[go: up one dir, main page]

WO2012033284A3 - Chamber system adapted for a successive process - Google Patents

Chamber system adapted for a successive process Download PDF

Info

Publication number
WO2012033284A3
WO2012033284A3 PCT/KR2011/005700 KR2011005700W WO2012033284A3 WO 2012033284 A3 WO2012033284 A3 WO 2012033284A3 KR 2011005700 W KR2011005700 W KR 2011005700W WO 2012033284 A3 WO2012033284 A3 WO 2012033284A3
Authority
WO
WIPO (PCT)
Prior art keywords
chamber
supercritical
supply part
pure water
chemical solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2011/005700
Other languages
French (fr)
Korean (ko)
Other versions
WO2012033284A2 (en
Inventor
김재달
이강열
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AND Corp
Original Assignee
AND Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AND Corp filed Critical AND Corp
Publication of WO2012033284A2 publication Critical patent/WO2012033284A2/en
Publication of WO2012033284A3 publication Critical patent/WO2012033284A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P70/80—
    • H10P72/0406—

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention relates to a chamber system adapted for a successive process which includes: a chamber; an ultra pure water supply part and a cleaning chemical solution supply part, which selectively supply the chamber with ultra pure water and a cleaning chemical solution; a first discharge part for discharging ultra pure water and a cleaning chemical solution from the chamber; a supercritical supply part for supplying supercritical gas to the upper portion of the chamber; an IPA supply part for selectively supplying isopropyl alcohol to the upper portion of the chamber; and a second discharge part for discharging the supercritical gas. Accordingly, a wet-type cleaning process, a supercritical cleaning process, and a drying process can be successively performed in one chamber to thereby clean highly integrated semiconductor devices more efficiently. In addition, since wafers are immobilized during the wet-type cleaning process and the supercritical cleaning process, the occurrence of process defects can be prevented.
PCT/KR2011/005700 2010-09-06 2011-08-03 Chamber system adapted for a successive process Ceased WO2012033284A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100086982A KR101156742B1 (en) 2010-09-06 2010-09-06 Chamber system capable of continuous process
KR10-2010-0086982 2010-09-06

Publications (2)

Publication Number Publication Date
WO2012033284A2 WO2012033284A2 (en) 2012-03-15
WO2012033284A3 true WO2012033284A3 (en) 2012-05-03

Family

ID=45811032

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/005700 Ceased WO2012033284A2 (en) 2010-09-06 2011-08-03 Chamber system adapted for a successive process

Country Status (2)

Country Link
KR (1) KR101156742B1 (en)
WO (1) WO2012033284A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180084692A (en) 2018-06-04 2018-07-25 주식회사 유닉 Method for cleaning and drying object to be clean
KR102636979B1 (en) 2019-04-26 2024-02-14 삼성전자주식회사 Multi-chamber equipment
CN113908581A (en) * 2021-09-30 2022-01-11 北京北方华创微电子装备有限公司 Semiconductor device and liquid discharge device thereof
CN117505437A (en) * 2023-11-21 2024-02-06 北京晶亦精微科技股份有限公司 Self-cleaning drying chamber, drying chamber self-cleaning system and self-cleaning method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040074632A (en) * 2003-02-19 2004-08-25 소니 가부시끼 가이샤 Cleaning method
KR100713209B1 (en) * 2007-02-06 2007-05-02 서강대학교산학협력단 High Pressure Cleaner Used for Cleaning Equipment
KR100766343B1 (en) * 2006-05-24 2007-10-11 세메스 주식회사 Substrate Cleaning Drying Method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101109075B1 (en) * 2009-07-24 2012-01-31 세메스 주식회사 Substrate Processing Apparatus and Method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040074632A (en) * 2003-02-19 2004-08-25 소니 가부시끼 가이샤 Cleaning method
KR100766343B1 (en) * 2006-05-24 2007-10-11 세메스 주식회사 Substrate Cleaning Drying Method
KR100713209B1 (en) * 2007-02-06 2007-05-02 서강대학교산학협력단 High Pressure Cleaner Used for Cleaning Equipment

Also Published As

Publication number Publication date
WO2012033284A2 (en) 2012-03-15
KR20120024213A (en) 2012-03-14
KR101156742B1 (en) 2012-06-14

Similar Documents

Publication Publication Date Title
SG169306A1 (en) Method of manufacturing semiconductor device, cleaning method, and substrate processing apparatus
WO2010144290A3 (en) Remote plasma processing of interface surfaces
WO2012056343A3 (en) Method and apparatus for drying a semiconductor wafer
MY177638A (en) Wafer dryer apparatus and method
WO2012108654A3 (en) Fume-removing apparatus, and apparatus for manufacturing semiconductors using same
TWI563076B (en) Aqueous, nitrogen-free cleaning composition and its use for removing residues and contaminants from semiconductor substrates suitable for manufacturing microelectronic devices
WO2013001482A9 (en) Semiconductor stocker systems and methods.
JP2010199160A5 (en) Substrate processing apparatus, semiconductor device manufacturing method, and substrate processing method
JP6068029B2 (en) Substrate processing method, substrate processing apparatus, and storage medium
JP2012023289A5 (en)
WO2011007287A3 (en) Method for drying a semiconductor wafer
CN105280477B (en) A kind of cleaning of sapphire wafer
WO2011073840A3 (en) Device and process for liquid treatment of a wafer shaped article
JP2013012538A (en) Substrate processing apparatus, substrate processing method, and storage medium
WO2012148801A3 (en) Semiconductor substrate processing system
WO2012033284A3 (en) Chamber system adapted for a successive process
SG152980A1 (en) Method for the wet-chemical treatment of a semiconductor wafer
WO2013019062A3 (en) Equipment for manufacturing semiconductor for epitaxial process
TWI483331B (en) Processing device and operating method of the processing device
MX2010006778A (en) PROCEDURE AND DEVICE FOR TREATMENT OF SILICON PADS.
TW200740989A (en) Semiconductor wafer cleaning solution, method for cleaning a semiconductor wafer and method for forming an interconnect structure of an integrated circuit
TW201130042A (en) Substrate processing method and substrate processing apparatus
SG151232A1 (en) Box cleaner for cleaning wafer shipping box
WO2012165861A3 (en) Substrate processing system and substrate processing method using the same
WO2011055960A3 (en) Apparatus and method for polishing and washing a semiconductor wafer

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11823717

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 08/07/2013)

122 Ep: pct application non-entry in european phase

Ref document number: 11823717

Country of ref document: EP

Kind code of ref document: A2