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WO2008096601A1 - 感光性ポリイミド樹脂組成物 - Google Patents

感光性ポリイミド樹脂組成物 Download PDF

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Publication number
WO2008096601A1
WO2008096601A1 PCT/JP2008/050896 JP2008050896W WO2008096601A1 WO 2008096601 A1 WO2008096601 A1 WO 2008096601A1 JP 2008050896 W JP2008050896 W JP 2008050896W WO 2008096601 A1 WO2008096601 A1 WO 2008096601A1
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WIPO (PCT)
Prior art keywords
composition
polyimide resin
analogue
resin composition
photosensitive polyimide
Prior art date
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Ceased
Application number
PCT/JP2008/050896
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English (en)
French (fr)
Inventor
Mamiko Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
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Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to US12/226,822 priority Critical patent/US7592119B2/en
Publication of WO2008096601A1 publication Critical patent/WO2008096601A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
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  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　感光性ポリイミド樹脂組成物を低弾性率化して低反り性を付与するために、ジアミン成分の一部をジアミノポリシロキサン系化合物やビス（アミノベンゾエート）系化合物で代替した場合であっても、汎用の有機溶媒に対する溶解性を維持したまま、弱アルカリ性水溶液による現像性を実現できるようにする。 　式（１）のポリイミドユニットと、式（２）又は式（３）のポリイミドユニットとからなるポリイミド樹脂と、メラミンシアヌレート類縁体と、ジアゾアフトキノン類縁体とを含有する、弱アルカリ性水溶液でポジ型現像が可能で且つ有機溶媒に可溶な感光性ポリイミド樹脂組成物は、メラミンシアヌレート類縁体を、ポリイミド樹脂１００重量部に対し５～５０重量部含有する。
PCT/JP2008/050896 2007-02-09 2008-01-23 感光性ポリイミド樹脂組成物 Ceased WO2008096601A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/226,822 US7592119B2 (en) 2007-02-09 2008-01-23 Photosensitive polyimide resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007031246 2007-02-09
JP2007-031246 2007-02-09

Publications (1)

Publication Number Publication Date
WO2008096601A1 true WO2008096601A1 (ja) 2008-08-14

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PCT/JP2008/050896 Ceased WO2008096601A1 (ja) 2007-02-09 2008-01-23 感光性ポリイミド樹脂組成物

Country Status (6)

Country Link
US (1) US7592119B2 (ja)
JP (1) JP5114776B2 (ja)
KR (1) KR20090075797A (ja)
CN (1) CN101606103A (ja)
TW (1) TW200905395A (ja)
WO (1) WO2008096601A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009025283A1 (ja) * 2007-08-22 2009-02-26 Sony Chemical & Information Device Corporation 新規なポリイミド樹脂及び感光性ポリイミド樹脂組成物
WO2009025319A1 (ja) * 2007-08-22 2009-02-26 Sony Chemical & Information Device Corporation ポリイミド組成物、フレキシブル配線板、及び、フレキシブル配線板の製造方法
JP2009063980A (ja) * 2006-11-15 2009-03-26 Asahi Kasei Corp 感光性樹脂組成物及びそれを用いたフレキシブルプリント配線板
WO2009157225A1 (ja) * 2008-06-23 2009-12-30 ソニーケミカル＆インフォメーションデバイス株式会社 シロキサンポリイミド樹脂の製造方法
JP2011075609A (ja) * 2009-09-29 2011-04-14 Nippon Zeon Co Ltd 感放射線性樹脂組成物、及び積層体

Families Citing this family (28)

