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WO2010119683A1 - Composition adhésive pouvant absorber les rayons du proche infrarouge - Google Patents

Composition adhésive pouvant absorber les rayons du proche infrarouge Download PDF

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Publication number
WO2010119683A1
WO2010119683A1 PCT/JP2010/002722 JP2010002722W WO2010119683A1 WO 2010119683 A1 WO2010119683 A1 WO 2010119683A1 JP 2010002722 W JP2010002722 W JP 2010002722W WO 2010119683 A1 WO2010119683 A1 WO 2010119683A1
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WIPO (PCT)
Prior art keywords
infrared absorbing
group
solvent
adhesive composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2010/002722
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English (en)
Japanese (ja)
Inventor
張替尊子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Shokubai Co Ltd
Original Assignee
Nippon Shokubai Co Ltd
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Filing date
Publication date
Priority claimed from JP2009174478A external-priority patent/JP4436888B1/ja
Application filed by Nippon Shokubai Co Ltd filed Critical Nippon Shokubai Co Ltd
Priority to CN2010800165292A priority Critical patent/CN102395642A/zh
Publication of WO2010119683A1 publication Critical patent/WO2010119683A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K15/00—Anti-oxidant compositions; Compositions inhibiting chemical change
    • C09K15/04—Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds
    • C09K15/16—Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds containing nitrogen
    • C09K15/18—Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds containing nitrogen containing an amine or imine moiety
    • C—CHEMISTRY; METALLURGY
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
    • C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
    • C08F230/085—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
    • C—CHEMISTRY; METALLURGY
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F275/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers containing phosphorus, selenium, tellurium or a metal as defined in group C08F30/00
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
    • C09B23/0066—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain being part of a carbocyclic ring,(e.g. benzene, naphtalene, cyclohexene, cyclobutenene-quadratic acid)
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    • C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
    • C09B23/02—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups
    • C09B23/06—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups three >CH- groups, e.g. carbocyanines
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    • C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
    • C09B23/02—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups
    • C09B23/08—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups more than three >CH- groups, e.g. polycarbocyanines
    • C09B23/083—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups more than three >CH- groups, e.g. polycarbocyanines five >CH- groups
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    • C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
    • C09B23/02—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups
    • C09B23/08—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups more than three >CH- groups, e.g. polycarbocyanines
    • C09B23/086—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups more than three >CH- groups, e.g. polycarbocyanines more than five >CH- groups
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C09J151/085—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds on to polysiloxanes
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
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    • C—CHEMISTRY; METALLURGY
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
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    • C08K5/00—Use of organic ingredients
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • G—PHYSICS
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    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation

Definitions

  • the present invention relates to a near-infrared absorbing adhesive composition, a near-infrared absorbing mixture used for the near-infrared absorbing adhesive composition, a near-infrared absorbing material containing the near-infrared absorbing adhesive composition, and the like.
  • a thin liquid crystal display applicable to a large screen and a thin display such as PDP (Plasma Display Panel) have been attracting attention.
  • the thin display generates near infrared rays having a wavelength of 800 nm to 1100 nm.
  • this near infrared ray causes malfunction of the remote control for home appliances.
  • the optical semiconductor element used for a CCD camera etc. has high sensitivity in the near infrared region, it is necessary to remove the near infrared ray. Therefore, there is a demand for a near-infrared absorbing material that has a high near-infrared absorbing ability and high transparency in the visible region.
  • cyanine dyes polymethine dyes, squarylium dyes, porphyrin dyes, metal dithiol complex dyes, phthalocyanine dyes, diimonium dyes or inorganic oxide particles are used as near infrared absorbing dyes that absorb near infrared rays.
  • diimonium dyes are frequently used because they have a high near-infrared absorption ability and high transparency in the visible light region (see, for example, Patent Documents 1 and 2).
  • the PDP generates a discharge in a rare gas, particularly a gas mainly composed of neon, enclosed in the panel, and R, G, B provided in the cells inside the panel by vacuum ultraviolet rays generated at that time.
  • the phosphor is made to emit light. Therefore, electromagnetic waves unnecessary for the operation of the PDP are simultaneously emitted during this light emission process. It is necessary to shield this electromagnetic wave. Further, an antireflection film and an antiglare film (antiglare film) are also required to suppress reflected light.
  • an optical filter for plasma display is generally produced by laminating a near-infrared absorbing film, an electromagnetic wave shielding film and an antireflection film on glass or a shock absorbing material as a support. Such an optical filter for plasma display is placed on the front side of the PDP. Such an optical filter for plasma display may be used by being directly bonded onto glass or a shock absorbing material as a support using an adhesive or a pressure-sensitive adhesive.
  • Patent Document 3 JP 2003-96040 A Japanese Unexamined Patent Publication No. 2000-80071 Japanese Patent No. 3621322 International Publication WO2008 / 026786
  • Diimonium-based dyes may be inferior in durability, and lowering of near-infrared absorption ability and coloring can be a serious problem when used in optical semiconductor devices and display applications.
  • a resin having a low glass transition point (Tg) such as an adhesive resin, the dye is severely deteriorated.
  • JP-A-2005-325292 discloses a diimonium dye having improved durability by introducing a halogen atom into the alkyl group of the diimonium cation.
  • the near-infrared cut-off filter using the diimonium dye and the high Tg binder resin shows improved durability as compared with the conventional diimonium dye.
  • the durability tends to be insufficient when combined with a rapidly degrading low Tg adhesive resin.
  • WO2008 / 026786 durability of the dye in the pressure-sensitive adhesive composition is improved by appropriately limiting the diimonium dye.
  • a technique capable of improving the durability of the diimonium dye in the pressure-sensitive adhesive resin has been found from a viewpoint different from the invention of International Publication WO2008 / 026786.
  • the present invention provides a near-infrared absorbing pressure-sensitive adhesive composition useful for preparing a near-infrared absorbing material having high transparency in the visible region and high durability of near-infrared absorbing ability, and a near-infrared absorbing pressure-sensitive adhesive composition. It is an object of the present invention to provide a near-infrared absorbing mixture useful for the purpose.
  • the present inventors diligently studied to improve the durability of the diimonium dye in the adhesive resin. As a result, it was found that the solubility under specific conditions or the absorbance measured under specific conditions correlates with the durability of the diimonium dye in the adhesive resin. The present inventor has found that when the solubility or the absorbance is set to an appropriate value, a near-infrared absorbing pressure-sensitive adhesive composition having excellent dye durability can be obtained.
  • the near-infrared absorbing pressure-sensitive adhesive composition of the present invention comprises a diimonium salt (A1) having an absorbance (X) at ⁇ max of 0.5 or less and a resin (B) having a calculated glass transition point of 0 ° C. or less. And a near-infrared absorbing pressure-sensitive adhesive composition containing the solvent (S2).
  • a mixed solution in which the diimonium salt (A1) was mixed at a ratio of 0.01% by mass with respect to the solvent (S1) was prepared, and this mixed solution was subjected to ultrasonic waves for 30 minutes. Then, leave it for 1 hour or more.
  • the supernatant of this mixed solution is put into a cell having an optical path length of 1 mm, and the absorbance is measured in the range of 350 nm to 1500 nm with an ultraviolet-visible spectrophotometer. By this measurement, ⁇ max and the absorbance (X) at ⁇ max are determined.
  • the solvent (S1) is toluene and / or ethyl acetate.
  • the solvent (S2) is toluene and / or ethyl acetate.
  • the solvent (S1) and the solvent (S2) are the same.
  • the blending amount of the diimonium salt (A1) in the near-infrared absorbing adhesive composition is 0.5% by mass or more based on the total mass of all solids contained in the near-infrared absorbing adhesive composition. It is.
  • Another near-infrared absorbing adhesive composition of the present invention comprises a solvent (S3), a diimonium salt (A2) having a solubility (Y) in the solvent (S3) of less than 0.01% by mass, and a calculated glass transition point. Containing a resin (B) having a temperature of 0 ° C. or lower.
  • the solvent (S3) is toluene and / or ethyl acetate.
  • the acid value of the resin (B) is 0 or more and 300 or less.
  • the calculated solubility parameter of the resin (B) is 10.2 or less.
  • the resin (B) is obtained by polymerizing a monomer mixture having the following composition.
  • Functional group-containing monomer 0.1% by mass or more and 20% by mass or less.
  • Other copolymerizable monomers 0% by mass to 30% by mass.
  • the near-infrared absorbing adhesive composition further contains a phthalocyanine compound.
  • Another near-infrared absorbing pressure-sensitive adhesive composition of the present invention is prepared by adjusting a mixed solution obtained by mixing a diimonium salt (A1) at a ratio of 0.01% by mass with respect to the solvent (S1), After sonication, the mixture is allowed to stand for 1 hour or longer. Thereafter, the supernatant of this mixed solution is put into a cell having an optical path length of 1 mm, and ⁇ max of the supernatant is measured in a range of 350 nm to 1500 nm by an ultraviolet-visible spectrophotometer.
  • Composition comprising a diimonium salt (A1) having an absorbance (X) of 0.5 or less, a resin (B) having a calculated glass transition point of 0 ° C. or less, and a solvent (S2) It is a thing.
  • the diimonium salt (A1) has a solubility (Y) in the solvent (S3) of less than 0.01% by mass.
  • the solvent (S1) and the solvent (S2) are the same, and the solvent (S3) and the solvent (S1) are the same.
  • the near-infrared absorbing material of the present invention contains any one of the above near-infrared absorbing adhesive compositions.
  • the near-infrared absorbing material is formed by laminating one of the above near-infrared absorbing adhesive compositions on a transparent substrate.
  • the near-infrared absorbing material may be one in which the solvent (S2) or the solvent (S3) is volatilized after being applied to the transparent substrate.
  • the near-infrared absorbing material is formed by laminating any one of the above near-infrared absorbing adhesive compositions on an electromagnetic wave shielding material capable of shielding electromagnetic waves.
  • the acid value of the resin (B) is 0 or more and 35 or less.
  • the electromagnetic shielding material includes the transparent substrate.
  • the thin display optical filter of the present invention is formed using any one of the above near-infrared absorbing materials.
  • the thin display of the present invention comprises any one of the above near infrared absorbing pressure-sensitive adhesive compositions, any one of the above near infrared absorbing materials, or the above optical filter.
  • the near-infrared absorbing mixture of the present invention is used for a near-infrared absorbing adhesive composition.
  • This near-infrared absorbing mixture was prepared by preparing a mixed solution obtained by mixing diimonium salt (A1) at a ratio of 0.01% by mass with respect to the solvent (Sm), and subjecting this mixed solution to ultrasonic waves for 30 minutes, and then for 1 hour. It was left above. Thereafter, the supernatant liquid of this mixed liquid was put into a cell having an optical path length of 1 mm, and the absorbance (X) at ⁇ max of the supernatant liquid measured in the range of 350 nm to 1500 nm with an ultraviolet-visible spectrophotometer was 0.5 or less. It contains a certain dimonium salt (A1) and a solvent (Sm).
  • the solvent (Sm) is toluene and / or ethyl acetate.
  • the other near-infrared absorbing mixture of the present invention is also for a near-infrared absorbing adhesive composition.
  • This near-infrared absorbing mixture contains a solvent (S3) and a diimonium salt (A2) having a solubility (Y) in the solvent (S3) of less than 0.01% by mass.
  • the solvent (S3) is toluene and / or ethyl acetate.
  • Still another near-infrared absorbing pressure-sensitive adhesive composition of the present invention comprises any one of the above near-infrared absorbing mixtures.
  • the other near-infrared absorbing pressure-sensitive adhesive composition comprises the near-infrared absorbing mixture and the resin composition (P).
  • This resin composition (P) includes a solvent (S2) and a resin (B) having a calculated glass transition point of 0 ° C. or lower.
  • the blending amount of the resin (B) in the resin composition (P) is 50% by mass or more.
  • the near-infrared absorbing pressure-sensitive adhesive composition using the near-infrared absorbing mixture of the present invention is excellent in the durability of the diimonium dye.
  • the near-infrared absorbing material using the near-infrared absorbing adhesive composition of the present invention the near-infrared absorbing ability of the diimonium dye can be maintained for a long period of time. Therefore, when this near-infrared absorbing pressure-sensitive adhesive composition is used for the production of an optical filter for an optical semiconductor element or a thin display, it becomes possible to make the optical filter thin and simplify the optical filter manufacturing process.
  • FIG. 1 is a graph showing the transmission spectrum of the test body of Example 2 before the test (initial stage).
  • FIG. 2 is a graph showing a transmission spectrum of the test body of Example 2 after the heat resistance test.
  • FIG. 3 is a graph showing a transmission spectrum of the test body of Example 2 after a heat and humidity resistance test.
  • FIG. 4 is a graph showing a transmission spectrum of the test body of Example 2 after a light resistance test.
  • FIG. 5 is a graph showing the transmission spectrum of the test body of Comparative Example 1 before the test (initial stage). 6 is a graph showing a transmission spectrum of the test body of Comparative Example 1 after the heat resistance test.
  • FIG. 7 is a graph showing a transmission spectrum of the test body of Comparative Example 1 after a moisture and heat resistance test.
  • FIG. 8 is a graph showing a transmission spectrum of the test body of Comparative Example 1 after the light resistance test.
  • the solvent is distinguished from (S1), (S2), (S3), (S4) and (Sm) in order to show that these may be different from each other.
  • the purpose of this distinction is also to clarify the description of the claims and the specification.
  • two or more selected from the solvents (S1), (S2), (S3), (S4) and (Sm) may be the same.
  • all of the solvents (S1), (S2), (S3), (S4) and (Sm) may be the same.
  • Solvent (S1), (S2), (S3), (S4) or (Sm) may be contained in the near-infrared absorbing adhesive composition of the present invention.
  • the solvent (S1), (S2), (S3), (S4), or (Sm) may disappear due to volatilization.
  • Diimonium salt (diimonium dye) A1 The diimonium salt (A1) used in the present invention has an absorbance (X) at ⁇ max of 0.5 or less, measured by the method described later.
  • Examples of the diimonium cation of the diimonium dye (A1) include a diimonium cation represented by the following formula (1).
