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WO2008108131A1 - 熱硬化型ダイボンドフィルム - Google Patents

熱硬化型ダイボンドフィルム Download PDF

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Publication number
WO2008108131A1
WO2008108131A1 PCT/JP2008/051772 JP2008051772W WO2008108131A1 WO 2008108131 A1 WO2008108131 A1 WO 2008108131A1 JP 2008051772 W JP2008051772 W JP 2008051772W WO 2008108131 A1 WO2008108131 A1 WO 2008108131A1
Authority
WO
WIPO (PCT)
Prior art keywords
die bonding
bonding film
thermosetting die
thermosetting
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/051772
Other languages
English (en)
French (fr)
Inventor
Naohide Takamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to CN2008800056620A priority Critical patent/CN101617395B/zh
Priority to KR1020097017946A priority patent/KR101140512B1/ko
Priority to US12/529,211 priority patent/US7829441B2/en
Publication of WO2008108131A1 publication Critical patent/WO2008108131A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • H10P72/7402—
    • H10W70/417—
    • H10W90/00—
    • H10W90/811—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10P72/7416—
    • H10W72/01331—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/07338—
    • H10W72/075—
    • H10W72/07504—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/354—
    • H10W72/381—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/884—
    • H10W74/00—
    • H10W74/114—
    • H10W90/231—
    • H10W90/732—
    • H10W90/734—
    • H10W90/736—
    • H10W90/754—
    • H10W90/756—
    • H10W99/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer

Landscapes

  • Die Bonding (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

　被着体との密着性に優れ、ピックアップ性の良好な熱硬化型ダイボンドフィルム及びそれを備えたダイシング・ダイボンドフィルムを提供する。本発明の熱硬化型ダイボンドフィルムは、半導体装置の製造の際に用いる熱硬化型ダイボンドフィルムであって、熱可塑性樹脂成分１５～３０重量％及び熱硬化性樹脂成分６０～７０重量％を主成分として含有し、熱硬化前の表面自由エネルギーが３７ｍＪ／ｍ２以上４０ｍＪ／ｍ２未満であることを特徴とする。   
PCT/JP2008/051772 2007-03-01 2008-02-04 熱硬化型ダイボンドフィルム Ceased WO2008108131A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800056620A CN101617395B (zh) 2007-03-01 2008-02-04 热固化型芯片接合薄膜
KR1020097017946A KR101140512B1 (ko) 2007-03-01 2008-02-04 열경화형 다이본드 필름
US12/529,211 US7829441B2 (en) 2007-03-01 2008-02-04 Thermosetting die-bonding film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-051767 2007-03-01
JP2007051767 2007-03-01

Publications (1)

Publication Number Publication Date
WO2008108131A1 true WO2008108131A1 (ja) 2008-09-12

Family

ID=39738028

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051772 Ceased WO2008108131A1 (ja) 2007-03-01 2008-02-04 熱硬化型ダイボンドフィルム

Country Status (6)

Country Link
US (1) US7829441B2 (ja)
JP (1) JP5305501B2 (ja)
KR (1) KR101140512B1 (ja)
CN (1) CN101617395B (ja)
TW (1) TWI372173B (ja)
WO (1) WO2008108131A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100314782A1 (en) * 2009-06-15 2010-12-16 Nitto Denko Corporation Dicing tape-integrated film for semiconductor back surface
CN102010677A (zh) * 2009-09-07 2011-04-13 日东电工株式会社 热固型芯片接合薄膜、切割/芯片接合薄膜及半导体装置
CN102153956A (zh) * 2009-11-26 2011-08-17 日东电工株式会社 热固型胶粘薄膜、带有切割薄膜的胶粘薄膜、以及使用它们制造半导体装置的方法
CN102399505A (zh) * 2010-09-13 2012-04-04 日东电工株式会社 切割/芯片接合薄膜
US20120114934A1 (en) * 2009-05-13 2012-05-10 Megumi Kodama Bonding sheet
JP2018182275A (ja) * 2017-04-17 2018-11-15 日東電工株式会社 ダイシングダイボンドフィルム

