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WO2014067493A1 - 一种新型半导体冷藏暖藏箱及制作方法 - Google Patents

一种新型半导体冷藏暖藏箱及制作方法 Download PDF

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Publication number
WO2014067493A1
WO2014067493A1 PCT/CN2013/086519 CN2013086519W WO2014067493A1 WO 2014067493 A1 WO2014067493 A1 WO 2014067493A1 CN 2013086519 W CN2013086519 W CN 2013086519W WO 2014067493 A1 WO2014067493 A1 WO 2014067493A1
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Prior art keywords
semiconductor
storage box
heat exchanger
warm storage
condenser
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French (fr)
Inventor
刘万辉
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SHEN MAOXIANG
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SHEN MAOXIANG
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators

Definitions

  • the invention relates to a manufacturing method of a novel semiconductor refrigerating warm storage box, in particular to a novel semiconductor refrigerating warm storage box with a large volume storage room.
  • refrigerator products with large-volume storage rooms are basically foamed after the relevant components such as evaporators are installed in the casing during the production process.
  • This process is difficult to industrialize in semiconductor refrigerated warm storage boxes.
  • the primary reason is that the preparation of the foaming of the box is more difficult.
  • the second reason is that the after-sales maintenance service of the semiconductor refrigerated warm storage box thus produced is more difficult.
  • the compressor refrigerator with a large-volume storage room is only The semiconductor refrigerated warm-up box technology that can not be cooled and can be cooled and heated can only meet the basic needs of a small-volume storage room.
  • the object of the present invention is to overcome the shortcomings of the prior art, and to provide a semiconductor refrigerated warm storage box with a simple operation, a difficulty in reducing the foaming preparation work of the box, and a large-volume storage room for reducing the workload of the after-sales maintenance service, and a manufacturing method thereof. Moreover, compared with the semiconductor refrigerated warm storage box without the box bottom machine room manufactured by the prior method, the new semiconductor refrigerated warm storage box has significant progress in cooling efficiency, cooling temperature difference depth and product volume.
  • the main technical solution of the present invention after installing the pre-prepared semiconductor cooling and heating device into the semiconductor refrigeration and heating device studio of the prepared semiconductor refrigerated warm-up box body, and then connecting the semiconductor cooling and heating device with the connecting tube,
  • the composite condenser and the infusion pump constitute a circulating flow path of the liquid refrigerant.
  • a semiconductor refrigerated warm storage box body wherein the refrigerated warm storage box body is assembled by inserting the outer body plate, the inner liner and the related parts into a foaming mold; the semiconductor refrigerated warm storage box The back of the body storage compartment is provided with a semiconductor cooling and heating device working inside and outside, and the bottom of the semiconductor refrigerating and warming box body is a machine room that passes through the front and the back;
  • the internal heat exchanger of one of the semiconductor refrigerating sheet, the outer heat exchanger of one of the metal components of the refrigerating heater, and the metal component of the refrigerating heater are in close contact with each other, and fastened.
  • the connecting member is fixedly composed
  • the semiconductor refrigeration heater is installed in a working chamber of the semiconductor refrigeration heater, and communicates with the external heat exchanger of the semiconductor refrigeration heater, the composite condenser and the infusion pump through a connecting pipe to form a circulating flow path of the liquid refrigerant.
  • the composite condenser is composed of a horizontal composite condenser and a vertical composite condenser, and the horizontal composite condenser and the infusion pump are located in the machine room, and the vertical composite condenser is located in the dual-purpose box. The back of the body.
  • the specific manufacturing method of the present invention includes the following steps:
  • Preparation of semiconductor refrigerated warm storage box body The semiconductor refrigerated warm box outer body plate, inner liner and related parts are assembled and put into foaming mold foaming to prepare a semiconductor refrigerated warm box box, semiconductor
  • the refrigerated warm storage box has a large-volume storage room, and the semiconductor refrigerated storage box storage room
  • the back of the semiconductor refrigeration and heating device is opened inside and outside, and the bottom of the semiconductor refrigerated warm box is a machine room that is connected to the front and back;
  • the new semiconductor refrigerated warm storage box with the machine room at the bottom of the box is compared with the semiconductor refrigerated warm storage box without the bottom bottom machine room manufactured by the prior method.
