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WO2010082298A1 - Dispositif et procédé de transfert - Google Patents

Dispositif et procédé de transfert Download PDF

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Publication number
WO2010082298A1
WO2010082298A1 PCT/JP2009/050313 JP2009050313W WO2010082298A1 WO 2010082298 A1 WO2010082298 A1 WO 2010082298A1 JP 2009050313 W JP2009050313 W JP 2009050313W WO 2010082298 A1 WO2010082298 A1 WO 2010082298A1
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WO
WIPO (PCT)
Prior art keywords
mold
substrate
center
alignment
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/050313
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English (en)
Japanese (ja)
Inventor
哲也 今井
修 加園
和信 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Corp filed Critical Pioneer Corp
Priority to JP2010546483A priority Critical patent/JPWO2010082298A1/ja
Priority to PCT/JP2009/050313 priority patent/WO2010082298A1/fr
Publication of WO2010082298A1 publication Critical patent/WO2010082298A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/855—Coating only part of a support with a magnetic layer

Definitions

  • the present invention relates to a transfer apparatus and a transfer method for transferring an uneven pattern to a transfer target.
  • Patent Document 1 describes that a conical mandrel is used to match reference positions of substrates on which a mold and a transfer layer are formed in a state of being separated from each other.
  • Patent Documents 2 and 3 describe that an alignment mark is formed on the mold, and the alignment between the disk substrate and the mold is performed using the alignment mark.
  • Patent Document 4 describes that the position of the molded product and the mold is aligned by detecting the position of the edge of the molded product.
  • the apparatus described in Patent Document 1 adjusts the relative position between the disk substrate and the mold using a conical mandrel, and the conical mandrel requires high processing accuracy.
  • the end position (inner periphery or outer periphery edge) of the disk substrate is observed using detection means such as a camera.
  • detection means such as a camera.
  • the edge position (inner and outer edges) of the disk substrate is generally chamfered or the like, the edge of the disk substrate is detected by a detection means such as a camera. It becomes difficult to accurately specify the position of the part.
  • the present invention has been made in view of the above points, and even when a mold is used in which the mold center point does not coincide with the center point of the uneven pattern formed on the mold, It is an object of the present invention to provide a transfer apparatus and a transfer method capable of adjusting the center point of the concavo-convex pattern with the center with high accuracy.
  • a transfer device is a transfer device that transfers a concavo-convex pattern by pressing a first mold against a first surface of a transfer object and pressing a second mold against the second surface of the transfer object.
  • Supporting means for supporting the transferred object, first mold holding means for holding the first mold, second mold holding means for holding the second mold, the first mold and the second mold.
  • First alignment means for adjusting the relative position of the first mold, the second mold, the center of the concave-convex pattern formed in each of the first and second molds and the center of the transferred body coincide with each other, And second alignment means for adjusting the relative position of the transfer object.
  • the transfer method according to the present invention is a transfer method in which a concavo-convex pattern is transferred by pressing a first mold against a first surface of a transfer object and pressing a second mold against the second surface of the transfer object.
  • a supporting step for supporting the transfer object a first mold holding step for holding the first mold, a second mold holding step for holding the second mold, the first mold, and the second mold.
  • a camera unit of a transfer device is a camera unit used for a transfer device that transfers a mold having a concavo-convex pattern and an alignment mark to a transfer target having a through hole. And first observation means for observing the holding means for holding the transferred body through the through-hole of the transferred body, and second observation means for observing the alignment mark formed on the mold.
  • the camera unit of the transfer device transfers a concavo-convex pattern by a first mold onto one surface of a transfer body having a through-hole, and a second surface on the other surface of the transfer body.
  • FIG. 2 is a diagram illustrating an example of a configuration of a camera unit 40.
  • FIG. It is a figure which shows typically the form of a mold drive stage (500a, 500b) and a mold holding
  • FIG. shows an example of the flowchart which shows the imprint method implemented when performing double-sided transfer.
  • FIG. shows an example of the flowchart which shows the imprint method implemented when performing double-sided transfer.
  • FIG. 6 is a diagram schematically illustrating the state (positional relationship) of each of an upper mold holding unit 501a, a lower mold holding unit 501b, and a center pin 30b for each stage by the imprint operation illustrated in FIGS. 4 and 5.
  • FIG. 6 is a diagram schematically illustrating the state (positional relationship) of each of an upper mold holding unit 501a, a lower mold holding unit 501b, and a center pin 30b for each stage by the imprint operation illustrated in FIGS. 4 and 5.
  • FIG. 6 is a diagram schematically illustrating the state (positional relationship) of each of an upper mold holding unit 501a, a lower mold holding unit 501b, and a center pin 30b for each stage by the imprint operation illustrated in FIGS. 4 and 5.
  • FIG. 6 is a diagram schematically illustrating the state (positional relationship) of each of an upper mold holding unit 501a, a lower mold holding unit 501b, and a center pin 30b for each stage by the imprint operation illustrated in FIGS
  • FIGS. 4 and 5 are diagram schematically illustrating the state (positional relationship) of each of an upper mold holding unit 501a, a lower mold holding unit 501b, and a center pin 30b for each stage by the imprint operation illustrated in FIGS. 4 and 5. It is a figure showing the position alignment operation
  • FIG.20 and FIG.21 It is a figure which shows an example of the flowchart which shows the imprint method implemented when performing single-sided transfer. It is a figure which represents typically the state (positional relationship) of each of the upper mold holding
  • FIG. 27 is a diagram schematically illustrating the state (positional relationship) of each of an upper mold holding unit 501a, a lower mold holding unit 501b, and a center pin 30b for each stage by the imprint operation illustrated in FIGS. 25 and 26.
  • FIG. 27 is a diagram schematically illustrating the state (positional relationship) of each of an upper mold holding unit 501a, a lower mold holding unit 501b, and a center pin 30b for each stage by the imprint operation illustrated in FIGS. 25 and 26.
  • FIG. 27 is a diagram schematically illustrating the state (positional relationship) of each of an upper mold holding unit 501a, a lower mold holding unit 501b, and a center pin 30b for each stage by the imprint operation illustrated in FIGS. 25 and 26.
  • FIG. 4 is a diagram illustrating an example of arrangement of cameras in a camera unit 40.
  • FIG. 4 is a diagram illustrating an example of arrangement of cameras in a camera unit 40.
  • FIG. 4 is a diagram illustrating an example of arrangement of cameras in a camera unit 40.
  • FIG. 4 is a diagram illustrating an example of arrangement of cameras in a camera unit 40. It is a figure which shows the other structure of the camera unit.
  • first, the first mold and the second mold are transferred.
  • the relative position is adjusted, and then the first mold, the second mold, and the transferred body so that the center of the uneven pattern formed in each of the first and second molds coincides with the center of the transferred body. Alignment whose relative position is to be adjusted is executed.
  • FIG. 1 is a cross-sectional view showing a schematic configuration of a UV (ultraviolet) type imprint apparatus as a transfer apparatus according to the present invention.
  • This imprint apparatus uses the upper mold 503a and the lower mold 503b on which the concavo-convex pattern to be transferred is formed, to simultaneously transfer patterns onto both sides of the substrate 6 as a transfer target to be transferred.
  • the transfer target is referred to as a substrate.
  • the substrate refers to a configuration including a transfer layer.
  • an upper transfer layer 604a and a lower transfer layer 604b made of a transfer material that is cured when irradiated with ultraviolet rays are formed.
  • a center hole is provided at the center position (reference position) of each of the substrate 6, the upper mold 503a, and the lower mold 503b.
  • FIG. 1 the configuration of the imprint apparatus is shown with the substrate 6, the upper mold 503a, and the lower mold 503b installed.
  • the imprint apparatus shown in FIG. 1 includes an upper mechanism unit, a lower mechanism unit, a controller 200 that controls the upper mechanism unit and the lower mechanism unit, and an operation unit 201.
  • the upper mechanism unit includes a camera unit 40, a camera unit driving stage 90, an upper mold driving stage 500a, an upper mold holding unit 501a, an upper stage 505a, and an upper UV irradiation unit 508a.
  • the board-like upper stage 505a has a screw hole portion in which a screw groove into which a ball screw 512 (to be described later) is screwed is formed, along with an opening portion 100a as shown in FIG.
  • the camera unit drive stage 90 is installed on the upper surface of the upper stage 505a.
  • the upper UV irradiation unit 508a applies ultraviolet light to be cured on the transfer material to the upper transfer layer 604a of the substrate 6 via the upper mold holding unit 501a and the upper mold 503a in accordance with the ultraviolet irradiation signal UV supplied from the controller 200. Irradiate.
  • the camera unit 40 On the camera unit drive stage 90, the camera unit 40 is installed.
  • the camera unit drive stage 90 moves the camera unit 40 to the center position of the opening 100a by the camera unit movement signal KG U supplied from the controller 200.
  • the camera unit 40 is provided to perform high-precision alignment of the upper mold 503a and the lower mold 503b with respect to the substrate 6 at the time of pressing.
  • FIG. 2 is a diagram illustrating a schematic configuration of the camera unit 40.
  • the camera unit 40 includes a plate-like stage CS having a plane parallel to the substrate 6, and cameras 41a to 41d fixedly arranged on the stage CS.
  • the center point of each photographic lens LZ is on a concentric reference alignment line AL (shown by a broken line) centered on the center point of the photographic lens LZ of the camera 41a on the surface of the stage CS. It is arranged to be located.
  • the reference alignment line AL is, for example, the innermost or outermost position of the concavo-convex pattern formed in the upper mold 503a and the lower mold 503b, or the relative positions of the upper mold 503a and the lower mold 503b with respect to the substrate 6.
