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WO2011152372A1 - Module de cellule solaire et son procédé de fabrication - Google Patents

Module de cellule solaire et son procédé de fabrication Download PDF

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Publication number
WO2011152372A1
WO2011152372A1 PCT/JP2011/062433 JP2011062433W WO2011152372A1 WO 2011152372 A1 WO2011152372 A1 WO 2011152372A1 JP 2011062433 W JP2011062433 W JP 2011062433W WO 2011152372 A1 WO2011152372 A1 WO 2011152372A1
Authority
WO
WIPO (PCT)
Prior art keywords
solar cell
electrode
solder
cell module
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/062433
Other languages
English (en)
Japanese (ja)
Inventor
毅 西脇
浩 神野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of WO2011152372A1 publication Critical patent/WO2011152372A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/906—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the materials of the structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a solar cell module and a manufacturing method thereof.
  • the solar cell module has a configuration in which the output is increased by electrically connecting a plurality of solar cells in series.
  • the configuration of the solar cell module 100 will be described with reference to FIG.
  • a plurality of solar cells 101 are electrically connected in series by a conductive connection member 102 to constitute a solar cell group 103.
  • another adjacent solar cell group 103 is soldered by a connecting member 104.
  • the output of the solar cell module 100 is increased by electrically connecting a plurality of solar cells 101 in series.
  • the outermost solar cell group 103 is solder-connected to L-shaped connection members (output extraction connection members) 105 and 106 for extracting electric output from the solar cell module 100.
  • the solar battery cell 101 needs to be electrically connected to the other solar battery cell 101 by the conductive connecting member 102.
  • this point will be described in detail.
  • the solar battery cell 101 includes a semiconductor substrate 107 having a pn junction, an antireflection film 108 and a surface side electrode 109 formed on the surface of the semiconductor substrate 107, and a back surface side electrode formed on the back surface of the semiconductor substrate 107. 110.
  • the front surface side electrode 109 includes a finger-shaped current collecting electrode 109a and a bus bar electrode 109b orthogonal to the current collecting electrode 109a.
  • the back side electrode 110 includes a metal film-like current collecting electrode 110a and a bus bar electrode 110b.
  • the solar battery cell 101 is electrically connected to the other solar battery cells 101 by connecting the conductive connecting member 102 described above to the bus bar electrodes 109b and 110b.
  • FIG. 10A is a cross-sectional view for explaining the connection between the solar battery cell and the conductive connecting member along AA ′ in FIG. 8, and FIG. 10B is a cross-sectional view along BB ′ in FIG. It is sectional drawing for demonstrating the connection of the photovoltaic cell in a solar cell module along with, and an electroconductive connection member.
  • the conductive connection member 102 connects the bus bar electrode 109b of one solar battery cell 101 and the bus bar electrode 110b of another adjacent solar battery cell 101. Thereby, the adjacent photovoltaic cells 101 are electrically connected to each other.
  • the conductive connection member 102 and the bus bar electrodes 109b and 110b are connected by melting solder.
  • the solar battery module according to the present invention is a solar battery module in which a conductive connection member and an electrode of a solar battery cell are electrically connected, and the conductive connection member is disposed on the electrode of the solar battery cell.
  • the conductive connecting member and the electrode are mechanically connected with a region in which solder and resin are mixed therebetween interposed therebetween.
  • the manufacturing method of the solar cell module of the present invention is the method of manufacturing a solar cell module in which the conductive connection member and the electrode of the solar cell are electrically connected, and the conductive connection member and the electrode of the solar cell Including a step of curing the thermosetting resin while melting the solder by thermocompression bonding at a temperature exceeding the melting point of the solder with an adhesive containing the thermosetting resin and solder interposed therebetween. It is characterized by being.
  • the adhesive strength between the solar cell and the conductive connection member can be improved.
  • FIG.1 (a) shows the surface view of a photovoltaic cell
  • FIG.1 (b) shows the back view of a photovoltaic cell
  • FIG. 2 is a cross-sectional view taken along the line A-A ′ of FIG. 3A is a plan view showing a state in which two solar cells are connected
