WO2012067332A1 - Substrate-transfer apparatus and substrate-transfer method using same - Google Patents

Abstract

The present invention relates to a substrate transfer apparatus. The substrate transfer apparatus, which is configured to transfer a substrate when the substrate is vertically fixed, includes: a pair of support brackets arranged in parallel and spaced apart from each other by a predetermined distance; a drive shaft on which a plurality of driving gears are disposed at a predetermined distance along a shaft direction of the drive shaft, the drive shaft being disposed in a length direction of one bracket from the pair of support brackets; a plurality of driven shafts disposed perpendicularly to the driving shaft between the pair of support brackets, wherein driven gears, which engage with the driving gears, respectively, are disposed on one side of the plurality of driven shafts; at least one support roller fixed to the driven shafts, wherein the at least one support roller is rotatably interlocked with the driven shafts; and a jig seated on the support roller and transferred by the support roller. The surface of the jig is coated with a coating material. The coating material includes either Teflon or Raydent.

Description

Substrate transfer device and substrate transfer method using same

The present invention relates to a substrate transfer apparatus and a substrate transfer method using the same. More particularly, the present invention relates to a substrate transfer apparatus for fixing a substrate in a vertical state and transferring the substrate to a predetermined processing step, and a substrate transfer method using the same.

In general, a semiconductor module is a single component unit in which several components or devices having regularity and separation are mounted on one printed circuit board (hereinafter, referred to as a PCB) to perform a predetermined function. It refers to a semiconductor device that is considered to be, and a representative module includes memory modules such as DRAM and SYNKDRAM in which various memory semiconductor devices can be mounted on a single PCB and a high capacity effect can be obtained at low cost. .

On the other hand, the PCB of the semiconductor module is typically manufactured and supplied in a soft arrangement to reduce the cost and improve the productivity is used to cut into a single PCB by a cutter.

Such a PCB is usually subjected to a number of processes to form a pattern for component mounting, the conventional substrate processing method of a conventional semiconductor module PCB is arranged at a predetermined interval on the transfer conveyor while the operator holding a plurality of PCBs. This was fed to the line for the process.

However, this conventional substrate processing method has a problem that the productivity is significantly reduced because the PCB is supplied to the transfer conveyor by the manual operation of the operator.

In order to solve this problem, in recent years, a plurality of PCBs mounted on a cassette are moved to a process conveyor using a robot to pursue process uniformity and to minimize damage to the PCB during the process.

However, even in such a case, since the PCB is horizontally seated on the transfer conveyor or is inclined, the PCB is damaged by friction between the transfer conveyor and the PCB. In addition, the substrate has a size and thickness of nano units, and there is a problem in that the substrate is damaged by the gas or liquid sprayed through the nozzle during the developing process, the cleaning process, and the drying process.

Therefore, the PCB is fixed in a vertical state and transferred to a predetermined process treatment section, thereby preventing the PCB from being damaged in the process. In this case, the chemical liquid sprayed onto the PCB for the predetermined process remains in place. As the device enters the next process, there is a problem that a bad state of the PCB occurs due to the chemical liquid.

The present invention has been made to solve the above problems, an object of the present invention is to fix the substrate to be processed in a vertical state to perform the process to prevent damage to the substrate during the process, the substrate It is to provide a substrate transfer apparatus and a substrate transfer method using the same by smoothly treating the surface of the transfer apparatus to minimize the remaining of the used chemical liquid on the surface of the substrate transfer apparatus, thereby increasing the yield in the substrate processing process. .

The technical problem to be achieved by the present invention is not limited to the technical problem mentioned above, and other technical problems not mentioned above may be clearly understood by those skilled in the art from the following description. will be.

In order to achieve the above object, a substrate transfer apparatus for fixing and transporting a substrate of the present invention in a vertical state includes a pair of support brackets arranged to be spaced apart at regular intervals in parallel to each other; A drive shaft disposed in one of the pair of support brackets along a length direction thereof, and a plurality of drive gears disposed along a axial direction at regular intervals; A plurality of driven shafts disposed to be orthogonal to the drive shaft between the pair of support brackets, one side of which is provided with a driven gear that meshes with the drive gear; At least one support roller fixed to the driven shaft and rotated in association with the driven shaft; And a jig seated on and supported by the support roller. It includes, the surface of the jig is coated with a coating material is coated, the coating material is characterized in that any one of Teflon or radant.

