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TWI381904B - The method of detecting the grinding characteristics and service life of the polishing pad - Google Patents

The method of detecting the grinding characteristics and service life of the polishing pad Download PDF

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Publication number
TWI381904B
TWI381904B TW098141405A TW98141405A TWI381904B TW I381904 B TWI381904 B TW I381904B TW 098141405 A TW098141405 A TW 098141405A TW 98141405 A TW98141405 A TW 98141405A TW I381904 B TWI381904 B TW I381904B
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TW
Taiwan
Prior art keywords
polishing pad
detecting
tested
service life
grinding
Prior art date
Application number
TW098141405A
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Chinese (zh)
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TW201119796A (en
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Nat Univ Chung Cheng
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Priority to TW098141405A priority Critical patent/TWI381904B/en
Priority to US12/801,555 priority patent/US20110136407A1/en
Publication of TW201119796A publication Critical patent/TW201119796A/en
Application granted granted Critical
Publication of TWI381904B publication Critical patent/TWI381904B/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/32—Investigating strength properties of solid materials by application of mechanical stress by applying repeated or pulsating forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/56—Investigating resistance to wear or abrasion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0016—Tensile or compressive
    • G01N2203/0019—Compressive
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/026—Specifications of the specimen
    • G01N2203/0262—Shape of the specimen
    • G01N2203/0278—Thin specimens
    • G01N2203/0282—Two dimensional, e.g. tapes, webs, sheets, strips, disks or membranes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/06—Indicating or recording means; Sensing means
    • G01N2203/067—Parameter measured for estimating the property
    • G01N2203/0676—Force, weight, load, energy, speed or acceleration

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Description

檢測研磨墊之研磨特性及使用壽命的方法Method for detecting the polishing characteristics and service life of a polishing pad

本發明係與研磨墊有關，特別是指一種檢測研磨墊之研磨特性及使用壽命的方法。The present invention relates to a polishing pad, and more particularly to a method of detecting the polishing characteristics and service life of a polishing pad.

按，研磨拋光(polishing)係精密工件表面加工的後段製程，其目的在於使工件表面的粗糙度(surface roughness)及平坦度(planarity)達一定的容許範圍；其中，使用研磨墊進行研磨的研磨製程即為現今主流表面研磨技術之一。Pressing, polishing is a back-end process of surface processing of precision workpieces, the purpose of which is to achieve a certain allowable range of surface roughness and planarity of the workpiece surface; wherein the polishing is performed by using a polishing pad The process is one of the mainstream surface grinding technologies available today.

習知研磨墊之研磨製程於進行前，須針對不同的被研磨工件，選用具有適當研磨特性(如：表面粗糙度)的研磨墊，以獲得最佳的研磨效率及品質。換言之，對於各式研磨墊的研磨特性及使用壽命的暸解，以及研磨墊對各式被研磨工件的影響，將是正確選用研磨墊的關鍵。Prior to the grinding process of the polishing pad, the polishing pad with appropriate grinding characteristics (such as surface roughness) must be selected for different workpieces to obtain the best grinding efficiency and quality. In other words, understanding the grinding characteristics and service life of various types of polishing pads, as well as the influence of the polishing pad on various types of workpieces to be polished, will be the key to the correct selection of the polishing pad.

然而，目前獲取未知研磨墊的研磨特性及使用壽命的普遍手段，仍是必須透過進行大量的實際研磨實驗，方可得到所需資料，因此不僅耗費時間，且又耗費成本。However, the current universal means of obtaining the abrasive properties and service life of an unknown polishing pad is still necessary to obtain a large amount of actual grinding experiments in order to obtain the required information, which is not only time consuming but also costly.

本發明之主要目的在於提供一種檢測研磨墊之研磨特性及使用壽命的方法，係可使未知特性的研磨墊不需進行實際的研磨試驗，即可被快速預估其研磨特性及使用壽命，因而可節省大量時間與成本。The main object of the present invention is to provide a method for detecting the polishing characteristics and the service life of the polishing pad, so that the polishing pad of unknown characteristics can be quickly predicted for its grinding characteristics and service life without performing an actual grinding test. Save a lot of time and cost.

