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WO2012033198A1 - Appareil de pulvérisation cathodique - Google Patents

Appareil de pulvérisation cathodique Download PDF

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Publication number
WO2012033198A1
WO2012033198A1 PCT/JP2011/070608 JP2011070608W WO2012033198A1 WO 2012033198 A1 WO2012033198 A1 WO 2012033198A1 JP 2011070608 W JP2011070608 W JP 2011070608W WO 2012033198 A1 WO2012033198 A1 WO 2012033198A1
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WO
WIPO (PCT)
Prior art keywords
target
shutter
substrate
incident control
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/070608
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English (en)
Japanese (ja)
Inventor
隆宏 難波
孝一 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP2012533044A priority Critical patent/JPWO2012033198A1/ja
Publication of WO2012033198A1 publication Critical patent/WO2012033198A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3464—Sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/548—Controlling the composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures

Definitions

  • the present invention relates to a sputtering apparatus.
  • a sputtering apparatus widely used in manufacturing processes of semiconductor devices, magnetic devices, and the like forms a thin film by causing ions to collide with a surface to be sputtered of a sputtering target and depositing sputtered particles emitted from the target on the surface of the substrate.
  • a multi-type sputtering apparatus having a plurality of cathodes has been developed in order to form a thin film made of an alloy, a compound, or the like.
  • the targets are respectively arranged on a plurality of cathodes of a multi-source sputtering apparatus.
  • the surface to be sputtered of each target is provided so as to be inclined with respect to the surface of the substrate to be deposited.
  • the surface to be sputtered of the target When the surface to be sputtered of the target is inclined with respect to the substrate surface, a region having a short relative distance to the surface to be sputtered and a region having a long relative distance to the surface to be sputtered are generated.
  • the number of sputtered particles incident on the substrate surface In a normal case, in a region where the relative distance from the surface to be sputtered is relatively short, the number of sputtered particles incident on the substrate surface is relatively large. In a region where the relative distance to the surface to be sputtered is relatively long, the number of sputtered particles scattered around the substrate increases, and therefore the number of incident particles on the substrate surface becomes relatively small. Therefore, the film thickness of a thin film formed by a multi-source sputtering apparatus generally varies.
  • the film thickness tends to increase in a region where the relative distance to the surface to be sputtered is short within the same plane of the thin film, and the film thickness tends to decrease in a region where the relative distance to the surface to be sputtered is long.
  • Countermeasures for non-uniform film thickness distribution include the distance from the rotation axis of the rotating substrate to the outer peripheral edge of the substrate, the distance from the rotation axis to the center point of the cathode (target) surface, and the substrate surface to the cathode surface. It has been proposed to set the ratio of the distance to the center point to a predetermined range (see Patent Document 1).
  • FIG. 15 shows the film thickness distribution when sputtering is performed using three targets made of different materials individually.
  • the vertical axis represents the film thickness
  • the horizontal axis represents the distance from the center of the substrate.
  • the film thickness tends to be the smallest at the center of the substrate.
  • the tendency of the film thickness distribution in the same plane may be greatly different among the targets. Since the film thickness distribution of the thin film formed on the substrate when sputtered by a conventional sputtering apparatus differs depending on the target material, when forming a thin film using different types of targets simultaneously, the film thickness of the thin film is in the radial direction. In addition to non-uniformity, the composition of the thin film in the same layer may differ in the radial direction. For example, the case where the periphery of a board
  • a thin film that is thin near the center and thicker toward the periphery can be formed on the substrate due to the film thickness distribution depending on the material. Further, the ratio of the material 3 in the thin film is low near the center, and can be higher as it approaches the periphery.
  • the film thickness and composition are likely to be non-uniform in the plane of the thin film.
  • the desired film quality may not be obtained, and there is a limit in making the film thickness uniform.
  • the present invention has been made in view of the above problems, and its object is to improve the in-plane uniformity of a thin film formed on a substrate even when a plurality of targets made of different materials are used.
  • An object of the present invention is to provide a sputtering apparatus that can perform this.
  • the sputtering apparatus includes a plurality of targets and forms a thin film on a substrate disposed in a film formation space.
  • the sputtering apparatus includes a shutter mechanism disposed between the plurality of targets and the film formation space, the shutter mechanism having an opening that exposes a selected target of the plurality of targets to the film formation space.
  • the shutter mechanism includes a plurality of incident control units that control the number of sputtered particles that are emitted from the selected target and travel toward the outer periphery of the substrate, and the plurality of incident control units have a plurality of shielding degrees with respect to the sputtered particles.
  • an incident control unit suitable for the selected target is applied to the selected target from the plurality of incident control units.
  • the gist is to do.
  • one of the incident control units is applied to the selected target according to the film thickness distribution of the selected target alone exposed to the film formation space among the plurality of incident control units.
  • the distribution of the number of sputtered particles reaching the substrate can be made uniform in the plane for each target. For this reason, while improving the in-plane uniformity of the film thickness of the thin film formed in a board
  • the plurality of incident control units have different degrees of shielding depending on the height of the wall portion disposed outside the plurality of targets.
  • the shielding degree of the plurality of incident control units can be varied by the wall portions having different heights. For this reason, it is possible to make the film thickness and the composition uniform without complicating the apparatus or the film forming process.
  • the plurality of incident control units of the shutter mechanism include only an incident control unit having a wall portion provided on an outer periphery of the sputtering target surface of the target, and an opening capable of exposing the sputtering target surface of the target. And an incident control unit.
  • the incident control unit having a wall portion surrounding the outer periphery of the surface to be sputtered and the incident control unit including only the opening are provided in the shutter mechanism, a plurality of targets having opposite film thickness distributions are employed. Even in this case, the thickness and composition of the thin film can be made uniform by making the incident control units suitable for a plurality of targets face each other.
