶである場合、
　前記厚さは、０．４０ｍｍ以上である
　請求項１～３のいずれか１項に記載の電球形ランプ。 When the sealing member is a silicone resin and the predetermined withstand voltage is 4.0 kV,
The light bulb shaped lamp according to any one of claims 1 to 3, wherein the thickness is 0.40 mm or more. 　前記封止部材は、低融点ガラスである
　請求項１～３のいずれか１項に記載の電球形ランプ。 The light bulb shaped lamp according to any one of claims 1 to 3, wherein the sealing member is low-melting glass. 　前記封止部材内に波長変換材が含有されている
　請求項１～６のいずれか１項に記載の電球形ランプ。 The light bulb shaped lamp according to any one of claims 1 to 6, wherein a wavelength converting material is contained in the sealing member. 　さらに、前記基板の前記第１の面とは反対側の面である第２の面に、複数の第２発光素子が設けられている
　請求項１～７のいずれか１項に記載の電球形ランプ。 The light bulb shape according to any one of claims 1 to 7, wherein a plurality of second light emitting elements are provided on a second surface which is a surface opposite to the first surface of the substrate. lamp. 　前記基板は、前記複数の第１発光素子が表面に設けられた主基板と、前記複数の第２発光素子が表面に設けられた副基板とから構成され、
　前記主基板及び前記副基板は、前記複数の第１発光素子及び前記複数の第２発光素子が設けられていない裏面同士が対向するように配置されている
　請求項８に記載の電球形ランプ。 The substrate is composed of a main substrate having the plurality of first light emitting elements provided on the surface and a sub-substrate having the plurality of second light emitting elements provided on the surface,
The light bulb shaped lamp according to claim 8, wherein the main substrate and the sub substrate are arranged such that back surfaces on which the plurality of first light emitting elements and the plurality of second light emitting elements are not provided are opposed to each other. 　請求項１～９のいずれか１項に記載の電球形ランプを備える
　照明装置。 An illumination device comprising the light bulb shaped lamp according to any one of claims 1 to 9.
PCT/JP2013/002921 2012-08-22 2013-05-02 Bulb lamp and illumination device Ceased WO2014030276A1 (en)

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