  • FIG. 3B is a cross-sectional view taken along the line AA ′ in FIG. Before and after the connection process.
  • FIG. 4 is a cross-sectional view taken along the line A-A ′ of FIG. 3A, in which the connection portion between the conductive connection member and the bus bar electrode is enlarged. The top view when the electroconductive connection member is peeled from the photovoltaic cell in Fig.3 (a) is shown.
  • FIG. 10A is a cross-sectional view for explaining the connection between the solar battery cell and the conductive connection member
  • FIG. 10B shows the connection between the solar battery cell and the conductive connection member in the conventional solar battery module. It is sectional drawing for demonstrating a connection.
  • FIGS. 1 and 2 the configuration of the solar battery cells constituting such a solar battery module will be described in detail.
  • FIG. 1 (a) shows a front view of the solar battery cell 5
  • FIG. 1 (b) shows a rear view of the solar battery cell 5.
  • the solar cell 5 has a transparent conductive film layer 18 and a surface side electrode 22 in this order.
  • the surface-side electrode 22 is formed on the transparent conductive film layer 18 by printing an epoxy thermosetting silver paste by screen printing and heating at 200 ° C.
  • the surface side electrode 22 includes a plurality of finger electrodes 22a and two bus bar electrodes 22b.
  • the plurality of finger electrodes 22a are formed so as to cover the entire surface of the transparent conductive film layer 18 over substantially the entire region.
  • Each finger electrode 22a has a narrow linear shape and is arranged in parallel to each other.
  • the finger electrodes 22a have a thin line shape having a thickness of 10 to 30 ⁇ m and a width of 50 to 200 ⁇ m, and are arranged at intervals of 2 mm.
  • the bus bar electrode 22b is configured to be orthogonally connected to the finger electrode 22a on the surface of the transparent conductive layer 18.
  • the bus bar electrode 22b is formed to have a linear shape with a thickness of 10 to 30 ⁇ m and a width of 0.1 to 1.8 mm.
  • the solar battery cell 5 has a transparent conductive film layer 21 and a back side electrode 23 in this order.
  • the back surface side electrode 23 includes a plurality of finger electrodes 23a and two bus bar electrodes 23b.
  • the distance between the adjacent finger electrodes 23 a of the back surface side electrode 23 is formed to be narrower than the distance between the adjacent finger electrodes 22 a of the front surface side electrode 22.
  • FIG. 2 is a cross-sectional view taken along the line A-A ′ of FIG.
  • the solar cell 5 includes an n-type single crystal silicon substrate 15, an i-type amorphous silicon layer 16, a p-type amorphous silicon layer 17, a transparent conductive film layer 18, a bus bar electrode 22b, an i-type amorphous silicon layer 19, The n-type amorphous silicon layer 20, the transparent conductive film layer 21, and the bus bar electrode 23b are included.
  • the n-type single crystal silicon substrate 15 has, for example, a substantially square planar shape of about 125 mm square and a thickness of 100 ⁇ m to 300 ⁇ m.
  • the solar cell 5 On the surface side, the solar cell 5 has an i-type amorphous silicon layer 16, a p-type amorphous silicon layer 17, and a transparent conductive film layer 18 formed in this order on the surface of the n-type single crystal silicon substrate 15 having the texture structure. ing. And the surface side electrode 22 is formed in the predetermined position on the transparent conductive film layer 18.
  • the solar cell 5 has an i-type amorphous silicon layer 19, an n-type amorphous silicon layer 20, and a transparent conductive film layer 21 in this order on the back surface having the texture structure of the n-type single crystal silicon substrate 15. Formed with.
  • the back surface side electrode 23 is formed in the predetermined position on the transparent conductive film layer 21.
  • the bus bar electrode 23 b is shown among the back surface side electrodes 23.
  • FIG. 3A is a plan view of a state in which two solar cells 5 are connected
  • FIG. 3B is a cross-sectional view taken along the line AA ′ in FIG. The front and back of a connection process with the bus-bar electrode 22b are shown. *
  • the conductive connection member 6 is connected to the bus bar electrode 22b on the surface side of one solar battery cell 5 by an adhesive 24 containing a resin.
  • the conductive connecting member 6 is connected to the bus bar electrode 23b on the back side of the other solar cell 5 adjacent to the one solar cell 5 via the adhesive 24.
  • the adhesive 24 is in the form of an epoxy thermosetting film, has a glass transition temperature of about 130 ° C., and is cured when thermocompression bonding is performed at about 200 ° C. or more for 20 seconds or more.
  • FIG. 3B the upper diagram shows the process steps before the connection between the bus bar electrode 22 b and the conductive connection member 6, and the lower diagram shows the process steps after the connection between the bus bar electrode 22 b and the conductive connection member 6.