  • diimmonium dyes as represented by the following formula (1S) and the diimmonium cation represented by the formula (1), diimmonium anion Z - consists of.
  • R 1 to R 8 each independently represent a hydrogen atom, a halogen atom, an alkyl group, or an alkyl group having a substituent.
  • Z ⁇ represents a diimonium anion.
  • R 1 to R 8 are an alkyl group or an alkyl group having a substituent
  • the number of carbon atoms of the alkyl group is preferably 1 to 22 and more preferably 2 to 12 for each of R 1 to R 8. .
  • Examples of the halogen atom constituting R 1 to R 8 include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
  • R 1 to R 8 include linear, branched and alicyclic alkyl groups having 1 to 10 carbon atoms.
  • alkyl group examples include a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-amyl group, isoamyl group, Examples include 1-methylbutyl group, 1-ethylpropyl group, 1,2-dimethylpropyl group, 1,1-dimethylpropyl group, neopentyl group, n-hexyl group, cyclohexyl group, and the like.
  • Other preferred R 1 to R 8 include 4,4,4-trifluorobutyl group, 2,2,2-trifluoroethyl group and perfluorobutyl group. R 1 to R 8 may all be the same or different.
  • R 1 to R 8 are linear or branched alkyl groups having 3 to 5 carbon atoms. More preferably, R 1 to R 8 are an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an n-amyl group or an isoamyl group, and more preferably an n-butyl group, an isobutyl group or an isoamyl group. An isobutyl group is particularly preferred.
  • Examples of the substituent that can be bonded to the alkyl group of R 1 to R 8 include cyano group; hydroxyl group; halogen atom such as fluorine atom, chlorine atom, bromine atom; methoxy group, ethoxy group, n-propoxy group, n
  • An alkoxy group having 1 to 6 carbon atoms such as butoxy group; alkoxy having 2 to 8 carbon atoms such as methoxymethoxy group, ethoxymethoxy group, methoxyethoxy group, ethoxyethoxy group, methoxypropoxy group, methoxybutoxy group, ethoxybutoxy group, etc.
  • Alkoxy group methoxymethoxymethoxy group, methoxymethoxyethoxy group, methoxyethoxyethoxy group, ethoxyethoxyethoxy group, etc., alkoxyalkoxyalkoxy group having 3 to 15 carbon atoms; allyloxy group; phenoxy group, tolyloxy group, xylyloxy group, naphthyloxy group Such as 6-12 carbon atoms A reeloxy group; an alkoxycarbonyl group having 2 to 7 carbon atoms such as a methoxycarbonyl group, an ethoxycarbonyl group, an n-propoxycarbonyl group, an isopropoxycarbonyl group, and an n-butoxycarbonyl group; a methylcarbonyloxy group, an ethylcarbonyloxy group, C2-C7 alkylcarbonyloxy groups such as n-propylcarbonyloxy group and n-butylcarbonyloxy group; methoxycarbonyloxy
  • alkoxycarbonyloxy group having 2 to 7 carbon atoms is an alkoxycarbonyloxy group having 2 to 7 carbon atoms.
  • a preferred example of the alkyl group to which the substituent is bonded is a methoxyethyl group. That is, a preferred example of R 1 to R 8 is a methoxyethyl group.
  • the diimonium anion is not particularly limited.
  • Preferred diimonium anions include hexafluoroantimonate ion, perchlorate ion, hexafluorophosphate ion, tetrafluoroborate ion, trifluoromethanesulfonate ion, toluenesulfonate ion, bis (trifluoromethanesulfonate) imide ion, tetrakis ( Pentafluorophenyl) borate ion, tris (trifluoromethanesulfonic acid) methide ion and the like.
  • More preferable diimonium anions include hexafluoroantimonate ion [SbF 6 ⁇ ] and tris (trifluoromethanesulfonic acid) methide ion [(CF 3 SO 2 ) 3 C ⁇ ].
  • Preferred diimonium salt (A1) of the present invention is a form in which two anions are bonded to one diimonium cation.
  • diimonium salt (A1) tris (trifluoromethylsulfonyl) methidoic acid-N, N, N ′, N′-tetrakis (p-di (iso-butyl) aminophenyl) -p-phenylenediimonium and hexafluoroantimonic acid -N, N, N ', N'-tetrakis ⁇ p-di (iso-butyl) aminophenyl ⁇ -p-phenylenediimonium.
  • These production methods will be described by the following synthesis examples. Since these have high durability in an adhesive composition, these are especially preferable.
  • the diimonium dye (A1) is preferably in a form that is easy to disperse.
  • the diimonium dye is refined by pulverization or the like.
  • miniaturization method both wet and dry methods can be adopted.
  • a wet micronization method a bead mill or ball mill, micronization by liquid flow, or micronization using laser or ultrasonic waves can be employed.
  • a dry refinement method a ball mill, an attritor, a roll mill or an air stream can be used. More preferably, a method of pulverizing a diimonium dye using particles such as zirconia beads, glass beads, and alumina beads may be employed.
  • a liquid mixture obtained by mixing a diimonium dye, a solvent (S4), and zirconia beads is prepared, and after the liquid mixture is shaken in a container, the zirconia beads are separated.
  • a method is illustrated.
  • a solvent (S4) a solvent (S1) in which the absorbance (X) measured by the above method using a diimonium salt to be ground is 0.5 or less.
  • a solvent (S3) in which the solubility (Y) measured by the above method using a diimonium salt to be pulverized is less than 0.01%.
  • Diimonium salt (diimonium dye) A2 The diimonium salt (A2) used in the present invention has a solubility (Y) measured by a method described later of less than 0.01% by mass.
  • Examples of the diimonium cation of the diimonium dye (A2) include the diimonium cation represented by the above formula (1).
  • a preferred dimonium dye is composed of the dimonium cation represented by the above formula (1) and the dimonium anion Z ⁇ as represented by the above formula (1S).
  • R 1 to R 8 are an alkyl group or an alkyl group having a substituent
  • the carbon number of the alkyl group is 1 for each of R 1 to R 8. It is preferably 22 or more and more preferably 2 or more and 12 or less.
  • Examples of the halogen atom constituting R 1 to R 8 include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
  • R 1 to R 8 include linear, branched and alicyclic alkyl groups having 1 to 10 carbon atoms as in the diimonium dye (A1).
  • Diimonium anion is not particularly limited. As a preferable diimonium anion, the same diimonium anion as the said diimonium dye (A1) is mentioned.
  • Preferred diimonium salt (A2) of the present invention is a form in which two anions are bonded to one diimonium cation.
  • diimonium salt (A2) tris (trifluoromethylsulfonyl) methidoic acid-N, N, N ′, N′-tetrakis (p-di (iso-butyl) aminophenyl) -p-phenylenediimonium and hexafluoroantimonic acid -N, N, N ', N'-tetrakis ⁇ p-di (iso-butyl) aminophenyl ⁇ -p-phenylenediimonium.
  • These production methods will be described by the following synthesis examples. Since these have high durability in an adhesive composition, these are especially preferable.
  • the diimonium dye (A2) is preferably in a form that is easy to disperse.
  • the diimonium dye is refined by pulverization or the like.
  • both wet and dry methods similar to the diimonium dye (A1) can be employed.
  • a method of pulverizing the diimonium dye using particles such as zirconia beads, glass beads, and alumina beads may be employed.
  • a diimonium dye (A2), a solvent (S3) in which the solubility (Y) of the diimonium dye (A2) is less than 0.01% by mass, and zirconia beads are mixed.
  • An example is a method of preparing a liquid, shaking the liquid in a container, and then separating the zirconia beads.
  • the solvent (S1) is used for measuring the absorbance (X) of the supernatant of the diimonium salt. Moreover, the solvent (S1) may be contained in the near-infrared absorption adhesive composition.
  • the solvent (S1) those having a measured diimonium salt solubility (Y) of less than 0.01% by mass are preferable. Details of the measurement of the solubility (Y) will be described later.
  • the solvent (S1) include toluene, ethyl acetate, xylene, butyl acetate and methylcyclohexane. Toluene and ethyl acetate are particularly preferred.
  • the measurement range is 350 nm or more and 1500 nm or less.
  • ⁇ max means the wavelength at which the absorbance is maximum in the measured wavelength range.
  • Absorbance is obtained by the following equation, where transmittance is T (%).
  • Absorbance ⁇ log (T / 100)
  • the mixing method and the method of collecting the supernatant liquid are as follows. First, 50 ml of a mixed solution in which a diimonium salt is mixed at a ratio of 0.01% by mass with respect to the solvent (S1) is produced.
  • the mixing container used for this mixing is a screw cap bottle.
  • the screw bottle has an outer diameter of 40 mm and a height of 75 mm.
  • the height of the liquid surface (the uppermost surface of the liquid) of the 50 ml mixed liquid is 50 mm.
  • the mixed solution is subjected to ultrasonic waves and allowed to stand for 1 hour or longer, and then the supernatant liquid from the liquid surface (the uppermost surface of the liquid) to 5 mm is collected and used for measurement.
  • an undissolved dimonium salt is sinking on the bottom surface of the mixing container.
  • the temperature of the solvent (S1) is 25 ° C.
  • a desktop ultrasonic cleaner (trade name “Bransonic 3510J-DTH”) manufactured by BRANSON was used. Water is added to the tank of this tabletop ultrasonic cleaner, the mixing container is placed in the tank filled with water, and the tank is vibrated at a frequency of 40,000 Hz or more (42 kHz) to mix in the mixing container. An ultrasonic wave was applied to the liquid.
  • the absorbance (X) with respect to the solvent (S1) is 0.5 or less
  • the durability of the dimonium salt in the adhesive resin (B) can be improved.
  • the absorbance (X) is preferably 0.5 or less, more preferably 0.3 or less, and even more preferably 0.25 or less.
  • the solvent (S1) is either toluene or ethyl acetate
  • the absorbance (X) is preferably 0.5 or less, more preferably 0.3 or less, 0.25 or less is more preferable and 0.15 or less is still more preferable.
  • the absorbance (X) is preferably 0.5 or less, more preferably 0.3 or less, regardless of whether the solvent (S1) is toluene or ethyl acetate. Preferably, 0.25 or less is more preferable.
  • Solvent (S2) The solvent (S2) can be included in the pressure-sensitive adhesive composition. This solvent (S2) may be used as a dilution solvent for adjusting the viscosity of the pressure-sensitive adhesive composition. With the solvent (S2), the viscosity of the pressure-sensitive adhesive composition is adjusted to a viscosity suitable for application to a substrate or the like. The thickness of the pressure-sensitive adhesive composition layer can be adjusted by this viscosity.
  • Examples of the solvent (S2) include toluene, ethyl acetate, methyl ethyl ketone, methyl isobutyl ketone, butyl acetate, butyl cellosolve, propylene glycol n-propyl ether, propylene glycol n-butyl ether, propylene glycol monomethyl ether acetate and the like.
  • the solvent (S2) is preferably toluene and / or ethyl acetate from the viewpoint of the durability of the diimonium salt.
  • the solvent (S2) is toluene and / or ethyl acetate and the solvent (S1) is more preferably toluene and / or ethyl acetate from the viewpoint of durability of the diimonium salt.
  • a solvent (S1) and a solvent (S2) are the same.
  • a preferred pressure-sensitive adhesive composition includes a solvent (S3) and a diimonium salt having a solubility (Y) in the solvent (S3) of less than 0.01% by mass. This solvent (S3) is used for measuring the solubility (Y).
  • Solvent (S3) can be variously selected depending on the diimonium salt used.
  • examples of the solvent (S3) include toluene, ethyl acetate, xylene, butyl acetate and methylcyclohexane. Toluene and / or ethyl acetate are particularly preferred.
  • This solvent (S3) may be used as a dilution solvent in the same manner as the solvent (S2).
  • a preferable solvent as the solvent (S2) is also preferable as the solvent (S3).
  • a preferable solvent as the solvent (S1) is also preferable as the solvent (S3).
  • the solubility (Y) is less than 0.01% by mass.
  • the solubility (Y) is 0.01% by mass or more and less than 0.1% by mass. It is judged.
  • the near-infrared absorbing pressure-sensitive adhesive composition may contain a diluting solvent.
  • This dilution solvent may be any of the above-mentioned solvents [solvents (S1), (S2), (S3), (S4), and (Sm)].
  • the dilution solvent may be two or more selected from the solvents (S1), (S2), (S3), (S4), and (Sm).
  • the dilution solvent may be a solvent other than the above-mentioned solvents [solvents (S1), (S2), (S3), (S4) and (Sm)].
  • Diluent solvents include toluene, ethyl acetate, methyl ethyl ketone, methyl isobutyl ketone, butyl acetate, butyl cellosolve, propylene glycol n-propyl ether, propylene glycol n-butyl ether, propylene glycol monomethyl ether acetate and the like.
  • the diluent solvent is preferably toluene and / or ethyl acetate.
  • the diluting solvent may not be used.
  • the viscosity of the near-infrared absorbing pressure-sensitive adhesive composition may be appropriately adjusted only by the solvent contained in the mixture (M1) described later.
  • the method for producing a near-infrared absorbing adhesive composition of the present invention includes a first step in which a diimonium salt and a solvent (Sm) are mixed to produce a mixture (M1), and the mixture (M1) is a resin (B). It is preferable to include the 2nd process mixed by (after-mentioned).
  • a preferable solvent (Sm) is the solvent (S1) or the solvent (S3). From the viewpoint of durability of the dimonium salt, it has been found that the solvent (Sm) is preferably toluene and / or ethyl acetate. Further, from the viewpoint of durability of the diimonium salt, this solvent (Sm) is preferably the same as the dilution solvent of the near-infrared absorbing adhesive composition.
  • a method for producing the mixture (M1) a method using particles for grinding a dimonium salt is exemplified.
  • this production method wet and dry methods similar to those shown as the above-described method for miniaturizing the dimonium dye (A1) can be employed.
  • a method for producing a mixture (M1) using zirconia particles a liquid mixture obtained by mixing a dimonium dye, a solvent (S4), and zirconia beads is prepared, and the liquid mixture is shaken in a container.
  • a method for separating zirconia beads is exemplified.
  • the solvent (S4) include a solvent (S1) in which the absorbance (X) measured by the above method using a diimonium salt to be ground is 0.5 or less.
