[go: up one dir, main page]

WO2010082314A1 - Équipement de transfert - Google Patents

Équipement de transfert Download PDF

Info

Publication number
WO2010082314A1
WO2010082314A1 PCT/JP2009/050359 JP2009050359W WO2010082314A1 WO 2010082314 A1 WO2010082314 A1 WO 2010082314A1 JP 2009050359 W JP2009050359 W JP 2009050359W WO 2010082314 A1 WO2010082314 A1 WO 2010082314A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
substrate
transfer
hole
center pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/050359
Other languages
English (en)
Japanese (ja)
Inventor
修 加園
睦巳 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Corp filed Critical Pioneer Corp
Priority to PCT/JP2009/050359 priority Critical patent/WO2010082314A1/fr
Priority to JP2010546497A priority patent/JPWO2010082314A1/ja
Publication of WO2010082314A1 publication Critical patent/WO2010082314A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/855—Coating only part of a support with a magnetic layer

Definitions

  • the present invention relates to a transfer device that transfers a concavo-convex pattern to a transfer layer on a transfer target such as a substrate.
  • a transfer device is proposed to transfer a concavo-convex pattern onto the substrate surface by pressing a disc-shaped mold with a concavo-convex pattern formed on the surface of the magnetic disk onto the substrate on which the transfer layer is formed.
  • a transfer apparatus first, the outer edge of the substrate on which the transfer layer is formed is gripped by the first holding means or held by vacuum suction, and further the mold is held by vacuum suction by the second holding means and is separated from each other. After matching the reference positions of the mold and the substrate, pressure is applied between the mold and the substrate and pressing is performed so that the uneven pattern of the mold is pressed against the transfer layer of the substrate.
  • the recording area is set to the limit of the outer edge, so that the substrate is held during transfer as in the conventional transfer device described above. Therefore, if the outer edge is used, the recording area is reduced accordingly.
  • the center pin in the transfer device is inserted into a through-hole such as a center hole formed in the substrate to hold the substrate, the substrate holding means of the transfer device attaches and detaches the substrate to and from the center pin. There was a problem that it was difficult to do without interfering with the pins.
  • the problem to be solved by the present invention includes the above-mentioned drawbacks as an example.
  • the center pin is inserted into the through hole formed in the substrate and the substrate is held, the mounting of the substrate to the center pin and It is an object of the present invention to provide a transfer apparatus that can perform appropriately without interfering with a center pin when a substrate holding means of a transport apparatus is attached or detached.
  • a transfer device is a transfer device for transferring a pattern of a mold to a transfer layer on a transfer target having a through hole, and is inserted into the through hole to hold the transfer target.
  • a support member having a fitting portion, and a transport means for transporting the transferred body in order to attach and detach the transferred body to and from the support member.
  • a gripping member is provided which is inserted into the through-hole and grips an edge around the through-hole, and is fitted into the fitting portion when the transfer target is detached from the support member.
  • a transfer device is a transfer device for transferring a pattern of a mold to a transfer layer on a transfer target having a through hole, and is inserted into the through hole to hold the transfer target.
  • a support member having a fitting portion, and the transferred member is attached to and detached from the support member by gripping an edge around the through hole by a gripping member of a transport unit.
  • the fitting portion is formed with an engaging groove that engages with the gripping member when the transfer body is detached.
  • the engaging groove is formed as the relief of the gripping member in the convex portion at the tip of the center pin
  • the mounting of the transfer medium to the convex portion at the tip of the center pin and The transfer target can be detached from the convex portion without causing interference such as a collision between the gripping member of the transport device and the center pin.
  • the periphery of the through hole of the transfer object is held in the transfer device, when the transfer object is used as a substrate of a magnetic disk, it can be used as a recording area up to the limit of the outer edge.
  • FIG. 1 It is a figure which shows schematic structure of a nanoimprint apparatus as an Example of this invention. It is a top view which shows the upper mold in the apparatus of FIG. It is a figure which shows the substrate holding mechanism of a lower side center pin and a conveying apparatus. It is a flowchart which shows the nanoimprint process of the apparatus of FIG.