The jig may further include a horizontal frame seated on the support roller, a vertical frame extending vertically upward from both sides of the horizontal frame, a support frame provided at upper and lower ends of the vertical frame, and the substrate. It is configured to include a plurality of chucking members provided in the support frame to fix the arrangement.

In addition, a guide groove is formed on an outer circumferential surface of the support roller, guide protrusions corresponding to the guide groove are formed on both side lower surfaces of the horizontal frame, and the guide protrusion is inserted into the guide groove.

In addition, the guide protrusion is characterized in that it is formed along both longitudinal directions of the horizontal frame.

In order to achieve the above object, a substrate transfer method of fixing and transporting a substrate of the present invention in a vertical state includes: loading a substrate to be processed in a horizontal state in a loading section; Chucking the substrate in a vertical state to the chucking member of the jig for transporting the substrate; Transferring the jig to a processing section to perform a predetermined process on the substrate; Separating the substrate from the jig by transferring the jig to an unloading section; And transferring the jig to the loading section. It includes, the surface of the jig is coated with a coating material is coated, the coating material is characterized in that any one of Teflon or radant.

In addition, the plurality of the jig is continuously transferred to the processing section in the step of performing a predetermined process on the substrate.

According to the present invention, there is an advantage of preventing the substrate from being damaged during the process by performing the process by fixing the substrate to be processed in a vertical state.

In addition, there is an advantage that the yield in the substrate processing process is increased by smoothly treating the surface of the substrate transfer device to minimize the remaining of the used chemical liquid on the surface of the substrate transfer device.

1 is a perspective view showing a substrate transfer apparatus according to an embodiment of the present invention.

2 is a plan view showing a substrate transfer apparatus according to an embodiment of the present invention.

3 is a front view showing a substrate transfer apparatus according to an embodiment of the present invention.

Figure 4 is a side cross-sectional view showing a horizontal frame and the support roller of the substrate transfer apparatus according to an embodiment of the present invention.

Figure 5 is a side cross-sectional view showing a horizontal frame and the support roller of the substrate transfer apparatus according to another embodiment of the present invention.

6 is a flow chart showing a substrate transfer method according to an embodiment of the present invention.

FIG. 7 is a side view schematically illustrating an operation process of standing a substrate in a vertical state and chucking the jig in the substrate transfer method according to an exemplary embodiment of the present invention.

8 is a plan view schematically showing a process flow of a substrate transfer method according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this process, the size or shape of the components shown in the drawings may be exaggerated for clarity and convenience of description. In addition, terms that are specifically defined in consideration of the configuration and operation of the present invention may vary depending on the intention or custom of the user or operator. Definitions of these terms should be made based on the contents throughout the specification. And the spirit of the present invention is not limited to the embodiments presented, those skilled in the art of understanding the spirit of the present invention can easily implement other embodiments within the scope of the same idea, but also within the scope of the present invention Of course.

1 is a perspective view showing a substrate transfer apparatus according to an embodiment of the present invention, Figure 2 is a plan view showing a substrate transfer apparatus according to an embodiment of the present invention, Figure 3 is a substrate according to an embodiment of the present invention The front view which showed the conveying apparatus. Referring to Figures 1 to 3 will be described in detail the structure and operation of the substrate transfer apparatus.

1 to 3, the substrate transfer apparatus of the present invention has a pair of support brackets 100, a drive shaft 200 disposed on any one of the pair of brackets, and the drive shaft 200. It comprises a plurality of driven shaft 300 to be orthogonally arranged, a support roller 400 fixed on the driven shaft 300 and a jig 500 seated and transported to the support roller 400.

