WO2009078121A1 - Semiconductor substrate supporting jig and method for manufacturing the same - Google Patents
Semiconductor substrate supporting jig and method for manufacturing the same Download PDFInfo
- Publication number
- WO2009078121A1 WO2009078121A1 PCT/JP2008/003209 JP2008003209W WO2009078121A1 WO 2009078121 A1 WO2009078121 A1 WO 2009078121A1 JP 2008003209 W JP2008003209 W JP 2008003209W WO 2009078121 A1 WO2009078121 A1 WO 2009078121A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor substrate
- supporting jig
- substrate supporting
- manufacturing
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H10P72/0434—
-
- H10P72/123—
-
- H10P72/145—
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Provided is a semiconductor substrate supporting jig for supporting a semiconductor substrate at the time of performing heat treatment to the semiconductor substrate. The semiconductor substrate supporting jig is composed of at least a base material and a thin film formed on the surface of the base material. The material of the thin film is different from that for the base material. The thin film is not formed at least on a portion where the semiconductor substrate supporting jig is brought into contact with the semiconductor substrate at the time of supporting the semiconductor substrate. Thus, the semiconductor substrate supporting jig, which suppresses both Fe contamination transfer to the silicon wafer and roughening of the silicon wafer rear surface at the time of performing heat treatment wherein argon or the like is used, is provided. A method for manufacturing such semiconductor substrate supporting jig is also provided.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007327128A JP4998246B2 (en) | 2007-12-19 | 2007-12-19 | Semiconductor substrate support jig and manufacturing method thereof. |
| JP2007-327128 | 2007-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009078121A1 true WO2009078121A1 (en) | 2009-06-25 |
Family
ID=40795245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/003209 Ceased WO2009078121A1 (en) | 2007-12-19 | 2008-11-06 | Semiconductor substrate supporting jig and method for manufacturing the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4998246B2 (en) |
| TW (1) | TW200941633A (en) |
| WO (1) | WO2009078121A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101990533B1 (en) * | 2012-11-06 | 2019-09-30 | 주식회사 원익아이피에스 | Batch type semiconductor manufacturing device |
| CN104600020B (en) * | 2015-02-03 | 2018-01-26 | 北京七星华创电子股份有限公司 | Wafer carrier, annealing device and heat treatment method |
| JP6322159B2 (en) * | 2015-06-10 | 2018-05-09 | クアーズテック株式会社 | Wafer boat and manufacturing method thereof |
| CN105552006B (en) * | 2016-01-28 | 2018-06-22 | 北京北方华创微电子装备有限公司 | A kind of vertical heat processing apparatus |
| US11133207B2 (en) * | 2018-08-30 | 2021-09-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for forming films on wafers separated by different distances |
| JP7251458B2 (en) * | 2019-12-05 | 2023-04-04 | 株式会社Sumco | Silicon wafer manufacturing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001059826A1 (en) * | 2000-02-10 | 2001-08-16 | Shin-Etsu Handotai Co., Ltd. | Silicon boat with protective film, method of manufacture thereof, and silicon wafer heat-treated using silicon boat |
| JP2005019748A (en) * | 2003-06-26 | 2005-01-20 | Shin Etsu Handotai Co Ltd | Thermal treatment jig and thermal treatment method for wafer |
-
2007
- 2007-12-19 JP JP2007327128A patent/JP4998246B2/en active Active
-
2008
- 2008-11-06 WO PCT/JP2008/003209 patent/WO2009078121A1/en not_active Ceased
- 2008-11-12 TW TW097143710A patent/TW200941633A/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001059826A1 (en) * | 2000-02-10 | 2001-08-16 | Shin-Etsu Handotai Co., Ltd. | Silicon boat with protective film, method of manufacture thereof, and silicon wafer heat-treated using silicon boat |
| JP2005019748A (en) * | 2003-06-26 | 2005-01-20 | Shin Etsu Handotai Co Ltd | Thermal treatment jig and thermal treatment method for wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009152283A (en) | 2009-07-09 |
| JP4998246B2 (en) | 2012-08-15 |
| TW200941633A (en) | 2009-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
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