  • the former In the cooling state, the former is compounded.
  • the temperature difference between the hot end temperature of the condenser and the ambient temperature is less than half of the temperature difference between the hot end temperature of the composite condenser and the ambient temperature, and the heat dissipation effect is remarkably improved.
  • the cooling efficiency of the new semiconductor refrigerated warm box is increased by 3 times.
  • the cooling depth is increased by 30%, and the capacity of the semiconductor refrigerated warm storage box that can be manufactured is increased from 150L to 500L, and all aspects are significantly improved.
  • the 260L large-volume full-glass semiconductor wine developed by us has been rejected by the national daily electrical appliance.
  • the center test, the test result data prove that the technology is at the domestic and international leading level in the application field of semiconductor refrigeration technology.
  • the external name of the national daily electrical appliance testing center is Guangzhou Weikai Testing Technology Co., Ltd., and the test report number is WTS2012-4875.
  • FIG. 1 is a schematic cross-sectional view showing a structure of a novel semiconductor refrigerated warm storage box according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view showing a structure of a novel semiconductor refrigerated warm storage box according to an embodiment of the present invention
  • FIG. 4 is a cross-sectional view showing the structure of an outer heat exchanger of a semiconductor refrigeration heater according to an embodiment of the present invention; wherein: 1. a storage compartment; 2. a machine room; 3. a semiconductor refrigeration and heating device studio; Heat exchanger; 5. Semiconductor refrigeration sheet; 6. External heat exchanger; 7. Internal heat exchange fan; 8. Composite condenser; 9. Horizontal composite condenser; 10. Vertical composite condenser; Infusion pump; 12. External heat exchange fan; 1 3. Rehydration vent; 14. Liquid refrigerant inflow/outlet; 15. Flow path; 16. Semiconductor refrigeration heater.
  • a novel semiconductor refrigerated warm storage box includes:
  • a semiconductor refrigerated warm storage box body wherein the refrigerated warm storage box body is assembled by inserting the outer casing, the inner liner and the related parts into a foaming mold; the semiconductor refrigerating warm storage box
  • the back of the box storage compartment 1 has a semiconductor cooling and heating device 3 that penetrates inside and outside, and the bottom of the semiconductor refrigerated warm box box is a machine room 2 that penetrates front and rear;
  • semiconductor refrigeration heater 16 the semiconductor heat exchanger 5, the outer heat exchanger 6 of one of the refrigeration heater metal components and the inner heat exchanger 4 of one of the refrigeration heater metal components are in close contact with each other in sequence Sticking, fixed by a fastening connector;
  • the semiconductor cooling and heating device 16 is installed in the semiconductor refrigeration and heating device working chamber 3, and communicates with the external heat exchanger 6, the composite condenser 8 and the infusion pump 11 of the semiconductor cooling and heating device 16 through a connecting pipe.
  • a circulating flow path that constitutes a liquid refrigerant.
  • the composite condenser 8 is composed of a horizontal composite condenser 9 and a vertical composite condenser 10, and the horizontal composite condenser 9 and the infusion pump 11 are located in the machine room 3, vertical
  • the composite condenser 10 is located on the back of the dual purpose tank.
  • the horizontal composite condenser 9 is composed of at least one horizontal single layer condenser.
  • the vertical composite condenser 14 is composed of at least one vertical single layer condenser. Further, an external heat exchange fan 12 for improving the heat exchange capability of the horizontal composite condenser 9 and the air is installed beside the horizontal composite condenser 9 in the machine room 3.
  • the outer heat exchanger 6 of the semiconductor cooling and heating device 16 is provided with a liquid refrigerant inflow/outlet port 14 through which the liquid refrigerant passes, and a rehydration and exhaust port 13 , and an S shape in which the liquid refrigerant flows inside the outer heat exchanger 6 Flow path 15.
