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WO2014067492A1 - 一种新型多功能半导体冷藏暖藏两用箱及制作方法 - Google Patents

一种新型多功能半导体冷藏暖藏两用箱及制作方法 Download PDF

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Publication number
WO2014067492A1
WO2014067492A1 PCT/CN2013/086518 CN2013086518W WO2014067492A1 WO 2014067492 A1 WO2014067492 A1 WO 2014067492A1 CN 2013086518 W CN2013086518 W CN 2013086518W WO 2014067492 A1 WO2014067492 A1 WO 2014067492A1
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Prior art keywords
semiconductor refrigeration
heat exchanger
heating device
outdoor heat
condenser
Prior art date
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Ceased
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PCT/CN2013/086518
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English (en)
French (fr)
Inventor
刘万辉
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SHEN MAOXIANG
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SHEN MAOXIANG
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Publication date
Application filed by SHEN MAOXIANG filed Critical SHEN MAOXIANG
Priority to US14/440,547 priority Critical patent/US9673126B2/en
Publication of WO2014067492A1 publication Critical patent/WO2014067492A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H10W40/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids

Definitions

  • the invention relates to a semiconductor refrigerated warm storage box and a manufacturing method thereof, in particular to a novel multifunctional semiconductor refrigerating and warming dual-purpose box having two independent storage rooms and a manufacturing method thereof.
  • the evaporator and other related components are basically installed in the box and then foamed. This method is difficult to be used in the multifunctional semiconductor refrigerating and warming.
  • the main reason for the application of the industrialization of the box is that the difficulty in preparing the foaming of the box is increased.
  • the second reason is that the after-sales maintenance service of the multifunctional semiconductor refrigerated warm-up dual-use box is more difficult.
  • the object of the present invention is to overcome the shortcomings of the prior art, and to provide a novel multifunctional refrigerator refrigerated warm-up dual-use box which is simple in operation, reduces the difficulty of foaming preparation of the cabinet, and reduces the workload of the after-sales maintenance service of the product.
  • the main technical solution of the present invention After installing the pre-prepared semiconductor cooling and heating device into the working chamber of each room of the prepared multi-functional semiconductor refrigerating and warming dual-purpose box, the connecting tube is used to connect the semiconductor cooling and heating The device, the composite condenser and the infusion pump constitute a circulating flow path of the liquid refrigerant.
  • the invention relates to a novel multifunctional semiconductor refrigerating and warming dual-purpose box, characterized in that:
  • a dual-purpose box body wherein the dual-purpose box body is assembled into a foaming mold by assembling the outer plate, the inner liner and the related parts, and the dual-purpose box body has two separate parts.
  • the upper chamber (1) has an upper chamber working inside and outside
  • the lower chamber has a lower chamber working inside and outside.
  • the bottom of the dual-use box is Machine room that runs through before and after;
  • semiconductor refrigeration heater including upper compartment semiconductor refrigeration heater and lower compartment semiconductor refrigeration heater (21), wherein the upper compartment semiconductor refrigeration heater is installed in the upper compartment working chamber The outdoor heat exchanger, the semiconductor refrigeration sheet and the upper indoor heat exchanger are arranged in close contact with each other in close contact; the lower compartment semiconductor refrigeration heater is installed by the lower outdoor heat exchanger installed in the lower chamber working chamber, The other semiconductor refrigeration sheet and the lower indoor heat exchanger are arranged in close contact with each other in close contact;
  • the upper outdoor heat exchanger and the lower outdoor heat exchanger are connected to the composite condenser and the infusion pump through a pipeline to form a circulating flow path of the liquid refrigerant;
  • the composite condenser is composed of a horizontal composite condenser and a vertical composite condenser, wherein the horizontal composite condenser and the infusion pump are located in the machine room, and the vertical composite condenser is located in the dual-purpose box. The back of the cabinet.
  • the manufacturing method of a novel multifunctional semiconductor refrigerating and warming dual-purpose box referred to in the present invention comprises the following steps:
  • the two-in-one box outer plate, inner liner and related parts are assembled and assembled.