  • FIG. 1 shows a schematic cross-sectional structure of a nanoimprint apparatus of UV (Ultraviolet) type as an embodiment of the present invention.
  • This nanoimprint apparatus performs pattern transfer on both sides of the substrate 6 simultaneously using an upper mold 503a and a lower mold 503b in which the uneven pattern to be transferred is previously formed.
  • the upper mold 503a and the lower mold 503b are mold sets.
  • the substrate 6 is a member to be transferred and is a disk-shaped substrate, for example, a magnetic disk, and has a central hole penetrating in the center.
  • the substrate 6 is made of a material such as tempered glass, an aluminum substrate, or a silicon wafer.
  • an upper transfer layer 604a and a lower transfer layer 604b made of a material that is cured when irradiated with ultraviolet rays are formed.
  • the upper and lower molds 503a and 503b are made of a base material having ultraviolet transparency such as quartz and glass, and an uneven pattern is formed on the surface thereof.
  • the upper mold 503a has a disk shape larger than the substrate 6 as shown in FIG. 2, and has a central hole at the center thereof.
  • a range P indicated by a dotted line in FIG. 2 is a portion where the uneven pattern of the upper mold 503a is formed.
  • the diameter of the center hole of the upper mold 503 a is slightly larger than the diameter of the center hole of the substrate 6.
  • the lower mold 503b has a disk shape like the upper mold 503a, and has a central hole at the center thereof.
  • FIG. 1 shows the configuration of the nanoimprint apparatus in a state where the substrate 6 on which the upper transfer layer 604a and the lower transfer layer 604b are formed, the upper mold 503a, and the lower mold 503b are mounted.
  • the nanoimprint apparatus shown in FIG. 1 includes an upper mechanism unit, a lower mechanism unit, a controller 200 that controls the upper mechanism unit and the lower mechanism unit, and an operation unit 201.
  • the upper mechanism unit includes an upper center pin 30a, an upper mold holding unit 501a, an upper stage 505a, an upper center pin driving unit 507a, and an upper UV irradiation unit 508a.
  • the board-like upper stage 505a has a nut portion in which a screw groove into which a screw portion of a ball screw 512, which will be described later, is screwed is cut, together with an opening portion 100a as shown in FIG.
  • An upper center pin drive unit 507a and an upper UV irradiation unit 508a are installed on the upper surface of the upper stage 505a.
  • an upper mold holding portion 501a having a mold holding surface (a surface in contact with the upper mold 503a in FIG. 1) for fixing and holding the upper mold 503a is provided on the lower surface.
  • the upper mold holding part 501a has a mold holding surface on which the upper mold 503a is fixed by vacuum suction by a suction fixing means (not shown).
  • the mold holding surface of the upper mold holding part 501a is provided with a through hole for allowing the upper center pin 30a to pass therethrough.
  • Upper center pin drive unit 507a in accordance with the upper center pin movement signal CG U supplied from the controller 200, the upper center pin 30a, the upper or lower in a direction perpendicular to the mold holding surface of the upper mold holding portion 501a Move to the side.
  • the upper UV irradiation unit 508a applies ultraviolet light to be cured on the transfer layer material to the upper transfer layer 604a of the substrate 6 through the opening 100a of the upper stage 505a in accordance with the ultraviolet irradiation signal UV supplied from the controller 200. Irradiate toward.
  • a recess 301a is formed at the tip of the upper center pin 30a.
  • the lower mechanism unit includes a lower center pin 30b, a lower mold holding unit 501b, a lower stage 505b, a lower center pin drive unit 507b, a lower UV irradiation unit 508b, a stage vertical drive unit 511, and a ball screw 512.
  • the board-like lower stage 505b has a hole through which the threaded portion of the ball screw 512 passes, along with the opening 100b as shown in FIG.
  • the ball screw 512 maintains the parallel state between the lower stage 505b and the upper stage 505a.
  • the screw portion of the ball screw 512 is screwed into the nut portion of the upper stage 505a.
  • On the upper surface of the lower stage 505b there is provided a lower mold holding portion 501b having a mold holding surface (a surface in contact with the lower mold 503b in FIG. 1) for fixing and holding the lower mold 503b. ing.
  • the lower mold holding part 501b has a mold holding surface to which the lower mold 503b is fixed by vacuum suction by means not shown.
  • the mold holding surface of the lower mold holding part 501b is provided with a through hole for allowing the lower center pin 30b to pass therethrough.
  • a lower center pin drive unit 507b, a lower UV irradiation unit 508b, and a stage vertical drive unit 511 are provided on the lower surface of the lower stage 505b.
  • each of the upper center pin 30a and the lower center pin 30b is on the same straight line.
  • a cone-shaped convex portion 301b is formed at the tip of the lower center pin 30b.
