WO2013153739A1 - Light-emitting device, and lamp - Google Patents

Abstract

　A light-emitting device (1) provided with: a translucent substrate (10); a plurality of LEDs (20) arranged in a straight line on the substrate (10); a first wavelength conversion portion (sealing member (30)) formed so as to cover the plurality of LEDs (20); and second wavelength conversion portions (fluorescent layers (40)) formed between the substrate (10) and each of the plurality of LEDs (20). If the direction in which the plurality of LEDs (20) are arranged is taken as the first direction, and a direction substantially perpendicular to the first direction on a first main surface (10a) of the substrate (10) is taken as the second direction, the fluorescent layers (40) each have a protrusion (40a) protruding from the sealing member (30) in the second direction.

Description

Light emitting device and lamp

The present invention relates to a light emitting device using a light emitting element and a lamp including the same.

In recent years, semiconductor light emitting devices such as LEDs (Light Emitting Diodes) are expected to be new light sources for various lamps because of their high efficiency and long life, and research and development of LED lamps using LEDs as light sources has been promoted. Yes.

As such an LED lamp, there are a straight tube type LED lamp (straight tube type LED lamp) and a light bulb type LED lamp (bulb shape LED lamp). For example, Patent Document 1 discloses a conventional bulb-type LED lamp. Patent Document 2 discloses a conventional straight tube LED lamp. In the LED lamp, an LED module including a substrate and a plurality of LEDs mounted on the substrate is used.

JP 2006-313717 A JP 2009-043447 A

In the conventional bulb-type LED lamp, a heat sink is used to dissipate heat generated by the LED, and the LED module is fixed to the heat sink. For example, in the conventional bulb-type LED lamp disclosed in Patent Document 1, a metal casing that functions as a heat sink is provided between a hemispherical globe and a base, and the LED module is mounted on the upper surface of the metal casing. Is placed.

Further, even in a conventional straight tube LED lamp, a heat sink is used to dissipate heat generated by the LED. In this case, a long metal base made of aluminum or the like is used as the heat sink. The metal base is fixed to the inner surface of the straight pipe with an adhesive, and the LED module is fixed to the upper surface of the metal base.

However, in such a conventional bulb-type LED lamp and a conventional straight tube LED lamp, the light emitted from the LED module to the heat sink side is shielded by the metal heat sink. The way in which the light spreads is different from a lamp having all light distribution characteristics such as a light bulb type fluorescent lamp or a straight tube type fluorescent lamp. That is, it is difficult to realize a wide light distribution angle similar to that of an incandescent bulb or an existing bulb-type fluorescent lamp in the conventional bulb-type LED lamp. In addition, in the conventional straight tube type LED lamp, it is difficult to realize a wide light distribution angle similar to that of the existing straight tube type fluorescent lamp.

Therefore, for example, a bulb-type LED lamp may have the same configuration as an incandescent bulb. That is, a bulb-type LED lamp having a configuration in which the filament coil of an incandescent bulb is simply replaced with an LED module without using a heat sink is conceivable. In this case, the light from the LED module is not blocked by the heat sink.

However, since the conventional bulb-type LED lamp and the conventional straight tube LED lamp are premised on the use of a heat sink as a light shielding member as described above, the conventional LED module emits light on the heat sink side. The light is emitted on the side opposite to the heat sink without emitting light. That is, the conventional LED module is configured to extract light from only one side of the substrate (the side on which the LED is mounted).

Therefore, even if the conventional LED module is simply placed in the bulb of the incandescent bulb, there is a problem that a wide light distribution angle cannot be realized because the light flux toward the base is low.

Therefore, the substrate on which the LED chip is mounted is a light-transmitting substrate, and light can be emitted in all directions by emitting light from the back surface of the light-transmitting substrate (the surface on which the LED is not mounted). LED modules are considered.

However, there is a problem that color deviation occurs in the light emitted from the LED module in all directions only by using the LED mounting substrate as a translucent substrate.

The present invention has been made to solve such a problem, and an object thereof is to provide a light emitting device and a lamp capable of suppressing color misregistration.

In order to solve the above problems, one embodiment of a light-emitting device according to the present invention includes a light-transmitting substrate, a plurality of light-emitting elements arranged linearly on the substrate, and the plurality of light-emitting elements. A first wavelength conversion unit formed as described above, and a second wavelength conversion unit formed between the substrate and each of the plurality of light emitting elements, wherein the first light emitting element is arranged in a first direction. The second wavelength conversion unit protrudes from the first wavelength conversion unit in the second direction, where the second direction is a direction substantially perpendicular to the first direction on the main surface of the substrate. It has the part.

Furthermore, in one aspect of the light emitting device according to the present invention, the protruding portion may protrude from both sides of the first wavelength conversion portion in the second direction.

Furthermore, in one aspect of the light emitting device according to the present invention, a plurality of the second wavelength conversion units having the protruding portions are formed, and the second wavelength conversion unit is one of the plurality of second wavelength conversion units. The protruding portion of the second wavelength converting portion may be connected to the protruding portion of the other second wavelength converting portion by a connecting portion made of the same material as the second wavelength converting portion.

Furthermore, in one aspect of the light emitting device according to the present invention, the first wavelength conversion unit includes a first wavelength conversion material that converts a wavelength of light emitted from the light emitting element, and a sealing member that seals the light emitting element. The second wavelength conversion unit may be a phosphor layer including a second wavelength conversion material that converts a wavelength of light emitted from the light emitting element.

Furthermore, in one aspect of the light emitting device according to the present invention, the phosphor layer is a sintered body film made of phosphor particles as the second wavelength conversion material and an inorganic material as a binder for sintering. It is preferable.

Furthermore, in one embodiment of the light emitting device according to the present invention, the concentration of the phosphor particles in the sintered body film is preferably 91 wt% or less.

Furthermore, in one aspect of the light emitting device according to the present invention, the thickness of the sintered body film is preferably 0.035 mm or more.

Furthermore, in one aspect of the light emitting device according to the present invention, it is preferable that the sealing member is composed of phosphor particles that are the first wavelength conversion material and a resin material that contains the phosphor particles. .

Furthermore, in one aspect of the light-emitting device according to the present invention, a metal wiring formed on the substrate is provided between the adjacent light-emitting elements, and the metal wiring is not in contact with the second wavelength conversion unit. Is preferred.

Furthermore, in one mode of the light-emitting device according to the present invention, the light-emitting device includes a metal wiring that receives power from outside the light-emitting device, and a glass film that is continuously formed on the metal wiring and the substrate. Also good.

According to another aspect of the lamp of the present invention, any one of the light-emitting devices described above, a hollow globe that houses the light-emitting device, a base that receives power for causing the light-emitting device to emit light, and the light-emitting device And a support for supporting the device in the globe.

According to the present invention, it is possible to realize a light emitting device and a lamp capable of achieving both suppression of color misregistration and prevention of peeling of the phosphor layer.