  • the conductive connecting member 6 is composed of a flat copper wire 6a and a solder layer 6b.
  • the flat copper wire 6 a is a core wire of the conductive connecting member 6.
  • the flat copper wire 6a is a flat copper wire having a width of 0.5 mm to 2 mm and a thickness of about 100 to 300 ⁇ m.
  • the solder layer 6b is coated so as to surround the flat copper wire 6a with a thickness of 5 to 50 ⁇ m of Sn—Ag—Cu, for example, by plating, dipping or the like. In this case, the melting point of the solder layer 6b is about 220 ° C., which is higher than the glass transition temperature.
  • the adhesive 24 is disposed between the conductive connecting member 6 and the surface-side electrode 22.
  • the adhesive 24 is disposed on the bus bar electrode 22 b, and the conductive connection member 6 is disposed on the adhesive 24.
  • the conductive connecting member 6 is heated at about 250 ° C. for about 20 seconds while being pressed against the bus bar electrode 22b at about 2 MPa, and is thermocompression bonded.
  • the adhesive 24 may be provided on the conductive connection member 6 in advance instead of being disposed on the bus bar electrode 22b.
  • the conductive connection member 6 and the bus bar electrode 22b are thermocompression bonded at a temperature exceeding the melting point of the solder layer 6b and the glass transition temperature of the adhesive 24.
  • the conductive connection member 6 and the bus bar electrode 22b are connected by the solder layer 6b melting and solidifying and the adhesive 24 being cured.
  • the conductive connection member 6 and the bus bar electrode 22b are thermocompression bonded at a temperature lower than the melting point of the solder layer 6b and exceeding the glass transition temperature of the adhesive 24. .
  • the connection between the conductive connection member 6 and the bus bar electrode 22b is not made by the solder layer 6b but by the adhesive 24, and therefore it is better to make the connection at the lowest possible temperature in order to reduce the stress. is there.
  • a temperature higher than the melting point of the solder layer 6b is applied, an abnormal shape forming a protrusion shape appears on the surface of the solder layer 6b, which may cause a problem in reliability.
  • FIG. 4 is a cross-sectional view taken along the line A-A ′ of FIG. 3A, in which the connection portion between the conductive connection member 6 and the bus bar electrode 22 b is enlarged.
  • the solder layer 6b has irregular micro-projections 6c having irregular micron-order heights at both ends Y in the lateral direction of the conductive connection member 6 on the surface facing the transparent conductive film layer 18 after connection.
  • the bus bar electrode 22b is melted and solidified at the central portion X in the lateral direction of the conductive connecting member 6 on the surface facing the transparent conductive film layer 18.
  • the minute projections 6c are formed with an average height of about 2 ⁇ m to 3 ⁇ m.
  • solder layer 6b Since the solder layer 6b is easily melted with the bus bar electrode 22b containing the metal material, the solder layer 6b Is firmly connected to the bus bar electrode 22b.
  • the adhesive 24 enters the minute convex portion 6c and is cured. Thereby, the contact area of the conductive connection member 6 and the adhesive 24 is increased, and the adhesive strength between the conductive connection member 6 and the adhesive 24 is further improved.
  • the adhesive 24 flows when it is thermocompression bonded at a temperature exceeding the glass transition temperature of the resin contained in the adhesive 24, and the region of the conductive connecting member 6 Distributed beyond Z. At that time, the adhesive 24 forms a fillet on the side surface in the short direction of the conductive connecting member 6, and the adhesive 24 is thicker at both ends Y than the central portion X of the conductive connecting member 6. Harden. Thereby, even if the solder layer 6b is melted in the thermocompression bonding process, the component 24 is prevented from flowing out beyond the width of the bus bar electrode 22b in the short direction by the adhesive 24.
  • the adhesive 24 is in close contact with the conductive connection member 6 and the transparent conductive film layer 18 beyond the bus bar electrode 22b, the contact area between the conductive connection member 6 and the transparent conductive film layer 18 and the adhesive 24 is large. Increase. As a result, the adhesive strength between the conductive connecting member 6 and the bus bar electrode 22b is improved by the fillet formed by curing the adhesive 24 to the conductive connecting member 6.
  • FIG. 5 shows a top view when the conductive connecting member 6 is peeled off from the solar battery cell 5 in FIG.
