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WO2014087682A1 - Dispositif de transfert - Google Patents

Dispositif de transfert Download PDF

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Publication number
WO2014087682A1
WO2014087682A1 PCT/JP2013/060872 JP2013060872W WO2014087682A1 WO 2014087682 A1 WO2014087682 A1 WO 2014087682A1 JP 2013060872 W JP2013060872 W JP 2013060872W WO 2014087682 A1 WO2014087682 A1 WO 2014087682A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
rotary
holding
container
pickup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/060872
Other languages
English (en)
Japanese (ja)
Inventor
佳明 原
航 蔭山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ueno Seiki Co Ltd
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Priority to SG11201504004VA priority Critical patent/SG11201504004VA/en
Priority to JP2013516894A priority patent/JP5376386B1/ja
Priority to KR1020157006101A priority patent/KR101527106B1/ko
Priority to HK15107355.7A priority patent/HK1206683B/xx
Priority to CN201380056662.4A priority patent/CN104768702B/zh
Priority to TW102144313A priority patent/TWI505901B/zh
Publication of WO2014087682A1 publication Critical patent/WO2014087682A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
    • B23P21/006—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed the conveying means comprising a rotating table

Definitions

  • the present invention relates to a transfer device for taking out an electronic component from one container and mounting it on the other container.
  • Electronic parts are parts used in electrical products, and include semiconductor elements.
  • semiconductor elements include transistors, LEDs, integrated circuits, and resistors, capacitors, and the like.
  • the container is, for example, a packaging container such as a wafer sheet, a lead frame, an organic substrate, an inorganic substrate, an adhesive tray, a substrate, a parts feeder, or a tape, a tray, or a classification bin formed with pockets.
  • Processing of electronic components at each processing point includes visual inspection, adhesive application, posture confirmation, classification, forced discharge of defective products, mounting on a board, temperature control such as electrical characteristics inspection, heating or cooling, and terminals extending from the electronic components There are various methods such as shape processing, posture correction, and marking.
  • a transfer device that takes out a semiconductor element from a wafer sheet, a tray, a tape, or a parts feeder, inverts the front and back, and adheres it to a lead frame or a mounting substrate via an adhesive is called a die bonder device.
  • Such a transfer device has a plurality of rotary tables and rotary pickups, supplies electronic components with the rotary pickups, and delivers the electronic components at a position where the holding portions provided on the rotary table are aligned.
  • a type that forms one transport path is known (see, for example, Patent Documents 1 to 3).
  • the rotary table is, for example, a turret table, which is used as a main conveyance path, and secondly, it is large and heavy compared to a rotary pickup so as to arrange a large number of processing points for electronic components, and thirdly, Since the processing unit for processing the electronic component is disposed below the processing point, a holding means for holding the electronic component is provided so as to hang down so as to be orthogonal to the table plane.
  • the rotary pickup is firstly used for supplying electronic components to the main transport path, and conventionally does not form the main transport path, and secondly, it is smaller and lighter than the rotary table.
  • the holding means for holding the electronic component is arranged in parallel to the rotation plane, and the tip of the holding means is always directed outward. That is, the rotary pickup is for supplying electronic components to the rotary table, and the rotary table forms a main conveyance path for the electronic components, which are different in use, type, and size.
  • the transfer device of Patent Document 1 has a pickup unit and a rotary head.
  • the pickup unit and the rotary head are each arranged by extending a plurality of nozzles along the circumference in a direction perpendicular to the circumferential plane.
  • the pickup unit and the rotary head are arranged one above the other so that a part of the outer periphery overlaps, and the electronic parts are delivered at the overlapping part.
  • the pickup unit can reverse the nozzle 180 degrees with horizontal rotation. The reversing process is established by receiving the electronic component below and delivering the electronic component to the upper rotary head.
  • the transfer device of Patent Document 2 three or more rotary tables having different sizes are installed horizontally, and the holding portion extends in a direction perpendicular to the circumferential plane.
  • the rotary table is arranged up and down and has an overlapping portion on a part of the outer periphery.
  • a holding device which is a large rotary table, is arranged horizontally, while an adsorption device, which is a small rotary pickup, is arranged vertically.
  • the suction device is for supplying the electronic component to the holding device, and the holding device receives the electronic component from the supply device and forms the main conveyance path of the electronic component.
  • the type and size are different.
  • this transfer device also has a holding device and a suction device arranged one above the other and has an overlapping portion on a part of the outer periphery.
  • JP 2000-315856 A Japanese Patent No. 2667712 JP 2011-66277 A
  • a type having a plurality of rotary tables and forming one transport path by delivering electronic components at a position where holding parts provided on the rotary table are aligned in a straight line is Overlap occurs on the rotary table.
  • the present invention has been proposed to solve the above-described problems of the prior art, and an object of the present invention is to provide a transfer apparatus capable of achieving both a reduction in size and an increase in processing points.
  • a transfer device for solving the above problems is a transfer device that takes out an electronic component from one container and mounts it on the other container, and holds and detaches one surface of the electronic component at the tip.
  • a rotary pickup of N machines N ⁇ 2 that disposes a plurality of the holding parts around the rotation axis and intermittently rotates the rotation axis by a predetermined angle around the rotation axis so that the tip always faces outward.
  • the rotating shafts are parallel to each other and are arranged adjacent to each other on the same plane, and the tips of the holding portions of both have a common stop position facing each other, and the stop position is transferred and Te, wherein the transferring electronic components, characterized by.
  • the rotary pickup is for supplying the electronic component from the one container to a main conveyance path formed by a turret table, the turret table is excluded, and the rotary pickup itself sets the main conveyance path. And the electronic component may be transported from the one container to the other container.
  • the rotary pickup is arranged in an odd number, and the rotary pickup arranged in correspondence with the one container holds the one surface of the electronic component taken out from the one container and conveys it to the delivery point,
  • the rotary pickup arranged corresponding to the other container may be separated from the other container by holding the opposite surface of the electronic component at the delivery point.
  • the rotary pickups of the N machines may all be vertically placed and have a vertical rotation surface.
  • an advancing / retreating drive unit is further provided to advance the holding unit stopped at the stop position outward in the radial direction away from the rotation shaft at the stop position corresponding to the delivery point.
  • Any one of the holding units that are arranged and face each other at the delivery point may send or pick up the electronic component to be delivered.