  • the shutter mechanism is a first shutter that has a smaller number of openings than the number of the plurality of targets and is provided so as to be rotatable with respect to the plurality of targets, wherein the selected target is The first shutter, which is a target selectively exposed to the film formation space through the opening of the first shutter, and a position closer to the substrate than the first shutter, A second shutter that includes an incident control unit and that opposes the incident control unit suitable for the selected target that is selectively exposed by the first shutter.
  • the first shutter selectively exposes the target
  • the second shutter causes the incident control unit suitable for the exposed target to face the target. For this reason, even when the target is selectively exposed, an incident control unit suitable for the target can be applied, so that the film thickness and the composition can be made uniform without hindering the degree of freedom of the film forming process. Can do.
  • the incidence control unit having a relatively high shielding degree among the plurality of incidence control units has a wall portion that blocks sputtered particles emitted from the surface to be sputtered of the selected target and directed toward the outer periphery of the substrate.
  • the selected target is a material that forms a thin film having a larger film thickness at the outer periphery of the substrate than at the center of the substrate when the target is sputtered alone, the incident having the relatively large shielding degree with respect to the selected target. Apply the control unit.
  • the selected target is a material that forms a thin film having a larger film thickness at the outer periphery of the substrate than at the center of the substrate when the target is sputtered alone.
  • an incident control unit having a large degree of shielding By applying an incident control unit having a large degree of shielding, the sputtered particles emitted from the target surface to be sputtered toward the outer peripheral portion of the substrate are shielded. For this reason, the degree of shielding can be varied without complicating the apparatus or the film forming process, and the film thickness and composition of the thin film can be made uniform.
  • the shutter mechanism includes a dome-shaped member that is rotatable in the film formation space, and the plurality of incident control units include a first opening formed in the dome-shaped member, and the first opening.
  • a first incident control unit including a first shield part projecting from the dome-shaped member by a first height toward the substrate, and not surrounded by a shield part projecting toward the substrate,
  • a second incident control unit including a second opening formed in the dome-shaped member.
  • the sputtering apparatus further includes a drive motor that rotates the dome-shaped member, and the drive motor has an opening selected according to a material of the selected target among the openings of the plurality of incident control units. The dome-shaped member is rotated so that the selected target is exposed.
  • the shielding degree can be switched by the operation of the drive motor.
  • the plurality of incident control units include a third opening formed in the dome-shaped member, the third opening, and the first height from the dome-shaped member toward the substrate. Further includes a third incident control part including a second shield part protruding by a different second height.
  • This configuration can cope with an increase in the types of selected targets.
  • the first shield part is an annular wall part surrounding the first opening.
  • a plurality of shielding levels can be given to the shutter mechanism (for example, the second shutter) with a simple structure.
  • the schematic sectional drawing of a sputtering device The schematic diagram which shows arrangement
  • (A)-(c) is a schematic diagram which shows the arrangement pattern of a 1st and 2nd shutter.
  • A)-(c) is a schematic diagram which shows the arrangement pattern of a 1st and 2nd shutter.
  • A)-(c) is a schematic diagram which shows the arrangement pattern of a 1st and 2nd shutter.
  • A)-(c) is a schematic diagram which shows the arrangement pattern of a 1st and 2nd shutter.
  • (A)-(c) is a schematic diagram which shows the arrangement pattern of a 1st and 2nd shutter.
  • the graph which shows the film thickness distribution of the target of a different material.
  • the sputtering apparatus 1 is a magnetron sputtering apparatus.
  • the chamber 2 having the internal space, that is, the film formation space 2S includes, for example, a bottomed cylindrical chamber main body 2a and an upper wall portion 2b that seals the inside of the chamber main body 2a in a vacuum state.
  • the chamber body 2a is connected to an exhaust mechanism 3 including a vacuum pump or the like through an exhaust port 2d formed in the bottom wall 2c or the like.
  • a gas introduction port 2e for introducing sputtering gas is formed in the chamber body 2a, and a gas supply mechanism 9 including a gas supply source, a gas supply pipe, a mass flow controller, and the like is connected to the gas introduction port 2e. Yes.
  • the gas supply mechanism 9 introduces a sputtering gas such as Ar gas, Kr gas, or Xe gas into the chamber body 2a through the gas introduction port 2e while controlling the flow rate.
  • the sputtering gas may include a reaction gas such as nitrogen or carbon monoxide.
  • the chamber 2 is loaded with a substrate S such as a silicon substrate or a glass substrate through a transfer port (not shown).
  • the substrate S is placed on the substrate position of the rotary substrate holder 4 provided in the chamber 2.
  • the substrate holder 4 is formed in a disc shape, and a drive motor 6 is connected to the bottom surface of the substrate holder 4 via a drive shaft 5 and a transmission mechanism 7.
  • the drive shaft 5 of the drive motor 6 is rotatably supported on the bottom wall portion 2c of the chamber 2. When the drive motor 6 rotates, the rotation is transmitted to the drive shaft 5 via the transmission mechanism 7, and the substrate holder 4 rotates in the same direction as the rotation direction of the drive motor 6.
  • the drive motor 6 rotates the substrate holder 4 during the execution of sputtering, and suppresses unevenness of sputtered particles deposited on the substrate S placed on the substrate holder 4.
  • a plurality of deposition plates 8 that cover the outer peripheral surface of the substrate holder 4 and the inner wall of the chamber body 2 a are provided.
  • the deposition preventing plate 8 suppresses the adhesion of sputtered particles to the outer peripheral surface of the substrate holder 4 and the inner wall of the chamber body 2a.
  • FIG. 2 shows the arrangement of the cathode 10 fixed to the upper wall 2b.
  • each cathode 10 has a flat-shaped backing plate 11.
  • An earth shield 12 is provided on the bottom surface of the backing plate 11, that is, the substrate side surface.
  • the earth shield 12 has a disk-shaped target accommodating portion 12a for accommodating the target 13, and an annular convex portion 12b formed so as to surround the accommodating portion 12a.
  • the height of the annular convex portion 12b is, for example, about several mm.