  • the inner heat exchanger 4 described above is a finned heat exchanger, and the inner heat exchanger abuts the inner heat exchange fan 7.
  • the method according to the present invention can be seen from Fig. 2, the semiconductor refrigerated warm box outer casing, the inner liner and related parts are assembled and put into a foaming mold to foam, and a semiconductor refrigerated warm storage box body is prepared, and the semiconductor refrigerating warm box is heated.
  • the storage box has a large-volume storage room 1
  • the semiconductor refrigerated storage box storage room 1 has a semiconductor cooling and heating device 3 that is open inside and outside.
  • the bottom of the semiconductor refrigerated storage box is front and rear.
  • the machine room 2 as shown in Fig.
  • the heat exchanger 4 of one of the metal cooling fins 5, one of the metal components of the semiconductor refrigerating heater 16, and the heat exchanger 4 of one of the metal components of the semiconductor refrigerating heater 16 are closely arranged.
  • the semiconductor cooling and heating device 16 is assembled by being fastened by a fastening member, and the semiconductor cooling and heating device 16 is mounted in the semiconductor cooling and heating device 3, as shown in FIG. 1, FIG. 2 and FIG.
  • the outer heat exchanger 6, the composite condenser 8, and the infusion pump 11 of the semiconductor refrigeration heater 16 are connected by a connecting pipe to constitute a circulating flow path of the liquid refrigerant.
  • the composite condenser 8 is composed of a horizontal composite condenser 9 and a vertical composite condenser 10, and a horizontal composite condenser 9 and an infusion pump 11 are provided. Placed in the machine room 2 of the new semiconductor refrigerated warm storage box, the vertical composite condenser 10 is placed on the outside of the new semiconductor refrigerated warm storage box.
