200810004 九、發明說明： 【發明所屬之技術領域】 本發明係關於具備狹縫噴嘴之基板處理裝置中的基板搬 送技術。 【先前技術】 自先前提出有如下技術：自狹縫喷嘴噴出藥液，於基板 表面形成薄膜之基板處理裝置中搬送基板。如此之技術， 例如於專利文獻1中有所揭示。 於專利文獻1中提出有如下技術：使保持基板之搬運梭 沿水平方向移動，藉由所謂之搬運梭搬送而搬送基板。 [專利文獻1]曰本專利特開平11_274265號公報 【發明内容】 [發明所欲解決之問題] 然而，於上述搬運梭搬送中存在如下問題：由於搬送單 疋與塗佈單元配置於塗佈單元之塗佈方向上，故當使狹縫 喷嘴於搬送單元側待機時，待機狀態下之狹縫噴嘴與搬送 基板之搬運梭會干擾。 又，存在如下問題：由於搬運梭之構造為僅保持基板之 側端部，故當基板大型化時，存在所保持之基板中央部f 曲、破損之可能。 再者，於搬運梭搬送中，搬送基板之高度位置固定，因 此存在裝置佈局之自由度降低之問題。 本發明係#於上述問題所完成者，其目的在於在且備狹 縫噴嘴之基板處理裝置中，恰t地搬送基板。 118227.doc 200810004 [解決問題之技術手段] 為解決上述問題，請求項1之發明之特徵在於：其係於 基板表面形成薄膜之基板處理裝置，且包括··塗佈單元， 八 自狹縫贺嘴噴出處理液，一面使上述狹縫喷嘴沿塗 佈方向移動而將處理液塗佈於基板表面；及搬送單元，其 於上述基板處理褒置中搬送基板；±㉛塗佈單元及上述搬 G單元排列於與上述塗佈方向垂直之方向上。 ，' 又，凊求項2之發明係如請求項1之發明之基板處理裝 置，其特被在於：上述搬送單元進而包括升降基板之升降 機構。 又明求項3之發明係如睛求項2之發明之基板處理裝 置，其特徵在於：進而包括後處理單元，其係對上述塗佈 早儿之處理結束之基板進行後處理，上述後處理單元與上 述搬送單元形成多層構造。 又，請求項4之發明係如請求項丨至3中任一項之發明之 w 基板處理裝置，其特徵在於：上述搬送單元包括支撐基板 中央部之支撐部件。 [發明之效果] 於請求項1至4之發明中，塗佈單元及搬送單元排列於與 塗佈方向垂直之方向上，藉此使塗佈單元中狹縫喷嘴之待 機位置之自由度增大。 於請求項2之發明中，搬送單元進而包括升降基板之升 降機構，藉此可進一步增大裝置佈局之自由度。尤其，可 自由地設計塗佈單元中之基板的高度位置’因此可易於對 H8227.doc 200810004 應基板之大型化。 於睛求項3之發明中，後處理單元與上述搬送單元形成 多層構造，藉此可抑制佔據面積增大。 於請求項4之發明中，包括支撐基板中央部之支撐部 件，藉此可抑制搬送過程中之基板彎曲，因此可易於對應 基板之大型化。 【實施方式】 η 以下，一面參照隨附圖式，一面對本發明之較佳實施形 悲加以詳細說明。 < 1·實施形態> 圖1係表示具備本發明之基板處理裝置丨之基板處理系統 的圖。 再者，於圖1中，為便於圖示及說明而定義如下，即· ζ 轴方向表示垂直方向，χγ平面表*水平面，㈣等係為 了便於把握位置關係而定義者，而並非對以下所說明之各 \ ^ 方向進行限定者。以下之圖亦相同。 基板處理系統除具備基板處理裝置1外，亦具備：搬入 ^ 2 ，、搬入要處理之基板90 ;清洗部3，其清洗並淨化基 板90;以及溫度調節部4〇、41、42，將基板9〇調節至特定 溫度。於基板處理系統中，將方形玻璃基板作為被處理基 板90 亥方形玻璃基板用於製造液晶顯示裝置之晝面面 板。 再者存清雖未圖示，但溫度調節部4 0、4 1、4 2具備加 熱基板90之加熱單元（加熱板）、冷卻基板卯之冷卻單元（冷 118227.doc 200810004 卻板）以及在該等單元間搬送基板9〇之搬送單元。 基板處理系統具備··曝光部5，其於基板之表面 曝光電路圖案等；顯像部6，其對被曝光之基板進行顯 像處理，檢查部7，其檢查基板90 ;以及搬出部8，其搬出 經基板處理系統處理後的基板90。 基板處理裝置丨具備··塗佈單元1〇，其將處理液塗佈至 土板表面，搬送單凡以，其在基板處理裝置丄中搬送基板 90"及乾燥單元30，其乾燥在塗佈單元10中已處理之基 板90，·且基板處理裝㈣系在基板處理系統中承擔在練 90之表面形成薄膜之塗佈部的裝置。 根據圖1可知，於基板處理裝置4，各單元排列於Y轴 方向上，取入並處理載置於溫度調節部41中之基板90,並 且將處理後之基板90搬出至溫度調節部42。 圖2係表示塗佈單元1〇之圖。 塗佈單具備平411，該平411具有作為用以載置並 」㈣被處理基板9G之保持台之功能，並且具有作為附屬之 各構造之基台的功能。平臺u係整體長方體形狀之石製， 且其上表面（保持面110)及侧面被加工成平坦面。 平臺11之上表面為水平面，且為基板90之保持面11〇。 於保持面110上分佈形成有複數個真空吸附口（未圖示）。並 且，该真空吸附口於塗佈單元1〇中處理基板9〇之期間吸附 基板90，藉此將基板9〇保持為特定之水平位置。 又，平臺11具備複數個頂升銷LP(lift pin)，且該頂升銷 LP可在Z軸方向上進退，藉此可將基板9〇載置於保持面11〇 H8227.doc 200810004 上，或者使基板90上升至特定之高度位置。 於平臺11上表面之（-Y)側固定設置走行軌llla，且於 (+Y)側固定設置走行軌111 b。走行軌111 a、111 b均以長度 方向沿者X轴方向之方式而配置。走行執llla具有引導下 述移動子124、134之移動方向之功能，且走行執丨丨lb具有 引導下述移動子125、135之移動方向之功能。即，走行執 llla、11 lb具有作為線性滑執之功能。 於平臺11側面之（-Y)側上部固定設置定子112a，且於 (+Y)側上部固定設置定子112b。 藉由定子112a與移動子124、134之電磁相互作用，而構 成生成直動驅動力之線性馬達。藉由定子112b與移動子 125、135之電磁相互作用，而同樣構成生成直動驅動力之 線性馬達。 進而，於平臺11側面之（-Y)側下部固定設置定標部 113a，且於（+Y)側下部固定設置定標部n3b、U4b。再 者，雖僅圖示符號，但於平臺11側面之側下部設置與 定標部114b對應之定標部ii4a。 定標部113a與固定於移動子134上之檢測子136構成線性 編碼器。即，由定標部l13a及檢測子136而構成之線性編 碼器’具有根據定標部113a與檢測子136之位置關係，而 檢測移動子13 4之位置之功能。 同樣’由定標部113b及檢測子137構成之線性編碼器， 具有檢測移動子135之位置之功能。又，由定標部114&及 檢測子126構成之線性編碼器，具有檢測移動子ι24之位置 118227.doc -9- 200810004 之功能。進而，由定標部114b及檢測子127構成之線性編 碼器’具有檢測移動子125之位置之功能。 於平臺11之（-X)側設置有待機空間115，且於平臺丨丨之 (+X)側設置有待機空間丨丨6。再者，雖省略圖示，但於每 個待機空間115、11 6中，均設置有清洗下述狹縫喷嘴 12 1、1 3 1之清洗機構、及待機收容器等。 於平臺11之上方設置架橋構造12、13，該架橋構造12、 13自該平臺11之兩側部分大致水平地架設。 架橋構造12主要由喷嘴支撐部120與升降機構122、123 構成，上述喷嘴支撐部120以碳纖維樹脂為骨料，上述升 降機構122、123支撐喷嘴支撐部120之兩端。同樣，架橋 構造13主要由喷嘴支撐部130與升降機構132、133構成， 上述喷嘴支撐部13 0以碳纖維樹脂為骨料，上述升降機構 132、133支撐喷嘴支撐部130兩端。 於喷嘴支撐部120、130上，分別安裝有狹縫喷嘴121、 131。即’基板處理裝置1具備兩個狹縫喷嘴I]!、I]!。在 沿水平Y軸方向延伸之狹縫喷嘴121、131上，連接有供給 藥液（抗蝕液）之配管及包含抗蝕劑用泵之喷出構造（未圖 示）。 又，於狹縫喷嘴12 1、13 1上，在噴出前端部設置有狹縫 (未圖示），且當藉由抗钱劑用泵而供給抗蝕液時，自各個 狹縫喷出抗蝕液。 升降機構122、123分開配置於架橋構造丨2之兩側，並藉 由喷嘴支撐部120而與狹缝喷嘴121連結。升降機構122、 118227.doc •10- 200810004 123用以使狹縫噴嘴121同步升降，並且亦用以調整狹縫噴 嗔121在YZ平面内之姿勢。同樣，架橋構造13之升降機構 132、133用以使狹縫喷嘴131同步升降，並且用以調整狹 縫喷嘴13 1在YZ平面内之姿勢。 於升降機構122、123上，分別固定設置有上述移動子 124、125。又，於升降機構132、^上，分別固定設置有 上述移動子134、135。 f、 如上所述’藉由移動子124、134中任一個與定子112a之 電磁相互作用’而構成生成X軸方向之直動驅動力之線性 馬達。因此，升降機構122藉由移動子124及定子112a而移 動。又’升降機構132藉由移動子134及定子112a而移動。 再者’藉由走行執111a而將升降機構122、132之移動方向 規定為X轴方向。 同樣’藉由移動子125、135中任一個與定子112b之電磁 性相互作用，而構成生成χ軸方向之直動驅動力之線性馬 G 達。因此’升降機構123藉由移動子125及定子112b而移 動。又，升降機構丨33藉由移動子135及定子112b而移動。 再者’藉由走行執111b而將升降機構123、133之移動方向 規疋為X轴方向。 又’移動子124在X軸方向上之位置可根據檢測子126而 才双’則’並且移動子12 5在X軸方向上之位置可根據檢測子 127而檢測。同樣，移動子134在X轴方向上之位置可根據 檢測子136而檢測，並且移動子135在又軸方向上之位置可 根據檢測子137而檢測。 118227.doc 200810004 即’於塗佈單元10中，可一面葬由娩 猎由線性編碼器而檢測架 橋構造12、13在X軸方向上之位署 从 、 您位置，一面藉由線性馬達而 使架橋構造12、13在X軸方向上移動。 根據如此之構造，塗佈單元10一面使抗蝕液自狹縫噴嘴 d、131噴出，一面使狹縫噴嘴121、^沿著基板9〇之表 面移動。藉此，狹縫噴嘴121、131掃描基板9〇之表面，並 將抗蝕液噴出（塗佈）於基板9〇表面之特定區域（以下，稱為[Technical Field] The present invention relates to a substrate transfer technique in a substrate processing apparatus including a slit nozzle. [Prior Art] Since the prior art has been proposed, a liquid crystal is ejected from a slit nozzle, and a substrate is transported in a substrate processing apparatus that forms a thin film on the surface of the substrate. Such a technique is disclosed, for example, in Patent Document 1. Patent Document 1 proposes a technique of moving a transport shuttle holding a substrate in a horizontal direction and transporting the substrate by a so-called transport shuttle. [Problem to be Solved by the Invention] However, in the above-described conveyance of the shuttle, there is a problem in that the conveyance unit and the coating unit are disposed in the coating unit. In the application direction, when the slit nozzle is placed on the transport unit side, the slit nozzle in the standby state interferes with the transport shuttle of the transport substrate. Further, since the structure of the transport shuttle is such that only the side end portion of the substrate is held, when the substrate is increased in size, there is a possibility that the center portion of the substrate to be