  • the foaming mold is foamed and prepared into a dual-purpose box body.
  • the dual-purpose box body has two separate upper and lower compartments, and the upper compartment has an upper and a lower chamber working inside and outside.
  • the back chamber of the room has a lower chamber working inside and outside, and the bottom of the dual-purpose box is a machine room that runs through the front and back.
  • a semiconductor refrigeration heater an upper chamber heat exchange of one of a semiconductor refrigeration sheet, an upper outdoor heat exchanger of one of the upper compartment refrigeration heater metal components, and one of the upper compartment refrigeration heater metal components
  • the device is closely contacted and attached to each other, and is fastened by a fastening member to form an upper compartment semiconductor cooling and heating device; the lower outdoor heat exchanger of the semiconductor refrigeration chip, the lower compartment refrigeration heater metal component and the lower
  • the lower indoor heat exchanger of one of the metal components of the intercooling and heating device is closely contacted and closely attached, and is fixed by a fastening member to form a lower compartment semiconductor cooling and heating device.
  • connection tube After installing the upper compartment semiconductor cooling heater into the upper chamber studio and the lower compartment semiconductor cooling heater into the lower chamber, the connection tube is used to connect the upper chamber to the semiconductor refrigeration system.
  • the upper outdoor heat exchanger of the heat exchanger, the lower outdoor heat exchanger of the lower compartment semiconductor refrigeration heater, the composite condenser and the infusion pump constitute a circulating flow path of the liquid refrigerant.
  • the new multi-functional semiconductor refrigerating and warming dual-purpose box is now in the cooling efficiency and the cooling temperature difference depth. And the product volume has to be significantly improved.
  • the test results of the test sample are compared.
  • the temperature difference d, half, the heat dissipation effect is significantly improved, and now the new multi-functional semiconductor refrigerated warm-up dual-use box has a three-fold improvement in cooling efficiency and a 30% increase in the cooling depth.
  • the multifunctional semiconductor refrigerated warm-up dual-use box product can be manufactured.
  • the volume has been increased from about 100L to about 500L, and all aspects have been significantly improved.
  • Door Semiconductor Wine Rejection The National Daily Electrical Appliance Testing Center's inspection
  • the national daily electrical appliance testing center's external name is Guangzhou Weikai Testing Technology Co., Ltd., and the test report number is WTS2012-4875.
  • FIG. 1 is a schematic cross-sectional view showing an assembly structure of a novel multifunctional semiconductor refrigerating and warming dual-use box
  • FIG. 2 is a schematic cross-sectional view of a novel multifunctional semiconductor refrigerating and warming dual-purpose box
  • FIG. 3 is a schematic diagram of a connection scheme between an upper outdoor heat exchanger, a lower outdoor heat exchanger, a composite condenser, and an infusion pump of an upper compartment semiconductor refrigeration heater in an upper compartment semiconductor refrigeration heater according to the technical solution of the present invention
  • FIG. 4 is a schematic cross-sectional view showing the structure of an upper outdoor heat exchanger in the technical solution of the present invention
  • FIG. 5 is a schematic cross-sectional view showing the structure of a lower outdoor heat exchanger in the technical solution of the present invention.
  • the novel multifunctional semiconductor refrigerated warm-up dual-use box includes:
  • a dual-purpose box body wherein the dual-purpose box body is assembled into a foaming mold by assembling the outer plate, the inner liner and the related parts, and the dual-purpose box body has two separate parts.