  • the horizontal composite condenser 9 is composed of one or more horizontal single-layer condensers.
  • the vertical composite condenser 10 is composed of one or more vertical single-layer condensers.
  • an external heat exchange fan 12 for improving the heat exchange capacity of the horizontal composite condenser 9 and the air is installed beside the horizontal composite condenser 9 in the machine room 2.
  • the inner heat exchanger 4 is a finned heat exchanger, and the inner heat exchanger 4 abuts the inner heat exchange fan 7.
  • the outer heat exchanger 6 of the semiconductor refrigeration heater 16 is provided with a liquid refrigerant inflow/outflow port 14 through which the liquid refrigerant passes, and a rehydration exhaust port 13 and an external heat exchanger 6.
  • An S-shaped flow path 15 through which a liquid refrigerant flows is opened inside.
  • the semiconductor cooling and heating device 16 is composed of at least one sub-semiconductor refrigerating heater, and the replenishing and exhausting port 13 is opened on the outer heat exchanger of the sub-semiconductor refrigerating heater having the highest position.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

提供了一种半导体冷藏暖藏箱及其制作方法。半导体冷藏暖藏箱包括有着大容积储藏室（1）及底部机器室（2）的半导体冷藏暖藏箱箱体和半导体制冷制热器（16）。半导体冷藏暖藏箱箱体背部开有内外贯通的半导体制冷制热器工作室（3）。该制作方法包括将半导体制冷制热器（16）安装进半导体制冷制热器工作室（3）之后，再用连接管连通半导体制冷制热器（16）的外换热器（6）、复合式冷凝器（8）及输液泵（11），从而构成液体冷媒的循环流动通路。该制作方法具有操作简便、降低箱体发泡准备工作难度、易于维修等优点。

Description

一种新型半导体冷藏暖藏箱及制作方法 技术领域
本发明涉及一种新型半导体冷藏暖藏箱的制作方法， 特别是一种有着大 容积储藏室的新型半导体冷藏暖藏箱的制作方法。
背景技术
目前有着大容积储藏室的电冰箱类产品， 在制作过程中基本上都是将蒸 发器等相关零部件安装到箱体内后再发泡， 这种工艺方法却难以在半导体冷 藏暖藏箱的工业化中应用， 首要原因是箱体发泡准备工作难度加大， 其次原 因是这样生产的半导体冷藏暖藏箱的售后维修服务工作难度加大， 另外， 目 前有着大容积储藏室的压缩机电冰箱只能制冷不能制热， 而既能制冷又能制 热的半导体冷藏暖藏箱技术却只能满足小容积储藏室的基本需求。