1A is a plan view of the light-emitting device according to Embodiment 1 of the present invention, and FIG. 1B is a cross-sectional view of the light-emitting device taken along line AA ′ in FIG. FIG. 1C is a cross-sectional view of the light emitting device taken along line BB ′ in FIG. FIG. 2 is an enlarged cross-sectional view around the LED in the light-emitting device according to Embodiment 1 of the present invention. FIG. 3A is a partially enlarged cross-sectional view of the light-emitting device 1 according to Embodiment 1 of the present invention, taken along line C-C ′ of FIG. FIG. 3B is a cross-sectional view illustrating a configuration of a light emitting device according to Comparative Example 1. FIG. 3C is a partially enlarged cross-sectional view of the light emitting device according to Comparative Example 2. FIG. 4 is a diagram for explaining the method for manufacturing the light emitting device according to Embodiment 1 of the present invention. FIG. 5 is a plan view of the light-emitting device according to Embodiment 2 of the present invention. FIG. 6 is a plan view of the light emitting device according to Embodiment 3 of the present invention. FIG. 7 is a side view of a light bulb shaped lamp according to Embodiment 4 of the present invention. FIG. 8 is an exploded perspective view of a light bulb shaped lamp according to Embodiment 4 of the present invention. FIG. 9 is a cross-sectional view of a light bulb shaped lamp according to Embodiment 4 of the present invention. FIG. 10A is a plan view of a light emitting device according to a modification of the present invention, and FIG. 10B is a cross-sectional view of the light emitting device. FIG. 11 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.

Hereinafter, a light emitting device and a lamp according to an embodiment of the present invention will be described with reference to the drawings. Note that each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement positions and connection forms of the components shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

Also, the X axis, Y axis, and Z axis shown in each figure are three axes that are orthogonal to each other. In the following embodiments, the X-axis direction is a first direction that is the longitudinal direction of the substrate 10 (the arrangement direction of the plurality of LEDs 20). Further, the Y-axis direction is a second direction that is a direction perpendicular to the X-axis and is a short direction of the substrate 10. The Z-axis direction is a third direction that is a direction perpendicular to the X-axis and the Y-axis and is perpendicular to the first major surface 10a of the substrate 10. Each figure is a schematic diagram and is not necessarily illustrated strictly. Moreover, in each figure, the same code | symbol is attached | subjected about the same structural member.

(Embodiment 1)
First, the configuration of the light-emitting device 1 according to Embodiment 1 of the present invention will be described with reference to FIG. 1A and 1B are diagrams showing a configuration of a light-emitting device according to Embodiment 1 of the present invention, where FIG. 1A is a plan view, FIG. 1B is a cross-sectional view taken along line AA ′ in FIG. FIG. 4A is a sectional view taken along line BB ′ in FIG.

As shown in FIGS. 1A to 1C, the light-emitting device 1 according to Embodiment 1 of the present invention is a light-emitting module (LED module) that emits light of a predetermined color, and is translucent. Formed between the substrate 10 and each of the plurality of LEDs 20, the plurality of LEDs 20 provided on the substrate 10, the sealing member 30 formed to cover the plurality of LEDs 20, and the plurality of LEDs 20. A phosphor layer 40, a metal wiring 50 formed on the substrate 10, and a wire 60 that electrically connects the LED 20 and the metal wiring 50 are provided. In FIG. 1A, the metal wiring 50 and the wire 60 are not shown.

The light emitting device 1 according to the present embodiment is a COB (Chip On Board) type LED module in which an LED chip (bare chip) is directly mounted on a substrate 10. Hereinafter, each component of the light emitting device 1 will be described in detail.

[substrate]
The substrate 10 is a mounting substrate (LED mounting substrate) for mounting the LED 20, and includes a first main surface (front side surface) 10a on which the LED 20 is mounted and a first main surface 10a facing the first main surface 10a. 2 main surface (back side surface) 10b.

The substrate 10 is a light-transmitting substrate that transmits light emitted from the LED 20. In the present embodiment, the transmittance of the substrate 10 with respect to visible light is 10% or more. In addition, it is preferable that the transmittance | permeability of the board | substrate 10 is 80% or more. Further, the transmittance of the substrate 10 is preferably 90% or more, and it is preferable to use a substrate that is transparent to visible light, that is, has a very high transmittance and allows the other side to be seen through.

As such a translucent substrate 10, a translucent ceramic substrate made of alumina, aluminum nitride or the like, a transparent glass substrate made of glass, a quartz substrate made of crystal, a sapphire substrate made of sapphire, or a transparent resin material. A transparent resin substrate or the like can be used. In the present embodiment, a translucent ceramic substrate made of alumina having a transmittance of 90% is used as the substrate 10. The transmittance of the substrate 10 can be adjusted by changing the material composition, but can also be adjusted by changing the thickness of the substrate 10.

Two through holes 11 are provided at both ends of the substrate 10 in the X-axis direction. The through hole 11 is for electrically connecting a lead wire for power supply (not shown) and the metal wiring 51 by soldering or the like, and the lead wire is inserted into the through hole 11. Further, a through hole 12 is provided in the center of the substrate 10. The through hole 12 is for fixing the light emitting device 1 to another member (support member or the like). For example, a protrusion of the support member is fitted into the through hole 12. Note that power can be supplied to the metal wiring 51 without the through-hole 11, and the light-emitting device 1 can be fixed to the support member or the like without the through-hole 12. Therefore, these through holes 11 and 12 may not be provided.

The shape of the substrate 10 is not particularly limited, but a rectangular substrate is used in the present embodiment. Specifically, the length of the substrate 10 in the X-axis direction (long side length) is L1, the length of the substrate 10 in the Y-axis direction (short side length) is L2, and the thickness of the substrate 10 is Assuming d, a substrate having L1 = 25 mm, L2 = 6 mm, and d = 1 mm was used.

[LED]
The LED 20 is an example of a light emitting element, and is mounted on the first main surface 10 a of the substrate 10 via the phosphor layer 40. That is, the LED 20 is mounted on the phosphor layer 40. In the present embodiment, the LED 20 is mounted only on the first main surface 10 a side of the substrate 10.

Also, a plurality of LEDs 20 are mounted in a straight line at the same pitch. In the present embodiment, two element rows in which twelve LEDs 20 are linearly arranged in the X-axis direction are provided side by side in the Y-axis direction. Further, the LEDs 20 in one element row in the X-axis direction are connected in series, and the LEDs 20 in the element rows are connected in parallel. In the present embodiment, the plurality of LEDs 20 are mounted in two rows, but may be one row or a plurality of rows other than two rows.

Each LED 20 is a bare chip that emits monochromatic visible light. As an example, a blue LED chip that emits blue light when energized can be used. As the blue LED chip, for example, a gallium nitride based semiconductor light emitting device having a central wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used. In the present embodiment, a square blue LED chip having a side length of about 0.35 mm (350 μm) is used as the LED 20, but a rectangular LED chip can also be used. Each LED 20 is an LED chip that emits light in all directions, that is, laterally, upwardly and downwardly. For example, 20% of the total light amount is laterally, 60% of the total light amount is upward, and the total light amount is downward. 20% of light. In addition, the plurality of LEDs 20 are mounted so that the interval (pitch) between adjacent LEDs 20 in one element row is 1.4 mm, and the LED 20 of one element row in two opposing element rows The other element row is mounted so that the distance from the LED 20 is 4 mm.

Here, the LED 20 used in the present embodiment will be described in detail with reference to FIG. FIG. 2 is an enlarged cross-sectional view around the LED in the light-emitting device according to Embodiment 1 of the present invention.

