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WO2010111972A1 - 一种光刻机硅片台双台交换系统 - Google Patents

一种光刻机硅片台双台交换系统 Download PDF

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Publication number
WO2010111972A1
WO2010111972A1 PCT/CN2010/071547 CN2010071547W WO2010111972A1 WO 2010111972 A1 WO2010111972 A1 WO 2010111972A1 CN 2010071547 W CN2010071547 W CN 2010071547W WO 2010111972 A1 WO2010111972 A1 WO 2010111972A1
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Prior art keywords
degree
wafer stage
drive unit
driving unit
freedom
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French (fr)
Inventor
朱煜
张鸣
汪劲松
田丽
徐登峰
尹文生
段广洪
胡金春
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Tsinghua University
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Tsinghua University
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Priority to US13/262,802 priority Critical patent/US9030648B2/en
Publication of WO2010111972A1 publication Critical patent/WO2010111972A1/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages

Definitions

  • the invention relates to a lithography machine wafer table double-station exchange system, which is applied to a semiconductor lithography machine and belongs to the technical field of semiconductor manufacturing equipment.
  • the exposure design (lithography) of the chip design pattern on the photoresist on the surface of the silicon wafer is one of the most important processes.
  • the device used in this process is called a photolithography machine. machine).
  • the resolution and exposure efficiency of the lithography machine greatly affect the feature line width (resolution) and productivity of the integrated circuit chip.
  • the basic principle of the step-and-scan projection lithography machine is shown in Figure 1.
  • the deep ultraviolet light from the light source 45 passes through a mask 47 and a lens system 49 to form a part of the pattern on the reticle on a chip of the silicon wafer 50.
  • the reticle and the silicon wafer are synchronously moved at a certain speed ratio, and finally all the patterns on the reticle are imaged on a specific chip of the silicon wafer.
  • the basic function of the wafer stage motion positioning system is to carry the silicon wafer during the exposure process and move at a set speed and direction to achieve accurate transfer of the mask pattern to various areas on the silicon wafer. Since the line width of the chip is very small (the minimum line width has reached 45nm at present), in order to ensure the lithography precision and resolution, the wafer stage is required to have extremely high motion positioning accuracy; It greatly affects the productivity of lithography, and from the perspective of improving productivity, it requires the speed of movement of the wafer table to increase.
  • the invention patent filed by the applicant in 2007 "a lithography machine wafer table double exchange system” (publication number: CN101101454 A dual-exchange system of a lithography machine is disclosed, which has the advantages of simple structure, high space utilization, and the like, and improves the exposure efficiency of the lithography machine.
  • the double-wafer stage system also has some problems. First, the air-floating bearing needs to exchange the guiding surface when the wafer stage is exchanged, which leads to extremely high precision requirements for the dimensional consistency of the wafer stage, and the processing and assembly of the parts.
  • Accuracy is required to be above the micron level; secondly, it is difficult to install sensors for detecting mutual position between the guide rails participating in the exchange, and collision may occur between the upper linear guide rails; third, the wafer stage system is not driven by the centroid.
  • the object of the present invention is to provide a new lithography machine wafer table and two-station exchange system to overcome the non-centroidal driving of the existing silicon wafer table and the high-speed processing. And the assembly accuracy and other shortcomings, so that it has a simple structure, high space utilization and the collision between the linear guides does not occur during the exchange, and thus improve the exposure efficiency of the lithography machine.
  • a lithography machine wafer stage dual stage system comprising a first wafer stage 13 running at an exposure station 3 and a second wafer stage 14 running at a pretreatment station 4, two wafer stage settings On the same rectangular base 1, the long side is the X direction, the short side is the Y direction, and the two silicon wafer stages are located on the upper surface 2 of the base.
  • the first Y direction is respectively disposed on the two long side edges of the base.
  • the second main driving unit 12 and the third single-degree-of-freedom auxiliary driving unit 9 and the fourth single-degree-of-freedom auxiliary driving unit 10 share the second Y-direction linear motor stator 6; the first guide rail 15 in the Y direction passes through the first wafer stage 13.
