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WO2011094949A1 - Led荧光灯 - Google Patents

Led荧光灯 Download PDF

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Publication number
WO2011094949A1
WO2011094949A1 PCT/CN2010/070550 CN2010070550W WO2011094949A1 WO 2011094949 A1 WO2011094949 A1 WO 2011094949A1 CN 2010070550 W CN2010070550 W CN 2010070550W WO 2011094949 A1 WO2011094949 A1 WO 2011094949A1
Authority
WO
WIPO (PCT)
Prior art keywords
light source
heat
fluorescent lamp
led
led fluorescent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2010/070550
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English (en)
French (fr)
Inventor
胡安华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mass Technology HK Ltd
Original Assignee
Mass Technology HK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mass Technology HK Ltd filed Critical Mass Technology HK Ltd
Priority to PCT/CN2010/070550 priority Critical patent/WO2011094949A1/zh
Priority to HK11110868.5A priority patent/HK1156681B/zh
Priority to CN2010800014381A priority patent/CN102016394B/zh
Priority to EP10252162.2A priority patent/EP2357402A3/en
Priority to TW100101921A priority patent/TW201135148A/zh
Publication of WO2011094949A1 publication Critical patent/WO2011094949A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to the field of lighting fixtures. More specifically, the present invention relates to an LED fluorescent lamp used as a lighting fixture, which has high luminous efficiency and good heat dissipation.
  • the existing LED lamps for illumination generally assemble a plurality of LED light sources to form an LED array structure to achieve the required brightness and power.
  • the LED array structure can meet the lighting requirements, it also generates heat concentration, local temperature is too high, and affects the stability of the circuit control system. Since no special heat conduction and heat dissipation devices are provided, the heat generated by the plurality of LED light sources cannot be effectively dissipated, so that the temperature of the outer casing of the lamp is relatively high, and there is a danger of hot hands when a person touches; High also makes the lamp more susceptible to damage.
  • the object of the present invention is to overcome the above disadvantages in the prior art and to provide a novel LED fluorescent lamp which has good thermal conductivity and heat dissipation, prolongs the service life of the LED lamp, reduces energy consumption and reduces light decay. .
  • the object of the present invention is to provide an LED fluorescent lamp comprising a lamp cap, a glass bulb and a control circuit that can be inserted into a lamp holder and connected to a power source, and the LED fluorescent lamp further comprises:
  • At least two LED light sources connected to the control circuit
  • At least two light source panels wherein the at least two LED light sources are respectively fixed on the at least two light source panels;
  • a heat conducting device comprising at least two heat conducting substrates disposed obliquely to a direction perpendicular to a center line thereof, wherein the at least two light source panels are respectively fixed to the at least two heat conducting substrates in a heat conductive manner, the heat conducting The bottom end of the substrate extends downward to form a receiving cavity, and the bottom edge of the receiving cavity is provided with an annular interface;
  • the rear cover includes a housing and a hollow cylinder for receiving the control circuit, the housing is engaged with the glass bulb, and an upper portion of the inner wall of the housing is provided with an annular interface through which the The annular interface of the heat conducting device is tightly coupled such that the heat conducting device and the back cover are thermally coupled together, and the bottom of the hollow cylinder is fixedly connected to the housing, the hollow cylinder Accommodating with the control circuit is received within the receiving cavity of the thermally conductive device.
  • the LED fluorescent lamp comprises:
  • a heat conducting device comprising three thermally conductive substrates disposed radially equidistantly spaced and inclined toward a vertical centerline thereof, the thermally conductive substrates comprising a lower thermally conductive substrate and upwardly and inwardly along a top end of the lower thermally conductive substrate
  • An upper thermally conductive substrate formed obliquely extending, the upper thermally conductive substrate forming a triangular structure on an upper portion of the heat conducting device, the top surface of the triangular structure having a circle through which the wires connecting the LED light source and the control circuit pass hole.