held is bent or broken. Further, in the conveyance shuttle conveyance, the height position of the conveyance substrate is fixed, and there is a problem that the degree of freedom in the layout of the apparatus is lowered. The present invention has been made in view of the above problems, and an object thereof is to convey a substrate in a substrate processing apparatus having a slit nozzle. [Technical means for solving the problem] In order to solve the above problem, the invention of claim 1 is characterized in that it is a substrate processing apparatus for forming a thin film on a surface of a substrate, and includes a coating unit, eight slits The processing liquid is ejected from the nozzle, and the processing liquid is applied to the surface of the substrate while moving the slit nozzle in the coating direction; and the transfer unit transports the substrate in the substrate processing unit; the ±31 coating unit and the moving G The cells are arranged in a direction perpendicular to the above-described coating direction. Further, the invention of claim 2 is the substrate processing apparatus of the invention of claim 1, wherein the transport unit further includes a lifting mechanism for elevating the substrate. The substrate processing apparatus according to the invention of claim 2, further comprising a post-processing unit that performs post-processing on the substrate on which the processing of the coating is completed, the post-processing The unit and the above-described transport unit form a multilayer structure. The invention of claim 4 is the w substrate processing apparatus according to any one of claims 3 to 3, wherein the transport unit includes a support member that supports a central portion of the substrate. [Effect of the Invention] In the inventions of claims 1 to 4, the coating unit and the conveying unit are arranged in a direction perpendicular to the coating direction, whereby the degree of freedom of the standby position of the slit nozzle in the coating unit is increased. . In the invention of claim 2, the transport unit further includes a lifting mechanism for elevating the substrate, whereby the degree of freedom in device layout can be further increased. In particular, the height position of the substrate in the coating unit can be freely designed, so that the size of the substrate can be easily increased. In the invention of claim 3, the post-processing unit and the transport unit form a multilayer structure, whereby an increase in the occupied area can be suppressed. According to the invention of claim 4, the support member at the central portion of the support substrate is provided, whereby the bending of the substrate during the transfer can be suppressed, so that the size of the substrate can be easily increased. [Embodiment] η Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. <1. Embodiments> Fig. 1 is a view showing a substrate processing system including a substrate processing apparatus according to the present invention. In addition, in FIG. 1, for convenience of illustration and description, it is defined as follows: ζ The axis direction indicates the vertical direction, the χ γ plane table * the water level, (4), etc. are defined for the purpose of grasping the positional relationship, and are not the following The description of each \ ^ direction is limited. The figures below are also the same. The substrate processing system includes, in addition to the substrate processing apparatus 1, a loading unit 2, a substrate 90 to be processed, a cleaning unit 3 for cleaning and purifying the substrate 90, and temperature adjusting units 4, 41, and 42 for the substrate. 9〇 Adjust to a specific temperature. In the substrate processing system, a square glass substrate was used as the substrate to be processed 90. The square glass substrate was used to fabricate a face sheet of a liquid crystal display device. Further, although not shown, the temperature adjustment units 40, 41, and 4 2 include a heating unit (heating plate) for heating the substrate 90, and a cooling unit for cooling the substrate (cold 118227.doc 200810004 board) and The transfer unit of the substrate 9 is transported between the units. The substrate processing system includes an exposure unit 5 that exposes a circuit pattern or the like on the surface of the substrate, a developing unit 6 that performs development processing on the exposed substrate, an inspection unit 7, an inspection substrate 90, and a removal unit 8, It carries out the substrate 90 processed by the substrate processing system. The substrate processing apparatus 丨 includes an application unit 1 that applies a treatment liquid to the surface of the soil plate, and transports the substrate 90" and the drying unit 30 in the substrate processing apparatus, and the drying is performed on the coating. The substrate 90 that has been processed in the unit 10, and the substrate processing package (4) is a device that is responsible for forming a coating portion of the film on the surface of the 90 in the substrate processing system. As is apparent from Fig. 1, in the substrate processing apparatus 4, each unit is arranged in the Y-axis direction, the substrate 90 placed in the temperature adjustment unit 41 is taken in and processed, and the processed substrate 90 is carried out to the temperature adjustment unit 42. Fig. 2 is a view showing the coating unit 1A. The coating sheet has a flat 411 having a function as a holding table for placing and (4) the substrate to be processed 9G, and