  • the advance / retreat drive unit includes a motor that generates a thrust force that advances the holding unit, and the motor decelerates the moving speed of the holding unit to advance as the other holding unit facing each other approaches. It may be.
  • the advancing / retreating drive unit may include a voice coil motor that controls a load applied by the holding unit that moves forward with respect to the electronic component to be delivered.
  • the voice coil motor applies an antagonistic thrust to the holding unit to resist the force received from the holding unit in a state where it has not reached the electronic component to be transferred, and absorbs an impact between the electronic component to be transferred and the holding unit. You may make it do.
  • the advancing / retreating drive unit includes a voice coil motor that provides the holding unit with an antagonistic thrust to a drag received from the holding unit in a state where the electronic component has not reached the transfer target electronic component, and the transfer target electronic component and the holding unit
  • the amount of rotation of the motor for advancing the holding unit may be determined based on a change in behavior of the voice coil motor caused by contact with the motor.
  • the rotary pickups of the N machines may be the same product based on the same design drawing.
  • a common bracket for regulating the position of the rotation shaft of the first and second rotary pickups may be further provided.
  • an odd-numbered one and an even-numbered one may each be provided with a photographing optical system for photographing the appearance of the electronic component.
  • One photographing optical system may photograph five surfaces other than the one surface of the electronic component, and the other photographing optical system may photograph the one surface of the electronic component. Further, one photographing optical system may photograph five surfaces other than the opposite surface of the electronic component, and the other photographing optical system may photograph the opposite surface of the electronic component.
  • the rotary pickup arranged corresponding to the other container is provided with a photographing optical system for photographing the posture of the electronic component so that the position and rotation of the other container are adjusted to the photographed posture. You may make it move and rotate two-dimensionally.
  • the one container and the other container include a wafer sheet, a lead frame, an organic substrate, an inorganic substrate, an adhesive tray, a substrate, a parts feeder, or a tape, tray, or classification bin formed with pockets. Any one or a combination of two types may be used.
  • the rotary pickup arranged corresponding to the other container may be provided with a paste application device for applying an adhesive to the electronic component.
  • the rotary pickup can be downsized, and the rotary pickup can be placed vertically, and the motor can be downsized. Therefore, it leads to further space saving. Furthermore, if the rotary pickup can be miniaturized, the rotational speed of the rotary pickup can be increased, and the conveying speed of the electronic components is improved.
  • FIG. 1 is a front view showing an overall configuration of a transfer apparatus 1 according to the present embodiment.
  • the transfer apparatus 1 takes out the electronic component W from one container 5a, and mounts it on the other container 5b through various processing points.
  • the electronic component W is a component used for an electrical product, and examples thereof include a semiconductor element and a resistor or capacitor other than the semiconductor element.
  • the semiconductor element include discrete semiconductors such as transistors, diodes, LEDs, capacitors, and thyristors, and integrated circuits such as ICs and LSIs.
  • the containers 5a and 5b are, for example, wafer containers, lead frames, organic substrates, inorganic substrates, adhesive trays, substrates, parts feeders, or packing containers such as tapes, trays, and classification bins in which pockets are formed. is there.
  • the electronic component W is taken out from the tray and mounted on the substrate.
  • the transfer device 1 includes two rotary pickups 2a and 2b having a rotation surface perpendicular to the installation surface.
  • the rotary pickups 2a and 2b convey the electronic component W along the outer periphery by intermittent rotation.
  • the two rotary pickups 2a and 2b share the first half and the second half of the transport path of the electronic component W, and form a series of transport paths by the delivery of the electronic component W. That is, the transfer device 1 includes rotary pickups 2a and 2b for supplying electronic components to the main transport path for forming the main transport path.
  • Each rotary pickup 2a, 2b includes a plurality of holding portions 21 for holding and releasing the electronic component W at the tip.
  • the holding portions 21 are installed on the same circumference at equal circumferential positions, extend along the radial direction from the center of the circumference, and are arranged with the tip facing outward in parallel with the circumferential plane. Yes.
  • the rotary pickups 2a and 2b rotate the holding unit 21 holding the electronic component W by a predetermined angle about an axis orthogonal to the radial direction through the circumferential center thereof.
  • Both rotary pickups 2a and 2b are arranged adjacent to each other, but are arranged so that the rotation axes for rotating the holding unit 21 are parallel and the arrangement plane of the holding unit 21 is the same. In other words, there is no overlap between the rotary pickups 2a and 2b. And the position where the holding
  • the holding unit 21 (21a) on the delivery side holds one surface of the electronic component W at its tip. That is, the opposite surface R of the electronic component W is directed to the receiving-side holding portion 21 (21b) facing at the delivery point A.
  • the receiving side holding portion 21 (21b) holds the opposite surface R at the tip, and holds the electronic component W as it is to the other housing 5b as the rotary pickup 2b rotates. That is, the two rotary pickups 2a and 2b are a series of conveyance paths from one container 5a to the other container 5b, and also serve as a front / back reversing mechanism for the electronic component W.
  • all the stop positions other than the delivery point A of the holding unit 21 can be set as processing points of the electronic component W, respectively, because there is no physical obstacle due to the overlap of the rotary pickups 2a and 2b.
  • one stage device 4a, 4b is disposed at one processing point of each rotary pickup 2a, 2b.
  • One stage apparatus 4a moves each electronic component W in the container 5a one by one to the pickup point B by moving in parallel in the XY direction while placing the container 5a from which the electronic component W is taken out.
  • the other stage device 4b moves each mounting location of the electronic component W one by one to the separation point C of the electronic component W by moving the electronic component W in the XY direction while placing the container 5b to be mounted.
  • the pickup point B is the nearest stop position from the housing 5a of the holding unit 21 provided in the rotary pickup 2a that bears the first half of the conveyance path
  • the separation point C is the accommodation of the holding part 21 that is provided in the rotary pickup 2b that bears the second half of the conveyance path. It is the nearest stop position from the body 5b.
  • both rotary pickups 2a and 2b are placed vertically
  • the rotation trajectory of the holding portion 21 is perpendicular to the installation surface
  • the direct locations of both rotary pickups 2a and 2b are the pickup point B and the separation point C, respectively. It has become.
  • the transfer device 1 applies an adhesive such as solder or resin paste to the electronic component W in advance.