  • Each backing plate 11 is connected to a corresponding external power supply G, and supplies direct current or alternating current power from the external power supply G to the target 13 housed in the target housing portion 12a.
  • the target 13 is fixed to the bottom surface of each backing plate 11 and in the target accommodating portion 12a of each earth shield 12.
  • the material of the target 13 is not particularly limited, and is composed of a metal, a metal compound, an insulator, or the like.
  • the targets 13 of the three cathodes 10 can be made of different materials.
  • a first target 13A made of nickel (Ni) is fixed to the first cathode 10A
  • a second target 13B made of cobalt (Co) is fixed to the second cathode 10B
  • a third target 13C made of magnesium oxide (MgO) is fixed to 10C.
  • the substrate-side surface of the target 13 fixed to each cathode 10, that is, the sputtered surface 13 a is inclined with respect to the surface S 1 of the substrate S.
  • the angle formed by the straight line from the center of the target 13 toward the farthest position on the edge of the substrate S and the substrate surface is greater than 0 ° and not more than 30 °.
  • the normal line of the surface 13a to be sputtered is referred to as a target axis line X1
  • the angle formed by the target axis line X1 and the central axis line X2 that is the normal line of the surface S1 of the substrate S and passes through the substrate center is defined. This is called the inclination angle.
  • the first to third targets 13A to 13C are each formed in a disk shape.
  • the center points PC1 to PC3 of the first to third targets 13A to 13C are located on the same circumference.
  • ⁇ 120 °
  • Each cathode 10 is provided with a magnetic device 14 at a position facing the target 13 with the backing plate 11 in between.
  • Each magnetic device 14 includes a magnetic circuit 15.
  • the magnetic circuit 15 When the magnetic circuit 15 is driven in a state where power from the external power supply G is supplied to the backing plate 11, a magnetron magnetic field is generated on the sputtering target surface 13 a of the target 13.
  • the generated magnetron magnetic field contributes to plasma generation in the vicinity of the surface to be sputtered 13a, so that the plasma is densified and the surface to be sputtered 13a is sputtered with ions of the sputtering gas.
  • a shutter mechanism M is provided on the upper wall 2 b of the chamber 2.
  • the shutter mechanism M has a first shutter 20 and a second shutter 30. As shown in FIG. 3, the shutters 20 and 30 are coaxially arranged along the central axis X4. When viewed from above the chamber 2, the shutters 20, 30 overlap.
  • the second shutter 30 is provided below (inside) the first shutter 20.
  • the first shutter 20 has a substantially hemispherical or dome-shaped shutter body 21 having a flange 21a on the outer peripheral edge thereof.
  • Two openings 22 are formed through the shutter body 21.
  • Each opening 22 is a hole for exposing the target 13 to the film formation space 2 ⁇ / b> S, and is formed in a circular shape in accordance with the shape of the target 13, and its inner diameter is slightly larger than the diameter of the target 13. Has been.
  • FIG. 4 shows the lower surface 20a of the first shutter 20.
  • the opening 22 is formed between the apex PC4 of the shutter main body 21 and the flange portion 21a.
  • the openings 22 are provided at an angle ⁇ in the circumferential direction of the shutter main body 21.
  • the angle ⁇ formed by the straight line connecting the center point PC5 of one opening 22 and the vertex PC4 of the first shutter 20 and the straight line connecting the center point PC6 of the other opening 22 and the vertex PC4 is: 120 °.
  • a state where the center point PC5 of one opening 22 is located in front of the chamber 2 and the other opening 22 is located on the right side when viewed from the front of the chamber 2 is referred to as a reference position of the first shutter 20.
  • the first shutter 20 disposed at the reference position exposes the first target 13A disposed on the front surface of the chamber 2 and the third target 13C disposed on the right side when viewed from the front surface to the film formation space 2S.
  • the first shutter 20 is rotatable inside the chamber 2. As shown in FIG. 1, the first shutter 20 is connected to a drive shaft 24 of a drive motor 23 via a transmission mechanism 25.
  • the drive shaft 24 is rotatably supported on the upper wall 2b of the chamber 2.
  • a transmission mechanism 25 provided between the drive shaft 24 and the first shutter 20 transmits the rotation of the drive shaft 24 to the first shutter 20.
  • the configuration of the transmission mechanism 25 is not particularly limited.
  • the transmission mechanism 25 includes a drive source such as a motor, a gear, a ratchet, and the like.
  • the transmission mode transmits the rotation of the drive shaft 24 to the first shutter 20 and the rotation of the drive shaft 24 is the first.
  • One non-transmission mode that is not transmitted to the shutter 20 is switched.
  • each opening 22 moves on an annular locus R1 having the same width as the diameter of the opening 22, as shown in FIG. As shown in FIG. 2, each target 13 is included in the locus R1. For this reason, when the first shutter 20 is rotated by 120 ° from the reference position, the openings 22 of the first shutter 20 overlap the positions of the two targets 13 out of the three targets 13, respectively, and face the openings 22. Two targets 13 to be selectively exposed to the film formation space 2S. At this time, one of the three targets 13 is shielded by the first shutter 20 and is not exposed to the film formation space 2S.
  • the second shutter 30 has a substantially hemispherical or dome-shaped shutter body 31 having a flange 31 a at the lower end, like the first shutter 20.
  • the shutter body 31 is formed to be approximately the same size as the shutter body 21 of the first shutter 20.
  • the shutter main body 31 is provided with first to third incident control units 30A to 30C for controlling the number of sputtered particles emitted from the target 13 and traveling toward the outer periphery of the substrate.
  • FIG. 5 shows the lower surface 30 a of the second shutter 30.
  • the incident control units 30A to 30C have openings 33 to 35 that penetrate the shutter main body 31, respectively.
  • Each of the openings 33 to 35 is a hole for exposing the target 13 that is not shielded by the first shutter 20 to the film formation space 2S, and the shape of the target 13 is the same as that of each opening 22 of the first shutter 20.
