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WO2010082297A1 - Équipement de transfert - Google Patents

Équipement de transfert Download PDF

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Publication number
WO2010082297A1
WO2010082297A1 PCT/JP2009/050312 JP2009050312W WO2010082297A1 WO 2010082297 A1 WO2010082297 A1 WO 2010082297A1 JP 2009050312 W JP2009050312 W JP 2009050312W WO 2010082297 A1 WO2010082297 A1 WO 2010082297A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
mold
holding
fixing
pressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/050312
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English (en)
Japanese (ja)
Inventor
修 加園
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Corp filed Critical Pioneer Corp
Priority to JP2010546482A priority Critical patent/JP4756106B2/ja
Priority to PCT/JP2009/050312 priority patent/WO2010082297A1/fr
Publication of WO2010082297A1 publication Critical patent/WO2010082297A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/855—Coating only part of a support with a magnetic layer

Definitions

  • the present invention relates to a transfer device that transfers a concavo-convex pattern to a transfer layer on a substrate.
  • a transfer device is proposed to transfer a concavo-convex pattern onto the substrate surface by pressing a disc-shaped mold with a concavo-convex pattern formed on the surface of the magnetic disk onto the substrate on which the transfer layer is formed.
  • a transfer apparatus first, the substrate on which the transfer layer is formed is held by the first holding unit, and further the mold is sucked and held by the second holding unit, so that the reference positions of the mold and the substrate are aligned with each other while being separated from each other. Then, by applying pressure between the mold and the substrate and pressing, the concave / convex pattern of the mold is pressed against the surface of the substrate.
  • JP 2005-529436 Gazette JP 2005-529436 Gazette
  • the problem to be solved by the present invention includes the above-mentioned drawbacks as an example, and an object thereof is to provide a transfer apparatus capable of appropriate release while stably holding a substrate.
  • the substrate holding means for holding the substrate having the transfer layer formed on the front surface and the back surface, and the first pattern to be formed on the transfer layer on the front surface of the substrate are formed.
  • a first pressing means for bringing the substrate held on the first mold and the first mold held on the first mold holding means closer to press the first pattern against the transfer layer on the surface of the substrate; and A second pressing that causes the substrate held by the holding means and the first mold held by the first mold holding means to approach each other and presses the second pattern against the transfer layer on the back surface of the substrate.
  • the second separation means for moving in the separation direction, and the fixing means for fixing the substrate to the substrate holding means when moved by the first separation means or the second separation means.
  • a transfer apparatus holds a substrate holding means for holding a substrate having a transfer layer formed on one surface, and a first mold on which a first pattern to be formed on the transfer layer is formed.
  • the first mold holding means, the substrate held by the substrate holding means, and the first mold held by the first mold holding means are brought close to each other to place the first pattern on the transfer layer of the substrate.
  • the fixing means fixes the substrate to the substrate holding means when they are separated from each other, so that the release layer remains attached to the mold. Is prevented. That is, the substrate can be reliably released from the mold with the transfer layer remaining on the substrate.
  • FIG. 1 It is a figure which shows schematic structure of a nanoimprint apparatus as an Example of this invention. It is a top view which shows the upper mold in the apparatus of FIG. It is a flowchart which shows the nanoimprint process of the apparatus of FIG. It is a figure which shows the state of the upper mold at the time of the mold press of the apparatus of FIG. 1, a lower mold, and a board
  • FIG. 1 shows a schematic cross-sectional structure of a nanoimprint apparatus of UV (Ultraviolet) type as an embodiment of the present invention.
  • This nanoimprint apparatus performs pattern transfer on both sides of the substrate 6 simultaneously using an upper mold 503a and a lower mold 503b in which the uneven pattern to be transferred is previously formed.
  • the upper mold 503a and the lower mold 503b are mold sets.
  • the substrate 6 is a disk-shaped substrate, for example, a magnetic disk, and has a central hole in the center.
  • the substrate 6 is made of a material such as specially processed chemically strengthened glass, a silicon wafer, or an aluminum substrate.
  • an upper transfer layer 604a and a lower transfer layer 604b made of a material that is cured when irradiated with ultraviolet rays are formed.
  • the upper and lower molds 503a and 503b are made of a base material such as quartz, silicon, or glass, and an uneven pattern is formed on the surface thereof.
  • the upper mold 503a has a disk shape larger than the substrate 6 as shown in FIG. 2, and has a central hole at the center thereof.
  • a range P indicated by a dotted line in FIG. 2 is a portion where the uneven pattern of the upper mold 503a is formed.
  • the diameter of the center hole of the upper mold 503 a is slightly larger than the diameter of the center hole of the substrate 6.
  • FIG. 1 shows the configuration of the nanoimprint apparatus in a state where the substrate 6 on which the upper transfer layer 604a and the lower transfer layer 604b are formed, the upper mold 503a, and the lower mold 503b are mounted.
  • the nanoimprint apparatus shown in FIG. 1 includes an upper mechanism unit, a lower mechanism unit, a controller 200 that controls the upper mechanism unit and the lower mechanism unit, and an operation unit 201.
  • the upper mechanism unit includes an upper center pin 30a, an upper mold holding unit 501a, an upper stage 505a, an upper center pin driving unit 507a, and an upper UV irradiation unit 508a.