  • the heat conducting device further includes three lower partition plates disposed between the lower heat conductive substrates and an upper partition plate extending obliquely upward and inward along a top end of each of the lower partition plates, the lower heat conductive substrate Forming a circular surface adjacent to the lower partitioning plate; wherein the light source panel to which the LED light source is fixed is respectively fixed on the upper heat conductive substrate.
  • each of the lower thermally conductive substrates is provided with a spring hole for one end of the snap spring, and the other end of the spring is fixed on the light source panel, so that the light source panel is further Securely attached to the lower thermally conductive substrate.
  • the LED light source can be fixed on the light source panel by dispensing or by any mechanical means, and the light source panel and the heat conductive substrate can pass fasteners, dispensing or adhesive heat dissipation oil. Fixed together.
  • a heat dissipation oil layer is coated between the light source panel and the heat conductive substrate.
  • the outer surface of the back cover housing of the present invention may be provided with a plurality of fins arranged parallel to and spaced apart from the center vertical axis for better heat dissipation.
  • the bottom of the hollow cylinder of the back cover can be fixedly attached to the housing by, for example, snapping, screwing, etc., as will be apparent to those skilled in the art.
  • the light source panel, the heat conducting plate, the heat sink and the reflector cup are preferably made of a heat conductive material such as aluminum, aluminum alloy or ceramic.
  • the main heating element is the LED light source
  • the heat dissipation generated by the LED luminaire affects the stability of the control circuit, which in turn affects the illuminating effect of the LED light source.
  • the LED fluorescent lamp of the invention closely contacts the LED chip light source panel and the heat conducting device, and the heat conducting device is also closely connected with the back cover provided with the heat sink, thereby forming a good heat conduction and heat dissipation path, and the heat emitted by the LED light source
  • the heat dissipation path of the light source panel-heat conducting device-back cover-heat sink is quickly and efficiently dissipated, which reduces the temperature of the LED light source to the inside of the lamp body.
  • the heat conduction and heat dissipation conduction path of the invention can achieve a good heat dissipation effect, ensure that the LED is not hot, and prolong the life of the LED fluorescent lamp, thereby solving the problem of heating of the high power LED fluorescent lamp.
  • the number of LED light sources and light source panels can be increased by merely changing the design of the heat conductive substrate in the heat conducting device, so that the present invention can be made into a series of high power LED fluorescent lamps.
  • Fig. 1 is a front elevational view showing an LED fluorescent lamp according to an embodiment of the present invention.
  • Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1.
  • FIG. 3 is an exploded perspective view of the LED fluorescent lamp shown in FIG. 1.
  • FIG. 4 is a top perspective view of the heat conducting device of the LED fluorescent lamp shown in FIG. 1.
  • FIG. 5 is a bottom perspective view of the heat conducting device shown in FIG. 4.
  • Figure 6 is a front elevational view of the heat transfer device of Figure 4.
  • Figure 7 is a plan view of the heat transfer device shown in Figure 4.
  • an LED fluorescent lamp 10 as a preferred embodiment of the present invention, the fluorescent lamp 10 comprising a glass bubble 100, three LED light sources 400, three light source panels 300, a heat conducting device 500, and control Circuit 600, back cover 700, and base 800.
  • the glass bubble 100 may be a transparent glass bubble, or a glass bubble coated with a silica gel, a twisted glass bubble, or a frosted glass bubble may be used as needed.
  • the lamp cap 800 can be designed as a lamp head of various sizes as required, such as E11, E12, E14, E17, E26, E27, and the like.
  • the control circuit 600 is not the gist of the present invention and will not be described in detail herein.
  • the LED light source can be constructed from one or more LEDs.
  • the three LED light sources 400 are each composed of three chip LEDs, which are respectively fixed on the three light source panels 300.
  • the LED light source 400 and the light source panel 300 can be glued together or fixed together in any known mechanical manner.
  • the upper portion of the heat transfer device is substantially triangular and the lower portion is cylindrical.
  • the heat conducting device 500 includes three thermally conductive substrates disposed radially equidistantly spaced and inclined toward their vertical centerline directions.