As shown in FIG. 2, the LED 20 (LED chip) includes a sapphire substrate 21 and a plurality of nitride semiconductor layers 22 laminated on the sapphire substrate 21 and having different compositions.

A cathode electrode 23 and an anode electrode 24 are provided at the end of the upper surface of the nitride semiconductor layer 22. Further, wire bond portions 25 and 26 are provided on the cathode electrode 23 and the anode electrode 24, respectively.

In the LEDs 20 adjacent to each other, the cathode electrode 23 of one LED 20 and the anode electrode 24 of the other LED 20 are electrically connected by a wire 60 via wire bond portions 25 and 26. Each LED 20 is arranged on the phosphor layer 40 by a translucent chip bonding material 70 so that the surface on the sapphire substrate 21 side faces the first main surface 10a of the substrate 10. For the chip bonding material 70, a silicone resin containing a filler made of metal oxide can be used. By using a translucent material for the chip bonding material 70, loss of light emitted from the surface of the LED 20 on the sapphire substrate 21 side and the side surface of the LED 20 can be reduced, and generation of shadows by the chip bonding material 70 is prevented. be able to.

[Sealing member]
The sealing member 30 is a first wavelength conversion unit including a first wavelength conversion material that converts the wavelength of light emitted from the LED 20, and is formed so as to cover the LED 20. As the first wavelength conversion material, phosphor particles that are excited by light emitted from the LED 20 and emit light of a desired color (wavelength) can be used. The sealing member 30 in the present embodiment is a phosphor-containing resin in which predetermined phosphor particles are contained as a first wavelength conversion material in a resin made of a translucent material. Note that a light diffusing material such as silica particles may be dispersed in the sealing member 30.

As the phosphor particles (first wavelength conversion material), when the LED 20 is a blue LED that emits blue light, the phosphor particles that convert the wavelength of the blue light into yellow light in order to emit white light from the sealing member 30. Is used. As such phosphor particles, for example, YAG (yttrium, aluminum, garnet) yellow phosphor particles can be used. Thereby, a part of the blue light emitted from the LED 20 is converted into yellow light by the yellow phosphor particles contained in the sealing member 30. Then, the blue light that has not been absorbed by the yellow phosphor particles (not wavelength-converted) and the yellow light that has been wavelength-converted by the yellow phosphor particles are diffused and mixed in the sealing member 30. The white light is emitted from the sealing member 30.

In addition, as a 1st wavelength conversion material contained in the sealing member 30, it replaces with a yellow fluorescent substance particle, uses a yellow fluorescent substance particle and a red fluorescent substance particle, or a green fluorescent substance particle and a red fluorescent substance particle. It doesn't matter. In addition, when the LED 20 that emits ultraviolet light is used, a combination of phosphor particles that emit light of three primary colors (red, green, and blue) can be used as the first wavelength conversion material. In addition to the phosphor particles, the first wavelength conversion material includes a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, and a pigment. You may use the material which is.

As the resin containing the phosphor particles, a transparent resin material such as a silicone resin can be used. The sealing member 30 is not necessarily formed of a silicone resin, and may be formed of an inorganic material such as a low-melting glass or a sol-gel glass in addition to an organic material such as a fluorine-based resin.

The sealing member 30 is formed linearly on the substrate 10 along the arrangement direction of the LEDs 20. That is, the sealing member 30 collectively seals the plurality of LEDs 20 arranged in a straight line. In the present embodiment, since one element row is composed of twelve LEDs 20, the sealing member 30 collectively seals twelve LEDs 20 for one row. The sealing member 30 is formed so as to straddle the plurality of phosphor layers 40. In the present embodiment, since the plurality of LEDs 20 are mounted in two rows, the sealing member 30 is also formed in two rows. In the present embodiment, each sealing member 30 has a length of 17 mm, a line width of 1.6 mm, and a center maximum height of 0.7 mm.

Note that a plurality of sealing members 30 may be formed so as to individually cover each LED 20. In this case, each sealing member 30 can be formed in a substantially hemispherical shape.

[Phosphor layer]
The phosphor layer 40 is a second wavelength conversion unit including a second wavelength conversion material that converts the wavelength of light emitted from the LED 20. As the second wavelength conversion material, similarly to the sealing member 30, phosphor particles that are excited by light emitted from the LED 20 and emit light of a desired color (wavelength) can be used.

The phosphor layer 40 in the present embodiment is a sintered body film formed by phosphor particles that are the second wavelength conversion material and a binder for sintering.

When the LED 20 is a blue LED that emits blue light, for example, YAG-based yellow phosphor particles are used as the phosphor particles (second wavelength conversion material) in order to emit white light from the phosphor layer 40. it can.

As the sintering binder, an inorganic material such as a glass frit made of a material mainly composed of silicon oxide (SiO ₂ ) can be used. The glass frit is a binding material (binding material) for binding the phosphor particles to the substrate 10 and is made of a material having high transmittance for visible light. Glass frit can be formed by heating and melting glass powder. As glass powder of the glass frit, SiO ₂ —B ₂ O ₃ —R ₂ O, B ₂ O ₃ —R ₂ O, or P ₂ O ₅ —R ₂ O (wherein R ₂ O is any , Li ₂ O, Na ₂ O, or K ₂ O). In addition to the glass frit, SnO ₂ —B ₂ O _{3 made} of a low-melting crystal can be used as the material for the binder for sintering.

The phosphor layer 40 is formed by being fixed to the substrate 10 between the substrate 10 and the LED 20. That is, the phosphor layer 40 is fixed to the substrate 10 with the binder that the phosphor layer 40 itself has. The phosphor layer 40 in the present embodiment is formed in an island shape on the first main surface 10a of the substrate 10 immediately below each LED 20. That is, a plurality of phosphor layers 40 are formed corresponding to each of the plurality of LEDs 20. The phosphor layer 40 is formed so as not to contact the metal wiring 50 formed between the adjacent LEDs 20.

Furthermore, each phosphor layer 40 formed in an island shape has a protruding portion (exposed portion) 40a protruding from the sealing member 30 in the Y-axis direction. In other words, the sealing member 30 is formed so as to cover a part of each phosphor layer 40 without covering the whole, and a part of the phosphor layer 40 (projecting part 40 a) is exposed from the sealing member 30. It is configured as follows. In the present embodiment, each of the phosphor layers 40 is covered by the sealing member 30 by about 80%. That is, the protrusion 40a is about 20% in each phosphor layer 40.

Further, in the present embodiment, the protruding portion 40a is configured to protrude only from one side (one side) of the sealing member 30 in the width direction (Y-axis direction). Thus, although the protrusion part 40a is made to protrude from the sealing member 30 only toward the inner side of the board | substrate 10, it is not restricted to this. For example, the protruding portion 40a may protrude from the sealing member 30 only toward the outside of the substrate 10, or one sealing member 30 protrudes only toward the inside of the substrate 10 and the other sealing. The stop member 30 may be configured to protrude only toward the outside of the substrate 10.

Each phosphor layer 40 is formed in a rectangular shape with the Y-axis direction as the longitudinal direction. In the present embodiment, each phosphor layer 40 is formed so that the length in the X-axis direction is 0.7 mm and the length in the Y-axis direction is 2 mm. The thickness of each phosphor layer 40 is 0.045 mm.

