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WO2009066704A1 - はんだ材料及びその製造方法、接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法 - Google Patents

はんだ材料及びその製造方法、接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法 Download PDF

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Publication number
WO2009066704A1
WO2009066704A1 PCT/JP2008/071043 JP2008071043W WO2009066704A1 WO 2009066704 A1 WO2009066704 A1 WO 2009066704A1 JP 2008071043 W JP2008071043 W JP 2008071043W WO 2009066704 A1 WO2009066704 A1 WO 2009066704A1
Authority
WO
WIPO (PCT)
Prior art keywords
producing
power semiconductor
semiconductor module
solder material
joint product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/071043
Other languages
English (en)
French (fr)
Inventor
Yasushi Yamada
Yuji Yagi
Yoshikazu Takaku
Ikuo Ohnuma
Kiyohito Ishida
Takashi Atsumi
Ikuo Nakagawa
Mikio Shirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku University NUC
Toyota Motor Corp
Original Assignee
Tohoku University NUC
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku University NUC, Toyota Motor Corp filed Critical Tohoku University NUC
Priority to CN2008800226496A priority Critical patent/CN101687284B/zh
Priority to US12/669,346 priority patent/US8283783B2/en
Priority to EP08852575.3A priority patent/EP2213404A4/en
Publication of WO2009066704A1 publication Critical patent/WO2009066704A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C18/00—Alloys based on zinc
    • C22C18/04—Alloys based on zinc with aluminium as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • H10W72/01308—
    • H10W72/073—
    • H10W72/07311—
    • H10W72/07336—
    • H10W72/07352—
    • H10W72/30—
    • H10W72/321—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/387—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12222—Shaped configuration for melting [e.g., package, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Die Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

　本発明の亜鉛系はんだ材料５５は、亜鉛系材料５０における表面の酸化膜５０１を除去した後に、又は表面に酸化膜５０１が存在しない状態で、前記酸化膜５０１よりもその酸化物が還元され易い金属を主成分とする被覆層５１を前記表面に設けてなる。また、本発明の接合体およびパワー半導体モジュールは、接合部に前記亜鉛系はんだ材料５５が用いられ、接合後には前記被覆層５１が消失している。
PCT/JP2008/071043 2007-11-20 2008-11-19 はんだ材料及びその製造方法、接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法 Ceased WO2009066704A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800226496A CN101687284B (zh) 2007-11-20 2008-11-19 接合体及其制造方法、以及功率半导体模块及其制造方法
US12/669,346 US8283783B2 (en) 2007-11-20 2008-11-19 Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same
EP08852575.3A EP2213404A4 (en) 2007-11-20 2008-11-19 SOLDERING MATERIAL, METHOD FOR PRODUCING THE SOLDER MATERIAL, CONNECTING PRODUCT, METHOD FOR PRODUCING THE CONNECTING PRODUCT, POWER-SEMICONDUCTOR MODULE, AND METHOD FOR PRODUCING THE POWER-SEMICONDUCTOR MODULE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007300792A JP5160201B2 (ja) 2007-11-20 2007-11-20 はんだ材料及びその製造方法、接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法
JP2007-300792 2007-11-20

Publications (1)

Publication Number Publication Date
WO2009066704A1 true WO2009066704A1 (ja) 2009-05-28

Family

ID=40667526

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071043 Ceased WO2009066704A1 (ja) 2007-11-20 2008-11-19 はんだ材料及びその製造方法、接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法

Country Status (5)

Country Link
US (1) US8283783B2 (ja)
EP (1) EP2213404A4 (ja)
JP (1) JP5160201B2 (ja)
CN (1) CN101687284B (ja)
WO (1) WO2009066704A1 (ja)

Cited By (3)

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JPH1145152A (ja) * 1997-07-28 1999-02-16 Melco:Kk 発電式無電源マウス
JP2014143342A (ja) * 2013-01-25 2014-08-07 Sanken Electric Co Ltd 半導体モジュール及びその製造方法
JP2015018843A (ja) * 2013-07-09 2015-01-29 三菱電機株式会社 電力用半導体装置の製造方法および電力用半導体装置