  • thermosetting resin 24a formed by curing the adhesive 24 is nonuniformly distributed in a random and irregular shape and shape in the solder layer 6b melted and solidified in the vicinity of the center of the conductive connecting member 6 in the short direction. Yes.
  • the region where the hardened resin enters and mixes with the bus bar electrode 22b and the melted / solidified solder layer 6b exists in the vicinity of the center in the short direction of the conductive connecting member 6, and thus the conductive connecting member 6 and the bus bar.
  • the adhesive strength with the electrode 22b is further improved.
  • the solar cell 5 is electrically connected to another solar cell 5 through the conductive connection member 6. Thereafter, a solar cell module 1 as shown in FIG. 8 is completed through a known modularization process.
  • the conductive connection member 6 in the connection step between the conductive connection member 6 and the bus bar electrode 22b, the conductive connection member 6 is at a temperature exceeding the melting point of the solder layer 6b. Thermocompression bonding is performed between the bus bar electrode 22b and an adhesive 24. Thereby, the minute convex part 6c is formed based on the melting of the solder layer 6b. If it does so, the micro convex part 6c will contribute to the adhesion area increase with the adhesive agent 24, and will contribute to the adhesive strength increase with the electroconductive connection member 6 and the bus-bar electrode 22b.
  • the adhesive 24 is distributed in the bus bar electrode 22b and the melted solder layer 6b, and the adhesive 24 enters and mixes in the solder layer 6b. As a result, the adhesive 24 enters the solder layer 6b and further contributes to an increase in the adhesive strength between the conductive connecting member 6 and the bus bar electrode 22b.
  • the temperature at that process may be higher than the melting point of the solder layer 6b. It becomes important.
  • the temperature is appropriately selected within a range not exceeding the decomposition temperature of the resin contained in the adhesive 24.
  • the conductive connecting member 6 connected to the bus bar electrode 22b is pulled through the adhesive 24 (epoxy thermosetting film-like one) by a tensile tester 1000 in a direction perpendicular to the adhesive surface ( The peak intensity was measured when the film was pulled up and peeled in the direction of the arrow in FIG.
  • the measurement results when Sn—Pb is used as the solder layer 6b will be described.
  • the adhesive strength when thermocompression bonding is performed at 200 ° C. higher than the melting point of the solder layer 6b is about 4.5. It improved about twice.
  • the measurement results when Sn—Ag—Cu is used as the solder layer 6b will be described.
  • the adhesive strength when thermocompression bonding was performed at 200 ° C. which is lower than the melting point of the solder layer 6b, was about 4.5 times, but from the melting point of the solder layer 6b.
  • the adhesive strength when thermocompression bonding was performed at a high temperature of 250 ° C. was improved about 9 times.
  • the adhesive strength was higher than the case where the connection was made only by melting and solidifying the solder without using the adhesive 24.
  • the present invention can be implemented even if the thermocompression bonding temperature is reduced, and the thermal stress on the solar battery cell can be reduced.
  • Example 2 is for making an understanding of this invention easy, and is not for limiting and interpreting this invention.
  • the present invention can be changed and improved without departing from the gist thereof, and the present invention includes equivalents thereof.
  • the solder layer 6b is coated only on the flat copper wire 6a, but may be covered on both the flat copper wire 6a and the front surface side electrode 22 and the back surface side electrode 23. Moreover, you may make it the flat copper wire 6a coat
  • solder layer 6b may be provided on at least one of the front surface side electrode 22 and the back surface side electrode 23 without being provided on the conductive connection member.
  • Sn—Ag—Cu alloy and Sn—Pb alloy solder were used as the solder layer 6b, but Pb—Au alloy, Au—Si alloy that is lead-free solder, Au—Ge alloy, Au—Sn alloy, Various solders such as Sn—Cu alloy, Sn—Ag alloy, Sn—Au alloy, and Sn—Ag—In alloy can be used as appropriate.
  • an insulating adhesive may be used, or a conductive adhesive may be used.
  • the resin is not limited to an epoxy thermosetting resin, and other resins can be used as appropriate.
  • the adhesive 24 made of the resin may contain conductive particles such as Ni and Ag, and may contain non-conductive materials such as non-conductive particles such as silica, both of which are included. These may be included, or both of them may not be included.
  • the present invention is not limited to the structure of the solar battery cell shown in FIG. 2, and can be appropriately used for various solar battery cells such as a polycrystalline solar battery cell.