The phosphor layer 40 thus configured preferably has a phosphor particle concentration of 91 wt% or less in the phosphor layer 40. When the concentration of the phosphor particles exceeds 91%, the phosphor layer 40 is easily peeled off from the alumina substrate. Moreover, it is preferable that the thickness of the fluorescent substance layer 40 is 0.035 mm or more. When the thickness of the phosphor layer 40 becomes thinner than 0.035, it becomes difficult to ensure the desired printing accuracy of the phosphor layer 40 in normal printing.

A phosphor layer 41 made of the same material as the phosphor layer 40 is also formed on the substrate 10. The phosphor layer 41 is formed so as to cover the outer edge portion of the metal wiring 51 formed around the through hole 11. That is, as shown in FIG. 1C, the phosphor layer 41 is formed so as to straddle the metal wiring 51 and the first main surface 10a of the substrate 10. The phosphor layer 41 is formed simultaneously with the phosphor layer 40.

[Metal wiring]
The metal wiring (first metal wiring) 50 is patterned in a predetermined shape on the first main surface 10a of the substrate 10 in order to electrically connect the plurality of LEDs 20 to each other. Each LED 20 and the metal wiring 50 are electrically connected via a wire 60. Adjacent LEDs 20 are connected in series by metal wiring 50.

Further, the metal wiring 50 is formed in an island shape between the adjacent LEDs 20 (phosphor layers 40). That is, a plurality of metal wirings 50 are formed so as to correspond between the adjacent LEDs 20 and are formed so as not to contact the phosphor layer 40.

Each metal wiring 50 is formed in a rectangular shape with the Y-axis direction as the longitudinal direction. In the present embodiment, each metal wiring 50 is formed so that the length in the X-axis direction is 0.4 mm and the length in the Y-axis direction is 1.0 mm. Moreover, the thickness of each metal wiring 50 is 0.004 mm.

As the metal material constituting the metal wiring 50, for example, silver (Ag), tungsten (W), copper (Cu), or the like can be used. The surface of the metal wiring 50 may be plated with nickel (Ni) / gold (Au) or the like.

Furthermore, a metal wiring 51 (second metal wiring) made of the same material as the metal wiring 50 is also formed on the substrate 10. The metal wiring 51 functions as a terminal electrode formed so as to surround the through hole 11. That is, the metal wiring 51 is a power supply / reception unit of the light emitting device 1 and receives power from the outside of the light emitting device 1 and supplies it to the LED 20. Therefore, the metal wiring 51 is electrically connected to the metal wiring 50 and the LED 20. Thereby, the electric power received from the lead wire or the like in the metal wiring 51 is supplied to each LED 20, and the LED 20 emits light. The metal wiring 51 is patterned simultaneously with the metal wiring 50.

[wire]
The wire 60 is an electric wire for electrically connecting the LED 20 and the metal wiring 50, and for example, a gold wire can be used. Specifically, as described with reference to FIG. 2, each of the wire bond portions 25 and 26 provided on the upper surface of the chip of the LED 20 and the metal wiring 50 formed adjacent to both sides of the LED 20 are wired by the wire 60. Bonded.

As shown in FIG. 1B, in the present embodiment, the wire 60 is configured not to protrude from the sealing member 30, and the entire wire 60 is embedded in the sealing member 30.

[Light characteristics of light-emitting device]
Next, optical characteristics of the light-emitting device 1 according to Embodiment 1 of the present invention will be described with reference to FIGS. 3A to 3C. FIG. 3A is a diagram for explaining how light propagates in the light-emitting device 1 according to Embodiment 1 of the present invention, and is an enlarged cross-sectional view of a portion taken along the line CC ′ of FIG. is there. FIG. 3B is a cross-sectional view illustrating a configuration of a light emitting device according to Comparative Example 1. FIG. 3C is a diagram for explaining a state when light propagates in the light emitting device according to Comparative Example 2.

As shown in FIG. 3A, in the light-emitting device 1 according to the present embodiment, when power is supplied to the LED 20, the LED 20 emits light in all directions.

Of these, the light traveling upward, obliquely upward and laterally of the LED 20 propagates in the sealing member 30, and a part thereof is predetermined by the phosphor particles (first wavelength conversion material) in the sealing member 30. It is converted into the wavelength. In the present embodiment, the yellow phosphor particles in the sealing member 30 are excited by the blue light of the blue LED chip to emit yellow light, and are generated by the color mixture of the yellow light and the blue light that has not been wavelength-converted. White light is emitted from the sealing member 30.

Moreover, since the light that travels below the LED 20 out of the light emitted from the LED 20 passes through the phosphor layer 40, a part of the light is predetermined by the phosphor particles (second wavelength conversion material) in the phosphor layer 40. Converted to wavelength. In the present embodiment, the yellow phosphor particles in the phosphor layer 40 are excited by the blue light of the blue LED chip to emit yellow light, and are generated by the color mixture of the yellow light and the blue light that has not been wavelength-converted. White light is emitted from the phosphor layer 40. The white light emitted from the phosphor layer 40 enters the substrate 10, passes through the substrate 10, and is emitted from the second main surface 10 b of the substrate 10.

In addition, part of the light emitted from the LED 20 that travels obliquely below the LED 20 passes through the sealing member 30 and the phosphor layer 40, and thus the phosphor particles (first wavelength conversion material) in the phosphor layer 40. Or it is converted into a predetermined wavelength by the phosphor particles (second wavelength conversion material) of the phosphor layer 40. In the present embodiment, as described above, one of the phosphor particles is excited by the blue light of the blue LED chip to emit yellow light, and is generated by the color mixture of the yellow light and the blue light that has not been wavelength-converted. White light emitted from the phosphor layer 40 is transmitted through the substrate 10 and emitted from the second main surface 10 b of the substrate 10.

As described above, according to the light emitting device 1 according to the present embodiment, white light is emitted outward from the first main surface 10a of the substrate 10, and outward from the second main surface 10b of the substrate 10. White light is emitted toward.

Here, in the light-emitting device 1 according to the present embodiment, the phosphor layer 40 has the protruding portion 40 a that protrudes from the sealing member 30. That is, a part of the phosphor layer 40 protrudes from the sealing member 30. Thereby, the color shift of the light emitted in all directions of the light emitting device 1 can be suppressed, and peeling of the phosphor layer 40 can be prevented. Hereinafter, this point will be described in detail.

In the light emitting device 1 in which the phosphor layer 40 is formed immediately below the LED 20, as shown in FIG. 3B, when the phosphor layer 400 is configured not to protrude from the sealing member 30, before the sealing member 30 is formed, etc. In this case, the present inventor has found that the phosphor layer 400 may be peeled off from the substrate 10. This is presumably because the binding property of the phosphor layer 400 to the substrate 10 was lowered because the amount of the binder (glass) contained in the phosphor layer 400 was small.

Therefore, as shown in FIG. 3C, when the phosphor layer 400A is manufactured by increasing the amount of the binder (glass) while keeping the size the same as that of the phosphor layer 400, the phosphor layer 400A and the substrate 10 are obtained. It has been found that, although the peeling force of the phosphor layer 400 </ b> A can be prevented by increasing the adhesion force to the light, a color shift occurs in the light emitted from the light emitting device 1. This is because if the ratio of the binder (glass) contained in the phosphor layer is increased while the phosphor layer is configured not to protrude from the sealing member, the concentration of the phosphor particles in the phosphor layer 400A decreases. It is believed that there is. Thus, when the phosphor layer 400A is formed by increasing the amount of the binder, light emitted from the phosphor layer 400A (light emitted from the second major surface 10b of the substrate 10) and the sealing member 30 are emitted. It was found that color shift occurs with light.