  • the board-like upper stage 505a has a nut portion in which a screw groove into which a screw portion of a ball screw 512, which will be described later, is screwed is cut, together with an opening portion 100a as shown in FIG.
  • An upper center pin drive unit 507a and an upper UV irradiation unit 508a are installed on the upper surface of the upper stage 505a.
  • an upper mold holding portion 501a having a mold holding surface (a surface in contact with the upper mold 503a in FIG. 1) for fixing and holding the upper mold 503a is provided on the lower surface.
  • the upper mold holding part 501a has a mold holding surface on which the upper mold 503a is fixed by vacuum suction by a suction fixing means (not shown).
  • the mold holding surface of the upper mold holding part 501a is provided with a through hole for allowing the upper center pin 30a to pass therethrough.
  • Upper center pin drive unit 507a in accordance with the upper center pin movement signal CG U supplied from the controller 200, the upper center pin 30a, the upper or lower in a direction perpendicular to the mold holding surface of the upper mold holding portion 501a Move to the side.
  • the upper UV irradiation unit 508a applies ultraviolet light to be cured on the transfer layer material to the upper transfer layer 604a of the substrate 6 through the opening 100a of the upper stage 505a in accordance with the ultraviolet irradiation signal UV supplied from the controller 200. Irradiate toward.
  • the upper mold holding part 501a has a mold holding surface on which the upper mold 503a is fixed by the upper mold holding part 509a.
  • the mold holding surface of the upper mold holding part 501a is provided with a through hole for allowing the upper center pin 30a to pass therethrough.
  • a recess 301a is formed at the tip of the upper center pin 30a.
  • the lower mechanism unit includes a lower center pin 30b, a lower mold holding unit 501b, a lower stage 505b, a lower center pin drive unit 507b, a lower UV irradiation unit 508b, a stage vertical drive unit 511, and a ball screw 512.
  • the board-like lower stage 505b has a hole through which the threaded portion of the ball screw 512 passes, along with the opening 100b as shown in FIG.
  • the ball screw 512 maintains the parallel state between the lower stage 505b and the upper stage 505a.
  • the screw portion of the ball screw 512 is screwed into the nut portion of the upper stage 505a.
  • On the upper surface of the lower stage 505b there is provided a lower mold holding portion 501b having a mold holding surface (a surface in contact with the lower mold 503b in FIG. 1) for fixing and holding the lower mold 503b. ing.
  • the lower mold holding part 501b has a mold holding surface to which the lower mold 503b is fixed by vacuum suction by means not shown.
  • the mold holding surface of the lower mold holding part 501b is provided with a through hole for allowing the lower center pin 30b to pass therethrough.
  • a lower center pin drive unit 507b, a lower UV irradiation unit 508b, and a stage vertical drive unit 511 are provided on the lower surface of the lower stage 505b.
  • a hemispherical or cone-shaped convex portion 301b is formed at the tip of the lower center pin 30b.
  • the convex portion 301b forms a clamping mechanism together with the concave portion 301a at the tip of the upper center pin 30a, and can be detachably coupled with the substrate 6 interposed therebetween.
  • a flange 504b is formed near the tip of the lower center pin 30b. The diameter of the flange 504b is smaller than the diameter of the center hole of the lower mold 503b, but larger than the diameter of the center hole of the substrate 6.
  • the vacuum suction means and upper mold holding portion 501a are holding means for the upper mold 503a
  • the vacuum suction means and upper mold holding portion 501b are holding means for the lower mold 503b
  • the lower center pin 30b is a substrate holding means
  • the upper center pin 30a is a fixing means.
  • the upper stage 505a, the stage vertical drive unit 511 and the ball screw 512 are the first pressing means and the first separation means
  • the lower stage 505b, the stage vertical drive unit 511 and the ball screw 512 are the second pressure means and the second separation means. It is.
  • each of the first pressing means, the second pressing means, the first separation means, and the second separation means may be provided independently, or may be an integrated mechanism.
  • the operation unit 201 accepts various operation commands instructed by the user to operate the nanoimprint apparatus, and supplies an operation command signal indicating the operation commands to the controller 200.
  • the controller 200 executes various processing signals (UV, CG U , CG L , SG) for controlling the nanoimprint apparatus by executing a processing program corresponding to the operation indicated by the operation command signal supplied from the operation unit 201. ) Is generated.
  • the controller 200 starts executing the nanoimprint processing program as shown in FIG.
  • the controller 200 causes the upper mold 503a to be transferred onto the mold holding surface of the upper mold holding portion 501a by a transfer device (not shown) (step S1).
  • the upper mold 503a is fixed to a predetermined upper holding position on the mold holding surface of the upper mold holding portion 501a by vacuum suction (step S2).
  • the predetermined upper holding position is a position where the upper center pin 30a can move without contacting the center hole of the upper mold 503a.
  • the controller 200 causes the lower mold 503b to be transferred onto the mold holding surface of the lower mold holding portion 501b by the transfer device (step S3), and after the transfer, the controller 200 lowers the vacuum by the suction fixing means.
  • the lower mold 503b is fixed to a predetermined lower holding position on the mold holding surface of the side mold holding portion 501b (step S4).
  • the predetermined lower holding position is a position where the lower center pin 30b can move without contacting the center hole of the lower mold 503b, and is in a vertical relationship with the predetermined upper holding position.