為了達成前述目的，依據本發明所提供之一種檢測研磨墊之研磨特性及使用壽命的方法，包含有下列步驟：(A)備置已知研磨特性的一全新研磨墊，對該全新研磨墊依序進行具有不同震盪頻率及負載的多次震盪試驗，並於執行完每次震盪試驗時，偵測該全新研磨墊的表面的反應，並配合該全新研磨墊的已知研磨特性，建立一比對資料庫；(B)備置用以研磨一被研磨工件的一待測研磨墊，對該待測研磨墊進行具有一預定震盪頻率及一預定負載的一震盪試驗，之後偵測該待測研磨墊的表面的反應；以及，(C)將步驟(B)之待測研磨墊的表面的反應與步驟(A)中的比對資料庫進行比對，藉以判定該待測研磨墊的研磨特性及使用壽命。藉由前述步驟，係可使得待測研磨墊不再需要進行實際的研磨試驗，即可被快速地預估其研磨特性及壽命，以節省大量時間及成本。In order to achieve the foregoing object, a method for detecting the polishing characteristics and service life of a polishing pad according to the present invention comprises the following steps: (A) preparing a new polishing pad having known polishing characteristics, and sequentially ordering the new polishing pad Perform multiple oscillation tests with different oscillation frequencies and loads, and detect the reaction of the surface of the new polishing pad after each oscillation test, and establish a comparison with the known grinding characteristics of the new polishing pad. a data library; (B) preparing a polishing pad to be ground for grinding a workpiece, performing an oscillation test on the polishing pad to be tested with a predetermined oscillation frequency and a predetermined load, and then detecting the polishing pad to be tested And (C) comparing the reaction of the surface of the polishing pad to be tested in the step (B) with the comparison database in the step (A), thereby determining the polishing characteristics of the polishing pad to be tested and Service life. By the foregoing steps, the polishing pad to be tested can be used to quickly estimate the grinding characteristics and life by eliminating the need for an actual grinding test, thereby saving a lot of time and cost.

為了詳細說明本發明之構造及特點所在，茲舉以下之一較佳實施例並配合圖式說明如后，其中：In order to explain the structure and features of the present invention in detail, the following description

第一圖係本發明一較佳實施例之步驟流程圖。The first figure is a flow chart of the steps of a preferred embodiment of the present invention.

第二圖係本發明一較佳實施例之步驟(A)的操作狀態示意圖。The second drawing is a schematic view of the operational state of step (A) of a preferred embodiment of the present invention.

第三圖係本發明一較佳實施例之步驟(B)的操作狀態示意圖。The third drawing is a schematic view of the operational state of step (B) of a preferred embodiment of the present invention.

