201135148 六、發明說明： 【發明所屬之技術領域】 本發明涉及照明燈具領域。更具體地說，本發明涉 及一種用作照明燈具的LED螢光燈，該LED螢光燈的發 光效率高，散熱良好。 【先前技術】 LED作爲一種具有巨大發展潛力的固體發光光 源，自20世紀60年代誕生以來，以其壽命長、結構牢 固、低功耗和外形尺寸靈活等優點受到人們越來越多的 關注’已經逐漸取代傳統的高壓鹵素燈應用在各種照明 領域。但是，LED燈本身在工作時的發熱量比較大，由 此產生了較大的光衰，同時也縮短了 LED燈的使用壽 命，故在一定程度上限制了 LED燈在照明領域的應用範 圍。 由於單個的LED光源的亮度和功率不足，不能當作 照明使用，故現有的照明用的LED燈一般都組裝了多個 LED光源，構成LED陣列結構，以達致所要求的亮度和 功率。組裝的LED光源的個數越多，所製成的LED燈的 亮度和功率也就會越高。LED陣列結構雖然能夠達到照 明要求，但由此也產生了熱量集中，局部溫度過高’影 響電路控制系統的穩定性等問題。由於沒有設置專門的 導熱和散熱裝置，因此，由多個LED光源產生的熱量不 能有效地散發掉，使得燈的外殼的溫度會比較高，人一 201135148 接觸就會有燙手的危險；再者，溫度高也使燈比較容易 損壞。 目前，已提出了許多技術方案來解決有關LED燈具 的散熱問題，但是這些技術方案有的散熱效果較差，有 的儘管散熱效果較好，但成本過高，結構複雜。例如中 國發明專利申請號200910011246.8，名稱爲“回路式熱 管散熱器散熱LED照明燈”的專利申請，公開了 一種採 用回路式熱管散熱器散熱的LED照明燈，利用回路式熱 管散熱器結構及熱管散熱器熱阻小、熱傳導係數高原 理，解決LED散熱問題，但是這種散熱方式的成本高， 結構複雜。 因此，有必要對現有的用作照明目的的LED燈具加 以改良，改善其導熱性，從而能夠很好地解決LED燈具 的散熱問題，提高發光效率，降低能耗，減少光衰，增 加光通量。 【發明內容】 本發明的目的在於克服現有技術中的上述缺點，提 供一種新穎的LED螢光燈，該LED螢光燈具有良好導熱 性和散熱性，延長了 LED燈的使用壽命，降低了能耗和 減少了光衰。 本發明的目的是通過以下技術方案實現的，提供一 種LED螢光燈，包括可插裝在燈頭座上並與電源連接的 燈頭、玻璃泡和控制電路，所述LED螢光燈還包括： -4- 201135148 至少兩個LED光源，所述LED光源與所述控制電路 連接； 至少兩塊光源面板，所述至少兩個LED光源分別固 定在所述至少兩塊光源面板上； 導熱裝置，所述導熱裝置包括向其垂直中心線方向 傾斜設置的至少兩塊導熱基板，所述至少兩塊光源面板 以可導熱方式分別固接在所述至少兩塊導熱基板上，所 述導熱基板的底端向下延伸形成一接納腔，所述接納腔 的底部邊緣上設有環形介面； 後蓋，所述後蓋包括殻體和用於容納所述控制電路 的空心柱體，所述殼體與所述玻璃泡接合，所述殼體的 內壁上部設有一環形介面，通過該介面與所述導熱裝置 的環形介面緊.密地接合，使得所述導熱裝置與所述後蓋 以可導熱方式嵌接在一起，所述空心柱體的底部與所述 殼體固定連接’所述空心柱體與所述控制電路一起接納 在所述導熱裝置的接納腔內。 在本發明一優選實施例中，所述led螢光燈包括： 三個LED光源； 三塊光源面板’所述三個LED光源分別固定在所述 三塊光源面板上； 導熱裝置’所述導熱裝置包括三塊徑向等距離間隔 地設置並向其垂直中心線方向傾斜的導熱基板，所述各 導熱基板包括下導熱基板和沿所述下導熱基板的頂端向 201135148 上向內傾斜延伸形成的上導熱基板，所 導熱裝置的上部形成一個三角狀結構， 的頂面開有供連接所述LED光源與所述 通過的圓孔。所述導熱裝置還包括三塊 熱基板之間的下分隔板和沿所述各下分 向內傾斜延伸形成的上分隔板，所述下 下分隔板緊靠著連接環繞形成一個圓面 有LED光源的光源面板分別固定在所述 較佳地，在上述優選實施例中，所 上設有一彈簧孔，用於卡扣彈簧的一端 端固定在所述光源面板上，使得所述光 地固接在所述下導熱基板上。 根據本發明’可以點膠方式或採用 所述LED光源固定在所述光源面板上’ 與所述導熱基板可通過緊固件、點膠或 固定在一起。較佳地’所述光源面板與 間塗有散熱油層。 本發明的後蓋殼體的外表面可以設 垂直軸線平行且間隔排列的散熱片，以 效果。 後蓋的空心柱體的底部可以通過例 方式固定連接在殼體上’這對本領域技 而易見的。 述上導熱基板在 所述三角狀結構 控制電路的導線 設置在所述下導 隔板的頂端向上 導熱基板和所述 ;其中所述固接 上導熱基板上。 述各下導熱基板 *而彈賛的另一 源面板更加牢固 任何機械方式把 而所述光源面板 有黏性的散熱油 所述導熱基板之 有多條與其中心 達到更好的散熱 如卡接、螺接等 術人員來說是顯 201135148 要加強散熱效果’所述光源面板、導熱板 和反光杯最好選用可導熱的材料，如鋁、鋁合爸 在LED燈具中’主要發熱元件爲LED光源 的熱量散發會影響控制電路的穩定性，從而反 響LED光源的發光效果。本發明的LED螢光 晶片光源面板與導熱裝置緊密地接觸，導熱裝 散熱片的後蓋也形成緊密連接，因而形成了一 導熱和散熱途徑，將LED光源散發出的熱量通 板-導熱裝置-後蓋-散熱片的散熱途徑快速 發出去，降低了 LED光源以致燈體內部的溫度 制電路的溫度不會過高，增強了控制電路的穩 發明的導熱和散熱的傳導途徑，能夠達到很好 果，確保LED不過熱，延長了 LED螢光燈的壽 解決了大功率LED螢光燈發熱的問題。 此外，只需要改變導熱裝置中導熱基板的 以增加LED光源和光源面板的數量，所以本發 成系列化的大功率LED螢光燈。 以下將結合附圖對本發明的構思、具體結 的技術效果作進一步說明，以充分地瞭解本 的、特徵和效果。 【實施方式】 參照圖1至圖3，圖中示出了作爲本發明 施例的LED螢光燈1〇，所述螢光燈1〇包括玻天 、散熱器 ί或陶瓷。 丨，其產生 過來又影 燈將LED 置與設有 條良好的 過光源面 高效地散 。因此控 定性。本 的散熱效 命，由此 設計就可 明可以做 構及產生 發明的目 一優選實 离泡1 0 0、 201135148 三個LED光源400、三塊光源面板300、導熱裝置5 00、 控制電路600、後蓋700以及燈頭800。 玻璃泡1 00可以是透明的玻璃泡，也可以根據需要 選用噴塗矽膠的玻璃泡、扭紋玻璃泡和磨砂玻璃泡等。 燈頭800可以根據需要設計爲各種尺寸的燈頭，如E 1 1、 E12、E14、E17、E26、E27等。控制電路600不爲本發 明的要點，本處不做詳細描述。 LED光源可以由一或多個LED構成。在本實施例 中，三個LED光源400各由3個晶片LED組成，分別固 定在三塊光源面板3 00上。LED光源400和光源面板300 可以點.膠或任何已知的機械方式固定在一起。 如圖4至圖7所示，導熱裝置的上部大體上呈三角 狀，下部爲圓柱狀。在本實施例中，導熱裝置500包括 三塊徑向等距離間隔地設置並向其垂直中心線方向傾斜 的導熱基板。使導熱基板與螢光燈的中心垂直軸線成傾 斜配置，是爲了讓LED晶片發出的光可以直接照射出 來。每一塊導熱基板包括下導熱基板510和上導熱基板 5 3 0，該上導熱基板5 3 0沿下導熱基板5 1 0的頂端向上向 內傾斜延伸而形成，其中固接有LED光源400的光源面 板3 00固定在上導熱基板530上。三塊上導熱基板530 緊靠在一起在導熱裝置的上部形成一個三角狀結構。該 三角狀結構有一個平的頂面560，在頂面560的中心位 置開有一個圓孔561，LED光源400與控制電路600可以 201135148 通過該圓孔5 6 1以導線形成電連接。 在光源面板 300與導熱基板之間可以塗一層散熱 油，從而起到更好的導熱作用。