  • upper compartment 1 and lower compartment 2 upper compartment (1) has an upper compartment chamber 4 with internal and external passages on the back, and a lower compartment studio 5 with internal and external passages on the back of the lower compartment 2, dual-use
  • the bottom of the box body is a machine room 3 that runs through the front and back;
  • a semiconductor refrigeration heater comprising an upper compartment semiconductor refrigeration heater 20 and a lower compartment semiconductor refrigeration heater 21, wherein the upper compartment semiconductor refrigeration heater 20 is installed in the upper compartment chamber 4
  • the upper outdoor heat exchanger 8, the semiconductor refrigerating sheet 7 and the upper indoor heat exchanger 6 are arranged in close contact with each other in close contact;
  • the lower compartment semiconductor cooling and heating device 21 is installed in the lower chamber working chamber 5
  • the lower outdoor heat exchanger 11, the other semiconductor refrigerating sheet 10 and the lower indoor heat exchanger 9 are arranged in close contact with each other in close contact; 3), the upper outdoor heat exchanger 8, and the lower outdoor
  • the heat exchanger 11 is connected to the composite condenser (12) and the infusion pump 15 through a pipeline to constitute a circulating flow path of the liquid refrigerant;
  • the composite condenser 12 is composed of a horizontal composite condenser 13 and a vertical composite condenser 14 connected to each other, and the horizontal composite condenser 13 and the infusion pump 15 are located in the machine room 3, and the vertical composite The condenser 14 is located on the back of the dual purpose tank.
  • the horizontal composite condenser 13 described above is composed of at least one horizontal single layer condenser.
  • the vertical composite condenser 14 is composed of at least one vertical single layer condenser.
  • An external heat exchange fan 16 for improving the heat exchange capacity of the horizontal composite condenser 13 and the air is installed beside the horizontal composite condenser 13 in the machine room 3.
  • the upper outdoor heat exchanger 8 has a liquid refrigerant inflow/outlet port 18 and an S-shaped flow passage 19; and the upper outdoor heat exchanger 8 has a liquid replacement exhaust port 17 therein.
  • the above-mentioned new multifunctional semiconductor refrigerated warm-up dual-use box is manufactured as follows:
  • the outer casing, the inner liner and the related components of the dual-purpose box are assembled and filled into a foaming mold to be foamed, and are prepared into a dual-purpose box body, and the dual-purpose box body has two independent ones.
  • the upper compartment 1 and the lower compartment 2 the upper compartment 1 has an upper compartment chamber 4 which is internally and externally connected, and the lower compartment 2 has a lower compartment studio 5 which is open inside and outside, and a bottom of the dual-purpose compartment It is a machine room 3 that penetrates front and rear; as shown in Fig.
  • the upper indoor heat exchanger 6 is in close contact with each other in sequence, and is fixed by a fastening member to form an upper compartment semiconductor cooling and heating device 20, and one of the semiconductor refrigeration sheet 10 and the lower compartment cooling and heating metal component.
  • the lower indoor heat exchanger 11 of the lower outdoor heat exchanger 11 and the lower compartment refrigeration heater metal assembly are closely contacted and closely attached, and are fastened by fastening connectors to form a lower compartment semiconductor cooling and heating 21; in combination with FIG. 1 and FIG.
  • the upper compartment semiconductor cooling heater 20 is mounted on Room studio 4 and lower room semi-conductor After the body cooling and heating device 21 is installed in the lower chamber working chamber 5, the upper and lower outdoor heat exchangers 8 and the lower chamber semiconductor cooling and heating device 21 of the upper chamber semiconductor cooling and heating device 20 are connected by a connecting tube.
  • the outdoor heat exchanger 11, the composite condenser 12, and the infusion pump 15 constitute a circulating flow path of the liquid refrigerant.
  • the lower outdoor heat exchanger 11 of the lower compartment semiconductor cooling and heating device 21, and the upper outdoor heat exchanger 8 of the upper compartment semiconductor cooling and heating device 20 are circulating flow paths that are sequentially connected in series to form a liquid refrigerant.
  • the composite condenser 12 is composed of a horizontal composite condenser 13 and a vertical composite condenser 14 connected to each other, and the horizontal composite condenser 13 and the infusion pump 15 are provided.
  • the vertical composite condenser 14 is placed in the machine compartment 3 of the new multifunctional semiconductor refrigerated warm-up compartment, and the vertical composite condenser 14 is placed on the outer back of the new multifunctional semiconductor refrigerated warm-up compartment.
  • the horizontal composite condenser 13 is composed of one or more horizontal single-layer condensers.