  • the inner diameter is slightly larger than the diameter of the target 13.
  • the openings 33 to 35 are formed between the apex PC8 of the shutter main body 31 and the flange 31a.
  • the openings 33 to 35 are provided at equal intervals at an angle ⁇ in the circumferential direction of the shutter main body 31.
  • the angle ⁇ formed by adjacent straight lines is 120 °.
  • the incident control sections 30A to 30C have different shielding degrees depending on the height of the shield section as a wall section provided outside the openings 33 to 35.
  • the first incident control unit 30 ⁇ / b> A includes a first shield unit 36 on the outer periphery of the opening 33.
  • the first shield portion 36 is an annular wall portion that surrounds the opening 33.
  • the lower surface 36u of the first shield part 36 defines an opening 36P.
  • the first shield portion 36 has a height, that is, a first shield length H1.
  • the first shield length H1 is not particularly limited, but is preferably 50 to 120 mm.
  • the height of the shield part 36 of the first incidence control unit 30A is the highest among the incidence control units 30A to 30C, and therefore the shielding degree of the first incidence control unit 30A is the largest.
  • the second incident control unit 30B is composed of only the opening 34. Unlike the first incident control unit 30 ⁇ / b> A, the second incident control unit 30 ⁇ / b> B does not include an annular wall portion protruding toward the substrate S on the outer periphery of the opening 34. In other words, the height of the outer peripheral wall portion of the opening 34 of the second incident control unit 30B is “0”. Accordingly, the shielding degree of the second incidence control unit 30B is the smallest among the incidence control units 30A to 30C.
  • the third incident control unit 30 ⁇ / b> C includes a second shield unit 37 on the outer periphery of the opening 35.
  • the second shield part 37 is an annular wall part surrounding the opening part 35.
  • the lower surface 37u of the second shield part 37 defines an opening 37P.
  • the second shield part 37 has a height, that is, a second shield length H2.
  • the second shield length H2 is shorter than the first shield length H1.
  • the second shield length H2 may be within the range of 50 to 120 mm and shorter than the first shield length H1.
  • the third incident control unit 30C has the second highest shielding degree after the first incident control unit 30A.
  • the second shutter 30 can also rotate inside the chamber 2.
  • the second shutter 30 is connected to the drive motor 23 via a transmission mechanism 25, for example, so that the center axis X4 (see FIG. 3) of the second shutter 30 coincides with the center line of the drive shaft 24 of the drive motor 23. .
  • the second shutter 30 rotates in the same direction as the rotation direction of the drive motor 23.
  • the openings 33 to 35 of the incidence controllers 30A to 30C have the same width as the diameters of the openings 33 to 35, as shown in FIG. It moves on an annular locus R2. As shown in FIG. 2, the position of each target 13 is included in the locus R2. Therefore, any two of the openings 33 to 35 of the second shutter 30 coincide with the position of the opening 22 of the first shutter 20 with respect to the two targets 13 selectively exposed by the first shutter 20. When stopped in this manner, the two targets 13 are exposed to the film formation space 2S via the first shutter 20 and the second shutter 30. Further, by rotating the second shutter 30 by 120 °, the shield portions 36 and 37 or the opening 34 facing the exposed target 13 can be changed.
  • a state where the first shield part 36 is located in front of the chamber 2 is referred to as a reference position of the second shutter 30.
  • the first target 13A exposed through the opening 22 of the first shutter 20 faces the first shield part 36.
  • the third target 13 ⁇ / b> C exposed through the opening portion 22 faces the second shield portion 37.
  • FIG. 6 shows a state in which one target 13 faces the first incident control unit 30 ⁇ / b> A of the second shutter 30 through the opening 22 of the first shutter 20.
  • the target 13 is exposed to the film formation space 2S through the opening 22 of the first shutter 20 and the opening 33 of the second shutter 30.
  • sputtered particles are emitted from the target surface 13a of the target 13 toward the substrate S.
  • the first shield part 36 blocks a part of the sputtered particles that are released and go to the outer peripheral part of the substrate. For this reason, the 1st shield part 36 reduces the number of the particles deposited on the board
  • the locus SP1 of the particles emitted from the reference point Pk1 that is the peripheral portion of the target 13 and is relatively far from the central axis X2 passing through the center of the substrate toward the substrate S is indicated by a two-dot chain line in the figure.
  • the first shield part 36 is not obstructed.
  • the trajectory SP2 of particles emitted from the reference point Pk2 located at the center of the target 13 and heading toward the substrate S is not blocked by the first shield part 36.
  • a part of the trajectory SP3 of the particle that is located at the peripheral edge of the target 13 and is emitted from the reference point Pk3 that is relatively close to the central axis X2 that passes through the center of the substrate and travels toward the substrate S is blocked by the first shield part 36. . That is, assuming that the angle formed between the surface S1 and the straight line L1 that contacts the lower surface 36u of the first shield part 36 and reaches the surface S1 of the substrate S with the shortest distance from the reference point Pk3 is the incident angle ⁇ in1, Sputtered particles that are incident at an angle smaller than the angle ⁇ in1 are blocked by the first shield part 36.
  • the region where the sputtered particles are supposed to reach is sputtered without a shield part.
  • the film thickness is smaller than This region is the substrate outer peripheral portion S2 located on the other side of the substrate center axis X2 when viewed from the reference point Pk3.
  • the width of the substrate outer peripheral portion S2 whose film thickness is reduced by the first shield portion 36 is ⁇ W1.
  • the sputtered particles emitted from the reference points Pk1 and Pk2 and directed toward the substrate surface are not blocked by the first shield part 36.
  • the first shield part 36 is set so that the sputtered particles are blocked. It may be configured.
  • FIG. 7 shows a state where one target 13 faces the third incident control unit 30 ⁇ / b> C of the second shutter 30 through the one opening 22 of the first shutter 20.
  • the target 13 is exposed to the film formation space 2 ⁇ / b> S through the opening 22 of the first shutter 20 and the opening 35 of the second shutter 30.
