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WO2011072597A1 - 光刻机双硅片台交换方法及系统 - Google Patents

光刻机双硅片台交换方法及系统 Download PDF

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Publication number
WO2011072597A1
WO2011072597A1 PCT/CN2010/079759 CN2010079759W WO2011072597A1 WO 2011072597 A1 WO2011072597 A1 WO 2011072597A1 CN 2010079759 W CN2010079759 W CN 2010079759W WO 2011072597 A1 WO2011072597 A1 WO 2011072597A1
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Prior art keywords
wafer stage
driving unit
degree
drive unit
freedom
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PCT/CN2010/079759
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English (en)
French (fr)
Inventor
朱煜
张鸣
徐登峰
汪劲松
董立立
杨开明
尹文生
胡金春
许岩
马竞
田丽
李玉洁
王婧
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Tsinghua University
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Tsinghua University
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    • H10P72/50—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving

Definitions

  • the invention relates to an efficient lithography machine dual silicon wafer exchange system, which is applied to a semiconductor lithography machine and belongs to the technical field of semiconductor manufacturing equipment.
  • the exposure design (lithography) of the chip design pattern on the photoresist on the surface of the silicon wafer is one of the most important processes.
  • the device used in this process is called a photolithography machine. machine).
  • the resolution and exposure efficiency of the lithography machine greatly affect the feature line width (resolution) and productivity of the integrated circuit chip.
  • the motion precision and working efficiency of the silicon ultra-precision motion positioning system (hereinafter referred to as the silicon wafer system), which is the key system of the lithography machine, largely determine the resolution and exposure efficiency of the lithography machine.
  • the basic principle of the step-and-scan projection lithography machine is shown in Figure 1.
  • the deep ultraviolet light from the light source 26 passes through a reticle 27 and a lens system 28 to image a portion of the pattern on the reticle on a particular chip of the silicon wafer 29.
  • the reticle and the silicon wafer are reversely moved at a certain speed ratio, and finally all the patterns on the reticle are imaged on the chip of the silicon wafer.
  • the basic function of the wafer stage motion positioning system is to carry the silicon wafer during the exposure process and move at a set speed and direction to achieve accurate transfer of the mask pattern to various areas of the wafer. Since the line width of the chip is very small (the minimum line width has reached 45 nm at present), in order to ensure the engraving precision and resolution of the lithography, the wafer stage must have a very high motion positioning accuracy; in addition, the movement of the wafer stage Speed greatly affects the productivity of lithography, so it is necessary to continuously increase the speed of the wafer stage to increase productivity.
  • the invention patent filed by the applicant in 2007 "a lithography machine wafer table double exchange system” (publication number: CN101101454 A dual-switching system of a lithography machine is disclosed, which has the advantages of simple structure, high space utilization, and the exposure efficiency of the lithography machine.
  • the double-wafer stage system also has some problems.
  • the air-floating bearing needs to exchange the guiding surface when the wafer stage is exchanged, which leads to extremely high precision requirements for the dimensional consistency of the wafer stage, and the processing and assembly of the parts.
  • the invention aims at the shortcomings and defects of the prior art silicon wafer stage technology, and proposes a new high efficiency with the advantages of simple structure, high exchange efficiency, high space utilization and no collision between linear guide rails during exchange.
  • the lithography machine's dual silicon wafer exchange system can overcome the shortcomings of the existing dual silicon wafer exchange system, such as non-centroid drive, high space utilization, and high processing and assembly precision requirements, making it simple in structure and space utilization.
  • the rate is high and there is no advantage that the linear guides collide with each other during the exchange, thereby further improving the exchange efficiency and exposure efficiency of the lithography machine.
  • the invention provides a method for exchanging a dual wafer stage of a lithography machine, characterized in that the exchange method is carried out as follows: a) when the two wafer stages exchange positions, firstly, the first main driving unit drives the first Y direction guide And the first wafer stage rotates clockwise in the plane of the base, and the second main driving unit drives the second Y-direction guide and the second wafer stage to rotate clockwise in the plane of the base, and The first wafer stage auxiliary driving unit drives the first wafer stage to move along the first Y-direction rail toward the first main driving unit, and the second wafer stage auxiliary driving unit drives the second wafer stage to face along the second Y-direction rail.
  • the second main driving unit moves in the direction; b) when the two Y-direction guides rotate to move in the X direction without mutual interference, the first main driving unit drives the first Y-direction guide rail and the first silicon wafer stage to move in the negative X direction. At the same time, the second main driving unit drives the second Y-direction guide rail and the second silicon wafer stage to move in the positive X direction, and the first single-degree-of-freedom auxiliary driving unit moves in the X negative direction, and the third single-degree-of-freedom auxiliary driving unit moves along the X direction.