  • the front end of the convex portion 301b is flat, and an engagement groove 301c cut into a U shape at every 120 degrees with respect to the center point is formed so as to extend from the front end edge of the convex portion 301b to the side surface.
  • the engagement groove 301c is formed by the longitudinal wall of the lower center pin 30b and the bottom surface perpendicular thereto.
  • the edge portion 301d of the convex portion 301b is formed as shown in FIG. It is cut by the engaging groove 301c to form three arcs.
  • An edge portion 301d of the convex portion 301b is a portion on which the substrate 6 is placed by the transport device.
  • the maximum diameter of the cone-shaped portion is determined so that the center hole of the substrate 6 fits into the cone-shaped portion of the convex portion 301b.
  • the carrying device is provided with three gripping members 40a at 120 ° intervals at the tip of the cylindrical arm 40. It arrange
  • the gripping member 40a has a rod shape, and a claw 40b is formed at the tip.
  • the three claws 40b are bent outward and are formed in a U shape to grip the edge of the center hole 6a of the substrate 6.
  • Each gripping member 40a is movable inward and outward by a driving means (not shown).
  • the claw 40b of the gripping member 40a can be positioned in the engagement groove 301c.
  • the operation unit 201 accepts various operation commands instructed by the user to operate the nanoimprint apparatus, and supplies an operation command signal indicating the operation commands to the controller 200.
  • the controller 200 executes various processing signals (UV, CG U , CG L , SG) for controlling the nanoimprint apparatus by executing a processing program corresponding to the operation indicated by the operation command signal supplied from the operation unit 201. ) Is generated.
  • the controller 200 starts executing a nanoimprint processing program as shown in FIG.
  • the controller 200 causes the upper mold 503a to be conveyed onto the mold holding surface of the upper mold holding portion 501a by the substrate conveying apparatus or other conveying apparatus (step S1).
  • the upper mold 503a is fixed to a predetermined upper holding position on the mold holding surface of the upper mold holding portion 501a by vacuum suction by the suction fixing means (step S2).
  • the predetermined upper holding position is a position where the upper center pin 30a can move without contacting the center hole of the upper mold 503a.
  • the controller 200 similarly transports the lower mold 503b onto the mold holding surface of the lower mold holding portion 501b (step S3), and after that, holds the lower mold by vacuum suction by the suction fixing means.
  • the lower mold 503b is fixed to a predetermined lower holding position on the mold holding surface of the part 501b (step S4).
  • the predetermined lower holding position is a position where the lower center pin 30b can move without contacting the center hole of the lower mold 503b, and is in a vertical relationship with the predetermined upper holding position.
  • step S5 the controller 200 holds the substrate 6 by the above-described transfer device (step S5).
  • step S5 the claws 40b of the three gripping members 40a are positioned in the center hole 6a of the substrate 6 and moved further outward to grip the edge of the substrate 6 on the U-shaped portion of the claws 40b. Hold.
  • the controller 200 applies a double-sided transfer material on the substrate 6 by means (not shown) to form a transfer layer (step S6).
  • the upper transfer layer 604a and the lower transfer layer 604b are formed on the substrate 6.
  • transfer layers may be formed on the pattern forming surfaces of the upper mold 503a and the lower mold 503b.
  • the holding member 40a holding the substrate 6 on which the upper transfer layer 604a and the lower transfer layer 604b are formed is moved between the upper mold 503a and the lower mold 503b of the nanoimprint apparatus main body together with the arm 40 to lower the lower center.
  • the position of the substrate 6 is determined so that the central axis of the pin 30b coincides with the center point of the circle of the substrate 6, and the angular positions of the three gripping members 40a and the engagement grooves 301c are coincident, and then the convex portion 301b.
  • the substrate 6 is lowered so that the center hole 6a of the substrate 6 is fitted to the substrate 6 (step S7).
  • step S8 since the gripping member 40a moves inward and the gripping of the substrate 6 is released, the substrate 6 remains placed on the edge 301d of the convex portion 301b, and the arm 40 is removed from the nanoimprint apparatus main body. Moved outside. At this time, since the gripping member 40a moves upward in the engagement groove 301c, the engagement between the gripping member 40a and the convex portion 301b is released.
  • the engaging groove 301c is formed as the relief of the gripping member 40a on the convex portion 301b of the lower center pin 30b, the gripping member 40a of the transport device does not cause interference such as a collision with the center pin 30b.