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  • Photovoltaic Devices (AREA)

Abstract

La présente invention a trait à un module de cellule solaire qui est doté d'une résistance d'adhésion améliorée et à un procédé de fabrication dudit module de cellule solaire. Dans le module de cellule solaire doté d'un élément de connexion conducteur (6) et d'une électrode (22) d'une cellule solaire (5) qui sont électroconnectés, l'élément de connexion conducteur (6) est disposé sur l'électrode (22) et l'élément de connexion conducteur (6) est mécaniquement connecté sur l'électrode (22) grâce à la présence, entre l'élément de connexion conducteur et l'électrode (22), d'une zone dotée d'une brasure tendre et d'une résine mélangées dans celle-ci.
PCT/JP2011/062433 2010-05-31 2011-05-31 Module de cellule solaire et son procédé de fabrication Ceased WO2011152372A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-124478 2010-05-31
JP2010124478 2010-05-31

Publications (1)

Publication Number Publication Date
WO2011152372A1 true WO2011152372A1 (fr) 2011-12-08

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PCT/JP2011/062433 Ceased WO2011152372A1 (fr) 2010-05-31 2011-05-31 Module de cellule solaire et son procédé de fabrication

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012141073A1 (fr) * 2011-04-11 2012-10-18 三菱電機株式会社 Module cellule solaire et procédé de fabrication associé
JP2013152979A (ja) * 2012-01-24 2013-08-08 Mitsubishi Electric Corp 太陽電池モジュール及びその製造方法
WO2014132282A1 (fr) * 2013-02-26 2014-09-04 三洋電機株式会社 Module de pile solaire
US9484479B2 (en) 2011-11-09 2016-11-01 Mitsubishi Electric Corporation Solar cell module and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008023795A1 (fr) * 2006-08-25 2008-02-28 Sanyo Electric Co., Ltd. Module de pile solaire et procédé de fabrication de module de pile solaire
JP2008053681A (ja) * 2006-03-27 2008-03-06 Kyocera Corp 太陽電池モジュール及びその製造方法
WO2008044357A1 (fr) * 2006-10-10 2008-04-17 Hitachi Chemical Company, Ltd. Structure connectée et son procédé de fabrication
WO2009041506A1 (fr) * 2007-09-26 2009-04-02 Hitachi Chemical Company, Ltd. Elément pour la connexion d'un conducteur, procédé pour fabriquer cet élément, structure de connexion et module de cellule solaire
JP2009283606A (ja) * 2008-05-21 2009-12-03 Hitachi Chem Co Ltd 配線部材の接続構造体及び配線部材の接続方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053681A (ja) * 2006-03-27 2008-03-06 Kyocera Corp 太陽電池モジュール及びその製造方法
WO2008023795A1 (fr) * 2006-08-25 2008-02-28 Sanyo Electric Co., Ltd. Module de pile solaire et procédé de fabrication de module de pile solaire
WO2008044357A1 (fr) * 2006-10-10 2008-04-17 Hitachi Chemical Company, Ltd. Structure connectée et son procédé de fabrication
WO2009041506A1 (fr) * 2007-09-26 2009-04-02 Hitachi Chemical Company, Ltd. Elément pour la connexion d'un conducteur, procédé pour fabriquer cet élément, structure de connexion et module de cellule solaire
JP2009283606A (ja) * 2008-05-21 2009-12-03 Hitachi Chem Co Ltd 配線部材の接続構造体及び配線部材の接続方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012141073A1 (fr) * 2011-04-11 2012-10-18 三菱電機株式会社 Module cellule solaire et procédé de fabrication associé
US20130312810A1 (en) * 2011-04-11 2013-11-28 Mitsubishi Electric Corporation Solar battery module and manufacturing method thereof
JPWO2012141073A1 (ja) * 2011-04-11 2014-07-28 三菱電機株式会社 太陽電池モジュールおよびその製造方法
US9484479B2 (en) 2011-11-09 2016-11-01 Mitsubishi Electric Corporation Solar cell module and manufacturing method thereof
JP2013152979A (ja) * 2012-01-24 2013-08-08 Mitsubishi Electric Corp 太陽電池モジュール及びその製造方法
WO2014132282A1 (fr) * 2013-02-26 2014-09-04 三洋電機株式会社 Module de pile solaire
JPWO2014132282A1 (ja) * 2013-02-26 2017-02-02 パナソニックＩｐマネジメント株式会社 太陽電池モジュール

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