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WO2008123110A1 - 感光性接着剤組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、半導体装置、及び、半導体装置の製造方法 - Google Patents

感光性接着剤組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、半導体装置、及び、半導体装置の製造方法 Download PDF

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Publication number
WO2008123110A1
WO2008123110A1 PCT/JP2008/055124 JP2008055124W WO2008123110A1 WO 2008123110 A1 WO2008123110 A1 WO 2008123110A1 JP 2008055124 W JP2008055124 W JP 2008055124W WO 2008123110 A1 WO2008123110 A1 WO 2008123110A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
semiconductor device
film
photosensitive
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/055124
Other languages
English (en)
French (fr)
Inventor
Kazuyuki Mitsukura
Takashi Kawamori
Takashi Masuko
Shigeki Katogi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2009509055A priority Critical patent/JP5093229B2/ja
Priority to EP08722499A priority patent/EP2135910A4/en
Priority to US12/594,461 priority patent/US20100143673A1/en
Priority to KR1020127013258A priority patent/KR101256332B1/ko
Publication of WO2008123110A1 publication Critical patent/WO2008123110A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/04—Chromates
    • H10W76/47—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H10W72/884—
    • H10W90/732—
    • H10W90/734—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)

Abstract

本発明の感光性接着剤組成物は、（Ａ）アルカリ可溶性の樹脂と、（Ｂ）エポキシ樹脂と、（Ｃ）放射線重合性化合物と、（Ｄ）光開始剤を含有する感光性接着剤組成物であって、（Ｄ）光開始剤が、少なくとも（Ｄ１）放射線の照射によりエポキシ樹脂の重合及び／又は硬化反応を促進する機能を発現する光開始剤を含有する。
PCT/JP2008/055124 2007-04-04 2008-03-19 感光性接着剤組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、半導体装置、及び、半導体装置の製造方法 Ceased WO2008123110A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009509055A JP5093229B2 (ja) 2007-04-04 2008-03-19 感光性接着剤組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、半導体装置、及び、半導体装置の製造方法
EP08722499A EP2135910A4 (en) 2007-04-04 2008-03-19 PHOTOSENSIBLE ADHESIVE, FILM-ADHESIVE ADHESIVE, ADHESIVE FILM, ADHESIVE SAMPLE, SEMICONDUCTOR SUBSTRATE WITH PLASTIC LAYER, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING PROCESS
US12/594,461 US20100143673A1 (en) 2007-04-04 2008-03-19 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method
KR1020127013258A KR101256332B1 (ko) 2007-04-04 2008-03-19 감광성 접착제 조성물, 필름상 접착제, 접착 시트, 접착제 패턴, 접착제층 부착 반도체 웨이퍼, 반도체 장치, 및, 반도체 장치의 제조방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007098356 2007-04-04
JP2007-098356 2007-04-04
JP2007239909 2007-09-14
JP2007-239909 2007-09-14

Publications (1)

Publication Number Publication Date
WO2008123110A1 true WO2008123110A1 (ja) 2008-10-16

Family

ID=39830609

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055124 Ceased WO2008123110A1 (ja) 2007-04-04 2008-03-19 感光性接着剤組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、半導体装置、及び、半導体装置の製造方法

Country Status (6)