  • the substrate 6 can be attached to the convex portion 301b of the lower center pin 30b.
  • step S9 After mounting the substrate 6, the controller 200 performs mold pressing (step S9).
  • mold pressing a stage drive signal SG is supplied to the stage vertical drive unit 511 to move the upper stage 505a downward, and an upper center pin movement signal CG U is used to move the upper center pin 30a downward. It is supplied to the pin drive unit 507a.
  • the upper stage 505a moves downward
  • the upper center pin 30a moves downward
  • the concave portion 301a at the tip thereof is coupled to the convex portion 301b of the lower center pin 30b
  • the upper mold 503a is attached to the substrate 6. It contacts the upper transfer layer 604a.
  • a concavo-convex pattern in which the concavo-convex state is reversed from the concavo-convex pattern formed in the upper mold 503a is formed on the surface portion of the upper transfer layer 604a.
  • a concavo-convex pattern in which the concavo-convex state is reversed from the concavo-convex pattern formed in the lower mold 503b is formed on the surface portion of the lower transfer layer 604b. That is, by executing step S9, the double-sided simultaneous pattern transfer by the upper mold 503a and the lower mold 503b is performed on the upper transfer layer 604a and the lower transfer layer 604b of the substrate 6, respectively.
  • the controller 200 supplies the ultraviolet irradiation signal UV to the upper UV irradiation unit 508a and the lower UV irradiation unit 508b (step S10).
  • the upper UV irradiation unit 508a irradiates the upper transfer layer 604a of the substrate 6 with ultraviolet rays that should cure the transfer layer material, and the lower UV irradiation unit 508b should cure the transfer layer material. Is irradiated toward the lower transfer layer 604b.
  • the controller 200 executes mold release to release the substrate 6 from the upper mold 503a and the lower mold 503b (step S11).
  • the controller 200 supplies a stage drive signal SG for moving the upper stage 505a upward by a predetermined distance to the stage vertical drive unit 511.
  • the upper mold 503 a is separated from the upper transfer layer 604 a of the substrate 6.
  • an upper center pin movement signal CG U is supplied to the upper center pin driving unit 507a so as to move upward in a state where the upper center pin 30a and the lower center pin 30b are coupled, and at the same time, the lower center pin movement signal CG.
  • L is supplied to the lower center pin drive unit 507b. Therefore, the substrate 6 is lifted by the flange 504b of the lower center pin 30b, and as a result, the substrate 6 is released from the lower mold 503b.
  • the controller 200 is a leaving supplies the upper center pin moving signal CG U to move the upper center pin 30a upward to the upper center pin drive unit 507a, the substrate 6 from the lower center pin 30b A command to be sent is sent to the above-mentioned transfer device to unload the substrate 6 (step S12). That is, the arm 40 is moved between the upper mold 503a and the lower mold 503b of the main body of the nanoimprint apparatus to position the claws 40b of the three gripping members 40a in the center hole 6a of the substrate 6 and further moved outward. The edge of the substrate 6 is gripped by the U-shaped portion of the claw 40b, thereby holding the substrate 6.
  • the arm 40 holding the substrate 6 on the gripping member 40a is moved from the nanoimprint apparatus main body to the outside.
  • the engaging groove 301c is formed as the relief of the gripping member 40a on the convex portion 301b of the lower center pin 30b, the gripping member 40a of the transport device does not cause interference such as a collision with the center pin 30b.
  • the substrate 6 can be detached from the convex portion 301b of the lower center pin 30b.
  • the controller 200 determines whether or not an operation command signal indicating the end of the operation is supplied from the operation unit 201 (step S13).
  • the controller 200 ends the nanoimprint processing program.
  • the controller 200 returns to the execution of step S5 and repeatedly executes the operations of steps S5 to S13. As a result, pattern transfer is continuously performed on the newly mounted substrate 6.
  • the transfer layer may be formed on both surfaces of the substrate 6 in step S6 before the substrate 6 in step S5 is held by the transfer device, or the substrate 6 is placed on the convex portion 301b in step S7. You may go after.
  • nanoimprinting using ultraviolet rays is performed, but the present invention can also be used for thermal imprinting in which a pattern is transferred by heating a substrate and a mold.
  • the concavo-convex pattern is transferred on both surfaces of the substrate.
  • the transfer device of the present invention can also be used for nanoimprinting that transfers the concavo-convex pattern only on one transfer layer forming surface of the substrate.
  • the transport device may be arranged in the nanoimprint apparatus and integrated as the apparatus, or may be configured separately from the nanoimprint apparatus.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