如第一圖所示，本發明一較佳實施例所提供的一種檢測研磨墊之研磨特性及使用壽命的方法，主要具有下列步驟：(A)備置已知研磨特性的一全新研磨墊11，如第二圖所示，接著對該全新研磨墊11依序進行多次震盪試驗，且每次的震盪試驗皆設定不同的震盪頻率及負載，本實施例中，震盪試驗係透過一施力探頭12配合凸輪機構或壓電元件等可產生反覆應力的設備，以對該全新研磨墊11的表面111施加垂直方向的一垂直反覆應力F1，藉以模擬各式被研磨工件(例如：晶圓或金屬表面)表面粗糙峰滑過該全新研磨墊11的實際狀況；其中，在執行前述的每次震盪試驗時，同時偵測該全新研磨墊11的表面111的反應，於本實施例中，該全新研磨墊11的表面111因受到上述垂直反覆應力F1的施加而產生對應的反應力F2，故本實施例利用設置在該施力探頭12上的一測力裝置13(如Load cell等感測力量元件)，量測該全新研磨墊11的反應力F2；爾後，將上述已知及測得的資訊，配合該全新研磨墊11的已知研磨特性，建立一比對資料庫，至此即完成步驟(A)的程序。As shown in the first figure, a method for detecting the polishing characteristics and the service life of a polishing pad according to a preferred embodiment of the present invention mainly comprises the following steps: (A) preparing a new polishing pad 11 having known polishing characteristics. As shown in the second figure, the new polishing pad 11 is sequentially subjected to multiple oscillation tests in sequence, and each oscillation test is set with different oscillation frequency and load. In this embodiment, the oscillation test is transmitted through a force application probe. 12 cooperate with a cam mechanism or a piezoelectric element to generate a stress-relieving device to apply a vertical vertical stress F1 to the surface 111 of the new polishing pad 11 to simulate various workpieces to be polished (for example, wafer or metal) The surface roughness peak slid over the actual condition of the new polishing pad 11; wherein, in performing each of the aforementioned oscillation tests, the reaction of the surface 111 of the brand new polishing pad 11 is simultaneously detected, in this embodiment, the new The surface 111 of the polishing pad 11 is subjected to the application of the vertical vertical stress F1 to generate a corresponding reaction force F2. Therefore, the present embodiment utilizes a force measuring device 13 (such as a load) disposed on the force applying probe 12. Cell or the like sensing force element), measuring the reaction force F2 of the new polishing pad 11; then, combining the above known and measured information with the known polishing characteristics of the new polishing pad 11 to establish a comparison database At this point, the procedure of step (A) is completed.

另一提的是，為了達到更真實的研磨界面現象模擬，前述每次震盪頻率的數值，係可根據欲模擬之被研磨工件的表面粗糙峰的分佈密度而設定；此外，前述負載係可分成靜態負載與動態負載；其中，靜態負載的數值選定，係取決於該全新研磨墊11在實際研磨製程中所預定被施加的研磨下壓力P而定，而該動態負載的數值選定，則取決於欲模擬之被研磨工件的表面粗糙峰的平均高度；又，上述施力探頭12的幾何形狀，係可依照欲模擬之被研磨工件之表面粗糙峰的形狀特徵而選用之，藉由上述設定，可使模擬更趨真實，以提高檢測之準確度。In addition, in order to achieve a more realistic simulation of the grinding interface phenomenon, the value of each of the aforementioned oscillation frequencies can be set according to the distribution density of the surface roughness peak of the workpiece to be simulated; in addition, the aforementioned load system can be divided into Static load and dynamic load; wherein the value of the static load is selected depending on the grinding pressure P that the new polishing pad 11 is intended to be applied in the actual grinding process, and the value of the dynamic load is selected, depending on The average height of the rough surface of the surface of the workpiece to be grounded; and the geometry of the force applying probe 12 can be selected according to the shape characteristic of the surface rough peak of the workpiece to be simulated, by the above setting, The simulation can be made more realistic to improve the accuracy of the detection.

接著進行步驟(B)，如下述，並請配合第三圖：(B)備置預定用來研磨一實際被研磨工件的一待測研磨墊14(其研磨特性及使用壽命未知)，接著，對該待測研磨墊14進行一次震盪試驗，本實施例同樣透過該施力探頭12，以一預定震盪頻率與一預定負載，對該待測研磨墊14的表面141施加一垂直反覆應力F3，之後同樣利用該測力裝置13量測該待測研磨墊14的表面141的反應力F4。另須再次說明的是，為達更真實之模擬，前述預定震盪頻率的數值，係依據該實際被研磨工件的表面粗糙峰的分佈密度而選定；此外，前述預定負載同樣可分成靜態負載與動態負載，其等之數值的選定方式同上述步驟(A)的負載選定方式，於此容不贅述。Then proceed to step (B), as described below, and please cooperate with the third figure: (B) prepare a polishing pad 14 to be ground for polishing an actual workpiece to be ground (the grinding characteristics and service life are unknown), and then, The polishing pad 14 to be tested performs an oscillation test. The embodiment also applies a vertical repetitive stress F3 to the surface 141 of the polishing pad 14 to be tested through the urging probe 12 at a predetermined oscillation frequency and a predetermined load. The reaction force F4 of the surface 141 of the polishing pad 14 to be tested is measured by the force measuring device 13. It should be further explained that, in order to achieve a more realistic simulation, the value of the aforementioned predetermined oscillation frequency is selected according to the distribution density of the surface roughness peak of the actually ground workpiece; in addition, the aforementioned predetermined load can also be divided into static load and dynamics. The selection method of the load, and the like is the same as the load selection method of the above step (A), and details are not described herein.