  • sputtered particles are emitted from the target surface 13a of the target 13 toward the substrate S.
  • the second shield part 37 blocks the flight of some of the emitted sputtered particles toward the substrate outer peripheral part S2.
  • the 2nd shield part 37 reduces the number of the particles deposited on the board
  • the height of the second shield part 37 is lower than that of the first shield part 36, the width of the substrate outer peripheral part S ⁇ b> 2 is reduced by the first shield part 36 because the film thickness generated by the second shield part 37 is reduced. Small compared to things.
  • the trajectories SP1 and SP2 of the sputtered particles emitted from the reference points Pk1 and Pk2 and directed toward the substrate S in the surface 13a to be sputtered of the target 13 are not blocked by the second shield part 37.
  • a part of the locus SP3 of particles emitted from the reference point Pk3 and directed to the substrate S is blocked by the second shield part 37.
  • the incident angle Sputtered particles that are incident at an angle smaller than the angle ⁇ in2 are blocked by the second shield part 37.
  • the substrate outer peripheral portion S2 that the sputtered particles were supposed to reach is the shield portion.
  • the film thickness becomes smaller compared to the case where sputtering is performed in a state where there is no film.
  • the width ⁇ W2 of the substrate outer peripheral portion S2 whose film thickness is reduced by the second shield portion 37 is smaller than the width ⁇ W1 of the substrate outer peripheral portion S2 in the case of the first shield portion 36.
  • the incident angle ⁇ in2 is smaller than the incident angle ⁇ in1 in the case of the first shield part 36.
  • FIG. 8 shows a state in which one target 13 faces the second incident control unit 30B of the second shutter 30 through the one opening 22 of the first shutter 20.
  • the sputtered particles directed from the reference points Pk1 to Pk3 toward the surface S1 of the substrate S are not blocked by the second incident control part 30B.
  • the sputtered particles emitted from the target 13 facing the opening 34 are deposited on the substrate with substantially the same film thickness distribution as when sputtered without the second shutter 30.
  • FIGS. 9 to 11 are views of the second shutter 30 as seen from the lower surface 30a in a state where the openings of the first shutter 20 and the second shutter 30 are overlapped with the target 13.
  • FIG. 9 is a view of the second shutter 30 as seen from the lower surface 30a in a state where the openings of the first shutter 20 and the second shutter 30 are overlapped with the target 13.
  • the first shutter 20 is arranged at the reference position.
  • the opening 22 of the first shutter 20 faces the first target 13A and the third target 13C, respectively. Therefore, the first target 13A and the third target 13C are exposed to the film formation space 2S through the opening 22, and the second target 13B is shielded by the shutter main body 31.
  • the arrangement pattern of the second shutter 30 is the three arrangement patterns shown in FIGS. 9A to 9C.
  • the material is selected according to the material of the first target 13A and the third target 13C.
  • FIG. 9A shows a state in which the second shutter 30 is arranged at the reference position.
  • the first shield part 36 faces the first target 13A
  • the second shield part 37 faces the third target 13C.
  • the arrangement pattern of FIG. 9A is effective in making the film thickness uniform, but the first target 13A and the third target 13C.
  • the second shutter 30 can be arranged in another arrangement pattern according to the tendency of the film thickness distribution of the material.
  • the transmission mechanism 25 is driven to enter a non-transmission mode in which no rotational force is transmitted to the first shutter 20, and only the second shutter 30 is set to the reference position. To a desired arrangement pattern.
  • the rotation directions of the first shutter 20 and the second shutter 30 are clockwise when viewed from the lower surface of the second shutter 30, but they may be counterclockwise or may be different from each other.
  • FIG. 9B shows a state where the second shutter 30 is rotated 120 ° from the reference position.
  • the first target 13 ⁇ / b> A faces the opening 34
  • the third target 13 ⁇ / b> C faces the first shield part 36.
  • the first target 13A is made of a material capable of obtaining a relatively uniform film thickness distribution even in the absence of the shield portion
  • the third target 13C is in the substrate outer peripheral portion S2 without the shield portion. This is effective in the case of using a material that increases the film thickness and that particularly increases the width of a region where the film thickness increases in the substrate outer peripheral portion S2 (hereinafter referred to as a film thickness increase region).
  • FIG. 9C shows a state where the second shutter 30 is rotated by 240 ° from the reference position.
  • the first target 13A faces the second shield part 37
  • the third target 13C faces the opening 34.
  • the first target 13A is made of a material having a large film thickness at the substrate outer peripheral portion S2 without the shield portion, and the third target 13C has a relatively uniform film thickness even without the shield portion. This is effective when a material with a distribution is used.
  • region is investigated beforehand by experiment or simulation.
  • the film thickness distribution of a thin film formed when sputtering is performed using a given target with a sputtering apparatus that does not include a shield part (36, 37) is referred to as “film thickness distribution depending on the target material”.
  • film thickness distribution when sputtering is performed with a single target is referred to as “film thickness distribution when sputtering is performed with a single target”.
  • the width ⁇ W1 that can suppress the increase in film thickness by the first shield part 36 and the width ⁇ W2 that can suppress the film thickness increase by the second shield part 37 are set to the width of the film thickness increase region that has been examined in advance.
  • the nearer one is selected as the shield part facing the target 13.
  • the width of the area where the increase in film thickness can be suppressed by the shield part is set to the actual film thickness increase area. Fine adjustments can be made to approach the width. For example, when the inclination angle of the target 13 is increased, the width of the region where the increase in film thickness can be suppressed by the shield portion is reduced. When the inclination angle of the target 13 is reduced, the width of the region where the increase in film thickness can be suppressed by the shield portion is increased.
  • the first shutter 20 When performing sputtering using the second target 13B and the third target 13C, as shown in FIGS. 10A to 10C, the first shutter 20 is disposed at a position rotated by 120 ° from the reference position. To do. The first shutter 20 disposed at this position selectively exposes the second target 13B and the third target 13C to the film formation space 2S through the opening 22, and shields the first target 13A by the shutter body 21. ing.