  • the heat-conducting substrate is disposed obliquely to the central vertical axis of the fluorescent lamp so that the light emitted from the LED chip can be directly irradiated.
  • Each of the heat conductive substrates includes a lower heat conductive substrate 510 and an upper heat conductive substrate 530.
  • the upper heat conductive substrate 530 is formed to extend obliquely upward and inward along the top end of the lower heat conductive substrate 510.
  • the light source panel 300 to which the LED light source 400 is fixed is fixed on the heat conduction.
  • the three upper thermally conductive substrates 530 abut together to form a triangular structure on the upper portion of the heat conducting device.
  • the triangular structure has a flat top surface 560 with a circular opening 561 at the center of the top surface 560 through which the LED light source 400 and the control circuit 600 can be electrically connected by wires.
  • a layer of heat-dissipating oil may be applied between the light source panel 300 and the heat-conducting substrate to provide better heat conduction.
  • the light source panel 300 can be fixed on the heat conductive substrate by any other means known in the art, and it is better to form a good heat conduction and heat dissipation effect.
  • the light source can be directly used by the viscous heat dissipation oil.
  • the panel 300 is bonded to the heat conducting plate.
  • the spring piece 200 is used to strengthen the fixing between the light source panel and the upper heat conductive substrate 530.
  • a spring hole 511 is disposed on each of the lower heat conductive substrates 510.
  • One end of the spring piece 200 is buckled inside the spring hole, and the other end of the spring piece is pressed against the light source panel 300. Because of the force of the spring, the reaction force of the spring will firmly press the light source panel 300, so that the light source panel 300 is more closely fixed to the upper heat conductive substrate 530.
  • the heat conducting device 500 further includes three lower partition plates 520 disposed between the lower heat conductive substrates 510 and an upper partition plate 540 formed obliquely upward and inward along the top ends of the respective lower partition plates 520.
  • the lower heat conductive substrate 510 and the lower partition plate 520 are circumferentially formed to form a circular surface, as shown in FIGS. 4 and 7.
  • the purpose of arranging the upper and lower partition plates 540, 520 to be inclined is to allow the light emitted from the LED light source 400 in various directions to be sufficiently effectively radiated, so that the divergence of the light is not hindered.
  • a receiving cavity 550 is formed downwardly from the bottom end of the circular vertebral body formed by the lower thermally conductive substrate 510 and the lower dividing plate 520, and an annular interface is provided on the bottom edge of the receiving cavity 550.
  • the annular interface is bent inwardly to form a step 551 for the bottom edge of the receiving cavity 550.
  • the back cover 700 is annular and includes a housing 720 and a hollow cylinder 710, the bottom of which is secured to the housing 720 in any manner known in the art.
  • the upper end of the housing 720 and the glass bulb 100 can be joined together by any means known in the art, such as snapping or screwing.
  • the upper side of the inner wall of the casing protrudes outwardly to form a step, and the step is closely engaged with the step 551 of the heat conducting device 500, so that the heat conducting device 500 and the back cover 700 are thermally coupled together to form good heat conduction and heat dissipation. aisle.
  • the size of the hollow cylinder 710 matches the size of the receiving cavity 550 of the heat conducting device 500, and after receiving the control circuit 600, is received together within the receiving cavity 550 of the heat conducting device.
  • the outer surface of the housing 720 is provided with a plurality of fins 721 arranged parallel to and spaced apart from the central vertical axis.
  • the fins 721 are disposed to dissipate the heat transferred from the heat conducting device 500 to achieve better heat dissipation. effect.
  • the light source panel 300, the heat conducting device 500, and the housing 720 of the back cover are preferably made of a heat conductive material such as aluminum, aluminum alloy or ceramic.
  • the heat-conducting device forms a heat-conducting connection with the rear cover, and the outer surface of the rear cover has a plurality of heat-dissipating fins, thereby forming a good light source.
  • the number of LED light sources may be two or more, such as three or four, or even more, as long as the number of thermally conductive substrates in the heat conducting device 500 is adjusted accordingly. Because it solves the heat dissipation problem of the LED light source, it can be made into LED lamps with higher power, lower power consumption and less light decay.