  • the Y-direction second rail 16 passes through the second wafer stage 14; one end of the Y-direction first rail 15 is connected to the first main driving unit 11, and the other end is docked with the fourth single-degree-of-freedom auxiliary driving unit 10;
  • the single-degree-of-freedom auxiliary driving unit 10 and the Y-direction first guide rail 15 adopt a separate structure, The two wafer stages are disconnected when the position is exchanged; one end of the second guide rail 16 in the Y direction is connected to the second main drive unit 12, and the other end is connected to the second single degree of freedom auxiliary drive unit 8; the second single degree of freedom auxiliary drive unit
  • the first rail 16 of the 8 and Y directions adopts a separate structure, and is disconnected when the two wafer stages are exchanged;
  • the first wafer stage 13 moves in the direction of the first rail 15 in the Y direction toward the first main driving unit 11, and the second wafer stage 14 moves in the Y direction in the second rail 16
  • the two main driving units 12 are directionalally moved; thereafter, the Y-direction first guide rail 15 is separated from the fourth single-degree-of-freedom auxiliary driving unit 10 and moved toward the first main driving unit 11, and the Y-direction second guide rail 16 and the second single-degree-of-freedom
  • the auxiliary driving unit 8 is separated and moved in the direction of the second main driving unit 12, while the second single degree of freedom auxiliary driving unit 8 and the fourth single degree of freedom auxiliary driving unit 10 are respectively moved to the left and right edges of the base; then, the first main The driving unit 11 and the second main driving unit 12 respectively drive the first wafer stage 13 and the second wafer stage 14 to perform work station exchange in the X direction, while the first single degree of freedom auxiliary driving unit 7 moves to the exposure station 3.
  • the third single-degree-of-freedom auxiliary driving unit 9 moves to the initial position of the pre-processing station 4; finally, the Y-direction first guide rail 15 and the third single-degree-of-freedom auxiliary driving unit 9 are docked, and the first wafer stage 13 is moved.
  • a second wafer stage 14 is moved to the initial position of the exposure station 3, to complete the switching into the next cycle.
  • the invention relates to a lithography machine wafer table double-station exchange system, characterized in that: the first single-degree-of-freedom auxiliary driving unit 7, the second single-degree-of-freedom auxiliary driving unit 8, and the third single-degree-of-freedom auxiliary driving
  • the bottom of the unit 9 and the fourth single-degree-of-freedom auxiliary driving unit 10 are each mounted with a linear motor mover 17, and each side of the single-degree-of-freedom auxiliary drive unit in contact with the base is provided with a vacuum preloaded air bearing 19, each single
  • the bottom surface of the degree of freedom auxiliary driving unit in contact with the base is equipped with a permanent magnet preloaded air bearing 20;
  • the first main driving unit 11 and the second main driving unit 12 are a two-degree-of-freedom driving unit, and the bottom is installed.
  • linear motor movers 17 identical to the single-degree-of-freedom auxiliary drive unit, and each side of the main drive unit in contact with the base is provided with a vacuum preloaded air bearing 19, and the bottom surface of each main drive unit in contact with the base is mounted
  • the permanent magnet preloaded air bearing 20 is additionally provided with a ball guide or an air bearing as a guide between the top of each main drive unit and the Y direction guide rail, and a linear motor or a friction wheel plus a stepping motor is used as a drive to realize Main drive
  • the moving unit supports the guiding drive of the Y-direction guide rail.
  • the lithography machine wafer table double-seat exchange system of the present invention is further characterized in that linear motors for position feedback are respectively mounted on the linear motors of each of the drive units.
  • the system also includes a dual-frequency laser interferometer for position feedback of the wafer stage.
  • the invention has the following outstanding advantages: first, the wafer stage of the system is driven by the centroid; secondly, the exchange surface is not exchanged by the air bearing, so the dimensional consistency requirement is not high; Each auxiliary drive unit is single degree of freedom, which simplifies the control system structure and reduces the installation accuracy requirements of system components.
  • Figure 1 is a schematic diagram of the working principle of the lithography machine.
  • FIG. 2 is a state diagram of a wafer stage dual stage exchange system of a lithography machine of the present invention and before exchange.
  • Figure 3 shows the structure of the drive unit on both sides of the wafer stage.
  • Figure 4 shows the structure of the wafer stage and the Y-direction guide.
  • Figure 5 shows the connection between the wafer stage, the Y-direction rail, the main drive unit and the single-degree-of-freedom auxiliary drive unit.
  • Figure 6 shows the structure of a single degree of freedom auxiliary drive unit.
  • Figure 7 shows the exchange process for two wafer stages.
  • FIG. 2 is a schematic view showing the structure of a dual-disc exchange system of a wafer wafer stage of a lithography machine, the system comprising a rectangular base station 1 (the long side is the X direction and the short side is the Y direction), and is operated at the exposure station 3.
