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PH12016500005B1 - Dicing sheet - Google Patents

Dicing sheet

Info

Publication number
PH12016500005B1
PH12016500005B1 PH12016500005A PH12016500005A PH12016500005B1 PH 12016500005 B1 PH12016500005 B1 PH 12016500005B1 PH 12016500005 A PH12016500005 A PH 12016500005A PH 12016500005 A PH12016500005 A PH 12016500005A PH 12016500005 B1 PH12016500005 B1 PH 12016500005B1
Authority
PH
Philippines
Prior art keywords
energy ray
pressure sensitive
sensitive adhesive
polymerizable compound
dicing sheet
Prior art date
Application number
PH12016500005A
Other versions
PH12016500005A1 (en
Inventor
Takuo Nishida
Yosuke Koma
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12016500005B1 publication Critical patent/PH12016500005B1/en
Publication of PH12016500005A1 publication Critical patent/PH12016500005A1/en

Links

Classifications

    • H10P72/7402—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H10P72/7416—
    • H10P72/742—
    • H10P72/744—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A dicing sheet (1) comprising a base film (2) and a pressure sensitive adhesive layer (3) laminated at least on one surface of the base film (2), wherein: the pressure sensitive adhesive layer (3) is formed of a pressure sensitive adhesive composition that contains an acrylic-based polymer (A) and a polyfunctional acrylate-based energy ray polymerizable compound (B); the polyfunctional acrylate-based energy ray polymerizable compound (B) has 0.004 to 0.009 moles of a polymerizable functional group in 1 g of the polyfunctional acrylate-based energy ray polymerizable compound (B); a ratio of the polyfunctional acrylate-based energy ray polymerizable compound (B) to a total amount of the acrylic-based polymer (A) and the polyfunctional acrylatebased energy ray polymerizable compound (B) is 20 to 65 mass pcnt ; and a thickness of the pressure sensitive adhesive layer (3) is 2 to 20 æm. When the adherend is a workpiece such as a semiconductor package having a large surface roughness, the dicing sheet (1) has a sufficient adhesive strength before energy ray irradiation and also has a moderate adhesive strength after energy ray irradiation, and pressure sensitive adhesive aggregates are unlikely to be generated in the dicing sheet (1).
PH12016500005A 2013-07-05 2016-01-04 Dicing sheet PH12016500005A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013141816 2013-07-05
PCT/JP2014/067798 WO2015002270A1 (en) 2013-07-05 2014-07-03 Dicing sheet

Publications (2)

Publication Number Publication Date
PH12016500005B1 true PH12016500005B1 (en) 2016-03-28
PH12016500005A1 PH12016500005A1 (en) 2016-03-28

Family

ID=52143839

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12016500005A PH12016500005A1 (en) 2013-07-05 2016-01-04 Dicing sheet

Country Status (6)

Country Link
JP (1) JP6317744B2 (en)
CN (1) CN105378899B (en)
MY (1) MY176995A (en)
PH (1) PH12016500005A1 (en)
SG (1) SG11201600047XA (en)
WO (1) WO2015002270A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105934478B (en) 2014-01-29 2020-01-14 日立化成株式会社 Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
KR20160114049A (en) 2014-01-29 2016-10-04 히타치가세이가부시끼가이샤 Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
TWI660022B (en) 2014-01-29 2019-05-21 Hitachi Chemical Company, Ltd. Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
JP6209097B2 (en) * 2014-02-07 2017-10-04 株式会社ディスコ Wafer processing method
TWI787147B (en) * 2015-03-06 2022-12-21 荷蘭商露明控股公司 Methods for providing ceramic phosphor plates to light-emitting device (led) dies, tapes for dicing or transferring of ceramic phosphor plates, methods for placing a ceramic phosphor plate onto a tape, and methods for using a tape
CN111032754A (en) * 2017-08-29 2020-04-17 东亚合成株式会社 Resin sheet and curable composition for producing the same
CN114514296B (en) * 2019-10-04 2024-03-29 琳得科株式会社 Pressure-sensitive adhesive sheet
JP2023141976A (en) * 2022-03-24 2023-10-05 リンテック株式会社 Workpiece processing sheet
WO2024185314A1 (en) * 2023-03-06 2024-09-12 三菱ケミカル株式会社 Pressure-sensitive adhesive sheet, pressure-sensitive adhesive sheet with release film, laminate for image display device, flexible image display device, and pressure-sensitive adhesive sheet for constituent member of flexible image display device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4063614B2 (en) * 2002-08-30 2008-03-19 日東電工株式会社 Water-dispersed acrylic pressure-sensitive adhesive composition for re-peeling and pressure-sensitive adhesive sheet
JP2004186263A (en) * 2002-11-29 2004-07-02 Sekisui Chem Co Ltd Method for manufacturing reinforced semiconductor wafer and IC chip
JP2007238802A (en) * 2006-03-09 2007-09-20 Sekisui Chem Co Ltd Processing method of electronic parts
JP5049620B2 (en) * 2007-03-20 2012-10-17 リンテック株式会社 Adhesive sheet
JP5513866B2 (en) * 2009-12-11 2014-06-04 リンテック株式会社 Adhesive sheet for processing electronic parts
JP5743555B2 (en) * 2010-02-02 2015-07-01 リンテック株式会社 Dicing sheet
JP2012180494A (en) * 2011-02-10 2012-09-20 Nitto Denko Corp Spontaneously rolling adhesive sheet, and method of manufacturing cut piece
EP2676991B1 (en) * 2011-02-14 2020-07-15 LG Chem, Ltd. Substrate film and method for manufacturing same
JP5975621B2 (en) * 2011-11-02 2016-08-23 リンテック株式会社 Dicing sheet and semiconductor chip manufacturing method
JP6087122B2 (en) * 2012-12-04 2017-03-01 リンテック株式会社 Dicing sheet

Also Published As

Publication number Publication date
SG11201600047XA (en) 2016-02-26
PH12016500005A1 (en) 2016-03-28
MY176995A (en) 2020-08-31
CN105378899B (en) 2018-05-11
CN105378899A (en) 2016-03-02
JPWO2015002270A1 (en) 2017-02-23
WO2015002270A1 (en) 2015-01-08
JP6317744B2 (en) 2018-04-25

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