having a function as a base for each of the attached structures. The platform u is made of a stone having an overall rectangular parallelepiped shape, and the upper surface (holding surface 110) and the side surface thereof are processed into a flat surface. The upper surface of the platform 11 is a horizontal plane and is a holding surface 11 of the substrate 90. A plurality of vacuum adsorption ports (not shown) are formed on the holding surface 110. Further, the vacuum adsorption port adsorbs the substrate 90 while the substrate 9 is being processed in the coating unit 1B, thereby holding the substrate 9A at a specific horizontal position. Moreover, the platform 11 is provided with a plurality of lift pins LP, and the lift pins LP can advance and retreat in the Z-axis direction, whereby the substrate 9 can be placed on the holding surface 11〇H8227.doc 200810004. Or the substrate 90 is raised to a specific height position. A running rail 111a is fixedly disposed on the (-Y) side of the upper surface of the platform 11, and a running rail 111b is fixedly disposed on the (+Y) side. The traveling rails 111a and 111b are arranged in such a manner that the longitudinal direction is along the X-axis direction. The walk llla has a function of guiding the moving directions of the movers 124, 134, and the walk lb has a function of guiding the moving directions of the movers 125, 135 described below. That is, the running llla, 11 lb has a function as a linear slip. A stator 112a is fixedly disposed on the (-Y) side upper portion of the side surface of the platform 11, and a stator 112b is fixedly disposed on the (+Y) side upper portion. The linear motor that generates the linear driving force is formed by the electromagnetic interaction of the stator 112a with the moving members 124, 134. The linear motor that generates the linear driving force is also constituted by the electromagnetic interaction of the stator 112b and the moving members 125, 135. Further, the scale portion 113a is fixed to the lower portion (-Y) side of the side surface of the stage 11, and the scale portions n3b and U4b are fixed to the lower portion of the (+Y) side. Further, although only the symbol is shown, the scale portion ii4a corresponding to the scale portion 114b is provided on the lower portion of the side surface of the stage 11. The scaling unit 113a and the detector 136 fixed to the moving sub-134 constitute a linear encoder. In other words, the linear encoder ’ configured by the scaling unit l13a and the detector 136 has a function of detecting the position of the slider 13 based on the positional relationship between the scaling unit 113a and the detector 136. Similarly, the linear encoder composed of the scaling unit 113b and the detector 137 has a function of detecting the position of the moving sub-135. Further, the linear encoder constituted by the scaling unit 114 & and the detector 126 has a function of detecting the position 118227.doc -9- 200810004 of the moving sub-note 24 . Further, the linear encoder ’ constituted by the scaling unit 114b and the detector 127 has a function of detecting the position of the moving sub-125. A standby space 115 is provided on the (-X) side of the platform 11, and a standby space 丨丨6 is provided on the (+X) side of the platform. Further, although not shown, each of the standby spaces 115 and 161 is provided with a cleaning mechanism for cleaning the slit nozzles 12 1 and 133 described below, a standby container, and the like. Overhang structures 12, 13 are provided above the platform 11, and the bridge structures 12, 13 are substantially horizontally erected from the sides of the platform 11. The bridge structure 12 is mainly composed of a nozzle support portion 120 and a lifting mechanism 122, 123. The nozzle support portion 120 has carbon fiber resin as an aggregate, and the lift mechanisms 122 and 123 support both ends of the nozzle support portion 120. Similarly, the bridging structure 13 is mainly composed of a nozzle supporting portion 130 and lifting mechanisms 132 and 133. The nozzle supporting portion 130 is made of carbon fiber resin as an aggregate, and the elevating mechanisms 132 and 133 support both ends of the nozzle supporting portion 130. The slit nozzles 121 and 131 are attached to the nozzle support portions 120 and 130, respectively. That is, the substrate processing apparatus 1 is provided with two slit nozzles I]!, I]!. In the slit nozzles 121 and 131 extending in the horizontal Y-axis direction, a pipe for supplying a chemical liquid (resist solution) and a discharge structure (not shown) including a pump for a resist are connected. Further, slits (not shown) are provided at the discharge tip end portions of the slit nozzles 12 1 and 13 1 , and when the resist liquid is supplied by the pump for the anti-money agent, the anti-spray is ejected from each slit. Corrosion. The elevating mechanisms 122 and 123 are disposed on both sides of the bridging structure 2, and are coupled to the slit nozzle 121 by the nozzle supporting portion 120. The lifting mechanism 122, 118227.doc • 10 - 200810004 123 is used to synchronously raise and lower the slit nozzle 121, and is also used to adjust the posture of the slit lance 121 in the YZ plane. Similarly, the elevating mechanisms 132, 133 of the bridging structure 13 are used to simultaneously raise and lower the slit nozzles 131 and to adjust the posture of the slit nozzles 13 1 in the YZ plane. The moving members 124 and 125 are fixed to the lifting mechanisms 122 and 