當然，把光源面板300 固定在導熱基板上可以採用任何本領域已知的任何其他 方式，最好能夠使二者形成良好的導熱和散熱效果，例 如，可以利用黏性較強的散熱油直接把光源面板300黏 結在導熱板上。本實施例還採用彈簧片200加強光源面 板與上導熱基板5 30之間的固定。爲此，在下導熱基板 510上各設有一個彈簧孔511，彈簧片200的一端卡扣在 該彈簧孔內側，彈簧片的另一端壓住光源面板300。因 爲彈簧的受力作用，彈簧的反作用力會把光源面板300 牢固地壓住，從而使光源面板300更加緊密地固定在上 導熱基板5 30上。 導熱裝置5 00還包括三塊設置在下導熱基板510之 間的下分隔板520和沿所述各下分隔板520的頂端向上 向內傾斜延伸形成的上分隔板540。所述下導熱基板510 和所述下分隔板520緊靠著連接環繞形成一個圓面，如 圖4和圖7所示。將上 '下分隔板540，520配置成傾斜 的目的是爲了讓LED光源400沿各方向發出的光線能夠 充分有效地發散出去，使光線的發散不致受阻。 由下導熱基板510和下分隔板5 20圍繞形成的圓椎 體底端向下延伸形成一接納腔550，在接納腔550的底 部邊緣上設有環形介面。在本實施例中，該環形介面爲 201135148 接納腔5 5 0的底部邊緣向內彎折形成臺階5 5 1 後蓋7 0 0呈環狀，包括殼體7 2 0和空心柱 該空心柱體710的底部與殼體720固定在一起 可以採用本領域所知的任何方式。殼體720的 璃泡1 00可以採用任何本領域已知的任何方式 起，例如卡接或螺接。殼體的內壁上側向外突 臺階，通過該臺階與導熱裝置500的臺階551 合，使得導熱裝置500與後蓋700以可導熱方 —起，形成良好的導熱和散熱通道。空心柱體 小與導熱裝置5 00的接納腔5 5 0的大小相配合 控制電路600之後，再一起接納在所述導熱裝 腔5 5 0內。 在殼體720的外表面設有多條與其中心垂 行且間隔排列的散熱片7 2 1，這些散熱片7 2 1 以將導熱裝置500傳遞過來的熱量很好地散發 到更好的散熱效果。 光源面板3 00、導熱裝置500、後蓋的殼體 選用可導熱的材料，例如鋁、鋁合金或陶瓷等 由於固定有LED光源的光源面板緊貼在導 導熱基板上’導熱裝置又與後蓋形成導熱連接 的殻體外側表面又設有多條散熱片，籍此形成 的光源面板-導熱裝置一後蓋一散熱片的導熱 徑。LED光源發出的熱量通過該散熱途徑快速 體 710， ，該固定 上端與玻 接合在一 出形成一 緊密地接 式嵌接在 710的大 ，在容納 置的接納 直軸線平 的設置可 出去，達 720最好 〇 熱裝置的 ，而後蓋 一條良好 和散熱途 地散發出 -10- 201135148 去，降低了 LED光源的溫度，從而有效地解決了 LED燈 具的散熱問題。201135148 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to the field of lighting fixtures. More specifically, the present invention relates to an LED fluorescent lamp used as a lighting fixture, which has high light-emitting efficiency and good heat dissipation. [Prior Art] As a solid-state light source with great development potential, LED has been paid more and more attention since its birth in the 1960s due to its long life, firm structure, low power consumption and flexible size. It has gradually replaced traditional high-voltage halogen lamps in various lighting fields. However, the LED lamp itself generates a relatively large amount of heat during operation, thereby generating a large light decay and shortening the life of the LED lamp, thereby limiting the application range of the LED lamp in the lighting field to some extent. Since the brightness and power of a single LED light source are not sufficient for illumination, the existing LED lamps for illumination generally incorporate a plurality of LED light sources to form an LED array structure to achieve the required brightness and power. The more the number of assembled LED light sources, the higher the brightness and power of the LED lamps produced. Although the LED array structure can meet the lighting requirements, it also generates heat concentration, and the local temperature is too high to affect the stability of the circuit control system. Since no special heat conduction and heat dissipation devices are provided, the heat generated by the multiple LED light sources cannot be effectively dissipated, so that the temperature of the outer casing of the lamp will be relatively high, and there is a danger of hot hands when the person touches 201135148; High temperatures also make the lamp more susceptible to damage. At present, many technical solutions have been proposed to solve the heat dissipation problem of LED lamps, but these technical solutions have poor heat dissipation effects, and some have high cost and complicated structure although the heat dissipation effect is good. For example, the Chinese invention patent application number 