  • the invention provides a lithography machine dual silicon wafer exchange system, which comprises a first wafer stage running at an exposure station, a second wafer stage running at a pretreatment station, a base station, a first X Direction linear guide, second X direction linear guide, first single degree of freedom auxiliary drive unit, second single degree of freedom auxiliary drive unit, third single degree of freedom auxiliary drive unit, fourth single degree of freedom auxiliary drive unit, first Y a direction guide rail, a second Y-direction guide rail, a first wafer stage auxiliary driving unit, and a second wafer stage auxiliary driving unit, the first Y-direction rail passes through the first wafer stage, and the second Y-direction rail passes through the second silicon a stage; the system further comprising: a first main driving unit disposed on the first X-direction linear guide; and a second main driving unit disposed on the second X-direction linear guide; the first main The driving unit and the second main driving unit have a degree of freedom of movement in the X direction and
  • a lithography machine dual silicon wafer exchange system is characterized in that: the first main driving unit and the second main driving unit are driven by a main driving unit linear motor mover, a torque motor and a vacuum preload
  • the air bearing is composed of a stepping motor, or the linear motor is replaced by a stepping motor, and the vacuum preloaded air bearing is replaced by a permanent magnet preloaded air floating shaft.
  • a ball guide or an air bearing is mounted between the top of the first main drive unit and the first X-direction guide rail, and between the top of the second main drive unit and the second X-direction guide rail as a guide support;
  • the bottom surface of the first main driving unit and the second main driving unit in contact with the base is equipped with a permanent magnet preloaded air bearing.
  • a lithography machine dual silicon wafer exchange system is characterized in that: the first main driving unit, the second main driving unit, the first single degree of freedom auxiliary driving unit, and the second single
  • the linearity motor of the degree of freedom auxiliary drive unit, the third single degree of freedom auxiliary drive unit, the fourth single degree of freedom auxiliary drive unit, the first wafer stage auxiliary drive unit, and the second wafer stage auxiliary drive unit are respectively mounted for position Feedback linear grating.
  • the first single degree of freedom auxiliary driving unit, the second single degree of freedom auxiliary driving unit, the third single degree of freedom auxiliary driving unit and the fourth single degree of freedom auxiliary driving unit of the present invention are all equipped with linear motor movers at the bottom.
  • the side contacting the abutment is equipped with a vacuum preloaded air bearing, and the bottom surface in contact with the abutment is equipped with a permanent magnet preloaded air bearing.
  • a lithography machine dual silicon wafer exchange system further comprises a dual frequency laser interferometer for moving position feedback of the silicon wafer stage.
  • the invention has the following outstanding advantages: one is that the silicon wafer stage of the system is driven by the centroid; the other is that the four auxiliary driving units are single degrees of freedom, which simplifies the control system structure and reduces the system zero.
  • Figure 1 is a schematic diagram of the working principle of the lithography machine.
  • FIG. 2 is a state diagram of a wafer stage dual stage exchange system of a lithography machine of the present invention and before exchange.
  • Figure 3 shows the structure of the drive unit on both sides of the wafer stage.
  • Figure 4 shows the structure of the wafer stage and the Y-direction guide.
  • Figure 5 shows the connection between the wafer stage, the Y-direction guide and the single-degree-of-freedom auxiliary drive unit.
  • Figure 6 shows the structure of a two degree of freedom main drive unit.
  • Figure 7 shows the structure of a single degree of freedom auxiliary drive unit.
  • Figure 8 shows the exchange process for two wafer stages.
  • 1 - first single degree of freedom auxiliary drive unit 2 - first X direction guide; 3 - first wafer stage; 4 - first Y direction guide; 5 - base; 6 - second X direction guide ; 7 - second single degree of freedom auxiliary drive unit; 8 - second wafer stage; 9 - second Y direction guide; 10 - first main drive unit; 11 - first wafer stage auxiliary drive unit; Two-silicon wafer auxiliary driving unit; 13-second main driving unit; 14-torque motor; 15-third single-degree-of-freedom auxiliary driving unit; 16-fourth single-degree-of-freedom auxiliary driving unit; 17-single-degree-of-freedom driving unit Linear motor mover; 18—main drive unit linear motor mover; 19-vacuum preloaded air bearing; 20—permanent magnet preloaded air bearing; 21—Y direction guide linear motor stator magnet; 22—silicon wafer stage Bottom air bearing; 23-Y direction guide air bearing; 24 - closed preloaded air bearing
  • FIG. 2 is a schematic structural view of a dual silicon wafer exchange system of a lithography machine according to the present invention, the system includes a first wafer stage 3 running at an exposure station, and a second wafer stage 8 running at a pretreatment station, a first X-direction linear guide 2, a second X-direction linear guide 6, a first single-degree-of-freedom auxiliary drive unit 1, a second single-degree-of-freedom auxiliary drive unit 7, a third single-degree-of-freedom auxiliary drive unit 15, and a fourth single free
  • the auxiliary driving unit 16 the first Y-direction guide rail 4, the second Y-direction guide rail 9, the first wafer stage auxiliary driving unit 11, the second wafer stage auxiliary driving unit 12, the first main driving unit 10, and the second main