As described above, in order to suppress the color shift in the light emitted in all directions, the light emitted from the phosphor layer needs to have a desired color (for example, white light). For this purpose, the phosphor layer It was possible to obtain the knowledge that the concentration of the phosphor particles in the film needs to be higher than a predetermined level. In other words, it has been found that the LED light (for example, blue light) to be converted into a desired color (for example, yellow light) by the phosphor layer needs to have a desired ratio.

The present invention has been made based on such knowledge, and as shown in FIG. 3A, adopts an epoch-making configuration in which a part of the phosphor layer 40 is intentionally protruded from the sealing member 30. Thus, in addition to preventing the phosphor layer 40 from being peeled off, it was possible to obtain an idea that the occurrence of color misregistration can be suppressed in all directions.

That is, by protruding a part of the phosphor layer 40 formed immediately below the LED 20 from the sealing member 30, it is possible to secure an amount of binder (glass) that does not cause the phosphor layer 40 to peel off. It is considered that the adhesion force (binding property) of the layer 40 to the substrate 10 could be improved. Thereby, peeling of the fluorescent substance layer 40 can be prevented.

Further, by projecting a part of the phosphor layer 40 formed immediately below the LED 20 from the sealing member 30, the light of the LED 20 that passes through the phosphor layer 40 can be increased. That is, it is possible to ensure the concentration of the phosphor particles so that no color shift occurs. Thereby, light (white light) radiated from the second main surface 10b of the substrate 10 can be set as light having a target chromaticity.

As described above, according to the light emitting device 1 according to Embodiment 1 of the present invention, it is possible to achieve both suppression of color shift and prevention of peeling of the phosphor layer.

Next, an example of a method for manufacturing the light-emitting device according to Embodiment 1 of the present invention will be described with reference to FIG. FIG. 4 is a diagram for explaining the method for manufacturing the light emitting device according to Embodiment 1 of the present invention.

First, as shown in FIG. 4A, a substrate 10 is prepared. In the present embodiment, a transparent ceramic substrate made of alumina having a long side length of 25 mm and a short side length of 6 mm, a plate thickness of 1 mm and a transmittance of 90% is used. It was. Further, the substrate 10 is provided with through holes 11 and 12.

Next, as shown in FIG. 4B, a plurality of metal wirings 50 having a predetermined shape are formed in an island shape on the first main surface 10a of the substrate 10, and each of the two through holes 11 is surrounded. A metal wiring 51 is formed on the substrate. The metal wirings 50 and 51 can be formed, for example, by applying a conductive paste in a predetermined pattern and baking it at a temperature range of 700 ° C. to 800 ° C. for 10 minutes. In the present embodiment, the metal wirings 50 and 51 are patterned using a silver paste containing Ag as a main component. A plurality of metal wirings 50 are formed in a rectangular island shape.

Next, as shown in FIG. 4C, a plurality of phosphor layers 40 are formed in an island shape between the adjacent metal wirings 50 on the first main surface 10a of the substrate 10. At this time, the metal wiring 50 and the phosphor layer 40 are preferably formed so as not to contact each other. This is because when the phosphor layer 40 is formed on the metal wiring 50, the wire 60 that should originally be wire-bonded on the metal wiring 50 is wire-bonded on the phosphor layer 40. This is because defects occur. In particular, since the metal wiring 50 has high wettability, when the paste-like phosphor layer 40 is applied, if the phosphor layer 40 comes into contact with the metal wiring 50, it spreads over the metal wiring 50. The metal wiring 50 may be unintentionally covered with the phosphor layer 40 in some cases.

In the present embodiment, the phosphor layer 41 is also formed so as to cover the outer edge of the metal wiring 51 at the same time as the phosphor layer 40 is formed. Thus, by covering a part of the metal wiring 51 with the phosphor layer 41, the metal wiring 51 can be prevented from peeling off.

Specifically, the phosphor layers 40 and 41 can be formed as follows.

First, powdered phosphor particles are prepared as the second wavelength conversion material, and powdered frit glass (powder glass) is prepared as a binder for sintering, and a solvent is added to the prepared phosphor particles and frit glass. Then, a paste for forming a sintered body film (a paste-like phosphor layer 40) is prepared by kneading.

In the present embodiment, powder glass having a softening point of 520 ° C. was used as the binder for sintering. Further, the yellow phosphor particles and the powder glass were prepared so that the weight ratio (wt%) was 80:20. Note that the proportion of the phosphor particles is not limited to 50 wt%, and may be in the range of 20 to 91 wt%. Further, the prepared material can be made into a paste by kneading (mixing), for example, with a three-roll kneader.

Next, a paste for forming a sintered body film is applied to a predetermined position on the first main surface 10a of the substrate 10 in a predetermined shape. The paste for forming the sintered body film is coated on the substrate 10 by coating, but can also be coated by printing. In addition, a predetermined surface treatment may be performed on the first main surface 10a of the substrate 10 before the substrate 10 is coated with the paste for forming the sintered body film. For example, when a transparent glass substrate is used as the substrate 10, it is preferable to perform a frost treatment.

Next, the substrate 10 on which the paste for forming the sintered body film is applied is dried, for example, at a temperature of 150 ° C. for 30 minutes, and then baked at a temperature of about 600 ° C. for 10 minutes. By firing, the glass frit is softened to form a sintered body film (phosphor layer 40) in which the phosphor particles are bonded to each other and the phosphor particles and the substrate 10 are bonded (bonded) by the glass frit. be able to. The firing temperature is preferably a temperature at which the phosphor particles are not deteriorated and a temperature at which the glass frit is softened. Since the phosphor particles deteriorate when the temperature exceeds 700 ° C., the firing temperature is preferably less than 700 ° C.

Thereby, the phosphor layer 40 (sintered body film) can be coated on the first main surface 10a of the substrate 10. In the present embodiment, the phosphor layer 40 is formed with a film thickness of 45 μm.

Next, as shown in FIG. 4D, the LED 20 (bare chip) is mounted on each phosphor layer 40. The LED 20 is mounted by die bonding using a die attach agent or the like.

Thereafter, as shown in the figure, in order to electrically connect the LED 20 and the metal wiring 50, the LED 20 and the metal wiring 50 adjacent to the LED 20 are wire-bonded using a wire 60.

Finally, as shown in FIG. 4E, the sealing member 30 is formed on the first main surface 10a of the substrate 10. At this time, the sealing member 30 is formed so that a part of the phosphor layer 40 protrudes and the other part is covered.

Such a sealing member 30 can be applied and formed by a dispenser method. For example, by disposing a discharge nozzle of a dispenser above the LED 20 and moving the discharge nozzle along the element array of the LED 20 while discharging the sealing member material (phosphor-containing resin) from the discharge nozzle, the sealing member material Can be applied linearly. Then, the sealing member 30 of a predetermined shape can be formed by curing the sealing member material by a predetermined method. In the present embodiment, a phosphor-containing resin in which yellow phosphor particles are dispersed in a silicone resin is used as the sealing member 30.