123, respectively. Further, the moving members 134 and 135 are fixed to the elevating mechanisms 132 and φ, respectively. f. As described above, the linear motor that generates the linear driving force in the X-axis direction is constituted by the electromagnetic interaction between the moving members 124 and 134 and the stator 112a. Therefore, the elevating mechanism 122 is moved by the moving member 124 and the stator 112a. Further, the elevating mechanism 132 is moved by the moving member 134 and the stator 112a. Further, the moving direction of the elevating mechanisms 122 and 132 is defined as the X-axis direction by the running command 111a. Similarly, by the electromagnetic interaction of any one of the moving members 125, 135 and the stator 112b, a linear horse G to generate a linear driving force in the direction of the x-axis is formed. Therefore, the elevating mechanism 123 is moved by the moving member 125 and the stator 112b. Further, the elevating mechanism 丨33 is moved by the moving sub-135 and the stator 112b. Further, the moving direction of the elevating mechanisms 123 and 133 is defined as the X-axis direction by the running command 111b. Further, the position of the moving sub-124 in the X-axis direction can be doubled according to the detector 126 and the position of the moving sub-125 in the X-axis direction can be detected based on the detector 127. Similarly, the position of the moving sub-134 in the X-axis direction can be detected based on the detecting sub-136, and the position of the moving sub-135 in the re-axis direction can be detected based on the detecting sub-137. 118227.doc 200810004 That is, in the coating unit 10, the linear encoder can be used to detect the bridging structure 12, 13 in the X-axis direction, and the position is controlled by a linear motor. The bridge structures 12, 13 move in the X-axis direction. According to such a configuration, the coating unit 10 moves the slit nozzles 121 and θ along the surface of the substrate 9 while discharging the resist liquid from the slit nozzles d and 131. Thereby, the slit nozzles 121 and 131 scan the surface of the substrate 9 and spray (coat) the resist liquid on a specific region of the surface of the substrate 9 (hereinafter referred to as
「抗蝕劑塗佈區域」）。 即，於本實施形態之塗佈單元1 〇中，狹縫喷嘴121、13 1 之塗佈方向均為X軸方向。因此，基板處理裝置丨之各單元 之排列方向（Y軸方向），與塗佈單元1〇之塗佈方向（χ軸方 向）垂直。 再者，於狹縫噴嘴121不塗佈抗蝕液時，如圖2所示，狹 縫噴鳴12 1待機於待機空間1丨5之上方。又，於狹縫喷嘴 13 1不塗佈抗飿液時，如圖2所示，狹縫喷嘴13丨待機於待 機空間11 6之上方。 返回圖1，搬送單元20係於基板處理裝置1中搬送基板9〇 之單元’且上述搬送單元2〇具備搬送機械臂21、22及搬送 輸送機23。 圖3係表示搬送機械臂21之平面圖。又，圖4係表示搬送 機械臂2 1及塗佈單元丨〇之側視圖。 搬送機械臂21具備基台21〇、臂部211、升降機構216、 以及旋轉機構219，上述基台210用以固定搬送機械臂21之 各構成。 118227.doc -12- 200810004 臂部211具備機械手212、第1臂214及第2臂215。又，機 械手212具備4個夾盤213。 於夾盤213上，豎直設置有複數個未圖示之支撐銷。機 械手212藉由使設置於夾盤213上之複數個支撐銷之前端與 基板90之背面抵接，而自下方支撐基板9〇。 如上所述，機械手212具備4個夾盤213，藉此搬送機械 臂21不僅可支撐基板90之端部，亦可支撐中央部。因此， 與如先前之搬運梭搬送般僅支·撐基板9〇之端部之情形相 比，可抑制所支撐之基板90之彎曲，因此即使於基板90大 型化之情形時，亦可無破損地搬送基板9〇。 第1臂214及第2臂215與機械手212連結。根據如此之構 造’臂部211可伸縮自由，且機械手212可在水平面内進 退。再者，本實施形態之搬送機械臂21僅在沿γ軸之方向 上進退。又，本實施形態之搬送機械臂21於圖3所示之狀 悲下’沿（ + Y)方向前進，並沿（_γ)方向後退。 升降機構216具備支撐部件217及支柱部件218。藉由未 圖示之直動機構，安裝有臂部211之支撐部件217，可沿著 支柱部件2 1 8而沿Ζ軸方向升降。即，升降機構2丨6具有使 臂部211在特定範圍内沿z軸方向升降之功能。 如此，搬送機械臂21具備升降機構2 16，藉此可使由機 械手212所支撐之基板90沿2軸方向移動。即，搬送機械臂 21可於上下方向搬送基板9〇。 旋轉機構219具備未圖示之旋轉馬達，且使臂部2ιι及升 降機構216以軸〇為中心而一體旋轉。#，旋轉機構219具 118227.doc -13- 200810004 有调整臂部211之進退方向之功能，例如，由圖3所示之狀 態可知’若旋轉機構219旋轉180。，則臂部211成為向後轉 之狀悲。即，變成沿（-Y)方向前進，並沿（+γ)方向後退之 狀態。 圖5係表示搬送機械臂22之平面圖。又，圖6係表示搬送 機械臂22之側視圖。 搬送機械臂22具備基台220、上臂部221、下臂部222、 升降機構223及旋轉機構224。 搬送機械臂22與搬送機械臂21之不同之處在於具備上臂 部221及下臂部222，上述上臂部221及下臂部222分別與搬 送機械臂21之臂部211具有大致相同之構造。 再者，本實施形態之升降機構223及旋轉機構224，均係 使上臂部221及下臂部222—體升降或者旋轉之機構。即， 於升降機構223變更上臂部221之高度位置時，同時亦變更 下臂部222之高度位置。又，於旋轉機構224變更上臂部 221之朝向時，同時下臂部222之朝向亦變更。然而，搬送 機械臂22亦可分別具備獨立變更上臂部221及下臂部222之 高度位置或者朝向之機構。 圖7係表示乾燥單元3〇及搬送輸送機23之圖。 乾燥單元30具備蓋部31、腔室32及吸引機構34，且乾燥 PO 一 早7030配置於搬送輸送機23(搬送單元20)之上方。乾燥單 元30構成為如下單元，即，對經塗佈單元1〇處理後之基板 90 ’進行作為後處理之乾燥處理。 蓋部3 1係以與χγ平面平行之方式而配置之板狀部件， H8227.doc -14- 200810004 並藉由未圖示之框架而支撐。又，如圖7之箭頭所示，蓋 部31可沿Z軸方向升降，且在上方位置（圖7所示之位置）與 下方位置之間升降。再者，蓋部31於下方位置迎合腔室 32 ° 腔室32係主要形成乾燥單元3〇之處理室之部件。 於蓋部31之下表面及腔室32之上表面形成有凹口，且蓋 部31與腔室32彼此迎合，藉此形成密閉之處理空間33。再 r 者，處理空間33形成為可充分收容水平姿勢之基板90之大 小的空間。 吸引機構34主要由配管構成，該配管使裝置外之空氣調 節裝置與處理空間33連通。根據如此之構造，於乾燥單元 30中，藉由裝置外之空氣調節裝置，可吸引處理空間”内 之環境氣體。即，乾燥單元30可進行減壓乾燥處理。 再者，洋情雖未圖示，但乾燥單元3〇具備自下方貫通腔 室32之複數個頂升銷（未圖示）。並且，該複數個頂升銷之 V.y 前端與基板90之背面抵接，藉此乾燥單元30自下方支撐已 搬入之基板90。又，複數個頂升銷可於支撐基板9〇之狀態 下進仃升降，因此乾燥單元3〇可調整已搬入之基板9〇在2 軸方向上之高度位置。 搬运輸送機23具備複數個排列於γ軸方向上之搬送滾筒 230。各滾筒230以其長度方向均與χ軸平行之方式而配 置。又，各搬送滾筒23〇分別具有與χ軸平行之旋轉軸，並 藉由未圖示之旋轉機構而旋轉。 搬入搬送輸送機23之基板90由複數個搬送滾筒23〇之上 118227.doc -】5· 200810004 表面支撐’並藉由該等搬送滚筒230旋轉而沿γ軸方向搬 送。再者，搬送輸送機23決定各搬送滾筒23〇之旋轉方 向’以便沿（+Υ)方向搬送基板9〇。 之高度位置，以成為温度 置。 統一各搬送滾筒230之上表面 調節部42接收基板9〇時之高度位"Resist coated area"). That is, in the coating unit 1 of the present embodiment, the application directions of the slit nozzles 121 and 13 1 are all in the X-axis direction. Therefore, the arrangement direction (Y-axis direction) of each unit of the substrate processing apparatus 垂直 is perpendicular to the application direction (the y-axis direction) of the coating unit 1A. Further, when the slit nozzle 121 is not coated with the resist liquid, as shown in Fig. 2, the slit whistles 12 1 stand by above the standby space 1丨5. Further, when the slit nozzle 13 1 is not coated with the anti-caries liquid, as shown in Fig. 2, the slit nozzle 13 is placed above the standby space 116. Referring back to Fig. 1, the transport unit 20 is a unit that transports the substrate 9A in the substrate processing apparatus 1, and the transport unit 2 includes the transport robots 21 and 22 and the transport conveyor 23. FIG. 3 is a plan view showing the transfer robot 21. 