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WO2009037807A1 - 電子部品パッケージとその製造方法 - Google Patents

電子部品パッケージとその製造方法 Download PDF

Info

Publication number
WO2009037807A1
WO2009037807A1 PCT/JP2008/002457 JP2008002457W WO2009037807A1 WO 2009037807 A1 WO2009037807 A1 WO 2009037807A1 JP 2008002457 W JP2008002457 W JP 2008002457W WO 2009037807 A1 WO2009037807 A1 WO 2009037807A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
wiring board
component package
producing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/002457
Other languages
English (en)
French (fr)
Inventor
Takayuki Kita
Masaaki Katsumata
Keiichi Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2009533031A priority Critical patent/JP5234001B2/ja
Priority to CN2008801079761A priority patent/CN101803477B/zh
Publication of WO2009037807A1 publication Critical patent/WO2009037807A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09354—Ground conductor along edge of main surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

　電子部品パッケージは、第１の配線板と、第１の配線板の上面上に実装された電子部品と、第１の配線板の上面上に設けられた接着層と、接着層の上面上に設けられた第２の配線板と、第１の配線板の上面と第２の配線板と電子部品とを覆う金属キャップとを備える。第２の配線板は第１の配線板より小さい。この電子部品パッケージでは、金属キャップに歪みが発生しても電子部品に不要な応力を発生させない。
PCT/JP2008/002457 2007-09-21 2008-09-05 電子部品パッケージとその製造方法 Ceased WO2009037807A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009533031A JP5234001B2 (ja) 2007-09-21 2008-09-05 電子部品パッケージとその製造方法
CN2008801079761A CN101803477B (zh) 2007-09-21 2008-09-05 电子部件封装体及其制造方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007244836 2007-09-21
JP2007-244836 2007-09-21
JP2007244835 2007-09-21
JP2007-244837 2007-09-21
JP2007244837 2007-09-21
JP2007-244835 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009037807A1 true WO2009037807A1 (ja) 2009-03-26

Family

ID=40467636

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002457 Ceased WO2009037807A1 (ja) 2007-09-21 2008-09-05 電子部品パッケージとその製造方法

Country Status (4)

Country Link
JP (1) JP5234001B2 (ja)
CN (1) CN101803477B (ja)
TW (1) TW200921867A (ja)
WO (1) WO2009037807A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4020549A1 (en) * 2020-12-23 2022-06-29 INTEL Corporation Trace routable radiation shield

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5528641B1 (ja) * 2012-10-03 2014-06-25 新電元工業株式会社 電子機器

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04171683A (ja) * 1990-11-06 1992-06-18 Taiyo Yuden Co Ltd 線状端子リードを備えた外部接続端子、および当該外部接続端子を備えた混成集積回路装置、並びに当該外部接続端子の製造方法
JPH04313299A (ja) * 1991-04-11 1992-11-05 Toshiba Corp 電子機器における実装構造
JPH0955597A (ja) * 1995-08-16 1997-02-25 Nec Corp 半導体装置
JPH10112517A (ja) * 1996-10-03 1998-04-28 Ngk Spark Plug Co Ltd 電子部品収納用パッケージ
JPH1167947A (ja) * 1997-08-20 1999-03-09 Sony Corp ハイブリッド集積回路装置の表面実装方法及びハイブリッド集積回路装置及びハイブリッド集積回路装置の実装体
JP2005236256A (ja) * 2003-09-12 2005-09-02 Matsushita Electric Ind Co Ltd コネクタシート及び配線基板、並びにコネクタシート及び配線基板の製造方法
JP2006040870A (ja) * 2004-02-20 2006-02-09 Matsushita Electric Ind Co Ltd 接続部材および実装体、ならびにその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001148595A (ja) * 1999-11-19 2001-05-29 Murata Mfg Co Ltd シールドケース付き電子部品
JP2007066936A (ja) * 2005-08-29 2007-03-15 Matsushita Electric Ind Co Ltd 高周波モジュールとその製造方法
US7135644B1 (en) * 2006-02-01 2006-11-14 International Business Machines Corporation Permeable conductive shield having a laminated structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04171683A (ja) * 1990-11-06 1992-06-18 Taiyo Yuden Co Ltd 線状端子リードを備えた外部接続端子、および当該外部接続端子を備えた混成集積回路装置、並びに当該外部接続端子の製造方法
JPH04313299A (ja) * 1991-04-11 1992-11-05 Toshiba Corp 電子機器における実装構造
JPH0955597A (ja) * 1995-08-16 1997-02-25 Nec Corp 半導体装置
JPH10112517A (ja) * 1996-10-03 1998-04-28 Ngk Spark Plug Co Ltd 電子部品収納用パッケージ
JPH1167947A (ja) * 1997-08-20 1999-03-09 Sony Corp ハイブリッド集積回路装置の表面実装方法及びハイブリッド集積回路装置及びハイブリッド集積回路装置の実装体
JP2005236256A (ja) * 2003-09-12 2005-09-02 Matsushita Electric Ind Co Ltd コネクタシート及び配線基板、並びにコネクタシート及び配線基板の製造方法
JP2006040870A (ja) * 2004-02-20 2006-02-09 Matsushita Electric Ind Co Ltd 接続部材および実装体、ならびにその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4020549A1 (en) * 2020-12-23 2022-06-29 INTEL Corporation Trace routable radiation shield
JP2022100245A (ja) * 2020-12-23 2022-07-05 インテル コーポレイション トレース・ルーティング可能な放射シールド
US12193149B2 (en) 2020-12-23 2025-01-07 Intel Corporation Trace routable radiation shield

Also Published As

Publication number Publication date
CN101803477A (zh) 2010-08-11
TW200921867A (en) 2009-05-16
JPWO2009037807A1 (ja) 2011-01-06
JP5234001B2 (ja) 2013-07-10
CN101803477B (zh) 2011-11-16

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