  • the vertical composite condenser 14 is composed of one or more vertical single-layer condensers.
  • an external heat exchange fan 16 for improving the heat exchange capacity of the horizontal composite condenser 13 and the air is installed beside the horizontal composite condenser 13 in the machine room 3.
  • the upper outdoor heat exchanger 8 is provided with a liquid refrigerant upper chamber inflow/outlet 18 through which the liquid refrigerant passes, and the upper outdoor heat exchanger 8 has a liquid refrigerant flowing therein.
  • the shape of the flow passage 19, the upper outdoor heat exchanger 8 is provided with a fluid replacement vent 17.
  • the lower outdoor heat exchanger 11 is provided with a liquid refrigerant lower chamber inflow/outlet 22 through which the liquid refrigerant passes, and the lower outdoor heat exchanger 11 has a liquid refrigerant flowing therein. Shaped flow path 23.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical & Material Sciences (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种多功能半导体冷藏暖藏两用箱及其制作方法。多功能半导体冷藏暖藏两用箱包括有两个独立的上间室（1）、下间室（2）及底部机器室（3）的两用箱箱体、上间室半导体制冷制热器（20）及下间室半导体制冷制热器（21）。其制作方法包括将上间室半导体制冷制热器（20）安装进上间室工作室（4），以及将下间室半导体制冷制热器（21）安装进下间室工作室（5）以后，再用连接管连通上间室半导体制冷制热器（20）、下间室半导体制冷制热器（21）、复合式冷凝器（12）和输液泵（15），构成液体冷媒的循环流动通路。该制作方法操作简便，能降低发泡难度，便于维修。

Description

一种新型多功能半导体冷藏暖藏两用箱及制作方法
技术领域
本发明涉及一种半导体冷藏暖藏箱及其制作方法， 特别是一种有着两个独立 的储藏室的新型多功能半导体冷藏暖藏两用箱及其制作方法。
背景技术
目前具有两个间室的电水箱类产品， 在制作过程中基本上都是将蒸发器等相 关零部件安装到箱体内后再发泡，这种工艺方法却难以在多功能半导体冷藏暖藏 两用箱的工业化中应用， 首要原因是箱体发泡准备工作难度加大， 其次原因是多 功能半导体冷藏暖藏两用箱的售后维修服务工作难度加大。
发明内容
本发明的目的是克服已有技术的缺点， 提出一种操作简便， 降低箱体发泡准 备工作难度，减少产品售后维修服务工作量的新型多功能半导体冷藏暖藏两用箱 及其制作方法。
