WO2011094949A1 - Led fluorescent lamp - Google Patents

Abstract

An LED fluorescent lamp is disclosed. The LED fluorescent lamp includes a lamp cap, a glass bubble, a control circuit, at least two LED light sources, at least two light source panels used for fixing the LED light source, a heat transfer apparatus and a rear cover. The heat transfer apparatus includes at least two heat transfer substrates, which are tilted to the vertical center line. With capability of heat transferring, the at least two light source panels are respectively fixed on the at least two heat transfer substrates. The bottoms of the heat transfer substrates extend downwards to form an accepting cavity. The rear cover includes a case and a hollow cylinder for accommodating the control circuit. The case attaches to the heat transfer apparatus closely through a ring interface, making the rear cover scarf the heat transfer substrates with capability of heat transferring. The outer surface of the rear cover has a plurality of heat fins also. The light source panels, the heat transfer apparatus, the case of the rear cover and the heat fins constitute a means of thermal conductivity and heat dissipation.

Description

 LED fluorescent light

The invention relates to the field of lighting fixtures. More specifically, the present invention relates to an LED fluorescent lamp used as a lighting fixture, which has high luminous efficiency and good heat dissipation.

led As a solid-state light source with great development potential, since its birth in the 1960s, it has attracted more and more attention due to its long life, firm structure, low power consumption and flexible size. It has gradually replaced the tradition. High-voltage halogen lamps are used in a variety of lighting applications. However, the LED lamp itself generates a relatively large amount of heat during operation, thereby generating a large light decay and shortening the service life of the LED lamp, thereby limiting the application range of the LED lamp in the field of illumination to a certain extent.

Since the brightness and power of a single LED light source are insufficient and cannot be used as illumination, the existing LED lamps for illumination generally assemble a plurality of LED light sources to form an LED array structure to achieve the required brightness and power. The more the number of assembled LED light sources, the higher the brightness and power of the LED lamps produced. Although the LED array structure can meet the lighting requirements, it also generates heat concentration, local temperature is too high, and affects the stability of the circuit control system. Since no special heat conduction and heat dissipation devices are provided, the heat generated by the plurality of LED light sources cannot be effectively dissipated, so that the temperature of the outer casing of the lamp is relatively high, and there is a danger of hot hands when a person touches; High also makes the lamp more susceptible to damage.

At present, many technical solutions have been proposed to solve the heat dissipation problem of LED lamps, but these technical solutions have poor heat dissipation effects, and some have high heat dissipation effects, but the structure is complicated. For example, the Chinese Patent Application No. 200910011246.8, entitled "Circular Heat Pipe Radiator Cooling LED Lighting" patent application, discloses an LED lighting lamp using a loop type heat pipe radiator to dissipate heat, using a loop type heat pipe radiator structure and a heat pipe The heat sink has a small thermal resistance and a high heat transfer coefficient, which solves the problem of LED heat dissipation, but the heat dissipation method has high cost and complicated structure.

Therefore, it is necessary to improve the existing LED lamps used for illumination purposes and improve the thermal conductivity thereof, thereby solving the heat dissipation problem of the LED lamps, improving the luminous efficiency, reducing the energy consumption, reducing the light decay, and increasing the luminous flux.

Summary of the invention

The object of the present invention is to overcome the above disadvantages in the prior art and to provide a novel LED fluorescent lamp which has good thermal conductivity and heat dissipation, prolongs the service life of the LED lamp, reduces energy consumption and reduces light decay. .

The object of the present invention is to provide an LED fluorescent lamp comprising a lamp cap, a glass bulb and a control circuit that can be inserted into a lamp holder and connected to a power source, and the LED fluorescent lamp further comprises:

At least two LED light sources connected to the control circuit;

At least two light source panels, wherein the at least two LED light sources are respectively fixed on the at least two light source panels;

a heat conducting device comprising at least two heat conducting substrates disposed obliquely to a direction perpendicular to a center line thereof, wherein the at least two light source panels are respectively fixed to the at least two heat conducting substrates in a heat conductive manner, the heat conducting The bottom end of the substrate extends downward to form a receiving cavity, and the bottom edge of the receiving cavity is provided with an annular interface;

a rear cover, the rear cover includes a housing and a hollow cylinder for receiving the control circuit, the housing is engaged with the glass bulb, and an upper portion of the inner wall of the housing is provided with an annular interface through which the The annular interface of the heat conducting device is tightly coupled such that the heat conducting device and the back cover are thermally coupled together, and the bottom of the hollow cylinder is fixedly connected to the housing, the hollow cylinder Accommodating with the control circuit is received within the receiving cavity of the thermally conductive device.