  • a solvent (S3) in which the solubility (Y) measured by the above method using a diimonium salt to be pulverized is less than 0.01%.
  • the blending amount of the dimonium salt in the mixture (M1) is preferably 3% by mass or more, more preferably 4% by mass or more, and particularly preferably 5% by mass or more. From the viewpoint of handling viscosity, the blending amount of the dimonium salt in the mixture (M1) is preferably 95% by mass or less.
  • the compounding quantity of this dimonium salt is represented by the ratio of the mass of the dimonium salt mix
  • this mixture (M1) is mixed with a resin (B) described later, whereby the dispersion state of the diimonium salt in the near-infrared absorbing adhesive composition is improved. This reason is considered to be because the resin (B) contributes as a dispersant.
  • an anionic, cationic, or nonionic surfactant, a polymeric dispersing agent, etc. are mentioned as this additive which a various additive may be added to the said mixture (M1).
  • Resin (B) The resin (B) according to the present invention is not particularly limited as long as the glass transition temperature is 0 ° C. or lower.
  • the resin (B) according to the present invention has adhesiveness. This tackiness enables direct adhesion between the near-infrared absorbing pressure-sensitive adhesive composition and the adherend.
  • the near-infrared absorbing pressure-sensitive adhesive composition and the adherend can be bonded without interposing an adhesive.
  • this resin (B) is also called adhesive resin.
  • the glass transition temperature of the adhesive resin (B) is preferably 0 ° C. or lower, more preferably ⁇ 10 ° C. or lower, and more preferably ⁇ 20 ° C. or lower. More preferably, it is ⁇ 30 ° C. or lower. When it is higher than 0 ° C., the tackiness may be insufficient.
  • the glass transition temperature can also be obtained by determining the maximum temperature of the loss tangent (tan ⁇ ) by a differential scanning calorimeter or dynamic viscoelasticity measurement.
  • Means the calculated glass transition temperature obtained by The monomer used for the polymerization of the resin (B) is not particularly limited as long as the calculated glass transition temperature Tg calculated using the Fox formula represented by the following formula satisfies a predetermined value.
  • 1 / (Tg + 273) ⁇ [Wi / (Tgi + 273)]: Fox formula Tg (° C.): calculated glass transition temperature
  • Wi weight fraction of each monomer Tgi (° C.): single weight of each monomer component Glass transition temperature of coalescence
  • the adhesive resin (B) is generally copolymerized with a carboxyl group-containing monomer such as acrylic acid for the purpose of improving the adhesion to the adherend and increasing the adhesive strength.
  • a functional group such as a carboxyl group degrades the diimonium dye
  • the acid value of the pressure-sensitive adhesive resin (B) is preferably 300 or less, more preferably 100 or less, and still more preferably 80 or less.
  • the acid value of the pressure-sensitive adhesive resin (B) is preferably 0 or more, more preferably 5 or more, and still more preferably 10 or more.
  • “Acid value” refers to the amount of mg of potassium hydroxide required to neutralize 1 g of the adhesive resin. Details of the acid value measurement method will be described later.
  • reaction 1 when the transparent base material mentioned later is glass, it is estimated that the following (Reaction 1) has occurred in the glass surface (interface of glass and a near-infrared absorption adhesive composition layer). It is believed that Na + ions in the glass emerge on the glass surface by diffusion. The Na + ions react with present in the near-infrared absorbing pressure-sensitive adhesive composition H 2 O (or H 2 O which is attached to the glass surface prior to application of the adhesive composition) and NaOH generates considered It is done. (Reaction 1) Na + + H 2 O ⁇ NaOH + H + (to the inside of the glass)
  • This NaOH degrades the diimonium salt.
  • this carboxyl group traps Na + . It is considered that this trap suppresses the generation of NaOH and suppresses the deterioration of the diimonium salt.
  • the reaction 1 is likely to occur because a large amount of H 2 O is present. Therefore, in particular, from the viewpoint of heat and humidity resistance, the acid value is preferably large. Specifically, as described above, 0 or more is preferable, 5 or more is more preferable, and 10 or more is more preferable.
  • the acid value of the resin (B) is excessively high, the solubility of the diimonium salt in the resin (B) increases and the aggregate (X) tends to decrease. Therefore, from the viewpoint of heat resistance for evaluating durability at high temperatures, the acid value is preferably small. Specifically, as described above, 300 or less is preferable, 100 or less is more preferable, and 80 or less is preferable. Further preferred.
  • an electromagnetic wave shielding layer including a metal layer may be laminated on the near-infrared absorbing layer.
  • this metal layer is laminated on this near-infrared absorbing layer, deterioration of the dimonium salt can be suppressed, and discoloration of the dye, the metal layer, and the adhesive can be prevented, so that the acid of the resin (B) can be prevented.
  • the value is particularly preferably 35 or less. From the viewpoint of improving the dispersion state of the diimonium salt, the acid value is preferably 0 or more.
  • the calculated solubility parameter is a value calculated by the method described on pages 147 to 154 of “POLYMER ENGINEERING AND SCIENCE” (1974, Vol. 14, No. 2). The method is outlined below.
  • the solubility parameter ( ⁇ ) of the homopolymer is calculated by the following formula based on the evaporation energy ( ⁇ ei) and molar volume ( ⁇ vi) of the structural unit forming the polymer.
  • ⁇ ( ⁇ ei / ⁇ vi) 1/2
  • ⁇ ei Evaporation energy of i component atom or atomic group
  • ⁇ vi Molar volume of i component atom or atomic group
  • the solubility parameter of the copolymer is obtained by multiplying the evaporation energy of each constituent monomer constituting the copolymer by the mole fraction ( ⁇ Ei) and adding it to the molar volume of each constituent monomer. Calculated by multiplying by the mole fraction and adding together ( ⁇ Vi) and taking the 1/2 power.
  • the adhesive resin (B) may be a copolymer.
  • the pressure-sensitive adhesive resin (B) is preferably a copolymer of a (meth) acrylic acid ester containing a hydroxyl group and another compound. Furthermore, from the viewpoint of the durability of the diimonium dye, the pressure-sensitive adhesive resin (B) is a (meth) acryl having an alicyclic, polycyclic alicyclic, aromatic or polycyclic aromatic ring alkyl group. A copolymer obtained by copolymerizing 5 to 40% by mass of an acid ester is preferable.
  • the resin (B) is a resin obtained by copolymerizing the following monomers (p1) to (p3).
  • P1 (meth) acrylic acid ester (p2) functional group-containing monomer having an alkyl group having 1 to 12 carbon atoms (P3)
  • P3 Other copolymerizable monomers
  • the preferable ratio of the monomer is 60% by mass or more and 99.9% by mass or less of (meth) acrylic acid ester of (p1), and 0.1% by mass or more and 20% by mass of the functional group-containing monomer of (p2).
  • the other copolymerizable monomer (p3) is 0% by mass or more and 30% by mass or less. More preferably, the ratio of the functional group-containing monomer (p2) is 0.1% by mass or more and 10% by mass or less.
  • the alkyl group in the monomer (p1) is a linear, branched or alicyclic alkyl group.
  • Examples of (meth) acrylic acid ester of (p1) above are methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate, t-butyl (meth) acrylate 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, i-octyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, n-nonyl ( Examples include meth) acrylate, isononyl (meth) acrylate, n-decyl (meth) acrylate, isodecyl (meth) acrylate, and n-dodecyl (meth) acrylate.
  • the functional group-containing monomer (p2) is preferably a hydroxyl group or carboxyl group-containing monomer, more preferably a hydroxyl group or carboxyl group-containing (meth) acrylic monomer.
  • a carboxyl group-containing (meth) acrylic monomer is preferable.
  • the carboxyl group of the carboxyl group-containing (meth) acryl monomer serves as a crosslinking point. Therefore, the adhesiveness can be adjusted by the blending amount of the carboxyl group-containing (meth) acrylic monomer.
  • the carboxyl group of the carboxyl group-containing (meth) acrylic monomer contributes to the improvement of durability. Details of this reason are as described above.
  • carboxyl group-containing (meth) acrylic monomer acrylic acid and methacrylic acid are preferably used.
  • the hydroxyl group-containing (meth) acrylic monomer examples include hydroxyethyl (meth) acrylate and hydroxypropyl (meth) acrylate.
  • the hydroxyl group of the hydroxyl group-containing (meth) acrylic monomer can be a crosslinking point. Therefore, the hydroxyl group-containing (meth) acrylic monomer contributes to the adjustment of the adhesive properties.
  • the ratio of the hydroxyl group-containing (meth) acrylic monomer is particularly preferably 0.1% by mass or more and 10% by mass or less based on the total amount of the monomers.
  • benzyl (meth) acrylate As other copolymerizable monomers of the above (p3), benzyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, tricyclodecanyl (meth) acrylate, Examples include phenoxyethyl (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, and 2-hydroxy-3-phenoxypropyl (meth) acrylate.
  • (p3) examples include (meth) acrylates such as methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, ethoxyethoxyethyl (meth) acrylate; ⁇ -methylstyrene, vinyltoluene, styrene, etc.
  • Styrene monomers represented by: vinyl ether monomers represented by methyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, etc .; fumaric acid; monoalkyl ester of fumaric acid; dialkyl ester of fumaric acid; maleic acid; Dialkyl ester of maleic acid; itaconic acid; monoalkyl ester of itaconic acid; dialkyl ester of itaconic acid; (meth) acrylonitrile; vinyl chloride; vinylidene chloride; vinyl acetate; Nirupirijin; vinyl carbazole and the like.
  • monomers having a functional group such as a carboxyl group, an oxazolinyl group, a pyrrolidonyl group, and a fluoroalkyl group may be copolymerized within a range that does not impair the object of the present invention.
  • a more preferred adhesive resin (B) is a resin obtained by copolymerizing the following (m1) to (m4).
  • (M1) A (meth) acrylic acid ester having an alicyclic, polycyclic alicyclic, aromatic or polycyclic aromatic cyclic alkyl group.
  • (M2) A (meth) acrylic acid ester having an alkyl group. However, this alkyl group is linear or branched, and the alkyl group has 1 to 10 carbon atoms.
  • M3 Functional group-containing monomer (m4) Other copolymerizable monomers.
  • a preferable ratio of the monomer is 5% by mass or more and 40% by mass or less of (meth) acrylic acid ester of (m1), and (meth) acrylic acid ester of (m2). Is from 60% by mass to 95% by mass, the functional group-containing monomer of (m3) is from 0.1% by mass to 20% by mass, and the other monomer of (m4) is from 0% by mass to 20% by mass. % Or less.
  • Examples of the (meth) acrylic ester of (m1) include cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, benzyl (meth) acrylate, dicyclopentenyl (meth) acrylate, and dicyclopentenyloxyethyl (meth).
  • Examples of the (m) acrylic acid ester of (m2) include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate, t-butyl (meth) Examples include acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, i-octyl (meth) acrylate, and the like.
  • Examples of the functional group-containing monomer (m3) include those exemplified as the functional group-containing monomer (p2).
  • Examples of the monomer (m4) include (meth) acrylates such as methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, and ethoxyethoxyethyl (meth) acrylate; ⁇ -methylstyrene, vinyltoluene, Styrenic monomers typified by styrene and the like; vinyl ether monomers typified by methyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether and the like; fumaric acid; monoalkyl ester of fumaric acid; dialkyl ester of fumaric acid; maleic acid; Monoalkyl ester of maleic acid; dialkyl ester of maleic acid; itaconic acid; monoalkyl ester of itaconic acid; dialkyl ester of itaconic acid; (meth) acrylonitrile; vinyl chloride; vinylidene chloride; vinyl acetate; Emission
  • Peroxide-based initiators include peroxyesters such as perbutyl O and perhexyl O (both manufactured by NOF); peroxydicarbonates such as PERROYL L and PEROIL O (both manufactured by NOF); Diacyl peroxides such as BW and Nyper BMT (both made by NOF); Peroxyketals such as perhexa 3M and perhexa MC (both made by NOF); perbutyl P, park mill D (both made by NOF) And hydroperoxides such as Park Mill P and Permenter H (both manufactured by NOF Corporation).
  • the azo initiator include ABN-E, ABN-R, and ABN-V (all manufactured by Nippon Hydrazine Kogyo).
  • a chain transfer agent may be used as necessary.
  • the chain transfer agent is not particularly limited, and thiol compounds such as normal dodecyl mercaptan, dithioglycol, octyl thioglycolate, and mercaptoethanol can be used.
  • the polymerization of the pressure-sensitive adhesive resin (B) may be performed without a solvent or in an organic solvent.
  • aromatic solvents such as toluene and xylene; ester solvents such as ethyl acetate and butyl acetate; ketone solvents such as methyl ethyl ketone (MEK) and methyl isobutyl ketone; other known organics A solvent can be used.
  • the type of organic solvent to be used is determined in consideration of the solubility of the obtained resin and the polymerization temperature, but the boiling point of toluene, ethyl acetate, methyl ethyl ketone, etc. is 120 ° C.
  • Organic solvents are preferred. Further, from the viewpoint of durability of the diimonium dye, an organic solvent having a solubility (Y) of less than 5% by weight of the diimonium dye is preferable, and an organic solvent having a solubility (Y) of less than 0.01% by weight is more preferable.
  • the pressure-sensitive adhesive resin (B) may be composed of a single composition, or may be a polymer alloy or polymer blend in which polymers having different compositions are combined.
  • a macromonomer In order to obtain a branched resin, a macromonomer, a polyfunctional monomer, a polyfunctional initiator, or a polyfunctional chain transfer agent can be used.
  • a macromonomer AA-6, AA-2, AS-6, AB-6, AK-5 (all manufactured by Toagosei Co., Ltd.) and the like can be used.
  • the polyfunctional monomer include LIGHT EG EG, LIGHT SEL 1,4BG, LIGHT ESTER NP, LIGHT ESTER TMP (all manufactured by Kyoeisha Chemical Co., Ltd.) and the like.
  • polyfunctional initiator examples include Pertetra A, BTTB-50 (all manufactured by NOF Corporation), Trigonox 17-40MB, Parkadox 12-XL25 (all manufactured by Explosive Akzo), and the like.