  • the transfer device 1 includes a paste application device 3 at one processing point of the rotary pickup 2b in the latter half of the conveyance path.
  • the transfer device 1 inspects the appearance of the six surfaces of the electronic component W being transferred.
  • a photographing optical system 6 for photographing the appearance of an electronic component is disposed at one processing point of each rotary pickup 2a, 2b.
  • the photographing optical system 61 arranged on one rotary pickup 2a guides the five-sided image of the electronic component W to the camera.
  • the other surface is held by the holding portion 21 of the rotary pickup 2a and faces the rotation center side.
  • the imaging optical system 62 disposed on the other rotary pickup 2b is reversed so that the image on the other surface released from the holding unit 21 is guided to the camera.
  • the transfer device 1 checks the posture of the electronic component W immediately before mounting on the other housing 5b, and the housing so that the electronic component W is mounted on the housing 5b in an appropriate posture. Adjust the posture of 5b. That is, the stage device 4b for moving the container 5b on which the electronic component W is to be mounted in the XY direction is capable of ⁇ rotation in the XY plane, and a rotary for mounting the electronic component W on the container 5b.
  • a photographing optical system 63 for photographing the posture of the electronic component W is disposed at one processing point of the pickup 2b.
  • FIG. 2 is a front view of the rotary pickups 2a and 2b
  • FIG. 3 is a side view of the rotary pickups 2a and 2b
  • FIG. 4 is a top view of the rotary pickups 2a and 2b.
  • both rotary pickups 2 a and 2 b are the same product assembled with the same parts based on the same design drawing, and have the same shape, structure, and size. This is because the tips of the holding portions 21 are arranged on the same line with high accuracy at the delivery point A. Since the rotary pickups 2a and 2b are small, they can be placed vertically and have a radius of about 5 cm to 30 cm.
  • the rotary pickups 2a and 2b are arranged at circumferentially equidistant positions around the axis of the shaft frame 22 so that the front end of the holding portion 21 always faces outward. By rotating, the holding part 21 is stopped at each rotation angle all at once.
  • the holding unit 21 is installed on the shaft frame 22 via the movable mechanism 24, and advances and retracts outward along the radial direction of the rotary pickup 2, in other words, away from the center of the rotary pickups 2a and 2b. It is possible.
  • an advance / retreat drive device 25 that provides a propelling force to advance and retreat with respect to the holding unit 21 is disposed at some stopping points of the holding unit 21. Some stop points are a pickup point B, a delivery point A, and a departure point C.
  • the holding unit 21 is, for example, a suction nozzle having an axis along the radial direction of the rotary pickups 2a and 2b.
  • the suction nozzle is a hollow cylinder having an opening at the tip of the nozzle, the tip of the nozzle is directed outward in the radial direction of the pickup, and the inside of the nozzle communicates with the pneumatic circuit of the vacuum generator via a tube.
  • the suction nozzle sucks the electronic component W by generating a negative pressure by a vacuum generator, and separates the electronic component W by generating a vacuum break or generating a positive pressure.
  • the shaft frame 22 is a cylinder that expands in a substantially disk shape at one end, is a support for the holding portion 21, and is connected to the motor 23 to become a rotating shaft.
  • the cylindrical portion of the shaft frame 22 is coaxially fixed to the rotation shaft of the motor 23. Specifically, the rotating shaft of the motor 23 is fitted into the cylindrical portion of the shaft frame 22 and fastened with a bolt or the like.
  • the motor 23 is a servo motor having a rotating shaft, for example, and alternately repeats rotation at a constant angle and stop for a certain time.
  • the motor 23 positions any one of the holding portions 21 at the pickup point B and the separation point C directly below, and positions any one of the holding portions 21 at the right delivery point A.
  • the rotation angle of the motor 23 is equal to the installation angle of the holding unit 21.
  • eight holding portions 21 are arranged at equal circumferential positions, and the installation angle of the holding portion 21 is arranged so that 90 degrees is included in an integral multiple.
  • the holding unit 21 stops at the pickup point B immediately below, the departure point C, and the right delivery point A.
  • the time during which the rotation of the motor 23 is stopped includes the time for picking up the electronic component W, the time for applying the adhesive, the time for photographing the appearance, the time for discharging the defective product, and the mounting time including the stage movement according to the posture. Corresponds to the longest time.
  • the movable mechanism 24 passes a slide shaft 24b through a sleeve 24a fixed to a stay extending around the disk portion of the shaft frame 22 so as to be slidable in the radial direction of the pickup, and the slide shaft 24b.
  • An arm 24c is fixed to the radially outer end of the pickup.
  • the holding part 21 is fixed to the arm 24c.
  • the arm 24c is fixed orthogonally to the slide shaft 24b and extends in parallel with the rotary shafts of the rotary pickups 2a and 2b. One end protrudes from the disk surface of the shaft frame 22, and the other end extends from the disk of the shaft frame 22. It extends to the back side.
  • the holding part 21 extends along the radial direction of the rotary pickups 2a and 2b at one end of an arm 24c protruding from the disk surface of the shaft frame 22.
  • the advancing / retreating drive device 25 is installed at the pick-up point B, the leaving point C, and the delivery point A, and is disposed on the back side of the shaft frame 22 so as to give a propulsive force to the part that extends to the back surface of the arm 24c.
  • the advance / retreat drive device 25 is installed only on one rotary pickup 2b. That is, at the delivery point A, one holding part 21 (21b) is unilaterally picked up for delivery of the electronic component W toward the other holding part 21 (21a). Further, at least at the delivery point A, the advancement speed of the holding portion 21 (21b) is decelerated as it approaches the electronic component W, and further control is performed to reduce the load on the electronic component W so as to approach zero.
  • the advancing / retreating drive device 25 gives a thrust force for moving the holding portion 21 outward in the radial direction of the rotary pickups 2a and 2b and a thrust force for moving the holding portion 21 backward toward the center in the radial direction. More specifically, the holding portion 21 fixed to the arm 24c is advanced by pushing the arm 24c to which the holding portion 21 is fixed outward in the radial direction. Further, by canceling the application of thrust to the arm 24c and exerting a biasing force that returns the slide shaft 24b of the movable mechanism 24 to the center in the radial direction, the arm 24c and the holding portion 21 fixed to the slide shaft 24b are moved backward. .
