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WO2008131998A3 - Support de pistes conductrices flexible et système à support de pistes conductrices - Google Patents

Support de pistes conductrices flexible et système à support de pistes conductrices Download PDF

Info

Publication number
WO2008131998A3
WO2008131998A3 PCT/EP2008/053570 EP2008053570W WO2008131998A3 WO 2008131998 A3 WO2008131998 A3 WO 2008131998A3 EP 2008053570 W EP2008053570 W EP 2008053570W WO 2008131998 A3 WO2008131998 A3 WO 2008131998A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductor carrier
flexible
conductor
substrate board
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/053570
Other languages
German (de)
English (en)
Other versions
WO2008131998A2 (fr
Inventor
Heinz Baumann
Hans Braun
Michael Ferstl
Hans-Juergen Siegl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of WO2008131998A2 publication Critical patent/WO2008131998A2/fr
Publication of WO2008131998A3 publication Critical patent/WO2008131998A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un support de pistes conductrices (12) flexible servant à établir les contacts de composants électriques et/ou électroniques (28), ce support comprenant une feuille de base (14) flexible, au moins une piste conductrice (16) disposée sur la feuille de base (14) dans une région de conduction (C) du support de pistes conductrices (12) flexible, ainsi qu'une feuille de recouvrement (18) flexible conçue pour recouvrir la piste conductrice (16) et la feuille de base (14). Selon l'invention, un élément de soutien (22) conçu pour soutenir la feuille de recouvrement (18) vis-à-vis de la feuille de base (14) est disposé entre la feuille de base (14) et la feuille de recouvrement (18) dans une région de soutien (S) du support de pistes conductrices (12) flexible située à l'extérieur de la région de conduction (C).
PCT/EP2008/053570 2007-04-27 2008-03-26 Support de pistes conductrices flexible et système à support de pistes conductrices Ceased WO2008131998A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710020016 DE102007020016A1 (de) 2007-04-27 2007-04-27 Flexibler Leiterbahnträger und Leiterbahnträgervorrichtung
DE102007020016.3 2007-04-27

Publications (2)

Publication Number Publication Date
WO2008131998A2 WO2008131998A2 (fr) 2008-11-06
WO2008131998A3 true WO2008131998A3 (fr) 2009-02-12

Family

ID=39777512

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/053570 Ceased WO2008131998A2 (fr) 2007-04-27 2008-03-26 Support de pistes conductrices flexible et système à support de pistes conductrices

Country Status (2)

Country Link
DE (1) DE102007020016A1 (fr)
WO (1) WO2008131998A2 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5317478A (en) * 1991-11-12 1994-05-31 Hughes Aircraft Company Hermetic sealing of flexprint electronic packages
WO1998044593A1 (fr) * 1997-04-02 1998-10-08 Siemens Aktiengesellschaft Connexion electrique entre un support de circuit et un support de traces conducteurs
DE19907949A1 (de) * 1999-02-24 2000-09-14 Siemens Ag Steuergerät für ein Kraftfahrzeug
US20010005048A1 (en) * 1999-12-17 2001-06-28 Dieter Krause Circuit board arrangement
EP1841296A1 (fr) * 2006-03-31 2007-10-03 Samsung Electronics Co., Ltd. Carte de circuit imprimé flexible et lecteur de disque dur utilisant cette carte

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19751095C1 (de) * 1997-11-18 1999-05-20 Siemens Ag Elektrische Verbindungsanordnung
JP2006173224A (ja) * 2004-12-14 2006-06-29 Funai Electric Co Ltd フレキシブルプリント基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5317478A (en) * 1991-11-12 1994-05-31 Hughes Aircraft Company Hermetic sealing of flexprint electronic packages
WO1998044593A1 (fr) * 1997-04-02 1998-10-08 Siemens Aktiengesellschaft Connexion electrique entre un support de circuit et un support de traces conducteurs
DE19907949A1 (de) * 1999-02-24 2000-09-14 Siemens Ag Steuergerät für ein Kraftfahrzeug
US20010005048A1 (en) * 1999-12-17 2001-06-28 Dieter Krause Circuit board arrangement
EP1841296A1 (fr) * 2006-03-31 2007-10-03 Samsung Electronics Co., Ltd. Carte de circuit imprimé flexible et lecteur de disque dur utilisant cette carte

Also Published As

Publication number Publication date
WO2008131998A2 (fr) 2008-11-06
DE102007020016A1 (de) 2008-10-30

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