发明内容
本发明的目的是克服已有技术的缺点， 提出一种操作简便， 降低箱体发 泡准备工作难度， 减少产品售后维修服务工作量的大容积储藏室的半导体冷 藏暖藏箱及其制作方法， 而且与以前方法制造的没有箱体底部机器室的半导 体冷藏暖藏箱相比较， 现在这种新型半导体冷藏暖藏箱在制冷效率、 制冷温 差深度及产品容积都要有显著进步。
本发明的主要技术方案： 将预先制备好的半导体制冷制热器安装进制备 好的半导体冷藏暖藏箱箱体的半导体制冷制热器工作室以后， 再用连接管连 通半导体制冷制热器、 复合式冷凝器及输液泵， 构成液体冷媒的循环流动通 路。
本发明所指的一种新型半导体冷藏暖藏箱， 其特征在于包括：
1、 半导体冷藏暖藏箱箱体， 所述冷藏暖藏箱箱体由箱体外板、 内胆及相 关零部件组装完毕后装进发泡模具发泡成型的整体； 半导体冷藏暖藏箱箱体 储藏室背部开有内外贯通的半导体制冷制热器工作室， 半导体冷藏暖藏箱箱 体底部是前后贯通的机器室；
2、 半导体制冷制热器： 由半导体制冷片、 制冷制热器金属组件之一的外 换热器及制冷制热器金属组件之一的内换热器按序紧密接触相贴， 用紧固连 接件固定组成；
3、 所述半导体制冷制热器安装在半导体制冷制热器工作室内， 通过连接 管连通半导体制冷制热器的外换热器、 复合式冷凝器及输液泵， 构成液体冷 媒的循环流动通路。
4、 所述复合式冷凝器由水平复合式冷凝器和竖直复合式冷凝器相互连通 组合而构成， 水平复合式冷凝器及输液泵位于机器室内， 竖直复合式冷凝器 位于两用箱箱体背面。
本发明的具体制作方法包括以下步骤：
1.制备半导体冷藏暖藏箱箱体： 将半导体冷藏暖藏箱箱体外板、 内胆及 相关零部件组装完毕并装进发泡模具发泡， 制备成半导体冷藏暖藏箱箱体， 半导体冷藏暖藏箱箱体有一个大容积储藏室， 半导体冷藏暖藏箱箱体储藏室 背部开有内外贯通的半导体制冷制热器工作室， 半导体冷藏暖藏箱箱体底部 是前后贯通的机器室；
2.制备半导体制冷制热器： 将半导体制冷片，半导体制冷制热器金属组件 之一的外换热器及半导体制冷制热器金属组件之一内换热器按序紧密接触相 贴， 用紧固连接件固定， 组成半导体制冷制热器；
3.组装： 将半导体制冷制热器安装进半导体制冷制热器工作室以后， 再 用连接管连通半导体制冷制热器的外换热器、 复合式冷凝器及输液泵， 构成 液体冷媒的循环流动通路。
对试验样机的测试结果进行比较， 有箱体底部机器室的新型半导体冷藏 暖藏箱与以前方法制造的没有箱体底部机器室的半导体冷藏暖藏箱相比较， 在制冷状态时， 前者复合式冷凝器的热端温度与环境温度的温差比后者复合 式冷凝器的热端温度与环境温度的温差小一半， 散热效果显著提高， 现在这 种新型半导体冷藏暖藏箱制冷效率提高了 3倍， 制冷深度提高 30% , 可以制造 的半导体冷藏暖藏箱产品容积由 150L左右提高到 500L左右，各方面都显著大 进步， 我们开发的 260L大容积全玻璃门半导体酒拒经国家日用电器检测中心 检测， 检测结果数据证明该技术处于半导体制冷技术应用领域的国内外领先 水平， 国家日用电器检测中心对外名称是广州威凯检测技术有限公司， 检测 才艮告编号是 WTS2012-4875。
附图说明：
图 1是本发明实施例中新型半导体冷藏暖藏箱组装结构剖视示意图； 图 2是本发明实施例中新型半导体冷藏暖藏箱箱体结构剖视示意图； 图 3是本发明实施例中半导体制冷制热器、 复合式冷凝器及输液泵连通方 案示意图；
图 4是本发明实施例中半导体制冷制热器的外换热器的结构剖视示意图； 图中： 1.储藏室； 2.机器室； 3.半导体制冷制热器工作室； 4.内换热器； 5. 半 导体制冷片； 6.外换热器； 7.内换热风扇； 8.复合式冷凝器； 9.水平复合式 冷凝器； 10.竖直复合式冷凝器； 11.输液泵； 12.外换热风机； 1 3.补液排气 口； 14.液体冷媒流入 /流出口； 15.流动通路； 16.半导体制冷制热器。
具体实施方式
下面结合附图对本发明做进一步说明： 参见附图： 图中的 1、 一种新型半 导体冷藏暖藏箱包括：
1 )、 半导体冷藏暖藏箱箱体， 所述冷藏暖藏箱箱体由箱体外板、 内胆及 相关零部件组装完毕后装进发泡模具发泡成型的整体； 半导体冷藏暖藏箱箱 体储藏室 1背部开有内外贯通的半导体制冷制热器工作室 3 , 半导体冷藏暖藏 箱箱体底部是前后贯通的机器室 2 ;
