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DE602009001232D1 - Leiterplatte und Herstellungsverfahren dafür - Google Patents

Leiterplatte und Herstellungsverfahren dafür

Info

Publication number
DE602009001232D1
DE602009001232D1 DE602009001232T DE602009001232T DE602009001232D1 DE 602009001232 D1 DE602009001232 D1 DE 602009001232D1 DE 602009001232 T DE602009001232 T DE 602009001232T DE 602009001232 T DE602009001232 T DE 602009001232T DE 602009001232 D1 DE602009001232 D1 DE 602009001232D1
Authority
DE
Germany
Prior art keywords
line
manufacturing
circuit board
printed circuit
connecting layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602009001232T
Other languages
English (en)
Inventor
Jun Ishii
Toshiki Naitou
Mitsuru Honjo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE602009001232D1 publication Critical patent/DE602009001232D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/484—Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853—Constructional details of the electrical connection between head and arm
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09254—Branched layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Paper (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
DE602009001232T 2008-11-10 2009-10-19 Leiterplatte und Herstellungsverfahren dafür Active DE602009001232D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008287773A JP5142951B2 (ja) 2008-11-10 2008-11-10 配線回路基板およびその製造方法

Publications (1)

Publication Number Publication Date
DE602009001232D1 true DE602009001232D1 (de) 2011-06-16

Family

ID=41404591

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602009001232T Active DE602009001232D1 (de) 2008-11-10 2009-10-19 Leiterplatte und Herstellungsverfahren dafür

Country Status (6)

Country Link
US (1) US8138427B2 (de)
EP (1) EP2187715B1 (de)
JP (1) JP5142951B2 (de)
CN (1) CN101742811B (de)
AT (1) ATE508617T1 (de)
DE (1) DE602009001232D1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5484176B2 (ja) 2010-04-26 2014-05-07 日東電工株式会社 配線回路基板およびその製造方法
US8339748B2 (en) * 2010-06-29 2012-12-25 Western Digital Technologies, Inc. Suspension assembly having a microactuator bonded to a flexure
JP4962878B2 (ja) * 2010-07-05 2012-06-27 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びに、サスペンションの製造方法
KR20120047596A (ko) * 2010-11-04 2012-05-14 삼성전자주식회사 반도체 소자의 배선 구조
JP5093701B2 (ja) * 2010-12-28 2012-12-12 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びにサスペンション用基板の製造方法
JP5772013B2 (ja) * 2011-01-27 2015-09-02 大日本印刷株式会社 サスペンション用基板
JP5810570B2 (ja) * 2011-03-18 2015-11-11 大日本印刷株式会社 サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP5311237B2 (ja) * 2011-04-11 2013-10-09 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法
JP5845631B2 (ja) * 2011-05-24 2016-01-20 大日本印刷株式会社 サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブ、およびサスペンション用フレキシャー基板の製造方法、ならびに検査方法
JP5924909B2 (ja) * 2011-11-21 2016-05-25 日東電工株式会社 配線回路基板およびその製造方法
JP6015024B2 (ja) * 2012-02-20 2016-10-26 大日本印刷株式会社 サスペンション用基板の製造方法
JP6024803B2 (ja) * 2015-09-07 2016-11-16 大日本印刷株式会社 サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP6128184B2 (ja) * 2015-10-30 2017-05-17 大日本印刷株式会社 サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP6160756B2 (ja) * 2016-08-26 2017-07-12 大日本印刷株式会社 サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP6802688B2 (ja) * 2016-11-02 2020-12-16 日東電工株式会社 配線回路基板
JP7161866B2 (ja) * 2018-05-31 2022-10-27 日東電工株式会社 配線回路基板

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JPH065995A (ja) * 1992-06-19 1994-01-14 Japan Servo Co Ltd バス配線用プリント基板
US5414393A (en) * 1992-08-20 1995-05-09 Hubbell Incorporated Telecommunication connector with feedback
US6341415B2 (en) * 1992-08-31 2002-01-29 Fujitsu Limited Method for assembling a magnetic head assembly and magnetic disk drive using bonding balls connecting magnetic head terminals to wiring terminals
SG52916A1 (en) * 1996-02-13 1998-09-28 Nitto Denko Corp Circuit substrate circuit-formed suspension substrate and production method thereof
JPH1012983A (ja) 1996-02-13 1998-01-16 Nitto Denko Corp 回路基板、回路付きサスペンション基板及びそれらの製造方法
SG55276A1 (en) * 1996-02-13 1998-12-21 Nitto Denko Corp Circuit substrate circuit-formed suspension substrate and production method thereof
US5717547A (en) * 1996-10-03 1998-02-10 Quantum Corporation Multi-trace transmission lines for R/W head interconnect in hard disk drive
JP3634134B2 (ja) * 1997-09-10 2005-03-30 富士通株式会社 サスペンション、ヘッドスライダ支持装置、及びディスク装置
US6392148B1 (en) * 1999-05-10 2002-05-21 Furukawa Electric Co., Ltd. Wire harness joint
JP3725991B2 (ja) * 1999-03-12 2005-12-14 株式会社日立グローバルストレージテクノロジーズ 磁気ディスク装置
US6424499B1 (en) * 1999-03-31 2002-07-23 Quantum Corporation Flexible trace interconnect array for multi-channel tape head
US6480359B1 (en) * 2000-05-09 2002-11-12 3M Innovative Properties Company Hard disk drive suspension with integral flexible circuit
JP2002009406A (ja) * 2000-06-19 2002-01-11 Mitsui Chemicals Inc 回路基板およびその製造方法
JP2002222578A (ja) * 2001-01-26 2002-08-09 Nitto Denko Corp 中継フレキシブル配線回路基板
JP3891912B2 (ja) 2002-10-09 2007-03-14 日本発条株式会社 ディスクドライブ用サスペンション
US6930888B2 (en) * 2002-11-04 2005-08-16 Intel Corporation Mechanism to cross high-speed differential pairs
US7259968B2 (en) * 2003-05-14 2007-08-21 Hewlett-Packard Development Company, L.P. Tailoring impedances of conductive traces in a circuit board
JP2005011387A (ja) * 2003-06-16 2005-01-13 Hitachi Global Storage Technologies Inc 磁気ディスク装置
JP2005109101A (ja) * 2003-09-30 2005-04-21 Nippon Mektron Ltd 電磁シールド型可撓性回路基板
JP2006040414A (ja) * 2004-07-27 2006-02-09 Nitto Denko Corp 配線回路基板
JP4757079B2 (ja) * 2006-04-03 2011-08-24 日東電工株式会社 配線回路基板およびその製造方法

Also Published As

Publication number Publication date
EP2187715B1 (de) 2011-05-04
EP2187715A1 (de) 2010-05-19
CN101742811A (zh) 2010-06-16
JP5142951B2 (ja) 2013-02-13
CN101742811B (zh) 2013-09-18
JP2010114366A (ja) 2010-05-20
ATE508617T1 (de) 2011-05-15
US8138427B2 (en) 2012-03-20
US20100116537A1 (en) 2010-05-13

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