  • the first wafer stage 13 runs on the second wafer stage 14 of the pretreatment station 4, and the two wafer stages are disposed on the base, and are suspended on the upper surface 2 of the base by the air bearing 22 on the bottom surface of the wafer stage.
  • a first Y-direction linear motor stator 5 and a second Y-direction linear motor stator 6 are respectively disposed at two long side edges of the base, and the first main driving unit 11, the first single-degree-of-freedom auxiliary driving unit 7 and the second single free
  • the auxiliary driving unit 8 shares the first Y-direction linear motor stator 5, and the second main driving unit 12, the third single-degree-of-freedom auxiliary driving unit 9, and the fourth single-degree-of-freedom auxiliary driving unit 10 share the second Y-direction linear motor stator 6 ;
  • the first guide rail 15 in the Y direction passes through the first wafer stage 13 and one end thereof is connected to the first main driving unit 11,
  • the first wafer stage 13 is movable along the Y-direction first rail 15 and the other end thereof is connected to the fourth single-degree-of-freedom auxiliary driving unit 10, and is driven together with the first main driving unit 11 and the fourth single-degree-of-freedom auxiliary driving unit 10.
  • the Y-direction second rail 16 passes through the second wafer stage 14, one end of which is connected to the second main driving unit 12, and the second wafer stage 14 is moved along the guide rail 16 in the Y direction, and the other end thereof
  • the two-degree-of-freedom auxiliary driving unit 8 is connected and driven together with the second main driving unit 12 and the second single-degree-of-freedom auxiliary driving unit 8 to realize movement of the wafer stage in the X direction.
  • Figures 3 and 4 show the structure and connection of the single-degree-of-freedom auxiliary drive unit, the wafer stage, the Y-direction guide and the main drive unit, and the arrangement of the air bearing.
  • the bottom of the single-degree-of-freedom auxiliary drive unit is equipped with a linear motor mover and a vacuum preloaded air bearing, and the stator is mounted on the base.
  • the main drive unit Cooperate with the driving silicon wafer table to move in the X direction.
  • connection between the Y-direction guide rails and the main drive unit can be realized by a ball guide or an air-floating bearing guide, a linear motor or a friction wheel plus a motor drive, and the other end of the Y-direction guide is connected with a single-degree-of-freedom auxiliary drive unit.
  • Accurate docking is achieved by electromagnetic or vacuum adsorption.
  • Figure 4 shows the connection structure of the wafer stage and the Y-direction guide.
  • a vacuum preloaded air bearing is mounted on the bottom of the first wafer stage 13, the upper surface of the base is a guiding surface, the Y-direction first rail 15 is penetrated from the inside of the first wafer stage 13, and the Y-direction first rail 15 is mounted.
  • Y-direction guide linear motor stator magnet 21 the coil is mounted as a linear motor mover on the wafer stage, and the closed front-load air bearing 24 is placed on the two inner vertical faces of the first wafer stage 13 to constrain the Y-direction guide 15 with The relative movement of the first wafer stage 13 in the Y direction.
  • Figure 5 shows the connection between the Y-direction rail and the single-degree-of-freedom auxiliary drive unit.
  • the single-degree-of-freedom auxiliary driving unit 10 is docked with the Y-direction first guide rail 15, and the connecting surfaces 25a and 25b can be accurately docked and detached by electromagnetic or vacuum adsorption to achieve position exchange of the wafer stage.
  • Figure 6 shows the structure of the main drive unit and the single degree of freedom auxiliary drive unit.
  • the main drive unit is a two-degree-of-freedom drive unit that mainly drives the movement of the wafer stage in the X direction, and it also drives the Y-direction guide to move in the Y direction. Therefore, the structure is equipped with a linear motor mover coil 18 at the bottom, a vacuum preloaded air bearing 19 on the side, a permanent magnet preloaded air bearing 20 on the bottom surface, and a ball guide for the connection with the Y direction guide. Or the air bearing is used as a guide, and is realized by a linear motor or a friction wheel plus a stepping motor as a driving method.
  • the single-degree-of-freedom auxiliary driving unit drives the wafer stage movement together with the main driving unit to move in the X direction. Therefore, the structure is equipped with a linear motor coil mover at the bottom, a vacuum preloaded air bearing 19 on the side, and a bottom surface is mounted. Permanent magnet preloaded air bearing 20 .
  • Figure 7 shows the process of switching between two sets of silicon wafers.
  • the first wafer stage 13 and the second wafer stage 14 are switched to a starting position, and the third single degree of freedom auxiliary driving unit 9 is docked with the Y-direction first rail 15 to drive the first silicon together with the first main driving unit 11.