4 is a side view showing the transfer robot 2 1 and the coating unit 丨〇. The transport robot 21 includes a base 21, an arm portion 211, a lifting mechanism 216, and a rotating mechanism 219, and the base 210 fixes each of the transport robots 21. 118227.doc -12- 200810004 The arm portion 211 includes a robot hand 212, a first arm 214, and a second arm 215. Further, the robot hand 212 is provided with four chucks 213. On the chuck 213, a plurality of support pins (not shown) are vertically disposed. The robot hand 212 supports the substrate 9A from below by abutting the front ends of the plurality of support pins provided on the chuck 213 with the back surface of the substrate 90. As described above, the robot 212 is provided with four chucks 213, whereby the transport robot 21 can support not only the end portion of the substrate 90 but also the center portion. Therefore, the bending of the supported substrate 90 can be suppressed as compared with the case where only the end portion of the support substrate 9 is transported as in the case of the conventional shuttle transport, so that the substrate 90 can be prevented from being damaged even when the substrate 90 is enlarged. The substrate is transported 9〇. The first arm 214 and the second arm 215 are coupled to the robot hand 212. According to such a configuration, the arm portion 211 is retractable, and the robot 212 can retreat in the horizontal plane. Further, the transfer robot 21 of the present embodiment advances and retracts only in the direction along the γ-axis. Further, the transport robot arm 21 of the present embodiment advances in the (+Y) direction in the direction shown in Fig. 3, and retreats in the (_γ) direction. The elevating mechanism 216 includes a support member 217 and a strut member 218. The support member 217 to which the arm portion 211 is attached is attached to the support member 217 in the z-axis direction along the support member 2 18 by a linear motion mechanism (not shown). That is, the elevating mechanism 2丨6 has a function of elevating and lowering the arm portion 211 in the z-axis direction within a specific range. As described above, the transport robot 21 includes the elevating mechanism 2, whereby the substrate 90 supported by the robot 212 can be moved in the two-axis direction. In other words, the transfer robot 21 can transport the substrate 9A in the vertical direction. The rotation mechanism 219 includes a rotation motor (not shown), and the arm portion 2 and the elevation mechanism 216 are integrally rotated about the shaft. #, Rotating mechanism 219 118227.doc -13- 200810004 There is a function of adjusting the advancing and retracting direction of the arm portion 211. For example, it can be seen from the state shown in Fig. 3 that the rotating mechanism 219 is rotated by 180. Then, the arm portion 211 becomes a backward turn. That is, it becomes a state of advancing in the (-Y) direction and retreating in the (+γ) direction. FIG. 5 is a plan view showing the transfer robot 22 . Further, Fig. 6 is a side view showing the transfer robot 22. The transport robot 22 includes a base 220, an upper arm portion 221, a lower arm portion 222, a lifting mechanism 223, and a rotating mechanism 224. The transport robot 22 is different from the transport robot 21 in that it has an upper arm portion 221 and a lower arm portion 222, and the upper arm portion 221 and the lower arm portion 222 have substantially the same structure as the arm portion 211 of the transport robot arm 21. Further, both of the elevating mechanism 223 and the rotating mechanism 224 of the present embodiment are mechanisms for elevating or rotating the upper arm portion 221 and the lower arm portion 222. That is, when the elevation mechanism 223 changes the height position of the upper arm portion 221, the height position of the lower arm portion 222 is also changed. Further, when the rotation mechanism 224 changes the orientation of the upper arm portion 221, the orientation of the lower arm portion 222 is also changed. However, the transfer robot 22 may have a mechanism for independently changing the height position or orientation of the upper arm portion 221 and the lower arm portion 222. Fig. 7 is a view showing the drying unit 3A and the conveying conveyor 23. The drying unit 30 is provided with a lid portion 31, a chamber 32, and a suction mechanism 34, and the drying PO is disposed 7030 earlier than the conveyance conveyor 23 (transport unit 20). The drying unit 30 is configured as a unit in which the substrate 90' treated by the coating unit 1 is subjected to a drying treatment as a post-treatment. The lid portion 3 1 is a plate-like member that is disposed in parallel with the χ γ plane, and is supported by a frame (not shown) by H8227.doc -14-200810004. Further, as shown by the arrow in Fig. 7, the lid portion 31 is movable up and down in the Z-axis direction, and is raised and lowered between the upper position (the position shown in Fig. 7) and the lower position. Further, the lid portion 31 occupies the chamber at a lower position. The chamber 32 is a member of the processing chamber which mainly forms the drying unit 3''. A notch is formed on the lower surface of the lid portion 31 and the upper surface of the chamber 32, and the lid portion 31 and the chamber 32 are in contact with each other, thereby forming a sealed processing space 33. Further, the processing space 33 is formed as