  • the present invention provides an LED fluorescent lamp, which not only effectively solves the heat dissipation problem of the LED, but also greatly improves the luminous flux and luminous efficiency of the LED.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

LED荧光灯
本发明涉及照明灯具领域。更具体地说，本发明涉及一种用作照明灯具的LED荧光灯，该LED荧光灯的发光效率高，散热良好。
LED 作为一种具有巨大发展潜力的固体发光光源，自20世纪60年代诞生以来，以其寿命长、结构牢固、低功耗和外形尺寸灵活等优点受到人们越来越多的关注，已经逐渐取代传统的高压卤素灯应用在各种照明领域。但是，LED灯本身在工作时的发热量比较大，由此产生了较大的光衰，同时也缩短了LED灯的使用寿命，故在一定程度上限制了LED灯在照明领域的应用范围。
由于单个的LED光源的亮度和功率不足，不能当作照明使用，故现有的照明用的LED灯一般都组装了多个LED光源，构成LED阵列结构，以达致所要求的亮度和功率。组装的LED光源的个数越多，所制成的LED灯的亮度和功率也就会越高。LED阵列结构虽然能够达到照明要求，但由此也产生了热量集中，局部温度过高，影响电路控制系统的稳定性等问题。由于没有设置专门的导热和散热装置，因此，由多个LED光源产生的热量不能有效地散发掉，使得灯的外壳的温度会比较高，人一接触就会有烫手的危险；再者，温度高也使灯比较容易损坏。
目前，已提出了许多技术方案来解决有关LED灯具的散热问题，但是这些技术方案有的散热效果较差，有的尽管散热效果较好，但成本过高，结构复杂。例如中国发明专利申请号200910011246.8，名称为“回路式热管散热器散热LED照明灯”的专利申请，公开了一种采用回路式热管散热器散热的LED照明灯，利用回路式热管散热器结构及热管散热器热阻小、热传导系数高原理，解决LED散热问题，但是这种散热方式的成本高，结构复杂。
因此，有必要对现有的用作照明目的的LED灯具加以改良，改善其导热性，从而能够很好地解决LED灯具的散热问题，提高发光效率，降低能耗，减少光衰，增加光通量。
 发明内容
本发明的目的在于克服现有技术中的上述缺点，提供一种新颖的LED荧光灯，该LED荧光灯具有良好导热性和散热性，延长了LED灯的使用寿命，降低了能耗和减少了光衰。
本发明的目的是通过以下技术方案实现的，提供一种LED荧光灯，包括可插装在灯头座上并与电源连接的灯头、玻璃泡和控制电路，所述LED荧光灯还包括：
至少两个LED光源，所述LED光源与所述控制电路连接；
至少两块光源面板，所述至少两个LED光源分别固定在所述至少两块光源面板上；
导热装置，所述导热装置包括向其垂直中心线方向倾斜设置的至少两块导热基板，所述至少两块光源面板以可导热方式分别固接在所述至少两块导热基板上，所述导热基板的底端向下延伸形成一接纳腔，所述接纳腔的底部边缘上设有环形接口；
后盖，所述后盖包括壳体和用于容纳所述控制电路的空心柱体，所述壳体与所述玻璃泡接合，所述壳体的内壁上部设有一环形接口，通过该接口与所述导热装置的环形接口紧密地接合，使得所述导热装置与所述后盖以可导热方式嵌接在一起，所述空心柱体的底部与所述壳体固定连接，所述空心柱体与所述控制电路一起接纳在所述导热装置的接纳腔内。
在本发明一优选实施例中，所述LED荧光灯包括：
三个LED光源；
三块光源面板，所述三个LED光源分别固定在所述三块光源面板上；