  • the controller 200 transports the substrate 6 by the transport device described above and attaches it to the flange 504b of the lower center pin 30b (step S5). That is, at the position where the lower center pin 30b is inserted into the center hole of the substrate 6, the substrate 6 is placed on the flange 504b by being moved along the tip convex portion 301b of the lower center pin 30b. As a result, the substrate 6 can be aligned with the molds 503a and 503b held and fixed as described above.
  • step S6 After mounting the substrate 6, the controller 200 performs mold pressing (step S6).
  • mold pressing a stage drive signal SG is supplied to the stage vertical drive unit 511 to move the upper stage 505a downward, and an upper center pin movement signal CG U is used to move the upper center pin 30a downward. It is supplied to the pin drive unit 507a.
  • the upper stage 505a moves downward
  • the upper center pin 30a moves downward
  • the concave portion 301a at the tip thereof is coupled to the convex portion 301b of the lower center pin 30b
  • the substrate 6 is fixed.
  • the upper mold 503a contacts the upper transfer layer 604a of the substrate 6.
  • a concavo-convex pattern in which the concavo-convex state is reversed from the concavo-convex pattern formed in the upper mold 503a is formed on the surface portion of the upper transfer layer 604a.
  • a concavo-convex pattern in which the concavo-convex state is reversed from the concavo-convex pattern formed in the lower mold 503b is formed on the surface portion of the lower transfer layer 604b. That is, by executing step S4, simultaneous double-side pattern transfer is performed on the upper transfer layer 604a and the lower transfer layer 604b of the substrate 6 by the upper mold 503a and the lower mold 503b.
  • step S7 the controller 200 supplies the ultraviolet irradiation signal UV to the upper UV irradiation unit 508a and the lower UV irradiation unit 508b (step S7).
  • the upper UV irradiation unit 508a irradiates the upper transfer layer 604a of the substrate 6 with ultraviolet rays to be cured, and the lower UV irradiation unit 508b is to cure the transfer layer material. Is irradiated toward the lower transfer layer 604b.
  • the controller 200 executes mold release to release the substrate 6 from the upper mold 503a and the lower mold 503b (step S8).
  • the controller 200 supplies a stage drive signal SG for moving the upper stage 505a upward by a predetermined distance to the stage vertical drive unit 511.
  • the upper mold 503a is separated from the upper transfer layer 604a of the substrate 6 as indicated by an arrow A in FIG.
  • the upper center pin 30a and the lower center pin 30b is supplied the upper center pin moving signal CG U to move in the upward direction in the upper center pin drive unit 507a remain attached across the substrate 6, the lower simultaneously Center pin moving signal CG L is supplied to the lower center pin drive unit 507b. Accordingly, the substrate 6 is lifted by the flange 504b of the lower center pin 30b in the direction of arrow A in FIG.
  • the substrate 6 is released from the lower mold 503b as indicated by arrow B.
  • the upper center pin 30a and the lower center pin 30b hold and fix the substrate 6 during the mold release process. Therefore, since the substrate 6 is kept horizontal, the transfer layers 604a and 604b of the substrate 6 remain attached to one of the upper mold 503a and the lower mold 603b and can be released only from the other mold. Is prevented. That is, the substrate 6 can be reliably released from both the upper mold 503a and the lower mold 603b.
  • the controller 200 is a leaving supplies the upper center pin moving signal CG U to move the upper center pin 30a upward to the upper center pin drive unit 507a, the substrate 6 from the lower center pin 30b A command to be sent is sent to the transfer device to carry out the substrate 6 (step S9).
  • step S10 determines whether or not an operation command signal indicating the end of the operation is supplied from the operation unit 201 (step S10). If it is determined in step S10 that an operation command signal indicating the end of the operation has been supplied, the controller 200 ends the nanoimprint processing program. On the other hand, if it is determined in step S7 that the operation command signal indicating the end of the operation is not supplied, the controller 200 returns to the execution of step S5 and repeatedly executes the operations of steps S5 to S10. As a result, pattern transfer is continuously performed on the newly mounted substrate 6.
  • the concavo-convex pattern is transferred to both surfaces of the substrate.
  • the transfer device of the present invention can also be used for nanoimprinting that transfers the concavo-convex pattern only to one transfer layer forming surface of the substrate.
  • FIG. 6 shows an example of a modal manufacturing method for manufacturing the upper mold 503a and the lower mold 503b.
  • the mold manufacturing method will be described with reference to FIG. 6.
  • a circular quartz substrate 100 having a resist layer 100a formed on the surface is prepared, and the resist layer 100a on the substrate 100 is applied to the resist layer 100a from above by an electron beam drawing apparatus.
  • the electron beam is irradiated to expose the resist layer 100a (exposure process). That is, in the exposure process, for example, the data pattern of each of the servo zone and the data zone for the magnetic disk is formed as a latent image 100b on the resist layer 100a of the substrate 100 by irradiating the substrate with an electron beam.
  • the substrate 100 is taken out from the electron beam recording apparatus, the substrate 100 is subjected to development processing (development process).
  • development process The latent image 100b portion is removed by the development process.
  • quartz etching is performed on the quartz substrate 100 to form a recess 100c (etching step).
  • the resist layer 100a remaining by the etching process is peeled off (resist layer removing process).
  • resist layer removing process the quartz substrate 100 formed on the surface as an uneven pattern is produced.