In a preferred embodiment of the invention, the LED fluorescent lamp comprises:

Three LED light sources;

a three light source panel, wherein the three LED light sources are respectively fixed on the three light source panels;

a heat conducting device comprising three thermally conductive substrates disposed radially equidistantly spaced and inclined toward a vertical centerline thereof, the thermally conductive substrates comprising a lower thermally conductive substrate and upwardly and inwardly along a top end of the lower thermally conductive substrate An upper thermally conductive substrate formed obliquely extending, the upper thermally conductive substrate forming a triangular structure on an upper portion of the heat conducting device, the top surface of the triangular structure having a circle through which the wires connecting the LED light source and the control circuit pass hole. The heat conducting device further includes three lower partition plates disposed between the lower heat conductive substrates and an upper partition plate extending obliquely upward and inward along a top end of each of the lower partition plates, the lower heat conductive substrate Forming a circular surface adjacent to the lower partitioning plate; wherein the light source panel to which the LED light source is fixed is respectively fixed on the upper heat conductive substrate.

Preferably, in the above preferred embodiment, each of the lower thermally conductive substrates is provided with a spring hole for one end of the snap spring, and the other end of the spring is fixed on the light source panel, so that the light source panel is further Securely attached to the lower thermally conductive substrate.

According to the present invention, the LED light source can be fixed on the light source panel by dispensing or by any mechanical means, and the light source panel and the heat conductive substrate can pass fasteners, dispensing or adhesive heat dissipation oil. Fixed together. Preferably, a heat dissipation oil layer is coated between the light source panel and the heat conductive substrate.

The outer surface of the back cover housing of the present invention may be provided with a plurality of fins arranged parallel to and spaced apart from the center vertical axis for better heat dissipation.

The bottom of the hollow cylinder of the back cover can be fixedly attached to the housing by, for example, snapping, screwing, etc., as will be apparent to those skilled in the art.

To enhance the heat dissipation effect, the light source panel, the heat conducting plate, the heat sink and the reflector cup are preferably made of a heat conductive material such as aluminum, aluminum alloy or ceramic.

In the LED luminaire, the main heating element is the LED light source, and the heat dissipation generated by the LED luminaire affects the stability of the control circuit, which in turn affects the illuminating effect of the LED light source. The LED fluorescent lamp of the invention closely contacts the LED chip light source panel and the heat conducting device, and the heat conducting device is also closely connected with the back cover provided with the heat sink, thereby forming a good heat conduction and heat dissipation path, and the heat emitted by the LED light source The heat dissipation path of the light source panel-heat conducting device-back cover-heat sink is quickly and efficiently dissipated, which reduces the temperature of the LED light source to the inside of the lamp body. Therefore, the temperature of the control circuit is not too high, which enhances the stability of the control circuit. The heat conduction and heat dissipation conduction path of the invention can achieve a good heat dissipation effect, ensure that the LED is not hot, and prolong the life of the LED fluorescent lamp, thereby solving the problem of heating of the high power LED fluorescent lamp.

In addition, the number of LED light sources and light source panels can be increased by merely changing the design of the heat conductive substrate in the heat conducting device, so that the present invention can be made into a series of high power LED fluorescent lamps.

The concept, the specific structure and the technical effects of the present invention will be further described in conjunction with the accompanying drawings in order to fully understand the objects, features and effects of the invention.

DRAWINGS

Fig. 1 is a front elevational view showing an LED fluorescent lamp according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1.

3 is an exploded perspective view of the LED fluorescent lamp shown in FIG. 1.

4 is a top perspective view of the heat conducting device of the LED fluorescent lamp shown in FIG. 1.

FIG. 5 is a bottom perspective view of the heat conducting device shown in FIG. 4.

Figure 6 is a front elevational view of the heat transfer device of Figure 4.

Figure 7 is a plan view of the heat transfer device shown in Figure 4.

detailed description

Referring to Figures 1 to 3, there is shown an LED fluorescent lamp 10 as a preferred embodiment of the present invention, the fluorescent lamp 10 comprising a glass bubble 100, three LED light sources 400, three light source panels 300, a heat conducting device 500, and control Circuit 600, back cover 700, and base 800.

The glass bubble 100 may be a transparent glass bubble, or a glass bubble coated with a silica gel, a twisted glass bubble, or a frosted glass bubble may be used as needed. The lamp cap 800 can be designed as a lamp head of various sizes as required, such as E11, E12, E14, E17, E26, E27, and the like. The control circuit 600 is not the gist of the present invention and will not be described in detail herein.

