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WO2009025151A1 - 新規なアミド基含有シロキサンアミン化合物 - Google Patents

新規なアミド基含有シロキサンアミン化合物 Download PDF

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Publication number
WO2009025151A1
WO2009025151A1 PCT/JP2008/063520 JP2008063520W WO2009025151A1 WO 2009025151 A1 WO2009025151 A1 WO 2009025151A1 JP 2008063520 W JP2008063520 W JP 2008063520W WO 2009025151 A1 WO2009025151 A1 WO 2009025151A1
Authority
WO
WIPO (PCT)
Prior art keywords
amine compound
amide group
containing siloxane
integer
novel amide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/063520
Other languages
English (en)
French (fr)
Inventor
Tomoyasu Sunaga
Junichi Ishii
Etsushi Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ihara Chemical Industry Co Ltd
Dexerials Corp
Original Assignee
Ihara Chemical Industry Co Ltd
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ihara Chemical Industry Co Ltd, Sony Chemical and Information Device Corp filed Critical Ihara Chemical Industry Co Ltd
Priority to US12/452,957 priority Critical patent/US8193295B2/en
Priority to CN2008801039887A priority patent/CN101784554B/zh
Priority to JP2009528989A priority patent/JP5370676B2/ja
Publication of WO2009025151A1 publication Critical patent/WO2009025151A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0838—Compounds with one or more Si-O-Si sequences
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Silicon Polymers (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

　アミンモノマーから誘導されるポリベンゾイミダゾール樹脂、ポリベンゾオキサゾール樹脂、特にポリイミド樹脂のジアミン成分として有用な新規なアミド基含有シロキサンアミン化合物は、式（１）の化学構造を有する。 　 式（１）中、Ｒ１及びＲ２は、それぞれ独立的に置換されてもよいアルキレン基であり、ｐは０～３の整数であり、ｑは０～３の整数であり、ｍは１～３０の整数であり、ｎは０～２０の整数であり、ｐとｑは同時に０とならない。
PCT/JP2008/063520 2007-08-22 2008-07-28 新規なアミド基含有シロキサンアミン化合物 Ceased WO2009025151A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/452,957 US8193295B2 (en) 2007-08-22 2008-07-28 Amide group-containing siloxane amine compound
CN2008801039887A CN101784554B (zh) 2007-08-22 2008-07-28 新型含酰胺基硅氧烷胺化合物
JP2009528989A JP5370676B2 (ja) 2007-08-22 2008-07-28 新規なアミド基含有シロキサンアミン化合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007216215 2007-08-22
JP2007-216215 2007-08-22

Publications (1)

Publication Number Publication Date
WO2009025151A1 true WO2009025151A1 (ja) 2009-02-26

Family

ID=40378059

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063520 Ceased WO2009025151A1 (ja) 2007-08-22 2008-07-28 新規なアミド基含有シロキサンアミン化合物

Country Status (6)

Country Link
US (1) US8193295B2 (ja)
JP (1) JP5370676B2 (ja)
KR (1) KR101546981B1 (ja)
CN (1) CN101784554B (ja)
TW (1) TWI391425B (ja)
WO (1) WO2009025151A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010002178A1 (de) 2010-02-22 2011-08-25 Evonik Goldschmidt GmbH, 45127 Verfahren zur Herstellung von Amin-Amid-funktionellen Siloxanen
JP5362811B2 (ja) * 2009-02-21 2013-12-11 デクセリアルズ株式会社 保護膜形成用原料液、保護膜、保護膜付き配線基板
TWI512015B (zh) * 2014-05-30 2015-12-11 Nat Inst Chung Shan Science & Technology Cross - linked polysiloxane molecules
JPWO2016017344A1 (ja) * 2014-07-30 2017-06-01 住友精化株式会社 シリコーン樹脂組成物、シリコーン樹脂硬化物、及び、光半導体素子封止体

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5499312B2 (ja) * 2009-09-30 2014-05-21 信越化学工業株式会社 アルコール性水酸基を有する新規のポリイミドシリコーンおよびその製造方法
US8852848B2 (en) * 2010-07-28 2014-10-07 Z Electronic Materials USA Corp. Composition for coating over a photoresist pattern
TWI461464B (zh) * 2011-12-23 2014-11-21 Chi Mei Corp 含聚矽氧烷的聚醯亞胺系樹脂組成物及由其所形成之軟性基板
KR101451630B1 (ko) * 2012-12-05 2014-10-23 금오공과대학교 산학협력단 이산화탄소 환원방법 및 이를 이용한 이산화탄소 환원장치
WO2018135657A1 (ja) * 2017-01-23 2018-07-26 日産化学工業株式会社 液晶配向剤及び液晶配向膜の製造方法
KR101840978B1 (ko) 2017-09-14 2018-03-21 주식회사 엘지화학 폴리이미드 공중합체 및 이를 이용한 폴리이미드 필름
KR101840977B1 (ko) 2017-09-14 2018-03-21 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름
JP7338681B2 (ja) * 2019-05-22 2023-09-05 信越化学工業株式会社 繊維処理剤