200910011246.8, the patent application entitled "Circular heat pipe radiator heat sink LED lighting", discloses an LED lighting lamp using a loop type heat pipe radiator to dissipate heat, using a loop type heat pipe radiator structure and heat pipe heat dissipation. The principle of low thermal resistance and high thermal conductivity solves the problem of LED heat dissipation, but the cost of this heat dissipation method is high and the structure is complicated. Therefore, it is necessary to improve the existing LED lamps used for illumination purposes and improve the thermal conductivity thereof, thereby solving the heat dissipation problem of the LED lamps, improving the luminous efficiency, reducing the energy consumption, reducing the light decay, and increasing the luminous flux. SUMMARY OF THE INVENTION The object of the present invention is to overcome the above disadvantages of the prior art and to provide a novel LED fluorescent lamp, which has good thermal conductivity and heat dissipation, prolongs the service life of the LED lamp and reduces the energy. Consumption and reduced light decay. The object of the present invention is to provide an LED fluorescent lamp comprising a lamp cap, a glass bulb and a control circuit that can be inserted into a lamp holder and connected to a power source, and the LED fluorescent lamp further comprises: 4- 201135148 at least two LED light sources, the LED light source is connected to the control circuit; at least two light source panels, the at least two LED light sources are respectively fixed on the at least two light source panels; a heat conducting device, the The heat conducting device includes at least two heat conducting substrates disposed obliquely to the direction of the vertical center line thereof, and the at least two light source panels are respectively fixed to the at least two heat conducting substrates by heat conduction, and the bottom end of the heat conducting substrate is a lower receiving portion forming a receiving cavity, the bottom edge of the receiving cavity is provided with an annular interface; a rear cover comprising a housing and a hollow cylinder for accommodating the control circuit, the housing and the housing The glass bulb is joined, and an upper surface of the inner wall of the casing is provided with an annular interface through which the interface is tightly and tightly engaged with the annular interface of the heat conducting device, so that the heat conducting device and the heat conducting device are The back cover can be fitted together thermally conductive manner, the receiving device receiving cavity of the heat-conducting connection with said fixed hollow cylinder and the housing bottom 'of the hollow cylinder and the control circuit. In a preferred embodiment of the present invention, the LED fluorescent lamp comprises: three LED light sources; three light source panels 'the three LED light sources are respectively fixed on the three light source panels; the heat conducting device' The device comprises three thermally conductive substrates disposed at equal radial intervals and inclined toward a vertical centerline thereof, the thermally conductive substrates comprising a lower thermally conductive substrate and an inwardly extending upwardly along the top end of