The LED light source can be constructed from one or more LEDs. In this embodiment, the three LED light sources 400 are each composed of three chip LEDs, which are respectively fixed on the three light source panels 300. The LED light source 400 and the light source panel 300 can be glued together or fixed together in any known mechanical manner.

As shown in FIGS. 4 to 7, the upper portion of the heat transfer device is substantially triangular and the lower portion is cylindrical. In the present embodiment, the heat conducting device 500 includes three thermally conductive substrates disposed radially equidistantly spaced and inclined toward their vertical centerline directions. The heat-conducting substrate is disposed obliquely to the central vertical axis of the fluorescent lamp so that the light emitted from the LED chip can be directly irradiated. Each of the heat conductive substrates includes a lower heat conductive substrate 510 and an upper heat conductive substrate 530. The upper heat conductive substrate 530 is formed to extend obliquely upward and inward along the top end of the lower heat conductive substrate 510. The light source panel 300 to which the LED light source 400 is fixed is fixed on the heat conduction. On the substrate 530. The three upper thermally conductive substrates 530 abut together to form a triangular structure on the upper portion of the heat conducting device. The triangular structure has a flat top surface 560 with a circular opening 561 at the center of the top surface 560 through which the LED light source 400 and the control circuit 600 can be electrically connected by wires.

A layer of heat-dissipating oil may be applied between the light source panel 300 and the heat-conducting substrate to provide better heat conduction. Of course, the light source panel 300 can be fixed on the heat conductive substrate by any other means known in the art, and it is better to form a good heat conduction and heat dissipation effect. For example, the light source can be directly used by the viscous heat dissipation oil. The panel 300 is bonded to the heat conducting plate. In this embodiment, the spring piece 200 is used to strengthen the fixing between the light source panel and the upper heat conductive substrate 530. To this end, a spring hole 511 is disposed on each of the lower heat conductive substrates 510. One end of the spring piece 200 is buckled inside the spring hole, and the other end of the spring piece is pressed against the light source panel 300. Because of the force of the spring, the reaction force of the spring will firmly press the light source panel 300, so that the light source panel 300 is more closely fixed to the upper heat conductive substrate 530.

The heat conducting device 500 further includes three lower partition plates 520 disposed between the lower heat conductive substrates 510 and an upper partition plate 540 formed obliquely upward and inward along the top ends of the respective lower partition plates 520. The lower heat conductive substrate 510 and the lower partition plate 520 are circumferentially formed to form a circular surface, as shown in FIGS. 4 and 7. The purpose of arranging the upper and lower partition plates 540, 520 to be inclined is to allow the light emitted from the LED light source 400 in various directions to be sufficiently effectively radiated, so that the divergence of the light is not hindered.

A receiving cavity 550 is formed downwardly from the bottom end of the circular vertebral body formed by the lower thermally conductive substrate 510 and the lower dividing plate 520, and an annular interface is provided on the bottom edge of the receiving cavity 550. In the present embodiment, the annular interface is bent inwardly to form a step 551 for the bottom edge of the receiving cavity 550.

The back cover 700 is annular and includes a housing 720 and a hollow cylinder 710, the bottom of which is secured to the housing 720 in any manner known in the art. The upper end of the housing 720 and the glass bulb 100 can be joined together by any means known in the art, such as snapping or screwing. The upper side of the inner wall of the casing protrudes outwardly to form a step, and the step is closely engaged with the step 551 of the heat conducting device 500, so that the heat conducting device 500 and the back cover 700 are thermally coupled together to form good heat conduction and heat dissipation. aisle. The size of the hollow cylinder 710 matches the size of the receiving cavity 550 of the heat conducting device 500, and after receiving the control circuit 600, is received together within the receiving cavity 550 of the heat conducting device.

The outer surface of the housing 720 is provided with a plurality of fins 721 arranged parallel to and spaced apart from the central vertical axis. The fins 721 are disposed to dissipate the heat transferred from the heat conducting device 500 to achieve better heat dissipation. effect.

The light source panel 300, the heat conducting device 500, and the housing 720 of the back cover are preferably made of a heat conductive material such as aluminum, aluminum alloy or ceramic.

Since the light source panel with the LED light source is closely attached to the heat-conducting substrate of the heat-conducting device, the heat-conducting device forms a heat-conducting connection with the rear cover, and the outer surface of the rear cover has a plurality of heat-dissipating fins, thereby forming a good light source. Panel - Heat Transfer - Back Cover - Heat sink and heat sink for heat sinks. The heat emitted by the LED light source is quickly dissipated through the heat dissipation path, which reduces the temperature of the LED light source, thereby effectively solving the heat dissipation problem of the LED lamp.