As described above, the light-emitting device 1 according to Embodiment 1 of the present invention can be manufactured.

(Modification)
Next, a modification of the light emitting device according to Embodiment 1 of the present invention will be described.

As shown in FIGS. 1 and 4, in the light emitting device 1 according to Embodiment 1, the periphery of the metal wiring 51 is covered with the phosphor layer 41 in order to prevent the metal wiring (second metal wiring) 51 from peeling off. Yes. However, when the phosphor layer 41 is formed on the metal wiring 51, the light emitted from the light-emitting device 1 is reflected by the inner surface of a glove or the like that houses the light-emitting device 1 or the light-emitting portion (the LED 20, the seal). When reflected light such as light reflected from the inside of the substrate 10 among the light emitted from the stop member 30) reaches the phosphor layer 41, the reflected light is absorbed by the phosphor layer 41. This causes problems such as color misregistration and a decrease in light extraction efficiency. That is, even if desired color adjustment is performed according to the film thickness or area of the phosphor layer 40 immediately below the LED 20, color deviation or the like occurs due to the phosphor layer 41 covering the metal wiring 51.

Therefore, in this modification, a glass film is used instead of the phosphor layer 41 as a member covering the metal wiring 51. The glass film can have the same shape as the phosphor layer 41 in FIG. That is, a glass film is formed so as to straddle the metal wiring 51 and the substrate 10, and the glass film is continuously formed on the surface of the metal wiring 51 and the surface of the substrate 10. The glass film is mainly composed of silicon oxide (SiO ₂ ), and for example, crystallized glass can be used. Since the glass film has high transmittance for visible light, it passes through without being absorbed even when light reaches it.

Further, the glass film is formed so as to protrude the soldered portion of the surface of the metal wiring 51 around the through hole 11. When soldering the lead wire inserted into the through hole 11 and the metal wiring 51, a temperature of about 300 ° C. is also applied to the metal wiring 51. The glass film is required to be resistant to such a temperature, but the glass film can satisfy this requirement.

As described above, according to the light emitting device according to this modification, since the metal wiring 51 is coated with the glass film instead of the phosphor layer 41, the light reaching the glass film is transmitted through the glass film. A part of the light transmitted through the glass film is reflected by the metal wiring 51, and the other part is transmitted through the substrate 10. Thereby, it is possible to prevent the color shift and the light extraction efficiency from being lowered by the reflected light. Moreover, peeling of the metal wiring 51 can also be prevented by covering the metal wiring 51 with a glass film. As described above, according to the present modification, it is possible to prevent the metal wiring 51 from being peeled while preventing the color shift and the light extraction efficiency from being lowered.

Note that this modification can also be applied to the following embodiments.

(Embodiment 2)
Next, the light emitting device 2 according to Embodiment 2 of the present invention will be described with reference to FIG. FIG. 5 is a plan view of the light-emitting device according to Embodiment 2 of the present invention. In FIG. 5, the metal wiring 50 and the wire 60 are not shown.

The light emitting device 2 according to the present embodiment is different from the light emitting device 1 according to the first embodiment in the configuration of the phosphor layer. That is, the protruding portion 40a of the phosphor layer 40 in the first embodiment protrudes from only one side in the width direction of the sealing member 30, but the protruding portion of the phosphor layer 40A in the present embodiment is the sealing member. It protrudes on both sides in the width direction of 30.

Specifically, as shown in FIG. 5, each of the plurality of phosphor layers 40 </ b> A includes a first protrusion 40 a 1 that protrudes from one side in the width direction of the sealing member 30, and a width direction of the sealing member 30. And a second protrusion 40a2 protruding from the other side. The phosphor layer 40A in the present embodiment can be formed by the same method as the phosphor layer 40 in the first embodiment.

As mentioned above, according to the light-emitting device 2 which concerns on this Embodiment, there can exist an effect similar to Embodiment 1. FIG. That is, it is possible to achieve both suppression of color misregistration and prevention of peeling of the phosphor layer.

In particular, in the present embodiment, the phosphor layer 40A protrudes from both sides in the width direction of the sealing member 30, so that the binding property of the phosphor layer 40A to the substrate 10 is further improved as compared to the first embodiment. Thus, peeling of the phosphor layer 40A can be prevented more reliably.

Further, the phosphor layer 40A protrudes from both sides in the width direction of the sealing member 30, so that the phosphor particles and the binder (glass) are mixed in the sealing member 30 without increasing the thickness of the phosphor layer 40. The degree of freedom of adjustment increases. Thereby, the light (white light) radiated | emitted from the 2nd main surface 10b of the board | substrate 10 can be easily made into the light of target chromaticity.

(Embodiment 3)
Next, the light emitting device 3 according to Embodiment 3 of the present invention will be described with reference to FIG. FIG. 6 is a plan view of the light emitting device according to Embodiment 3 of the present invention. In FIG. 6, the metal wiring 50 and the wire 60 are not shown.

The light emitting device 3 according to the present embodiment is different from the light emitting device 2 according to the second embodiment in the configuration of the phosphor layer. That is, with respect to the second embodiment, the plurality of first protrusions 40a1 protruding from the sealing member 30 toward the inside of the substrate 10 are connected to each other and the sealing member toward the outside of the substrate 10 A plurality of second protrusions 40a2 protruding from 30 are connected to each other.

Specifically, as shown in FIG. 6, in the adjacent phosphor layer 40B, the first protrusion 40a1 of one phosphor layer 40B and the first protrusion 40a1 of the other phosphor layer 40B are the first It is connected by the connection part 40b1. Similarly, in the adjacent phosphor layer 40B, the second projecting portion 40a2 of one phosphor layer 40B and the second projecting portion 40a2 of the other phosphor layer 40B are connected by the second connecting portion 40b2.

The first connection portion 40b1 and the second connection portion 40b2 are sintered body films formed of the same material as the phosphor layer 40B. Accordingly, the first connection portion 40b1 and the second connection portion 40b2 are formed at the same time as the phosphor layer 40B is formed. The phosphor layer 40B in the present embodiment can be formed by the same method as the phosphor layer 40 in the first embodiment.

As mentioned above, according to the light-emitting device 2 which concerns on this Embodiment, there can exist an effect similar to Embodiment 1,2. That is, it is possible to achieve both suppression of color misregistration and prevention of peeling of the phosphor layer.

In particular, in the present embodiment, the phosphor layer 40B protrudes from both sides in the width direction of the sealing member 30 and the protruding portions are connected to each other. The binding property to the substrate 10 can be further improved, and the phosphor layer 40B can be more reliably prevented from peeling off. Also, with this configuration, the degree of freedom in adjusting the mixing ratio of the phosphor particles and the binder (glass) in the sealing member 30 can be improved with respect to the second embodiment, so the second main surface of the substrate 10 The light (white light) radiated from 10b can be more easily converted into light having a target chromaticity.

(Embodiment 4)
Next, a light bulb shaped lamp 100 according to Embodiment 4 of the present invention will be described with reference to FIGS. A light bulb shaped lamp 100 according to the present embodiment is an application example of the light emitting device according to the first to third embodiments. FIG. 7 is a side view of a light bulb shaped lamp according to Embodiment 4 of the present invention. FIG. 8 is an exploded perspective view of a light bulb shaped lamp according to Embodiment 4 of the present invention. FIG. 9 is a cross-sectional view of a light bulb shaped lamp according to Embodiment 4 of the present invention.