  • the advance / retreat drive device 25 includes a slide member 250 that can move in the radial direction of the pickup.
  • the slide member 250 is an L-shaped plate member.
  • One flat plate forming the L-shape is a side plate 251 whose plate surface extends in the radial direction of the pickup, and the other flat plate is a ceiling plate 252 extending in the rotation axis direction of the rotary pickups 2a and 2b.
  • the ceiling plate 252 is located closer to the center in the radial direction of the pickup than the side plate 251.
  • the slide member 250 is movable in the pickup radial direction.
  • a single protrusion support plate 253 is connected to the ceiling plate 252 of the slide member 250 via a spring 25b so that the surfaces of the protrusion support plate 253 face each other.
  • the protrusion support plate 253 is located on the outer side in the radial direction of the pickup than the ceiling plate 252, and a protrusion 25 c is provided on the outer surface in the radial direction of the pickup.
  • the protrusion 25c is located immediately above the portion of the arm 24c that extends to the back surface of the shaft frame 22.
  • a propulsion generation source for moving the slide member 250 As a propulsion generation source for moving the slide member 250, a rotary motor 25d, a cylindrical cam 25e, and a cam follower 25f are provided. In addition, a voice coil motor 25g is provided as a thrust generation source for applying a load to the protrusion support plate 253.
  • the cam follower 25f is a cylindrical member, and extends in the direction of the rotation axis of the pickup by being erected on the side plate 251 of the slide member 250.
  • the cylindrical cam 25e has an axis extending in the rotation axis direction of the pickup, and this axis is supported by a position-fixed rotation motor 25d.
  • the circumferential surface is a cam surface, and the circumferential surface of the cam follower 25f is from the radial center side of the pickup.
  • the cam surface is in contact with A bulging portion that enlarges the diameter of the cylindrical cam 25e is formed in part on the cam surface.
  • the cylindrical cam 25e rotates, and the distance between the rotation center of the cylindrical cam 25e and the cam follower 25f increases when the cam follower 25f passes through the bulging portion of the cylindrical cam 25e. Since the cylindrical cam 25e is in contact with the cam follower 25f from the center side in the radial direction of the pickup, the rotation center of the cylindrical cam 25e and the cam follower 25f increase the distance outward in the radial direction of the pickup. Therefore, the cam follower 25f is pushed down outward in the radial direction of the pickup by the cylindrical cam 25e. Since the cam follower 25f is in a fixed relationship with the slide member 250, the slide member 250 is also pushed down outward in the radial direction of the pickup. Eventually, the protrusion 25c abuts on the arm 24c and advances the holding portion 21.
  • the voice coil motor 25g is a linear motor in which current and thrust are in a proportional relationship, and includes a magnet, an annular coil, and a rod connected to the annular coil. A Lorentz force is generated in the annular coil by electromagnetic interaction between the energized annular coil and the magnet, and the rod is advanced from the motor housing.
  • the voice coil motor 25g is fixed to the ceiling plate 252 and is disposed between the ceiling plate 252 and the protrusion support plate 253.
  • the rod extends outward in the radial direction of the pickup, and the tip is connected to the protrusion support plate 253 from the radial center side of the pickup.
  • the voice coil motor 25g When the voice coil motor 25g is driven to apply a thrust force against the sum of the reduction force of the spring 25b and the reaction force received from the arm 24c to the rod, the thrust force is applied to the protrusion support plate 253, the protrusion portion 25c, the arm 24c, and the holding portion. It joins the electronic component W through the tip of 21.
  • a thrust that antagonizes the drag received by the rod in a state where the holding portion 21 has not reached the electronic component W is applied to the rod, an impact that occurs when the holding portion 21 reaches the electronic component W is caused by the rod being buried. Since it is absorbed, a load close to zero can be applied to the electronic component W.
  • the advancing / retreating drive device 25 uses a slide shaft 24b, which fixes the holding portion 21 via the arm 24c, as a thrust generation source for the holding portion 21 to move backward, at the radial center of the rotary pickups 2a, 2b.
  • a spring portion 25h that biases it toward.
  • one end of the spring portion 25h is fixed with the edge of the sleeve 24a included in the movable mechanism 24 as a seating surface.
  • the edge of the sleeve 24a to which the spring portion 25h is fixed is one end on the radial center side of the rotary pickups 2a and 2b.
  • the slide shaft 24b also protrudes from the sleeve 24a toward the center in the radial direction, and a flange 24d is formed at the protruding portion.
  • the other end of the spring portion 25h is fixed to the flange 24d.
  • the spring portion 25h is compressed by reducing the gap between the edge of the sleeve 24a and the flange 24d of the slide shaft 24b.
  • the spring portion 25h releases the urging force accumulated by the compression and holds it at the radial center of the pickup of the rotary pickups 2a and 2b via the arm 24c and the slide shaft 24b.
  • the part 21 is retracted.
  • FIG. 6 is a perspective view showing the bracket 7.
  • the bracket 7 is a flat plate that restrains the positional relationship between the rotary pickups 2a and 2b.
  • the bracket 7 is formed with a fastening region on the back surface for fastening with one surface of the motor 23 of each of the rotary pickups 2a and 2b mated.
  • the bracket 7 has two through holes 71 penetrating the front and back.
  • the through hole 71 is a bearing having approximately the same dimensions as the motor shaft of the rotary pickups 2a and 2b.
  • Both rotary pickups 2a and 2b pass the motor shaft through the corresponding through hole 71, fix the motor 23 in the fastening region, and then fit the shaft frame 22 to which the holding portion 21 is attached from the surface side of the bracket 7 to the motor shaft. Positioning and fixing.
  • the through holes 71 are formed at the same height at regular intervals.
  • the specified interval is a length obtained by adding the planned advance distance of the holding portion 21 and the thickness of the electronic component W to twice the radius of the rotary pickups 2a and 2b. Thereby, both rotary pick-ups 2a and 2b are positioned and supported so that the holding portions 21 stopped just beside abut the nozzle openings with high precision.
  • the amount of advancement of the holding unit 21 by the rotary motor 25d is managed by the encoder, but the point at which the tip of the holding unit 21 contacts the electronic component W, that is, the stop point of the holding unit 21 is received by the rod by the voice coil motor 25g. It is set in advance by detecting the drag. By adjusting the advancement amount of the holding unit 21, the holding unit 21 can be moved at a high speed and an excessive load is not applied to the electronic component W.
