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WO2009054371A1 - Procédé de formation de film de revêtement métallique, et particule électriquement conductrice - Google Patents

Procédé de formation de film de revêtement métallique, et particule électriquement conductrice Download PDF

Info

Publication number
WO2009054371A1
WO2009054371A1 PCT/JP2008/069024 JP2008069024W WO2009054371A1 WO 2009054371 A1 WO2009054371 A1 WO 2009054371A1 JP 2008069024 W JP2008069024 W JP 2008069024W WO 2009054371 A1 WO2009054371 A1 WO 2009054371A1
Authority
WO
WIPO (PCT)
Prior art keywords
coating film
metal coating
conductive particle
electrically non
formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/069024
Other languages
English (en)
Japanese (ja)
Inventor
Hidekatsu Kuroda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Exsymo Co Ltd
Original Assignee
Ube Nitto Kasei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Nitto Kasei Co Ltd filed Critical Ube Nitto Kasei Co Ltd
Priority to KR1020107008712A priority Critical patent/KR101502995B1/ko
Priority to JP2009538214A priority patent/JP5620678B2/ja
Priority to CN200880111331A priority patent/CN101842515A/zh
Publication of WO2009054371A1 publication Critical patent/WO2009054371A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Liquid Crystal (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)

Abstract

L'invention porte sur un procédé pour la formation d'un film de revêtement métallique, qui est caractérisé par la formation d'un film de revêtement de métal sur une particule électriquement non-conductrice ayant un diamètre de particule de 0,5 à 100 µm par dépôt autocatalytique. Le dépôt autocatalytique est effectué après qu'un pré-traitement pour fixer un cœur de métal à la particule électriquement non conductrice a été effectué, et peut former un film de revêtement métallique constitué d'argent en présence d'un composé de silane comportant un groupe thiol. Le film de revêtement métallique formé sur la totalité de la surface de la particule électriquement non conductrice peut communiquer une conductivité électrique à la particule électriquement non conductrice. La particule électriquement non-conductrice a un diamètre de particule compris entre 0,5 et 100 µm. Le film de revêtement métallique est constitué par une seule couche d'argent.
PCT/JP2008/069024 2007-10-23 2008-10-21 Procédé de formation de film de revêtement métallique, et particule électriquement conductrice Ceased WO2009054371A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107008712A KR101502995B1 (ko) 2007-10-23 2008-10-21 금속 피막 형성 방법 및 도전성 입자
JP2009538214A JP5620678B2 (ja) 2007-10-23 2008-10-21 金属皮膜形成方法及び導電性粒子
CN200880111331A CN101842515A (zh) 2007-10-23 2008-10-21 金属薄膜形成方法及导电性粒子

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-275794 2007-10-23
JP2007275794 2007-10-23

Publications (1)

Publication Number Publication Date
WO2009054371A1 true WO2009054371A1 (fr) 2009-04-30

Family

ID=40579476

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069024 Ceased WO2009054371A1 (fr) 2007-10-23 2008-10-21 Procédé de formation de film de revêtement métallique, et particule électriquement conductrice

Country Status (5)

Country Link
JP (1) JP5620678B2 (fr)
KR (1) KR101502995B1 (fr)
CN (1) CN101842515A (fr)
TW (1) TWI467049B (fr)
WO (1) WO2009054371A1 (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011058050A (ja) * 2009-09-10 2011-03-24 Ricoh Co Ltd 複合金属ナノ粒子とその製造方法および複合金属ナノ粒子を含む多光子吸収材料または多光子吸収反応助剤
JP2011168631A (ja) * 2010-02-16 2011-09-01 Nippon Shokubai Co Ltd 金属被覆粒子の製造方法
JP2013510953A (ja) * 2009-11-16 2013-03-28 ビーエーエスエフ ソシエタス・ヨーロピア 島状金属被覆及び合成方法
WO2012072658A3 (fr) * 2010-11-30 2013-12-12 Technische Universität Dresden Procédé de revêtement métallique de nanoparticules par des techniques de dépôt autocatalytique
JP5497183B2 (ja) * 2010-08-20 2014-05-21 三菱マテリアル株式会社 銀被覆球状樹脂、及びその製造方法、並びに銀被覆球状樹脂を含有する異方性導電接着剤、異方性導電フィルム、及び導電スペーサー
WO2016121558A1 (fr) * 2015-01-28 2016-08-04 三菱マテリアル株式会社 Particules revêtues d'argent et leur procédé de production
JP2016146319A (ja) * 2015-01-28 2016-08-12 三菱マテリアル株式会社 銀被覆粒子及びその製造方法
EP3096330A4 (fr) * 2014-01-14 2017-06-28 Toyo Aluminium Kabushiki Kaisha Particules conductrices composites, composition de résine conductrice contenant ces dernières et article conducteur revêtu
JP2021019012A (ja) * 2019-07-17 2021-02-15 信越ポリマー株式会社 電磁波シールドフィルム、回路基板、及び回路基板の製造方法
CN114695896A (zh) * 2022-03-14 2022-07-01 电子科技大学 一种电子器件的自组装高阻隔薄膜封装方法
CN119300674A (zh) * 2024-09-14 2025-01-10 华中科技大学 一种基于二氧化硅包覆的金属核壳纳米粒子薄膜的纳米晶浮栅存储器及印刷制备方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102681262B (zh) * 2012-02-23 2016-02-24 京东方科技集团股份有限公司 一种掺杂在封框胶中的导电型隔垫物及其制备方法和应用
CN105264114A (zh) * 2013-06-18 2016-01-20 株式会社杰希优 无电解金属镀敷的防桥接液及使用其的印刷布线板的制造方法
US11072711B2 (en) * 2017-12-22 2021-07-27 Eckart Gmbh Electrically conductive particles, composition, article and method of manufacturing electrically conductive particles