  • the alignment mark has a diameter substantially the same as that of the alignment mark formed for adjusting.
  • the alignment mark is made up of, for example, a plurality of concentric grooves centering on the center point of the uneven pattern formed in the upper mold 503a and the lower mold 503b, and is formed so as to surround the periphery of the uneven pattern. ing.
  • the alignment mark may be in any form as long as it can be recognized as an image, and is not limited to a groove, and may be composed of a plurality of lines drawn with, for example, a laser marker.
  • the camera 41a is arranged so that the center of the photographing lens is located at the center point of the reference alignment line AL.
  • the cameras 41a to 41d there are photographing through-holes for fixing the respective photographing lenses vertically downward (direction in which the substrate 6 exists). Is provided. Further, as shown in FIG. 2, the cameras 41a to 41d are respectively installed at the same height position with respect to the surface of the stage CS.
  • the camera 41a takes an image of the tip of the center pin 30b shown in FIG. 1, and supplies the obtained image signal PDa to the controller 200.
  • the cameras 41b to 41d shoot the surfaces of the upper mold 503a and the lower mold 503b at the respective positions, and supply the photographic signals PDb to PDd obtained at this time to the controller 200.
  • the camera unit 40 maintains the relative positional relationship between the cameras 41b to 41d as shown in FIG. 2 in accordance with the unit position adjustment signal UP supplied from the controller 200, and the surface of the camera unit drive stage 90 is maintained. Move up to change the installation position.
  • An upper mold driving stage 500a having an opening 100a is installed on the lower surface of the upper stage 505a.
  • an upper mold holding part 501a made of a transparent material is installed so as to cover the opening 100a.
  • the upper mold holding unit 501a can move in two-dimensional directions (X, Y) as shown in FIG. 3 on the upper mold driving stage 500a, and can rotate about a central axis QJ perpendicular to the plane. It is installed in a state.
  • the upper mold holding part 501a has a mold holding surface DF as shown in FIG. 3 for holding the upper mold 503a, and a through hole is provided at the center thereof.
  • the upper mold holding unit 501a holds the upper mold 503a on the mold holding surface DF by, for example, vacuum suction according to the upper mold holding signal MH U supplied from the controller 200.
  • the method of holding the upper mold 503a on the mold holding surface is not limited to vacuum suction and may be held by a mechanical method.
  • Upper mold driving stage 500a is according to the supplied upper XY directions mold movement signal XY U from the controller 200 to move the upper mold holding portion 501a in the X direction and the Y direction in its surface. Further, the upper mold driving stage 500a in accordance with the upper mold rotation signal theta U supplied from the controller 200 rotates the upper mold holding portion 501a around the such central axis QJ shown in FIG. As a result, the relative positions of the upper mold 503a, the lower mold 503b, and the substrate 6 are adjusted. A method for adjusting each relative position will be described later.
  • 1 includes a center pin 30b, a lower mold driving stage 500b, a lower mold holding unit 501b, a lower stage 505b, a center pin driving unit 507b, a lower UV irradiation unit 508b, A lower stage vertical drive unit 511b and a lower ball screw 512b are provided.
  • the board-like lower stage 505b has a through hole through which the ball screw 512 passes, together with the opening 100b as shown in FIG.
  • One end of the ball screw 512 penetrates the through hole of the lower stage 505b and the other end is a screw hole of the upper stage 505a so that the lower stage 505b and the upper stage 505a are maintained in a parallel state. It is screwed into the part.
  • a lower mold driving stage 500b having an opening 100b is installed on the upper surface of the lower stage 505b.
  • a lower mold holding part 501b made of a transparent material is installed so as to cover the opening 100b.
  • the lower mold holding portion 501b can move in two-dimensional directions (X, Y) as shown in FIG. 3 on the lower mold driving stage 500b, and rotates about a central axis QJ perpendicular to the plane. Installed as possible.
  • the lower mold holding part 501b includes a mold holding surface DF as shown in FIG. 3 for holding the lower mold 503b, and a through hole is provided at the center thereof.
  • Lower mold holding portion 501b in accordance with the lower mold holding signal MH L supplied from the controller 200, for example, to hold the lower mold 503b to the mold holding surface DF by vacuum suction.
  • the method of holding the lower mold 503b on the mold holding surface is not limited to vacuum suction, and the mold may be supported by a mechanical method.
  • Lower mold driver stage 500b in response to the supplied lower XY direction mold movement signal XY L from the controller 200 moves the lower mold holding portion 501b in the X and Y directions at the surface. Also, the lower mold driver stage 500b, in accordance with the lower mold rotation signal theta L supplied from the controller 200, is rotated around the central axis QJ as shown the lower mold holding portion 501b in FIG. As a result, the relative positions of the lower mold 503b, the upper mold 503a, and the substrate 6 are adjusted. A method for adjusting each relative position will be described later.
  • the lower UV irradiation unit 508b transmits ultraviolet light to be cured on the transfer material in accordance with the ultraviolet irradiation signal UV supplied from the controller 200 via the lower mold holding unit 501b and the lower mold 503b. Irradiation is performed toward the side transfer layer 604b.
  • Center pin drive unit 507b in accordance with the center pin moving signal CG L supplied from the controller 200, the center pin 30b, by penetrating the lower mold holding portion 501b of the hole, perpendicular to the mold holding surface In the direction, that is, in the central axis direction of the center pin 30b, it is moved upward or downward.
  • a first support portion TB1 for supporting the upper mold 503a or the lower mold 503b and a second support portion TB2 for supporting the substrate 6 are provided at the tip of the center pin 30b.
  • the upper mold 503a, the lower mold 503b, and the substrate 6 are supported on the center pin 30b by the first support portion TB1 and the second support portion TB2 while maintaining the parallel state of the respective surfaces (described later). .
  • the lower UV irradiation unit 508b transmits ultraviolet light to be cured on the transfer material in accordance with the ultraviolet irradiation signal UV supplied from the controller 200 via the lower mold holding unit 501b and the lower mold 503b. Irradiate the transfer layer 604b.
  • the stage vertical drive unit 511 maintains the upper stage 505a parallel to the lower stage 505b by rotating the ball screw 512 clockwise or counterclockwise according to the stage drive signal SG supplied from the controller 200. Move it up or down. That is, the upward movement of the upper stage 505a causes the upper mold holding portion 501a to move away from the lower mold holding portion 501b in the direction perpendicular to the mold holding surface of the lower mold holding portion 501b. To do. On the other hand, the upper mold holding part 501a moves toward the lower mold holding part 501b by the downward movement of the upper stage 505a.
  • the operation unit 201 accepts various operation commands instructed by the user to operate the imprint apparatus, and supplies an operation command signal indicating the operation command to the controller 200.
  • the controller 200 generates various control signals for controlling the imprint apparatus by executing an operation processing program corresponding to the operation command signal supplied from the operation unit 201.
  • the controller 200 starts execution of the imprint processing program as shown in FIGS.
  • FIGS. 6 to 9 show states (positional relationships) of the upper mold holding portion 501a, the lower mold holding portion 501b, and the center pin 30b of the imprint apparatus shown in FIG. 1 at each stage in the pattern transfer operation. It is schematically represented.
  • step S1 the controller 200 supplies the center pin moving signal CG L to move the center pin 30b to a predetermined initial position to the center pin drive unit 507b (step S1).
  • the center pin driving unit 507b causes the center pin 30b to be in the initial state as shown in [State 1] in FIG. 6, that is, the first support portion TB1 and the second support portion TB2 in the center pin 30b are both in the initial state. Then, it moves to a position that appears at a position above the mold holding surface of the lower mold holding portion 501b.
  • the controller 200 repeatedly determines whether or not the center pin 30b supports the upper mold 503a from the output of a sensor (not shown) such as a contact sensor until the upper mold 503a is supported (step). S2).
  • the mold conveying device moves the upper mold 503a to the center pin 30b so that the center pin 30b passes through the center hole CA provided at the center position of the upper mold 503a as shown in FIG. Installing.
  • the upper mold 503a is supported by the first support portion TB1 of the center pin 30b with its pattern surface facing downward, as shown in [State 2] in FIG.
  • step S2 If it is determined in step S2 that the upper mold 503a is supported by the center pin 30b as shown in [State 2] in FIG. 6, the controller 200 causes the stage drive signal to move the upper stage 505a downward. SG is supplied to the stage vertical drive unit 511 (step S3). By executing step S3, the entire upper mechanism part including the upper mold holding part 501a gradually moves downward.
  • step S4 determines whether or not the mold holding surface of the upper mold holding unit 501a is in contact with the upper mold 503a from the output of a sensor or the like (not shown) (step S4).
  • step S4 determines whether or not the mold holding surface of the upper mold holding portion 501a is in contact with the upper mold 503a from the output of a sensor or the like (not shown) (step S4).
  • the controller 200 returns to the execution of step S3 and executes the operation as described above again. That is, as shown in [State 3] in FIG. 6, the upper mold holding portion 501a is moved downward until the mold holding surface of the upper mold holding portion 501a contacts the upper mold 503a.
  • step S4 If it is determined in step S4 that the mold holding surface of the upper mold holding portion 501a has contacted the upper mold 503a as shown in [State 3] in FIG. 6, the controller 200 sends the upper mold holding signal MH U to the upper mold holding signal MH U. It supplies to the holding
  • step S6 the controller 200 supplies a stage drive signal SG that should move the upper stage 505a upward by a predetermined distance to the stage vertical drive unit 511 (step S6).
  • step S6 As shown in [State 4] in FIG. 6, the upper mold holding portion 501a moves upward in the central axis direction of the center pin 30b.