the lower thermally conductive substrate toward 201135148 The upper heat conducting substrate has a triangular structure formed on the upper portion of the heat conducting device, and a top surface is provided with a circular hole for connecting the LED light source and the passing. The heat conducting device further includes a lower partition plate between the three hot substrates and an upper partition plate extending obliquely inwardly along the lower portions, the lower lower partition plate forming a circle abutting against the connection The light source panel having the LED light source is respectively fixed to the above. Preferably, in the above preferred embodiment, a spring hole is disposed thereon, and one end of the snap spring is fixed on the light source panel, so that the light The ground is fixed on the lower heat conductive substrate. According to the present invention, the light source panel can be fixed by means of a dispensing or by using the LED light source, and the thermally conductive substrate can be fastened, glued or fixed together. Preferably, the light source panel is coated with a heat dissipating oil layer. The outer surface of the back cover casing of the present invention may be provided with heat sinks having parallel and spaced vertical axes for the purpose. The bottom of the hollow cylinder of the back cover can be fixedly attached to the housing by way of example' which is readily apparent in the art. The heat conducting substrate is disposed on the top end of the lower conductive spacer in a conductive line of the triangular structure control circuit, and the thermally conductive substrate is mounted thereon; wherein the conductive substrate is fixed on the thermally conductive substrate. The other source panel of the heat-conducting substrate* is more robust, and the heat-dissipating oil of the light-emitting panel has a plurality of heat-dissipating oils. Screws and other technicians are shown 201135148 to enhance the heat dissipation effect. The light source panel, heat conducting plate and reflector cup are preferably made of heat-conducting materials, such as aluminum and aluminum dad in LED lamps. The main heating element is LED light source. The heat dissipation affects the stability of the control circuit and thus the illumination of the LED light source. The LED fluorescent wafer light source panel of the invention is in close contact with the heat conducting device, and the rear cover of the heat conducting heat sink is also tightly connected, thereby forming a heat conduction and heat dissipation path, and the heat radiated from the LED light source is passed through the heat conduction device- The heat dissipation path of the back cover-heat sink is quickly emitted, which reduces the LED light source so that the temperature inside the lamp body is not too high, which enhances the conduction path of the heat conduction and heat dissipation of the control circuit. If the LED is not too hot, the life of the LED fluorescent lamp is extended to solve the problem of high-power LED fluorescent lamp heating. In addition, it is only necessary to change the number of the heat-conducting substrate in the heat-conducting device to increase the number of the LED light source and the light source panel, so that a