导热装置，所述导热装置包括三块径向等距离间隔地设置并向其垂直中心线方向倾斜的导热基板，所述各导热基板包括下导热基板和沿所述下导热基板的顶端向上向内倾斜延伸形成的上导热基板，所述上导热基板在导热装置的上部形成一个三角状结构，所述三角状结构的顶面开有供连接所述LED光源与所述控制电路的导线通过的圆孔。所述导热装置还包括三块设置在所述下导热基板之间的下分隔板和沿所述各下分隔板的顶端向上向内倾斜延伸形成的上分隔板，所述下导热基板和所述下分隔板紧靠着连接环绕形成一个圆面；其中所述固接有LED光源的光源面板分别固定在所述上导热基板上。
较佳地，在上述优选实施例中，所述各下导热基板上设有一弹簧孔，用于卡扣弹簧的一端，而弹簧的另一端固定在所述光源面板上，使得所述光源面板更加牢固地固接在所述下导热基板上。
根据本发明，可以点胶方式或采用任何机械方式把所述LED光源固定在所述光源面板上，而所述光源面板与所述导热基板可通过紧固件、点胶或有粘性的散热油固定在一起。较佳地，所述光源面板与所述导热基板之间涂有散热油层。
本发明的后盖壳体的外表面可以设有多条与其中心垂直轴线平行且间隔排列的散热片，以达到更好的散热效果。
后盖的空心柱体的底部可以通过例如卡接、螺接等方式固定连接在壳体上，这对本领域技术人员来说是显而易见的。
要加强散热效果，所述光源面板、导热板、散热器和反光杯最好选用可导热的材料，如铝、铝合金或陶瓷。
在LED灯具中，主要发热元件为LED光源，其产生的热量散发会影响控制电路的稳定性，从而反过来又影响LED光源的发光效果。本发明的LED荧光灯将LED芯片光源面板与导热装置紧密地接触，导热装置与设有散热片的后盖也形成紧密连接，因而形成了一条良好的导热和散热途径，将LED光源散发出的热量通过光源面板－导热装置－后盖－散热片的散热途径快速高效地散发出去，降低了LED光源以致灯体内部的温度。因此控制电路的温度不会过高，增强了控制电路的稳定性。本发明的导热和散热的传导途径，能够达到很好的散热效果，确保LED不过热，延长了LED荧光灯的寿命，由此解决了大功率LED荧光灯发热的问题。
此外，只需要改变导热装置中导热基板的设计就可以增加LED光源和光源面板的数量，所以本发明可以做成系列化的大功率LED荧光灯。
以下将结合附图对本发明的构思、具体结构及产生的技术效果作进一步说明，以充分地了解本发明的目的、特征和效果。
附图说明
图1所示为本发明一实施例的LED荧光灯的正视图。
图2所示为沿图1所示的A-A方向的剖视图。
图3所示为图1所示的LED荧光灯的立体分解图。
图4所示为图1所示的LED荧光灯中导热装置的顶部立体示意图。
图5所示为图4所示的导热装置的底部立体示意图。
图6所示为图4所示的导热装置的正视图。
图7所示为图4所示的导热装置的俯视图。
 具体实施方式
参照图1至图3，图中示出了作为本发明一优选实施例的LED荧光灯10，所述荧光灯10包括玻璃泡100、三个LED光源400、三块光源面板300、导热装置500、控制电路600、后盖700以及灯头800。
玻璃泡100可以是透明的玻璃泡，也可以根据需要选用喷涂硅胶的玻璃泡、扭纹玻璃泡和磨砂玻璃泡等。灯头800可以根据需要设计为各种尺寸的灯头，如E11、E12、E14、E17、E26、E27等。控制电路600不为本发明的要点，本处不做详细描述。
LED光源可以由一或多个LED构成。在本实施例中，三个LED光源400各由3个芯片LED组成，分别固定在三块光源面板300上。LED光源400和光源面板300可以点胶或任何已知的机械方式固定在一起。