  • the holding portion 21b is advanced outward in the radial direction of the pickup at the delivery point A.
  • a thrust that antagonizes the total of the compressive force of the spring 25b and the drag received from the arm 24c is applied to the rod.
  • the rod receives a new drag from the electronic component W and tries to move in the burying direction.
  • the new drag corresponds to the weight of the rod and the frictional force of burial.
  • the moment of movement in the burying direction is detected, and the rotation amount of the rotary motor 25d at the time of detection is stored in association with combination information of the holding portions 21a and 21b facing each other or stop point information such as the delivery point A.
  • the advancement amount adjustment it is not necessary to use the actual electronic component W, and it may be performed using the simulated body.
  • each rotary pickup 2a, 2b has eight holding portions 21 arranged at equal circumferential positions, and the rotary pickup 2a in the first half of the conveyance path is A stage device 4a on which a housing 5a that accommodates an electronic component W is placed is arranged immediately below, and a stage device that has a housing 5b on which the electronic component W is scheduled to be mounted is placed directly below the rotary pickup 2b in the latter half of the transport path. 4b is arranged.
  • Both rotary pickups 2a and 2b rotate counterclockwise. That is, the conveyance path of the electronic component W extends from the pickup point B to the delivery point A counterclockwise, and further extends from the delivery position to the separation point C counterclockwise.
  • the imaging optical system 61 that performs the appearance inspection on the five surfaces of the electronic component W is arranged, with the pickup point B as the first and the stop positions counted in the order of the conveyance path.
  • the seventh is the delivery point A
  • the eighth is an imaging optical system 62 that performs an appearance inspection on the other surface of the electronic component W.
  • a paste application device 3 for applying an adhesive to the electronic component W is disposed.
  • a photographing optical system 63 for photographing the posture of the electronic component W is arranged.
  • a discharge container 8 for discharging defective products is arranged at the twelfth position located immediately before the departure point C.
  • the thirteenth is the departure point C.
  • the stage device 4a carries the electronic component W to the pick-up point B, and the first holding part 21 of the rotary pickup 2a holds the electronic part W. As shown in FIG. 8, the stage device 4a moves the stage in the XY directions. The order in which the electronic component W is moved to the pickup point B follows a control device (not shown).
  • the X-direction moving mechanism moves the stage in one direction by one pitch, and Y The direction moving mechanism does not move the stage.
  • the X-direction moving mechanism moves the stage in the reverse direction for all the columns in order to sequentially move the electronic components W for the next Y row. Move the stage one pitch in one direction.
  • the advancing / retreating drive device 25 lowers the holding unit 21 toward the electronic component W existing at the pickup point B along the radial direction of the rotary pickup 2a.
  • the holding unit 21 is guided in the radial direction of the pickup by the movable mechanism 24.
  • a negative pressure is generated in the nozzle by the vacuum generator, whereby the holding unit 21 holds one surface of the electronic component.
  • the advance / retreat driving device 25 releases the propulsive force that advances the holding unit 21. And the holding
  • the photographic optical system 61 arranges each prism for guiding the five-surface image to the camera around the fifth electronic component W stopped, and an image element such as a CMOS on the extended line of the optical system emitted from the prism.
  • a camera having Further, the photographing optical system 61 has a light source for the electronic component W.
  • the light source has, for example, LEDs arranged in a ring shape, and the light beam passes through the hole.
  • the image of the electronic component W captured by the camera is image-analyzed by an image processing unit (not shown), and the presence or absence of a scratch is determined, and information indicating a non-defective product or a defective product is associated with the determination result.
  • the holding part 21b of the rotary pickup 2b that bears the second half of the transport path goes to pick up the electronic component W.
  • the holding part 21a holding the electronic component W disengages the electronic part W by vacuum break or blow, and the holding part 21b that has been picked up generates a negative pressure in the nozzle by the vacuum generator, and the electronic part W
  • the opposite surface R of the pickup facing outward in the radial direction is held.
  • the advancing / retreating drive device 25 that advances the holding portion 21b controls the advancement speed of the holding portion 21b and the load applied to the electronic component W by the holding portion 21b. That is, the rotary motor 25d of the advance / retreat drive device 25 decreases the rotational speed as the holding portion 21b that is advanced approaches the holding portion 21a that holds the electronic component W, and reduces the advance speed of the holding portion 21b.
  • the advance speed is set to zero. The deceleration may be linear or gradual.
  • the rotary motor 25d of the advance / retreat driving device 25 adjusts the thrust of the voice coil motor 25g so that the load applied to the electronic component W approaches zero.
  • the advance / retreat drive device 25 rotates the cylindrical cam 25e by driving the rotary motor 25d.
  • the swelled portion of the cam surface is passed through the cam follower 25f, and the slide member 250 to which the cam follower 25f is attached is pushed outward in the radial direction.
  • the projection 25c of the projection support plate 253 connected to the slide member 250 comes into contact with the arm 24c at a certain point in time and pushes the holding portion 21b together with the arm 24c.
  • the holding portion 21b is guided by the movable mechanism 24 and advances toward the electronic component W held by the holding portion 21a that is waiting.
  • the rotation motor 25d of the advance / retreat drive device 25 rotates at a high rotational speed so as to move the holding portion 21b at a high speed until the tip of the holding portion 21b reaches immediately before the electronic component W, and reaches the immediately preceding position.
  • the holding portion 21b is rotated at a low rotational speed so as to move at a low speed, and the speed is set to zero when reaching the contact position with the electronic component W.
  • a difference is provided in the torque limit before and after reaching the electronic component W. After the tip of the holding portion 21b reaches immediately before the electronic component W, the restriction is tightened so as to reduce the maximum torque.
  • the rotation amount of the rotary motor 25d linked to stop point information such as the combination information of the holding portions 21a and 21b facing each other or the transfer point A is referred to. This prevents a large load from being applied to the electronic component W.
  • the voice coil motor 25g antagonized the sum of the drag force F1 received by the rod 25i when the unreachable holding portion 21b advances to the electronic component W and the compression force F2 of the spring 25b that supports the protrusion support plate 253. A thrust F is applied to the rod 25i. Thereby, the rod 25i does not advance and is not buried in the casing of the voice coil motor 25g.