  • the upper mold 503a is detached from the center pin 30b. That is, by performing the above steps S1 to S6, the upper mold 503a is held on the mold holding surface of the upper mold holding portion 501a in a state where the reference position coincides with the central axis of the center pin 30b.
  • the controller 200 repeatedly determines whether or not the center pin 30b supports the lower mold 503b from the output of a sensor (not shown) until the lower mold 503b is supported (step S7).
  • the mold conveying apparatus attaches the lower mold 503b to the center pin 30b so that the center pin 30b passes through the center hole CA provided at the center position of the lower mold 503b as shown in FIG. Thereby, as shown in [State 5] of Drawing 7, lower mold 503b is supported on the 1st support part TB1 of center pin 30b in the state where the pattern side turned up.
  • step S7 If it is determined in step S7 that the lower mold 503b is supported by the center pin 30b as shown in [State 5] in FIG. 7, the controller 200 should lower the center pin 30b to a predetermined position. supplying a pin moving signal CG L to the center pin drive unit 507b (step S8). By executing step S8, the center pin drive unit 507b lowers the center pin 30b to a predetermined position. That is, in the center pin drive unit 507b, as shown in [State 6] in FIG. 7, the first support portion TB1 of the center pin 30b and the mold holding surface of the lower mold holding portion 501b are located on the same plane. Until this happens, the center pin 30b is moved downward while monitoring the output of the distance sensor or the like. As a result, the lower mold 503b comes into contact with the mold holding surface of the lower mold holding portion 501b as shown in [State 6] in FIG.
  • the controller 200 supplies the lower mold holding signal MH L to the lower mold holding portion 501b (step S9).
  • the lower mold 503b is held on the mold holding surface of the lower mold holding portion 501b in a state where the center position Q of the lower mold 503b as shown in FIG. 10 coincides with the center axis of the center pin 30b. . That is, by performing the above steps S7 to S9, the lower mold 503b is placed on the mold holding surface of the lower mold holding portion 501b with its center position (reference position) aligned with the center axis of the center pin 30b. It is retained.
  • the controller 200 executes a mold alignment operation in which the upper mold 503a and the lower mold 503b should be aligned with each other (step S10). That is, in this step, in the state where the upper mold 503a and the lower mold 503b are held by the upper mold holding part 501a and the lower mold holding part 501b, the upper mold 503a and the lower mold 503b are displaced. Or the center of the concavo-convex pattern formed in the upper mold 503a when the center hole CA of the mold is eccentric with respect to the center point of the concavo-convex pattern formed in the upper mold 503a and / or the lower mold 503b. Positioning is performed so that the point coincides with the center point of the uneven pattern formed on the lower mold 503b.
  • the controller 200 sets a stage driving signal SG for moving the upper stage 505b downward based on the imaging signal PDb (or PDc, PDd) obtained by imaging with the camera 41b (or 41c, 41d). It is supplied to the vertical drive unit 511. That is, until the outlines of the alignment marks formed on each of the upper mold 503a and the lower mold 503b are displayed without being blurred in one frame image based on the photographing signal PDb, the [state of FIG.
  • the alignment mark is made up of, for example, a plurality of concentric grooves centering on the center point of the concavo-convex pattern formed in both molds (503a, 503b), and is formed so as to surround the concavo-convex pattern. .
  • one of the grooves closest to the reference alignment line AL as shown in FIG. 2 is selected from the alignment marks made up of a plurality of grooves formed concentrically on the upper mold 503a and the lower mold 503b.
  • this groove is referred to as an alignment line PL).
  • Such an alignment line PL becomes a photographing target for each of the cameras 41b to 41d arranged on the reference alignment line AL as shown in FIG. Therefore, for example, as shown in FIG. 10, one frame images Fb to Fd obtained by photographing with the cameras 41b to 41d include an alignment line PL (shown by a solid line) formed on the upper mold 503a and a bottom line.
  • An alignment line PL (shown by a broken line) formed in the side mold 503b appears.
  • the center position R of the alignment mark (including the alignment line PL) formed on each of the upper mold 503a and the lower mold 503b is not necessarily the mold itself due to the influence of manufacturing variations. It does not coincide with the center position Q of. Therefore, the controller 200, on the basis of the photographing signals PDb to PDd, on the vertical axis with respect to the surface of the substrate 6 as shown in FIG. 10, regardless of the center position Q between the alignment lines PL of both molds (503a, 503b).
  • the controller 200 controls the upper side so that the alignment lines PL of both molds (503a, 503b) overlap at the same position in each of the one frame images Fb to Fd as shown in FIG. 10 based on the photographing signals PDb to PDd.
  • Various control signals (XY U , XY L , ⁇ U , ⁇ L ) for moving the mold 503a and / or the lower mold 503b are supplied to the mold driving stage (500a, 500b).
  • the controller 200 supplies the stage vertical drive unit 511 with a stage drive signal SG for moving the upper stage 505a upward.
  • the upper mold 503a and the lower mold 503b are separated from each other to the extent that the substrate 6 can be mounted on the second support portion TB2 of the center pin 30b.
  • the alignment line PL of each of the upper mold 503a and the lower mold 503b is positioned on the axis perpendicular to the surface of the substrate 6, that is, the upper mold 503a and the lower mold 503b.
  • the reference positions of the side molds 503b coincide with each other.
  • the controller 200 After executing the mold alignment operation (step S10), the controller 200 repeatedly determines whether or not the substrate 6 is supported by the center pin 30b from the output of a sensor (not shown) until the substrate 6 is supported. (Step S11).
  • the substrate transfer device attaches the substrate 6 to the center pin 30b so that the center pin 30b passes through the center hole of the substrate 6.
  • the substrate 6 is supported on the second support portion TB2 of the center pin 30b as shown in [State 10] in FIG. That is, the substrate 6 is supported by the center pin 30b in a state where the position of the center axis of the center pin 30b and the reference position (the position of the center hole) of the substrate 6 coincide.
  • step S11 If it is determined in step S11 that the substrate 6 is supported by the center pin 30b, the controller 200 next performs a mold / substrate alignment operation for aligning the mold (503a, 503b) and the substrate 6. Is executed (step S12).
  • the controller 200 first starts the upper stage 505a until the surface of the tip of the center pin 30b appears in one frame image based on the photographing signal PDa obtained by the camera 41a. Is supplied to the stage vertical drive unit 511, as shown in [State 11] in FIG. In other words, this adjusts the focus to focus the camera 41a on the surface of the tip of the center pin 30b.
  • the controller 200 determines that the center axis CJ of the center pin 30b is located at the center position of the one frame image based on the tip image of the center pin 30b existing in the one frame image.
  • a unit position adjustment signal UP for moving the installation position of the unit 40 itself is supplied to the camera unit drive stage 90.
  • the center position R of the alignment line PL of each of the upper mold 503a and the lower mold 503b by the mold alignment operation (step S10) is not necessarily the position of the center axis CJ of the center pin 30b as shown in FIG. Is not consistent. Accordingly, as shown in [State 10] in FIG. 8, when the camera unit 40 is arranged at a position where the photographing axis of the camera 41a coincides with the center axis CJ (indicated by a broken line) of the center pin 30b, FIG.
  • the controller 200 sets the upper mold 503a at the center position (indicated by a cross) of each of the one-frame images Fb to Fd obtained by photographing with the cameras 41b to 41d.
  • the positions of the upper mold 503a and the lower mold 503b are adjusted so that the alignment line PL is positioned.
  • the controller 200 sends the upper XY stage movement signal XY U and the lower XY stage movement signal XY L to move the positions of the upper mold 503a and the lower mold 503b in the same two-dimensional direction. 500a and the lower mold drive stage 500b are supplied.
  • step S12 the center position R of each alignment line PL formed in each of the upper mold 503a and the lower mold 503b, and the center pin The position of the central axis CJ of 30b coincides.
  • the center position of the substrate 6, the center point of the concavo-convex pattern formed on the upper mold 503a, and the center point of the concavo-convex pattern formed on the lower mold 503b coincide with each other.
  • step S12 After execution of the mold / substrate alignment operation (step S12), the camera unit 40 is moved from the UV irradiation optical path, that is, from the opening 100a by the camera unit movement signal KG U supplied from the controller 200.
  • the controller 200 supplies a stage drive signal SG for moving the upper stage 505a downward to the stage vertical drive unit 511 (step S13).
  • step S13 the upper mold holding unit 501a moves downward in the direction of the central axis of the center pin 30b.
  • step S14 determines whether or not the upper mold 503a has contacted the substrate 6 from the output of a sensor or the like (not shown) (step S14).
  • the controller 200 returns to the execution of step S13 and performs the operation as described above again. That is, as shown in [State 12] in FIG. 8, the upper mold holding portion 501a is moved downward until the upper mold 503a contacts the substrate 6.
  • step S15 When it is determined in step S14 that the upper mold 503a is in contact with the substrate 6, the controller 200 performs a mold pressing operation for pressing the upper mold 503a and the lower mold 503b against the substrate 6 (step S15).
  • the controller 200 in order to press the substrate 6 the upper mold 503a and the lower mold 503b with a predetermined pressing value PV AD, the stage drive signal SG to move the upper stage 505a downward It is supplied to the stage vertical drive unit 511 for a predetermined time. Thereby, first, the lower mold 503b comes into contact with the upper transfer layer 604a of the substrate 6, and the substrate 6 is lowered together with the upper mold 503a. As a result, as shown in [State 13] in FIG.
  • both surfaces of the substrate 6 are pressed by the upper mold 503a and the lower mold 503b, and the state is maintained for a predetermined time. Therefore, the concave / convex pattern formed on the upper mold 503a is pressed against the upper transfer layer 604a, and the concave / convex pattern formed on the lower mold 503b is pressed against the lower transfer layer 604b. Since the upper transfer layer 604a and the lower transfer layer 604b are in a liquid state (flowable state), the upper transfer layer 604a is deformed along the uneven pattern shape formed in the upper mold 503a, and the lower transfer layer 604b is Each deforms along the uneven pattern shape formed in the lower mold 503b.