2 )、 半导体制冷制热器 16 : 由半导体制冷片 5、 制冷制热器金属组件之 一的外换热器 6及制冷制热器金属组件之一的内换热器 4按序紧密接触相贴， 用紧固连接件固定组成；
3 )、 所述半导体制冷制热器 16安装在半导体制冷制热器工作室 3内， 通 过连接管连通半导体制冷制热器 16的外换热器 6、 复合式冷凝器 8及输液泵 11 , 构成液体冷媒的循环流动通路。
4 )、 所述复合式冷凝器 8由水平复合式冷凝器 9和竖直复合式冷凝器 1 0相 互连通组合而构成， 水平复合式冷凝器 9及输液泵 11位于机器室 3内， 竖直复 合式冷凝器 10位于两用箱箱体背面。
所述水平复合式冷凝器 9由至少一个水平单层冷凝器连通组成。
进一步， 所述竖直复合式冷凝器 14由至少一个竖直单层冷凝器连通组成。 更进一步， 机器室 3内的水平复合式冷凝器 9旁边安装有可提高水平复合 式冷凝器 9与空气换热能力的外换热风机 12。
所述半导体制冷制热器 16的外换热器 6上开有液体冷媒通过的液体冷媒 流入 /流出口 14及补液排气口 1 3，外换热器 6内部开有液体冷媒流动的 S形状的 流动通路 15。
上述内换热器 4是翅片式换热器， 内换热器紧靠内换热风扇 7。
本发明涉及的方法由图 2可知， 将半导体冷藏暖藏箱箱体外板、 内胆及相 关零部件组装完毕并装进发泡模具发泡， 制备半导体冷藏暖藏箱箱体， 半导 体冷藏暖藏箱箱体有一个大容积的储藏室 1 , 半导体冷藏暖藏箱箱体储藏室 1 背部开有内外贯通的半导体制冷制热器工作室 3 , 半导体冷藏暖藏箱箱体底部 是前后贯通的机器室 2 ; 由图 1可知， 将半导体制冷片 5，半导体制冷制热器 16 金属组件之一的外换热器 7及半导体制冷制热器 16金属组件之一内换热器 4按 序紧密接触相贴， 用紧固连接件固定， 组成半导体制冷制热器 16 ; 结合图 1、 图 2及图 3所示， 将半导体制冷制热器 16安装进半导体制冷制热器工作室 3以 后， 再用连接管连通半导体制冷制热器 16的外换热器 6、 复合式冷凝器 8及输 液泵 11 , 构成液体冷媒的循环流动通路。
如图 1、 图 3所示本发明技术方案中， 复合式冷凝器 8由水平复合式冷凝器 9和 竖直复合式冷凝器 10相互连通组合而构成， 水平复合式冷凝器 9及输液泵 11被 置于新型半导体冷藏暖藏箱的机器室 2内， 竖直复合式冷凝器 1 0被置于新型半 导体冷藏暖藏箱外背面。
本发明技术方案中， 水平复合式冷凝器 9由一个或一个以上的水平单层冷凝器 连通组成。
本发明技术方案中， 竖直复合式冷凝器 10由一个或一个以上的竖直单层冷凝 器连通组成。
如图 1所示本发明技术方案中， 机器室 2内的水平复合式冷凝器 9旁边安装有可 提高水平复合式冷凝器 9与空气换热能力的外换热风机 12。
如图 1所示本发明技术方案中， 内换热器 4是翅片式换热器， 内换热器 4紧靠内 换热风扇 7。
如图 4所示本发明技术方案中， 半导体制冷制热器 16的外换热器 6上开有液体 冷媒通过的液体冷媒流入 /流出口 14及补液排气口 1 3，外换热器 6内部开有液 体冷媒流动的 S形状的流动通路 15。
本发明技术方案中， 半导体制冷制热器 16是由至少一个子半导体制冷制热器 组成， 补液排气口 1 3开在位置最高的子半导体制冷制热器的外换热器上。

Claims

权利要求
1、 一种新型半导体冷藏暖藏箱， 其特征在于包括：
1)、 半导体冷藏暖藏箱箱体， 所述冷藏暖藏箱箱体由箱体外板、 内胆及相关 零部件组装完毕后装进发泡模具发泡成型的整体；半导体冷藏暖藏箱箱体储藏室
(1 ) 背部开有内外贯通的半导体制冷制热器工作室 （ 3)， 半导体冷藏暖藏箱箱 体底部是前后贯通的机器室 （2);
2)、 半导体制冷制热器 （16): 由半导体制冷片 （5)、 制冷制热器金属组件 之一的外换热器（ 6 )及制冷制热器金属组件之一的内换热器（ 4 )按序紧密接触 相贴， 用紧固连接件固定组成；
3 )、 所述半导体制冷制热器（ 16 )安装在半导体制冷制热器工作室（ 3 ) 内， 通过连接管连通半导体制冷制热器 （16) 的外换热器 （6)、 复合式冷凝器 （8) 及输液泵（11)， 构成液体冷媒的循环流动通路。