  • the driving unit 13 and the base 5 the long side of the base is the X direction, and the short side is the Y direction; the first main driving unit 10 and the second main driving unit 13 have the freedom of movement in the X direction and are
  • the first main driving unit 10, the third single degree of freedom auxiliary driving unit 15 and the fourth single degree of freedom auxiliary driving unit 16 share the first Y direction linear guide 4;
  • the second main driving unit 13, the first single degree of freedom auxiliary driving unit 1 and the second single-degree-of-freedom auxiliary driving unit 7 share the second Y-direction linear guide 9;
  • the first Y-direction guide 4 passes through the first wafer stage 3, one end of the first Y-direction guide 9 and the first main driving unit 10 Coupling, the other end is coupled with the third single-degree-of-freedom auxiliary driving unit 15 , and the first driving unit 10 and the third single-degree-of-freedom auxiliary driving unit 15 are driven together to realize the movement of the first wafer stage in the X direction;
  • the first Y-direction guide rail 4 can realize a rotary motion perpendicular to the plane of the base plate under the driving of the first main drive unit 10;
  • the second Y-direction guide rail 9 passes through the second wafer stage 8, and
  • FIG. 3 and 4 show the structure and connection mode of the wafer stage, the X-direction guide rail, the Y-direction guide rail, the air bearing, the single-degree-of-freedom auxiliary drive unit, the main drive unit, and the first single-degree-of-freedom auxiliary drive unit 1,
  • the bottoms of the two single-degree-of-freedom auxiliary driving unit 7, the third single-degree-of-freedom auxiliary driving unit 15, and the fourth single-degree-of-freedom auxiliary driving unit 16 are all equipped with a linear motor mover, and the bottom surface in contact with the base is equipped with a permanent magnet pre-prepared a carrier air bearing or a vacuum preload air bearing, the stator is mounted on the base 5, and the third single degree of freedom auxiliary driving unit or the fourth single degree of freedom auxiliary driving unit is docked with the first Y direction rail 4, and
  • a main driving unit 10 cooperates to jointly drive the first silicon wafer table to move in the X direction; the coupling manner of the X direction guide rail and the main
  • Figure 4 shows the coupling structure of the wafer stage and the Y-direction guide.
  • the bottom of the first wafer stage 3 is provided with a vacuum preloaded air bearing, the upper surface of the base is a guiding surface, the first Y direction rail 4 penetrates from the inside of the first wafer stage 3, and the first Y direction rail 4 is mounted with Y.
  • the directional guide linear motor stator magnet, the coil is mounted as a linear motor mover on the wafer stage; the two inner vertical faces of the first wafer stage 3 are also equipped with a closed preload air bearing to constrain the first wafer stage 3 Move along the guide rail in the Y direction.
  • Figure 5 shows the coupling between the first Y-direction rail 4 and the single-degree-of-freedom auxiliary drive unit 15.
  • the third single-degree-of-freedom auxiliary driving unit 15 is docked with the first Y-direction guide rail 4, and the joint surface can be accurately docked and detached by electromagnetic or vacuum adsorption to achieve position exchange of the wafer stage.
  • FIG. 6 shows the structure of the first main drive unit.
  • the first main driving unit 10 is equipped with a linear motor mover 18 and a torque motor 14, which has two degrees of freedom of translation and rotation, and is driven by a torque motor, a linear motor or a stepping motor, and can realize translation in the X direction.
  • the bottoms of the first main driving unit 10 and the second main driving unit 13 are respectively equipped with linear motor movers 18, and the bottom surface is equipped with a permanent magnet preloaded air bearing 20;
  • a ball guide or an air bearing is used as a guide support between the Y-direction guide rail and the Y-direction guide rail.
  • Figure 7 shows the structure of a single degree of freedom auxiliary drive unit.
  • the single-degree-of-freedom auxiliary drive unit and the main drive unit drive the wafer stage to move in the X direction.
  • the single-degree-of-freedom auxiliary drive unit is equipped with a linear motor mover 17 at the bottom, and a vacuum preloaded air bearing 19 is mounted on the side. Both are equipped with permanent magnet preloaded air bearing.
  • the system of the present invention also includes a dual frequency laser interferometer for feedback of the position of the wafer stage.
  • Figure 8 shows the exchange process of the dual silicon wafer exchange system of the lithography machine of the present invention, which is carried out as follows:
  • the first wafer stage 3 and the second wafer stage 8 are in a position state before the exchange, and the third single-degree-of-freedom auxiliary driving unit 15 is docked with the first Y-direction guide 4 and is driven together with the first main drive unit 10.
  • the first wafer stage 3 is in the exposure station; the first single degree of freedom auxiliary driving unit 1 is docked with the second Y direction rail 9 and drives the second wafer stage 8 together with the second main driving unit 13 in the pretreatment station.
  • the first Y-direction guide rail 4 is disengaged from the third single-degree-of-freedom auxiliary drive unit 15, and the first main drive unit 10 drives the first Y-direction guide rail 4 and drives the first wafer stage 3 to be compliant in the plane of the base station.