  • the transfer conditions such as the pressure and holding time for pressing the upper mold 503a and the lower mold 503b against the substrate 6 are the uneven pattern shape of the upper mold 503a and the lower mold 503b and the materials of the upper transfer layer 604a and the lower transfer layer 604b. It sets suitably according to etc.
  • step S15 the controller 200 supplies the ultraviolet irradiation signal UV to the upper UV irradiation unit 508a and the lower UV irradiation unit 508b (step 16).
  • step 16 causes the upper UV irradiation unit 508a to irradiate the upper transfer layer 604a of the substrate 6 with ultraviolet rays to cure the transfer material, and the lower UV irradiation unit 508b lowers the ultraviolet rays to cure the transfer material. Irradiation is performed toward the side transfer layer 604b. Thereby, the transfer layers of the upper transfer layer 604a and the lower transfer layer 604b are cured, and the uneven pattern on the surfaces of the upper transfer layer 604a and the lower transfer layer 604b is determined.
  • the controller 200 executes a mold release operation for releasing the substrate 6 from the upper mold 503a and the lower mold 503b (step S17).
  • the controller 200 supplies a stage drive signal SG for moving the upper stage 505a upward by a predetermined distance to the stage vertical drive unit 511.
  • the upper mold 503a is released from the upper transfer layer 604a of the substrate 6 as shown in [State 15] in FIG.
  • the controller 200 supplies the center pin moving signal CG L to move the center pin 30b upward to the center pin drive unit 507b.
  • the substrate 6 is released from the lower mold 503b.
  • the substrate 6 may be fixed by a fixing member (not shown) so that the substrate 6 does not adhere to the upper mold 503a and move together with the upward movement of the upper stage 505a. good. Further, the upper stage 505a and the center pin 30b may be moved simultaneously. In this case, the upper mold 503a and the lower mold 503b can be released from the substrate 6 at the same time by making the rising speed of the upper stage 505a faster than the rising speed of the center pin 30b.
  • a concavo-convex pattern in which the concavo-convex state is reversed from the concavo-convex pattern formed in the upper mold 503a is formed in the upper transfer layer 604a and the concavo-convex pattern formed in the lower mold 503b
  • the substrate 6 is obtained in which the concave / convex pattern in which the concave / convex state is inverted is formed on the lower transfer layer 604b.
  • the controller 200 sends a command to detach the substrate 6 from the center pin 30b to the substrate transfer device.
  • double-sided pattern transfer is performed by the upper mold 503a and the lower mold 503b for the upper transfer layer 604a and the lower transfer layer 604b of the substrate 6, respectively.
  • the controller 200 determines whether or not an operation command signal indicating the end of the operation is supplied from the operation unit 201 (step S18). When it is determined in step S18 that the operation command signal indicating the operation end is supplied, the controller 200 ends the imprint processing program. On the other hand, if it is determined in step S18 that the operation command signal indicating the end of the operation is not supplied, the controller 200 waits until the substrate transfer device removes the substrate 6 supported by the center pin 30b. , as shown the center pin 30b in the state 6] in FIG. 7, for supplying the center pin moving signal CG L to be moved to a predetermined position for mounting the substrate 6 to the center pin drive unit 507b (step S19).
  • step S19 the controller 200 repeatedly determines whether or not the substrate 6 is supported on the center pin 30b until the substrate 6 is supported (step S20).
  • the substrate transfer device (not shown) attaches a new substrate 6 to the center pin 30b so that the center pin 30b passes through the center hole of the substrate 6.
  • the controller 200 determines in step S20 that the substrate 6 is supported by the center pin 30b, returns to the execution of step S13, and repeatedly executes the operation as described above. Thereby, pattern transfer is continuously performed on the newly mounted substrate 6.
  • the molds are aligned (step S10), and then the mold and the substrate are aligned (Ste S12).
  • the positions of the upper mold 503a and the lower mold 503b are adjusted so that the center position of the substrate 6 coincides with the center position R of the alignment mark formed on the mold (503a, 503b).
  • the alignment mark is formed so as to be concentric with the concave / convex pattern formed on the mold, the center point of the mold coincides with the central point of the concave / convex pattern formed on the mold due to variations in mold manufacturing.
  • the alignment for aligning the center point of the concavo-convex pattern with the center of the substrate can be performed with high accuracy, and the concavo-convex shape does not occur with respect to the substrate
  • the pattern can be transferred.
  • the imprint process as described above by the imprint apparatus shown in FIG. 1 can be applied to a manufacturing process of a magnetic recording medium such as a discrete track medium or a bit patterned medium.
  • an upper mold 503a and a lower mold 503b having a desired concavo-convex pattern on the surface of a base material made of a material that transmits ultraviolet rays such as glass are prepared.
  • the concavo-convex pattern is formed by forming a resist pattern on a substrate using, for example, an electron beam drawing apparatus, and then performing dry etching using the resist pattern as a mask.
  • the completed upper mold 503a and lower mold 503b are subjected to surface treatment with a silane coupling agent or the like for improving the mold release property.
  • a substrate made of a material that transmits ultraviolet rays such as glass replicated by an imprint method or the like, may be used as a transfer mold using the upper mold 503a and the lower mold 503b as masters.
  • a substrate made of a material that transmits ultraviolet rays such as glass duplicated by an imprint method or the like from the duplication disk produced by the above method, may be used as a transfer mold. If a duplicate transfer mold is used, the master and / or the base material of the duplicate disk is, for example, ultraviolet rays such as nickel (including alloys) duplicated by a method such as silicon or electroforming. A material that does not transmit can be used.
  • a magnetic disk media substrate (hereinafter referred to as a media substrate) 600 is manufactured.
  • the media substrate 600 has, for example, an upper side on one side (upper side) and the other side (lower side) of a disc-shaped support substrate 601 made of specially processed chemically strengthened glass, silicon wafer, aluminum substrate, or the like.
  • a plurality of layers including the transfer layer 604a and the lower transfer layer 604b are laminated as follows. That is, as shown in FIG. 12A, on the upper surface of the support substrate 601, an upper nonmagnetic layer 602a made of a nonmagnetic material, an upper metal layer 603a made of a metal material such as Ta or Ti, and an upper transfer A layer 604a is stacked.
  • a lower nonmagnetic layer 602b made of a nonmagnetic material, a lower metal layer 603b made of a metal material such as Ta or Ti, and a lower transfer layer 604b are laminated on the lower surface of the support substrate 601.
  • the upper nonmagnetic layer 602a, the upper metal layer 603a, the lower nonmagnetic layer 602b, and the lower metal layer 603b are formed by a sputtering method or the like.
  • the concavo-convex pattern formed on the upper mold 503a and the lower mold 503b is transferred to the upper transfer layer 604a and the lower transfer layer 604b formed on the media substrate 600 by the imprint method described above. That is, the upper transfer layer 604a and the lower transfer layer 604b are formed on the media substrate 600 prepared in the above process by spin coating or the like, and the reference positions of the upper mold 503a and the lower mold 503b are aligned with the central axis of the center pin 30b.
  • the media substrate 600 is supported on the center pin 30b, and the upper mold 503a is placed on the lower mold in the direction of the center axis of the center pin 30b with the reference position aligned with the center axis of the center pin 30b.
  • the upper mold 503 a is pressed against one surface of the media substrate 600 and the lower mold 503 b is pressed against the other surface of the media substrate 600.
  • the upper UV irradiation unit 508a irradiates the upper transfer layer 604a of the media substrate 600 with ultraviolet rays to cure the transfer layer
  • the lower UV irradiation unit 508b emits ultraviolet rays to cure the transfer layer.
  • the upper transfer layer 604a and the lower transfer layer 604b are cured by irradiating toward the 604b, the upper mold 503a and the lower mold 503b are released from the media substrate 600, and the media substrate 600 is taken out.
  • the media substrate 600 is formed on both sides with a cross-sectional structure as shown in FIG.
  • etching is performed on both surfaces of the media substrate 600 having a structure as shown in FIG.
  • the etching process first, the remaining film of the upper transfer layer 604a remains in the portion corresponding to the convex portion of the upper mold 503a, and the residual film of the lower transfer layer 604b remains in the portion corresponding to the convex portion of the lower mold 503b.
  • the remaining film is removed by oxygen reactive ion etching (RIE) or the like.
  • RIE oxygen reactive ion etching
  • the upper metal layer 603a and the lower metal layer 603b are etched and patterned by dry etching using the upper transfer layer 604a and the lower transfer layer 604b patterned by the imprint process as a mask.
  • the recesses in the concavo-convex patterns of the upper resist layer 604a and the lower resist layer 604b and the recesses in the upper metal layer 603a and the lower metal layer 603b are formed. Corresponding portions are removed, and a pattern is formed on each of the upper metal layer 603a and the lower metal layer 603b (metal mask patterning step).
  • a transfer layer removal process is performed on both surfaces of the media substrate 600 in the state shown in FIG. 12B by a method such as wet etching or dry ashing. Then, the transfer layer remaining on each of the upper metal layer 603a and the lower metal layer 603b is removed (transfer layer removing process).
  • the non-magnetic material is etched and patterned by dry etching using the upper metal layer 603a and the lower metal layer 603b as a mask for the media substrate 600 in the state as shown in FIG.
  • a pattern is formed on the nonmagnetic material by a predetermined depth as shown in FIG. 12D for the exposed regions of the upper nonmagnetic layer 602a and the lower nonmagnetic layer 602b (nonmagnetic). Layer patterning process).