  • polyfunctional chain transfer agent pentaerythritol tetrakis (3-mercaptopropionate), trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (thioglycolate) or the like can be used.
  • near-infrared-absorbing pressure-sensitive adhesive composition In the near-infrared-absorbing pressure-sensitive adhesive composition of the present invention, since the diimonium dye considering the absorbance (X) or the solubility (Y) is used, the persistence of near-infrared absorption ability Excellent. Moreover, this near-infrared absorption adhesive composition is excellent in transparency in the visible region. Since the near-infrared absorbing adhesive composition of the present invention contains an adhesive resin, it can be easily adhered to an adherend.
  • near infrared absorbing dyes may be added to the near infrared absorbing pressure-sensitive adhesive composition of the present invention.
  • Other near infrared absorbing dyes that can be used in combination include known cyanine dyes, polymethine dyes, squarylium dyes, porphyrin dyes, metal dithiol complex dyes, phthalocyanine dyes, diimonium dyes, inorganic oxide particles, and the like. Can be mentioned.
  • Preferred other dyes are dyes that can exhibit a quencher effect with respect to the diimonium dye.
  • the quencher effect is an effect of deexciting an active molecule in an excited state.
  • other dyes having an effect of de-exciting and stabilizing diimonium dye molecules, diimonium anions or diimonium cations are preferred.
  • phthalocyanine dyes are preferable, and phthalocyanine dyes whose central metal is vanadium are particularly preferable.
  • a dye or a metal dithiol complex dye having a maximum absorption wavelength of 800 to 950 nm is preferably used in combination.
  • near infrared rays of 800 to 1100 nm can be effectively absorbed. From the viewpoint of obtaining a near-infrared absorbing pressure-sensitive adhesive composition having good durability, it is particularly preferable to use a phthalocyanine dye in combination.
  • the phthalocyanine dye used in combination is a central metal.
  • a phthalocyanine compound that is copper is particularly preferred.
  • the phthalocyanine compound that can be used in the present invention is not particularly limited as long as it has excellent near-infrared absorption ability, and a known phthalocyanine compound can be used.
  • Preferable phthalocyanine compounds include compounds represented by the following formula (A) or compounds represented by the following formula (I).
  • a 1 to A 16 represent functional groups.
  • a 1 to A 16 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a hydroxysulfonyl group, a carboxyl group, a thiol group, or an optionally substituted carbon atom having 1 to 20 carbon atoms.
  • Alkyl groups optionally substituted alkoxy groups having 1 to 20 carbon atoms, optionally substituted aryl groups having 6 to 20 carbon atoms, optionally substituted carbon atoms 6 to 20 Aryloxy groups, optionally substituted aralkyl groups having 7 to 20 carbon atoms, optionally substituted aralkyloxy groups having 7 to 20 carbon atoms, and optionally substituted carbon atoms 1-20 alkylthio group, optionally substituted arylthio group having 6-20 carbon atoms, optionally substituted aralkylthio group having 7-20 carbon atoms, substituted An optionally substituted alkylsulfonyl group having 1 to 20 carbon atoms, an optionally substituted arylsulfonyl group having 6 to 20 carbon atoms, and an optionally substituted aralkyl having 7 to 20 carbon atoms A sulfonyl group, an optionally substituted acyl group having 1 to 20 carbon atoms, an optionally substituted alkoxy
  • the functional groups of A 1 to A 16 may be the same or different, and may be the same or different in the same type, and the functional groups may be connected via a linking group.
  • M 1 represents two hydrogen atoms, a divalent metal atom, a trivalent substituted metal atom, a tetravalent substituted metal atom, or an oxy metal.
  • the “acyl group” has the same definition as that described on page 17 of the third edition of the Dictionary of Science and Technology Terms published by the Nikkan Kogyo Shimbun.
  • a group from which a group has been removed is a group represented by the formula: RCO— (where R is an aliphatic group, an alicyclic group or an aromatic group).
  • examples of the halogen atom of the functional groups A 1 to A 16 include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
  • Examples of the optionally substituted alkyl group having 1 to 20 carbon atoms include methyl group, ethyl group, n-propyl group, iso-propyl group, n-butyl group, iso-butyl group, sec-butyl group, Examples thereof include linear, branched or cyclic alkyl groups such as t-butyl group, n-pentyl group, n-hexyl group, cyclohexyl group, n-heptyl group, n-octyl group, 2-ethylhexyl group, etc. It is not limited to.
  • Examples of the optionally substituted alkoxy group having 1 to 20 carbon atoms include methoxy group, ethoxy group, n-propyloxy group, iso-propyloxy group, n-butyloxy group, iso-butyloxy group, sec-butyloxy Group, t-butyloxy group, n-pentyloxy group, n-hexyloxy group, cyclohexyloxy group, n-heptyloxy group, n-octyloxy group, 2-ethylhexyloxy group, etc.
  • an alkoxy group is mentioned, it is not limited to these.
  • Examples of the optionally substituted aryl group having 6 to 20 carbon atoms include, but are not limited to, a phenyl group and a naphthyl group.
  • Examples of the aryloxy group having 6 to 20 carbon atoms which may be substituted include, but are not limited to, a phenoxy group and a naphthoxy group.
  • Examples of the aralkyl group having 7 to 20 carbon atoms which may be substituted include, but are not limited to, benzyl group, phenethyl group, diphenylmethyl group and the like.
  • Examples of the aralkyloxy group having 7 to 20 carbon atoms which may be substituted include a benzyloxy group, a phenethyloxy group and a diphenylmethyloxy group, but are not limited thereto.
  • Examples of the optionally substituted alkylthio group having 1 to 20 carbon atoms include methylthio group, ethylthio group, n-propylthio group, iso-propylthio group, n-butylthio group, iso-butylthio group, sec-butylthio group, linear, branched or cyclic alkylthio groups such as t-butylthio group, n-pentylthio group, n-hexylthio group, cyclohexylthio group, n-heptylthio group, n-octylthio group, 2-ethylhexylthio group, etc.
  • Examples of the optionally substituted arylthio group having 6 to 20 carbon atoms include a phenylthio group and a naphthylthio group, but are not limited thereto.
  • Examples of the aralkylthio group having 7 to 20 carbon atoms which may be substituted include, but are not limited to, benzylthio group, phenethylthio group, diphenylmethylthio group and the like.
  • Examples of the optionally substituted alkylsulfonyl group having 1 to 20 carbon atoms include methylsulfonyl group, ethylsulfonyl group, n-propylsulfonyl group, iso-propylsulfonyl group, n-butylsulfonyl group, iso-butylsulfonyl Group, sec-butylsulfonyl group, t-butylsulfonyl group, n-pentylsulfonyl group, n-hexylsulfonyl group, cyclohexylsulfonyl group, n-heptylsulfonyl group, n-octylsulfonyl group, 2-ethylhexylsulfonyl group, etc.
  • Examples include, but are not limited to, linear, branched, or cyclic alkylsulfonyl groups.
  • Examples of the optionally substituted arylsulfonyl group having 6 to 20 carbon atoms include, but are not limited to, a phenylsulfonyl group and a naphthylsulfonyl group.
  • Examples of the aralkylsulfonyl group which may be substituted include a benzylsulfonyl group, a phenethylsulfonyl group, a diphenylmethylsulfonyl group, and the like, but are not limited thereto.
  • Examples of the optionally substituted acyl group having 1 to 20 carbon atoms include methylcarbonyl group, ethylcarbonyl group, n-propylcarbonyl group, iso-propylcarbonyl group, n-butylcarbonyl group, iso-butylcarbonyl group, straight-chain such as sec-butylcarbonyl group, t-butylcarbonyl group, n-pentylcarbonyl group, n-hexylcarbonyl group, cyclohexylcarbonyl group, n-heptylcarbonyl group, n-octylcarbonyl group, 2-ethylhexylcarbonyl group, Examples include, but are not limited to, branched or cyclic alkylcarbonyl groups, arylcarbonyl groups such as benzylcarbonyl groups and phenylcarbonyl groups, and aralkylcarbonyl groups such as benzoyl groups.
  • Examples of the optionally substituted alkoxycarbonyl group having 2 to 20 carbon atoms include methoxycarbonyl group, ethoxycarbonyl group, n-propyloxycarbonyl group, iso-propyloxycarbonyl group, n-butyloxycarbonyl group, iso -Butyloxycarbonyl group, sec-butyloxycarbonyl group, t-butyloxycarbonyl group, n-pentyloxycarbonyl group, n-hexyloxycarbonyl group, cyclohexyloxycarbonyl group, n-heptyloxycarbonyl group, n-octyloxy Examples thereof include, but are not limited to, a carbonyl group and a 2-ethylhexyloxycarbonyl group.
  • Examples of the optionally substituted aryloxycarbonyl group having 7 to 20 carbon atoms include, but are not limited to, phenoxycarbonyl and naphthylcarbonyl groups.
  • Examples of the optionally substituted aralkyloxycarbonyl group having 8 to 20 carbon atoms include benzyloxycarbonyl group, phenethyloxycarbonyl group, diphenylmethyloxycarbonyl group and the like, but are not limited thereto. .
  • Examples of the optionally substituted alkylcarbonyloxy group having 2 to 20 carbon atoms include acetyloxy group, ethylcarbonyloxy group, n-propylcarbonyloxy group, iso-propylcarbonyloxy group, n-butylcarbonyloxy group , Iso-butylcarbonyloxy group, sec-butylcarbonyloxy group, t-butylcarbonyloxy group, n-pentylcarbonyloxy group, n-hexylcarbonyloxy group, cyclohexylcarbonyloxy group, n-heptylcarbonyloxy group, 3- A heptyl carbonyloxy group, an n-octyl carbonyloxy group, etc.
  • the arylcarbonyloxy group having 7 to 20 carbon atoms which may be substituted includes a benzoyloxy group, but is not limited thereto.
  • Examples of the aralkylcarbonyloxy group having 8 to 20 carbon atoms which may be substituted include, but are not limited to, a benzylcarbonyloxy group.
  • Examples of the optionally substituted heterocyclic group having 2 to 20 carbon atoms include, but are not limited to, a pyrrole group, an imidazole group, a piperidine group, and a morpholine group.
  • the alkyl group, alkoxy group, aryl group, aryloxy group, aralkyl group, aralkyloxy group, alkylthio group, arylthio group, aralkylthio group, alkylsulfonyl group of the functional groups A 1 to A 16 An arylsulfonyl group, an aralkylsulfonyl group, an acyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, an aralkyloxycarbonyl group, an alkylcarbonyloxy group, an arylcarbonyloxy group, an aralkylcarbonyloxy group or a heterocyclic group
  • substituents present in these functional groups A 1 to A 16 for example, halogen atoms, acyl groups, alkyl groups, phenyl groups, alkoxy groups, halogenated alkyl groups, halogenated alkoxy groups, nitro
  • the substituents on the optionally substituted amino group, the optionally substituted aminosulfonyl group, and the optionally substituted aminocarbonyl group of the functional groups A 1 to A 16 are as follows: Hydrogen atom; linear, branched or cyclic such as methyl group, ethyl group, n-propyl group, n-butyl group, sec-butyl group, n-pentyl group, n-hexyl group, 2-ethylhexyl group, cyclohexyl group, etc.
  • Alkyl group aryl group such as phenyl group and naphthyl group; aralkyl group such as benzyl group and phenethyl group; acetyl group, ethylcarbonyl group, n-propylcarbonyl group, iso-propylcarbonyl group, n-butylcarbonyl group, iso- Butylcarbonyl group, sec-butylcarbonyl group, t-butylcarbonyl group, n-pentylcarbonyl group, n-hexyl Linear, branched or cyclic alkylcarbonyl groups such as carbonyl group, cyclohexylcarbonyl group, n-heptylcarbonyl group, 3-heptylcarbonyl group and n-octylcarbonyl group; arylcarbonyl groups such as benzoyl group and naphthylcarbonyl group; benzyl Examples thereof include, but are not limited
  • substituents may be present in the number of 0, 1 or 2, and when 2 are present, they may be the same or different from each other, and even in the same type, they may be the same or different. Also good. Moreover, when there are two substituents, the substituents may be connected via a linking group.
  • Examples of the divalent metal as the metal M 1 include Cu (II), Co (II), Zn (II), Fe (II), Ni (II), Ru (II), and Rh (II). , Pd (II), Pt (II), Mn (II), Mg (II), Ti (II), Be (II), Ca (II), Ba (II), Cd (II), Hg (II) , Pb (II), Sn (II) and the like, but are not limited thereto.
  • Examples of trivalent substituted metal atoms include Al—F, Al—Cl, Al—Br, Al—I, Fe—Cl, Ga—F, Ga—Cl, Ga—I, Ga—Br, and In—F.
  • Examples of tetravalent substituted metal atoms include CrCl 2 , SiF 2 , SiCl 2 , SiBr 2 , SiI 2 , ZrCl 2 , GeF 2 , GeCl 2 , GeBr 2 , GeI 2 , SnF 2 , SnCl 2 , SnBr 2 , TiF 2 , TiCl 2 , TiBr 2 , Ge (OH) 2 , Mn (OH) 2 , Si (OH) 2 , Sn (OH) 2 , Zr (OH) 2 , Cr (R 1 ) 2 , Ge (R 1 ) 2 , Si (R 1 ) 2 , Sn (R 1 ) 2 , Ti (R 1 ) 2 ⁇ R 1 represents an alkyl group, a phenyl group, a naphthyl group, or a derivative thereof ⁇ Cr (OR 2 ) 2 , Ge (OR 2) 2, Si (OR 2) 2, Sn (OR 2) 2, Ti (OR 2) 2,
  • B 1 to B 24 represent functional groups.
  • Each of B 1 to B 24 is any of the functional groups represented by A 1 to A 16 in the above formula (a).
  • the functional groups of B 1 to B 24 may be the same type or different types, and may be the same or different in the same type, and the functional groups may be linked via a linking group.
  • M 2 represents two hydrogen atoms, a divalent metal atom, a trivalent substituted metal atom, a tetravalent substituted metal atom, or an oxy metal.
  • Examples of M 2 are the same as the examples of M 1 in the above formula (a), but are not limited thereto.