  • the second shutter 30 is arranged in an arrangement pattern that matches the material of the selected target (13B, 13C) among the three arrangement patterns shown in FIGS. 10 (a) to 10 (c).
  • FIG. 10A shows a state in which the second shutter 30 is arranged at the reference position.
  • the second target 13B faces the opening 34
  • the third target 13C faces the second shield part 37.
  • This arrangement pattern is effective when, for example, Co is used as the second target 13B and MgO is used as the third target 13C as in the present embodiment. That is, when the second target 13B is made of a material that can obtain a relatively uniform film thickness distribution even when there is no shield portion, such as Co, the second shutter 30 has the opening portion 34 having no wall portion as the second portion.
  • the sputtered particles of the second target 13B can be deposited on the substrate outer peripheral portion S2 without hindering the flight of the sputtered particles reaching the substrate outer peripheral portion S2.
  • the second shutter 30 faces the second shield portion 37 to the second target 13B.
  • the film thickness and composition of the thin film formed on the substrate S can be made uniform as a result.
  • FIG. 10B shows a state where the second shutter 30 is rotated 120 ° from the reference position.
  • the second target 13B faces the second shield part 37
  • the third target 13C faces the first shield part 36.
  • the second target 13B is made of a material whose film thickness increases at the substrate outer peripheral portion S2 without the shield portion
  • the third target 13C has a film at the substrate outer peripheral portion S2 without the shield portion. This is effective when a material having a large thickness and a particularly large width of the film thickness increasing region is used.
  • FIG. 10C shows a state in which the second shutter 30 is rotated by 240 ° from the reference position.
  • the second target 13B faces the first shield part 36
  • the third target 13C faces the opening 34.
  • the second target 13B is made of a material having a large film thickness in the substrate outer peripheral portion S2 in a state where there is no shield part, and the width of the film thickness increasing region is particularly large. This is effective in the case of using a material capable of obtaining a relatively uniform film thickness distribution even in the absence of the film.
  • the first shutter 20 When performing sputtering using the first target 13A and the second target 13B, as shown in FIGS. 11A to 11C, the first shutter 20 is disposed in a state rotated by 240 ° from the reference position. To do. The first shutter 20 disposed at this position selectively exposes the first target 13A and the second target 13B to the film formation space 2S through the opening 22, and shields the third target 13C by the shutter body 21. ing.
  • the second shutter 30 is arranged in an arrangement pattern that matches the material of the selected target (13A, 13B) among the three arrangement patterns shown in FIGS. 11 (a) to 11 (c).
  • FIG. 11A shows a state in which the second shutter 30 is arranged at the reference position.
  • the first target 13A faces the first shield part 36
  • the second target 13B faces the opening 34.
  • This arrangement pattern is effective when Ni is used as the first target 13A and Co is used as the second target 13B, as in the present embodiment, for example. That is, as described above, for the first target 13A, the second shutter 30 suppresses an increase in film thickness at the substrate outer peripheral portion S2 by the first shield portion 36, and for the second target 13B, The two shutters 30 do not hinder the flight of sputtered particles that reach the substrate outer peripheral portion S2.
  • FIG. 11B shows a state where the second shutter 30 is rotated 120 ° from the reference position.
  • the first target 13 ⁇ / b> A faces the opening 34 and the second target 13 ⁇ / b> B faces the second shield part 37.
  • the first target 13A is made of a material that can obtain a relatively uniform film thickness distribution even without a shield portion
  • the second target 13B has a film thickness at the substrate outer peripheral portion S2 without the shield portion. This is effective when a material with a large is used.
  • FIG. 11C shows a state in which the second shutter 30 is rotated by 240 ° from the reference position.
  • the first target 13A faces the second shield part 37
  • the second target 13B faces the first shield part 36.
  • the first target 13A is made of a material whose film thickness is increased in the substrate outer peripheral portion S2 without the shield portion
  • the second target 13B is formed in the substrate outer peripheral portion S2 without the shield portion. This is effective when a material having a large film thickness and a particularly large width of the film thickness increasing region is used.
  • the procedure for the sputtering process will be described.
  • the substrate S is carried into the chamber 2, and the substrate S is placed on the substrate holder 4 and rotated to a predetermined film formation start position. Further, the sputtering gas from the gas supply mechanism 9 is introduced into the film forming space 2S, and the pressure in the chamber 2 is adjusted to a predetermined pressure.
  • the first shutter 20 and the second shutter 30 are rotated to a desired rotation position by the drive motor 23, and two targets 13 are selected. Incident control units suitable for these targets 13 are made to face each other.
  • the shutters 20 and 30 may be rotated in the same direction by the same angle.
  • the transmission mechanism 25 is switched to the non-transmission mode, and the drive motor 23 is rotated clockwise or counterclockwise in accordance with a desired rotation position of the second shutter 30 in a state where the rotation of the drive motor 23 is not transmitted to the first shutter 20. Rotate only the angle.
  • the first shutter 20 is held in a stopped state, and only the second shutter 30 is rotated to a desired rotation position. In this way, the shields 36 and 37 or the opening 34 suitable for the selected target can be opposed to the selected target.
  • the magnetic circuit 15 of the cathode 10 for the selected target is driven to generate a magnetron magnetic field on the sputtered surface 13a of the selected target.
  • a predetermined direct current or alternating current power is applied to the selected target. Thereby, discharge is started between the sputter target surface 13a of the selected target and the film formation space 2S, and sputtering is performed using the sputter target surface 13a.
  • the shields 36 and 37 or the opening 34 suitable for the material are opposed to each selected target.
  • the shield part 36 or 37 opposes the target 13 that increases the film thickness of the outer peripheral part S2 of the substrate when sputtering is performed in a state where there is no shield part.