  • the voice coil motor 25g absorbs an impact caused by the contact between the holding portion 21b and the electronic component W by the immersion of the rod 25i into the housing. Therefore, the load applied to the electronic component W by the holding portion 21b is considerably reduced.
  • the positions of the holding portions 21a and 21b may be shifted at the delivery point A, and one point may be a fulcrum and the other point may be a power point, causing a rotational moment in the electronic component W.
  • this forward / backward drive device 25 since the load applied to the electronic component W is close to zero, the posture of the electronic component W may be shifted, or in the worst case, the electronic component W may roll over. Can be avoided.
  • both rotary pickups 2a and 2b are the same product and are assembled to a common bracket 7. Therefore, just assembling the rotary pickups 2a and 2b to the bracket 7 completes the positioning of the rotary pickups 2a and 2b, and the holding portions 21a and 21b facing each other at the delivery point A are accurately aligned. ing. Therefore, even the situation where the positions of the holding portions 21a and 21b facing each other are displaced is prevented as much as possible.
  • the advancing / retreating drive device 25 reversely rotates the cylindrical cam 25e by driving the rotary motor 25d, and the cam follower 25f escapes from the bulging portion of the cam surface. Then, the propulsive force to the arm 24c is released.
  • the spring portion 25h is compressed by the advancement of the slide shaft 24b of the movable mechanism 24.
  • a biasing force is exerted to return to the original position, and the slide shaft 24b is moved in the radial direction. Return to the center.
  • the holding portion 21b fixed to the slide shaft 24b via the arm 24c returns to the center direction of the rotary pickup 2b while holding the electronic component W.
  • the appearance of the opposite surface R of the electronic component W that could not be photographed in the first half of the conveyance path is photographed and classified into a non-defective product or a defective product.
  • the rotary pickup 2a that bears the first half of the transport path, one surface is held by the holding unit 21 and faces the center of rotation of the rotary pickup 2a.
  • the electronic component W is automatically reversed by the delivery, so that the opposite surface R that could not be photographed faces outward and can be photographed.
  • the paste applicator 3 stands by with the tip of the stamping pin 31 facing directly above the ninth application point E.
  • the stamping pin 31 is a rod-like member having a tapered tip.
  • the paste application device 3 includes a receiving tray 32 in which an adhesive is stored.
  • the stamping pin 31 is moved into the receiving tray in advance, and the tip of the stamping pin 31 is immersed in the adhesive. Wait at the second application point E.
  • the stamping pin 31 is lowered, and the adhesive is applied to the electronic component W stopped at the application point E.
  • the posture of the electronic component W is confirmed, and the displacement of the electronic component in the XY ⁇ direction is detected.
  • the same photographing optical system 63 as the eighth appearance inspection point D is also arranged at the posture confirmation point F, and the deviation is calculated from the image of the electronic component W.
  • the deviation is calculated by measuring the distance to each point of the electronic component based on one point of the image. Information on the amount of deviation in the XY ⁇ direction is stored in association with the electronic component W.
  • the electronic components determined to be defective are forcibly discharged.
  • a discharge container 8 having an opening in the dropping direction is disposed.
  • the vacuum generator In the appearance inspection, when an electronic component associated with information indicating a defective product is conveyed to the discharge point G, the vacuum generator generates a positive pressure inside the nozzle of the holding unit 21 and holds it. The electronic component is blown off and dropped into the discharge container 8.
  • the stage device 4b carries the mounting portion to the separation point C, and the thirteenth holding part 21 of the rotary pickup 2b separates the electronic component.
  • the stage device 4b moves the stage in the XY direction and rotates it in the ⁇ direction.
  • the movement in the X direction is an amount obtained by adding the stored shift amount in the X direction to one pitch in one direction when an empty mounting location remains in the X row.
  • the movement in the Y direction is an amount obtained by adding the stored shift amount in the Y direction to one pitch in one direction when there is no empty mounting position in the X row.
  • the ⁇ rotation corresponds to the stored shift amount in the ⁇ direction.
  • the stage is moved in the XY direction and ⁇ direction in advance, and when the movement is completed, the advancing / retreating drive device 25 lowers the holding portion 21 located at the thirteenth separation point C, and the electronic component W is moved to the mounting location. Let go.
  • the container 5b mounted on the stage device 4b is the substrate P
  • the surface on which the adhesive is applied faces the substrate P
  • the electronic component W and the substrate P are bonded via the adhesive.
  • the advancing / retreating drive device 25 controls the rotation motor 25d and the voice coil motor 25g to apply a certain load to the electronic component W, and promotes the adhesion between the electronic component W and the substrate P.
  • the transfer device 1 is provided with the two rotary pickups 2a and 2b as the transport path.
  • Both rotary pickups 2a and 2b intermittently rotate by a predetermined angle around the rotation axis so that the tip of the holding portion 21 always faces outward in the radial direction of the pickup.
  • the rotary pickups 2a and 2b are arranged adjacent to each other on the same plane so that their rotation axes are parallel so as not to overlap each other.
  • Both rotary pickups 2a and 2b have a common stop position where the tips of the holding parts 21a and 21b of both the two face each other, and the electronic parts W are delivered as a delivery point A.
  • the rotary pickups 2a and 2b are arranged adjacent to each other on the same plane with the rotation axes parallel so that they do not overlap with each other, so that many processing points can be provided around the rotary pickups 2a and 2b. it can.
  • the processing point is a place where the electronic component W is subjected to various types of processing such as appearance inspection, adhesive application, and posture confirmation.
  • the transfer device 1 does not have such an overlapping portion, and the processing points can be installed at all points except the delivery point A of the rotary pickups 2a and 2b.
  • this transfer apparatus 1 can be provided with many processing points, it is not necessary to increase the diameter of the pickup, and space saving can be realized.
  • the rotary pickup 2 can be downsized, and the rotary pickup 2 can be placed vertically, and the motor 23 can be downsized. Therefore, it leads to further space saving.
  • the rotary pickups 2a and 2b can be downsized, the rotational speed of the rotary pickups 2a and 2b can be increased. Therefore, the conveyance speed of the electronic component W is improved.
  • the transfer process of the electronic component W is also the reversal process of the electronic component W, so that it is not necessary to add a separate reversal process to the transfer process, and the electronic component W can be reversed. Therefore, the conveyance speed of the electronic component W is further improved.