  • the stage 13 performs an exposure movement at the exposure station 3; the second single-degree-of-freedom auxiliary driving unit 8 is docked with the second Y-direction guide 16, and the second main driving unit 12 drives the second wafer stage 14 at the pre-processing station. 6 for pretreatment exercise.
  • the system After each of the wafer stages completes the pre-treatment and exposure processes, the system enters a dual-segment exchange state.
  • the first wafer stage 13 moves toward the first main driving unit 11 in the Y direction toward the first main driving unit 11 to the base side, and the second wafer stage 14 follows the second Y direction guide 16 to the second main driving unit 12 The direction moves to the other side of the abutment as shown in Figure 7(1).
  • the first wafer stage 13 and the Y-direction first rail 15 and the fourth single-degree-of-freedom auxiliary driving unit 10 When disengaged, the Y-direction first guide rail 15 moves in the direction in which the first main drive unit 11 is located, and at the same time, the fourth single-degree-of-freedom auxiliary drive unit 10 is disengaged and moved to the nearest base post corner to the edge stop.
  • the second wafer stage 14 and the second Y-direction guide rail 16 and the second single-degree-of-freedom auxiliary driving unit 8 Disengaged, the second Y-direction guide rail 16 moves toward the second main drive unit 12, and at the same time, the second single-degree-of-freedom auxiliary drive unit 8 moves away from the nearest base abutment corner to the edge stop, as shown in Fig. 7 (2). .
  • the first main driving unit 11 drives the first wafer stage 13 to move to the pretreatment station 4 in the X direction to the initial position of the silicon wafer, the first side of the same side.
  • the single-degree-of-freedom auxiliary driving unit 7 is stopped when moving in the same direction as the first wafer stage 13 to the initial position of exposure of the wafer.