如图4至图7所示，导热装置的上部大体上呈三角状，下部为圆柱状。在本实施例中，导热装置500包括三块径向等距离间隔地设置并向其垂直中心线方向倾斜的导热基板。使导热基板与荧光灯的中心垂直轴线成倾斜配置，是为了让LED芯片发出的光可以直接照射出来。每一块导热基板包括下导热基板510和上导热基板530，该上导热基板530沿下导热基板510的顶端向上向内倾斜延伸而形成，其中固接有LED光源400的光源面板300固定在上导热基板530上。三块上导热基板530紧靠在一起在导热装置的上部形成一个三角状结构。该三角状结构有一个平的顶面560，在顶面560的中心位置开有一个圆孔561，LED光源400与控制电路600可以通过该圆孔561以导线形成电连接。
在光源面板300与导热基板之间可以涂一层散热油，从而起到更好的导热作用。当然，把光源面板300固定在导热基板上可以采用任何本领域已知的任何其他方式，最好能够使二者形成良好的导热和散热效果，例如，可以利用粘性较强的散热油直接把光源面板300粘结在导热板上。本实施例还采用弹簧片200加强光源面板与上导热基板530之间的固定。为此，在下导热基板510上各设有一个弹簧孔511，弹簧片200的一端卡扣在该弹簧孔内侧，弹簧片的另一端压住光源面板300。因为弹簧的受力作用，弹簧的反作用力会把光源面板300牢固地压住，从而使光源面板300更加紧密地固定在上导热基板530上。
导热装置500还包括三块设置在下导热基板510之间的下分隔板520和沿所述各下分隔板520的顶端向上向内倾斜延伸形成的上分隔板540。所述下导热基板510和所述下分隔板520紧靠着连接环绕形成一个圆面，如图4和图7所示。将上、下分隔板540，520配置成倾斜的目的是为了让LED光源400沿各方向发出的光线能够充分有效地发散出去，使光线的发散不致受阻。
由下导热基板510和下分隔板520围绕形成的圆椎体底端向下延伸形成一接纳腔550，在接纳腔550的底部边缘上设有环形接口。在本实施例中，该环形接口为接纳腔550的底部边缘向内弯折形成台阶551。
后盖700呈环状，包括壳体720和空心柱体710，该空心柱体710的底部与壳体720固定在一起，该固定可以采用本领域所知的任何方式。壳体720的上端与玻璃泡100可以采用任何本领域已知的任何方式接合在一起，例如卡接或螺接。壳体的内壁上侧向外突出形成一台阶，通过该台阶与导热装置500的台阶551紧密地接合，使得导热装置500与后盖700以可导热方式嵌接在一起，形成良好的导热和散热通道。空心柱体710的大小与导热装置500的接纳腔550的大小相配合，在容纳控制电路600之后，再一起接纳在所述导热装置的接纳腔550内。
在壳体720的外表面设有多条与其中心垂直轴线平行且间隔排列的散热片721，这些散热片721的设置可以将导热装置500传递过来的热量很好地散发出去，达到更好的散热效果。
光源面板300、导热装置500、后盖的壳体720最好选用可导热的材料，例如铝、铝合金或陶瓷等。
由于固定有LED光源的光源面板紧贴在导热装置的导热基板上，导热装置又与后盖形成导热连接，而后盖的壳体外侧表面又设有多条散热片，籍此形成一条良好的光源面板－导热装置－后盖－散热片的导热和散热途径。LED光源发出的热量通过该散热途径快速地散发出去，降低了LED光源的温度，从而有效地解决了LED灯具的散热问题。
根据本发明，LED光源的数量可以为2个以上，如3个或4个，甚至更多个，只要相应地调整导热装置500中导热基板的数量即可。因为解决了LED光源的散热问题，因而可以做成更大功率、更低能耗和更小光衰的LED灯具。
因此，本发明提供了一种LED荧光灯，不仅有效地解决了LED的散热问题，而且还大大地提高了LED的光通量和发光效率。
虽然结合附图描述了本发明的较佳具体实施例，但本发明不应被限制于与以上的描述和附图完全相同的结构和操作。对本技术领域的技术人员来说，在不超出本发明构思和范围的情况下通过逻辑分析、推理或者有限的实验还可对上述实施例作出许多改进和变化，但这些改进和变化都应属于本发明要求保护的范围。

Claims (11)