  • Such a double rotary pickup 2a, 2b requires a high degree of alignment.
  • the rotary pickups 2a and 2b are the same product based on the same design drawing, and one common bracket that regulates the position of the rotary shaft of the rotary pickups 2a and 2b. 7 was used.
  • the high-precision positioning of the rotary pickups 2a and 2b can be completed only by fitting the rotary pickups 2a and 2b into the bracket 7, and the holding portion 21 whose front ends face each other at the delivery point A can be easily positioned. Are aligned on the same straight line with high accuracy. Therefore, even if it has the structure which delivers the electronic component W between such rotary pick-up 2a, 2b, the yield of the electronic component W is favorable and it is rich in effectiveness as an apparatus.
  • either one of the holding portions 21 facing each other at the delivery point A sends or picks up the electronic component W to be delivered, and the advance / retreat drive device 25 advances.
  • the moving speed of the holding part 21 is decelerated as it approaches the other holding part 21 facing each other, and the load applied to the electronic component W to be delivered in the holding part 21 to be advanced is controlled.
  • the transfer device 1 can be provided with many processing points if the rotary pickups 2a and 2b are arranged adjacent to each other on the same plane so that the rotary shafts 2a and 2b do not overlap each other. 2b may be placed horizontally so as to be horizontal with the installation surface.
  • processing points in addition to appearance inspection, adhesive application, posture confirmation, forced discharge of defective products, mounting on a substrate, mounting on a board, temperature adjustment such as electrical characteristic inspection, heating or cooling, and extending from the electronic component W.
  • Terminal shape processing, posture correction, marking, and other various types can be provided.
  • an electrostatic suction method in addition to a suction nozzle that sucks and releases the electronic component W by generating and breaking vacuum or generating a positive pressure, an electrostatic suction method, a Bernoulli chuck method, or a chuck that mechanically clamps the electronic component W A mechanism may be arranged.
  • the holding unit 21 installed in the rotary pickups 2a and 2b is not limited to one type, and two types can be arranged.
  • odd-numbered and even-numbered holding units 21 are installed so that every other holding unit 21 of the same type is arranged, and when the first type of electronic component W is supplied, the odd-numbered holding units 21 are arranged.
  • the even-numbered holding unit 21 holds it.
  • the rotary pickups 2a and 2b are rotated by two pitches.
  • the rotary pickups 2a and 2b are rotated by one pitch to obtain the different types. Hold.
  • multi-product / small-volume production when product replacement frequently occurs, the labor of replacing the holding unit 21 depending on the product can be saved, and the production efficiency is improved.
  • the holding part 21b of the rotary pickup 2b responsible for the second half of the transport path picks up the electronic component W, but the holding part of the rotary pickup 2a responsible for the first half of the transport path. It is also possible to adopt a method in which 21a passes the electronic component W. Furthermore, a system in which both move to each other up to an intermediate point may be used. In this case, the advancing / retreating driving device 25 may be disposed at the transfer point A with respect to the rotary pickup 2a that bears the first half of the transport path, or the advancing / retreating driving device 25 may be disposed at both the rotary pickups 2a, 2b.
  • one container 5a is a tray and the other container 5b is a mounting substrate.
  • the present invention is not limited to this, and the tape, on which the tray, the substrate, the wafer sheet, and the pocket are formed, is not limited thereto. Either one or two types of combinations can be adopted.
  • one of the imaging optical systems 6 for appearance inspection employs a system in which 5 surfaces are imaged at a time, it can be divided into several surfaces and arranged at other stop positions.
  • FIG. 11 is a schematic diagram showing another example of the transfer device 1.
  • one container 5 is a wafer sheet.
  • the first lateral stop position opposite to the delivery position of the rotary pickup 2a that bears the first half of the transport path is the first, and both rotary pickups 2a and 2b rotate counterclockwise from the first.
  • a ring holder 50 is disposed in place of the stage at the first stop position, which is a lateral position.
  • a photographing optical system 6 that photographs one surface of the electronic component W facing outward in the radial direction in the rotary pickup 2a that bears the first half of the transport path is disposed.
  • the fifth is the delivery point A.
  • a discharge pipe 80 is disposed at a stop position that is two more clockwise than the first. The electronic parts W that have failed to be transferred at the fifth transfer point A are discharged to the discharge pipe 80. This is because if the holding unit 21 holds the electronic component W, two electronic components W are stacked at the first pickup point B.
  • a photographing optical system 6 for photographing the adhesive application surface of the electronic component W is disposed for application of the adhesive by the paste application device 3 installed in the seventh.
  • the photographing optical system 6 detects the amount of deviation of the electronic component W in the XY ⁇ direction, and corrects the position of the stamping pin 31 according to the amount of deviation.
  • a photographing optical system 6 for performing an appearance inspection on the adhesive application surface is disposed.
  • the photographing optical system 6 inspects the adhesive application surface and the adhesive application mode.
  • an imaging optical system 6 for performing an appearance inspection on the four side surfaces of the electronic component W is disposed.
  • a classification pipe 82 is provided at the tenth stop position instead of the discharge pipe.
  • the classification tube 82 accommodates electronic parts W that are not defective but are not high grade. In each appearance inspection, ranking is performed according to the degree of non-defective electronic components W, and the electronic components W associated with a specified rank are discharged to the classification tube 82 with the holding unit 21 serving as a blower.
  • the eleventh stop position is a stage on which a mounting board such as a lead frame is placed. Defective products that have not been removed in the tenth classification tube 82 and the eleventh stage are dumped into the discharge tube 81 provided in the twelfth. This is because if the adjoining point is the transfer point A and the holding unit 21 holds the electronic component W, two electronic components W are stacked at the transfer point A.
  • the transfer device 1 forms a transport path with two rotary pickups 2.
  • the number of rotary pickups 2 that form the transport path is not limited to two.
  • Machine 4 machines ... N machines (N ⁇ 2).
  • FIG. 12 shows the transfer apparatus 1 in which a transport path is formed by arranging three rotary pickups 2a, 2b, and 2c.
  • the rotary pickups 2a, 2b, and 2c are connected in a vertical arrangement along the same vertical plane.