  • the movement of the second wafer stage 14 on the other side is the same, and the second main driving unit 12 drives the second wafer stage 14 to move toward the exposure station 3 in the X direction to the initial position of the wafer exposure, and the third single degree of freedom on the same side.
  • the auxiliary driving unit 9 stops when moving in the same direction as the second wafer stage 14 to the initial position of the wafer pre-processing, as shown in Fig. 7 (3).
  • the Y-direction first guide rail 15 extends along the third-direction single-degree-of-freedom auxiliary drive unit 9 and achieves docking, and the first wafer stage 13 moves along the Y-direction first guide rail 15 to the pre-processing station initial position.
  • the second Y-direction guide rail 16 extends along the first single-degree-of-freedom auxiliary driving unit 7 and realizes the docking, and then the second silicon wafer stage 14 moves along the second Y-direction guide rail 16 to the initial position of the exposure station, as shown in FIG. 7 . (4) As shown, the position exchange of the two wafer stages is completed and the next cycle is started.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

一种光刻机硅片台双台交换系统 技术领域
本发明涉及一种光刻机硅片台双台交换系统，该系统应用于半导体光刻机中，属于半导体制造设备技术领域。
 背景技术
在集成电路芯片的生产过程中，芯片的设计图形在硅片表面光刻胶上的曝光转印（光刻）是其中最重要的工序之一，该工序所用的设备称为光刻机（曝光机）。光刻机的分辨率和曝光效率极大的影响着集成电路芯片的特征线宽（分辨率）和生产率。而作为光刻机关键系统的硅片超精密运动定位系统（以下简称为硅片台）的运动精度和工作效率，又在很大程度上决定了光刻机的分辨率和曝光效率。
步进扫描投影光刻机基本原理如图1所示。来自光源45的深紫外光透过掩模版47、透镜系统49将掩模版上的一部分图形成像在硅片50的某个Chip上。掩模版和硅片反向按一定的速度比例作同步运动，最终将掩模版上的全部图形成像在硅片的特定芯片（Chip）上。
硅片台运动定位系统的基本作用就是在曝光过程中承载着硅片并按设定的速度和方向运动，以实现掩模版图形向硅片上各区域的精确转移。由于芯片的线宽非常小（目前最小线宽已经达到45nm），为保证光刻的套刻精度和分辨率，就要求硅片台具有极高的运动定位精度；由于硅片台的运动速度在很大程度上影响着光刻的生产率，从提高生产率的角度，又要求硅片台的运动速度不断提高。
传统的硅片台，如专利EP 0729073和专利US 5996437所描述的，光刻机中只有一个硅片运动定位单元，即一个硅片台。调平调焦等准备工作都要在上面完成，这些工作所需的时间很长，特别是对准，由于要求进行精度极高的低速扫描（典型的对准扫描速度为1 mm/s），因此所需时间很长。而要减少其工作时间却非常困难。这样，为了提高光刻机的生产效率，就必须不断提高硅片台的步进和曝光扫描的运动速度。而速度的提高将不可避免导致系统动态性能的恶化，需要采取大量的技术措施保障和提高硅片台的运动精度，为保持现有精度或达到更高精度要付出的代价将大大提高。
专利W098/40791（公开日期：1998.9.17；国别：荷兰）所描述的结构采用双硅片台结构，将上下片、预对准、对准等曝光准备工作转移至第二个硅片台上，且与曝光硅片台同时独立运动。在不提高硅片台运动速度的前提下，曝光硅片台大量的准备工作由第二个硅片台分担，从而大大缩短了每片硅片在曝光硅片台上的工作时间，大幅度提高了生产效率。然而该系统存在的主要缺点在于硅片台系统的非质心驱动问题。