  • EEX COLOR IR-10A trade names EEX COLOR IR-12, EEX COLOR IR-14, EEX COLOR IR-906, EEX COLOR IR-910, TX-EX-820 And TX-EX-915 (both manufactured by Nippon Shokubai).
  • a cyanine dye may be used in combination as a near infrared absorbing dye.
  • the cyanine dye is not particularly limited as long as it has an excellent near-infrared absorbing ability, but a salt composed of an indolium cation or a benzothiazolium cation and a counter anion can be preferably used.
  • a salt composed of an indolium cation or a benzothiazolium cation and a counter anion can be preferably used.
  • the indolium cation or benzothiazolium cation cations represented by the above formulas (a) to (i) can be preferably used, but are not limited thereto.
  • the counter anion of the indolium cation or benzothiazolium cation is not particularly limited, and chloride ion, bromide ion, iodide ion, perchlorate ion, nitrate ion, benzenesulfonate ion, p-toluenesulfonic acid Ion, methyl sulfate ion, ethyl sulfate ion, propyl sulfate ion, tetrafluoroborate ion, tetraphenylborate ion, hexafluorophosphate ion, benzenesulfinate ion, acetate ion, trifluoroacetate ion, propionate ion, benzoic acid Acid ion, oxalate ion, succinate ion, malonate ion, oleate ion, stearate ion,
  • ADS812MI counter anion is an iodide ion
  • ADS780MT Counter anion is an iodide ion
  • AS0712 S0712 manufactured by FEW Chemical Co.
  • Counter anion is hexafluorophosphate ion
  • S0726 manufactured by FEW Chemical Co.
  • Counter anion is chloride ion
  • ADS780MT As cyanine-based dye containing a cation represented by the above general formula (d), ADS780MT manufactured by American Dye Source Co.
  • the blending amount of the diimonium dye of the present invention, or the total blending amount of the diimonium dye of the present invention and other near-infrared absorbing dyes can be appropriately selected depending on the type and use of the dye.
  • the blending amount is preferably set to 0. 0 relative to the total mass of all solids contained in the near-infrared absorbing pressure-sensitive adhesive composition.
  • the content is from 01 to 10% by mass, and more preferably from 0.1 to 5% by mass.
  • the total amount of these dyes is preferably 0.01 to 10% by mass, more preferably 0.1%, based on the solid content of the resin. ⁇ 5% by mass. If the blending amount is less than 0.01% by mass, there is a possibility that sufficient near infrared absorption ability cannot be achieved. Conversely, when it exceeds 10 mass%, the effect corresponding to addition cannot be acquired and it is not economical, and conversely, transparency in the visible region may be impaired.
  • the amount of the diimonium salt is preferably 0.5% by mass or more, more preferably 1.0% by mass or more, with respect to the total mass of all the solids contained in the near-infrared absorbing adhesive composition. 0.5% by mass or more is more preferable, 2.0% by mass or more is more preferable, 2.9% by mass or more is further preferable, and 4.7% by mass or more is particularly preferable.
  • the near-infrared absorbing adhesive composition of the present invention is characterized by transparency in the visible region, durability of near-infrared absorbing ability, and good adhesiveness.
  • a dye that absorbs visible light may be added to the near-infrared absorbing adhesive composition of the present invention.
  • dyes that absorb visible light include cyanine, phthalocyanine, naphthalocyanine, porphyrin, tetraazaporphyrin, metal dithiol complex, squarylium, azurenium, diphenylmethane, triphenylmethane, oxazine, and azine.
  • dye such as a system and a diketopyrrolopyrrole type
  • the near-infrared absorbing adhesive composition of the present invention is used as an optical filter for PDP, it is preferable to use a visible absorbing dye having a maximum absorption wavelength of 550 to 650 nm in order to absorb unnecessary neon light emission.
  • the type of the dye that absorbs neon light emission is not particularly limited, and a cyanine dye and a tetraazaporphyrin dye can be used.
  • Adeka Arcles TY-102 Adeka Arcles TY-14 (Asahi Denka Kogyo Co., Ltd.), Adeka Arcles TY-15 (Asahi Denka Kogyo Co., Ltd.), TAP-2 ( Yamada Chemical Industries), TAP-18 (Yamada Chemical Industries), TAP-45 (Yamada Chemical Industries), NK-5451 (Hayashibara Biochemical Laboratories), NK-5532 (Hayashibara Biochemical Laboratories) ), NK-5450 (produced by Hayashibara Biochemical Laboratories), and the like.
  • the addition amount of the dye for absorbing neon emission varies depending on the kind of the dye, but it is preferable to add so that the transmittance at the maximum absorption wavelength is about 20 to 80%.
  • a visible light absorbing dye for toning may be added.
  • coloring pigment 1: 2 chromium complex, 1: 2 cobalt complex, copper phthalocyanine, anthraquinone, diketopyrrolopyrrole, and the like can be used.
  • Orazol Blue GN (manufactured by Ciba Specialty Chemicals), Orazol Blue BL (manufactured by Ciba Specialty Chemicals), Orazol Red 2B (manufactured by Ciba Specialty Chemicals), Orazol Red G (Ciba) ⁇ Specialty Chemicals), Orazole Black CN (Ciba Specialty Chemicals), Orasol Yellow 2GLN (Ciba Specialty Chemicals), Orazole Yellow 2RLN (Ciba Specialty Chemicals), Microlith DPP Red BK (manufactured by Ciba Specialty Chemicals) and the like.
  • the near-infrared absorbing pressure-sensitive adhesive composition of the present invention may contain one or more diluents, additives, and curing agents as long as the performance is not lost.
  • the near-infrared absorbing pressure-sensitive adhesive composition of the present invention is preferably a first step in which a mixture (M1) is prepared by mixing a diimonium salt and a solvent (Sm), and this mixture (M1). Is manufactured by a manufacturing method including a second step of mixing with resin (B).
  • a resin composition (P) containing the resin (B) and the solvent (S2) is prepared, and the mixture (M1) is added to the resin composition (P). ) May be mixed.
  • a near-infrared absorbing material as a coating film can be obtained by applying a near-infrared-absorbing pressure-sensitive adhesive composition containing the mixture (M1) and the resin composition (P) to a transparent substrate described later. it can.
  • this resin composition ( 30 mass% or more is preferable and the compounding quantity of resin (B) in P) has more preferable 45 mass% or more.
  • the compounding quantity of this resin (B) is represented by the ratio of the mass of the non volatile matter of this resin composition (P) with respect to the mass of the resin composition (P).
  • a near-infrared absorbing pressure-sensitive adhesive composition containing a high amount of diimonium salt can be obtained.
  • the improved dispersion state of the dimonium salt and the excellent near-infrared absorbing ability of the dimonium salt were stably maintained.
  • the use of the near-infrared absorbing pressure-sensitive adhesive composition having a high blending amount of the diimonium salt can achieve thinning of the coating film formed from the near-infrared absorbing pressure-sensitive adhesive composition.
  • the resin (B) in this resin composition (P) The blending amount is preferably set to a value higher than the value described above.
  • the amount of the resin (B) in the resin composition (P) is preferably 50% by mass or more, more preferably 55% by mass or more, further preferably 60% by mass or more, and particularly preferably 65% by mass or more. preferable.
  • the blending amount of the resin (B) in the resin composition (P) is preferably 80% by mass or less.
  • the dilution solvent that can be contained in the near-infrared absorbing adhesive composition is not limited, and those exemplified as the solvent (S2) or the solvent (S4) are preferable.
  • the viscosity of the near-infrared absorbing pressure-sensitive adhesive composition is appropriately selected depending on the type of the coating machine, but in the case of coating by a small-diameter gravure kiss reverse method such as a micro gravure coater, 1 to 1000 mPa ⁇ In the case of coating by an extrusion method such as s or a die coater, 100 to 10,000 mPa ⁇ s is generally used.
  • the solid content of the near-infrared absorbing adhesive composition is adjusted according to the viscosity of the paint.
  • additives that are used in resin compositions that form films, coating films, and the like can be used.
  • additives include dispersants, leveling agents, antifoaming agents, viscosity modifiers, matting agents, tackifiers, antistatic agents, antioxidants, UV absorbers, light stabilizers, quenchers, curing agents, A blocking agent etc. are mentioned.
  • an isocyanate compound, a thiol compound, an epoxy compound, an amine compound, an imine compound, an oxazoline compound, a silane coupling agent, a UV curing agent, and the like can be used as the curing agent.
  • the near-infrared absorbing adhesive composition of the present invention is a near-infrared absorbing material for optical, agricultural, architectural or vehicle use, an image recording material such as photosensitive paper, an information recording material such as an optical disc, and a dye-sensitized type. It can be used for a solar cell such as a solar cell, a photosensitive material using a semiconductor laser beam or the like as a light source, and an eye strain prevention material.
  • the near infrared absorbing pressure-sensitive adhesive composition of the present invention is particularly preferably used in the form of a film or a sheet.
  • the blending amount of the dimonium salt contained in the near-infrared absorbing adhesive composition of the present invention is preferably 0.4% by mass or more from the viewpoint of near-infrared absorbing ability. From the viewpoint that the improved dispersion state of the dimonium salt and the excellent near-infrared absorptivity of the dimonium salt can be stably maintained even when the near-infrared absorbing adhesive composition is stored for a long period of time, the blending amount of the dimonium salt Is preferably 0.5% by mass or more.
  • the blending amount of the diimonium salt is more preferably 1.0% by mass or more, further preferably 1.5% by mass or more, and 1.9% by mass or more. Particularly preferred. From an economical viewpoint, the blending amount of the diimonium salt is preferably 50% by mass or less, and more preferably 30% by mass or less.
  • the temperature of the near-infrared absorbing adhesive composition during storage or transport is not limited. This temperature is preferably 40 ° C. or lower, more preferably 30 ° C. or lower, and further preferably 25 ° C. or lower, from the viewpoint of suppressing deterioration of near-infrared absorption ability and suppressing deterioration of the diimonium salt.
  • This temperature is preferably 40 ° C. or lower, more preferably 30 ° C. or lower, and further preferably 25 ° C. or lower, from the viewpoint of suppressing deterioration of near-infrared absorption ability and suppressing deterioration of the diimonium salt.
  • the amount of the dimonium salt is increased, the disadvantage caused by the high storage temperature is effectively suppressed.
  • the maximum temperature Tmax in the transfer is preferably 40 ° C. or higher, more preferably 45 ° C. or higher, and still more preferably 50 ° C. or higher. In this case, for example, refrigeration may be unnecessary for storage or transport in summer. From the viewpoint of suppressing deterioration of near infrared absorption ability, the maximum temperature Tmax is preferably 80 ° C. or lower, and more preferably 70 ° C. or lower.
  • the minimum temperature Tmin during storage or transfer is preferably 30 ° C. or more, and 35 More preferably, it is 40 degreeC or more, It is more preferable that it is 45 degreeC or more, It is further more preferable that it is 50 degreeC or more.
  • the maximum temperature Tmax means the maximum temperature during the entire storage or transfer period.
  • T1 ° C. to T2 ° C. (T1 ⁇ T2) the temperature of the diimonium dye-containing composition changes in the range of T1 ° C. to T2 ° C. (T1 ⁇ T2) during the entire storage or transfer period.
  • Tmax the temperature T2.
  • the blending ratio Rp is preferably in the above-described range.
  • the above minimum temperature Tmin means the minimum temperature during the entire period of storage or transfer.
  • the minimum temperature Tmin is the temperature T1.
  • the near-infrared absorbing material according to the present invention includes the near-infrared absorbing adhesive composition.
  • the near-infrared absorbing material of the present invention may be a film obtained by forming the near-infrared absorbing adhesive composition into a film, and a coating film containing the near-infrared absorbing adhesive composition is laminated on a transparent substrate. It may be what you did.
  • the transparent substrate is generally usable as an optical material and is not particularly limited as long as it is substantially transparent.
  • Specific examples include glass; olefin polymers such as cyclopolyolefin and amorphous polyolefin; methacrylic polymers such as polymethyl methacrylate; vinyl polymers such as vinyl acetate and vinyl halides; polyesters such as PET; polycarbonate and butyral.
  • examples thereof include polyvinyl acetals such as resins; polyaryl ether resins; lactone ring-containing resin films.
  • the transparent substrate is subjected to surface treatment by a conventionally known method such as corona discharge treatment, flame treatment, plasma treatment, glow discharge treatment, roughening treatment, chemical treatment, and coating such as an anchor coating agent and a primer. May be applied.
  • the base resin constituting the transparent base material can be blended with known additives, heat aging inhibitors, lubricants, antistatic agents, and the like.
  • the transparent substrate is formed into a film or a sheet using a known method such as injection molding, T-die molding, calendar molding, compression molding, or a method of casting by melting in an organic solvent.
  • the base material constituting the transparent base material may be unstretched or stretched, and may be laminated with another base material.
  • a PET film As a transparent substrate for obtaining a near infrared ray absorbing film by a coating method, a PET film is preferable, and a PET film subjected to an easy adhesion treatment is particularly preferable.
  • a PET film As a transparent substrate for obtaining a near infrared ray absorbing film by a coating method, a PET film is preferable, and a PET film subjected to an easy adhesion treatment is particularly preferable.
  • Cosmo Shine A4300 manufactured by Toyobo
  • Lumirror U34 manufactured by Toray
  • Melinex 705 manufactured by Teijin DuPont
  • Functional films such as a TAC (triacetylcellulose) film, an antireflection film, an antiglare film, an impact absorbing film, an electromagnetic wave shielding film, and an ultraviolet absorbing film can also be used as the transparent substrate.
  • TAC triacetylcellulose
  • the transparent substrate is preferably a film.
  • glass PET film, lactone ring-containing resin film, easy-adhesive PET film, TAC film, antireflection film and electromagnetic wave shielding film are preferably used as the transparent substrate.
  • an inorganic base material such as glass is used as the transparent base material, a material having a small alkali component is preferable from the viewpoint of durability of the near-infrared absorbing dye.
  • the thickness of the near-infrared absorbing material of the present invention is generally about 0.1 ⁇ m to 10 mm, but is appropriately determined according to the purpose. Further, the content of the near-infrared absorbing dye contained in the near-infrared absorbing material is also appropriately determined according to the purpose.
  • the method for producing the near-infrared absorbing material of the present invention is not particularly limited.