本发明的主要技术方案： 将预先制备好的半导体制冷制热器安装进制备好的 多功能半导体冷藏暖藏两用箱箱体各间室的工作室以后，再用连接管连通半导体 制冷制热器、 复合式冷凝器及输液泵， 构成液体冷媒的循环流动通路。
本发明所指的一种新型多功能半导体冷藏暖藏两用箱， 其特征在于： 包括
1 )、 两用箱箱体， 所述两用箱箱体为其外板、 内胆及相关零部件组装完毕后 装进发泡模具发泡成型的整体， 两用箱箱体有两个分别独立的上间室和下间室， 上间室（1)背部开有内外贯通的上间室工作室， 下间室背部开有内外贯通的下间 室工作室， 两用箱箱体底部是前后贯通的机器室；
2 )、 半导体制冷制热器： 包括上间室半导体制冷制热器和下间室半导体制冷 制热器（21)，其中上间室半导体制冷制热器由在上间室工作室内安装的上间室外 换热器、半导体制冷片及上间室内换热器按序紧密接触相贴固定连接后构成； 下 间室半导体制冷制热器由在下间室工作室内安装的下间室外换热器、另一半导体 制冷片及下间室内换热器按序紧密接触相贴固定连接后组成；
3 )、所述上间室外换热器、下间室外换热器通过管道连接复合式冷凝器及输 液泵， 构成液体冷媒的循环流动通路；
4 )、 所述复合式冷凝器由水平复合式冷凝器和竖直复合式冷凝器相互连通组 合而构成， 水平复合式冷凝器及输液泵位于机器室内， 竖直复合式冷凝器位于两 用箱箱体背面。
本发明所指的一种新型多功能半导体冷藏暖藏两用箱的制造方法包括以下 步骤：
1.制备两用箱箱体： 将两用箱箱体外板、 内胆及相关零部件组装完毕并装进 发泡模具发泡， 制备成两用箱箱体， 两用箱箱体有两个分别独立的上间室和下间 室， 上间室背部开有内外贯通的上间室工作室， 下间室背部开有内外贯通的下间 室工作室， 两用箱箱体底部是前后贯通的机器室。
2.制备半导体制冷制热器： 将半导体制冷片， 上间室制冷制热器金属组件之 一的上间室外换热器及上间室制冷制热器金属组件之一的上间室内换热器按序 紧密接触相贴， 用紧固连接件固定， 组成上间室半导体制冷制热器；将半导体制 冷片， 下间室制冷制热器金属组件之一的下间室外换热器及下间室制冷制热器 金属组件之一的下间室内换热器按序紧密接触相贴， 用紧固连接件固定， 组成下 间室半导体制冷制热器。
3.组装： 将上间室半导体制冷制热器安装进上间室工作室及把下间室半导体 制冷制热器安装进下间室工作室以后，再用连接管连通上间室半导体制冷制热器 的上间室外换热器、 下间室半导体制冷制热器的下间室外换热器、 复合式冷凝器 及输液泵， 构成液体冷媒的循环流动通路。
本发明由于上述结构及制造方法，与以前没有箱体底部机器室的多功能半导 体冷藏暖藏两用箱相比较，现在这种新型多功能半导体冷藏暖藏两用箱在制冷效 率、 制冷温差深度及产品容积都要有显著进步对试验样机的测试结果进行比较， 有箱体底部机器室的新型多功能半导体冷藏暖藏两用箱与以前方法制造的没有 箱体底部机器室的多功能半导体冷藏暖藏两用箱相比较，在上间室及下间室都制 冷的状况时，前者复合式冷凝器的热端温度与环境温度的温差比后者复合式冷凝 器的热端温度与环境温度的温差 d、一半， 散热效果显著提高， 现在这种新型多功 能半导体冷藏暖藏两用箱制冷效率提高了 3倍， 制冷深度提高 30%， 可以制造的多 功能半导体冷藏暖藏两用箱产品容积由 100L左右提高到 500L左右，各方面都显著 大进步，我们开发的 260L大容积全玻璃门半导体酒拒：经国家日用电器检测中心'检 国家日用电器检测中心对外名称是广州威凯检测技术有限公司，检测报告编号是 WTS2012- 4875。
附图说明：
图 1是新型多功能半导体冷藏暖藏两用箱组装结构剖视示意图；
图 2是新型多功能半导体冷藏暖藏两用箱箱体剖视示意图；
图 3是本发明技术方案中上间室半导体制冷制热器的上间室外换热器、 下间 室半导体制冷制热器的下间室外换热器、 复合式冷凝器及输液泵连通方案示意 图；