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JP2010179336A (ja) * 2009-02-05 2010-08-19 Toyota Central R&D Labs Inc 接合体、半導体モジュール、及び接合体の製造方法
US8193040B2 (en) * 2010-02-08 2012-06-05 Infineon Technologies Ag Manufacturing of a device including a semiconductor chip
US9217192B2 (en) * 2010-03-01 2015-12-22 Osaka University Semiconductor device and bonding material for semiconductor device
JP5828618B2 (ja) * 2010-05-13 2015-12-09 住友金属鉱山株式会社 コーティング膜付きＰｂフリーＺｎ系はんだ合金及びその製造方法
JP5601275B2 (ja) 2010-08-31 2014-10-08 日立金属株式会社 接合材料、その製造方法、および接合構造の製造方法
JP6163305B2 (ja) * 2010-09-24 2017-07-12 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置
JP5206779B2 (ja) * 2010-12-08 2013-06-12 住友金属鉱山株式会社 Ｚｎを主成分とするＰｂフリーはんだ合金
JP5325917B2 (ja) 2011-03-17 2013-10-23 株式会社東芝 半導体装置及びその製造方法
PH12013502053A1 (en) * 2011-04-04 2019-03-22 Ceram Gmbh Ceramic printed circuit board comprising an al cooling body
JP5672132B2 (ja) * 2011-04-27 2015-02-18 住友金属鉱山株式会社 Ｚｎを主成分とするＰｂフリーはんだ合金およびその製造方法
US9735126B2 (en) 2011-06-07 2017-08-15 Infineon Technologies Ag Solder alloys and arrangements
JP5675525B2 (ja) 2011-07-28 2015-02-25 日産自動車株式会社 半導体装置の製造方法及び半導体装置
JP5588419B2 (ja) * 2011-10-26 2014-09-10 株式会社東芝 パッケージ
JP6104518B2 (ja) 2012-04-27 2017-03-29 日産自動車株式会社 半導体装置の製造方法、断熱荷重治具及び断熱荷重治具の設置方法
US9105561B2 (en) * 2012-05-14 2015-08-11 The Boeing Company Layered bonded structures formed from reactive bonding of zinc metal and zinc peroxide
JP2014024082A (ja) * 2012-07-26 2014-02-06 Sumitomo Metal Mining Co Ltd はんだ合金
TWI476883B (zh) * 2012-11-15 2015-03-11 財團法人工業技術研究院 焊料、接點結構及接點結構的製作方法
WO2014179108A1 (en) 2013-05-03 2014-11-06 Honeywell International Inc. Lead frame construct for lead-free solder connections
JP2015098048A (ja) * 2013-11-19 2015-05-28 住友金属鉱山株式会社 Ｐｂを含まないＺｎ−Ｇｅ系はんだ合金およびそれを用いた電子部品
EP3107683B1 (en) 2014-02-20 2021-12-08 Honeywell International Inc. Method of forming a solder wire
JP2015165527A (ja) * 2014-02-28 2015-09-17 株式会社東芝 半導体装置及びその製造方法
JP2015208765A (ja) * 2014-04-28 2015-11-24 三菱電機株式会社 無鉛はんだ材、電力用半導体装置、および電力用半導体装置の製造方法
JP6468412B2 (ja) * 2014-06-13 2019-02-13 Tdk株式会社 磁性体コアおよびコイル装置
JP6387697B2 (ja) * 2014-06-13 2018-09-12 Tdk株式会社 磁性体コアおよびコイル装置
JP6078577B2 (ja) * 2015-04-22 2017-02-08 株式会社日立製作所 接続材料、接続方法、半導体装置及び半導体装置の製造方法
JP6493161B2 (ja) * 2015-11-05 2019-04-03 トヨタ自動車株式会社 半導体装置の製造方法
US9802274B2 (en) 2016-03-21 2017-10-31 Indium Corporation Hybrid lead-free solder wire
WO2019189329A1 (ja) * 2018-03-28 2019-10-03 三菱マテリアル株式会社 ヒートシンク付き絶縁回路基板
CN109534842B (zh) * 2018-11-26 2021-08-10 北京卫星制造厂有限公司 功率半导体模块用焊接工艺
JP7080161B2 (ja) * 2018-12-05 2022-06-03 三菱電機株式会社 半導体装置
KR102564459B1 (ko) * 2019-05-09 2023-08-07 현대자동차주식회사 양면 냉각 파워모듈의 스페이서 구조 및 그 제조 방법
CN112935633A (zh) * 2021-02-03 2021-06-11 新疆应用职业技术学院 复合焊丝的制造方法

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Publication number Priority date Publication date Assignee Title
JPH1145152A (ja) * 1997-07-28 1999-02-16 Melco:Kk 発電式無電源マウス
JP2014143342A (ja) * 2013-01-25 2014-08-07 Sanken Electric Co Ltd 半導体モジュール及びその製造方法
JP2015018843A (ja) * 2013-07-09 2015-01-29 三菱電機株式会社 電力用半導体装置の製造方法および電力用半導体装置

Also Published As

Publication number Publication date
EP2213404A4 (en) 2016-11-30
JP5160201B2 (ja) 2013-03-13
CN101687284B (zh) 2013-06-05
CN101687284A (zh) 2010-03-31
JP2009125753A (ja) 2009-06-11
US8283783B2 (en) 2012-10-09
EP2213404A1 (en) 2010-08-04
US20100193801A1 (en) 2010-08-05

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