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WO2008131998A2 - Support de pistes conductrices flexible et système à support de pistes conductrices - Google Patents

Support de pistes conductrices flexible et système à support de pistes conductrices Download PDF

Info

Publication number
WO2008131998A2
WO2008131998A2 PCT/EP2008/053570 EP2008053570W WO2008131998A2 WO 2008131998 A2 WO2008131998 A2 WO 2008131998A2 EP 2008053570 W EP2008053570 W EP 2008053570W WO 2008131998 A2 WO2008131998 A2 WO 2008131998A2
Authority
WO
WIPO (PCT)
Prior art keywords
support
conductor
flexible
carrier
conductor carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/053570
Other languages
German (de)
English (en)
Other versions
WO2008131998A3 (fr
Inventor
Heinz Baumann
Hans Braun
Michael Ferstl
Hans-Jürgen SIEGL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of WO2008131998A2 publication Critical patent/WO2008131998A2/fr
Publication of WO2008131998A3 publication Critical patent/WO2008131998A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Definitions

  • the invention relates to a flexible conductor carrier and a conductor carrier device.
  • a control unit for a motor vehicle is known.
  • a flexible foil carrying conductive tracks surrounds an electronic circuit disposed in a cavity of a housing.
  • the flexible printed circuit board is guided out of the cavity between a molded seal and a metallic base plate of the control unit and is itself part of the sealing system for the home.
  • the invention is based on the object to provide a flexible conductor carrier and a conductor track device, which are inexpensive to implement and allow a secure connection of electrical and / or electronic components on the conductor carrier.
  • the invention is characterized by a flexible conductor carrier for contacting electrical and / or electronic components, with a flexible base film, at least one conductor path arranged on the base film in a line region of the flexible conductor carrier, and a flexible cover film which comprises is formed for covering the conductor track and the base film, wherein between the base film and the cover sheet arranged in a support region outside the line region of the flexible conductor carrier a support element is arranged, which is designed for Abstutz the cover sheet against the base film.
  • the support element differs from the conductor track or the conductor tracks in that it has a pure support function for the cover film in relation to the base film and is electrically decoupled from the conductor track or the conductor tracks.
  • This embodiment of the flexible conductor carrier is particularly advantageous since a defined distance between the base film and the cover film in the areas can exist in which no conductor tracks are arranged. 200702397
  • the support element is formed such that the flexible conductor carrier has the same thickness in the support region as in the conduction region with the conductor path. This has the advantage that a defined, equal distance between the base film and the cover film is possible in all the areas in which either conductor tracks or support elements are arranged.
  • the support element in the support region has the same thickness as the conductor in the lead region. This is advantageous because the same layer can be used for the support element and the conductor track, and the support element only has to be electrically decoupled from the conductor track. In addition, air pockets can be avoided by providing the or the support elements in the conductor carrier.
  • the support element is formed from the same material or the same material combination as the conductor track. This has the advantage that the same layer of the same material can be used for the support area and the conductor track.
  • the support element is formed from a material which comprises a metal.
  • a material which comprises a metal for a mechanically particularly stable execution of the support area is possible.
  • the support element is formed from a material which comprises copper.
  • the invention is characterized by a strip conductor carrier device having a base element, a cover element, a flexible strip conductor carrier according to the first aspect of the invention, which is arranged between the base plate 200702397
  • siselement and the cover element is arranged, and a sealing element, which is arranged in the support region of the flexible conductor web carrier and having a sealing surface which is formed so that a contact region for contacting the electrical and / or electronic components can be sealed against an environment.
  • a support surface of the support region of the flexible conductor carrier is formed on an outer side of the flexible conductor carrier which is at least as large as the sealing surface of the sealing element enlarged by a predetermined support tolerance band.
  • FIG. 1 shows a plan view of a conductor carrier
  • Figure 2 is a sectional view of the conductor track carrying device along the line II-II 'of Fig. 1, and
  • FIG. 3 shows a further sectional view of a conductor carrier device along the line III-III 'of FIG. 1. 200702397
  • FIG. 1 shows a plan view of a conductor carrier 12 and a sealing element 34 arranged on the conductor carrier 12.
  • the view shown in FIG. 2 illustrates the structure of a conductor carrier device 10 with the conductor carrier 12.
  • the conductor carrier 12 has a base film 14 and a cover film 18, between which conductor tracks 16, which are preferably made of copper, are arranged.
  • the conductor tracks 16 are embedded in different adhesive layers 20, which are arranged between the base film 14 and the interconnects 16 on the one hand and the interconnects 16 and the cover film 18 on the other.
  • Both the base film 14 and the cover film 18 are flexible and are preferably made of polyimide having the chemical, thermal and mechanical properties required for use in vehicle components.
  • support elements 22 are arranged between the interconnects, which the
  • Support elements 22 may preferably also extend annularly or semi-annularly in the conductor carrier 12 between the base film 14 and the cover film 18 (FIG. 1), so as to also bridge larger distances between two conductor tracks 16.
  • the support elements 22 are electrically decoupled from the conductor tracks 16 and therefore do not serve the conduction of electric current, but the mechanical support of the cover sheet 18.
  • the support elements can also be principally borrowed coupled with an electrical potential, in such a way that through them no short circuit occurred. 200702397
  • the conductor carrier 12 is arranged between a base element 30 and a cover element 32.
  • the base member 30 is preferably a base plate.
  • the cover member 32 is preferably formed as a lid.
  • the sealing element 34 is arranged with a sealing surface 40 ( Figure 1).
  • the conductor carrier 12 is laminated onto the base element 30 by means of a further adhesive layer 21. Alternatively, a further sealing element between the base member 30 and the conductor carrier 12 may be arranged.
  • the support elements 22, together with sections of the conductor tracks 16, enclose a contact region 26 for contacting electrical and / or electronic components 28.
  • connecting points 24 are arranged at which the conductor carrier 12 can be contacted electrically, so as to allow an e- lektwitz coupling of the electrical and / or electronic components 28 with the environment.
  • a support surface 38 is formed, which is generally larger, but at least as large as the sealing surface 40 of the sealing element 34 enlarged by a predetermined position tolerance band.
  • the support tolerance band takes into account the manufacturing tolerances.
  • the sealing surface 40 of the sealing element 34 abuts directly on the support surface 38 of the conductor carrier 12 so as to achieve a good seal between the flexible conductor carrier 12 and the sealing element 34.
  • the conductor tracks 16 are arranged in line regions C and the support elements 22 in support regions S of the flexible conductor carrier 12.
  • the flexible conductor carrier 12 has in the line region C with the conductor tracks 16 and in FIG 200702397
  • the support region S with the support element 22 each have the same thickness D_F.
  • the support element 22 in the support region S has the same thickness D_S as the conductor tracks 16 in the lead region C. This embodiment makes it possible to achieve a good seal between the flexible conductor support 12 and in particular the sealing element 34.
  • the support elements 22 are preferably formed of the same material or the same combination of materials as the interconnects 16.
  • the support elements 22 preferably comprise a metal.
  • the support elements 22 are formed from a material which comprises copper. Since the conductor tracks 16 usually also have a material that is made of copper or another conductive
  • the production of the flexible conductor carrier 12 preferably takes place in such a way that interstices between the conductor tracks 16 to be produced are produced from a full-surface copper plate, preferably by an etching process, which are free of copper or another conductive material. It is thus possible in a simple manner, by dispensing with the complete removal of the copper in the interstices form the support elements 22, without the need for additional material is required.
  • the fixed composite of the base element 30, the flexible conductor support 12, the sealing element 34 and the cover element 32 makes it possible for the contact region 26 with the electrical and / or electronic components 28 to be sealed against an environment in a fluid-tight manner to protect them from aggressive influences.
  • Support elements 22 in the support areas S, in particular between the conductors 16, can be achieved that the flexible conductor carrier 12 in almost all the areas in which between the flexible conductor carrier 12 and the sealing element 34 is to be a fluid-tight seal, almost the same everywhere Thickness D_F has, so that the sealing member 34 in the region of the support portion S particularly well on the flexible conductor carrier 12 is applied and thus a very good sealing of the contact region 26 of the flexible conductor carrier sheet 12 can be made with respect to the environment.
  • the support surface 38 is larger than the sealing surface 40 of the sealing element 34, it can be achieved that a secure sealing of the contact region 26 of the flexible conductor carrier 12 by forming a large support surface of the sealing element 34 in the support region S is possible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un support de pistes conductrices (12) flexible servant à établir les contacts de composants électriques et/ou électroniques (28), ce support comprenant une feuille de base (14) flexible, au moins une piste conductrice (16) disposée sur la feuille de base (14) dans une région de conduction (C) du support de pistes conductrices (12) flexible, ainsi qu'une feuille de recouvrement (18) flexible conçue pour recouvrir la piste conductrice (16) et la feuille de base (14). Selon l'invention, un élément de soutien (22) conçu pour soutenir la feuille de recouvrement (18) vis-à-vis de la feuille de base (14) est disposé entre la feuille de base (14) et la feuille de recouvrement (18) dans une région de soutien (S) du support de pistes conductrices (12) flexible située à l'extérieur de la région de conduction (C).
PCT/EP2008/053570 2007-04-27 2008-03-26 Support de pistes conductrices flexible et système à support de pistes conductrices Ceased WO2008131998A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007020016.3 2007-04-27
DE200710020016 DE102007020016A1 (de) 2007-04-27 2007-04-27 Flexibler Leiterbahnträger und Leiterbahnträgervorrichtung