  • the remaining upper metal layer 603a and lower metal layer 603b are removed from both surfaces of the media substrate 600 in a state as shown in FIG. 12D by a method such as wet etching or dry etching.
  • a method such as wet etching or dry etching.
  • FIG. 12E the metal layer remaining in each of the upper nonmagnetic layer 602a and the lower nonmagnetic layer 602b is removed (metal mask removing process).
  • the concave portions of the upper nonmagnetic layer 602a and the lower nonmagnetic layer 602b are filled with a magnetic material (shown in black), and the upper protective layer 605a and the upper lubricating layer are further filled.
  • a layer 606a, a lower protective layer 605b, and a lower lubricating layer 606b are stacked as shown in FIG.
  • the substrate 6 having the concavo-convex pattern formed on both surfaces thereof by the imprint apparatus shown in FIG. 1 is subjected to the processes as shown in FIGS. 12A to 12F, so that FIG.
  • FIG. 12A to 12F a method for manufacturing a magnetic disk from a media substrate 600 having an upper nonmagnetic layer 602a and a lower nonmagnetic layer 602b as shown in FIG. 12A.
  • the magnetic disk may be manufactured from the media substrate 600 employing the upper magnetic layer and the lower magnetic layer made of a magnetic material instead of the upper nonmagnetic layer 602a and the lower nonmagnetic layer 602b.
  • the magnetic material is etched by dry etching using the upper metal layer 603a and the lower metal layer 603b as a mask with respect to the media substrate 600 in the state as shown in FIG.
  • a pattern is formed on the magnetic material by a predetermined depth for each exposed region of the side nonmagnetic layer (magnetic layer patterning step). Then, the magnetic disk is obtained by filling the concave portions of the upper magnetic layer and the lower magnetic layer with a nonmagnetic material.
  • the imprint method according to this embodiment is different from the first embodiment in the alignment adjustment method.
  • the alignment adjustment method according to the present embodiment will be described with reference to FIGS.
  • step S10 after the alignment between the molds is performed (step S10), the substrate 6 is mounted and then the alignment adjustment between the mold and the substrate is performed (step S12), but the substrate 6 is not mounted. Both can be executed together in the state.
  • FIG. 13 and FIG. 14 are diagrams showing another example of the imprint processing program made in view of this point.
  • FIGS. 15 to 18 schematically show the pattern transfer operation performed by executing the imprint processing program for each stage.
  • steps S101 to S109 shown in FIG. 13 is the same as that in steps S1 to S9 shown in FIG. 4, and the pattern transfer operation at each stage by the execution of steps S101 to S109, that is, in FIG. [State 1] to [State 6] in FIG. 16 are the same as [State 1] to FIG. 7 [State 6] in FIG.
  • step S109 the controller 200 executes an alignment operation for aligning the upper mold 503a, the lower mold 503b, and the substrate 6 (step S110).
  • a unit position adjustment signal UP for moving the installation position of the unit 40 itself is supplied to the camera unit drive stage 90.
  • the center positions Ra and Rb of the alignment line PL of each of the upper mold 503a and the lower mold 503b are not necessarily the position of the center axis CJ of the center pin 30b due to variations in mold manufacture, as shown in FIG. Is not consistent. Therefore, as shown in [State 7] in FIG. 16, when the camera unit 40 is arranged at a position where the photographing axis of the camera 41a coincides with the center axis CJ (indicated by a broken line) of the center pin 30b, FIG.
  • the controller 200 sets a stage driving signal SG for moving the upper stage 505b downward based on the imaging signal PDb (or PDc, PDd) obtained by imaging with the camera 41b (or 41c, 41d). It is supplied to the vertical drive unit 511.
  • the controller 200 sets the upper mold 503a and the upper mold 503a so that the alignment lines PL of both molds (503a, 503b) overlap at the same position in each of the one-frame images Fb to Fd as shown in FIG.
  • Various control signals (XY U , XY L , ⁇ U , ⁇ L ) for moving or rotating the lower mold 503b are supplied to the mold driving stage (500a, 500b).
  • the alignment lines PL of the upper mold 503a and the lower mold 503b are positioned together on the axis perpendicular to the surface of the substrate 6, that is, the upper mold 503a and the lower mold.
  • the reference positions of 503b coincide with each other.
  • the controller 200 sets the upper mold at the center positions (indicated by crosses) of the 1-frame images Fb to Fd obtained by photographing with the cameras 41b to 41d.
  • the positions of the upper mold 503a and the lower mold 503b are adjusted so that the alignment line PL of 503a (or the lower mold 503b) is positioned. That is, the controller 200 sends the upper XY stage movement signal XY U and the lower XY stage movement signal XY L to move the positions of the upper mold 503a and the lower mold 503b in the same two-dimensional direction. 500a and the lower mold drive stage 500b are supplied. According to this adjustment, as shown in FIG.
  • the controller 200 supplies the stage vertical drive unit 511 with a stage drive signal SG for moving the upper stage 505a upward. Accordingly, as shown in [State 9] in FIG. 17, the upper mold 503a and the lower mold 503b are separated from each other to the extent that the substrate 6 can be mounted on the second support portion TB2 of the center pin 30b. .
  • step S110 the position of the center axis CJ of the center pin 30b and the center position of the alignment line PL formed in both molds (503a, 503b) are adjusted to coincide with each other. It is. That is, the position of the center axis CJ of the center pin 30b, the center point of the concavo-convex pattern formed on the upper mold 503a, and the center point of the concavo-convex pattern formed on the lower mold 503b coincide.
  • the camera unit 40 moves from the UV irradiation optical path, that is, from the opening 100a by the camera unit movement signal KG U supplied from the controller 200.
  • the controller 200 repeatedly determines whether or not the substrate 6 is supported on the center pin 30b until the substrate 6 is supported (step S111).
  • the substrate transfer device (not shown) attaches the substrate 6 to the center pin 30b so that the center pin 30b passes through the center hole of the substrate 6.
  • the substrate 6 is supported on the second support portion TB2 of the center pin 30b as shown in [State 10] in FIG.
  • the substrate 6 is supported by the center pin 30b in a state where the position of the center axis of the center pin 30b and the reference position (the position of the center hole) of the substrate 6 coincide. That is, the center position of the substrate 6, the center point of the concavo-convex pattern formed on the upper mold 503a, and the center point of the concavo-convex pattern formed on the lower mold 503b coincide.
  • step S111 If it is determined in step S111 that the substrate 6 is supported by the center pin 30b, then the controller 200 sends a stage drive signal SG for moving the upper stage 505a downward to the stage vertical drive unit 511.
  • Supply step S112
  • step S112 the upper mold holding unit 501a moves downward in the central axis direction of the center pin 30b.
  • step S113 determines whether or not the upper mold 503a has contacted the substrate 6 (step S113).
  • step S113 determines whether or not the upper mold 503a has contacted the substrate 6 (step S113).
  • the controller 200 returns to the execution of step S112 and performs the above-described operation again. That is, as shown in [State 11] in FIG. 17, the upper mold holding portion 501a is moved downward until the upper mold 503a contacts the substrate 6.
  • step S114 When it is determined in step S113 that the upper mold 503a is in contact with the substrate 6, the controller 200 performs a mold pressing operation for pressing the upper mold 503a and the lower mold 503b against the substrate 6 (step S114).
  • the controller 200 in order to press the substrate 6 the upper mold 503a and the lower mold 503b with a predetermined pressing value PV AD, stage drive signal to move the upper stage 505a downward SG Is supplied to the stage vertical drive unit 511 for a predetermined time.
  • the lower mold 503b contacts the upper transfer layer 604a of the substrate 6, and the substrate 6 is lowered together with the lower mold 503b.
  • both surfaces of the substrate 6 are pressed by the upper mold 503a and the lower mold 503b, and the state is maintained for a predetermined time. Therefore, the concave / convex pattern formed on the upper mold 503a is pressed against the upper transfer layer 604a, and the concave / convex pattern formed on the lower mold 503b is pressed against the lower transfer layer 604b. Since the upper transfer layer 604a and the lower transfer layer 604b are in a liquid state (flowable state), the upper transfer layer 604a is deformed along the uneven pattern shape formed in the upper mold 503a, and the lower transfer layer 604b is Each deforms along the uneven pattern shape formed in the lower mold 503b.
  • the pressure, holding time, and the like for pressing the upper mold 503a and the lower mold 503b against the substrate 6 and the transfer conditions are the uneven pattern shape of the upper mold 503a and the lower mold 503b and the material of the upper transfer layer 604a and the lower transfer layer 604b. It sets suitably according to etc.
  • the controller 200 executes a transfer layer curing operation for curing the upper transfer layer 604a and the lower transfer layer 604b of the substrate 6 (step S115).
  • the controller 200 supplies the ultraviolet irradiation signal UV to the upper UV irradiation unit 508a and the lower UV irradiation unit 508b.
  • the upper UV irradiation unit 508a irradiates the upper transfer layer 604a of the substrate 6 with ultraviolet rays for curing the transfer material
  • the lower UV irradiation unit 508b applies the ultraviolet rays for curing the transfer material with the lower transfer layer. Irradiate toward 604b.
  • the transfer layers of the upper transfer layer 604a and the lower transfer layer 604b are cured, and the uneven pattern on the surfaces of the upper transfer layer 604a and the lower transfer layer 604b is determined.
  • the controller 200 executes a mold release operation for releasing the substrate 6 from the upper mold 503a and the lower mold 503b (step S116).
  • a mold release operation the controller 200 supplies a stage drive signal SG for moving the upper stage 505a upward by a predetermined distance to the stage vertical drive unit 511.