  • the following method can be used.
  • III a method of coating the near-infrared absorbing adhesive composition according to the present invention on the transparent substrate, etc. It is.
  • the near-infrared absorbing pressure-sensitive adhesive composition according to the present invention is usually used as a resin powder or pellet. Examples thereof include a method of adding, heating to 150 to 350 ° C. and dissolving, followed by molding to produce a resin plate, and a method of forming a film (resin plate) with an extruder.
  • the near-infrared absorbing pressure-sensitive adhesive composition according to the present invention and a monomer or oligomer are cast polymerized in the presence of a polymerization catalyst, and the mixture is injected into a mold and reacted to be cured. Or by pouring into a mold and solidifying until a hard product is formed in the mold.
  • Many resins can be molded in this process. Specific examples of such resins include acrylic resins, diethylene glycol bis (allyl carbonate) resins, epoxy resins, phenol-formaldehyde resins, polystyrene resins, silicon resins, and the like.
  • the casting method by bulk polymerization of methyl methacrylate which can obtain an acrylic sheet excellent in hardness, heat resistance, and chemical resistance, is preferable.
  • known radical thermal polymerization initiators can be used, and examples thereof include peroxides such as benzoyl peroxide, p-chlorobenzoyl peroxide, diisopropyl peroxycarbonate, and azo compounds such as azobisisobutyronitrile. .
  • the amount used is generally 0.01 to 5% by mass relative to the total amount of the mixture.
  • the heating temperature in the thermal polymerization is generally 40 to 200 ° C., and the polymerization time is generally about 30 minutes to 8 hours.
  • a method of photopolymerization by adding a photopolymerization initiator or a sensitizer can also be used.
  • a method of coating the near-infrared absorbing material of the present invention on a transparent substrate a paint in which the near-infrared absorbing adhesive composition of the present invention is fixed to fine particles, and the fine particles are dispersed are used. There is a method of coating on a transparent substrate.
  • a known coating machine When applying the near-infrared absorbing adhesive composition to the substrate, a known coating machine can be used. Examples thereof include knife coaters such as comma coaters, fountain coaters such as slot die coaters and lip coaters, kiss coaters such as micro gravure coaters, roll coaters such as gravure coaters and reverse roll coaters, flow coaters, spray coaters and bar coaters.
  • knife coaters such as comma coaters, fountain coaters such as slot die coaters and lip coaters, kiss coaters such as micro gravure coaters, roll coaters such as gravure coaters and reverse roll coaters, flow coaters, spray coaters and bar coaters.
  • the substrate Prior to coating, the substrate may be surface treated by a known method such as corona discharge treatment or plasma treatment.
  • a drying / curing method a known method such as hot air, far-infrared ray or UV curing can be used. You may wind up with a well-known protective film after drying and hardening.
  • the drying method is not particularly limited, and hot air drying or far infrared drying can be used.
  • the drying temperature may be determined in consideration of the length of the drying line, the line speed, the coating amount, the residual solvent amount, the type of substrate, and the like. If the substrate is a PET film, the general drying temperature is 50 to 150 ° C. When there are a plurality of dryers in one line, each dryer may be set to a different temperature and wind speed. In order to obtain a coating film having a good coating appearance, it is preferable that the drying condition on the inlet side is mild.
  • the near-infrared-absorbing pressure-sensitive adhesive composition of the present invention can be a constituent material of an excellent optical filter having high transparency in the visible region and high near-infrared absorption ability.
  • the near-infrared absorbing pressure-sensitive adhesive composition of the present invention has higher durability, especially heat resistance and light resistance than conventional near-infrared absorbing materials, so that appearance and near-infrared absorbing ability are maintained even during long-term storage and use.
  • the near-infrared absorbing adhesive composition of the present invention can be easily formed into a sheet or film, it is effective for thin displays and optical semiconductor elements.
  • the near-infrared absorbing adhesive composition of the present invention can also be used in filters and films that need to cut infrared rays, such as agricultural films, heat insulating films, sunglasses, optical recording materials, and the like.
  • Optical filter A suitable application of the near-infrared absorbing material is an optical filter.
  • This optical filter is formed using the near-infrared absorbing material.
  • This optical filter is suitable as an optical filter for an optical semiconductor element or an optical filter for a thin display.
  • Such an optical filter has a total light transmittance in the visible region of 40% or more, preferably 50% or more, more preferably 60% or more, and a transmittance of near infrared light having a wavelength of 800 to 1100 nm is preferably 30% or less. Is 15% or less, more preferably 5% or less.
  • the optical filter of the present invention includes an electromagnetic wave shielding layer, an antireflection layer, a glare prevention (antiglare) layer, a scratch prevention layer, and color adjustment.
  • a support such as a layer or glass may be provided.
  • each layer of the optical filter may be arbitrarily selected.
  • an optical filter that preferably combines at least one of an antireflection layer and an antiglare layer and at least two layers of a near-infrared absorbing layer is preferable, and more preferably at least 3 that further combines an electromagnetic wave shielding layer.
  • An optical filter having a layer is preferable.
  • the antireflection layer or the glare prevention layer is the outermost layer on the human side.
  • the stacking order between the near infrared absorbing layer and the electromagnetic wave shielding layer is arbitrary.
  • other layers such as a damage prevention layer, a color adjustment layer, a shock absorption layer, a support body, and a transparent base material, may be inserted between the three layers.
  • an antireflection layer or an antiglare layer on the outermost layer on the human side in order to make the optical filter for thin display easier to see the screen.
  • the antireflection layer is for suppressing reflection of the surface and preventing reflection of external light such as a fluorescent lamp on the surface.
  • the antireflection layer consists of a single layer of a resin with a different refractive index, such as an acrylic resin or a fluororesin, when it is made of an inorganic thin film such as a metal oxide, fluoride, silicide, boride, carbide, nitride, or sulfide.
  • it may be composed of multi-layers, and as a manufacturing method in the former case, there is a method of forming an antireflection coating on a transparent substrate in the form of a single layer or a multilayer using vapor deposition or sputtering. is there.
  • a knife coater such as a comma coater, a fountain coater such as a slot coater and a lip coater, a gravure coater, a flow coater, a spray coater, and a bar coater are used.
  • a bar coater such as a comma coater, a fountain coater such as a slot coater and a lip coater, a gravure coater, a flow coater, a spray coater, and a bar coater are used.
  • the glare-preventing layer is formed by converting fine powders of silica, melamine resin, acrylic resin, etc. into ink, applying it on any layer of the filter of the present invention by a conventionally known coating method, and curing it by heat or photocuring. Is done.
  • An antiglare-treated film may be attached on the filter.
  • the scratch-preventing layer is a coating solution prepared by dissolving or dispersing an acrylate such as urethane acrylate, epoxy acrylate or polyfunctional acrylate and a photopolymerization initiator in an organic solvent by a conventionally known coating method, and any of the filters of the present invention. On this layer, it is formed by coating, drying and photocuring.
  • An optical filter having an antireflection layer or an antiglare layer and a near infrared absorbing layer is provided with a layer made of the near infrared absorbing adhesive composition or the near infrared absorbing material of the present invention on the back surface of the antireflection film or the antiglare film. Obtained by laminating.
  • the near-infrared absorbing layer according to the present invention in the form of a film and the antireflection film or the anti-glare film may be directly bonded together, or the near-infrared absorbing adhesive composition of the present invention in solution may be used. You may apply
  • a near-infrared absorbing layer is provided on the back surface of the antireflection film or the antiglare film, it is preferable to use an ultraviolet absorbing film as a transparent substrate in order to suppress deterioration of the pigment due to ultraviolet rays.
  • the near infrared ray absorbing pressure-sensitive adhesive composition of the present invention has adhesiveness. Therefore, when the near-infrared absorbing layer and another layer are bonded, a pressure-sensitive adhesive or an adhesive may be unnecessary.
  • a near-infrared absorption layer is a layer containing the near-infrared absorption adhesive composition of this invention.
  • the plasma display optical filter is preferably provided with an electromagnetic wave shielding layer in order to remove electromagnetic waves generated from the panel.
  • the electromagnetic wave shielding layer is a film in which a metal mesh is patterned on a film by etching, printing, etc., or a film in which a metal is deposited on a fiber mesh and embedded in a resin. used. These films are called electromagnetic wave shielding films or electromagnetic wave shielding films.
  • An optical filter having two layers of a near-infrared absorbing layer and an electromagnetic wave shielding layer can be obtained by combining an electromagnetic wave prevention material and a near-infrared absorbing adhesive composition.
  • the film form of the near-infrared absorbing adhesive composition of the present invention and the electromagnetic wave shielding film may be laminated, or the solution of the near-infrared absorbing adhesive composition of the present invention is used as an electromagnetic wave shielding film. You may apply directly.
  • the near-infrared absorption adhesive composition of this invention can also be used.
  • the near-infrared absorption adhesive composition of this invention can also be used.
  • an optical filter having three layers of a near-infrared absorbing layer, a reflection or anti-glare layer and an electromagnetic wave shielding layer a near-infrared absorbing film comprising the near-infrared absorbing adhesive composition of the present invention, a reflection or anti-glare film, an electromagnetic wave A laminate of three shielding films can be used.
  • an optical filter having a structure in which a near-infrared absorbing film made of the near-infrared absorbing adhesive composition of the present invention is sandwiched between a reflection or glare-preventing film and an electromagnetic wave shielding film is preferable.
  • this optical filter is laminated
  • an optical filter in which a near-infrared absorbing layer is laminated on an electromagnetic wave shielding layer is formed by laminating a near-infrared absorbing adhesive composition on an electromagnetic wave shielding material capable of shielding electromagnetic waves.
  • the electromagnetic wave shielding layer may be formed so as to have electromagnetic wave shielding properties and image transparency, and the configuration, composition, and the like of the electromagnetic wave shielding layer are not particularly limited.
  • the electromagnetic wave shielding material that can constitute the electromagnetic wave shielding layer include a thin metal layer formed by vapor deposition, plating, etc. of a metal such as gold, copper, and aluminum, and a transparent conductive thin film containing a conductive substance. .
  • the metal layer is more preferably formed in a mesh shape (hereinafter referred to as a metal mesh layer) from the viewpoint of electromagnetic wave shielding properties and image transparency.
  • the electromagnetic wave shielding material that can constitute the electromagnetic wave shielding layer includes the above-described electromagnetic wave shielding film as a transparent substrate.
  • this electromagnetic wave shielding film uses a metal mesh patterned on the film by etching, printing, etc.
  • the metal mesh patterned on the film by etching, printing, etc. is the above-mentioned metal. Configure the mesh layer.
  • the metal mesh layer is brought into contact with the near infrared ray absorbing layer.
  • a metal mesh may be directly bonded to the near-infrared absorbing layer, and a metal mesh layer made of mesh may be formed on the near-infrared absorbing layer.
  • a metal mesh layer made of an etched plating layer may be formed on the near-infrared absorbing layer by plating the near-infrared absorbing layer with a metal such as copper and then etching it.
  • a metal mesh layer composed of a plating layer formed in a mesh shape is formed on the near-infrared absorbing layer. It may be formed. Further, an optical filter in which a metal mesh layer is laminated on the near-infrared absorbing layer by directly bonding the metal mesh layer to the near-infrared absorbing layer using an electromagnetic wave shielding film having a metal mesh layer formed on the front side. May be configured.
  • the thickness of the metal mesh layer is preferably 1 ⁇ m or more. The thickness of the metal mesh layer is preferably 10 ⁇ m or less from the viewpoint that narrowing of the viewing angle and deterioration of visibility can be prevented.
  • a near-infrared absorbing adhesive composition containing a resin (B) having an acid value of 0 to 35 is used. Is preferred. In this case, a good dispersion state of the dimonium salt can be maintained, deterioration of the dimonium salt can be suppressed, and discoloration of the dye, the metal layer, and the adhesive can be prevented. A filter can be obtained.
  • a preferable optical filter is an optical filter in which a near-infrared absorbing adhesive layer comprising the near-infrared absorbing adhesive composition of the present invention is bonded to a composite film including an electromagnetic wave shielding layer and a reflection or glare-preventing layer on a single film. It is.
  • the optical filter for thin display of the present invention may be installed away from the display device or may be directly attached to the display device.
  • an optical filter that does not use glass is preferable.
  • the present invention relating to a thin display is a thin display comprising the near-infrared absorbing adhesive composition of the present invention, the near-infrared absorbing material of the present invention, or the optical filter of the present invention.
  • a thin display in which an optical filter is directly bonded to the display body can provide clearer image quality.
  • the optical filter is directly attached, it is preferable to use tempered glass as the display glass or an optical filter provided with a shock absorbing layer.
  • Adhesives for attaching the above optical filter to the display device include rubbers such as styrene butadiene rubber, polyisoprene rubber, polyisobutylene rubber, natural rubber, neoprene rubber, chloroprene rubber, butyl rubber, methyl acrylate, polyacrylic acid.
  • rubbers such as styrene butadiene rubber, polyisoprene rubber, polyisobutylene rubber, natural rubber, neoprene rubber, chloroprene rubber, butyl rubber, methyl acrylate, polyacrylic acid.
  • examples thereof include polyacrylic acid alkyl esters such as ethyl acrylate and polybutyl acrylate, and these may be used alone, or further using a picolite, polyvale, rosin ester or the like added as a tackifier. Also good.
  • an adhesive having an impact absorbing ability can be used, but it is not limited to this. Without using an adhesive, the optical
  • this adhesive layer is usually 5 to 2000 ⁇ m, preferably 10 to 1000 ⁇ m.
  • a release film is provided on the surface of the pressure-sensitive adhesive layer, and this release film protects the pressure-sensitive adhesive layer and prevents dust from adhering to the pressure-sensitive adhesive layer until the optical filter is attached to the surface of the thin display. Also good.
  • a non-adhesive part is formed by forming a part where the adhesive layer is not provided or by sandwiching a non-adhesive film between the adhesive layer at the edge of the filter and the release film. If the part is a peeling start part, the work at the time of sticking is easy to perform.
  • the impact absorbing layer is for protecting the display device from external impacts. It is preferably used in an optical filter that does not use a support.