  • the number of sputtered particles reaching the substrate outer peripheral portion S2 is reduced by shielding the sputtered particles by the shield portions 36 and 37, and an increase in film thickness at the substrate outer peripheral portion S2 is suppressed.
  • the opening 34 faces the target 13 that can obtain a relatively uniform film thickness distribution in the absence of the shield portion, the film formation can be performed without shielding the sputtered particles.
  • the shields 36 and 37 or the opening 34 corresponding to the tendency of the film thickness distribution of the selected target are selectively opposed to the selected target, thereby suppressing the deviation of the film thickness for each selected target.
  • the deviation of the film thickness in the radial direction of the thin film is suppressed without changing various conditions such as the gas flow rate, the inclination angle of the target, and the power supplied from the external power supply G. Therefore, in-plane uniformity of the film thickness can be improved and the composition in the same layer can be made uniform without changing the film quality.
  • the first shutter 20 When performing the sputtering by changing the selected target continuously, the first shutter 20 is rotated so that the opening 22 of the first shutter 20 faces the changed selected target 13. Further, the second shutter 30 is rotated so that the shield portions 36 and 37 or the opening 34 suitable for the material of each selected target after the change are opposed to each selected target. Thereafter, sputtering is performed.
  • the sputtering apparatus 1 is a multi-element apparatus including a plurality of targets 13, and the selected target is exposed to the film formation space 2 ⁇ / b> S between the plurality of targets 13 and the film formation space 2 ⁇ / b> S.
  • a shutter mechanism M having an opening 22 is provided.
  • the shutter mechanism M includes a first shutter 20 and a second shutter 30.
  • the second shutter 30 includes incident control units 30A, 30B, and 30C (shield portions 36 and 37 and the opening 34) that control the number of sputtered particles emitted from the selected target through the opening 22 and heading toward the outer peripheral portion S2. Prepare.
  • the incident control units 30A to 30C are controlled in accordance with the tendency of the film thickness distribution when the selected target exposed to the film forming space 2S through the opening 22 of the first shutter 20 is sputtered alone.
  • Any one incident control unit suitable for the selected target is applied to the selected target.
  • a material such as Ni and a material such as Co and Ti have different film thickness distributions when the target is sputtered alone. Even when a plurality of targets 13 are mounted on the same apparatus, the distribution of the number of sputtered particles reaching the substrate S can be made uniform in the plane for each target.
  • the incident control units 30A, 30B, and 30C are the heights (H1, 0, and H) of the wall that surrounds the outer periphery of the sputtering target surface 13a of the target 13.
  • H2 the heights of the wall that surrounds the outer periphery of the sputtering target surface 13a of the target 13.
  • H2 the shielding degree
  • the incidence control unit 30A includes the first shield part 36 that is a relatively high (H1) wall part
  • the incidence control part 30C has a large shielding degree
  • the incidence control part 30C has a lower (H2) wall than the first shield part 36. Since the second shield part 37 as a part is provided, the degree of shielding is smaller than that of the incident control part 30A.
  • the incident control unit 30B includes a simple opening 34. There is no wall portion surrounding the opening 34, that is, the height is “0”. Therefore, the incidence control unit 30B has the smallest shielding degree. For this reason, the degree of shielding can be varied according to the target 13 without complicating the apparatus or the film forming process.
  • the shutter mechanism M is configured by the first shutter 20 having the two openings and the second shutter 30 having the shields 36 and 37 and the opening 34.
  • the first shutter 20 is provided so as to be rotatable with respect to the target 13 and selectively exposes the two targets 13 to the film formation space 2 ⁇ / b> S through the two openings 22.
  • the second shutter 30 is provided at a position closer to the substrate S than the first shutter 20 and is shielded according to the two targets 13 selectively exposed by the first shutter 20 by rotating to the desired position. Two of the portions 36 and 37 and the opening 34 are opposed to the two targets 13, respectively.
  • the incident control units 30A to 30C suitable for these targets 13 can be applied, so that the degree of freedom of the film forming process is not hindered.
  • the film thickness and composition can be made uniform.
  • the drive motor 23 rotates the second shutter 30 to move the target through the opening of the incidence control unit selected according to the target material among the incidence control units 30A to 30C of the second shutter 30. Expose. This eliminates the increase in film thickness at the peripheral edge of the substrate S depending on the target. A thin film corresponding to the target can be formed on the substrate with a substantially uniform film thickness.
  • the drive motor 23 rotates the second shutter 30 and a plurality of incidents selected from the incidence control units 30A to 30C of the second shutter 30 according to the materials of the plurality of selected targets. Each of the plurality of selection targets is exposed through the opening of the control unit. Thereby, a thin film having a composite composition corresponding to a plurality of selected targets can be formed on the substrate with a substantially uniform film thickness and a substantially uniform thickness.
  • the first shutter 20 of the present embodiment has a single opening 22 formed through the shutter body 21.
  • the opening 22 is circular and has an inner diameter slightly larger than the diameter of the target 13. For this reason, in this embodiment, one target 13 is exposed to the film formation space 2 ⁇ / b> S through the opening 22 when performing sputtering.
  • FIG. 13A shows a state in which the first shutter 20 and the second shutter 30 are arranged at the reference position.
  • the first shutter 20 disposed at this position causes the first target 13A to enter the film formation space 2S through the opening 22.
  • the first shield portion 36 of the second shutter 30 faces the first target 13A.
  • the arrangement pattern of FIG. 13A is effective.
  • the first shield portion 36 is opposed to the first target 13A.
  • the second shield portion 37 may be opposed to the first target 13A according to the film thickness distribution of the target.
  • FIG. 13B shows a state where the first shutter 20 is rotated 120 ° from the reference position and the second shutter 30 is arranged at the reference position.
  • the first shutter 20 disposed at this position exposes the third target 13C to the film formation space 2S through the opening 22.
  • the second shield part 37 of the second shutter 30 faces the third target 13C.
  • the arrangement pattern of FIG. 13B is effective.
  • the second shield part 37 is opposed to the third target 13C.