  • the controller 200 supplies the center pin moving signal CG L to move the center pin 30b upward to the center pin drive unit 507b.
  • the substrate 6 is released from the lower mold 503b.
  • the substrate 6 may be fixed by a fixing member (not shown) so that the substrate 6 does not adhere to the upper mold 503a and move together with the upward movement of the upper stage 505a. good. Further, the upper stage 505a and the center pin 30b may be moved simultaneously. In this case, the upper mold 503a and the lower mold 503b can be released from the substrate 6 at the same time by making the rising speed of the upper stage 505a faster than the rising speed of the center pin 30b.
  • a concavo-convex pattern in which the concavo-convex state is reversed from the concavo-convex pattern formed in the upper mold 503a is formed in the upper transfer layer 604a and the concavo-convex pattern formed in the lower mold 503b
  • the substrate 6 is obtained in which the concave / convex pattern in which the concave / convex state is inverted is formed on the lower transfer layer 604b.
  • the controller 200 sends a command to detach the substrate 6 from the center pin 30b to the substrate transfer device.
  • double-sided pattern transfer is performed by the upper mold 503a and the lower mold 503b for the upper transfer layer 604a and the lower transfer layer 604b of the substrate 6, respectively.
  • step S117 determines whether or not an operation command signal indicating the end of the operation is supplied from the operation unit 201 (step S117). If it is determined in step S117 that an operation command signal indicating the end of the operation has been supplied, the controller 200 ends the imprint processing program. On the other hand, when it is determined in step S117 that the operation command signal indicating the end of the operation is not supplied, the controller 200 waits until the substrate transfer device removes the substrate 6 supported by the center pin 30b. supplies center pin moving signal CG L to be moved to a predetermined position for mounting the center pin 30b of the new board 6 as shown in the state 6] in FIG. 16 to the center pin drive unit 507b (step S118).
  • step S118 the controller 200 returns to the execution of step S11 and repeatedly executes the operation as described above. That is, first, the controller 200 repeatedly determines whether or not the substrate 6 is supported on the center pin 30b by executing the above step S111 until the substrate 6 is supported.
  • the substrate transfer device (not shown) attaches a new substrate 6 to the center pin 30b so that the center pin 30b passes through the center hole of the substrate 6.
  • the controller 200 determines that the substrate 6 is supported by the center pin 30b in the step S111, and executes the operations of the steps S112 to S118 again, thereby continuously with respect to the newly mounted substrate 6. Pattern transfer.
  • the substrate 6 and the molds (503a, 503b) are aligned with each other before the substrate 6 is mounted.
  • the number of execution steps can be reduced.
  • the operation when pattern transfer is performed on both surfaces of the substrate 6 has been described.
  • the imprint method of the present application is also applied when pattern transfer is performed only on one surface of the substrate 6. Is possible.
  • FIG. 20 and FIG. 21 show an example of an imprint processing program for single-sided transfer made in view of such points.
  • FIGS. 22 to 24 schematically show the states (positional relationships) of the upper mold holding portion 501a, the lower mold holding portion 501b, and the center pin 30b for each stage in the pattern transfer operation. .
  • the controller 200 supplies the center pin moving signal CG L to move the center pin 30b to a predetermined initial position to the center pin drive unit 507b (step S201).
  • the center pin driving unit 507b causes the center pin 30b to be in the initial state as shown in [State 1] in FIG. 22, that is, the first support portion TB1 and the second support portion TB2 in the center pin 30b are both in the initial state. Then, it moves to a position that appears at a position above the mold holding surface of the lower mold holding portion 501b.
  • the controller 200 repeatedly determines whether or not the center pin 30b supports the upper mold 503a until the upper mold 503a is supported (step S202).
  • the mold conveying device (not shown) attaches the upper mold 503a to the center pin 30b so that the center pin 30b passes through the center hole CA of the upper mold 503a as described above.
  • the upper mold 503a is supported by the first support portion TB1 of the center pin 30b as shown in [State 2] in FIG. 22 with the pattern surface facing downward.
  • step S202 If it is determined in step S202 that the upper mold 503a is supported by the center pin 30b, the controller 200 supplies a stage drive signal SG for moving the upper stage 505a downward to the stage vertical drive unit 511. (Step S203). By executing step S203, the entire upper mechanism section including the upper mold holding section 501a gradually moves downward.
  • step S204 determines whether or not the mold holding surface of the upper mold holding part 501a has come into contact with the upper mold 503a.
  • step S204 determines whether or not the mold holding surface of the upper mold holding portion 501a has come into contact with the upper mold 503a.
  • the controller 200 returns to the execution of step S203 and executes the operation as described above again. That is, as shown in [State 3] in FIG. 22, the upper mold holding part 501a is moved downward until the mold holding surface of the upper mold holding part 501a contacts the upper mold 503a.
  • step S204 When it is determined in step S204 that the mold holding surface of the upper mold holding unit 501a has contacted the upper mold 503a, the controller 200 supplies the upper mold holding signal MH U to the upper mold holding unit 501a (step S205). Accordingly, the upper mold 503a is held on the mold holding surface of the upper mold holding portion 501a in a state where the center position Q of the upper mold 503a as shown in FIG. 10 is aligned with the center axis of the center pin 30b.
  • step S206 supplies a stage drive signal SG for moving the upper stage 505a upward by a predetermined distance to the stage vertical drive unit 511 (step S206).
  • step S206 As shown in [State 4] in FIG. 22, the upper mold holding portion 501a moves upward in the central axis direction of the center pin 30b.
  • the upper mold 503a is detached from the center pin 30b. That is, by performing the above steps S1 to S6, the upper mold 503a is held on the mold holding surface of the upper mold holding portion 501a in a state where the reference position coincides with the central axis of the center pin 30b.
  • the controller 200 repeatedly determines whether or not the substrate 6 is supported by the center pin 30b until the substrate 6 is supported (step S207).
  • the substrate transfer device (not shown) attaches the substrate 6 to the center pin 30b so that the center pin 30b passes through the center hole of the substrate 6. Accordingly, the substrate 6 is supported on the second support portion TB2 of the center pin 30b as shown in [State 5] in FIG. That is, the substrate 6 is supported by the center pin 30b in a state where the position of the center axis of the center pin 30b and the reference position (the position of the center hole) of the substrate 6 coincide.
  • An upper transfer layer 604a is formed on one surface of the substrate 6 (here, the upper side of the substrate).
  • step S207 If it is determined in step S207 that the substrate 6 is supported by the center pin 30b, then the controller 200 executes a mold / substrate alignment operation in which the upper mold 503a and the substrate 6 are to be aligned. (Step S208).
  • molded substrate alignment operation first, as shown in State 6] in FIG. 24, to move the camera unit 40 to the center position of the opening 100a by the camera unit movement signal KG U supplied from the controller 200.
  • the controller 200 should move the upper stage 505a downward until the surface of the tip of the center pin 30b appears in one frame image based on the photographing signal PDa obtained by the camera 41a.
  • a stage drive signal SG is supplied to the stage vertical drive unit 511.
  • this adjusts the focus to focus the camera 41a on the surface of the tip of the center pin 30b.
  • the controller 200 determines that the center axis CJ of the center pin 30b is located at the center position of the one frame image based on the tip image of the center pin 30b existing in the one frame image.
  • a unit position adjustment signal UP for moving the installation position of the unit 40 itself is supplied to the camera unit drive stage 90. Accordingly, as shown in [State 6] in FIG. 23, the camera unit 40 is arranged at a position where the imaging axis of the camera 41a and the center axis CJ (indicated by a broken line) of the center pin 30b coincide.
  • the controller 200 photographs the alignment line PL of the upper mold 503a with the cameras 41b to 41d.
  • the controller 200 aligns the upper mold 503a at the center position (indicated by a cross) of each of the one-frame images Fb to Fd as shown in FIG. 11B obtained by photographing with these cameras 41b to 41d.
  • the position of the upper mold 503a is adjusted so that the line PL is positioned. That is, the controller 200 may be moved to the position of the upper mold 503a, is to supply the upper XY stage movement signal XY U to the upper mold driving stage 500a.
  • step S208 the center position R of the alignment line PL formed in the upper mold 503a and the position of the center axis CJ of the center pin 30b. Will match. Thereby, the center position of the board
  • step S208 After execution of the mold / substrate alignment operation (step S208), the camera unit 40 is moved from the UV irradiation optical path, that is, from the opening 100a by the camera unit movement signal KG U supplied from the controller 200.
  • the controller 200 supplies a stage drive signal SG for moving the upper stage 505a downward to the stage vertical drive unit 511 (step S209).
  • step S209 the upper mold holding unit 501a moves downward in the central axis direction of the center pin 30b.
  • step S210 determines whether or not the upper mold 503a has contacted the substrate 6 (step S210).
  • step S210 determines whether or not the upper mold 503a has contacted the substrate 6 (step S210).
  • the controller 200 returns to the execution of step S209 and performs the above-described operation again. That is, as shown in [State 8] in FIG. 23, the upper mold holding portion 501a is moved downward until the upper mold 503a contacts the substrate 6.
  • step S210 When it is determined in step S210 that the upper mold 503a has come into contact with the substrate 6, the controller 200 performs a mold pressing operation for pressing the upper mold 503a against the substrate 6 (step S211).
  • the controller 200 in order to press the substrate 6 the upper mold 503a with a predetermined pressing value PV AD, stage drive signal SG stage vertical drive unit for moving the upper stage 505a downward 511 For a predetermined time.
  • stage drive signal SG stage vertical drive unit for moving the upper stage 505a downward 511
  • the substrate 6 is lowered together with the upper mold 503a, and the upper transfer layer 604a of the substrate 6 is pressed by the upper mold 503a as shown in [State 8] in FIG. 23, and this state is maintained for a predetermined time.