  • This manufacturing method is the same for both the upper mold 503a and the lower mold 503b.
  • a disc-shaped quartz substrate (with a non-outlined shape) having a UV curable resin formed on the surface is prepared, and a concavo-convex pattern is separately prepared on the UV curable resin on the surface of the quartz substrate.
  • a resin replica mold in which UV nanoimprint is performed using a mold and the uneven pattern is transferred onto the UV curable resin may be produced.
  • the tip of the upper center pin 30a is concave, but this is not restrictive.
  • the upper center pin 30a may have a flat tip as shown in FIG.
  • the lower center pin 30b has the tip of the convex portion 301b.
  • the convex portion 301b has a central tip protruding surface and an outer step flat surface lower than the tip protruding surface.
  • the length of the convex portion that is, the length from the tip protruding surface to the step plane is slightly smaller than the thickness of the substrate 6.
  • the upper center pin 30a penetrates the center hole of the upper mold 503a
  • the lower center pin 30b penetrates the center hole of the lower mold 503b
  • the convex portion 301b of the lower center pin 30b fits into the center hole of the substrate 6.
  • the substrate 6 is positioned.
  • the flat front end of the upper center pin 30a presses the substrate 6 against the outer stepped surface of the convex portion of the lower center pin 30b, whereby the substrate 6 is held between the upper center pin 30a and the lower center pin 30b. Fixed.
  • the upper center pin 30a and the lower center pin 30b move upward with the substrate 6 fixed together with the upward movement of the upper stage 505a, and the upward movement of the upper stage 505a at that time Since the speed is faster than the moving speed of the upper center pin 30a and the lower center pin 30b, the lower mold 503b is peeled from the substrate 6 and the upper mold 503a is peeled from the substrate 6.
  • the substrate 6 is a mechanism that is held and fixed between the upper center pin 30a and the lower center pin 30b, but is not limited thereto.
  • a mechanism for holding and fixing the substrate 6 may be used instead, as shown in FIG.
  • the substrate 6 is held and fixed by the upper substrate fixing member 40a and the lower substrate holding member 40b forming a pair.
  • a plurality of sets (at least one set) of the upper substrate fixing member 40a and the lower substrate holding member 40b are provided, and the upper substrate fixing member 40a is movable in the vertical direction by a moving driving means (not shown).
  • the lower substrate holding member 40b is fixedly installed in the nanoimprint apparatus.
  • the diameter of the substrate 6 is larger than that of the upper mold 503a and the lower mold 503b. Further, the substrate 6, the upper mold 503a, and the lower mold 503b may each have no center hole.
  • the tip of the upper substrate fixing member 40a has a cross-section bent downward in an L-shape, and the lower substrate holding member 40b has a cross-section cut out in a step shape at the top of the tip.
  • the notched portion of the lower substrate holding member 40b acts as the tip holding portion 400b, the outer peripheral area of the substrate 6 abuts on the tip holding portion 400b, and the substrate 6 is placed, whereby the substrate 6 is positioned.
  • the L-shaped tip of the upper substrate fixing member 40a presses the substrate 6 against the tip holding portion 400b of the lower substrate holding member 40b, thereby holding and fixing.
  • the upper mold 503a is movable in the vertical direction by the upper stage 505a
  • the lower mold 503b is movable in the vertical direction by the lower stage 505b
  • the convex portion of the upper mold 503a is formed on the upper transfer layer during the mold pressing process.
  • the convex portion of the lower mold 503b is pushed into the lower transfer layer 604b.
  • the upper mold 503a is peeled from the substrate 6 and the lower mold 503b is peeled from the substrate 6 by the downward movement of the lower stage 505b simultaneously with the upward movement of the upper stage 505a.
  • the tip holding portion 400b of the lower substrate holding member 40b may have a gentle horn shape as shown in FIG. . That is, the diameter of the entrance of the portion surrounded by the plurality of tip holding portions 400 b is larger than the diameter of the substrate 6.
  • a rotating shaft 401b is attached to the lower substrate holding member 40b, and the upper substrate fixing member 40a is rotated around the rotating shaft 401b by driving means (not shown) to fix the substrate 6. Also good.
  • the tip of the upper substrate fixing member 40a may not be L-shaped but may be flat as shown in FIG. In this case, the depth of the tip holding portion 400b of the lower substrate holding member 40b is slightly smaller than the thickness of the substrate 6. The flat tip of the upper substrate fixing member 40a presses the substrate 6 against the tip holding portion 400b, whereby the substrate 6 is held and fixed between the upper substrate fixing member 40a and the lower substrate holding member 40b.
  • the UV-type nanoimprint method and the nanoimprint apparatus are described.
  • the present invention is not limited to this, and other methods such as thermal nanoimprint, light energy (light other than UV) curable nanoimprint, etc. It can also be used for nanoimprinting. If it is a thermal nanoimprint, it is not necessary to be a transparent mold, and a metal mold such as nickel can be used, and in order to transmit UV light to the resist, a member that is made of a transparent material should be a non-transparent member such as a metal. I can do it.
  • the material of the substrate 6 is a material capable of transferring a fine uneven pattern formed on the mold, for example, a resin film, bulk resin, low melting point glass, etc.
  • the upper layer portion of the substrate 6 can be handled as a transfer layer.
  • the pattern shape can be directly transferred onto the substrate 6 without forming a transfer material on the substrate 6.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