  • the first main drive unit 10 drives the first Y-direction guide rail 4 and the first wafer stage 3 to move in the negative X direction
  • the main driving unit 13 drives the second Y-direction guide 9 and the second wafer stage 8 to move in the positive X direction
  • the first single-degree-of-freedom auxiliary driving unit 1 moves in the X negative direction
  • the third single-degree-of-freedom auxiliary driving unit 15 X moves in the positive direction and moves to the edge to stop, as shown in Figure 7(b);

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

[根据细则37.2由ISA制定的发明名称]　光刻机双硅片台交换方法及系统
本发明涉及一种高效的光刻机双硅片台交换系统，该系统应用于半导体光刻机中，属于半导体制造设备技术领域。
在集成电路芯片的生产过程中，芯片的设计图形在硅片表面光刻胶上的曝光转印（光刻）是其中最重要的工序之一，该工序所用的设备称为光刻机（曝光机）。光刻机的分辨率和曝光效率极大的影响着集成电路芯片的特征线宽（分辨率）和生产率。而作为光刻机关键系统的硅片超精密运动定位系统（以下简称为硅片台系统）的运动精度和工作效率，又在很大程度上决定了光刻机的分辨率和曝光效率。
步进扫描投影光刻机基本原理如图1所示。来自光源26的深紫外光透过掩模版27、透镜系统28将掩模版上的一部分图形成像在硅片29的某个特定芯片（Chip）上。掩模版和硅片反向按一定的速度比例作同步运动，最终将掩模版上的全部图形成像在硅片的Chip上。
硅片台运动定位系统的基本作用就是在曝光过程中承载着硅片并按设定的速度和方向运动，以实现掩模版图形向硅片各区域的精确转移。由于芯片的线宽非常小（目前最小线宽已经达到45nm），为保证光刻的套刻精度和分辨率，就必须要求硅片台具有极高的运动定位精度；另外，硅片台的运动速度在很大程度上影响着光刻的生产率，因此必须不断提高硅片台的运动速度以提高生产率。
传统的硅片台，如专利EP 0729073和专利US 5996437所描述的，光刻机中只有一个硅片运动定位单元，即一个硅片台。调平调焦等准备工作都要在其上面完成，这些工作所需的时间很长，特别是对准，由于要求进行精度极高的低速扫描（典型的对准扫描速度为1 mm/s），因此所需时间很长。而要减少其工作时间却非常困难。为了提高光刻机的生产效率，就必须不断提高硅片台的步进和曝光扫描的运动速度。而速度的提高将不可避免地导致系统动态性能的恶化，因此需要采取大量的技术措施保障和提高硅片台的运动精度，且为保持现有精度或达到更高精度要付出的代价将大大提高。
专利W098/40791（公开日期：1998.9.17；国别：荷兰）所描述的结构采用双硅片台结构，将上下片、预对准、对准等曝光准备工作转移至第二个硅片台上，且与曝光硅片台同时独立运动。在不提高硅片台运动速度的前提下，曝光硅片台大量的准备工作由第二个硅片台分担，从而大大缩短了每片硅片在曝光硅片台上的工作时间，大幅度提高了生产效率。然而该系统存在的主要缺点是硅片台系统的非质心驱动问题。
本申请人在2007年申请的发明专利“一种光刻机硅片台双台交换系统 ”（公 开 号： CN101101454 ）公开了一种光刻机的双台交换系统，具有结构简单、空间利用率高等优点，还提高了光刻机的曝光效率。但是该双硅片台系统也存在一些问题，一是在硅片台交换时气浮轴承需交换导向面，导致对硅片台尺寸一致性有极高的精度要求，零部件的加工和装配的精度都要求微米级以上；二是参与交换的导轨之间很难安装用于检测相互位置的传感器，直线导轨之间可能发生碰撞；三是硅片台系统非质心驱动；四是双硅片台交换系统的交换效率和空间利用率还不够高等。
 技术问题