  • the uneven pattern formed on the upper mold 503a is pressed against the upper transfer layer 604a.
  • the upper transfer layer 604a is in a liquid state (flowable state)
  • the upper transfer layer 604a is deformed along the uneven pattern shape formed on the upper mold 503a.
  • the transfer conditions such as the pressure and holding time for pressing the upper mold 503a against the substrate 6 are appropriately set according to the concave / convex pattern shape of the upper mold 503a, the material of the upper transfer layer 604a, and the like.
  • the controller 200 executes a transfer layer curing operation for curing the upper transfer layer 604a of the substrate 6 (step S212).
  • the controller 200 supplies the ultraviolet irradiation signal UV to the upper UV irradiation unit 508a.
  • the upper UV irradiation unit 508a irradiates the upper transfer layer 604a of the substrate 6 with ultraviolet rays for curing the transfer material.
  • the transfer layer of the upper transfer layer 604a is cured, and the uneven pattern on the surface of the upper transfer layer 604a is determined.
  • the controller 200 executes a mold release operation for releasing the substrate 6 from the upper mold 503a (step S213).
  • the controller 200 supplies a stage drive signal SG for moving the upper stage 505a upward by a predetermined distance to the stage vertical drive unit 511 and a center pin for moving the center pin 30b upward. supplying a shift signal CG L to the center pin drive unit 507b. Accordingly, as shown in [State 10] in FIG. 24, the upper mold 503a is released from the upper transfer layer 604a of the substrate 6.
  • the substrate 6 may be fixed by a fixing member (not shown) so that the substrate 6 does not adhere to the upper mold 503a and move together with the upward movement of the upper stage 505a. good.
  • the substrate 6 is obtained in which the concavo-convex pattern in which the concavo-convex state is reversed from the concavo-convex pattern formed in the upper mold 503a is formed in the upper transfer layer 604a.
  • the controller 200 supplies the center pin moving signal CG L to move the center pin 30b upward to the center pin drive unit 507b.
  • the substrate 6 is supported by the center pin 30b.
  • the controller 200 sends a command to detach the substrate 6 from the center pin 30b to the substrate transfer device.
  • the controller 200 determines whether or not an operation command signal indicating the end of the operation is supplied from the operation unit 201 (step S214). If it is determined in step S214 that an operation command signal indicating the end of the operation has been supplied, the controller 200 ends the imprint processing program. On the other hand, if it is determined in step S214 that the operation command signal indicating the end of the operation is not supplied, the controller 200 waits until the substrate transfer apparatus removes the substrate 6 supported by the center pin 30b. , as shown the center pin 30b to state 4 in FIG. 22, and supplies the center pin moving signal CG L to be moved to a predetermined position for mounting the substrate 6 to the center pin drive unit 507b (step S215).
  • step S215 the controller 200 repeatedly determines whether or not the substrate 6 is supported on the center pin 30b until the substrate 6 is supported (step S216).
  • the substrate transfer device (not shown) attaches a new substrate 6 to the center pin 30b so that the center pin 30b passes through the center hole of the substrate 6.
  • the controller 200 determines in step S216 that the substrate 6 is supported by the center pin 30b, returns to the execution of step S209, and repeatedly executes the operation as described above. Thereby, single-sided pattern transfer is continuously performed on the newly mounted substrate 6.
  • the pattern transfer is performed by pressing the mold (503a) from the upper side against the substrate 6 on which the transfer layer (604a) is formed only on the upper surface.
  • single-sided pattern transfer may be performed by pressing the substrate 6 on which the transfer layer (604b) is formed only on the lower surface against the mold (503b) provided on the lower surface.
  • the substrate 6 is mounted and then the alignment operation (step S208) between the mold and the substrate is executed. You may make it perform alignment operation between a mold and a board
  • FIGS. 25 and 26 are diagrams showing another example of the imprint processing program made in view of the above points.
  • FIGS. 27 to 29 schematically show the pattern transfer operation performed by executing the imprint processing program for each stage.
  • steps S301 to S306 shown in FIG. 25 is the same as that in steps S201 to S2066 shown in FIG. 20, and the pattern transfer operation at each stage by the execution of steps S301 to S306, that is, in FIG. [State 1] to [State 4] are the same as [State 1] to [State 4] in FIG.
  • step S306 the controller 200 executes a mold / substrate alignment operation in which the upper mold 503a and the substrate 6 should be aligned (step S307).
  • the controller 200 first supplies the camera unit movement signal KG U to move the camera unit 40 to the center position of the opening 100a.
  • the controller 200 should move the upper stage 505a downward until the surface of the tip of the center pin 30b appears in one frame image based on the photographing signal PDa obtained by the camera 41a.
  • a stage drive signal SG is supplied to the stage vertical drive unit 511. In other words, this adjusts the focus to focus the camera 41a on the surface of the tip of the center pin 30b.
  • the controller 200 determines that the center axis CJ of the center pin 30b is located at the center position of the one frame image based on the tip image of the center pin 30b existing in the one frame image.
  • a unit position adjustment signal UP for moving the installation position of the unit 40 itself is supplied to the camera unit drive stage 90.
  • the camera unit 40 is arranged at a position where the imaging axis of the camera 41a and the center axis CJ (indicated by a broken line) of the center pin 30b coincide.
  • the controller 200 photographs the alignment line PL of the upper mold 503a with the cameras 41b to 41d.
  • the controller 200 aligns the upper mold 503a at the center position (indicated by a cross) of each of the one-frame images Fb to Fd as shown in FIG. 11B obtained by photographing with the cameras 41b to 41d.
  • the position of the upper mold 503a is adjusted so that the line PL is positioned. That is, the controller 200 may be moved to the position of the upper mold 503a, is to supply the upper XY stage movement signal XY U to the upper mold driving stage 500a.
  • step S307 the center position R of the alignment line PL formed in the upper mold 503a and the position of the center axis CJ of the center pin 30b. Will match. Thereby, the center axis CJ of the center pin 30b and the center point of the concavo-convex pattern formed in the upper mold 503a coincide with each other.
  • the controller 200 After the execution of the mold substrate alignment operation (step S307), the optical path of the camera unit 40 UV irradiation, i.e., to move from the opening 100a, the controller 200 supplies the camera unit movement signal KG U. Next, the controller 200 repeatedly determines whether or not the substrate 6 is supported on the center pin 30b until the substrate 6 is supported (step S308).
  • the substrate transfer device (not shown) attaches the substrate 6 to the center pin 30b so that the center pin 30b passes through the center hole of the substrate 6. As a result, the substrate 6 is supported on the second support portion TB2 of the center pin 30b as shown in [State 7] in FIG.
  • the substrate 6 is supported by the center pin 30b in a state where the position of the center axis CJ of the center pin 30b and the reference position (the position of the center hole) of the substrate 6 coincide. That is, the center position of the substrate 6 coincides with the center point of the uneven pattern formed on the upper mold 503a.
  • step S308 If it is determined in step S308 that the substrate 6 is supported by the center pin 30b, then the controller 200 sends a stage drive signal SG for moving the upper stage 505a downward to the stage vertical drive unit 511. Supply (step S309). By executing step S309, the upper mold holding unit 501a moves downward in the central axis direction of the center pin 30b.
  • step S310 determines whether or not the upper mold 503a has contacted the substrate 6 (step S310).
  • step S310 determines whether or not the upper mold 503a has contacted the substrate 6 (step S310).
  • the controller 200 returns to the execution of step S309 and performs the above-described operation again. That is, as shown in [State 8] in FIG. 28, the upper mold holding portion 501a is moved downward until the upper mold 503a contacts the substrate 6.
  • step S310 When it is determined in step S310 that the upper mold 503a has come into contact with the substrate 6, the controller 200 performs a mold pressing operation for pressing the upper mold 503a against the substrate 6 (step S311).
  • the controller 200 in order to press the substrate 6 the upper mold 503a with a predetermined pressing value PV AD, vertical stage drive unit stage drive signal SG to move the upper stage 505a downward 511 is supplied for a predetermined time.
  • the substrate 6 is lowered together with the upper mold 503a, and the upper transfer layer 604a of the substrate 6 is pressed by the upper mold 503a as shown in [State 8] in FIG. 28, and this state is maintained for a predetermined time.
  • the uneven pattern formed on the upper mold 503a is pressed against the upper transfer layer 604a.
  • the upper transfer layer 604a is in a liquid state (flowable state)
  • the upper transfer layer 604a is deformed along the uneven pattern shape formed on the upper mold 503a.
  • the transfer conditions such as the pressure and holding time for pressing the upper mold 503a against the substrate 6 are appropriately set according to the concave / convex pattern shape of the upper mold 503a, the material of the upper transfer layer 604a, and the like.
  • the controller 200 executes a transfer layer curing operation for curing the upper transfer layer 604a of the substrate 6 (step S312).
  • the controller 200 supplies the ultraviolet irradiation signal UV to the upper UV irradiation unit 508a.
  • the upper UV irradiation unit 508a irradiates the upper transfer layer 604a of the substrate 6 with ultraviolet rays for curing the transfer material.
  • the transfer layer of the upper transfer layer 604a is cured, and the uneven pattern on the surface of the upper transfer layer 604a is determined.
  • the controller 200 executes a mold release operation for releasing the substrate 6 from the upper mold 503a (step S313).
  • a mold release operation the controller 200 supplies a stage drive signal SG for moving the upper stage 505a upward by a predetermined distance to the stage vertical drive unit 511 and a center pin for moving the center pin 30b upward. supplying a shift signal CG L to the center pin drive unit 507b.