图 4是本发明技术方案中上间室外换热器的结构剖视示意图；
图 5是本发明技术方案中下间室外换热器的结构剖视示意图；
图中： 1.上间室； 2.下间室； 3. 机器室； 4. 上间室工作室； 5. 下间室工 作室； 6.上间室内换热器； 7.半导体制冷片； 8. 上间室外换热器； 9.下间室 内换热器； 10. 半导体制冷片； 1 1.下间室外换热器； 12.复合式冷凝器； 1 3. 水平复合式冷凝器； 14. 竖直复合式冷凝器； 15.输液泵； 16.外换热风机； 17. 补液排气口； 18.上间室流入 /流出口； 19. 流动通路； 20.上间室半导体制冷制 热器； 21.下间室半导体制冷制热器； 22.下间室流入 /流出口； 23.流动通路。 具体实施方式
下面结合附图对本发明故进一步说明： 参见附图： 图中的新型多功能半导体 冷藏暖藏两用箱包括：
1 )、 两用箱箱体， 所述两用箱箱体为其外板、 内胆及相关零部件组装完毕后 装进发泡模具发泡成型的整体， 两用箱箱体有两个分别独立的上间室 1和下间室 2 , 上间室（1)背部开有内外贯通的上间室工作室 4， 下间室 2背部开有内外贯通的 下间室工作室 5， 两用箱箱体底部是前后贯通的机器室 3 ;
2 )、 半导体制冷制热器： 包括上间室半导体制冷制热器 20和下间室半导体制 冷制热器 21， 其中上间室半导体制冷制热器 20由在上间室工作室 4内安装的上间 室外换热器 8、 半导体制冷片 7及上间室内换热器 6按序紧密接触相贴固定连接后 构成； 下间室半导体制冷制热器 21由在下间室工作室 5内安装的下间室外换热器 11、另一半导体制冷片 10及下间室内换热器 9按序紧密接触相贴固定连接后组成； 3 )、 所述上间室外换热器 8、 下间室外换热器 11通过管道连接复合式冷凝器 (12)及输液泵 15， 构成液体冷媒的循环流动通路；
4 )、 所述复合式冷凝器 12由水平复合式冷凝器 13和竖直复合式冷凝器 14相互 连通组合而构成， 水平复合式冷凝器 13及输液泵 15位于机器室 3内， 竖直复合式 冷凝器 14位于两用箱箱体背面。
上述水平复合式冷凝器 13由至少一个水平单层冷凝器连通组成。
进一步： 竖直复合式冷凝器 14由至少一个竖直单层冷凝器连通组成。
所述机器室 3内的水平复合式冷凝器 13旁边安装有可提高水平复合式冷凝器 13与空气换热能力的外换热风机 16。
进一步， 上间室外换热器 8具有液体冷媒流入 /流出口 18及 S形状的流动通路 19 ; 上间室外换热器 8上开有补液排气口 17。
上述新型多功能半导体冷藏暖藏两用箱制作方法如下：
由图 2可知， 将两用箱箱体外板、 内胆及相关零部件组装完毕并装进发泡模 具发泡， 制备成两用箱箱体， 两用箱箱体有两个分别独立的上间室 1和下间室 2， 上间室 1背部开有内外贯通的上间室工作室 4， 下间室 2背部开有内外贯通的下间 室工作室 5， 两用箱箱体底部是前后贯通的机器室 3 ; 由图 1可知， 将半导体制冷 片 7、上间室制冷制热器金属组件之一的上间室外换热器 8及上间室制冷制热器金 属组件之一的上间室内换热器 6按序紧密接触相贴， 用紧固连接件固定， 组成上 间室半导体制冷制热器 20， 将半导体制冷片 10、 下间室制冷制热器金属组件之一 的下间室外换热器 11及下间室制冷制热器金属组件之一的下间室内换热器 9按序 紧密接触相贴， 用紧固连接件固定， 组成下间室半导体制冷制热器 21 ; 结合图 1 和图 2所示，将上间室半导体制冷制热器 20安装进上间室工作室 4及把下间室半导 体制冷制热器 21安装进下间室工作室 5以后， 再用连接管连通上间室半导体制冷 制热器 20的上间室外换热器 8、下间室半导体制冷制热器 21的下间室外换热器 11、 复合式冷凝器 12及输液泵 15， 构成液体冷媒的循环流动通路。