4)、 所述复合式冷凝器 （8) 由水平复合式冷凝器 （9) 和竖直复合式冷凝器 (10)相互连通組合而构成，水平复合式冷凝器（9)及输液泵 (11)位于机器室（3) 内， 竖直复合式冷凝器 （10) 位于两用箱箱体背面。
2、 如权利要求 1所述一种新型半导体冷藏暖藏箱， 其特征是： 水平复合式冷 凝器 （9) 由至少一个水平单层冷凝器连通組成。
3、 如权利要求 1所述一种新型多功能半导体冷藏暖藏两用箱， 其特征是： 竖 直复合式冷凝器 （14) 由至少一个竖直单层冷凝器连通組成。
4、 如权利要求 1所述一种新型半导体冷藏暖藏箱， 其特征是： 机器室 （3) 内的水平复合式冷凝器 （9) 旁边安装有可提高水平复合式冷凝器 （9) 与空气换 热能力的外换热风机 （12)。
5、 如权利要求 1所述一种新型半导体冷藏暖藏箱， 其特征是： 半导体制冷制 热器 （16) 的外换热器 （6) 上开有液体冷媒通过的液体冷媒流入 /流出口 （14) 及补液排气口 （13) ，外换热器 （6) 内部开有液体冷媒流动的 S形状的流动通路
(15)。
6、 如权利要求 1所述一种新型半导体冷藏暖藏箱， 其特征是： 内换热器（4) 是翅片式换热器， 内换热器紧靠内换热风扇 （7)。
7、 一种新型半导体冷藏暖藏箱的制作方法， 其特征在于制备过程包括以下 步骤：
IX 制备半导体冷藏暖藏箱箱体： 将箱体外板、 内胆及相关零部件组装完毕 并装进发泡模具发泡， 制备成半导体冷藏暖藏箱箱体， 半导体冷藏暖藏箱箱体储 藏室 （1 ) 背部开有内外贯通的半导体制冷制热器工作室 （3)， 半导体冷藏暖藏 箱箱体底部是前后贯通的机器室 （2); 2 )、 制备半导体制冷制热器（16 ): 将半导体制冷片 （5 )、 制冷制热器金属 组件之一的外换热器（ 6 )及制冷制热器金属组件之一的内换热器（ 4 )按序紧密 接触相贴， 用紧固连接件固定， 组成半导体制冷制热器（16 );
3 )、 组装： 将半导体制冷制热器（ 16 )安装进半导体制冷制热器工作室（ 3 ) 以后， 再用连接管连通半导体制冷制热器（ 16 )的外换热器（ 6 ), 复合式冷凝器 ( 8 )及输液泵（ 11 )， 构成液体冷媒的循环流动通路。
8、 如权利要求 7所述一种新型半导体冷藏暖藏箱的制作方法， 其特征是： 复 合式冷凝器（ 8 )由水平复合式冷凝器（ 9 )和竖直复合式冷凝器（ 10 )相互连通 组合而构成， 水平复合式冷凝器（9 )及输液泵（11)被置于新型半导体冷藏暖藏 箱的机器室 （2 ) 内， 竖直复合式冷凝器（10 )被置于新型半导体冷藏暖藏箱外 背面。
9、 如权利要求 1所述一种新型半导体冷藏暖藏箱的制作方法， 其特征是： 水 平复合式冷凝器（9 ) 由一个或一个以上的水平单层冷凝器连通组成。
10、 如权利要求 7所述一种新型半导体冷藏暖藏箱的制作方法， 其特征是： 竖直复合式冷凝器（10 ) 由一个或一个以上的竖直单层冷凝器连通组成。
11、 如权利要求 7所述一种新型半导体冷藏暖藏箱的制作方法， 其特征是： 机器室（ 2 )内的水平复合式冷凝器（ 9 )旁边安装有可提高水平复合式冷凝器（ 9 ) 与空气换热能力的外换热风机（12 )。
12、 如权利要求 7所述一种新型半导体冷藏暖藏箱的制作方法， 其特征是： 内换热器（4 )是翅片式换热器， 内换热器紧靠内换热风扇 （7 )。
13、 如权利要求 7所述一种新型半导体冷藏暖藏箱的制作方法， 其特征是： 半导体制冷制热器（ 16 )的外换热器（ 6 )上开有液体冷媒通过的液体冷媒流入 / 流出口 （I4 )及补液排气口 （I 3 )，外换热器（6 ) 内部开有液体冷媒流动的 S形 状的流动通路（15 )。
14、 如权利要求 7所述一种新型半导体冷藏暖藏箱的制作方法， 其特征是： 半导体制冷制热器（ 16 )是由至少一个子半导体制冷制热器组成，补液排气口（ 1 3 ) 开在位置最高的子半导体制冷制热器的子外换热器上。
PCT/CN2013/086519 2012-11-05 2013-11-04 一种新型半导体冷藏暖藏箱及制作方法 Ceased WO2014067493A1 (zh)

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