  • the upper mold 503a is released from the upper transfer layer 604a of the substrate 6.
  • the substrate 6 may be fixed by a fixing member (not shown) so that the substrate 6 does not come into close contact with the upper mold 503a and moves together with the upward movement of the upper stage 505a. .
  • the substrate 6 is obtained in which the concavo-convex pattern in which the concavo-convex state is reversed from the concavo-convex pattern formed in the upper mold 503a is formed in the upper transfer layer 604a.
  • the controller 200 supplies the center pin moving signal CG L to move the center pin 30b upward to the center pin drive unit 507b.
  • the substrate 6 is supported by the center pin 30b.
  • the controller 200 sends a command to detach the substrate 6 from the center pin 30b to the substrate transfer device.
  • the controller 200 determines whether or not an operation command signal indicating the end of the operation is supplied from the operation unit 201 (step S314). If it is determined in step S314 that the operation command signal indicating the end of the operation is supplied, the controller 200 ends the imprint processing program. On the other hand, if it is determined in step S314 that the operation command signal indicating the end of the operation is not supplied, the controller 200 waits until the substrate transfer device removes the substrate 6 supported by the center pin 30b. , as shown the center pin 30b in the state 6] in FIG. 28, and supplies the center pin moving signal CG L to be moved to a predetermined position for mounting the substrate 6 to the center pin drive unit 507b (step S315).
  • step S315 the controller 200 returns to the execution of step S308 and repeatedly executes the operation as described above. That is, first, the controller 200 repeatedly determines whether or not the substrate 6 is supported on the center pin 30b by executing step S308 until the substrate 6 is supported.
  • the substrate transfer device (not shown) attaches a new substrate 6 to the center pin 30b so that the center pin 30b passes through the center hole of the substrate 6.
  • the controller 200 determines that the substrate 6 is supported by the center pin 30b in step S13, and executes the operations of steps S308 to S314 again, thereby continuously with respect to the newly supported substrate 6. Pattern transfer.
  • the substrate 6 and the upper mold 503a are aligned with each other before the substrate 6 is mounted. Compared to the case where the imprint processing program shown in FIG. 21 is executed, the number of execution steps can be reduced.
  • (Modification 1) 30 to 31 show modifications of the camera unit 40 mounted on the imprint apparatus according to the present invention.
  • the three cameras 41b to 41d for photographing the alignment line (PL) around the camera 41a for photographing the tip of the center pin (30b) are used as the reference alignment line AL.
  • the number of cameras and the arrangement position are not limited to those shown in FIG.
  • the three cameras 41c to 41d are arranged at equal angular positions, that is, the angles of the three cameras 41c to 41d on the reference alignment line AL, with the camera 41a as the center. May be arranged to be 120 °.
  • the cameras 41b and 41c are arranged so as to be symmetric with respect to the camera 41a, that is, the three cameras 41a to 41c are arranged on the same diameter, and the same diameter is obtained. You may make it arrange
  • the cameras 41a are arranged at the center so that the angles are equal, that is, the angles of the four cameras 41c to 41e are 90 ° on the reference alignment line AL. Also good.
  • the number of cameras arranged on the reference alignment line AL may be two (cameras 41b and 41c) as shown in FIGS. 31 (a) to 31 (c). Further, the number of cameras arranged on the reference alignment line AL to photograph the alignment line (PL) may be only one (camera 41b) as shown in FIG. At this time, by rotating the upper mold 503a or the lower mold 503b on the mold driving stage (500a, 500b), the one camera 41b sequentially photographs the alignment line (PL), and the amount of variation of the alignment line Adjust the position so that is uniform.
  • an alignment mark is formed on the inner peripheral portion of the mold, and within the observation range of the camera 41a, that is, within one frame obtained by photographing, the alignment mark on the inner peripheral portion and the tip of the center pin If there is a camera, only the central camera 41a may shoot.
  • the number of cameras and their arrangement positions may be changed in accordance with desired alignment accuracy and restrictions by the imprint apparatus.
  • FIG. 33 shows a modification of the camera arrangement height on the camera unit 40 mounted on the imprint apparatus according to the present invention.
  • the camera (41a) for photographing the tip of the center pin (30b) and the cameras (41b to 41c) for photographing the alignment line (PL) are the same with respect to the surface of the stage CS. Although it installs in the height position, it is not limited to this.
  • the camera (41a) for photographing the tip of the center pin (30b) is more suitable for the stage CS than the cameras (41b to 41d) for photographing the mold alignment line (PL). You may make it arrange
  • the camera (41a) for photographing the tip of the center pin (30b) is positioned above the surface of the stage CS, rather than the cameras (41b to 41d) for photographing the mold alignment line (PL). It may be arranged.
  • the tip of the center pin (30b) and the mold alignment line (PL) can be photographed at the same time, so the focus adjustment operation, that is, the number of movement operations of the upper stage 505a in the vertical direction is reduced. It becomes possible.
  • FIG. 34 shows a modification of the installation position of the camera unit 40 mounted on the imprint apparatus according to the present invention.
  • the camera unit 40 is installed on the upper mold drive stage 500a.
  • the camera unit 40 is set in the imprint apparatus only when it is required by a transport apparatus (not shown). You may make it let it.
  • the camera unit 40 having the structure as shown in FIG. 34 is employed, it is possible to simultaneously photograph the alignment line PL of each of the upper mold 503a and the lower mold 503b and the tip of the center pin (30b).
  • the camera unit 40 shown in FIG. 34 is similar to that shown in FIG.
  • each photographing lens is installed on the stage CS with the downward direction.
  • cameras 41w to 41y for photographing the alignment line PL of the upper mold 503a are installed on the stage CS with their photographing lenses facing upward. This eliminates the need to stop the imprint apparatus when the camera unit 40 is maintained.
  • the present invention can be applied to an imprint apparatus using a non-transparent upper and lower mold, for example, a thermal imprint apparatus.
  • the upper and lower molds are moved in order to perform the alignment operation, but the present invention is not limited to this.
  • the center pin drive unit 511b can be moved in two-dimensional directions (X, Y) and rotated ( ⁇ ) by a central axis QJ perpendicular to the plane, and the center pin 30b is not moved in the vertical direction alone Instead, they may be moved to X, Y, and ⁇ .
  • the center pin 30b can be moved when the center position R of the alignment line PL formed in the mold (503a, 503b) and the position of the center axis CJ of the center pin 30b are matched.
  • the UV imprint method and the imprint apparatus are described.
  • the present invention is not limited to this.
  • Thermal imprint, energy rays for example, light other than UV, X-rays, etc.
  • It can also be used for other types of imprints such as curable imprints.
  • the material of the substrate 6 is a material capable of transferring a fine uneven pattern formed on the mold, such as a resin film, bulk resin, low melting point glass, etc.
  • the upper layer portion of the substrate 6 can be handled as a transfer layer.
  • the pattern shape can be directly transferred to the surface of the substrate without forming a transfer material on the substrate.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

L'invention porte sur un dispositif de transfert pour transférer des motifs rugueux sur une surface et sur l'autre surface d'une cible de transfert à l'aide de premier et second moules sur lesquels sont formés les motifs rugueux. Le dispositif de transfert comporte un moyen pour régler les positions relatives du premier moule et du second moule et un moyen pour régler les positions relatives des centres des motifs rugueux respectivement formés sur les premier et second moules et du centre de la cible de transfert.
PCT/JP2009/050313 2009-01-13 2009-01-13 Dispositif et procédé de transfert Ceased WO2010082298A1 (fr)

Priority Applications (2)

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JP2010546483A JPWO2010082298A1 (ja) 2009-01-13 2009-01-13 転写装置及び転写方法
PCT/JP2009/050313 WO2010082298A1 (fr) 2009-01-13 2009-01-13 Dispositif et procédé de transfert

Applications Claiming Priority (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012201000A (ja) * 2011-03-25 2012-10-22 Toshiba Mach Co Ltd 成形品成形装置および成形品成形方法
JP2012232547A (ja) * 2011-05-09 2012-11-29 Toshiba Mach Co Ltd 成形体の設置方法および成形体の設置装置
TWI641091B (zh) * 2016-06-30 2018-11-11 東和股份有限公司 Resin molding device and method for producing resin molded article

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000246810A (ja) * 1999-03-03 2000-09-12 Sharp Corp 光学素子の製造装置および光学素子の製造方法
JP2007190734A (ja) * 2006-01-18 2007-08-02 Hitachi Ltd パターン形成方法およびモールド
JP2008012858A (ja) * 2006-07-07 2008-01-24 Hitachi High-Technologies Corp インプリント装置およびインプリント方法
JP2008276919A (ja) * 2007-03-30 2008-11-13 Pioneer Electronic Corp インプリント装置およびインプリント方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000246810A (ja) * 1999-03-03 2000-09-12 Sharp Corp 光学素子の製造装置および光学素子の製造方法
JP2007190734A (ja) * 2006-01-18 2007-08-02 Hitachi Ltd パターン形成方法およびモールド
JP2008012858A (ja) * 2006-07-07 2008-01-24 Hitachi High-Technologies Corp インプリント装置およびインプリント方法
JP2008276919A (ja) * 2007-03-30 2008-11-13 Pioneer Electronic Corp インプリント装置およびインプリント方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012201000A (ja) * 2011-03-25 2012-10-22 Toshiba Mach Co Ltd 成形品成形装置および成形品成形方法
JP2012232547A (ja) * 2011-05-09 2012-11-29 Toshiba Mach Co Ltd 成形体の設置方法および成形体の設置装置
TWI641091B (zh) * 2016-06-30 2018-11-11 東和股份有限公司 Resin molding device and method for producing resin molded article

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