如图 1、 图 3所示本发明技术方案中， 下间室半导体制冷制热器 21的下间室外 换热器 11、 上间室半导体制冷制热器 20的上间室外换热器 8、 复合式冷凝器 12及 输液泵 15是依次串行循环连通， 构成液体冷媒的循环流动通路。
如图 1、 图 3所示本发明技术方案中， 复合式冷凝器 12由水平复合式冷凝器 13 和竖直复合式冷凝器 14相互连通组合而构成， 水平复合式冷凝器 13及输液泵 15 被置于新型多功能半导体冷藏暖藏两用箱的机器室 3内， 竖直复合式冷凝器 14被 置于新型多功能半导体冷藏暖藏两用箱外背面。
本发明技术方案中， 水平复合式冷凝器 13由一个或一个以上的水平单层冷凝 器连通组成。
本发明技术方案中， 竖直复合式冷凝器 14由一个或一个以上的竖直单层冷凝 器连通组成。
如图 1所示本发明技术方案中， 机器室 3内的水平复合式冷凝器 13旁边安装有 可提高水平复合式冷凝器 13与空气换热能力的外换热风机 16。
如图 4所示本发明技术方案中，上间室外换热器 8开有液体冷媒通过的液体冷 媒上间室流入 /流出口 18，上间室外换热器 8内部开有液体冷媒流动的 S形状的流 动通路 19， 上间室外换热器 8上开有补液排气口 17。
如图 5所示本发明技术方案中， 下间室外换热器 11开有液体冷媒通过的液体 冷媒下间室流入 /流出口 22，下间室外换热器 11内部开有液体冷媒流动的 S形状的 流动通路 23。

Claims

权利要求
1、 一种新型多功能半导体冷藏暖藏两用箱， 其特征在于： 包括
1 )、 两用箱箱体， 所述两用箱箱体为其外板、 内胆及相关零部件組装完毕后 装进发泡模具发泡成型的整体，两用箱箱体有两个分别独立的上间室 (1)和下间室 (2) , 上间室 (1)背部开有内外贯通的上间室工作室 (4) , 下间室 (2)背部开有内外贯 通的下间室工作室 (5) , 两用箱箱体底部是前后贯通的机器室 （3) ;
2)、 半导体制冷制热器： 包括上间室半导体制冷制热器 (20)和下间室半导体 制冷制热器 (21)，其中上间室半导体制冷制热器 (20)由在上间室工作室 (4)内安装的 上间室外换热器 （8)、 半导体制冷片（7)及上间室内换热器 （6) 按序紧密接触相 贴固定连接后构成；下间室半导体制冷制热器 (21) 由在下间室工作室 (5)内安装的 下间室外换热器 （11 )、 另一半导体制冷片（10)及下间室内换热器 （9) 按序紧密 接触相贴固定连接后組成；
3)、 所述上间室外换热器 （8)、 下间室外换热器 （11 ) 通过管道连接复合式 冷凝器 (12)及输液泵 (15) , 构成液体冷媒的循环流动通路；
4)、 所述复合式冷凝器 （12) 由水平复合式冷凝器 （13) 和竖直复合式冷凝 器 （14) 相互连通組合而构成， 水平复合式冷凝器 （13) 及输液泵 (15)位于机器 室 （3) 内， 竖直复合式冷凝器 （14) 位于两用箱箱体背面。
2、 如权利要求 1所述一种新型多功能半导体冷藏暖藏两用箱， 其特征是： 水 平复合式冷凝器 （13) 由至少一个水平单层冷凝器连通組成。
3、 如权利要求 1所述一种新型多功能半导体冷藏暖藏两用箱， 其特征是： 竖 直复合式冷凝器 （14) 由至少一个竖直单层冷凝器连通組成。
4、 如权利要求 1所述一种新型多功能半导体冷藏暖藏两用箱， 其特征是： 机 器室（3) 内的水平复合式冷凝器（13)旁边安装有可提高水平复合式冷凝器（13) 与空气换热能力的外换热风机 （16)。
5、 如权利要求 1所述一种新型多功能半导体冷藏暖藏两用箱， 其特征是： 上 间室外换热器 （8) 具有液体冷媒流入 /流出口（18)及 S形状的流动通路 （19) ; 上 间室外换热器 （8) 上开有补液排气口 （Π)。