* Cited by examiner, † Cited by third party
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KR100725023B1 (ko) * 2006-10-16 2007-06-07 제일모직주식회사 카도계 수지를 함유한 수지 조성물 및 그에 의한 패턴의 제조방법, 이를 이용한 컬러필터
JP5065853B2 (ja) * 2007-10-26 2012-11-07 旭化成イーマテリアルズ株式会社 感光性ポリアミド酸組成物および感光性ドライフィルム
JP5320639B2 (ja) * 2008-02-13 2013-10-23 日立電線株式会社 絶縁電線
CN102015835A (zh) * 2008-05-09 2011-04-13 旭化成电子材料株式会社 聚酰亚胺前体、感光性聚酰亚胺前体组合物、感光性干膜及使用它们的柔性印刷布线基板
JP5343494B2 (ja) * 2008-09-30 2013-11-13 デクセリアルズ株式会社 感光性シロキサンポリイミド樹脂組成物
CN102140169B (zh) * 2010-01-28 2013-08-21 长春人造树脂厂股份有限公司 水溶性聚酰亚胺树脂、其制法及其用途
KR101304590B1 (ko) * 2010-03-11 2013-09-05 주식회사 엘지화학 Ｏｌｅｄ 디바이스용 감광성 유기 절연재 조성물
WO2011135887A1 (ja) * 2010-04-28 2011-11-03 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
EP2590025B1 (en) * 2010-07-02 2014-09-17 Toray Industries, Inc. Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or the photosensitive resin composition film
CN102436142B (zh) 2010-09-29 2013-11-06 第一毛织株式会社 黑色光敏树脂组合物以及使用其的光阻层
KR101367253B1 (ko) 2010-10-13 2014-03-13 제일모직 주식회사 감광성 수지 조성물 및 이를 이용한 차광층
KR101486560B1 (ko) 2010-12-10 2015-01-27 제일모직 주식회사 감광성 수지 조성물 및 이를 이용한 차광층
KR101453769B1 (ko) 2010-12-24 2014-10-22 제일모직 주식회사 감광성 수지 조성물 및 이를 이용한 컬러 필터
KR101344786B1 (ko) 2011-12-02 2013-12-26 제일모직주식회사 컬러필터용 감광성 수지 조성물 및 이를 이용한　컬러필터
SG11201501594UA (en) * 2012-09-25 2015-05-28 Toray Industries Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said composition
JP6016581B2 (ja) * 2012-10-31 2016-10-26 旭化成株式会社 樹脂組成物、積層体及び配線板
KR20140076320A (ko) 2012-12-12 2014-06-20 제일모직주식회사 감광성 수지 조성물 및 이를 이용한 블랙 스페이서
CN103113587B (zh) * 2013-03-14 2015-06-17 华威聚酰亚胺有限责任公司 一种柔性超支化半互穿氟硅聚酰亚胺薄膜及其制备方法
CN106094436B (zh) * 2016-06-16 2019-12-17 杭州福斯特应用材料股份有限公司 一种自修复感光性聚酰亚胺树脂组合物
TWI782241B (zh) * 2019-11-12 2022-11-01 臺灣永光化學工業股份有限公司 聚醯亞胺正型光阻組成物
TWI718853B (zh) 2020-01-21 2021-02-11 新應材股份有限公司 移除光阻的方法、積層體、聚醯亞胺樹脂及剝離液
CN113219796B (zh) * 2020-01-21 2025-01-10 新应材股份有限公司 移除方法、积层体、形成方法及聚酰亚胺树脂
CN115232017B (zh) * 2021-03-15 2024-06-18 华为技术有限公司 一种化合物、一种树脂及其制备方法和应用
US11856708B2 (en) * 2021-03-22 2023-12-26 Carnegie Mellon University Stretchable 3D-printed circuit boards
KR20230052121A (ko) * 2021-10-12 2023-04-19 삼성전자주식회사 반도체 패키지 및 그 제조 방법
CN115246930B (zh) * 2022-07-19 2023-08-18 吉林奥来德光电材料股份有限公司 一种新型聚酰亚胺树脂、感光聚酰亚胺树脂组合物及其制备方法和应用
CN116414000B (zh) * 2023-04-14 2024-12-20 江苏艾森半导体材料股份有限公司 感光性聚酰亚胺组合物、固化物和电子部件
CN116609999B (zh) * 2023-04-14 2025-02-07 江苏艾森半导体材料股份有限公司 感光性聚酰亚胺组合物、固化物和电子部件

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001330953A (ja) * 2000-05-22 2001-11-30 Jsr Corp 感放射線性樹脂組成物
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