According to the present invention, the number of LED light sources may be two or more, such as three or four, or even more, as long as the number of thermally conductive substrates in the heat conducting device 500 is adjusted accordingly. Because it solves the heat dissipation problem of the LED light source, it can be made into LED lamps with higher power, lower power consumption and less light decay.

Therefore, the present invention provides an LED fluorescent lamp, which not only effectively solves the heat dissipation problem of the LED, but also greatly improves the luminous flux and luminous efficiency of the LED.

While the preferred embodiment of the invention has been described with reference to the drawings, the invention should not be construed Many modifications and variations of the above-described embodiments may be made by those skilled in the art without departing from the spirit and scope of the inventions. The scope of the claimed invention.

Claims (11)

An LED fluorescent lamp comprising a lamp cap, a glass bulb and a control circuit that can be inserted into a lamp holder and connected to a power source, wherein the LED fluorescent lamp further comprises: At least two LED light sources connected to the control circuit; At least two light source panels, wherein the at least two LED light sources are respectively fixed on the at least two light source panels; a heat conducting device comprising at least two heat conducting substrates disposed obliquely to a direction perpendicular to a center line thereof, wherein the at least two light source panels are respectively fixed to the at least two heat conducting substrates in a heat conductive manner, the heat conducting The bottom end of the substrate extends downward to form a receiving cavity, and the bottom edge of the receiving cavity is provided with an annular interface; a rear cover, the rear cover includes a housing and a hollow cylinder for receiving the control circuit, the housing is engaged with the glass bulb, and an upper portion of the inner wall of the housing is provided with an annular interface through which the The annular interface of the heat conducting device is tightly coupled such that the heat conducting device and the back cover are thermally coupled together, and the bottom of the hollow cylinder is fixedly connected to the housing, the hollow cylinder Accommodating with the control circuit is received within the receiving cavity of the thermally conductive device. The LED fluorescent lamp of claim 1 wherein said LED fluorescent lamp comprises: Three LED light sources; a three light source panel, wherein the three LED light sources are respectively fixed on the three light source panels; a heat conducting device comprising three thermally conductive substrates disposed at equal intervals and inclined toward a vertical centerline thereof, the thermally conductive substrates comprising a lower thermally conductive substrate and extending obliquely upward and inward along a top end of the lower thermally conductive substrate Forming an upper thermally conductive substrate, the upper thermally conductive substrate forming a triangular structure on top of the heat conducting device; the heat conducting device further comprising three lower dividing plates disposed between the lower thermally conductive substrates and along each of the lower An upper partition plate is formed by extending a top end of the partition plate upwardly and inwardly, and the lower heat conductive substrate and the lower partition plate are circumferentially abutted to form a circular surface; The light source panel to which the LED light source is fixed is respectively fixed on the upper heat conductive substrate. The LED fluorescent lamp of claim 2, wherein each of the lower thermally conductive substrates is provided with a spring hole for one end of the snap spring, and the other end of the spring is fixed to the light source panel, so that The light source panel is firmly fixed to the upper heat conductive substrate. The LED fluorescent lamp according to claim 2, wherein the top surface of the triangular structure is provided with a circular hole through which a wire connecting the LED light source and the control circuit passes. The LED fluorescent lamp according to any one of claims 1 to 4, wherein the LED light source is fixed to the light source panel by dispensing or mechanical means. The LED fluorescent lamp according to any one of claims 1 to 4, wherein the light source panel and the heat-conductive substrate are fixed together in the following manner: a fastener, a dispensing or a viscous heat-dissipating oil. The LED fluorescent lamp according to any one of claims 1 to 4, wherein a heat dissipating oil layer is applied between the light source panel and the thermally conductive substrate. The LED fluorescent lamp according to any one of claims 1 to 4, wherein the outer surface of the casing is provided with a plurality of fins arranged in parallel with and spaced apart from the center vertical axis. The LED fluorescent lamp according to any one of claims 1 to 4, wherein the light source panel, the heat conducting device and the housing of the back cover are made of a material that can conduct heat. The LED fluorescent lamp of claim 9, wherein the heat conductive material is aluminum, an aluminum alloy or a ceramic. The LED fluorescent lamp according to any one of claims 1 to 4, wherein the glass bubble is selected from the group consisting of a glass foam coated with silica gel, a twisted glass bubble, and a frosted glass bubble.

Images