  • the rotary pickups 2a and 2b at both ends have the same height, and the middle rotary pickup 2c is disposed obliquely above the rotary pickups 2a and 2b at both ends. This is to shorten the arrangement length of the three rotary pickups 2a, 2b, and 2c.
  • the rotary pickup 2a picks up the electronic components W one by one from the wafer ring held by one wafer holder 50a.
  • the middle rotary pickup 2c receives the electronic component W from the rotary pickup 2a and passes it to the rotary pickup 2c.
  • the rotary pickup 2b attaches the electronic component W to the wafer ring 50b held by the other wafer holder.
  • the transfer device 1 is also used as an inspection device for inspecting the external appearance of the electronic component W, and photographing of the electronic component W is performed at a plurality of processing points on the conveyance path formed by the rotary pickups 2a, 2b, and 2c.
  • Optical systems 64 to 67 are arranged.
  • the first imaging optical system 64 is located near the rotary pickup 2a, and is arranged at a first stop where the electronic component W stops first when it is picked up from one ring holder 50a.
  • the first photographing optical system 64 is configured by a mirror and a camera, and determines whether the electronic component W is a non-defective product or a defective product. The electronic component W determined to be defective is quickly removed from the conveyance path.
  • the second imaging optical system 65 is arranged near the rotary pickup 2c and at a second stop where the electronic component W received from the rotary pickup 2a stops first.
  • the second imaging optical system 65 is constituted by a prism and a camera, and measures the positional deviation of the electronic component W in advance for correcting the position of the electronic component W. The position of the electronic component W is corrected based on the measured positional deviation at the stop location immediately after the second stop location.
  • the third imaging optical system 66 is arranged near the rotary pickup 2b and at a third stop where the electronic component W received from the rotary pickup 2c stops first.
  • the third imaging optical system 66 is also composed of a prism and a camera, and determines whether there are any scratches or the like in the transport path of the electronic component W.
  • the electronic component W determined to be a defective product having scratches or the like is detached from the conveyance path without being attached to the wafer ring in the other ring holder 50b.
  • the 4th imaging optical system 67 is arrange
  • the fourth photographing optical system 67 is constituted by a mirror and a camera, and measures a positional shift in the electronic component W in advance for correcting the position where the electronic component W is attached to the wafer ring. Based on the measured positional deviation, the ring holder 50b moves in parallel to adjust the attachment position of the electronic component W.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Specific Conveyance Elements (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'objet de la présente invention est de fournir un dispositif de transfert à la fois compact et présentant davantage de points de traitement. Deux dispositifs de ramassage rotatifs (2) sont fournis en tant de trajet de transport. Les deux dispositifs de ramassage rotatifs (2) sont entraînés en rotation par intermittence selon un angle prédéterminé autour d'un axe de rotation de sorte que les pointes d'unités de support (21) soient toujours dirigées radialement vers l'extérieur des dispositifs de ramassage. Les dispositifs de ramassage rotatifs (2) sont agencés de manière adjacente, coplanaire et avec des axes de rotation parallèles de manière à ne pas se chevaucher. En outre, les deux dispositifs de ramassage rotatifs (2) présentent des positions d'arrêt communes au niveau desquelles les pointes des unités de support (21) des deux dispositifs de ramassage sont opposées les unes aux autres, et des composants électroniques (W) sont transférés avec lesdites positions d'arrêt en tant que points de transfert (A).
PCT/JP2013/060872 2012-12-04 2013-04-10 Dispositif de transfert Ceased WO2014087682A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SG11201504004VA SG11201504004VA (en) 2012-12-04 2013-04-10 Transfer apparatus
JP2013516894A JP5376386B1 (ja) 2012-12-04 2013-04-10 移載装置
KR1020157006101A KR101527106B1 (ko) 2012-12-04 2013-04-10 이재 장치
HK15107355.7A HK1206683B (en) 2012-12-04 2013-04-10 Transfer equipment
CN201380056662.4A CN104768702B (zh) 2012-12-04 2013-04-10 移载装置
TW102144313A TWI505901B (zh) 2012-12-04 2013-12-04 移載裝置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPPCT/JP2012/081412 2012-12-04
PCT/JP2012/081412 WO2014087491A1 (fr) 2012-12-04 2012-12-04 Dispositif de transfert

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Publication Number Publication Date
WO2014087682A1 true WO2014087682A1 (fr) 2014-06-12

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PCT/JP2013/060872 Ceased WO2014087682A1 (fr) 2012-12-04 2013-04-10 Dispositif de transfert

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KR (1) KR101527106B1 (fr)
CN (1) CN104768702B (fr)
MY (1) MY157624A (fr)
SG (1) SG11201504004VA (fr)
TW (1) TWI505901B (fr)
WO (2) WO2014087491A1 (fr)

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WO2017098980A1 (fr) 2015-12-11 2017-06-15 上野精機株式会社 Dispositif de transfert
JP2018533843A (ja) * 2015-10-16 2018-11-15 ミュールバウアー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト 電子構成部品用の構成部品操作装置を自己調整する装置及び方法
KR20190073613A (ko) * 2015-10-16 2019-06-26 뮐바우어 게엠베하 운트 콤파니 카게 부품 핸들링 시스템
WO2020080430A1 (fr) * 2018-10-16 2020-04-23 上野精機株式会社 Unité d'inversion
JP2021111707A (ja) * 2020-01-10 2021-08-02 上野精機株式会社 電子部品の処理装置
WO2022054728A1 (fr) * 2020-09-09 2022-03-17 上野精機株式会社 Dispositif de traitement de composant électronique
JP2022045736A (ja) * 2020-09-09 2022-03-22 上野精機株式会社 回転式部品搬送装置

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JP6164624B1 (ja) * 2016-10-18 2017-07-19 上野精機株式会社 電子部品移動装置及び電子部品搬送装置
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JP7451259B2 (ja) * 2020-03-26 2024-03-18 芝浦メカトロニクス株式会社 電子部品の実装装置
JP6836816B1 (ja) * 2020-05-28 2021-03-03 上野精機株式会社 電子部品の処理装置
CN112938333A (zh) * 2021-02-03 2021-06-11 陈伟 一种环料提升机剔料设备
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WO2014087491A1 (fr) 2014-06-12
SG11201504004VA (en) 2015-06-29
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TWI505901B (zh) 2015-11-01

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