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WO2012018425A3 - Real-time monitoring of retaining ring thickness and lifetime - Google Patents

Real-time monitoring of retaining ring thickness and lifetime Download PDF

Info

Publication number
WO2012018425A3
WO2012018425A3 PCT/US2011/036731 US2011036731W WO2012018425A3 WO 2012018425 A3 WO2012018425 A3 WO 2012018425A3 US 2011036731 W US2011036731 W US 2011036731W WO 2012018425 A3 WO2012018425 A3 WO 2012018425A3
Authority
WO
WIPO (PCT)
Prior art keywords
retaining ring
carrier head
lifetime
real
time monitoring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2011/036731
Other languages
French (fr)
Other versions
WO2012018425A2 (en
Inventor
Peter Mcreynolds
Eric S. Rondum
Garlen C. Leung
Adam H. Zhong
Gregory E. Menk
Gopalakrishna B. Prabhu
Thomas H. Osterheld
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to CN201180007401.4A priority Critical patent/CN102725830B/en
Priority to KR1020127020850A priority patent/KR101754855B1/en
Priority to JP2013521776A priority patent/JP2013532588A/en
Publication of WO2012018425A2 publication Critical patent/WO2012018425A2/en
Publication of WO2012018425A3 publication Critical patent/WO2012018425A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H10P50/00—
    • H10P72/06—
    • H10P95/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

A method and apparatus for monitoring the condition of a surface of a retaining ring disposed on a carrier head in a polishing module is described. In one embodiment, an apparatus is provided. The apparatus includes a carrier head movable in a travel path between at least one polishing station for polishing a substrate as the substrate is retained in the carrier head, and a transfer station for transferring the substrate to and from the carrier head, the carrier head having a retaining ring, and a sensor disposed in the travel path of the carrier head, the sensor operable to provide a metric indicative of a condition of the retaining ring.
PCT/US2011/036731 2010-07-26 2011-05-17 Real-time monitoring of retaining ring thickness and lifetime Ceased WO2012018425A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201180007401.4A CN102725830B (en) 2010-07-26 2011-05-17 The thickness of retainer ring and the immediately monitoring method and apparatus of useful life
KR1020127020850A KR101754855B1 (en) 2010-07-26 2011-05-17 Real-time monitoring of retaining ring thickness and lifetime
JP2013521776A JP2013532588A (en) 2010-07-26 2011-05-17 Real-time monitoring of retaining ring thickness and life

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/843,793 2010-07-26
US12/843,793 US20120021671A1 (en) 2010-07-26 2010-07-26 Real-time monitoring of retaining ring thickness and lifetime

Publications (2)

Publication Number Publication Date
WO2012018425A2 WO2012018425A2 (en) 2012-02-09
WO2012018425A3 true WO2012018425A3 (en) 2012-05-18

Family

ID=45494015

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/036731 Ceased WO2012018425A2 (en) 2010-07-26 2011-05-17 Real-time monitoring of retaining ring thickness and lifetime

Country Status (6)

Country Link
US (1) US20120021671A1 (en)
JP (1) JP2013532588A (en)
KR (1) KR101754855B1 (en)
CN (1) CN102725830B (en)
TW (1) TWI530359B (en)
WO (1) WO2012018425A2 (en)

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TWI381904B (en) * 2009-12-03 2013-01-11 Nat Univ Chung Cheng The method of detecting the grinding characteristics and service life of the polishing pad
KR101902049B1 (en) * 2012-01-25 2018-09-27 어플라이드 머티어리얼스, 인코포레이티드 Retaining ring monitoring and control of pressure
US9067295B2 (en) * 2012-07-25 2015-06-30 Applied Materials, Inc. Monitoring retaining ring thickness and pressure control
US9242338B2 (en) * 2013-10-22 2016-01-26 Globalfoundries Singapore Pte. Ltd. CMP head structure
US9227294B2 (en) * 2013-12-31 2016-01-05 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and method for chemical mechanical polishing
JP2015188955A (en) 2014-03-27 2015-11-02 株式会社荏原製作所 Polishing device
KR102323430B1 (en) * 2014-03-31 2021-11-09 가부시키가이샤 에바라 세이사꾸쇼 Polishing apparatus and polishing method
JP6344950B2 (en) * 2014-03-31 2018-06-20 株式会社荏原製作所 Polishing apparatus and polishing method
US9878421B2 (en) * 2014-06-16 2018-01-30 Applied Materials, Inc. Chemical mechanical polishing retaining ring with integrated sensor
CN107405523B (en) * 2015-01-09 2021-03-16 铁堡发明有限公司 controller for game console
CN105397618B (en) * 2015-10-20 2018-03-06 上海华力微电子有限公司 Retainer ring for work-table of chemicomechanical grinding mill
KR102461598B1 (en) * 2015-12-18 2022-11-01 주식회사 케이씨텍 Apparatus of loading substrate in chemical mechanical polishing system
JP6577385B2 (en) * 2016-02-12 2019-09-18 株式会社荏原製作所 Substrate holding module, substrate processing apparatus, and substrate processing method
CN110709980A (en) * 2017-04-26 2020-01-17 崇硕科技公司 CMP machines with increased throughput and processing flexibility
US11292101B2 (en) * 2017-11-22 2022-04-05 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11571786B2 (en) * 2018-03-13 2023-02-07 Applied Materials, Inc. Consumable part monitoring in chemical mechanical polisher
CN108716899B (en) * 2018-06-27 2020-04-10 山东天厚石油科技有限责任公司 Non-contact ultrasonic thickness gauge with high detection precision
JP7074607B2 (en) * 2018-08-02 2022-05-24 株式会社荏原製作所 Jig for polishing equipment
US12296428B2 (en) * 2018-10-29 2025-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11731232B2 (en) * 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
JP7220648B2 (en) * 2019-12-20 2023-02-10 株式会社荏原製作所 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
US20210323117A1 (en) 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
JP7466658B2 (en) * 2020-07-08 2024-04-12 アプライド マテリアルズ インコーポレイテッド Magnetically controlled retaining ring with multiple teeth
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
US12138732B2 (en) * 2020-12-14 2024-11-12 Applied Materials, Inc. Polishing system apparatus and methods for defect reduction at a substrate edge
JP7755817B2 (en) * 2021-08-17 2025-10-17 東京エレクトロン株式会社 Optical sensor for measuring properties of consumable parts in semiconductor plasma processing chambers
CN114910557B (en) * 2022-05-13 2025-08-12 北京晶亦精微科技股份有限公司 Monitoring method and monitoring system for polishing head based on sound waves
US12224186B2 (en) 2023-04-03 2025-02-11 Applied Materials, Inc. Apparatus and method of brush cleaning using periodic chemical treatments