As shown in FIGS. 7 to 9, a light bulb shaped lamp 100 according to the present embodiment is a light bulb shaped LED lamp that is a substitute for a light bulb shaped fluorescent light or an incandescent light bulb, and has a translucent globe 110, LED module 120 that is a light source, base 130 that receives power, support column 140 that holds LED module 120, support base 150 that supports support column 140, resin case 160, lead wire 170, and lighting circuit 180 Is provided.

In the light bulb shaped lamp 100 according to the present embodiment, an envelope is constituted by the globe 110, the resin case 160, and the base 130. Further, as the LED module 120, the light emitting devices 1 to 3 of Embodiments 1 to 3 can be used. Hereinafter, each component of the light bulb shaped lamp 100 will be described in detail with reference to FIGS.

[Glove]
The globe 110 houses the LED module 120 and transmits light from the LED module 120 to the outside of the lamp. In the present embodiment, globe 110 is a glass bulb (clear bulb) made of silica glass that is transparent to visible light. Therefore, the LED module 120 housed in the globe 110 can be viewed from the outside of the globe 110.

In the present embodiment, the shape of the globe 110 is a shape in which one end is closed in a spherical shape and an opening is provided at the other end. In other words, the shape of the globe 110 is such that a part of the hollow sphere narrows while extending away from the center of the sphere, and an opening is formed at a position away from the center of the sphere. Yes. As the globe 110 having such a shape, a glass bulb having the same shape as a general incandescent bulb can be used. For example, a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 110.

Note that the globe 110 is not necessarily transparent to visible light, and the globe 110 may have a light diffusion function. For example, a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 110. Further, the globe 110 does not need to be made of silica glass. For example, a globe 110 made of a resin material such as acrylic may be used.

[Base]
The base 130 is a power receiving unit that receives power for causing the LEDs of the LED module 120 to emit light from the outside, and is attached to a socket of a lighting fixture, for example. When the light bulb shaped lamp 100 is lit, the base 130 receives power from the socket of the lighting fixture. The base 130 in the present embodiment receives AC power through two contact points, and the power received by the base 130 is input to the power input unit of the lighting circuit 180 via a lead wire.

The base 130 is E-shaped, and a screwing portion for screwing into a socket of the lighting fixture is formed on the outer peripheral surface thereof. Further, on the inner peripheral surface of the base 130, a screwing portion for screwing into the resin case 160 is formed. The base 130 has a metal bottomed cylindrical shape.

The type of the base 130 is not particularly limited. For example, a screw-type Edison type (E type) base can be used, and examples thereof include E26 type and E17 type.

[Support]
The strut 140 is a metal stem provided so as to extend from the vicinity of the opening of the globe 110 toward the inside of the globe 110.

The column 140 functions as a holding member that holds the LED module 120, one end of the column 140 is connected to the LED module 120, and the other end of the column 140 is connected to the support base 150. The LED module 120 is held in the hollow in the globe 110 by the support column 140.

Moreover, the support | pillar 140 is comprised with the metal material and functions also as a heat radiating member for radiating the heat which generate | occur | produces in the LED module 120. FIG. In the present embodiment, the support column 140 is made of aluminum having a thermal conductivity of 237 [W / m · K]. Thus, since the support | pillar 140 is comprised with the metal material, the heat | fever of the LED module 120 is efficiently conducted to the support | pillar 140 through a board | substrate. Thereby, the heat of the LED module 120 can be released to the base 130 side. As a result, it is possible to suppress a decrease in luminous efficiency and lifetime of the LED due to temperature rise.

Moreover, the support | pillar 140 has a projection part for making it fit with the through-hole (through-hole 12 of FIG. 1) provided in the board | substrate of the LED module 120. FIG. The protruding portion is provided so as to protrude from the top surface of the top of the support column 140 and functions as a position restricting portion that restricts the position of the LED module 120. That is, the protrusion is configured to determine the arrangement direction of the LED module 120.

In addition, as the support | pillar 140, you may use the stem which consists of soft glass transparent with respect to visible light similarly to the conventional light bulb-type fluorescent lamp. Thereby, it can suppress that the light produced in the LED module 120 is lost by the support | pillar 140. FIG. Further, it is possible to prevent a shadow from being generated by the support 140. Furthermore, since the column 140 shines with the white light emitted from the LED module 120, the light bulb shaped lamp 100 can also exhibit a visually attractive appearance.

[Support stand]
The support base (support plate) 150 is a support member that supports the support column 140, and is connected to the opening end of the opening of the globe 110 as shown in FIG. 9. The support base 150 is configured to close the opening of the globe 110. In the present embodiment, the support base 150 is fixed to the resin case 160. In addition, the support base 150 is provided with a through hole through which the lead wire 170 is passed.

The support base 150 is made of a metal material, and in the present embodiment, like the support 140, it is made of aluminum. Thereby, the heat of the LED module 120 thermally conducted to the support column 140 is efficiently conducted to the support base 150. As a result, it is possible to suppress a decrease in luminous efficiency and lifetime of the LED due to temperature rise.

Further, the support base 150 is configured by a disk-shaped member having a stepped portion. The stepped portion is in contact with the opening end of the opening of the globe 110, thereby closing the opening of the globe 110. Further, in the stepped portion, the support base 150, the resin case 160, and the opening end of the opening of the globe 110 are fixed by an adhesive.

[Resin case]
The resin case 160 is an insulating case (circuit holder) for insulating the support column 140 and the base 130 and accommodating the lighting circuit 180. The resin case 160 includes a large-diameter cylindrical first case portion and a small-diameter cylindrical second case portion. Since the outer surface of the first case part protrudes to the outside air, the heat conducted to the resin case 160 is mainly radiated from the first case part. On the other hand, the second case portion is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 130. In the present embodiment, the second case portion is screwed into the outer peripheral surface of the second case portion. A threaded portion is formed. The resin case 160 can be formed of, for example, polybutylene terephthalate (PBT).

[Lead]
The two lead wires 170 are electric wires for supplying power for lighting the LED module 120 from the lighting circuit 180 to the LED module 120. One end of each lead wire 170 is electrically connected to the power supply unit of the LED module 120, and the other end of each lead wire 170 is electrically connected to the power output unit of the lighting circuit 180.

[Lighting circuit]
The lighting circuit 180 is a circuit unit for lighting the LED module 120 (LED chip), and is housed in the resin case 160. Specifically, the lighting circuit 180 includes a plurality of circuit elements and a circuit board on which each circuit element is mounted. In the present embodiment, the lighting circuit 180 is a power supply circuit that converts AC power fed from the base 130 into DC power, and the DC power is converted into LED module 120 (LED chip) via two lead wires 170. Output to.

Note that the light bulb shaped lamp 100 is not necessarily provided with the lighting circuit 180. For example, when direct-current power is directly supplied from a lighting fixture or a battery, the light bulb shaped lamp 100 may not include the lighting circuit 180. Further, the lighting circuit 180 is not limited to a smoothing circuit, and a dimmer circuit or a booster circuit can be appropriately selected and combined.