本申请人在2007年申请的发明专利“一种光刻机硅片台双台交换系统 ”（公 开 号： CN101101454 ）公开了一种光刻机的双台交换系统，其具有结构简单，空间利用率高等优点，提高了光刻机的曝光效率。但是该双硅片台系统也存在一些问题，一是在硅片台交换时气浮轴承需交换导向面，导致对硅片台尺寸一致性有极高的精度要求，零部件的加工和装配的精度都要求微米级以上；二是参与交换的导轨之间很难安装用于检测相互位置的传感器，上直线导轨之间可能发生碰撞；三是硅片台系统非质心驱动等。
 技术问题
针对现有技术的不足和缺陷，本发明的目的是提供一种新的光刻机硅片台双台交换系统，以克服已有硅片台双台交换系统非质心驱动以及要求极高的加工和装配精度等缺点，使其具有结构简单，空间利用率高以及交换时不会发生上直线导轨之间碰撞等优点，进而提高光刻机的曝光效率。
 技术解决方案
本发明的技术方案一如下：
一种光刻机硅片台双台系统，该系统含有运行于曝光工位3的第一硅片台13和运行于预处理工位4的第二硅片台14，两个硅片台设置在同一长方形基台1上，长边为X方向，短边为Y方向，两硅片台位于基台上表面2，其特征在于：在基台两个长边边缘分别设有第一Y方向直线电机定子5和第二Y方向直线电机定子6，第一主驱动单元11和第一单自由度辅助驱动单元7、第二单自由度辅助驱动单元8共用第一Y方向直线电机定子5，第二主驱动单元12和第三单自由度辅助驱动单元9、第四单自由度辅助驱动单元10共用第二Y方向直线电机定子6；Y方向的第一导轨15穿过第一硅片台13，Y方向第二导轨16穿过第二硅片台14；Y方向第一导轨15的一端与第一主驱动单元11连接，另一端与第四单自由度辅助驱动单元10对接；第四单自由度辅助驱动单元10和Y方向第一导轨15采用分离式结构，在两个硅片台交换位置时断开；Y方向第二导轨16的一端与第二主驱动单元12连接，另一端与第二单自由度辅助驱动单元8对接；第二单自由度辅助驱动单元8和Y方向第一导轨16采用分离式结构，在两个硅片台交换位置时断开；
在两个硅片台交换位置时，首先，第一硅片台13沿Y方向第一导轨15向第一主驱动单元11方向运动，第二硅片台14沿Y方向第二导轨16向第二主驱动单元12方向运动；之后，Y方向第一导轨15与第四单自由度辅助驱动单元10分开并向第一主驱动单元11方向运动，Y方向第二导轨16与第二单自由度辅助驱动单元8分开并向第二主驱动单元12方向运动，同时第二单自由度辅助驱动单元8和第四单自由度辅助驱动单元10分别运动至基台左右两边缘；然后，第一主驱动单元11和第二主驱动单元12分别驱动第一硅片台13和第二硅片台14沿X方向进行工位交换，同时第一单自由度辅助驱动单元7运动至曝光工位3的初始位置，第三单自由度辅助驱动单元9运动至预处理工位4的初始位置；最后，Y方向第一导轨15和第三单自由度辅助驱动单元9对接，第一硅片台13运动至预处理工位4初始位置，Y方向第二导轨16和第一单自由度辅助驱动单元7对接，第二硅片台14运动至曝光工位3初始位置，交换完成进入下一循环。
所述的一种光刻机硅片台双台交换系统，其特征在于：所述的第一单自由度辅助驱动单元7、第二单自由度辅助驱动单元8、第三单自由度辅助驱动单元9和第四单自由度辅助驱动单元10的底部均安装有直线电机动子17，每个单自由度辅助驱动单元与基台接触的侧面装有真空预载气浮轴承19，每个单自由度辅助驱动单元与基台接触的底面装有永磁预载气浮轴承20；所述的第一主驱动单元11和第二主驱动单元12是一个两自由度的驱动单元，底部均安装有与单自由度辅助驱动单元相同的直线电机动子17，每个主驱动单元与基台接触的侧面装有真空预载气浮轴承19，每个主驱动单元与基台接触的底面装有永磁预载气浮轴承20，另外，每个主驱动单元的顶部与Y方向导轨之间安装有滚珠导轨或气浮轴承作为导向，安装直线电机或摩擦轮加步进电机作为驱动，来实现主驱动单元对Y方向导轨的导向驱动支撑作用。
本发明所述的光刻机硅片台双台交换系统，其特征还在于：在所述的每个驱动单元的直线电机分别安装有用于位置反馈的线性光栅。该系统还包含用于硅片台运动位置反馈的双频激光干涉仪。
 有益效果
本发明与现有技术相比，具有以下突出性的优点：一是该系统的硅片台为质心驱动；二是交换面不采用气浮轴承交换，因此尺寸一致性要求不高；三是两个辅助驱动单元都是单自由度的，简化了控制系统结构，降低了系统零部件的安装精度要求。
 附图说明
图1为光刻机的工作原理示意图。
图2为本发明的光刻机硅片台双台交换系统及其交换前的状态图。
图3显示了硅片台两侧驱动单元的结构。
图4显示了硅片台和Y方向导轨的结构。
图5硅片台、Y方向导轨、主驱动单元和单自由度辅助驱动单元之间的连接方式。
图6单自由度辅助驱动单元的结构。
图7显示了两个硅片台交换过程。