La présente invention porte sur un équipement de transfert permettant de transférer le motif d'un moule à une couche de transfert sur un corps transféré pourvu d'un trou traversant, lequel équipement de transfert comprend une broche centrale comportant, au niveau de sa pointe, une saillie conique qui est introduite à l'intérieur du trou traversant afin de maintenir le corps transféré dans un état où le corps transféré fait face au moule, et un moyen de transport pour transporter le corps transféré afin d'attacher le corps transféré à la saillie ou de détacher le corps transféré de celle-ci. Une pluralité de rainures de mise en prise sont formées dans la saillie sur la surface latérale de celle-ci, en partant de la pointe, et le moyen de transport comporte une pluralité d'éléments de préhension disposés en correspondance avec les emplacements de la pluralité de saillies de mise en prise et introduits à l'intérieur du trou traversant du corps transféré afin de saisir le bord du corps transféré sur la périphérie du trou traversant.
PCT/JP2009/050359 2009-01-14 2009-01-14 Équipement de transfert Ceased WO2010082314A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2009/050359 WO2010082314A1 (fr) 2009-01-14 2009-01-14 Équipement de transfert
JP2010546497A JPWO2010082314A1 (ja) 2009-01-14 2009-01-14 転写装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/050359 WO2010082314A1 (fr) 2009-01-14 2009-01-14 Équipement de transfert