series of high-power LED fluorescent lamps are produced. The concept of the present invention and the technical effects of the specific embodiments will be further described in conjunction with the accompanying drawings in order to fully understand the present invention. [Embodiment] Referring to Figs. 1 to 3, there is shown an LED fluorescent lamp 1 as an embodiment of the present invention, which comprises a glass bulb, a heat sink or a ceramic. Oh, it produces a light that illuminates the LEDs with a good light source surface. Therefore, it is controllable. The heat dissipation effect of the present invention can be clearly designed and produced. The preferred three-light source 400, the three light source panels 300, the heat-conducting device 500, the control circuit 600, The rear cover 700 and the base 800. The glass bubble 100 can be a transparent glass bubble, and a glass bubble, a twisted glass bubble, a frosted glass bubble, or the like can be used as needed. The lamp cap 800 can be designed as a lamp head of various sizes as required, such as E 1 1 , E12, E14, E17, E26, E27, and the like. The control circuit 600 is not the gist of the present invention and will not be described in detail herein. The LED light source can be constructed from one or more LEDs. In the present embodiment, the three LED light sources 400 are each composed of three wafer LEDs, which are respectively fixed on the three light source panels 300. The LED light source 400 and the light source panel 300 can be secured together by glue or any known mechanical means. As shown in Figs. 4 to 7, the upper portion of the heat transfer device is substantially triangular and the lower portion is cylindrical. In the present embodiment, the heat conducting device 500 includes three thermally conductive substrates which are radially equidistantly spaced and inclined toward their vertical centerlines. The thermally conductive substrate is disposed obliquely to the center vertical axis of the fluorescent lamp so that the light emitted from the LED chip can be directly irradiated. Each of the heat conductive substrates includes a lower heat conductive substrate 510 and an upper heat conductive substrate 530. The upper heat conductive substrate 530 is formed to extend obliquely upward and inward along a top end of the lower heat conductive substrate 510, wherein the light source of the LED light source 400 is fixed. The panel 300 is fixed to the upper heat conductive substrate 530. The three upper thermally conductive substrates 530 abut together to form a triangular structure on the upper portion of the heat conducting device. The triangular structure has a flat top surface 560 with a circular aperture 561 in the center of the top surface 560 through which the LED light source 400 and the control circuit 600 can be electrically connected by wires through the circular aperture 516. A layer of heat dissipating oil may be applied between the light source panel 300 and the heat conducting substrate to provide better heat conduction. Of course, the light source panel 300 can be fixed on the heat conductive substrate by any other means known in the art, and it is preferable to form a good heat conduction and heat dissipation effect. For example, the heat dissipation oil with strong viscosity