La présente invention porte sur un équipement de transfert qui comprend un premier moyen de pression permettant d'amener un substrat tenu par un moyen de maintien de substrat et un premier moule tenu par un premier moyen de maintien de moule à proximité l'un de l'autre et permettant de presser un premier motif contre une couche de transfert sur la surface avant du substrat, un second moyen de pression permettant d'amener un substrat tenu par un moyen de maintien de substrat et un premier moule tenu par un premier moyen de maintien de moule à proximité l'un de l'autre et permettant de presser un second motif contre une couche de transfert sur la surface arrière du substrat, un premier moyen de séparation permettant de déplacer le substrat pressé par le premier moyen de pression et le premier moule dans la direction de séparation, et un second moyen de séparation permettant de déplacer le substrat pressé par le second moyen de presse et un second moule dans la direction de séparation, et un moyen de fixation permettant de fixer le substrat au moyen de maintien de substrat lorsque le substrat est déplacé par le premier moyen de séparation ou le second moyen de séparation.
PCT/JP2009/050312 2009-01-13 2009-01-13 Équipement de transfert Ceased WO2010082297A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010546482A JP4756106B2 (ja) 2009-01-13 2009-01-13 転写装置
PCT/JP2009/050312 WO2010082297A1 (fr) 2009-01-13 2009-01-13 Équipement de transfert