本发明针对现有光刻机硅片台技术的不足和缺陷，提出了一种具有结构简单、交换效率高、空间利用率高以及交换时不会发生直线导轨间碰撞等优点的、新的高效的光刻机双硅片台交换系统，能够克服现有双硅片台交换系统非质心驱动、空间利用率还不够高、以及加工和装配精度要求极高等缺点，使其具有结构简单、空间利用率较高以及交换时不会发生直线导轨间相互碰撞等优点，进一步提高光刻机的交换效率和曝光效率。
技术解决方案
本发明的技术方案如下：
本发明提供的一种光刻机双硅片台交换方法，其特征在于该交换方法按如下步骤进行：a）两硅片台交换位置时，首先，第一主驱动单元驱动第一Y方向导轨及第一硅片台在基台平面内做顺时针方向旋转运动，同时第二主驱动单元驱动第二Y方向导轨及第二硅片台在基台平面内也做顺时针方向旋转运动，且第一硅片台辅助驱动单元驱动第一硅片台沿第一Y方向导轨朝向第一主驱动单元方向运动，第二硅片台辅助驱动单元驱动第二硅片台沿第二Y方向导轨朝向第二主驱动单元方向运动；b）当两Y方向导轨旋转至沿X方向移动时互不干涉时，第一主驱动单元驱动第一Y方向导轨及第一硅片台沿X负方向运动，同时第二主驱动单元驱动第二Y方向导轨及第二硅片台沿X正方向运动，且第一单自由度辅助驱动单元沿X负方向运动，第三单自由度辅助驱动单元沿X正方向运动；c）当两Y方向导轨由相向移动转变为反向移动时，两Y方向导轨带动硅片台做反方向旋转运动，且第一硅片台辅助驱动单元驱动第一硅片台沿第一Y方向导轨远离第一主驱动单元方向运动，第二硅片台辅助驱动单元驱动第二硅片台沿第二Y方向导轨远离第二主驱动单元方向运动；同时，第二单自由度辅助驱动单元运动至第二Y方向导轨的对应位置并与之对接，并与第二主驱动单元及第二辅助驱动单元共同将第二硅片台驱于曝光工位，第四单自由度辅助驱动单元运动至第一Y方向导轨的对应位置并与之对接，并与第一主驱动单元及第一辅助驱动单元共同将第一硅片台驱于预处理工位，这样就完成了第一硅片台和第二硅片台的位置交换，并进入下一循环。
本发明提供的一种光刻机双硅片台交换系统，该系统含有运行于曝光工位的第一硅片台、运行于预处理工位的第二硅片台、基台、第一X方向直线导轨、第二X方向直线导轨、第一单自由度辅助驱动单元、第二单自由度辅助驱动单元、第三单自由度辅助驱动单元、第四单自由度辅助驱动单元、第一Y方向导轨、第二Y方向导轨、第一硅片台辅助驱动单元和第二硅片台辅助驱动单元，第一Y方向导轨穿过第一硅片台，第二Y方向导轨穿过第二硅片台；其特征在于：所述系统还含有设置在第一X方向直线导轨上的第一主驱动单元和设置在第二X方向直线导轨上的第二主驱动单元；所述的第一主驱动单元和第二主驱动单元具有沿X方向的移动自由度和垂直于基台平面的转动自由度；所述的第一主驱动单元与第一Y方向导轨的一端相联，第一Y方向导轨的另一端与第三单自由度辅助驱动单元或第四单自由度辅助驱动单元对接；所述的第二主驱动单元与第二Y方向导轨的一端相联，导轨的另一端与第一单自由度辅助驱动单元或第二单自由度辅助驱动单元对接；所述的Y方向导轨与单自由度辅助驱动单元采用分离式结构，在两硅片台位置交换时断开。
本发明所述的一种光刻机双硅片台交换系统，其特征在于：所述的第一主驱动单元和第二主驱动单元由主驱动单元直线电机动子、力矩电机和真空预载气浮轴承组成，或由步进电机代替所述的直线电机，由永磁预载气浮轴代替所述的承真空预载气浮轴承。所述的第一主驱动单元的顶部与第一X方向导轨之间、第二主驱动单元的顶部与第二X方向导轨之间分别安装有滚珠导轨或气浮轴承作为导向支撑；所述的第一主驱动单元和第二主驱动单元与基台接触的底面均装有永磁预载气浮轴承。
本发明所述的一种光刻机双硅片台交换系统，其特征还在于：在所述的第一主驱动单元、第二主驱动单元、第一单自由度辅助驱动单元、第二单自由度辅助驱动单元、第三单自由度辅助驱动单元、第四单自由度辅助驱动单元、第一硅片台辅助驱动单元以及第二硅片台辅助驱动单元的直线电机上分别安装有用于位置反馈的线性光栅。
本发明所述的第一单自由度辅助驱动单元、第二单自由度辅助驱动单元、第三单自由度辅助驱动单元和第四单自由度辅助驱动单元的底部均安装有直线电机动子，与基台接触的侧面均装有真空预载气浮轴承，与基台接触的底面均装有永磁预载气浮轴承。
本发明所述的一种光刻机双硅片台交换系统还包含用于硅片台运动位置反馈的双频激光干涉仪。
 有益效果
本发明与现有技术相比，具有以下突出优点：一是该系统的硅片台为质心驱动；二是四个辅助驱动单元都是单自由度的，简化了控制系统结构，降低了系统零部件的安装精度要求；三是交换面不采用气浮轴承交换，降低了尺寸一致性的要求；四是进一步缩短了系统的双硅片台交换时间，提高了系统效率和空间利用率。