can be directly used. The light source panel 300 is bonded to the heat conducting plate. In this embodiment, the spring piece 200 is used to reinforce the fixing between the light source panel and the upper heat conductive substrate 530. To this end, a spring hole 511 is disposed on each of the lower heat conductive substrates 510. One end of the spring piece 200 is snapped inside the spring hole, and the other end of the spring piece is pressed against the light source panel 300. Due to the force of the spring, the reaction force of the spring firmly presses the light source panel 300, so that the light source panel 300 is more closely fixed to the upper heat conductive substrate 530. The heat transfer device 500 further includes three lower partition plates 520 disposed between the lower heat conductive substrates 510 and an upper partition plate 540 formed obliquely upward and upward along the top ends of the respective lower partition plates 520. The lower thermally conductive substrate 510 and the lower spacer 520 are circumferentially formed to form a circular surface as shown in Figs. 4 and 7. The purpose of arranging the upper 'lower partition plates 540, 520 to be inclined is to allow the light emitted from the LED light source 400 in all directions to be sufficiently efficiently radiated, so that the divergence of the light is not hindered. A receiving cavity 550 is formed downwardly from the bottom end of the circular body formed by the lower thermally conductive substrate 510 and the lower dividing plate 520, and an annular interface is provided on the bottom edge of the receiving cavity 550. In this embodiment, the annular interface is 201135148. The bottom edge of the receiving cavity 550 is bent inward to form a step 5 5 1 . The back cover 700 is annular, including a housing 720 and a hollow cylinder. The bottom of the 710 is secured to the housing 720 in any manner known in the art. The glass bulb 100 of the housing 720 can be in any manner known in the art, such as snapping or screwing. The upper side of the inner wall of the casing protrudes outwardly from the step, and the step 551 of the heat conducting device 500 is engaged with the step, so that the heat conducting device 500 and the rear cover 700 form a good heat conduction and heat dissipation passage. The hollow cylinder is small enough to match the size of the receiving cavity 505 of the heat conducting device 500. After the control circuit 600, it is received together in the heat conducting chamber 550. The outer surface of the housing 720 is provided with a plurality of fins 7 2 1 which are arranged vertically and spaced apart from each other, and the fins 7 2 1 are used to dissipate the heat transferred from the heat conducting device 500 to a better heat dissipation effect. . The light source panel 300, the heat conducting device 500, and the cover of the back cover are made of a material that can conduct heat, such as aluminum, aluminum alloy or ceramic. The light source panel with the LED light source fixedly adheres to the heat conductive substrate. The outer surface of the casing forming the heat-conducting connection is further provided with a plurality of fins, and the light source panel formed by the heat-conducting device has a heat-dissipating diameter of the heat-dissipating fin. The heat generated by the LED light source passes through the heat dissipating means 710, and the fixed upper end and the glass are joined together to form a tightly fitting 710 at the large position, and the receiving straight axis is disposed in a flat position. 