  • the shock absorbing material ethylene-vinyl acetate copolymer, acrylic polymer, polyvinyl chloride, urethane-based, silicon-based resin as disclosed in JP-A Nos. 2004-246365 and 2004-264416 are disclosed. However, it is not limited to these.
  • This ⁇ T is a value (%) obtained by subtracting the transmittance (%) before the heat test from the transmittance (%) after the heat test.
  • This ⁇ T is a change in transmittance at a wavelength of 1000 nm. This ⁇ T is shown in the following table.
  • This ⁇ T is a value (%) obtained by subtracting the transmittance (%) before the wet heat resistance test from the transmittance (%) after the heat resistance test.
  • This ⁇ T is a change in transmittance at a wavelength of 1000 nm. This ⁇ T is shown in the following table.
  • ⁇ max was determined based on the measurement results before the test. The evaluation results are shown in the following table. Further, ⁇ T was calculated based on the transmission spectra before and after the test. This ⁇ T is a value (%) obtained by subtracting the transmittance (%) before the light resistance test from the transmittance (%) after the light resistance test. This ⁇ T is a change in transmittance at a wavelength of 1000 nm. This ⁇ T is shown in the following table.
  • the dye residual ratio (%) was measured.
  • the absorbance at ⁇ max after the test is Ax (%) and the absorbance at ⁇ max before the test is Bx (%)
  • Synthesis example 1 [Synthesis of Diimonium Compound a1 and Production of Near-Infrared Absorbing Mixture 1]
  • DMF dimethylformamide
  • 6 parts of N, N, N ′, N′-tetrakis (p-di (iso-butyl) aminophenyl) -p-phenylenediamine was added and dissolved by heating at 60 ° C. Thereafter, 10.1 parts of a 58.4% aqueous solution of tris (trifluoromethylsulfonyl) methane was added.
  • 2.32 parts of silver nitrate dissolved in 35 parts of DMF was added and stirred with heating for 30 minutes.
  • This compound a1 is a dimonium salt in which R 1 to R 8 in the formula (2) are all iso-butyl groups and Z ⁇ in the formula (2) is [(CF 3 SO 2 ) 3 C ⁇ ]. It is.
  • the absorbance (X) of the compound a1 was 0.138 ( ⁇ max was 1096 nm) when the solvent was toluene, and 0.239 ( ⁇ max was 1081 nm) when the solvent was ethyl acetate.
  • the solubility (Y) of this compound a1 was measured, it was less than 0.01% by mass when the solvent was toluene, and less than 0.01% by mass when the solvent was ethyl acetate.
  • 0.5 parts of the above compound a1, 9.5 parts of ethyl acetate and 25 parts of zirconia beads are placed in a 70 ml mayonnaise bottle, shaken with a paint shaker for 4 hours, and then filtered to remove the zirconia beads to contain compound a1.
  • a near-infrared absorbing mixture 1 was obtained.
  • the zirconia beads were manufactured by Nikkato Co., Ltd., and the particle size was 300 ⁇ m.
  • Synthesis example 2 [Preparation of near-infrared absorbing mixture 2] A near-infrared absorbing mixture 2 was obtained in the same manner as in Synthesis Example 1 except that 9.5 parts of toluene was used instead of 9.5 parts of ethyl acetate.
  • the produced crystals were washed with methanol and dried to obtain 2.5 parts of a light brown crystalline compound.
  • 1 part of the above crystalline compound was added to 10 parts of DMF and heated to 60 ° C. to obtain a liquid A1 in which the crystalline compound was dissolved.
  • Liquid B1 obtained by dissolving 0.78 parts of silver hexafluoroantimonate in 10 parts of DMF was added to the liquid A1 and allowed to react for 30 minutes. After cooling, the precipitated silver was filtered off. To this reaction liquid (filtrate), 10 parts of water was slowly added dropwise, followed by stirring for 15 minutes.
  • This compound b1 is a dimonium salt in which R 1 to R 8 in the formula (2) are all iso-butyl groups and Z ⁇ in the formula (2) is [SbF 6 ⁇ ].
  • 0.5 parts of the above compound b1, 9.5 parts of ethyl acetate and 25 parts of zirconia beads are placed in a 70 ml mayonnaise bottle, shaken with a paint shaker for 4 hours, and then filtered to remove the zirconia beads to contain compound b1.
  • a near-infrared absorbing mixture 3 was obtained.
  • the zirconia beads were manufactured by Nikkato Co., Ltd., and the particle size was 300 ⁇ m.
  • Synthesis Example 4 [Preparation of near-infrared absorbing mixture 4] A near-infrared absorbing mixture 4 was obtained in the same manner as in Synthesis Example 2 except that the trade name “CIR-1085” (a diimonium dye manufactured by Nippon Carlit Co., Ltd.) was used instead of the compound a1.
  • CIR-1085 a diimonium dye manufactured by Nippon Carlit Co., Ltd.
  • R 1 to R 8 in the above formula (2) are all n-butyl groups and Z ⁇ in the above formula (2) is [(CF 3 SO 2 ) 2 N ⁇ ]. It is a certain dimonium salt.
  • Resin production example 1 As monomers, 360.6 g 2-ethylhexyl acrylate, 60 g butyl acrylate, 156 g cyclohexyl methacrylate, 18 g acrylic acid and 5.4 g hydroxyethyl acrylate were weighed and mixed thoroughly to obtain a polymerizable monomer mixture (1 )
  • the internal temperature of the flask was raised to 95 ° C., and a polymerization initiator, Niper BMT-K40 (0.15 g), was charged into the flask to initiate the polymerization reaction. 30 minutes after charging the polymerization initiator, the dropping of the dropping mixture (1) from the dropping funnel was started. The dropping mixture (1) was dropped evenly over 90 minutes. After completion of the dropwise addition of the mixture for dripping (1), the mixture was aged for 6 hours while maintaining the reflux temperature while appropriately diluting with ethyl acetate as the viscosity increased.
  • a polymerization initiator Niper BMT-K40 (0.15 g
  • the reaction solution is diluted with ethyl acetate so that the non-volatile content is about 45%, a resin having a calculated glass transition temperature (Tg) of ⁇ 38.5 ° C. and a calculated solubility parameter of 9.08.
  • Tg glass transition temperature
  • Mw weight average molecular weight
  • the acid value of the resin (1) was 23.4.
  • the reaction liquid diluted with ethyl acetate so that the non-volatile content is about 45% is also referred to as a resin composition P1.
  • Resin production example 2 As the monomer, 264.6 g of 2-ethylhexyl acrylate, 150 g of butyl acrylate, 180 g of cyclohexyl methacrylate and 5.4 g of hydroxyethyl acrylate were weighed and mixed thoroughly to obtain a polymerizable monomer mixture (2).
  • the calculated glass transition temperature (Tg) is ⁇ 35 ° C. and the calculated solubility is the same as in Resin Production Example 1 except that the polymerizable monomer mixture (2) is used in place of the polymerizable monomer mixture (1).
  • a resin (2) having a parameter of 8.99 was obtained.
  • This resin (2) was an adhesive resin.
  • the weight average molecular weight (Mw) of the resin (2) was 440,000, and the acid value of the resin (2) was 0.
  • Resin production example 3 As monomers, 365.4 g 2-ethylhexyl acrylate, 60 g butyl acrylate, 144 g cyclohexyl methacrylate, 30 g acrylic acid and 5.4 g hydroxyethyl acrylate were weighed and mixed thoroughly to obtain a polymerizable monomer mixture (3 ) A calculated glass transition temperature (Tg) of ⁇ 38.96 ° C. was calculated in the same manner as in Resin Production Example 1, except that this polymerizable monomer mixture (3) was used instead of the polymerizable monomer mixture (1). A resin (2) having a solubility parameter of 9.19 was obtained. This resin (2) was an adhesive resin. The weight average molecular weight (Mw) of the resin (2) was 470,000, and the acid value of the resin (2) was 39.96.
  • Mw weight average molecular weight
  • Example 1 Coronate L-55E (manufactured by Nippon Polyurethane Co., Ltd.) as a crosslinking agent was dissolved in an ethyl acetate solution to prepare a crosslinking agent solution 1 having a solid content of 2.75%.
  • the resin (1) obtained in Resin Production Example 1, the near-infrared absorbing mixture 1 obtained in Synthesis Example 1 and the crosslinking agent solution 1 are mixed so that the solid content weight ratio is 100/1 / 0.25. And it diluted with ethyl acetate as a dilution solvent so that solid content might be 25%, and near-infrared absorption adhesive composition A1 was obtained.
  • this solid content weight ratio is described in order of (resin (1) / near-infrared absorption mixture 1 / crosslinking agent solution 1).
  • the near-infrared absorbing pressure-sensitive adhesive composition A1 was coated on an easy-adhesion-treated PET film (manufactured by Toyobo Co., Ltd., Cosmo Shine A4300) with an applicator. The thickness at the time of coating was set so that the thickness of the pressure-sensitive adhesive composition layer after drying was 25 ⁇ m. Subsequently, it was dried in a hot air circulating oven at 100 ° C. for 2 minutes. A release film (silicone-treated PET film) was laminated to the layer made of the pressure-sensitive adhesive composition A1, and then cured at 23 ° C. for 7 days to obtain a near-infrared absorbing material B1.
  • this near-infrared absorbing material B1 was attached to a glass plate to obtain a test body according to Example 1.
  • the test body was subjected to a heat resistance test, a moist heat resistance test, and a light resistance test. The evaluation results are shown in the following table.
  • Example 2 A test body according to Example 2 was obtained in the same manner as in Example 1 except that the near-infrared absorbing mixture 2 was used in place of the near-infrared absorbing mixture 1 and the diluent solvent was changed from ethyl acetate to toluene. The test body was subjected to a heat resistance test, a moist heat resistance test, and a light resistance test. The evaluation results are shown in the following table.
  • Example 3 A test body according to Example 3 was obtained in the same manner as in Example 1 except that the near-infrared absorbing mixture 3 was used in place of the near-infrared absorbing mixture 1. The test body was subjected to a heat resistance test, a moist heat resistance test, and a light resistance test. The evaluation results are shown in the following table.
  • Example 4 A test body according to Example 4 was obtained in the same manner as Example 2 except that the resin (2) was used instead of the resin (1).
  • the test body was subjected to a heat resistance test, a moist heat resistance test, and a light resistance test. The evaluation results are shown in the following table.
  • Example 5 The test body according to Example 3 was obtained in the same manner as in Example 1 except that the resin (2) was used instead of the resin (1), and the near-infrared absorbing mixture 3 was used instead of the near-infrared absorbing mixture 1. Obtained. The test body was subjected to a heat resistance test, a moist heat resistance test, and a light resistance test. The evaluation results are shown in the following table.
  • Comparative Example 1 A test body according to Comparative Example 1 was obtained in the same manner as in Example 1 except that the near-infrared absorbing mixture 4 was used in place of the near-infrared absorbing mixture 1 and the diluent solvent was changed from ethyl acetate to toluene. The test body was subjected to a heat resistance test, a moist heat resistance test, and a light resistance test. The evaluation results are shown in the following table.
  • the transmission spectrum of the specimen of Example 2 before the test (initial stage) is shown in FIG.
  • the transmission spectrum after the heat resistance test of the test body of Example 2 is shown in FIG.
  • the transmission spectrum of the test body of Example 2 after the heat and humidity resistance test is shown in FIG.
  • the transmission spectrum of the test body of Example 2 after the light resistance test is shown in FIG.
  • the transmission spectrum of the test body of Comparative Example 1 before the test (initial stage) is shown in FIG.
  • the transmission spectrum after the heat resistance test of the test body of Comparative Example 1 is shown in FIG.
  • the transmission spectrum of the test body of Comparative Example 1 after the heat and humidity resistance test is shown in FIG.
  • the transmission spectrum after the light resistance test of the test body of Comparative Example 1 is shown in FIG.
  • Example 1a Synthesis of polymerizable polysiloxane (M-1) In a 300 ml four-necked flask equipped with a stirrer, a thermometer and a condenser tube, 144.5 parts of tetramethoxysilane, 23.6 parts of ⁇ -methacryloxypropyltrimethoxysilane, water 19.0 parts, 30.0 parts of methanol, and 5.0 parts of Amberlyst 15 (trade name: cation exchange resin manufactured by Organo) were added and stirred at 65 ° C. for 2 hours for reaction.
  • Amberlyst 15 trade name: cation exchange resin manufactured by Organo
  • the ratio of inorganic fine particles to organic polymer in the organic polymer composite inorganic fine particles was 70/30. This ratio is a weight ratio.
  • the average particle diameter of the obtained organic polymer composite inorganic fine particles was 23.9 nm.
  • the ratio of the inorganic fine particles to the organic polymer in the organic polymer composite inorganic fine particles was determined by conducting an elemental analysis on the organic polymer composite fine particle dispersion dried at 130 ° C. for 24 hours under a pressure of 1.33 ⁇ 10 kPa, and calculating the ash content. It calculated
  • the average particle size was determined by photographing particles with a transmission electron microscope using a solution obtained by diluting 1 part of the organic polymer composite inorganic fine particle dispersion (S-1) with 99 parts of n-butyl acetate. The diameter of the particles was read and the average was determined as the average particle diameter.
  • Antireflective film 8 parts of dipentaerythritol hexaacrylate (DPE-6A, manufactured by Kyoeisha Chemical Co., Ltd.) and 2 parts of pentaerythritol triacrylate (PE-3A, manufactured by Kyoeisha Chemical Co., Ltd.) were mixed and a solution dissolved in 40 parts of methyl ethyl ketone was prepared.
  • a photopolymerization initiator Irgacure 907, manufactured by Ciba Geigy Co., Ltd.
  • the hard coat layer coating solution was applied to a 188 ⁇ m thick polyethylene terephthalate film (Cosmo Shine A4300, manufactured by Toyobo Co., Ltd.) using a bar coater to obtain a coating layer h.
  • the coating layer h was dried at 100 ° C. for 15 minutes and then cured by irradiating with 200 mJ / cm 2 of ultraviolet light with a high-pressure mercury lamp to form a hard coat layer having a thickness of 5 ⁇ m.
  • the above low refractive index coating solution was applied using a bar coater to form an antireflection film on the polyethylene terephthalate film.
  • the surface opposite to the antireflection film side of the film was roughened with steel wool. Black ink was applied to the roughened surface.