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3488371A (en) * 1967-08-18 1970-01-06 Gen Electric Linear difunctional silylamide and process therefor
JPS57123223A (en) * 1980-12-15 1982-07-31 M & T Chemicals Inc Thermostable polymer containing siloxane units and manufacture of siloxane and disiloxane
JPS61293224A (ja) * 1985-06-20 1986-12-24 Tokyo Inst Of Technol ポリシロキサン−ポリアミド系マルチブロツク共重合体及びその製造方法
JPS6384188A (ja) * 1986-09-29 1988-04-14 新日鐵化学株式会社 フレキシブルプリント基板の製造方法
JPH04325523A (ja) * 1991-01-24 1992-11-13 Cheil Synthetics Inc シロキシサン変性ポリイミド樹脂の製造方法
JPH0543700A (ja) * 1991-08-15 1993-02-23 Shin Etsu Chem Co Ltd 硬化性化合物、その製造方法、絶縁保護膜形成剤及び電子部品用保護剤
JPH06206856A (ja) * 1992-07-20 1994-07-26 Kolon Co Ltd 高弾性芳香族ポリアミドフィルムおよびその製造方法
JP2000173345A (ja) * 1998-07-02 2000-06-23 Natl Starch & Chem Investment Holding Corp アリル化されたアミド化合物類から製造される回路部品
JP2002201279A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd ポリフェニルアミドシロキサン重合体の製造方法及びポリフェニルアミドシロキサン重合体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4480009A (en) 1980-12-15 1984-10-30 M&T Chemicals Inc. Siloxane-containing polymers
US4890009A (en) * 1987-04-30 1989-12-26 Hitachi, Ltd. Monolithic integrated circuit device
EP0641832B1 (en) * 1993-08-25 1999-01-13 Dow Corning Asia, Ltd. Diorganopolysiloxane-Rigid aromatic polymer compositions and preparation thereof
JP2003131371A (ja) 2001-10-24 2003-05-09 Kanegafuchi Chem Ind Co Ltd 難燃性の感光性ドライフィルムレジスト

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3488371A (en) * 1967-08-18 1970-01-06 Gen Electric Linear difunctional silylamide and process therefor
JPS57123223A (en) * 1980-12-15 1982-07-31 M & T Chemicals Inc Thermostable polymer containing siloxane units and manufacture of siloxane and disiloxane
JPS61293224A (ja) * 1985-06-20 1986-12-24 Tokyo Inst Of Technol ポリシロキサン−ポリアミド系マルチブロツク共重合体及びその製造方法
JPS6384188A (ja) * 1986-09-29 1988-04-14 新日鐵化学株式会社 フレキシブルプリント基板の製造方法
JPH04325523A (ja) * 1991-01-24 1992-11-13 Cheil Synthetics Inc シロキシサン変性ポリイミド樹脂の製造方法
JPH0543700A (ja) * 1991-08-15 1993-02-23 Shin Etsu Chem Co Ltd 硬化性化合物、その製造方法、絶縁保護膜形成剤及び電子部品用保護剤
JPH06206856A (ja) * 1992-07-20 1994-07-26 Kolon Co Ltd 高弾性芳香族ポリアミドフィルムおよびその製造方法
JP2000173345A (ja) * 1998-07-02 2000-06-23 Natl Starch & Chem Investment Holding Corp アリル化されたアミド化合物類から製造される回路部品
JP2002201279A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd ポリフェニルアミドシロキサン重合体の製造方法及びポリフェニルアミドシロキサン重合体

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5362811B2 (ja) * 2009-02-21 2013-12-11 デクセリアルズ株式会社 保護膜形成用原料液、保護膜、保護膜付き配線基板
DE102010002178A1 (de) 2010-02-22 2011-08-25 Evonik Goldschmidt GmbH, 45127 Verfahren zur Herstellung von Amin-Amid-funktionellen Siloxanen
EP2365021A1 (de) 2010-02-22 2011-09-14 Evonik Goldschmidt GmbH Verfahren zur Herstellung von Amin-Amid-funktionellen Siloxanen
TWI512015B (zh) * 2014-05-30 2015-12-11 Nat Inst Chung Shan Science & Technology Cross - linked polysiloxane molecules
JPWO2016017344A1 (ja) * 2014-07-30 2017-06-01 住友精化株式会社 シリコーン樹脂組成物、シリコーン樹脂硬化物、及び、光半導体素子封止体

Also Published As

Publication number Publication date
CN101784554A (zh) 2010-07-21
TW200914499A (en) 2009-04-01
CN101784554B (zh) 2013-07-17
US8193295B2 (en) 2012-06-05
US20100137547A1 (en) 2010-06-03
JPWO2009025151A1 (ja) 2010-11-18
KR20100057810A (ko) 2010-06-01
TWI391425B (zh) 2013-04-01
JP5370676B2 (ja) 2013-12-18
KR101546981B1 (ko) 2015-08-24

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