Publications (1)

Publication Number Publication Date
WO2010082314A1 true WO2010082314A1 (fr) 2010-07-22

Family

ID=42339583

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/050359 Ceased WO2010082314A1 (fr) 2009-01-14 2009-01-14 Équipement de transfert

Country Status (2)

Country Link
JP (1) JPWO2010082314A1 (fr)
WO (1) WO2010082314A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105666786A (zh) * 2016-01-28 2016-06-15 三进光电（苏州）有限公司 嵌件抓取装配机构及嵌件抓取台
CN115464890A (zh) * 2022-08-24 2022-12-13 安徽天航机电有限公司 一种薄壁金属垫片双面涂胶装置及其使用方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6292269A (ja) * 1985-10-18 1987-04-27 Hitachi Electronics Eng Co Ltd デイスク部材の回転装置
JPH03141022A (ja) * 1989-10-26 1991-06-17 Toshiba Corp ハードディスクの搬送装置
JPH05277427A (ja) * 1992-03-30 1993-10-26 Origin Electric Co Ltd ディスク反転装置
JP2002208134A (ja) * 2001-01-09 2002-07-26 Nakamura Tome Precision Ind Co Ltd ディスク基板の回転把持装置
JP2008036781A (ja) * 2006-08-07 2008-02-21 Daitron Technology Co Ltd ディスク基板の回転保持装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6292269A (ja) * 1985-10-18 1987-04-27 Hitachi Electronics Eng Co Ltd デイスク部材の回転装置
JPH03141022A (ja) * 1989-10-26 1991-06-17 Toshiba Corp ハードディスクの搬送装置
JPH05277427A (ja) * 1992-03-30 1993-10-26 Origin Electric Co Ltd ディスク反転装置
JP2002208134A (ja) * 2001-01-09 2002-07-26 Nakamura Tome Precision Ind Co Ltd ディスク基板の回転把持装置
JP2008036781A (ja) * 2006-08-07 2008-02-21 Daitron Technology Co Ltd ディスク基板の回転保持装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105666786A (zh) * 2016-01-28 2016-06-15 三进光电（苏州）有限公司 嵌件抓取装配机构及嵌件抓取台
CN115464890A (zh) * 2022-08-24 2022-12-13 安徽天航机电有限公司 一种薄壁金属垫片双面涂胶装置及其使用方法

Also Published As

Publication number Publication date
JPWO2010082314A1 (ja) 2012-06-28

Similar Documents

Publication Publication Date Title
US20050151282A1 (en) Workpiece handler and alignment assembly
JP4699767B2 (ja) 恒温インプリント・エンボッシング・システム
JP6511074B2 (ja) 基板搬送ロボットおよびその運転方法
US20050150862A1 (en) Workpiece alignment assembly
US20050151300A1 (en) Workpiece isothermal imprinting
US7964135B2 (en) Method and apparatus for imprinting energy ray-setting resin, and discs and semiconductor devices with imprinted resin layer
JP2016086051A (ja) インプリント方法、インプリント装置、およびそれを用いた物品の製造方法
US20130113136A1 (en) Imprint apparatus and method of manufacturing article
US20180321584A1 (en) Mold, imprint device, and imprint method
JP4555896B2 (ja) 転写方法及び転写装置
WO2010082314A1 (fr) Équipement de transfert
JP5222177B2 (ja) 基板処理装置および基板保持機構
JP4608028B2 (ja) モールド及びその作製方法
JP5052660B2 (ja) モールド、モールドの製造方法、及びモールドによる転写方法
CN101842889A (zh) 用于支撑工件的装置
JP4756106B2 (ja) 転写装置
JP5315081B2 (ja) 薄膜形成装置
JP2008300534A (ja) 薄膜形成装置および薄膜形成方法
JP2004536415A (ja) スパッタパレット装着装置
JP2022041588A (ja) 成形装置、成形方法、およびテンプレート
JP4756105B2 (ja) 転写装置及び転写方法
JPWO2010143303A1 (ja) 転写装置及び転写方法
JP2025058736A (ja) 搬送装置、成形装置、および物品の製造方法
JP2008300533A (ja) 薄膜形成装置および薄膜形成方法
JP6798924B2 (ja) 成形装置および成形品成形方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09838284

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2010546497

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09838284

Country of ref document: EP

Kind code of ref document: A1