720 is best to heat the device, and the back cover emits a good and heat-dissipating way to -10-201135148, which reduces the temperature of the LED light source, thus effectively solving the heat dissipation problem of the LED lamp.
根據本發明，LED光源的數量可以爲2個以上，如 3個或4個，甚至更多個，只要相應地調整導熱裝置500 中導熱基板的數量即可。因爲解決了 LED光源的散熱問 題，因而可以做成更大功率、更低能耗和更小光衰的LED 燈具。 因此，本發明提供了一種LED螢光燈，不僅有效地 解決了 LED的散熱問題，而且還大大地提高了 LED的光 通量和發光效率。 雖然結合附圖描述了本發明的較佳具體實施例，但 本發明不應被限制於與以上的描述和附圖完全相同的結 構和操作。對本技術領域的技術人員來說，在不超出本 發明構思和範圍的情況下通過邏輯分析、推理或者有限 的實驗還可對上述實施例作出許多改進和變化，但這些 改進和變化都應屬於本發明要求保護的範圍。 【圖式簡單說明】 圖1所示爲本發日I 一實施例的LED螢光燈的正視 圖。 圖2所示爲沿圖1所示的A - A方向的剖視圖。 圖3所示爲圖1所示的LED螢光燈的立體分解圖。 圖4所示爲圖1所示的LED螢光燈中導熱裝置的頂 部立體示意圖。 -11- 201135148 圖5所示爲圖4所示的導熱裝置的底部立體示意圖 圖6所示爲圖4所示的導熱裝置的正視圖。' 圖7所示爲圖4所示的導熱裝置的俯視圖。 【主要元件符號說明】 10 LED螢光燈 100 玻璃泡 200 彈簧片 300 光源面板 400 LED光源 500 導熱裝置 510 下導熱基板 5 11 彈簧孔 520 下分隔板 530 上導熱基板 540 上分隔板 550 接納腔 55 1 臺階 560 頂面 561 圓孔 600 控制電路 700 後蓋 7 10 空心柱體 720 殼體 -12- 201135148 72 1 散熱片 800 燈頭According to the present invention, the number of LED light sources may be two or more, such as three or four, or even more, as long as the number of thermally conductive substrates in the heat conducting device 500 is adjusted accordingly. Because it solves the heat dissipation problem of the LED light source, it can be made into LED lamps with higher power, lower power consumption and less light decay. Therefore, the present invention provides an LED fluorescent lamp which not only effectively solves the problem of heat dissipation of the LED, but also greatly improves the luminous flux and luminous efficiency of the LED. While the preferred embodiment of the present invention has been described in conjunction with the drawings, the invention should not be construed as Many modifications and variations of the above-described embodiments may be made by those skilled in the art without departing from the spirit and scope of the inventions. The scope of the claimed invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing an LED fluorescent lamp according to an embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line A - A shown in Fig. 1. 3 is an exploded perspective view of the LED fluorescent lamp shown in FIG. 1. Fig. 4 is a top perspective view showing the heat transfer device of the LED fluorescent lamp shown in Fig. 1. -11- 201135148 Fig. 5 is a bottom perspective view of the heat conducting device shown in Fig. 4. Fig. 6 is a front elevational view showing the heat conducting device shown in Fig. 4. Figure 7 is a plan view of the heat transfer device shown in Figure 4. [Main component symbol description] 10 LED fluorescent lamp 100 Glass bubble 200 Spring plate 300 Light source panel 400 LED light source 500 Heat conduction device 510 Lower thermal substrate 5 11 Spring hole 520 Lower partition plate 530 Upper heat conductive substrate 540 Upper partition plate 550 Accept Cavity 55 1 Step 560 Top surface 561 Round hole 600 Control circuit 700 Back cover 7 10 Hollow cylinder 720 Housing-12- 201135148 72 1 Heat sink 800 Lamp cap