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/050312 WO2010082297A1 (fr) 2009-01-13 2009-01-13 Équipement de transfert

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WO2010082297A1 true WO2010082297A1 (fr) 2010-07-22

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PCT/JP2009/050312 Ceased WO2010082297A1 (fr) 2009-01-13 2009-01-13 Équipement de transfert

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WO (1) WO2010082297A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210070126A (ko) * 2019-12-04 2021-06-14 주식회사 파워로직스 벤딩 장치 및 이를 이용한 벤딩 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005056535A (ja) * 2003-08-07 2005-03-03 Tdk Corp 磁気記録媒体の製造方法及び製造装置
JP2008221552A (ja) * 2007-03-12 2008-09-25 Hitachi High-Technologies Corp 微細構造転写装置、スタンパおよび微細構造の製造方法
JP2008276919A (ja) * 2007-03-30 2008-11-13 Pioneer Electronic Corp インプリント装置およびインプリント方法
WO2008142784A1 (fr) * 2007-05-23 2008-11-27 Pioneer Corporation Équipement d'estampage

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005056535A (ja) * 2003-08-07 2005-03-03 Tdk Corp 磁気記録媒体の製造方法及び製造装置
JP2008221552A (ja) * 2007-03-12 2008-09-25 Hitachi High-Technologies Corp 微細構造転写装置、スタンパおよび微細構造の製造方法
JP2008276919A (ja) * 2007-03-30 2008-11-13 Pioneer Electronic Corp インプリント装置およびインプリント方法
WO2008142784A1 (fr) * 2007-05-23 2008-11-27 Pioneer Corporation Équipement d'estampage

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210070126A (ko) * 2019-12-04 2021-06-14 주식회사 파워로직스 벤딩 장치 및 이를 이용한 벤딩 방법
KR102295117B1 (ko) * 2019-12-04 2021-08-31 주식회사 파워로직스 벤딩 장치 및 이를 이용한 벤딩 방법

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JP4756106B2 (ja) 2011-08-24
JPWO2010082297A1 (ja) 2012-06-28

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