附图说明
图1为光刻机的工作原理示意图。
图2为本发明的光刻机硅片台双台交换系统及其交换前的状态图。
图3显示了硅片台两侧驱动单元的结构。
图4显示了硅片台和Y方向导轨的结构。
图5硅片台、Y方向导轨与单自由度辅助驱动单元之间的连接方式。
图6为两自由度主驱动单元的结构。
图7为单自由度辅助驱动单元的结构。
图8显示了两个硅片台交换过程。
图中：1—第一单自由度辅助驱动单元；2—第一X方向导轨；3—第一硅片台；4—第一Y方向导轨；5—基台；6—第二X方向导轨；7—第二单自由度辅助驱动单元；8—第二硅片台；9—第二Y方向导轨；10—第一主驱动单元；11—第一硅片台辅助驱动单元；12—第二硅片台辅助驱动单元；13—第二主驱动单元；14—力矩电机；15—第三单自由度辅助驱动单元；16—第四单自由度辅助驱动单元；17—单自由度驱动单元直线电机动子；18—主驱动单元直线电机动子；19－真空预载气浮轴承；20—永磁预载气浮轴承；21—Y方向导轨直线电机定子磁钢；22—硅片台底面气浮轴承；23—Y方向导轨气浮轴承；24—闭式预载气浮轴承；25a—Y方向导轨对接侧面；25b—单自由度辅助驱动单元对接侧面；26—光源；27—掩模版；28—透镜系统；29—硅片。
 本发明的实施方式
下面结合附图对本发明的结构、原理和工作过程做进一步的说明
图2为本发明提供的光刻机双硅片台交换系统的结构示意图，该系统含有运行于曝光工位的第一硅片台3、运行于预处理工位的第二硅片台8、第一X方向直线导轨2、第二X方向直线导轨6、第一单自由度辅助驱动单元1、第二单自由度辅助驱动单元7、第三单自由度辅助驱动单元15、第四单自由度辅助驱动单元16、第一Y方向导轨4、第二Y方向导轨9、第一硅片台辅助驱动单元11、第二硅片台辅助驱动单元12、第一主驱动单元10、第二主驱动单元13以及基台5，基台的长边为X方向，短边为Y方向；所述的第一主驱动单元10和第二主驱动单元13具有沿X方向的移动自由度和垂直于基台平面的转动自由度，第一主驱动单元与第一Y方向导轨的一端相联，第一Y方向导轨的另一端与第三单自由度辅助驱动单元或第四单自由度辅助驱动单元对接，第二主驱动单元与第二Y方向导轨9的一端相联，第二Y方向导轨轨的另一端与第一单自由度辅助驱动单元1或第二单自由度辅助驱动单元7对接；所述的Y方向导轨在主驱动单元的驱动下或与单自由度辅助驱动单元的共同驱动下，能够实现硅片台沿X方向的移动，且Y方向导轨与单自由度辅助驱动单元采用分离式结构，在两硅片台位置交换时断开。
第一主驱动单元10、第三单自由度辅助驱动单元15和第四单自由度辅助驱动单元16共用第一Y方向直线导轨4；第二主驱动单元13、第一单自由度辅助驱动单元1和第二单自由度辅助驱动单元7共用第二Y方向直线导轨9；第一Y方向导轨4穿过第一硅片台3，第一Y方向导轨9的一端与第一主驱动单元10联接，另一端与第三单自由度辅助驱动单元15联接，在第一主驱动单元10和第三单自由度辅助驱动单元15共同驱动下，可实现第一硅片台沿X方向的移动；第一Y方向导轨4在第一主驱动单元10的驱动下可实现垂直于基台平面的旋转运动；第二Y方向导轨9穿过第二硅片台8，第二Y方向导轨的一端与第二主驱动单元13联接，另一端与第一单自由度辅助驱动单元1连接，在第二主驱动单元13和第一单自由度辅助驱动单元1共同驱动下，可实现第二硅片台沿X方向的移动。
图3和图4显示了硅片台、X方向导轨、Y方向导轨、气浮轴承、单自由度辅助驱动单元、主驱动单元的结构和联接方式；第一单自由度辅助驱动单元1、第二单自由度辅助驱动单元7、第三单自由度辅助驱动单元15和第四单自由度辅助驱动单元16的底部均安装有直线电机动子，与基台接触的底面均装有永磁预载气浮轴承或真空预载气浮轴承，定子安装在基台5上，第三单自由度辅助驱动单元或第四单自由度辅助驱动单元与第一Y方向导轨4对接，就可与第一主驱动单元10配合，共同驱动第一硅片台沿X方向运动；X方向导轨和主驱动单元的联接方式可采用滚珠导轨或气浮轴承导向、磁力或真空预载等方式实现；Y方向导轨和主驱动单元的联接方式采用螺钉固接等方式实现，另一端与一个单自由度辅助驱动单元连接，采用电磁或真空吸附等方式实现精确对接；Y方向导轨在力矩电机、直线电机或步进电机的驱动下，可实现旋转运动和沿X方向的移动。