Publications (2)

Publication Number Publication Date
WO2008131998A2 true WO2008131998A2 (fr) 2008-11-06
WO2008131998A3 WO2008131998A3 (fr) 2009-02-12

Family

ID=39777512

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/053570 Ceased WO2008131998A2 (fr) 2007-04-27 2008-03-26 Support de pistes conductrices flexible et système à support de pistes conductrices

Country Status (2)

Country Link
DE (1) DE102007020016A1 (fr)
WO (1) WO2008131998A2 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5317478A (en) * 1991-11-12 1994-05-31 Hughes Aircraft Company Hermetic sealing of flexprint electronic packages
EP0972318B1 (fr) * 1997-04-02 2002-10-23 Siemens Aktiengesellschaft Connexion electrique entre un support de circuit et un support de traces conducteurs
DE19751095C1 (de) * 1997-11-18 1999-05-20 Siemens Ag Elektrische Verbindungsanordnung
DE19907949C2 (de) 1999-02-24 2002-11-07 Siemens Ag Steuergerät für ein Kraftfahrzeug
DE19961116A1 (de) 1999-12-17 2001-07-05 Siemens Ag Leiterplattenanordnung
JP2006173224A (ja) * 2004-12-14 2006-06-29 Funai Electric Co Ltd フレキシブルプリント基板
KR100752660B1 (ko) * 2006-03-31 2007-08-29 삼성전자주식회사 가요성 인쇄회로 및 이를 구비한 하드디스크 드라이브

Also Published As

Publication number Publication date
DE102007020016A1 (de) 2008-10-30
WO2008131998A3 (fr) 2009-02-12

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