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WO2009001842A1 - 積層セラミック電子部品及びその実装構造 - Google Patents

積層セラミック電子部品及びその実装構造 Download PDF

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Publication number
WO2009001842A1
WO2009001842A1 PCT/JP2008/061518 JP2008061518W WO2009001842A1 WO 2009001842 A1 WO2009001842 A1 WO 2009001842A1 JP 2008061518 W JP2008061518 W JP 2008061518W WO 2009001842 A1 WO2009001842 A1 WO 2009001842A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
multilayer ceramic
ceramic electronic
region
end surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/061518
Other languages
English (en)
French (fr)
Inventor
Seiji Koga
Yukio Sanada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of WO2009001842A1 publication Critical patent/WO2009001842A1/ja
Priority to US12/642,976 priority Critical patent/US8130484B2/en
Anticipated expiration legal-status Critical
Priority to US13/296,262 priority patent/US8405954B2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

　導電性接着剤を用いて実装した場合であっても、導電性接着剤に含有されている金属によるマイグレーションによる劣化が生じ難い、積層セラミック電子部品を提供する。 　セラミック素体２内において、第１の内部電極３が、第１の端面２ｅに引き出されている相対的に幅方向寸法が大きな第１の領域３ａと、第１の領域３ａよりも先端側に位置しており、相対的に幅方向寸法が小さい第２の領域３ｂとを有し、第１の領域３ａの第１の側面２ｃに最も近く、第２の端面２ｅに最も近い第１の端点Ｐ１から第２の端面２ｆまでの距離をｄ１とし、第１，第２の回り込み部５ｂ，６ｂ間の距離をｇとし、第１の側面２ｃが実装面とされた際に、第２の回り込み部６ｂの先端と第２の端面２ｆとの間の距離をｃ１としたときに、ｄ１＞ｃ１＋ｎｇ１（ｎは積層セラミック電子部品のサイズによる定まる定数）とされている、積層セラミック電子部品１。
PCT/JP2008/061518 2007-06-27 2008-06-25 積層セラミック電子部品及びその実装構造 Ceased WO2009001842A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/642,976 US8130484B2 (en) 2007-06-27 2009-12-21 Monolithic ceramic electronic component and mounting structure thereof
US13/296,262 US8405954B2 (en) 2007-06-27 2011-11-15 Monolithic ceramic electronic component and mounting structure thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-169782 2007-06-27
JP2007169782 2007-06-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/642,976 Continuation US8130484B2 (en) 2007-06-27 2009-12-21 Monolithic ceramic electronic component and mounting structure thereof

Publications (1)

Publication Number Publication Date
WO2009001842A1 true WO2009001842A1 (ja) 2008-12-31

Family

ID=40185654

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061518 Ceased WO2009001842A1 (ja) 2007-06-27 2008-06-25 積層セラミック電子部品及びその実装構造

Country Status (2)

Country Link
US (2) US8130484B2 (ja)
WO (1) WO2009001842A1 (ja)

Cited By (11)

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JP2011091271A (ja) * 2009-10-23 2011-05-06 Tdk Corp 積層型コンデンサ
JP2011091272A (ja) * 2009-10-23 2011-05-06 Tdk Corp 積層型コンデンサ
CN102473522A (zh) * 2009-07-01 2012-05-23 凯米特电子公司 具有高电压容量的高电容多层
CN102693835A (zh) * 2011-03-24 2012-09-26 株式会社村田制作所 电子部件
KR20130063234A (ko) * 2011-12-06 2013-06-14 삼성전기주식회사 적층 세라믹 전자 부품
JP2014120750A (ja) * 2012-12-12 2014-06-30 Samsung Electro-Mechanics Co Ltd 積層セラミック電子部品
US9378890B2 (en) 2012-03-16 2016-06-28 Murata Manufacturing Co., Ltd. Ceramic capacitor having a small variation in capacity
JP2019102515A (ja) * 2017-11-29 2019-06-24 Tdk株式会社 電子部品
CN112292738A (zh) * 2018-06-22 2021-01-29 Tdk电子股份有限公司 陶瓷多层器件和用于制造陶瓷多层器件的方法
JP2022104173A (ja) * 2020-12-28 2022-07-08 Tdk株式会社 電子部品
JP2022104526A (ja) * 2020-12-28 2022-07-08 Tdk株式会社 電子部品