a space in which the substrate 90 in the horizontal posture can be sufficiently accommodated. The suction mechanism 34 is mainly constituted by a pipe that allows the air conditioning device outside the device to communicate with the processing space 33. According to such a configuration, in the drying unit 30, the ambient gas in the processing space can be attracted by the air conditioning device outside the device. That is, the drying unit 30 can perform the vacuum drying process. The drying unit 3 includes a plurality of jacking pins (not shown) that pass through the chamber 32 from below. Further, the Vy front ends of the plurality of jacking pins abut against the back surface of the substrate 90, whereby the drying unit 30 The substrate 90 that has been loaded is supported from below. Further, a plurality of jacking pins can be lifted and lowered in a state where the supporting substrate 9 is pressed, so that the drying unit 3 can adjust the height position of the loaded substrate 9 in the 2-axis direction. The transport conveyor 23 includes a plurality of transport rollers 230 arranged in the γ-axis direction. Each of the rollers 230 is disposed such that its longitudinal direction is parallel to the χ axis. Further, each of the transport rollers 23 平行 has a parallel with the χ axis. The rotating shaft is rotated by a rotating mechanism (not shown). The substrate 90 of the loading/unloading conveyor 23 is supported by a plurality of conveying rollers 23 118 118227.doc - 5 · 200810004 surface support twenty three 0 is rotated and conveyed in the γ-axis direction. Further, the conveyance conveyor 23 determines the rotation direction of each of the conveyance rollers 23 to transport the substrate 9 in the (+Υ) direction. The height position is set to a temperature. The height position of the upper surface adjustment portion 42 of the drum 230 when receiving the substrate 9〇
如此，於搬送輸送機23中統一各搬送滾筒23〇上表面之 高度位置’目此搬送輸送機23可財平姿勢搬送基板9〇。 又，由於搬送滾筒230上表面之高度位置為溫度調節部42 之路線之高度位置，故於搬送輸送機23與溫度調節部“之 間可易於交接基板90。 根據如上所述之構成，對基板處理裝置i中搬送基板9〇 之情形加以說明。 首先，搬送機械臂21具有將待機於溫度調節部4丨之基板 90搬入基板處理裝置i之功能。即，搬送機械臂21之臂部 211，於朝向（-Y)方向之狀態下沿（_γ)方向前進，並接收位 於溫度調節部41之特定位置之基板9〇，藉此將基板9〇搬入 基板處理裝置1。 此時，臂部211可藉由升降機構216而升降，因此故搬送 機械臂21可接收待機於任意高度位置（更詳細而言，於升 降機構216使臂部211升降之範圍内之高度位置）之基板 90。即’與先前之搬運梭搬送相比，可任意選擇使基板9〇 待機之位置，因此溫度調節部41之佈局的自由度增大。 接收基板90後，臂部2 11向（+γ)方向後退。於該狀態 下’旋轉機構219使臂部211旋轉18〇。，藉此將臂部211之 118227.doc -16 - 200810004 朝向變更為（+Y)方向。藉此，臂部211成為圖3中二點鎖線 所示之狀態。 繼而，升降機構216將臂部211自該狀態調整為向塗佈單 元10搬送基板90之高度位置。並且，當升降機構216之高 度調整結束時’臂部211向（+Υ)方向前進。藉此，臂部21 i 成為圖3中之實線所示之狀態。 於該狀態下，搬送機械臂21將藉由機械手212而保持之 f 基板90交接至平臺11，並搬入塗佈單元丨〇。即，搬送機械 臂21具有將搬入基板處理裝置1之基板9〇(搬送機械臂21自 溫度調節部41接收之基板90)搬送至塗佈單元1〇之功能。 當本實施形態之塗佈單元1 〇中搬入基板9〇時，如圖2所 示，塗佈單元10使狹縫喷嘴121、13丨於又軸方向之兩側待 機。換言之，將基板90搬送至塗佈單元1〇之搬送機械臂 21，相對於塗佈單元10，而配置於與塗佈單元1〇之塗佈方 向垂直之方向上，因此塗佈單元1〇可使狹縫噴嘴121、ΐ3ι v / 預先於x軸方向之兩側待機。 如此，在兩個狹縫喷嘴121、131分開待機於又軸方向之 狀態下，將基板90搬入狹縫喷嘴12ι、131之間之位置。因 此，於最初之塗佈處理中，即使於使用狹縫喷嘴121、ΐ3ι 中之任一個時，亦可馬上開始塗佈動作。 搬入塗佈單元10之基板90,藉由塗佈單元1〇而被塗佈抗 蝕液，但省略其詳情。 、孩而搬送機械臂22具有將經塗佈單元10處理後的基板 9〇自塗佈單元Π)搬出之功能。再者，基板9G之搬出係藉由 118227.doc 17 200810004 搬送機械臂22之上臂部221或者下臂部222中之任一方而進 行，以下，對藉由上臂部221而搬出基板9〇之例加以說 明。 首先，旋轉機構224將上臂部221之朝向調整為（_γ)方 向，且升降機構223將上臂部221調整為與塗佈單元1〇對應 之高度位置。於該狀態下，上臂部221使機械手向（_¥)方 向前進，藉此上臂部22丨自塗佈單元1〇接收基板卯。並 且，上臂部221使機械手向（+Υ)方向後退，藉此將所接收 之基板90自塗佈單元1〇搬出。 如此，搬送機械臂21、22可根據塗佈單元1〇而調整基板 90之搬入高度位置或者搬出高度位置，因此塗佈單元⑺之 佈局的自由度增大。即，基板處理裝置丨，可易於對應基 板90之大型化，而使塗佈單元1〇之平臺丨丨在z軸方向上之 尺寸大型化。 當自塗佈單元10搬出基板90時，搬送機械臂22藉由旋轉 機構224而將上臂部221之朝向變更為（+Y)方向。並且，根 據乾燥單元30，藉由升降機構223而調整上臂部221之高度 位置’上述上臂部22丨保持自塗佈單元丨〇所搬出之基板 90 〇 當高度調整結束時，上臂部221向乾燥單元30前進，並 將基板90交接至腔室32之頂升銷。即，搬送機械臂22具有 將基板90自塗佈單元10搬送至乾燥單元30之功能。 如此’由於搬送機械臂22可使所搬送之基板90沿Ζ軸方 向移動’故可將乾燥單元3〇配置於任意高度位置（更詳細 118227.doc -18- 200810004 而言，於升降機構223使上臂部221升降之範圍内之高度位 置）。因此，於基板處理裝置，可將乾燥單元3〇配置於 搬送輸送機23之上方（所謂之多層配置），因此可減小佔據 面積。 藉由乾燥單元30而處理搬送至乾燥單元3〇之基板9〇，但 省略其詳情。 經乾燥單元30處理後之基板90藉由搬送機械臂22之上臂 部22 1而接收’並將其自乾燥單元3〇搬出。再者，即使由 上臂部221搬入乾燥單元30之基板90，亦並非必須由上臂 部221搬出，亦可由下臂部222搬出。又，亦可進行如下動 作（交換動作），即，由下臂部222接收完成乾燥之基板9〇 後’將由上臂部221所保持之未乾燥之基板9〇搬入乾燥單 元30 〇 藉由升降機構223並根據搬送輸送機23，而調整將基板 90自乾燥單元30搬出之上臂部221之高度位置。當升降機 構223之高度調整結束後，上臂部221使保持基板90之機械 手沿（+Y)方向前進，並將該基板90搬入搬送輸送機23。 如此，由於搬送機械臂22可使所搬送之基板90沿Z軸方 向移動，故可將搬送輸送機23配置於任意高度位置（更詳 細而言，於升降機構223使上臂部221升降之範圍内之高度 位置）。因此，於基板處理裝置1中，可進行如下配置， 即’如上所述，使搬送輸送機23之高度位置與溫度調節部 42接收基板90之高度位置一致。換言之，可根據溫度調節 部42之規格而配置搬送輸送機23。 118227.doc -19- 200810004 將基板90搬入後，搬送輸送機23使搬送滾筒230旋轉， 藉此將所搬入之基板90沿（+Y)方向搬送至特定之位置。由 搬送輸送機23所搬送之基板90，由溫度調節部42接收。 即，搬送輸送機23具有將經基板處理裝置丨處理後之基板 90自基板處理裝置1中搬出的功能。In this way, the height position of the upper surface of each of the transport rollers 23 is unified in the transport conveyor 23. Thus, the transport conveyor 23 can transport the substrate 9A in a flat position. Further, since the height position of the upper surface of the transport cylinder 230 is the height position of the route of the temperature adjustment unit 42, the substrate 90 can be easily transferred between the transport conveyor 23 and the temperature control unit. The case where the substrate 9 is transported in the processing apparatus i will be described. First, the transport robot 21 has a function of loading the substrate 90 waiting for the temperature adjustment unit 4 into the substrate processing apparatus i. That is, the arm portion 211 of the robot arm 21 is transported. The substrate 9 is placed in the (_γ) direction in the direction of (-Y), and the substrate 9 is placed at a specific position of the temperature adjustment unit 41, whereby the substrate 9 is carried into the substrate processing apparatus 1. At this time, the arm 211 Since the elevating mechanism 216 can be moved