The pair of support brackets 100 are arranged in parallel with each other at a predetermined distance so as to provide a space in which the jig 500 is transported, and are fixed to the bottom surface thereof, and the cross-section of the support brackets 100 is formed in an 'L' shape. . In addition, the driving shaft 200 is provided on any one of the pair of support brackets 100, and the driven shaft 300 is provided between the pair of support brackets 100, wherein the support brackets 100 are provided. ) Serves to support the drive shaft 200 and the driven shaft 300.

As described above, the drive shaft 200 is disposed along a length direction of any one of the pair of support brackets 100, and a plurality of drive gears 210 are fixed to the drive shaft 200 along the axis direction thereof. Are provided at intervals.

In addition, a plurality of driven shafts 300 are disposed to be orthogonal to the drive shaft 200 between the pair of support brackets 100, and one side of the driven shaft 300 fits the driving gear 210. The physics driven gear 310 is provided. Therefore, the drive gear 210 is provided to correspond to the number of the driven shaft 300.

The drive shaft 200 and the driven shaft 300 is connected to a motor (not shown) to provide a driving force for transferring the jig 500 to the support roller 400. Specifically, when the motor (not shown) is driven, the drive shaft 200 rotates in one direction by the driving force of the motor (not shown), and the drive gear 210 is linked to the rotation of the drive shaft 200. Rotate in one direction.

When the driving gear 210 rotates in one direction, the driven gear 310 engaged with the driving gear 210 also rotates in one direction, and the driven shaft is linked to the rotation of the driven gear 310. As the 300 is rotated in one direction, a driving force for transferring the jig 500 is generated.

On the other hand, at least one support roller 400 is fixed on the driven shaft 300, the support roller 400 is rotated in conjunction with the rotation of the driven shaft 300 is seated on the support roller 400 The jig 500 is transferred in one direction. As shown in FIGS. 1 to 3, the support roller 400 is provided on the driven shaft 300 by a pair at intervals of approximately the width of the jig 500, but the shape of the jig 500 or The support roller 400 may be provided in three or more at regular intervals on the driven shaft 300 according to the weight, etc., but the content of the present invention is not limited by the number of the support rollers 400. .

As described above, the jig 500 transfers the substrate S, which is seated on the support roller 400 and subjected to the process, and includes a horizontal frame 510, a vertical frame 520, and a support frame 530. And the chucking member 540.

The horizontal frame 510 is seated on the support roller 400 and transported in one direction, and is formed to have a shape of a substantially rectangular parallelepiped. In addition, the width of the horizontal frame 510 is formed to correspond to the spaced apart the pair of support rollers 400, the length of the horizontal frame 510 is formed to correspond to the width of the substrate (S). .

The vertical frame 520 extends vertically upward from both sides of the horizontal frame 510, and the substrate S is fixed between the vertical frames 520.

The support frame 530 is provided at the upper end and the lower end of each vertical frame 520 provided at both sides of the horizontal frame 510, the plurality of chucking member 540 is provided on the support frame 530 to process the process The substrate S to be transferred is fixedly placed.

As described above, the jig 500 serves to fix the substrate S and to transfer the substrate S in one direction so as to be processed in the substrate S. A coating material is coated on the surface of the jig 500. That is, one of teflon or raydent, which is a coating material, is applied to the surface of the jig 500 so that a chemical solution or the like is applied to the jig 500 in the process of processing the substrate S. When buried, allow it to flow down easily.

In detail, the surfaces of the horizontal frame 510, the vertical frame 520, the support frame 530, the chucking member 540, and the like that make up the jig 500 are polished to smooth the surface roughness. Then, by coating a coating material to coat the components of the jig 500 is minimized that the processing of the substrate (S) is hindered by the chemicals and the like buried in the jig 500.

As described above, such a coating material is provided with either teflon or radant, wherein the teflon or radant may be applied as a thin thin film on the surface of the base material and coated even if the chemical liquid used for the process treatment is strongly adhesive. Since it does not adhere to the surface, residuals such as chemicals do not occur in the jig 500.