最後，進行步驟(C)，如下述：(C)將步驟(B)之待測研磨墊14的表面141的反應(本實施例為反應力F4)，與步驟(A)中的比對資料庫進行比對，即可間接地從具有相當於該待測研磨墊14之反應力F4的全新研磨墊，判定該待測研磨墊14在實際研磨製程中的研磨特性及使用壽命。Finally, step (C) is carried out as follows: (C) the reaction of the surface 141 of the polishing pad 14 to be tested in step (B) (the reaction force F4 in this embodiment), and the comparison data in the step (A) By comparing the libraries, the polishing characteristics and the service life of the polishing pad 14 to be tested in the actual polishing process can be determined indirectly from a brand new polishing pad having a reaction force F4 corresponding to the polishing pad 14 to be tested.

藉由上述步驟，係可使得未知特性的待測研磨墊不再需要進行大量的實際研磨試驗，即可被簡便快速地預估其實際研磨特性及使用壽命，藉以節省大量試驗時間及成本。By the above steps, the polishing pad to be tested of unknown characteristics can be easily and quickly estimated for its actual grinding characteristics and service life by eliminating a large number of actual grinding tests, thereby saving a lot of test time and cost.

11．．．全新研磨墊11. . . New polishing pad

111．．．表面111. . . surface

12．．．施力探頭12. . . Force probe

13．．．測力裝置13. . . Force measuring device

14．．．待測研磨墊14. . . Grinding pad to be tested

141．．．表面141. . . surface

F1．．．垂直反覆應力F1. . . Vertical stress

F2．．．反應力F2. . . reaction

F3．．．垂直反覆應力F3. . . Vertical stress

F4．．．反應力F4. . . reaction

P．．．研磨下壓力P. . . Grinding pressure

第一圖係本發明一較佳實施例之步驟流程圖。The first figure is a flow chart of the steps of a preferred embodiment of the present invention.

第二圖係本發明一較佳實施例之步驟(A)的操作狀態示意圖。The second drawing is a schematic view of the operational state of step (A) of a preferred embodiment of the present invention.

第三圖係本發明一較佳實施例之步驟(B)的操作狀態示意圖。The third drawing is a schematic view of the operational state of step (B) of a preferred embodiment of the present invention.

Claims (8)