  1. 一种LED荧光灯，包括可插装在灯头座上并与电源连接的灯头、玻璃泡和控制电路，其特征在于，所述LED荧光灯还包括：
    至少两个LED光源，所述LED光源与所述控制电路连接；
    至少两块光源面板，所述至少两个LED光源分别固定在所述至少两块光源面板上；
    导热装置，所述导热装置包括向其垂直中心线方向倾斜设置的至少两块导热基板，所述至少两块光源面板以可导热方式分别固接在所述至少两块导热基板上，所述导热基板的底端向下延伸形成一接纳腔，所述接纳腔的底部边缘上设有环形接口；
    后盖，所述后盖包括壳体和用于容纳所述控制电路的空心柱体，所述壳体与所述玻璃泡接合，所述壳体的内壁上部设有一环形接口，通过该接口与所述导热装置的环形接口紧密地接合，使得所述导热装置与所述后盖以可导热方式嵌接在一起，所述空心柱体的底部与所述壳体固定连接，所述空心柱体与所述控制电路一起接纳在所述导热装置的接纳腔内。
  2. 如权利要求1所述的LED荧光灯，其特征在于，所述LED荧光灯包括：
    三个LED光源；
    三块光源面板，所述三个LED光源分别固定在所述三块光源面板上；
    导热装置，所述导热装置包括三块等距离间隔地设置并向其垂直中心线方向倾斜的导热基板，所述各导热基板包括下导热基板和沿所述下导热基板的顶端向上向内倾斜延伸形成的上导热基板，所述上导热基板在导热装置的顶部形成一个三角状结构；所述导热装置还包括三块设置在所述下导热基板之间的下分隔板和沿所述各下分隔板的顶端向上向内倾斜延伸形成的上分隔板，所述下导热基板和所述下分隔板紧靠着连接环绕形成一个圆面；
    其中所述固接有LED光源的光源面板分别固定在所述上导热基板上。
  3. 如权利要求2所述的LED荧光灯，其特征在于，所述各下导热基板上设有弹簧孔，用于卡扣弹簧的一端，而弹簧的另一端固定在所述光源面板上，使得所述光源面板牢固地固接在所述上导热基板上。
  4. 如权利要求2所述的LED荧光灯，其特征在于，所述三角状结构的顶面开有供连接所述LED光源与所述控制电路的导线通过的圆孔。
  5. 如权利要求1至4中任一项所述的LED荧光灯，其特征在于，所述LED光源以点胶方式或机械方式固定在所述光源面板上。
  6. 如权利要求1至4中任一项所述的LED荧光灯，其特征在于，采用以下方式把所述光源面板与所述导热基板固定在一起：紧固件、点胶或有粘性的散热油。
  7. 如权利要求1至4中任一项所述的LED荧光灯，其特征在于，所述光源面板与所述导热基板之间涂有散热油层。
  8. 如权利要求1至4中任一项所述的LED荧光灯，其特征在于，所述壳体的外表面设有多条与其中心垂直轴线平行且间隔排列的散热片。
  9. 如权利要求1至4中任一项所述的LED荧光灯，其特征在于，所述光源面板、导热装置和所述后盖的壳体选用可导热的材料。
  10. 如权利要求9所述的LED荧光灯，其特征在于，所述可导热的材料为铝、铝合金或陶瓷。
  11. 如权利要求1至4中任一项所述的LED荧光灯，其特征在于，所述玻璃泡选自喷涂硅胶的玻璃泡、扭纹玻璃泡和磨砂玻璃泡。
PCT/CN2010/070550 2010-02-05 2010-02-05 Led荧光灯 Ceased WO2011094949A1 (zh)

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CN2010800014381A CN102016394B (zh) 2010-02-05 2010-02-05 Led荧光灯
EP10252162.2A EP2357402A3 (en) 2010-02-05 2010-12-17 LED fluorescent lamp
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