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2002367941A (en) * 2001-06-08 2002-12-20 Hitachi Ltd Method for manufacturing semiconductor integrated circuit device
US6579151B2 (en) * 2001-08-02 2003-06-17 Taiwan Semiconductor Manufacturing Co., Ltd Retaining ring with active edge-profile control by piezoelectric actuator/sensors
US20070232193A1 (en) * 2006-03-31 2007-10-04 Hozumi Yasuda Substrate holding apparatus, polishing apparatus, and polishing method
JP2009260142A (en) * 2008-04-18 2009-11-05 Panasonic Corp Wafer-polishing apparatus and wafer-polishing method

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US4056970A (en) * 1975-10-30 1977-11-08 Yeda Research And Development Co., Ltd. Ultrasonic velocity and thickness gage
EP0049956A1 (en) * 1980-10-10 1982-04-21 Imperial Chemical Industries Plc Ultrasonic identification of damage in lined structures
US5343750A (en) * 1991-11-25 1994-09-06 General Electric Company Manual ultrasonic scanner for complex surfaces
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
JP2000153445A (en) * 1998-11-19 2000-06-06 Seiko Epson Corp Dresser for polishing machine
US6390908B1 (en) * 1999-07-01 2002-05-21 Applied Materials, Inc. Determining when to replace a retaining ring used in substrate polishing operations
JP2001223190A (en) * 2000-02-08 2001-08-17 Hitachi Ltd Method and apparatus for evaluating surface condition of polishing pad, method for manufacturing thin film device using the same, and apparatus for manufacturing the same
US6354928B1 (en) * 2000-04-21 2002-03-12 Agere Systems Guardian Corp. Polishing apparatus with carrier ring and carrier head employing like polarities
TW545580U (en) * 2002-06-07 2003-08-01 Nanya Technology Corp CMP device of measuring apparatus with a notched size for measuring the guide ring of wafer edge
US6964597B2 (en) * 2003-06-27 2005-11-15 Khuu's Inc. Retaining ring with trigger for chemical mechanical polishing apparatus
TWI373393B (en) * 2004-11-01 2012-10-01 Ebara Corp Top ring, polishing apparatus and polishing method
JP2007287787A (en) * 2006-04-13 2007-11-01 Elpida Memory Inc Method and equipment for manufacturing semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002367941A (en) * 2001-06-08 2002-12-20 Hitachi Ltd Method for manufacturing semiconductor integrated circuit device
US6579151B2 (en) * 2001-08-02 2003-06-17 Taiwan Semiconductor Manufacturing Co., Ltd Retaining ring with active edge-profile control by piezoelectric actuator/sensors
US20070232193A1 (en) * 2006-03-31 2007-10-04 Hozumi Yasuda Substrate holding apparatus, polishing apparatus, and polishing method
JP2009260142A (en) * 2008-04-18 2009-11-05 Panasonic Corp Wafer-polishing apparatus and wafer-polishing method

Also Published As

Publication number Publication date
US20120021671A1 (en) 2012-01-26
TW201204509A (en) 2012-02-01
KR20130088738A (en) 2013-08-08
CN102725830A (en) 2012-10-10
CN102725830B (en) 2016-03-16
JP2013532588A (en) 2013-08-19
KR101754855B1 (en) 2017-07-06
WO2012018425A2 (en) 2012-02-09
TWI530359B (en) 2016-04-21

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