6、 如权利要求 1所述一种新型多功能半导体冷藏暖藏两用箱， 其特征是： 下 间室外换热器 （11 ) 具有另一个液体冷媒流入 /流出口 (22)及另一个 S形状的流动 通路 （23)。
7、 一种新型多功能半导体冷藏暖藏两用箱的制作方法， 其特征在于制备过 程包括以下步骤： 1 ) .制备两用箱箱体： 将箱体外板、 内胆及相关零部件組装完毕并装进发泡 模具发泡，制备成两用箱箱体， 两用箱箱体有两个分别独立的上间室 (1)和下间室 (2) , 上间室 (1)背部开有内外贯通的上间室工作室 (4) , 下间室 (2)背部开有内外贯 通的下间室工作室 (5) , 两用箱箱体底部是前后贯通的机器室 （3) ;
2) .制备半导体制冷制热器： 将半导体制冷片 (7), 上间室制冷制热器金属組 件之一的上间室外换热器 （8) 及上间室制冷制热器金属組件之一的上间室内换 热器 （6) 按序紧密接触相贴， 用紧固连接件固定， 組成上间室半导体制冷制热 器 (20);将半导体制冷片（10), 下间室制冷制热器金属組件之一的下间室外换热器
( 11 ) 及下间室制冷制热器金属組件之一的下间室内换热器 （9) 按序紧密接触 相贴， 用紧固连接件固定， 組成下间室半导体制冷制热器 (21) ;
3) .組装： 将上间室半导体制冷制热器 (20)安装进上间室工作室 (4)及把下间 室半导体制冷制热器 (21)安装进下间室工作室 (5) , 再用连接管连通上间室半导体 制冷制热器 (20)的上间室外换热器 （8)、 下间室半导体制冷制热器 (21) 的下间室 外换热器 （11 )、 复合式冷凝器 (12)及输液泵 (15) , 构成液体冷媒的循环流动通路。
8、如权利要求 7所述一种新型多功能半导体冷藏暖藏两用箱的制造方法， 其 特征是： 下间室半导体制冷制热器 (21) 的下间室外换热器 （11 )、 上间室半导体 制冷制热器 (20) 的上间室外换热器（8)、 复合式冷凝器 (12)及输液泵 (15)是依次串 行循环连通， 构成液体冷媒的循环流动通路。
9、 如权利要求 7所述一种新型多功能半导体冷藏暖藏两用箱的制造方法， 其 特征是： 复合式冷凝器（12)由水平复合式冷凝器（13)和竖直复合式冷凝器（14) 相互连通組合而构成， 水平复合式冷凝器 （13) 及输液泵 (15)被置于新型多功能 半导体冷藏暖藏两用箱的机器室 （3) 内， 竖直复合式冷凝器 （14) 被置于新型 多功能半导体冷藏暖藏两用箱外背面。
10、 如权利要求 7所述一种新型多功能半导体冷藏暖藏两用箱的制造方法， 其特征是： 水平复合式冷凝器 （13) 由一个或一个以上的水平单层冷凝器连通組 成。
11、 如权利要求 7所述一种新型多功能半导体冷藏暖藏两用箱的制造方法， 其特征是： 竖直复合式冷凝器 （14) 由一个或一个以上的竖直单层冷凝器连通組 成。
12、 如权利要求 7所述一种新型多功能半导体冷藏暖藏两用箱的制造方法， 其特征是： 机器室 （3) 内的水平复合式冷凝器 （13) 旁边安装有可提高水平复 合式冷凝器 （13) 与空气换热能力的外换热风机 （16)。
13、 如权利要求 7所述一种新型多功能半导体冷藏暖藏两用箱的制造方法， 其特征是： 上间室外换热器 （8) 开有液体冷媒通过的液体冷媒上间室流入 /流出 口（18),上间室外换热器 （8) 内部开有液体冷媒流动的 S形状的流动通路 （19) , 上间室外换热器 （8) 上开有补液排气口 （Π)。
14、 如权利要求 7所述一种新型多功能半导体冷藏暖藏两用箱的制造方法， 其特征是： 下间室外换热器 （11 ) 开有液体冷媒通过的液体冷媒下间室流入 /流 出口 (22) , 下间室外换热器 (11)内部开有液体冷媒流动的 S形状的流动通路 （23)。
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