up and down, the transport robot 21 can receive the substrate 90 that stands by at any height position (more specifically, the height position in the range in which the elevating mechanism 216 raises and lowers the arm portion 211). The degree of freedom in the layout of the temperature adjustment unit 41 is increased as compared with the previous transfer of the shuttle, and the degree of freedom of the layout of the temperature adjustment unit 41 is increased. After receiving the substrate 90, the arm portion 2 11 is oriented toward (+ γ). In this state, the "rotation mechanism 219 rotates the arm portion 211 by 18", thereby changing the direction of the 118227.doc -16 - 200810004 of the arm portion 211 to the (+Y) direction. Thereby, the arm portion 211 becomes The state indicated by the two-point lock line in Fig. 3. Then, the elevating mechanism 216 adjusts the arm portion 211 from the state to the height position at which the substrate 90 is conveyed to the coating unit 10. Further, when the height adjustment of the elevating mechanism 216 is completed, the arm The portion 211 advances in the (+Υ) direction. Thereby, the arm portion 21 i is in a state shown by the solid line in Fig. 3. In this state, the transport robot arm 21 holds the f-substrate 90 held by the robot 212. The transfer robot 11 carries the substrate 9 that is carried into the substrate processing apparatus 1 (the substrate 90 that the transfer robot 21 receives from the temperature adjustment unit 41) to the coating unit. When the substrate unit 9 is loaded into the substrate unit 9 of the present embodiment, as shown in Fig. 2, the coating unit 10 causes the slit nozzles 121 and 13 to stand on both sides in the axial direction. Transfer the substrate 90 to the transfer robot 21 of the coating unit 1 Since the coating unit 10 is disposed in a direction perpendicular to the application direction of the coating unit 1A, the coating unit 1 can wait for the slit nozzles 121 and ΐ3 to be in advance on both sides in the x-axis direction. In this manner, in a state in which the two slit nozzles 121 and 131 are separated from each other in the axial direction, the substrate 90 is carried into the position between the slit nozzles 12 and 131. Therefore, even in the initial coating process, even in use When any one of the nozzles 121 and ΐ3 is sewed, the coating operation can be started immediately. The substrate 90 loaded into the coating unit 10 is coated with the resist liquid by the coating unit 1 ,, but the details thereof are omitted. The child transport robot 22 has a function of transporting the substrate 9 processed by the coating unit 10 from the coating unit Π). Further, the substrate 9G is carried out by transporting either one of the upper arm portion 221 or the lower arm portion 222 of the robot arm 22 by 118227.doc 17 200810004, and hereinafter, the substrate 9 is carried out by the upper arm portion 221. Explain. First, the rotating mechanism 224 adjusts the orientation of the upper arm portion 221 to the (_γ) direction, and the elevating mechanism 223 adjusts the upper arm portion 221 to a height position corresponding to the coating unit 1A. In this state, the upper arm portion 221 advances the robot in the (_¥) direction, whereby the upper arm portion 22 receives the substrate cassette from the coating unit 1A. Further, the upper arm portion 221 retracts the robot in the (+Υ) direction, whereby the received substrate 90 is carried out from the coating unit 1A. As described above, the transport robots 21 and 22 can adjust the loading height position or the carry-out height position of the substrate 90 in accordance with the application unit 1〇, so that the degree of freedom in layout of the coating unit (7) is increased. In other words, the substrate processing apparatus 易于 can easily increase the size of the substrate 90 in the z-axis direction by increasing the size of the substrate 90. When the substrate 90 is carried out from the coating unit 10, the transfer robot 22 changes the orientation of the upper arm portion 221 to the (+Y) direction by the rotation mechanism 224. Further, according to the drying unit 30, the height position of the upper arm portion 221 is adjusted by the elevating mechanism 223. The upper arm portion 22 is held by the substrate 90 carried out from the coating unit. When the height adjustment is completed, the upper arm portion 221 is dried. Unit 30 is advanced and the substrate 90 is handed over to the top lift pin of chamber 32. That is, the transfer robot 22 has a function of transporting the substrate 90 from the coating unit 10 to the drying unit 30. Thus, since the transport robot 22 can move the transported substrate 90 in the z-axis direction, the drying unit 3 can be disposed at any height position (in more detail, 118227.doc -18-200810004, the lift mechanism 223 The height position within the range in which the upper arm portion 221 is raised and lowered). Therefore, in the substrate processing apparatus, the drying unit 3 can be disposed above the conveying conveyor 23 (so-called multi-layer arrangement), so that the occupation area can be reduced. The substrate 9 搬 conveyed to the drying unit 3 is processed by the drying unit 30, but the details thereof are omitted. The substrate 90 processed by the drying unit 30 is received by the upper arm portion 22 1 of the transfer robot 22 and carried out from the drying unit 3〇. Further, even if the substrate 90 of the drying unit 30 is carried by the upper arm portion 221, it is not