Meanwhile, referring to FIG. 3, guide grooves 410 are formed on the outer circumferential surface of the support roller 400, and guide protrusions 512 corresponding to the guide grooves 410 on both side lower surfaces of the horizontal frame 510. Is formed in the direction in which the jig 500 is transferred, the guide protrusion 512 is inserted into the guide groove 410 during the transfer of the jig 500 to guide the transfer of the jig 500.

That is, the guide protrusions 512 are formed along the longitudinal direction of the horizontal frame 510 on both lower surfaces of the horizontal frame 510 and are inserted into the guide grooves 410, thereby transferring the jig 500. In the process, the jig 500 is prevented from being separated from the support roller 400. In addition, since the substrate S is always disposed in the correct position even when the process is performed on the substrate S during the transfer process of the jig 500 by engaging the guide groove 410 and the guide protrusion 512. Damage to the substrate S due to an error during the process can be prevented.

Figure 4 is a side cross-sectional view showing a horizontal frame and the support roller of the substrate transfer apparatus according to an embodiment of the present invention, Figure 5 is a side cross-sectional view showing a horizontal frame and support roller of the substrate transfer apparatus according to another embodiment of the present invention. to be.

As shown in FIG. 4, according to an embodiment of the present invention, the guide groove 410 is formed as a groove having a predetermined depth at the center of the outer circumferential surface of the support roller 400, and the guide protrusion 512 is In order to correspond to the shape of the guide groove 410 is formed by forming a straight rib (rib) in the longitudinal direction on both sides of the horizontal frame (510). In this case, the jig 500 is transferred by the frictional force between the guide groove 410 and the guide protrusion 512.

On the other hand, as shown in Figure 5 according to another embodiment of the present invention the guide groove 420 is formed to have a gear tooth shape in the center of the outer peripheral surface of the support roller 400, the guide protrusion 522 is It is formed at regular intervals along both longitudinal directions of the horizontal frame 510 to be engaged with the guide groove 420. In this case, the jig 500 is transported by the frictional force and engagement between the guide groove 420 and the guide protrusion 522, and stops the jig 500 as necessary during the transfer process of the jig 500. In this case, the jig 500 is prevented from slipping from the support roller 400 so that the accuracy of the process is further improved.

6 is a flow chart illustrating a substrate transfer method according to an embodiment of the present invention, Figure 7 is a schematic diagram of the operation process of chucking the jig to stand the substrate in a vertical state in the substrate transfer method according to an embodiment of the present invention. 8 is a plan view schematically showing the process flow of the substrate transfer method according to an embodiment of the present invention. The substrate transfer method will be described in detail with reference to FIGS. 6 to 8.

First, in order to transfer the substrate S, which is a process target, to the process, according to an embodiment of the present invention, the substrate S having a circuit pattern or the like is loaded in the loading section 600 in a horizontal state. In other words, the substrate S is stacked on a cassette (not shown) or the like, and the cassette (not shown) is placed adjacent to the loading section 600 (S10). S) is introduced into the loading section 600 in a horizontal state.

When the substrate S is introduced into the loading section 600, the substrate S stands in a vertical state and chucked to the chucking member 540 for transferring the substrate S. (S20) In FIG. As shown, first, the robot arm 610 positioned above the loading section 600 descends to the substrate S side to fix the substrate S. As shown in FIG. The robot arm 610 rises by a predetermined height and rotates in one direction so that the substrate S stands in a vertical state.

When the substrate S stands in a vertical state, the robot arm 610 moves to the jig 500 disposed on one side of the loading section 600 to move the substrate S to the jig 500. Chuck. As described above, the chucking member 540 provided in the jig 500 fixes the substrate S to maintain the vertical state of the substrate S. As shown in FIG. When the substrate S is fixedly disposed by the chucking member 540, the robot arm 610 moves to the other side of the loading section 600.

In general, the robot arm 610 may be any as long as the robot arm 610 can rotate a joint or the like to move the substrate S and to stand the substrate S fixed in a horizontal state in a vertical state. It is preferable to have a structure which rotates a joint in the state which fixed the edge side in which the circuit pattern etc. are not formed in the board | substrate S.