  • the specular reflection spectrum of the surface on the antireflection film side at an incident angle of 5 ° is measured using an ultraviolet-visible spectrophotometer (UV-3100, manufactured by Shimadzu Corporation), and the wavelength at which the reflectance shows the minimum value and the reflectance at that wavelength. (Minimum reflectance) was determined.
  • UV-3100 ultraviolet-visible spectrophotometer
  • Minimum reflectance was 0.45%.
  • the near-infrared absorbing adhesive composition A1 obtained in Example 1 was coated and dried on the back side of the antireflection film in the same manner as in Example 1 to obtain an optical filter 1.
  • the near-infrared transmittance, total light transmittance, heat resistance, moist heat resistance, light resistance, crack resistance and solvent resistance of the optical filter 1 were good.
  • Example 6 Example 1 except that a phthalocyanine-based compound (trade name “EEX Color IR-14” manufactured by Nippon Shokubai Co., Ltd.) was added in an amount of 0.3 part by weight with respect to 100 parts of resin (1).
  • a test body according to Example 6 was obtained. The test body was subjected to a heat resistance test, a moist heat resistance test, and a light resistance test. The evaluation results are shown in Table 5 below together with the results of Example 1 described above.
  • Example 7 After peeling off the release film from the near-infrared absorbing layer made of the pressure-sensitive adhesive composition A1 obtained in the same manner as in Example 1, this near-infrared absorbing layer was used as a copper foil of an electromagnetic wave shielding film (Dai Nippon Printing Co., Ltd.).
  • the test body according to Example 7 was obtained by sticking to a mesh surface (hereinafter referred to as a metal mesh layer) and performing an autoclave treatment (treatment temperature: 60 ° C., treatment pressure: 4 atm, treatment time: 30 minutes). The test body was subjected to a heat resistance test, a moist heat resistance test, and a light resistance test. The evaluation results are shown in Table 5 below.
  • This metal mesh layer is formed by etching a plated layer made of copper.
  • the pressure-sensitive adhesive composition is laminated on the metal mesh layer.
  • this electromagnetic wave shielding film is displayed as a mesh.
  • Example 8 Resin (1) is replaced with resin (3), and a phthalocyanine compound (trade name “EEX Color IR-14” manufactured by Nippon Shokubai Co., Ltd.) is 0.3 parts by weight with respect to 100 parts of resin (3).
  • the test body which concerns on Example 8 was obtained like Example 1 except having added so that it might become.
  • the test body was subjected to a heat resistance test, a moist heat resistance test, and a light resistance test. The evaluation results are shown in Table 5 below.
  • Example 9 Resin (1) is replaced with resin (3), and the glass plate of the test specimen is replaced with the electromagnetic wave shielding film used in Example 7, and autoclave treatment (treatment temperature: 60 ° C., treatment pressure: 4 atm, treatment time: 30 minutes)
  • the test body according to Example 9 was obtained in the same manner as in Example 1 except that.
  • the test body was subjected to a heat resistance test, a moist heat resistance test, and a light resistance test.
  • the evaluation results are shown in Table 5 below.
  • the pressure-sensitive adhesive composition containing the resin (3) is laminated on the metal mesh layer of the electromagnetic wave shielding film.
  • Resin production example 4 A polymerization reaction was carried out in the same manner as in Resin Production Example 1. Only the dilution ratio after completion of the reaction was changed. After completion of the reaction, a resin composition P2 was obtained in the same manner as in Resin Production Example 1 except that the reaction solution was diluted with ethyl acetate so that the nonvolatile content was about 65%.
  • Example 10 The near-infrared absorbing mixture 3 obtained in Synthesis Example 3 and the resin composition P1 obtained in Resin Production Example 1 were used.
  • the near-infrared absorbing mixture 3 and the resin composition P1 are mixed at a solid weight ratio of 1: 100 (100 parts by mass of the resin composition P1 solids with respect to 1 part by mass of the mixture 3 solids). And it diluted with ethyl acetate so that solid content might be 40 mass%, and near-infrared absorption adhesive composition B1 was obtained.
  • 0.5 kg of near-infrared absorbing adhesive composition B1 is placed in a laminate can A (trade name “Hybrid 1.3L can”; manufactured by Dainippon Steel Co., Ltd.), sealed, and kept at 25 ° C. Stored in. There were three types of storage periods: 7 days, 14 days and 28 days. Each of the near-infrared absorbing adhesive compositions B1 after 7 days, 14 days and 28 days was evaluated. These evaluation results are shown in Table 6 below.
  • specimens were prepared for each of the near-infrared absorbing adhesive compositions B1 after 7 days, 14 days, and 28 days.
  • the preparation method of this test body is as follows.
  • the said near-infrared absorption adhesive composition B1 after storage period progress was diluted with ethyl acetate so that solid content might be 25 mass%, and the liquid for adhesive tests was obtained.
  • this pressure-sensitive adhesive test liquid was applied onto an easy-adhesion-treated PET film (Toyobo Co., Ltd., Cosmo Shine A4300).
  • the thickness at the time of coating was set so that the thickness of the coating layer after drying was 25 ⁇ m. Subsequently, it was dried in a hot air circulating oven at 100 ° C.
  • test bodies were created. These three types of test bodies are a test body related to the pressure-sensitive adhesive composition B1 after 7 days, a test body related to the pressure-sensitive adhesive composition B1 after 14 days, and a test body related to the pressure-sensitive adhesive composition B1 after 28 days. It is. These specimens were evaluated for retention of near infrared absorption ability. The evaluation results are shown in Table 6 below.
  • Example 11 and 12 Evaluations were made in the same manner as in Example 10 except for the specifications shown in Table 6. The specifications and evaluation results of these examples are shown in Table 6 below.
  • Example 13 The near-infrared absorbing mixture 3 obtained in Synthesis Example 3 and the resin composition P2 obtained in Resin Production Example 4 were used.
  • the near-infrared absorbing mixture 3 and the resin composition P2 are mixed at a solid weight ratio of 5: 100 (100 parts by mass of the resin composition P2 solids with respect to 5 parts by mass of the mixture 3 solids).
  • 0.5 kg of near-infrared absorbing adhesive composition B2 was put in a coating can (trade name “T40 Tsuanisu No. 30 Crown Can”), sealed, and stored in a thermostatic chamber at 25 ° C.
  • Each of the near-infrared absorbing pressure-sensitive adhesive composition B2 after 7 days, 14 days and 28 days was evaluated. These evaluation results are shown in Table 6 below.
  • Example 14 was evaluated in the same manner as Example 13 except that the storage temperature was changed from 25 ° C to 40 ° C. The evaluation results are shown in Table 6 below.
  • Example 15 The coating can was changed to a laminate can A (trade name “Hybrid 1.3L can”; manufactured by Dainippon Steel Co., Ltd.), and the storage temperature was changed from 25 ° C. to 50 ° C., as in Example 13. Thus, Example 15 was evaluated. The evaluation results are shown in Table 6 below.
  • Example 16 The near-infrared absorbing mixture 3 obtained in Synthesis Example 3 and the resin composition P2 obtained in Resin Production Example 4 were used.
  • the near-infrared absorbing mixture 3 and the resin composition P2 are mixed at a solid weight ratio of 3: 100 (100 parts by mass of the resin composition P2 solids with respect to 3 parts by mass of the mixture 3 solids). And it diluted with ethyl acetate so that solid content might be 40 mass%, and near-infrared absorption adhesive composition B3 was obtained.
  • 0.5 kg of near-infrared absorbing adhesive composition B3 is placed in a laminate can A (trade name “Hybrid 1.3L can”; manufactured by Dainippon Steel Co., Ltd.), sealed and sealed at a constant temperature room of 50 ° C. Stored in. There were three types of storage periods: 7 days, 14 days and 28 days. Each of the near-infrared absorbing pressure-sensitive adhesive composition B3 after 7 days, 14 days and 28 days was evaluated. These evaluation results are shown in Table 6 below.
  • Table 7 below shows a list of storage hollow bodies (containers) used in the examples.
  • modified polyolefin is used for the innermost layer of the main body of the laminate can A (trade name “hybrid 1.3 L can”).
  • the material of the inner layer of the coating can (trade name “T40 Tsuyanisu No. 30 Crown Can”) is an epoxy resin. This inner layer epoxy resin is baked on the main body.
  • Example 13 the concentration of dimonium dye is higher than that in Example 11. This Example 13 is more highly rated than Example 11.
  • the storage temperature is higher than that in Example 13. Even when the storage temperature is raised to 40 ° C., Example 14 is more highly rated than Example 11.
  • Example 15 The storage temperature of Example 15 is 50 ° C. as in Example 12. In Example 15, compared with Example 12, the concentration of the diimonium dye is high. This Example 15 has a higher evaluation than the Example 12. Also in Example 16, the storage temperature is 50 ° C. This Example 16 is highly evaluated compared to the Example 12. Compared with Example 15, Example 16 has a low evaluation.
  • the near-infrared-absorbing pressure-sensitive adhesive composition of the present invention is useful as an optical filter for, for example, a thin display because it has a high near-infrared-absorbing ability and high transparency in the visible region, and is excellent in heat resistance, moist heat resistance and light resistance. It is. It can also be used as an optical information recording material.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Optical Filters (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention a pour objet une composition adhésive pouvant absorber les rayons du proche infrarouge comprenant un sel de diimonium (A1), une résine (B) ayant un point de transition vitreuse calculé de 0 °C ou inférieur, et un solvant (S2). Le sel de diimonium (A1) est mélangé avec un solvant (S1) selon un rapport de 0,01 % en masse du sel de diimonium (A1) par rapport à la quantité du solvant (S1) pour préparer une solution mélangée. Une onde ultrasonore est appliquée à la solution mélangée pendant 30 minutes, la solution mélangée est laissée au repos pendant 1 heure ou plus longtemps, et par la suite un surnageant de la solution mélangée est placé dans une cellule ayant une longueur de chemin optique de 1 mm. L'absorbance (X) du surnageant mesurée sur un spectrophotomètre dans l'ultraviolet et le visible à une longueur d'onde (?max) allant de 350 à 1 500 nm inclus est de 0,5 ou moins. De préférence, le solvant (S1) est du toluène et/ou de l'acétate d'éthyle. De préférence, le solvant (S2) est du toluène et/ou de l'acétate d'éthyle.
PCT/JP2010/002722 2009-04-14 2010-04-14 Composition adhésive pouvant absorber les rayons du proche infrarouge Ceased WO2010119683A1 (fr)

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JP2013209234A (ja) * 2012-03-30 2013-10-10 Japan Carlit Co Ltd:The 合わせガラス用中間膜及び合わせガラス
CN103619977A (zh) * 2011-06-30 2014-03-05 日东电工株式会社 粘合剂组合物、粘合剂层以及粘合片
WO2014084289A1 (fr) * 2012-11-30 2014-06-05 富士フイルム株式会社 Composition de résine durcissable, et puce de capteur d'image ainsi que procédé de fabrication de celle-ci mettant en œuvre cette composition
WO2018055880A1 (fr) * 2016-09-21 2018-03-29 富士フイルム株式会社 Filtre de coupure proche infrarouge, dispositif d'imagerie à semi-conducteurs, module de caméra et dispositif d'affichage d'image
JPWO2019151344A1 (ja) * 2018-02-05 2021-02-04 Ａｇｃ株式会社 光学フィルタおよび撮像装置

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EP3129810B1 (fr) * 2014-04-10 2018-09-19 CSEM Centre Suisse D'electronique Et De Microtechnique SA Module photovoltaïque solaire

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JP2007004098A (ja) * 2005-05-25 2007-01-11 Nippon Kayaku Co Ltd 近赤外線吸収フィルタ及びこれを用いた光学フィルタ
WO2008026786A1 (fr) * 2006-08-31 2008-03-06 Nippon Shokubai Co., Ltd. Sel de composition d'absorption des rayons proches de l'infrarouge et composition auto adhésive absorbant les rayons proches de l'infrarouge

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CN101395501B (zh) * 2006-03-01 2011-01-26 日本化药株式会社 近红外线吸收薄膜以及使用该薄膜的等离子体显示板用滤光器
WO2009001662A1 (fr) * 2007-06-27 2008-12-31 Nippon Kayaku Kabushiki Kaisha Film d'absorption dans le proche infrarouge et filtre optique employant celui-ci pour un panneau d'affichage à plasma

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WO2006028006A1 (fr) * 2004-09-06 2006-03-16 Nippon Kayaku Kabushiki Kaisha Compose de diimmonium et utilisation de celui-ci
JP2007004098A (ja) * 2005-05-25 2007-01-11 Nippon Kayaku Co Ltd 近赤外線吸収フィルタ及びこれを用いた光学フィルタ
WO2008026786A1 (fr) * 2006-08-31 2008-03-06 Nippon Shokubai Co., Ltd. Sel de composition d'absorption des rayons proches de l'infrarouge et composition auto adhésive absorbant les rayons proches de l'infrarouge

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103619977A (zh) * 2011-06-30 2014-03-05 日东电工株式会社 粘合剂组合物、粘合剂层以及粘合片
JP2013209234A (ja) * 2012-03-30 2013-10-10 Japan Carlit Co Ltd:The 合わせガラス用中間膜及び合わせガラス
WO2014084289A1 (fr) * 2012-11-30 2014-06-05 富士フイルム株式会社 Composition de résine durcissable, et puce de capteur d'image ainsi que procédé de fabrication de celle-ci mettant en œuvre cette composition
WO2018055880A1 (fr) * 2016-09-21 2018-03-29 富士フイルム株式会社 Filtre de coupure proche infrarouge, dispositif d'imagerie à semi-conducteurs, module de caméra et dispositif d'affichage d'image
JPWO2018055880A1 (ja) * 2016-09-21 2019-06-24 富士フイルム株式会社 近赤外線カットフィルタ、固体撮像素子、カメラモジュールおよび画像表示装置
JPWO2019151344A1 (ja) * 2018-02-05 2021-02-04 Ａｇｃ株式会社 光学フィルタおよび撮像装置
JP7222361B2 (ja) 2018-02-05 2023-02-15 Ａｇｃ株式会社 光学フィルタおよび撮像装置

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