图中：1—基台；2—基台上表面；3—曝光工位；4—预处理工位；5—第一Y方向直线电机定子；6—第二Y方向直线电机定子； 7—第一单自由度辅助驱动单元；8—第二单自由度辅助驱动单元；9—第三单自由度辅助驱动单元；10—第四单自由度辅助驱动单元；11—第一主驱动单元；12—第二主驱动单元；13—第一硅片台；14—第二硅片台；15—Y方向第一导轨；16—Y方向第二导轨；17—单自由度辅助驱动单元直线电机动子；18—主驱动单元直线电机动子；19－真空预载气浮轴承；20— 永磁预载气浮轴承；21—Y方向导轨直线电机定子磁钢； 22—硅片台底面气浮轴承；23—主驱动单元与Y方向导轨气浮轴承；24—闭式预载气浮轴承；25a—Y方向导轨用于对接的侧面；25b—单自由度辅助驱动单元对接侧面； 45—光源；47—掩模版；49—透镜系统；50—硅片。
 本发明的最佳实施方式
本发明的实施方式
图2显示了光刻机硅片台双台交换系统的结构示意图，该系统含有长方形基台1，（长边为X方向，短边为Y方向），运行于曝光工位3的 第一硅片台13，运行于预处理工位4的第二硅片台14，两个硅片台设置在基台上，通过硅片台底面气浮轴承22悬浮在基台上表面2。在基台两个长边边缘分别设有第一Y方向直线电机定子5和第二Y方向直线电机定子6，第一主驱动单元11、第一单自由度辅助驱动单元7和第二单自由度辅助驱动单元8共用第一Y方向直线电机定子5，第二主驱动单元12、第三单自由度辅助驱动单元9和第四单自由度辅助驱动单元10共用第二Y方向直线电机定子6； Y方向第一导轨15穿过第一硅片台13，其一端与第一主驱动单元11连接， 第一硅片台13可沿Y方向第一导轨15移动，其另一端与第四单自由度辅助驱动单元10连接，与第一主驱动单元11和第四单自由度辅助驱动单元10共同驱动，实现硅片台在X方向的移动。相同的，Y方向第二导轨16穿过第二硅片台14，其一端与第二主驱动单元12连接，并使第二硅片台14沿导轨16在Y方向移动，其另一端与第二单自由度辅助驱动单元8连接，并与第二主驱动单元12和第二单自由度辅助驱动单元8共同驱动，实现硅片台在X方向的移动。
图3和图4显示了单自由度辅助驱动单元、硅片台、Y方向导轨和主驱动单元的结构和连接方式及气浮轴承的布置。单自由度辅助驱动单元的底部均装有直线电机动子和真空预载气浮轴承，定子安装在基台上，当单自由度辅助驱动单元与Y方向第一导轨15对接，与主驱动单元配合驱动硅片台沿X方向运动。Y方向导轨之间和主驱动单元的连接方式可以采用滚珠导轨或气浮轴承导向，直线电机或摩擦轮加电机驱动等方式实现，Y方向导轨的另一端与一个单自由度辅助驱动单元连接，采用电磁或真空吸附等方式实现精确对接。
图4显示了硅片台与Y方向导轨的连接结构。在第一硅片台13底部装有真空预载气浮轴承，基台上表面为导向面，Y方向第一导轨15从第一硅片台13内部贯穿，Y方向第一导轨15上安装有Y方向导轨直线电机定子磁钢21，线圈作为直线电机动子安装在硅片台上，在第一硅片台13两个内侧垂直面装有闭式预载气浮轴承24来约束Y方向导轨15与 第一硅片台13沿Y方向的相对运动。
图5显示了Y方向导轨与单自由度辅助驱动单元之间的联接。单自由度辅助驱动单元10与Y方向第一导轨15对接，在连接面25a和25b可采用电磁或真空吸附等方式实现精确对接和脱离，来实现硅片台的位置交换。
图6显示了主驱动单元和单自由度辅助驱动单元的结构。如上所述，主驱动单元是两自由度的驱动单元，它主要是沿X方向驱动硅片台运动，另外它还需驱动Y方向导轨沿Y方向运动。因此其结构为底部装有直线电机动子线圈18，侧面装有真空预载气浮轴承19，底面装有永磁预载气浮轴承20；与Y方向导轨之间的连接方式可以采用滚珠导轨或气浮轴承作为导向，以直线电机或摩擦轮加步进电机作为驱动等方式实现。
单自由度辅助驱动单元是和主驱动单元一起驱动硅片台运动沿X方向移动，因此其结构为底部均装有直线电机线圈动子，侧面装有真空预载气浮轴承19，底面装有永磁预载气浮轴承20。
图7所示为硅片台双台交换的过程。 第一硅片台13和第二硅片台14交换前的起始位置，第三单自由度辅助驱动单元9与Y方向第一导轨15对接，和第一主驱动单元11一起驱动第一硅片台13在曝光工位3作曝光运动；第二单自由度辅助驱动单元8与第二Y方向导轨16对接，和第二主驱动单元12一起驱动第二硅片台14在预处理工位6作预处理运动。
在硅片台各自完成预处理和曝光工序后，系统进入双台交换状态。 第一硅片台13沿着Y方向第一导轨15向第一主驱动单元11方向运动到基台一侧，第二硅片台14沿着第二Y方向导轨16向第二主驱动单元12方向运动到基台另一侧，如图7（1）所示。
此后， 第一硅片台13和 Y方向第一导轨15与第四单自由度辅助驱动单元10 脱离，Y方向第一导轨15向第一主驱动单元11所在方向运动，同时，第四单自由度辅助驱动单元10脱离后向最近的基台边角运动至边缘停止。另一边，第二硅片台14和第二Y方向导轨16与第二单自由度辅助驱动单元8 脱离， 第二Y方向导轨16向第二主驱动单元12运动，同时，第二单自由度辅助驱动单元8脱离后向最近的基台边角运动至边缘停止，如图7（2）所示。
在第一硅片台13运动至基台边缘后，第一主驱动单元11驱动第一硅片台13沿X方向向预处理工位4移动到硅片预处理初始位置，同一侧的第一单自由度辅助驱动单元7与第一硅片台13同方向运动至硅片曝光初始位置时停止。另一边的第二硅片台14的运动相同，第二主驱动单元12驱动第二硅片台14沿X方向向曝光工位3移动至硅片曝光初始位置，同一侧的第三单自由度辅助驱动单元9与第二硅片台14同方向运动至硅片预处理初始位置时停止，如图7（3）所示。