Next, the jig 500 is transferred to the processing section 700 to perform a predetermined process on the substrate S fixedly disposed on the jig 500. (S30) That is, in the processing section 700, The process of developing the circuit pattern of the said board | substrate S, the process of washing the developed said board | substrate S, the process of drying the cleaned said board | substrate S, etc. are performed.

In addition, the jig 500 entered into the processing section 700 may perform the process by repeating forward and backward in parallel or performing the process by repeating forward and stop in parallel. This is because the jig 500 seated in the processing section 700 performs the repetitive work during the process of the substrate S, so that a slight position change of the jig 500 may occur in the processing section 700. In order to minimize the defect of the substrate (S) by increasing the process precision.

Meanwhile, a developing process, a cleaning process, and a drying process, which are process processes performed on the substrate S in the processing section 700, are generally known techniques for performing a process on the substrate S. It will be omitted.

When the process for the substrate S is completed in the processing section 700, the jig 500 is transferred to the unloading section 800 to separate the substrate S from the jig 500. That is, the robot arm 610 located above the unloading section 800 removes the substrate S from the jig 500 that has passed through the processing section 700, and is removed. The substrate S is transferred to the outside from the unloading section 800 is converted to a horizontal state in a vertical standing state. The substrate S transferred to the outside may be subjected to a post-treatment process or the like.

Here, the process of removing the substrate (S) from the jig 500 is the reverse of the process of chucking the substrate (S) in the vertical state to the chucking member 540 in the loading period 600 described above. As it proceeds, a detailed description thereof will be omitted.

Finally, the jig 500 from which the substrate S has been removed is transferred to the loading section 600. In other words, the jig 500 transfers the transport section within the unloading section 800. 900 is moved horizontally, and is transferred back to the loading section 600 through the transfer section 900 to perform a process for the new substrate (S).

On the other hand, according to the substrate transfer method according to an embodiment of the present invention the process yield by continuously transferring a plurality of the jig 500 to the processing section 700 to perform a predetermined process on the substrate (S) Can be improved.

Although embodiments according to the present invention have been described above, these are merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent embodiments of the present invention are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the following claims.

Claims (6)

In the substrate transfer apparatus for fixing and transporting the substrate in a vertical state, The substrate transfer device, A pair of support brackets arranged to be spaced apart at regular intervals in parallel to each other; A drive shaft disposed in one of the pair of support brackets along a length direction thereof, and a plurality of drive gears disposed along a axial direction at regular intervals; A plurality of driven shafts disposed to be orthogonal to the drive shaft between the pair of support brackets, one side of which is provided with a driven gear that meshes with the drive gear; At least one support roller fixed to the driven shaft and rotated in association with the driven shaft; And A jig seated on and supported by the support roller; Including; A coating material is coated and coated on the surface of the jig, and the coating material is any one of teflon or radant. The method of claim 1, The jig is, A horizontal frame seated and transported on the support roller; A vertical frame extending vertically upward from both sides of the horizontal frame; A support frame provided at an upper end and a lower end of the vertical frame; And a plurality of chucking members provided in the support frame to fix the substrate. The method of claim 2, Guide grooves are formed on an outer circumferential surface of the support roller, guide protrusions corresponding to the guide grooves are formed on both side lower surfaces of the horizontal frame, and the guide protrusions are inserted into the guide grooves. The method of claim 3, The guide projections are formed along the longitudinal direction of both sides of the horizontal frame. In the substrate transfer method for fixing and transporting the substrate in a vertical state, Loading a substrate to be processed in a horizontal state in a loading section; Chucking the substrate in a vertical state to the chucking member of the jig for transporting the substrate; Transferring the jig to a processing section to perform a predetermined process on the substrate; Separating the substrate from the jig by transferring the jig to an unloading section; And Transferring the jig to the loading section; Including, A coating material is coated and coated on the surface of the jig, and the coating material is any one of teflon or radant. The method of claim 5, And a plurality of the jigs are continuously transferred to the processing section in a step of performing a predetermined process on the substrate.

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