一種檢測研磨墊之研磨特性及使用壽命的方法，包含有下列步驟：(A)備置已知研磨特性的全新研磨墊，對該全新研磨墊依序進行具有不同震盪頻率及負載的多次震盪試驗，並於執行每次震盪試驗時，偵測該全新研磨墊的表面的反應，並配合該全新研磨墊的已知研磨特性，建立一比對資料庫；(B)備置用以研磨一被研磨工件的一待測研磨墊，對該待測研磨墊進行具有一預定震盪頻率及一預定負載的震盪試驗，並偵測該待測研磨墊的表面的反應；以及(C)將步驟(B)之待測研磨墊的表面的反應與步驟(A)中的比對資料庫進行比對，藉以判定該待測研磨墊的研磨特性及使用壽命。A method for detecting the grinding characteristics and service life of a polishing pad comprises the following steps: (A) preparing a new polishing pad with known grinding characteristics, and sequentially performing a plurality of oscillation tests with different oscillation frequencies and loads on the new polishing pad. And detecting the reaction of the surface of the new polishing pad during each oscillation test, and establishing a comparison database in accordance with the known polishing characteristics of the new polishing pad; (B) preparing for grinding and grinding a polishing pad to be tested, an oscillation test having a predetermined oscillation frequency and a predetermined load on the polishing pad to be tested, and detecting a reaction of the surface of the polishing pad to be tested; and (C) step (B) The reaction of the surface of the polishing pad to be tested is compared with the comparison database in the step (A) to determine the polishing characteristics and the service life of the polishing pad to be tested. 依據申請專利範圍第1項所述之檢測研磨墊之研磨特性及使用壽命的方法，其中：步驟(A)與步驟(B)中的震盪試驗，係分別指將一垂直反覆應力施加於該全新研磨墊與該待測研磨墊的表面。The method for detecting the polishing characteristics and the service life of the polishing pad according to the first aspect of the patent application, wherein the oscillation test in the steps (A) and (B) respectively refers to applying a vertical reverse stress to the new one. A polishing pad and a surface of the polishing pad to be tested. 依據申請專利範圍第2項所述之檢測研磨墊之研磨特性及使用壽命的方法，其中：該垂直反覆應力的施加，係透過一施力探頭施力於該全新研磨墊與該待測研磨墊的表面，其中，該施力探頭的幾何形狀，係根據該被研磨工件之表面粗糙峰的形狀而定。The method for detecting the polishing characteristics and the service life of the polishing pad according to the second aspect of the patent application, wherein: the application of the vertical repetitive stress is applied to the new polishing pad and the polishing pad to be tested through a force applying probe The surface of the force applying probe is determined according to the shape of the surface rough peak of the workpiece to be polished. 依據申請專利範圍第1項所述之檢測研磨墊之研磨特性及使用壽命的方法，其中：步驟(A)所述之偵測該全新研磨墊的表面的反應，以及步驟(B)所述之偵測該待測研磨墊的表面的反應，係指利用一測力裝置量測該全新研磨墊及該待測研磨墊的表面的反應力。The method for detecting the polishing characteristics and the service life of the polishing pad according to the first aspect of the patent application, wherein: the reaction of detecting the surface of the brand new polishing pad described in the step (A), and the step (B) The reaction for detecting the surface of the polishing pad to be tested refers to measuring the reaction force of the surface of the new polishing pad and the polishing pad to be tested by using a force measuring device. 依據申請專利範圍第1項所述之檢測研磨墊之研磨特性及使用壽命的方法，其中：步驟(A)中的負載及步驟(B)中的預定負載，皆包括有靜態負載與動態負載。The method for detecting the grinding characteristics and the service life of the polishing pad according to the first aspect of the patent application, wherein the load in the step (A) and the predetermined load in the step (B) include a static load and a dynamic load. 依據申請專利範圍第5項所述之檢測研磨墊之研磨特性及使用壽命的方法，其中：步驟(B)之靜態負載的數值選定，係取決於該待測研磨墊在實際研磨製程中所被施加的研磨下壓力而定。The method for detecting the grinding characteristics and the service life of the polishing pad according to the fifth aspect of the patent application, wherein: the value of the static load of the step (B) is selected according to the polishing pad to be tested in the actual grinding process. Depending on the applied pressure under the grinding. 依據申請專利範圍第5項所述之檢測研磨墊之研磨特性及使用壽命的方法，其中：步驟(B)之動態負載的數值選定，係取決於該被研磨工件的表面粗糙峰的平均高度而定。The method for detecting the grinding characteristics and the service life of the polishing pad according to the fifth aspect of the patent application, wherein the value of the dynamic load of the step (B) is determined according to the average height of the surface roughness peak of the workpiece to be polished. set. 依據申請專利範圍第1項所述之檢測研磨墊之研磨特性及使用壽命的方法，其中：步驟(B)之預定震盪頻率的數值選定，係取決於該被研磨工件的表面粗糙峰的分佈密度而定。The method for detecting the grinding characteristics and the service life of the polishing pad according to the first aspect of the patent application, wherein the value of the predetermined oscillation frequency of the step (B) is determined according to the distribution density of the surface rough peak of the workpiece to be polished. And set.
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