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5976857B2 (ja) * 2009-01-30 2016-08-24 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
JP5275834B2 (ja) * 2009-02-04 2013-08-28 古河電気工業株式会社 ウエハ加工用フィルム及びウエハ加工用フィルムを用いて半導体装置を製造する方法
JP5734834B2 (ja) * 2009-02-20 2015-06-17 日本碍子株式会社 セラミックス−金属接合体の製法
CN102460655B (zh) * 2009-06-15 2015-05-13 Lg化学株式会社 晶片处理薄片
JP2011187571A (ja) * 2010-03-05 2011-09-22 Nitto Denko Corp ダイシング・ダイボンドフィルム
SG183334A1 (en) 2010-03-09 2012-09-27 Furukawa Electric Co Ltd Wafer-processing film and method of manufacturing semiconductor device by using wafer-processing film
JP5419226B2 (ja) * 2010-07-29 2014-02-19 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
JP5432853B2 (ja) * 2010-07-30 2014-03-05 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法
KR101143109B1 (ko) * 2010-08-05 2012-05-08 후루카와 덴키 고교 가부시키가이샤 점착 필름 및 반도체 웨이퍼 가공용 테이프
JP4865926B1 (ja) * 2011-06-24 2012-02-01 古河電気工業株式会社 ウェハ加工用テープ
JP6148430B2 (ja) * 2011-07-26 2017-06-14 日東電工株式会社 接着シート及びその用途
JP2013038181A (ja) * 2011-08-05 2013-02-21 Nitto Denko Corp ダイシング・ダイボンドフィルム
KR20150087222A (ko) * 2012-11-20 2015-07-29 후루카와 덴키 고교 가부시키가이샤 반도체 칩의 제조방법 및 이것에 이용되는 박막 연삭용 표면 보호 테이프
TWI516530B (zh) * 2013-03-22 2016-01-11 琳得科股份有限公司 A film for forming a protective film, and a composite sheet for forming a protective film
JP2014216488A (ja) * 2013-04-25 2014-11-17 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
JP6033734B2 (ja) * 2013-04-30 2016-11-30 日東電工株式会社 フィルム状接着剤、ダイシングテープ一体型フィルム状接着剤、及び、半導体装置の製造方法
JP6193663B2 (ja) * 2013-07-26 2017-09-06 日東電工株式会社 ダイシングテープ付きダイボンドフィルム、及び、半導体装置の製造方法
CN105637623B (zh) * 2013-11-19 2018-11-27 积水化学工业株式会社 半导体接合用粘接膜
WO2016002080A1 (ja) * 2014-07-04 2016-01-07 リンテック株式会社 保護膜形成用フィルム
JP6399923B2 (ja) * 2014-12-24 2018-10-03 株式会社ディスコ 板状物のレーザー加工方法
CN107922798B (zh) * 2015-09-01 2022-01-04 琳得科株式会社 粘合片
JP6574685B2 (ja) * 2015-11-12 2019-09-11 日東電工株式会社 ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP6791701B2 (ja) * 2016-09-28 2020-11-25 日東電工株式会社 ダイシングダイボンディングテープおよび半導体装置の製造方法
JP6220488B1 (ja) * 2017-02-28 2017-10-25 リンテック株式会社 粘着シート
JP7438741B2 (ja) * 2019-12-13 2024-02-27 日東電工株式会社 半導体プロセスシート
JP7539769B2 (ja) 2019-12-18 2024-08-26 日東電工株式会社 ダイボンドシート、及び、ダイシングダイボンドフィルム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005120269A (ja) * 2003-10-17 2005-05-12 Shin Etsu Chem Co Ltd 接着剤組成物及び接着フイルム並びにダイシング・ダイボンド用接着テープ
JP2006261657A (ja) * 2005-02-21 2006-09-28 Nitto Denko Corp 半導体装置の製造方法
JP2006299226A (ja) * 2005-03-23 2006-11-02 Furukawa Electric Co Ltd:The ダイシングダイボンドシート

Family Cites Families (7)

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JPS6057342A (ja) 1983-09-08 1985-04-03 Canon Inc 現像装置
US6323251B1 (en) * 1999-09-24 2001-11-27 3M Innovative Properties Co Thermoplastic/thermoset hybrid foams and methods for making same
TWI304835B (en) * 2003-06-10 2009-01-01 Hitachi Chemical Co Ltd Film adhesive and manufacturing method thereof,adhesive sheet and semiconductor device
KR100850772B1 (ko) * 2003-07-08 2008-08-06 린텍 코포레이션 다이싱·다이 본딩용 점접착 시트 및 반도체 장치의 제조방법
MY138566A (en) * 2004-03-15 2009-06-30 Hitachi Chemical Co Ltd Dicing/die bonding sheet
US20070003758A1 (en) * 2004-04-01 2007-01-04 National Starch And Chemical Investment Holding Corporation Dicing die bonding film
US8236614B2 (en) 2005-02-21 2012-08-07 Nitto Denko Corporation Semiconductor device manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005120269A (ja) * 2003-10-17 2005-05-12 Shin Etsu Chem Co Ltd 接着剤組成物及び接着フイルム並びにダイシング・ダイボンド用接着テープ
JP2006261657A (ja) * 2005-02-21 2006-09-28 Nitto Denko Corp 半導体装置の製造方法
JP2006299226A (ja) * 2005-03-23 2006-11-02 Furukawa Electric Co Ltd:The ダイシングダイボンドシート

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120114934A1 (en) * 2009-05-13 2012-05-10 Megumi Kodama Bonding sheet
US20100314782A1 (en) * 2009-06-15 2010-12-16 Nitto Denko Corporation Dicing tape-integrated film for semiconductor back surface
CN102010677A (zh) * 2009-09-07 2011-04-13 日东电工株式会社 热固型芯片接合薄膜、切割/芯片接合薄膜及半导体装置
CN102153956A (zh) * 2009-11-26 2011-08-17 日东电工株式会社 热固型胶粘薄膜、带有切割薄膜的胶粘薄膜、以及使用它们制造半导体装置的方法
CN102153956B (zh) * 2009-11-26 2016-06-01 日东电工株式会社 热固型胶粘薄膜、带有切割薄膜的胶粘薄膜、以及使用它们制造半导体装置的方法
CN102399505A (zh) * 2010-09-13 2012-04-04 日东电工株式会社 切割/芯片接合薄膜
US9123794B2 (en) 2010-09-13 2015-09-01 Nitto Denko Corporation Dicing die bond film
JP2018182275A (ja) * 2017-04-17 2018-11-15 日東電工株式会社 ダイシングダイボンドフィルム
JP7019333B2 (ja) 2017-04-17 2022-02-15 日東電工株式会社 ダイシングダイボンドフィルム

Also Published As

Publication number Publication date
TW200846437A (en) 2008-12-01
JP5305501B2 (ja) 2013-10-02
JP2008244463A (ja) 2008-10-09
CN101617395B (zh) 2011-08-17
US7829441B2 (en) 2010-11-09
CN101617395A (zh) 2009-12-30
TWI372173B (en) 2012-09-11
US20100081258A1 (en) 2010-04-01
KR20090107557A (ko) 2009-10-13
KR101140512B1 (ko) 2012-04-30

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