Country Link
US (1) US20100143673A1 (ja)
EP (1) EP2135910A4 (ja)
JP (1) JP5093229B2 (ja)
KR (2) KR101175401B1 (ja)
TW (1) TW200907004A (ja)
WO (1) WO2008123110A1 (ja)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006313289A (ja) * 2005-05-09 2006-11-16 Sekisui Chem Co Ltd 液晶滴下工法用シール剤、上下導通材料及び液晶表示素子
WO2009090922A1 (ja) * 2008-01-16 2009-07-23 Hitachi Chemical Company, Ltd. 感光性接着剤組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、半導体装置、及び、半導体装置の製造方法
WO2010024295A1 (ja) * 2008-08-27 2010-03-04 日立化成工業株式会社 感光性接着剤組成物、フィルム状感光性接着剤、接着剤パターン、接着剤付き半導体ウェハ、半導体装置、及び電子部品
JP2010189484A (ja) * 2009-02-16 2010-09-02 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
JP2010189485A (ja) * 2009-02-16 2010-09-02 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
WO2011001942A1 (ja) * 2009-06-30 2011-01-06 日立化成工業株式会社 感光性接着剤、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
JP2011042775A (ja) * 2009-07-22 2011-03-03 Hitachi Chem Co Ltd 感光性接着剤組成物、感光性エレメント、レジストパターンの製造方法及び接着体の製造方法
JP2012078840A (ja) * 2011-11-07 2012-04-19 Sekisui Chem Co Ltd 液晶滴下工法用シール剤、上下導通材料及び液晶表示素子
JP2013001847A (ja) * 2011-06-17 2013-01-07 Hitachi Chemical Co Ltd 半導体用積層シート、接着剤層付き半導体チップの製造方法及び半導体装置の製造方法
JP2013068797A (ja) * 2011-09-22 2013-04-18 Hitachi Chemical Co Ltd 感光性接着剤組成物、これを用いた感光性エレメント、レジストパターンの形成方法及び被接着部材の接着方法
JP2015101604A (ja) * 2013-11-21 2015-06-04 東京応化工業株式会社 感エネルギー性組成物
JP2015187726A (ja) * 2014-03-14 2015-10-29 株式会社Adeka 感光性樹脂組成物
JPWO2013172433A1 (ja) * 2012-05-17 2016-01-12 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
EP2492331A4 (en) * 2009-10-19 2016-09-07 Toray Industries LIGHT-SENSITIVE LAMINATE, LIGHT-SENSITIVE FUEL AND SEMICONDUCTOR COMPONENTS THEREWITH
JP2017214528A (ja) * 2016-06-02 2017-12-07 日東電工株式会社 真空プロセス用粘着テープ
CN107976867A (zh) * 2016-10-24 2018-05-01 东京应化工业株式会社 感光性组合物及固化膜的形成方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090042842A (ko) * 2006-10-04 2009-04-30 히다치 가세고교 가부시끼가이샤 다이본딩용 수지 페이스트, 반도체장치의 제조방법 및 반도체장치
US20100295190A1 (en) * 2007-06-06 2010-11-25 Kazuyuki Mitsukura Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device
JP5644896B2 (ja) * 2012-07-04 2014-12-24 大日本印刷株式会社 粘接着層及び粘接着シート
US9751984B2 (en) 2012-12-21 2017-09-05 Hitachi Chemical Dupont Microsystems, Ltd. Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition
KR102630893B1 (ko) * 2015-11-25 2024-01-31 롬엔드하스전자재료코리아유한회사 감광성 수지 조성물 및 이로부터 제조된 경화막
WO2017090879A1 (en) * 2015-11-25 2017-06-01 Rohm And Haas Electronic Materials Korea Ltd. Photosensitive resin composition and cured film prepared therefrom
KR102504338B1 (ko) * 2015-12-03 2023-02-28 롬엔드하스전자재료코리아유한회사 감광성 수지 조성물 및 이를 이용한 유기 절연막
US10522907B2 (en) * 2017-05-19 2019-12-31 Voxx International Corporation WiFi and bluetooth smart indoor/outdoor antenna with automatic motorized and app control
JP7018126B2 (ja) * 2018-04-20 2022-02-09 富士フイルム株式会社 導熱層、感光層、感光性組成物、導熱層の製造方法、並びに、積層体および半導体デバイス
KR20210146882A (ko) * 2019-03-27 2021-12-06 도레이 카부시키가이샤 감광성 수지 조성물, 감광성 수지 시트, 중공 구조의 제조 방법 및 전자 부품
KR102814936B1 (ko) * 2020-12-17 2025-05-29 세키스이가세이힝코교가부시키가이샤 적층판, 빌드업층이 형성된 적층판, 금속박이 형성된 적층판, 및 회로 기판
JP2023010237A (ja) * 2021-07-09 2023-01-20 イビデン株式会社 配線基板及び配線基板の製造方法
KR102378082B1 (ko) * 2021-09-23 2022-03-24 박성호 Dfr 필름 제조 방법
KR102673269B1 (ko) * 2022-01-10 2024-06-05 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 감광성 수지막 및 반도체 장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH089643B2 (ja) * 1987-07-06 1996-01-31 富士写真フイルム株式会社 光重合性組成物
JPH1124257A (ja) 1997-07-04 1999-01-29 Hitachi Chem Co Ltd 感光性ポリイミド前駆体組成物及びそれを用いたパターン製造法