Thus, the light bulb shaped lamp 100 is configured. As described above, according to the light bulb shaped lamp 100 according to the fourth embodiment of the present invention, since the LED modules according to the first to third embodiments are used, a light bulb shaped lamp capable of suppressing color shift is realized. be able to. Moreover, according to the light bulb shaped lamp 100 according to the present embodiment, a wide light distribution angle can be obtained.

(Modification)
Next, a light emitting device 4 according to a modification of the present invention will be described with reference to FIG. FIG. 10A is a plan view of a light emitting device according to a modification of the present invention, and FIG. 10B is a cross-sectional view of the light emitting device. In FIG. 10, metal wiring and wires are not shown.

As shown in FIGS. 10A and 10B, in the light emitting device 4 according to this modification, the phosphor layer (second wavelength conversion unit) 40 is the entire sealing member (first wavelength conversion unit) 30. It is comprised so that it may protrude from the sealing member 30 over the periphery.

With such a configuration, it is possible to achieve both suppression of color misregistration and prevention of peeling of the phosphor layer, and to enhance the color.

In this modification, the LED 20 is one chip and the sealing member 30 is hemispherical so as to cover the LED 20. However, the present invention is not limited to this. For example, this modification can also be applied when a plurality of LEDs 20 are arranged in a line as in the first to third embodiments.

As mentioned above, although the light-emitting device and lamp which concern on this invention have been demonstrated based on embodiment and a modification, this invention is not limited to said embodiment and a modification.

For example, the light emitting devices 1 to 3 according to Embodiments 1 to 3 described above are applied to a light bulb shaped lamp, but the present invention is not limited thereto. For example, the light emitting devices 1 to 3 according to the above-described embodiments can be applied to a straight tube lamp constituted by a long cylindrical straight tube or a round tube lamp constituted by an annular round tube. . Alternatively, the light emitting devices 1 to 3 according to Embodiments 1 to 3 described above can also be applied to lamps having a base structure such as a GX53 base or a GH76p base.

In addition, the light emitting devices 1 to 3 according to the first to third embodiments described above include an illumination unit or an illumination configured by arranging a lamp without a base, for example, a light emitting device (LED module) on a base such as a heat sink It can also be applied to the system.

As an application example (Embodiment 4) of the light bulb shaped lamp, the light emitting devices 1 to 3 according to Embodiments 1 to 3 described above are applied to glass bulbs used for incandescent bulbs. Not limited to this. For example, the light emitting devices 1 to 3 according to Embodiments 1 to 3 described above can also be applied to a light bulb shaped lamp having a heat sink of a metal housing between a globe and a base. Further, the present invention can be applied to a light bulb shaped lamp having a long spherical bulb extending in the longitudinal direction used in a chandelier or a candle type lighting device.

Further, the present invention can also be realized as an illumination device including a lamp such as the above-described light bulb shaped lamp. For example, as shown in FIG. 11, the lighting device 200 according to the present invention may be configured to include the light bulb shaped lamp 100 and a lighting fixture (lighting fixture) 300 to which the light bulb shaped lamp is attached. . In this case, the lighting fixture 300 turns off and turns on the light bulb shaped lamp 100, and includes, for example, a fixture main body 310 attached to the ceiling and a lamp cover 320 that covers the light bulb shaped lamp 100. Among these, the appliance main body 310 has a socket 311 for mounting the cap of the light bulb shaped lamp 100 and supplying power to the light bulb shaped lamp 100. A translucent plate may be provided in the opening of the lamp cover 320.

In the above embodiment, the LED is exemplified as the light emitting element. However, a semiconductor light emitting element such as a semiconductor laser, an EL element such as an organic EL (Electro Luminescence) or an inorganic EL, or other solid light emitting element is used. Also good.

In addition, unless it deviates from the gist of the present invention, various modifications conceived by those skilled in the art are applied to the present embodiment and the modification, or a form constructed by combining components in different embodiments and modifications. Are included within the scope of the present invention.

The present invention can be widely used in a light emitting device including a light emitting element such as an LED, a lamp, an illumination unit, or an illumination system including the light emitting device.

1, 2, 3, 4 Light-emitting device 10 Substrate 10a First main surface 10b Second main surface 11, 12 Through hole 20 LED
21 Sapphire substrate 22 Nitride semiconductor layer 23 Cathode electrode 24 Anode electrode 25, 26 Wire bond part 30 Sealing member 40, 40A, 41, 400, 400A Phosphor layer 40a Protrusion part 40a1 First protrusion part 40a2 Second protrusion part 40b1 1st connection part 40b2 2nd connection part 50, 51 Metal wiring 60 Wire 70 Chip bonding material 100 Light bulb shaped lamp 110 Globe 120 LED module 130 Base 140 Post 150 Support base 160 Resin case 170 Lead wire 180 Lighting circuit 200 Illuminating device 300 Lighting Appliance 310 Appliance body 311 Socket 320 Lamp cover

Claims (11)

A substrate having translucency;
A plurality of light emitting elements arranged linearly on the substrate;
A first wavelength converter formed to cover the plurality of light emitting elements;
A second wavelength conversion unit formed between the substrate and each of the plurality of light emitting elements,
When the arrangement direction of the plurality of light emitting elements is a first direction and the direction substantially perpendicular to the first direction on the main surface of the substrate is a second direction,
The second wavelength conversion unit includes a protrusion that protrudes from the first wavelength conversion unit in the second direction. The protruding portion protrudes from both sides of the first wavelength conversion portion in the second direction.
The light emitting device according to claim 1. A plurality of the second wavelength conversion parts having the protrusions are formed,
Of the plurality of second wavelength conversion units, the projection of one of the second wavelength conversion units and the projection of the other second wavelength conversion unit are made of the same material as the second wavelength conversion unit. Connected by part,
The light emitting device according to claim 1. The first wavelength conversion unit includes a first wavelength conversion material that converts a wavelength of light emitted from the light emitting element, and is a sealing member that seals the light emitting element.
The second wavelength conversion unit is a phosphor layer including a second wavelength conversion material that converts a wavelength of light emitted from the light emitting element.
The light emitting device according to any one of claims 1 to 3. The phosphor layer is a sintered body film composed of phosphor particles as the second wavelength conversion material and an inorganic material as a binder for sintering.
The light emitting device according to claim 4. The concentration of the phosphor particles in the sintered body film is 91 wt% or less.
The light emitting device according to claim 5. The thickness of the sintered body film is 0.035 mm or more.
The light emitting device according to claim 5. The sealing member is composed of phosphor particles that are the first wavelength conversion material and a resin material containing the phosphor particles.
The light emitting device according to any one of claims 4 to 7. Furthermore, comprising a metal wiring formed on the substrate between the adjacent light emitting elements,
The metal wiring is not in contact with the second wavelength conversion unit,
The light emitting device according to any one of claims 1 to 8. Furthermore, metal wiring that receives power from outside the light emitting device,
A glass film formed continuously on the metal wiring and the substrate,
The light emitting device according to any one of claims 1 to 9. A light emitting device according to any one of claims 1 to 10;
A hollow glove for housing the light emitting device;
A base for receiving power for causing the light emitting device to emit light;
A support for supporting the light emitting device in the globe,
lamp.

Images