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JP5589891B2 (ja) * 2010-05-27 2014-09-17 株式会社村田製作所 セラミック電子部品及びその製造方法
JP5672162B2 (ja) * 2010-07-21 2015-02-18 株式会社村田製作所 電子部品
WO2012086285A1 (ja) * 2010-12-24 2012-06-28 株式会社村田製作所 加速度センサ
JP5888281B2 (ja) * 2012-08-10 2016-03-16 株式会社村田製作所 実装ランド構造体及び積層コンデンサの実装構造体
KR101376839B1 (ko) * 2012-10-12 2014-03-20 삼성전기주식회사 적층 세라믹 커패시터
KR101422945B1 (ko) * 2012-12-11 2014-07-23 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조 방법
KR20140090466A (ko) * 2013-01-09 2014-07-17 삼성전기주식회사 도전성 수지 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
KR101462758B1 (ko) * 2013-01-29 2014-11-20 삼성전기주식회사 적층 세라믹 커패시터, 그 제조방법 및 적층 세라믹 커패시터가 내장된 인쇄회로기판
KR101462761B1 (ko) * 2013-02-13 2014-11-20 삼성전기주식회사 다층 세라믹 소자 및 그 제조 방법
DE102013102686A1 (de) * 2013-03-15 2014-09-18 Epcos Ag Elektronisches Bauelement
KR102415221B1 (ko) 2013-04-15 2022-06-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치
KR101474138B1 (ko) * 2013-06-05 2014-12-17 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
JP5991337B2 (ja) * 2013-08-20 2016-09-14 株式会社村田製作所 端子板付き電子部品の製造方法及び端子板付き電子部品
JP2015109410A (ja) 2013-10-25 2015-06-11 株式会社村田製作所 セラミック電子部品及びセラミック電子部品の製造方法
JP5958479B2 (ja) * 2014-01-31 2016-08-02 株式会社村田製作所 電子部品の実装構造体
WO2016059514A1 (en) 2014-10-17 2016-04-21 Semiconductor Energy Laboratory Co., Ltd. Electronic device
JP2016085457A (ja) 2014-10-24 2016-05-19 株式会社半導体エネルギー研究所 電子機器
JP7347919B2 (ja) * 2017-12-15 2023-09-20 太陽誘電株式会社 積層セラミックコンデンサ
JP7040062B2 (ja) 2018-01-31 2022-03-23 Tdk株式会社 電子部品
KR102139752B1 (ko) * 2018-09-21 2020-07-31 삼성전기주식회사 세라믹 전자 부품
KR102185055B1 (ko) * 2018-10-02 2020-12-01 삼성전기주식회사 적층 세라믹 전자부품
KR102815916B1 (ko) * 2019-09-23 2025-06-02 삼성전기주식회사 적층 세라믹 전자부품

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KR101498098B1 (ko) * 2009-07-01 2015-03-03 케메트 일렉트로닉스 코포레이션 고전압 성능을 가지는 고캐패시턴스 다층레이어
CN102473522A (zh) * 2009-07-01 2012-05-23 凯米特电子公司 具有高电压容量的高电容多层
JP2012532455A (ja) * 2009-07-01 2012-12-13 ケメット エレクトロニクス コーポレーション 高電圧能力を有する高静電容量の多層
EP2449569A4 (en) * 2009-07-01 2013-01-23 Kemet Electronics Corp MULTILAYER WITH HIGH CAPACITY WITH HIGH VOLTAGE CAPACITY
US9490072B2 (en) 2009-07-01 2016-11-08 Kemet Electronics Corporation Method of making a high capacitance multilayer capacitor with high voltage capability
JP2015073115A (ja) * 2009-07-01 2015-04-16 ケメット エレクトロニクス コーポレーション 高電圧能力を有する高静電容量の多層
US8885319B2 (en) 2009-07-01 2014-11-11 Kemet Electronics Corporation High capacitance multilayer with high voltage capability
JP2011091272A (ja) * 2009-10-23 2011-05-06 Tdk Corp 積層型コンデンサ
JP2011091271A (ja) * 2009-10-23 2011-05-06 Tdk Corp 積層型コンデンサ
CN102693835A (zh) * 2011-03-24 2012-09-26 株式会社村田制作所 电子部件
KR20130063234A (ko) * 2011-12-06 2013-06-14 삼성전기주식회사 적층 세라믹 전자 부품
JP2013120927A (ja) * 2011-12-06 2013-06-17 Samsung Electro-Mechanics Co Ltd 積層セラミック電子部品
US9378890B2 (en) 2012-03-16 2016-06-28 Murata Manufacturing Co., Ltd. Ceramic capacitor having a small variation in capacity
JP2014120750A (ja) * 2012-12-12 2014-06-30 Samsung Electro-Mechanics Co Ltd 積層セラミック電子部品
US9293259B2 (en) 2012-12-12 2016-03-22 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component including electrode lead out portions having different lengths
JP2019102515A (ja) * 2017-11-29 2019-06-24 Tdk株式会社 電子部品
CN112292738A (zh) * 2018-06-22 2021-01-29 Tdk电子股份有限公司 陶瓷多层器件和用于制造陶瓷多层器件的方法
JP2021518993A (ja) * 2018-06-22 2021-08-05 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ セラミック多層部品及びセラミック多層部品の製造方法
CN112292738B (zh) * 2018-06-22 2022-06-14 Tdk电子股份有限公司 陶瓷多层器件和用于制造陶瓷多层器件的方法
JP7227274B2 (ja) 2018-06-22 2023-02-21 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフト セラミック多層部品及びセラミック多層部品の製造方法
JP2022104173A (ja) * 2020-12-28 2022-07-08 Tdk株式会社 電子部品
JP2022104526A (ja) * 2020-12-28 2022-07-08 Tdk株式会社 電子部品
JP7671219B2 (ja) 2020-12-28 2025-05-01 Tdk株式会社 電子部品

Also Published As

Publication number Publication date
US20120293908A1 (en) 2012-11-22
US8130484B2 (en) 2012-03-06
US8405954B2 (en) 2013-03-26
US20100091429A1 (en) 2010-04-15

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