JP2000290501A (ja) 1999-04-05 2000-10-17 Nitto Denko Corp 感光性ポリイミド樹脂前駆体及び接着剤
JP2001329233A (ja) 2000-03-15 2001-11-27 Shin Etsu Chem Co Ltd フィルム状電子部品用接着剤及び電子部品
JP2005316449A (ja) * 2004-03-30 2005-11-10 Nippon Steel Chem Co Ltd 感光性樹脂組成物及びそれを用いたカラーフィルター
JP2006516246A (ja) * 2002-12-03 2006-06-29 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド ヘテロ芳香族基を有するオキシムエステル光開始剤
WO2007004569A1 (ja) * 2005-07-05 2007-01-11 Hitachi Chemical Company, Ltd. 感光性接着剤組成物、並びにこれを用いて得られる接着フィルム、接着シート、接着剤層付半導体ウェハ、半導体装置及び電子部品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4950581A (en) * 1987-07-06 1990-08-21 Fuji Photo Film Co., Ltd. Photopolymerizable composition
JP4135793B2 (ja) * 1999-12-03 2008-08-20 日本化薬株式会社 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
NL1016815C2 (nl) * 1999-12-15 2002-05-14 Ciba Sc Holding Ag Oximester-fotoinitiatoren.
TW574263B (en) * 2001-06-28 2004-02-01 Dainippon Ink & Chemicals Active energy ray-curable polyimide resin composition
DE10237950A1 (de) * 2002-08-20 2004-03-11 Tesa Ag UV-initiiert thermisch vernetzte Acrylathaftklebemassen
EP1403043B1 (en) * 2002-09-30 2009-04-15 FUJIFILM Corporation Polymerizable composition and planographic printing plate precursor
US8063245B2 (en) * 2003-06-05 2011-11-22 Kaneka Corporation Phosphazene compound, photosensitive resin composition and use thereof
TWI349677B (en) * 2004-03-30 2011-10-01 Nippon Steel Chemical Co Photosensitive resin composition and color filter using the same
JP2006023419A (ja) * 2004-07-07 2006-01-26 Shin Etsu Chem Co Ltd 液晶表示セル用シール剤組成物
JP2006124531A (ja) * 2004-10-29 2006-05-18 Shin Etsu Chem Co Ltd 異方導電性接着剤
JP2006330301A (ja) * 2005-05-25 2006-12-07 Shin Etsu Chem Co Ltd 液晶表示素子用シール剤組成物
US7582398B2 (en) * 2007-06-13 2009-09-01 Xerox Corporation Inkless reimageable printing paper and method
WO2009076255A2 (en) * 2007-12-06 2009-06-18 Saint-Gobain Abrasives, Inc. Abrasive articles and methods for making same
KR101184467B1 (ko) * 2008-01-16 2012-09-19 히다치 가세고교 가부시끼가이샤 감광성 접착제 조성물, 필름상 접착제, 접착 시트, 접착제 패턴, 접착제층 부착 반도체 웨이퍼, 반도체 장치, 및, 반도체 장치의 제조방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH089643B2 (ja) * 1987-07-06 1996-01-31 富士写真フイルム株式会社 光重合性組成物
JPH1124257A (ja) 1997-07-04 1999-01-29 Hitachi Chem Co Ltd 感光性ポリイミド前駆体組成物及びそれを用いたパターン製造法
JP2000290501A (ja) 1999-04-05 2000-10-17 Nitto Denko Corp 感光性ポリイミド樹脂前駆体及び接着剤
JP2001329233A (ja) 2000-03-15 2001-11-27 Shin Etsu Chem Co Ltd フィルム状電子部品用接着剤及び電子部品
JP2006516246A (ja) * 2002-12-03 2006-06-29 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド ヘテロ芳香族基を有するオキシムエステル光開始剤
JP2005316449A (ja) * 2004-03-30 2005-11-10 Nippon Steel Chem Co Ltd 感光性樹脂組成物及びそれを用いたカラーフィルター
WO2007004569A1 (ja) * 2005-07-05 2007-01-11 Hitachi Chemical Company, Ltd. 感光性接着剤組成物、並びにこれを用いて得られる接着フィルム、接着シート、接着剤層付半導体ウェハ、半導体装置及び電子部品

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
CHEMISTRY OF MATERIALS, vol. 11, 1999, pages 170 - 176
JOURNAL OF AMERICAN CHEMICAL SOCIETY, vol. 118, 1996, pages 12925
JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, vol. 12, 1999, pages 313 - 314
POLYMER JOURNAL, vol. 28, 1996, pages 795
See also references of EP2135910A4

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EP2135910A4 (en) 2012-02-29
US20100143673A1 (en) 2010-06-10
EP2135910A1 (en) 2009-12-23
KR20100009537A (ko) 2010-01-27
KR101175401B1 (ko) 2012-08-20
KR20120073358A (ko) 2012-07-04
TW200907004A (en) 2009-02-16
JPWO2008123110A1 (ja) 2010-07-15
KR101256332B1 (ko) 2013-04-18

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