当两硅片台到达指定工位的初始位置后， Y方向第一导轨15沿第三向单自由度辅助驱动单元9伸出并实现对接，第一硅片台13沿Y方向第一导轨15运动至预处理工位初始位置。同时地，第二Y方向导轨16沿第一单自由度辅助驱动单元7伸出并实现对接，然后第二硅片台14沿第二Y方向导轨16运动至曝光工位初始位置，如图7（4）所示，至此两硅片台的位置交换完成，并开始下一个循环。
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Claims (1)

  1. 1. 一种光刻机硅片台双台系统，该系统含有运行于曝光工位（3）的第一硅片台（13）和运行于预处理工位（4）的第二硅片台（14），两个硅片台设置在同一长方形基台（1）上，长边为X方向，短边为Y方向，两硅片台位于基台上表面（2），其特征在于：在基台两个长边边缘分别设有第一Y方向直线电机定子（5）和第二Y方向直线电机定子（6），第一主驱动单元（11）、第一单自由度辅助驱动单元（7）和第二单自由度辅助驱动单元（8）共用第一Y方向直线电机定子（5），第二主驱动单元（12）、第三单自由度辅助驱动单元（9）和第四单自由度辅助驱动单元（10）共用第二Y方向直线电机定子（6）；Y方向的第一导轨（15）穿过第一硅片台（13），Y方向第二导轨（16）穿过第二硅片台（14）；Y方向第一导轨（15）的一端与第一主驱动单元（11）连接，另一端与第四单自由度辅助驱动单元（10）对接；第四单自由度辅助驱动单元（10）和Y方向第一导轨（15）采用分离式结构，在两个硅片台位置交换时断开；Y方向第二导轨（16）的一端与第二主驱动单元（12）连接，另一端与第二单自由度辅助驱动单元（8）对接；第二单自由度辅助驱动单元（8）和Y方向第一导轨（16）采用分离式结构，在两个硅片台位置交换时断开；
    在两个硅片台位置交换时，首先，第一硅片台（13）沿Y方向第一导轨（15）向第一主驱动单元（11）方向运动，第二硅片台（14）沿Y方向第二导轨（16）向第二主驱动单元（12）方向运动；之后，Y方向第一导轨（15）与第四单自由度辅助驱动单元（10）分开并向第一主驱动单元（11）方向运动，Y方向第二导轨（16）与第二单自由度辅助驱动单元（8）分开并向第二主驱动单元（12）方向运动，同时第二单自由度辅助驱动单元（8）和第四单自由度辅助驱动单元（10）分别运动至基台左右两边缘；然后，第一主驱动单元（11）和第二主驱动单元（12）分别驱动第一硅片台（13）和第二硅片台（14）沿X方向进行工位交换，同时第一单自由度辅助驱动单元（7）运动至曝光工位（3）的初始位置，第三单自由度辅助驱动单元（9）运动至预处理工位（4）的初始位置；最后，Y方向第一导轨（15）和第三单自由度辅助驱动单元（9）对接，第一硅片台（13）运动至预处理工位（4）初始位置，Y方向第二导轨（16）和第一单自由度辅助驱动单元（7）对接，第二硅片台（14）运动至曝光工位（3）初始位置，交换完成进入下一循环。
    2. 按照权利要求1所述的一种光刻机硅片台双台交换系统，其特征在于：所述的第一单自由度辅助驱动单元（7）、第二单自由度辅助驱动单元（8）、第三单自由度辅助驱动单元（9）和第四单自由度辅助驱动单元（10）的底部均安装有直线电机动子（17），每个单自由度辅助驱动单元与基台接触的侧面装有真空预载气浮轴承（19），每个单自由度辅助驱动单元与基台接触的底面装有永磁预载气浮轴承（20）；所述的第一主驱动单元（11）和第二主驱动单元（12）是一个两自由度的驱动单元，底部均安装有与单自由度辅助驱动单元相同的直线电机动子（17），每个主驱动单元与基台接触的侧面装有真空预载气浮轴承（19），每个主驱动单元与基台接触的底面装有永磁预载气浮轴承（20），另外，每个主驱动单元的顶部与Y方向导轨之间安装有滚珠导轨或气浮轴承作为导向，安装直线电机或摩擦轮加步进电机作为驱动，来实现主驱动单元对Y方向导轨的导向驱动支撑作用。
    3．按照权利要求2所述的一种光刻机硅片台双台交换系统，其特征在于：在所述的每个驱动单元的直线电机上分别安装有用于位置反馈的线性光栅。
    4．按照权利要求1所述的一种光刻机硅片台双台交换系统，其特征在于：所述的光刻机硅片台双台交换系统还包含用于硅片台运动位置反馈的双频激光干涉仪。
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CN101551599B (zh) 2009-04-03 2011-07-20 清华大学 一种光刻机硅片台双台交换系统
CN101551598B (zh) * 2009-04-03 2010-12-01 清华大学 一种光刻机硅片台双台交换系统
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