necessarily carried out by the upper arm portion 221, and may be carried out by the lower arm portion 222. Further, an operation (exchange operation) may be performed in which the undried substrate 9 held by the upper arm portion 221 is carried into the drying unit 30 after receiving the dried substrate 9 by the lower arm portion 222, by the elevating mechanism 223, based on the conveyance conveyor 23, adjusts the height position at which the substrate 90 is carried out of the drying unit 30 from the upper arm portion 221. When the height adjustment of the elevator mechanism 223 is completed, the upper arm portion 221 advances the robot holding the substrate 90 in the (+Y) direction, and carries the substrate 90 into the conveyance conveyor 23. In this manner, since the transport robot 22 can move the transported substrate 90 in the Z-axis direction, the transport conveyor 23 can be disposed at an arbitrary height position (more specifically, the lift mechanism 223 raises and lowers the upper arm portion 221). Height position). Therefore, in the substrate processing apparatus 1, it is possible to arrange the height position of the transport conveyor 23 and the height position of the temperature adjustment unit 42 receiving the substrate 90 as described above. In other words, the transport conveyor 23 can be arranged in accordance with the specifications of the temperature adjustment unit 42. 118227.doc -19-200810004 After the substrate 90 is carried in, the transport conveyor 23 rotates the transport drum 230, thereby transporting the loaded substrate 90 to a specific position in the (+Y) direction. The substrate 90 conveyed by the conveyance conveyor 23 is received by the temperature adjustment unit 42. In other words, the transport conveyor 23 has a function of transporting the substrate 90 processed by the substrate processing apparatus from the substrate processing apparatus 1.
如上所述，於本實施形態之基板處理裝置丨中，塗佈單 元10及搬送單元20排列於與塗佈單元丨〇之塗佈方向垂直之 方向上。藉此，於塗佈單元1〇中，可使狹縫喷嘴121、m 於X軸方向之兩側待機。 再者，於本實施形態中，對塗佈單元1〇具備兩個狹縫噴 嘴121、131之情形進行了說明，但亦可適用於僅具備^固 狹縫噴嘴之塗佈單元。此時，塗佈單元可使狹縫噴嘴待機 於X軸方向之任一側，且塗佈單元之佈局的自由度增大。 < 2 ·變形例> U上，對本發明之實施形態進行了說明，但本發明並非 限定於上述實施形態，而可進行各種變形。 例如，於上述實施形態中，對與乾燥單元30形成多層構 造之搬送單元20(搬送輸送機23)設置於乾燥單元3〇下方之 例進行了說明，但搬送單元20之配置並非限定於此。即， 搬送單元20亦可設置於乾燥單元3〇之上方。 又’與乾燥單元30形成多 於搬送輸送機23。例如，亦 之裝置，或僅使基板9〇待機 溫度調節部42接收基板9〇之 層構造之搬送單元2〇並非限定 可為如轉盤般變更基板9〇方向 之緩衝器。即，適當地將對應 方法之構造的裝置設為搬送單 118227.doc -20- 200810004 元2 0即可。 又’搬送機械臂21亦可與搬送機械臂22相同，具備2個 臂部。 【圖式簡單說明】 ，圖1係表示具備本發明之基板處理裝置之基板處理系統 的圖。 圖2係表示塗佈單元之圖。 f、 圖3係表示搬送機械臂之平面圖。 圖4係表示搬送機械臂及塗佈單元之側視圖。 圖5係表示搬送機械臂之平面圖。 圖6係表示搬送機械臂之側視圖。 圖7係表示乾燥單元及搬送輸送機之圖。 【主要元件符號說明】 1 基板處理袭置 10 塗佈單元 11 平臺 20 搬送單元 21、22 搬送機械臂 23 搬送輸送機 30 乾燥單元 110 保持面 112a、112b 定子 124 、 125 、 134 、 135 移動子 121 、 131 狹縫嘴嘴 118227.doc -21 - 200810004 216 升降機構 219 旋轉機構 230 搬送滾筒 118227.doc -22-As described above, in the substrate processing apparatus according to the embodiment, the coating unit 10 and the conveying unit 20 are arranged in a direction perpendicular to the coating direction of the coating unit. Thereby, in the coating unit 1A, the slit nozzles 121 and m can be made to stand on both sides in the X-axis direction. Further, in the present embodiment, the case where the coating unit 1 is provided with the two slit nozzles 121 and 131 has been described. However, the present invention can also be applied to a coating unit including only the slit nozzle. At this time, the coating unit can stand the slit nozzle on either side of the X-axis direction, and the degree of freedom in the layout of the coating unit increases. <2. Modifications> The embodiment of the present invention has been described. However, the present invention is not limited to the above embodiment, and various modifications can be made. For example, in the above-described embodiment, the example in which the transport unit 20 (transport conveyor 23) having a multilayer structure with the drying unit 30 is disposed below the drying unit 3A has been described. However, the arrangement of the transport unit 20 is not limited thereto. That is, the transport unit 20 may be disposed above the drying unit 3A. Further, the drying unit 30 is formed more than the conveying conveyor 23. For example, the apparatus or the transport unit 2 that only has the layer structure in which the substrate 9 〇 standby temperature adjusting unit 42 receives the substrate 9 〇 is not limited to a damper that changes the direction of the substrate 9 as a turntable. That is, the apparatus for constructing the corresponding method is appropriately set to the transport order 118227.doc -20-200810004 yuan 2 0. Further, the transport robot 21 can be the same as the transport robot 22, and has two arm portions. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a substrate processing system including a substrate processing apparatus of the present invention. Fig. 2 is a view showing a coating unit. f. Fig. 3 is a plan view showing the transfer robot. Fig. 4 is a side view showing the transfer robot arm and the coating unit. Fig. 5 is a plan view showing the transfer robot. Fig. 6 is a side view showing the transfer robot. Fig. 7 is a view showing a drying unit and a conveying conveyor. [Description of main component symbols] 1 substrate processing apparatus 10 coating unit 11 platform 20 conveying unit 21, 22 conveying robot 23 conveying conveyor 30 drying unit 110 holding surfaces 112a, 112b stators 124, 125, 134, 135 moving sub-121 , 131 slit nozzle 118227.doc -21 - 200810004 216 lifting mechanism 219 rotating mechanism 230 conveying roller 118227.doc -22-