  • the first shield part 36 may be opposed to the third target 13C according to the film thickness distribution of the target.
  • FIG. 13C shows a state in which the first shutter 20 is rotated by 240 ° from the reference position and the second shutter 30 is arranged at the reference position.
  • the first shutter 20 disposed at this position exposes the second target 13B to the film formation space 2S through the opening 22.
  • the opening 34 faces the second target 13B.
  • the arrangement pattern of FIG. 13C is effective.
  • the number of openings 22 formed in the first shutter 20 is one, and film formation is performed using one target 13 when performing sputtering.
  • the second shutter 30 is provided with shield portions 36 and 37 and openings 34 suitable for the plurality of targets 13. For this reason, even when film formation is performed with one target 13 selectively exposed, the incidence control units 30A to 30C suitable for the target 13 can be applied, which hinders the degree of freedom of the film formation process.
  • the film thickness and composition can be made uniform.
  • the sputtering apparatus 1 of this embodiment is provided with two targets 13A and 13B, and the shutter mechanism M has one shutter 40.
  • the shutter 40 is connected to the drive shaft 24 of the drive motor 23 as in the above embodiment, and is configured to rotate with respect to the target 13 of the cathode 10 fixed to the chamber 2.
  • the shutter 40 is provided with two incident control units 50A and 50B in the shutter main body 41 thereof.
  • the incident control units 50A and 50B are provided with openings 51 and 52, respectively.
  • the first incident control unit 50 ⁇ / b> A includes an annular shield part 53 provided on the outer periphery of the opening 51.
  • the second incident control unit 50B includes only the opening 52.
  • An annular shield portion is not provided on the outer periphery of the opening 52.
  • the openings 51 and 52 have the same configuration as the openings 33 and 34 in the above embodiment.
  • the shutter 40 is rotated and the two targets 13 are exposed to the film formation space 2S through the openings 52 and 53.
  • the target 13A is made of a material having a small film thickness at the substrate outer peripheral portion S2, such as Ni, for example
  • the first incident control unit 50A having the shield portion 53 faces the target 13A.
  • the target 13B is made of a material that has a relatively uniform film thickness even when there is no shield part, such as Co, for example, the second incident control part 50B without the shield part faces the target 13B.
  • the shutter mechanism M is composed of one shutter 40, and the shutter 40 has a first incident control unit 50A having a shield part 53 and a second incident control part 50B having no shield part.
  • the film thickness distribution is made uniform for each target by one shutter 40, the in-plane uniformity of the film thickness of the thin film formed on the substrate S is improved and the composition of the thin film in the same layer is uniform. Can be improved.
  • the plurality of incident control units include the annular shield portions 36 and 37 and the opening 34.
  • the plurality of incident control units have different shielding degrees depending on the heights (including zero height) of the wall portions around the openings 33 to 35.
  • the wall portion of the incident control unit may have other shapes. For example, it may be an annular shape with a tapered shape that decreases in inner diameter from the target side toward the substrate side.
  • a collimator having a partition plate is provided on the inner side of the ring-shaped member and closer to the central axis X4 of the substrate S, and the outer periphery of the substrate is allowed to pass through the collimator without providing a collimator on the side far from the central axis X4. You may make it reduce the number of sputtered particles which reaches
  • the incident control unit having a high shielding degree may have a shape that reduces the number of sputtered particles that reach the substrate outer peripheral portion S2.
  • the shield portions 36 and 37 have different heights, but the shield portions 36 and 37 may be formed at the same height depending on the material of the target 13.
  • the height of the wall portion in each shield portion 36, 37 is constant.
  • the height of the wall portion that continues along the circumferential direction of the opening corresponding to each shield portion may be non-uniform.
  • a part of the wall part can be made high and the others can be made low so as to reduce the number of sputtered particles reaching the substrate outer peripheral part S2.
  • the sputtering apparatus is embodied as a magnetron sputtering apparatus, but may be embodied as an ECR (Electron Cyclotron Resonance) sputtering apparatus. Even when embodied in this apparatus, according to the tendency of the film thickness distribution according to the target, a shield part that prevents the flight of sputtered particles toward the region where the film thickness is desired to be reduced is provided so as to face the target.
  • ECR Electrotron Cyclotron Resonance
  • M ... shutter mechanism, S ... substrate, S2 ... substrate outer periphery, 1 ... sputter device, 2 ... chamber, 2S ... film formation space, 13, 13A-13B ... target, 13a ... surface to be sputtered, 20 ... first shutter, 22, 33 to 35, 51, 52, 53 ... opening, 30 ... second shutter, 30A to 30C, 50A, 50B ... incident control part, 36, 37, 53 ... shield part as wall part, 36P, 37P ... Opening.

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Abstract

L'invention concerne un appareil de pulvérisation cathodique (1) pour former un film mince sur un substrat (S) disposé dans un espace (2S) de formation de film. Cet appareil comporte plusieurs cibles (13A à 13C) ; et des mécanismes d'obturation (M) qui sont disposés entre les cibles (13A à 13C) et l'espace (2S) de formation de film et ont des ouvertures (22) qui exposent une cible choisie à l'espace (2S) de formation de film. Les mécanismes d'obturation (M) comportent des unités de commande d'injection (30A à 30C) qui commandent le nombre de particules de pulvérisation cathodique libérées à partir de la cible choisie vers une section périphérique externe (S2) du substrat. Les différentes unités de commande d'injection ont différents niveaux de protection par rapport aux particules de pulvérisation cathodique. Une unité de commande d'injection qui est appropriée pour la cible choisie est utilisée parmi les différentes unités de commande d'injection conformément à la distribution d'épaisseur du film quand la cible choisie qui est exposée à l'espace (2S) de formation de film est soumise à une pulvérisation cathodique individuelle.
PCT/JP2011/070608 2010-09-10 2011-09-09 Appareil de pulvérisation cathodique Ceased WO2012033198A1 (fr)

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