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051151A (ja) * 2003-07-31 2005-02-24 Seiko Epson Corp 導電層の製造方法、導電層を有する基板、および電子デバイス
JP2006169566A (ja) * 2004-12-14 2006-06-29 Sk Kaken Co Ltd 着色粒子の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0642189B2 (ja) * 1987-09-07 1994-06-01 触媒化成工業株式会社 タッチパネル
JPH0696771B2 (ja) * 1988-03-24 1994-11-30 日本化学工業株式会社 無電解めっき粉末並びに導電性フィラーおよびその製造方法
JP3940638B2 (ja) * 2002-06-10 2007-07-04 積水化学工業株式会社 導電性微粒子及び導電性微粒子の製造方法
JP2004224942A (ja) * 2003-01-24 2004-08-12 Kinugawa Rubber Ind Co Ltd 異方導電性弾性体組成物およびその製造方法
JP2006040546A (ja) * 2004-07-22 2006-02-09 Sanyo Chem Ind Ltd 導電性微粒子
JP2007242307A (ja) * 2006-03-06 2007-09-20 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051151A (ja) * 2003-07-31 2005-02-24 Seiko Epson Corp 導電層の製造方法、導電層を有する基板、および電子デバイス
JP2006169566A (ja) * 2004-12-14 2006-06-29 Sk Kaken Co Ltd 着色粒子の製造方法

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011058050A (ja) * 2009-09-10 2011-03-24 Ricoh Co Ltd 複合金属ナノ粒子とその製造方法および複合金属ナノ粒子を含む多光子吸収材料または多光子吸収反応助剤
JP2013510953A (ja) * 2009-11-16 2013-03-28 ビーエーエスエフ ソシエタス・ヨーロピア 島状金属被覆及び合成方法
JP2011168631A (ja) * 2010-02-16 2011-09-01 Nippon Shokubai Co Ltd 金属被覆粒子の製造方法
JP5497183B2 (ja) * 2010-08-20 2014-05-21 三菱マテリアル株式会社 銀被覆球状樹脂、及びその製造方法、並びに銀被覆球状樹脂を含有する異方性導電接着剤、異方性導電フィルム、及び導電スペーサー
US9093192B2 (en) 2010-08-20 2015-07-28 Mitsubishi Materials Corporation Silver-coated spherical resin, method for producing same, anisotropically conductive adhesive containing silver-coated spherical resin, anisotropically conductive film containing silver-coated spherical resin, and conductive spacer containing silver-coated spherical resin
WO2012072658A3 (fr) * 2010-11-30 2013-12-12 Technische Universität Dresden Procédé de revêtement métallique de nanoparticules par des techniques de dépôt autocatalytique
US10227496B2 (en) 2014-01-14 2019-03-12 Toyo Aluminium Kabushiki Kaisha Composite conductive particle, conductive resin composition containing same and conductive coated article
EP3096330A4 (fr) * 2014-01-14 2017-06-28 Toyo Aluminium Kabushiki Kaisha Particules conductrices composites, composition de résine conductrice contenant ces dernières et article conducteur revêtu
JP2016146319A (ja) * 2015-01-28 2016-08-12 三菱マテリアル株式会社 銀被覆粒子及びその製造方法
WO2016121558A1 (fr) * 2015-01-28 2016-08-04 三菱マテリアル株式会社 Particules revêtues d'argent et leur procédé de production
US10590540B2 (en) 2015-01-28 2020-03-17 Mitsubishi Materials Corporation Silver-coated particle and method of producing same
JP2021019012A (ja) * 2019-07-17 2021-02-15 信越ポリマー株式会社 電磁波シールドフィルム、回路基板、及び回路基板の製造方法
CN114695896A (zh) * 2022-03-14 2022-07-01 电子科技大学 一种电子器件的自组装高阻隔薄膜封装方法
CN119300674A (zh) * 2024-09-14 2025-01-10 华中科技大学 一种基于二氧化硅包覆的金属核壳纳米粒子薄膜的纳米晶浮栅存储器及印刷制备方法

Also Published As

Publication number Publication date
TWI467049B (zh) 2015-01-01
CN101842515A (zh) 2010-09-22
KR20100093518A (ko) 2010-08-25
TW200936807A (en) 2009-09-01
JP5620678B2 (ja) 2014-11-05
KR101502995B1 (ko) 2015-03-16
JPWO2009054371A1 (ja) 2011-03-03

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