图4显示了硅片台与Y方向导轨的联接结构。第一硅片台3底部装有真空预载气浮轴承，基台上表面为导向面，第一Y方向导轨4从第一硅片台3内部贯穿，第一Y方向导轨4上安装有Y方向导轨直线电机定子磁钢，线圈作为直线电机动子安装在硅片台上；第一硅片台3的两内侧垂直面还装有闭式预载气浮轴承，以约束第一硅片台3沿Y方向导轨运动。
图5显示了第一Y方向导轨4与单自由度辅助驱动单元15之间的联接。第三单自由度辅助驱动单元15与第一Y方向导轨4对接，在联接面可采用电磁或真空吸附等方式实现精确对接和脱离，以实现硅片台的位置交换。
图6显示了第一主驱动单元的结构。第一主驱动单元10装有直线电机动子18和力矩电机14，具有平动和转动两个自由度，以力矩电机、直线电机或步进电机等作为驱动，可实现沿X方向的平动和绕第一主驱动单元的转动；所述的第一主驱动单元10和第二主驱动单元13的底部均装有直线电机动子18，底面均装有永磁预载气浮轴承20，与Y方向导轨之间均采用滚珠导轨或气浮轴承作为导向支撑。
图7显示了单自由度辅助驱动单元的结构。单自由度辅助驱动单元和主驱动单元一起驱动硅片台沿X方向移动，单自由度辅助驱动单元的底部均装有直线电机动子17，侧面均装有真空预载气浮轴承19，底面均装有永磁预载气浮轴承。
本发明所述的系统还包含用于硅片台运动位置反馈的双频激光干涉仪。另外，在所述的第一主驱动单元10、第二主驱动单元13、第一单自由度辅助驱动单元1、第二单自由度辅助驱动单元17、第三单自由度辅助驱动单元15、第四单自由度辅助驱动单元16、第一硅片台辅助驱动单元11以及第二硅片台辅助驱动单元12的直线电机上分别安装有用于位置反馈的线性光栅。
图8显示了本发明光刻机双硅片台交换系统的交换过程，按如下步骤进行：
a）第一硅片台3和第二硅片台8位于交换前的位置状态，第三单自由度辅助驱动单元15与第一Y方向导轨4对接，并和第一主驱动单元10共同驱动第一硅片台3于曝光工位；第一单自由度辅助驱动单元1与第二Y方向导轨9对接，并和第二主驱动单元13共同驱动第二硅片台8于预处理工位；两硅片台各自完成预处理和曝光工序后，系统进入双台交换状态。
b）首先，第一Y方向导轨4与第三单自由度辅助驱动单元15脱离，第一主驱动单元10驱动第一Y方向导轨4并带动第一硅片台3在基台平面内做顺时针方向旋转运动，同时第二Y方向导轨9与第一单自由度辅助驱动单元1脱离，第二主驱动单元13驱动第二Y方向导轨9及第二硅片台8在基台平面内做顺时针方向旋转运动，且第一硅片台辅助驱动单元11驱动第一硅片台3沿第一Y方向导轨4朝向第一主驱动单元10方向运动，第二硅片台辅助驱动单元12驱动第二硅片台8沿第二Y方向导轨9朝向第二主驱动单元13方向运动，如图7（a）所示；
c）其次，当两Y方向导轨旋转至沿X方向移动时互不干涉时，第一主驱动单元10驱动第一Y方向导轨4及第一硅片台3沿X负方向运动，同时第二主驱动单元13驱动第二Y方向导轨9及第二硅片台8沿X正方向运动，且第一单自由度辅助驱动单元1沿X负方向运动，第三单自由度辅助驱动单元15沿X正方向运动，运动至边缘停止，如图7（b）所示；
d）然后，当两Y方向导轨由相向移动转变为反向移动后，两Y方向导轨带动各自的硅片台做逆时针方向旋转运动，且第一辅助驱动单元11驱动第一硅片台3沿第一Y方向导轨4远离第一主驱动单元10方向运动，第二辅助驱动单元12驱动第二硅片台8沿第二Y方向导轨9远离第二主驱动单元13方向运动，如图7（c）所示；
e）最后，当两Y方向导轨与X方向垂直时，第二单自由度辅助驱动单元7运动至第二Y方向导轨9的对应位置并与之对接，并与第二主驱动单元13及第二硅片台辅助驱动单元12共同将第二硅片台8驱于曝光工位，第四单自由度辅助驱动单元16运动至第一Y方向导轨4的对应位置并与之对接，并与第一主驱动单元10及第一硅片台辅助驱动单元11共同将第一硅片台3驱于预处理工位，如图7（d）所示，至此第一硅片台3和第二硅片台8完成位置交换，并开始下一个循环。

Claims (1)

1． 一种光刻机双硅片台交换方法，其特征在于该方法按如下步骤进行：
a）两硅片台交换位置时，首先，第一主驱动单元（10）驱动第一Y方向导轨（4）及第一硅片台（3）在基台（5）平面内做顺时针方向旋转运动，同时第二主驱动单元（13）驱动第二Y方向导轨（9）及第二硅片台（8）在基台（5）平面内也做顺时针方向旋转运动，且第一硅片台辅助驱动单元（11）驱动第一硅片台（3）沿第一Y方向导轨（4）朝向第一主驱动单元（10）方向运动，第二硅片台辅助驱动单元（12）驱动第二硅片台（8）沿第二Y方向导轨（9）朝向第二主驱动单元（13）方向运动；
