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WO2008133186A1 - 回路接続用接着フィルム、接続構造体及びその製造方法 - Google Patents

回路接続用接着フィルム、接続構造体及びその製造方法 Download PDF

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Publication number
WO2008133186A1
WO2008133186A1 PCT/JP2008/057534 JP2008057534W WO2008133186A1 WO 2008133186 A1 WO2008133186 A1 WO 2008133186A1 JP 2008057534 W JP2008057534 W JP 2008057534W WO 2008133186 A1 WO2008133186 A1 WO 2008133186A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
adhesive layer
adhesive film
circuit member
connecting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057534
Other languages
English (en)
French (fr)
Inventor
Motohiro Arifuku
Nichiomi Mochizuki
Kouji Kobayashi
Kazuyoshi Kojima
Takashi Nakazawa
Yukihisa Hirosawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008002577A external-priority patent/JP5181220B2/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to KR1020097023996A priority Critical patent/KR101139073B1/ko
Priority to CN2008800049491A priority patent/CN101611659B/zh
Publication of WO2008133186A1 publication Critical patent/WO2008133186A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H10W72/30—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H10W72/074—
    • H10W72/325—
    • H10W72/352—
    • H10W72/354—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

【課題】回路接続用接着フィルムにおいて、回路接続後の接着強度及び長期接続信頼性を十分なレベルに維持しつつ、回路部材への転写性の改善を図ること。 【解決手段】第一の回路部材と第二の回路部材とを接着するために用いられる回路接続用接着フィルム。回路接続用接着フィルムは、接着剤層と接着剤層上に積層された接着剤層とを備える。回路接続用接着用フィルムを接着剤層が第一の回路部材に接する向きで第一の回路部材の第一の接続端子側の面に対して貼り付けたときの剥離強度が、接着剤層を第一の回路部材の第一の接続端子側の面に貼り付けたときの剥離強度よりも大きく、接着剤層の厚みが０．１～５．０μｍである。
PCT/JP2008/057534 2007-04-19 2008-04-17 回路接続用接着フィルム、接続構造体及びその製造方法 Ceased WO2008133186A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020097023996A KR101139073B1 (ko) 2007-04-19 2008-04-17 회로 접속용 접착 필름, 접속 구조체 및 그의 제조 방법
CN2008800049491A CN101611659B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007110385 2007-04-19
JP2007-110385 2007-04-19
JP2008002577A JP5181220B2 (ja) 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法
JP2008-002577 2008-01-09

Publications (1)

Publication Number Publication Date
WO2008133186A1 true WO2008133186A1 (ja) 2008-11-06

Family

ID=39925642

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057534 Ceased WO2008133186A1 (ja) 2007-04-19 2008-04-17 回路接続用接着フィルム、接続構造体及びその製造方法

Country Status (1)

Country Link
WO (1) WO2008133186A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010058782A1 (ja) * 2008-11-20 2010-05-27 ソニーケミカル＆インフォメーションデバイス株式会社 接続フィルム、並びに、接合体及びその製造方法
US8247697B2 (en) 2008-03-27 2012-08-21 Sony Chemical & Information Device Corporation Anisotropic conductive film, joined structure and method for producing the joined structure
CN113136145A (zh) * 2020-01-17 2021-07-20 广东生益科技股份有限公司 一种绝缘树脂片及其使用方法、包含其的印制电路板和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体
JP2007027712A (ja) * 1997-02-27 2007-02-01 Seiko Epson Corp 接着方法及び液晶装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027712A (ja) * 1997-02-27 2007-02-01 Seiko Epson Corp 接着方法及び液晶装置の製造方法
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8247697B2 (en) 2008-03-27 2012-08-21 Sony Chemical & Information Device Corporation Anisotropic conductive film, joined structure and method for producing the joined structure
US8980043B2 (en) 2008-03-27 2015-03-17 Dexerials Corporation Anisotropic conductive film, joined structure and method for producing the joined structure
WO2010058782A1 (ja) * 2008-11-20 2010-05-27 ソニーケミカル＆インフォメーションデバイス株式会社 接続フィルム、並びに、接合体及びその製造方法
JP2010123418A (ja) * 2008-11-20 2010-06-03 Sony Chemical & Information Device Corp 接続フィルム、並びに、接合体及びその製造方法
KR101085722B1 (ko) 2008-11-20 2011-11-21 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 접속 필름, 및 접합체 및 그 제조 방법
US8524032B2 (en) 2008-11-20 2013-09-03 Dexerials Corporation Connecting film, and joined structure and method for producing the same
US9023464B2 (en) 2008-11-20 2015-05-05 Dexerials Corporation Connecting film, and joined structure and method for producing the same
CN113136145A (zh) * 2020-01-17 2021-07-20 广东生益科技股份有限公司 一种绝缘树脂片及其使用方法、包含其的印制电路板和应用

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