b）当两Y方向导轨旋转至沿X方向移动时互不干涉时，第一主驱动单元（10）驱动第一Y方向导轨（4）及第一硅片台（3）沿X负方向运动，同时第二主驱动单元（13）驱动第二Y方向导轨（9）及第二硅片台（8）沿X正方向运动，且第一单自由度辅助驱动单元（1）沿X负方向运动，第三单自由度辅助驱动单元（15）沿X正方向运动；
c）当两Y方向导轨由相向移动转变为反向移动时，两Y方向导轨带动硅片台做反方向旋转运动，且第一硅片台辅助驱动单元（11）驱动第一硅片台（3）沿第一Y方向导轨（4）远离第一主驱动单元（10）方向运动，第二硅片台辅助驱动单元（12）驱动第二硅片台（8）沿第二Y方向导轨（9）远离第二主驱动单元（13）方向运动；同时，第二单自由度辅助驱动单元（7）运动至第二Y方向导轨（9）的对应位置并与之对接，并与第二主驱动单元（13）及第二辅助驱动单元（12）共同将第二硅片台（8）驱于曝光工位，第四单自由度辅助驱动单元（16）运动至第一Y方向导轨（4）的对应位置并与之对接，并与第一主驱动单元（10）及第一辅助驱动单元（11）共同将第一硅片台（3）驱于预处理工位，这样就完成了第一硅片台（3）和第二硅片台（8）的位置交换，并进入下一循环。
2．一种采用如权利要求1所述方法的光刻机双硅片台交换系统 ，该系统含有运行于曝光工位的第一硅片台（3）、运行于预处理工位的第二硅片台（8）、基台（5）、第一X方向直线导轨（2）、第二X方向直线导轨（6）、第一单自由度辅助驱动单元（1）、第二单自由度辅助驱动单元（7）、第三单自由度辅助驱动单元（15）、第四单自由度辅助驱动单元（16）、第一Y方向导轨（4）、第二Y方向导轨（9）、第一硅片台辅助驱动单元（11）和第二硅片台辅助驱动单元（12），第一Y方向导轨（4）穿过第一硅片台（3），第二Y方向导轨（9）穿过第二硅片台（8）；其特征在于：所述系统还含有设置在第一X方向直线导轨（2）上的第一主驱动单元（10）和设置在第二X方向直线导轨（6）上的第二主驱动单元（13）；所述的第一主驱动单元（10）和第二主驱动单元（13）具有沿X方向的移动自由度和垂直于基台平面的转动自由度；所述的第一主驱动单元（10）与第一Y方向导轨（4）的一端相联，第一Y方向导轨（4）的另一端与第三单自由度辅助驱动单元（15）或第四单自由度辅助驱动单元（16）对接；所述的第二主驱动单元（13）与第二Y方向导轨（9）的一端相联，导轨的另一端与第一单自由度辅助驱动单元（1）或第二单自由度辅助驱动单元（7）对接；所述的Y方向导轨与单自由度辅助驱动单元采用分离式结构，在两硅片台位置交换时断开。
3．按照权利要求2所述的一种光刻机双硅片台交换系统，其特征在于：所述的第一主驱动单元（10）和第二主驱动单元（13）由主驱动单元直线电机动子（18）、力矩电机（14）和真空预载气浮轴承（20）组成，或由步进电机代替所述的直线电机，由永磁预载气浮轴代替所述的承真空预载气浮轴承。
4．按照权利要求2所述的一种光刻机双硅片台交换系统，其特征在于：所述的第一主驱动单元（10）的顶部与第一X方向导轨（2）之间、第二主驱动单元（13）的顶部与第二X方向导轨（6）之间分别安装有滚珠导轨或气浮轴承作为导向支撑；所述的第一主驱动单元（10）和第二主驱动单元（13）与基台（5）接触的底面均装有永磁预载气浮轴承。
5．按照权利要求2所述的一种光刻机双硅片台交换系统，其特征在于：在所述的第一主驱动单元（10）、第二主驱动单元（13）、第一单自由度辅助驱动单元（1）、第二单自由度辅助驱动单元（7）、第三单自由度辅助驱动单元（15）、第四单自由度辅助驱动单元（16）、第一硅片台辅助驱动单元（11）以及第二硅片台辅助驱动单元（12）的直线电机上分别安装有用于位置反馈的线性光栅。
6．按照权利要求 2、3、4或5所述的一种光刻机双硅片台交换系统，其特征在于：所述的第一单自由度辅助驱动单元（1）、第二单自由度辅助驱动单元（7）、第三单自由度辅助驱动单元（15）和第四单自由度辅助驱动单元（16）的底部均安装有直线电机动子（17），与基台（5）接触的侧面均装有真空预载气浮轴承（19），与基台（5）接触的底面均装有永磁预载气浮轴承（20）。
7．按照权利要求6所述的一种光刻机双硅片台交换系统，其特征在于：所述的光刻机双硅片台台换系统还包含用于硅片台运动位置反馈的双频激光干涉仪。
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