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WO2008090835A1 - 多層プリント配線板の製造方法 - Google Patents

多層プリント配線板の製造方法 Download PDF

Info

Publication number
WO2008090835A1
WO2008090835A1 PCT/JP2008/050680 JP2008050680W WO2008090835A1 WO 2008090835 A1 WO2008090835 A1 WO 2008090835A1 JP 2008050680 W JP2008050680 W JP 2008050680W WO 2008090835 A1 WO2008090835 A1 WO 2008090835A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed wiring
multilayer printed
roughening
composition
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050680
Other languages
English (en)
French (fr)
Inventor
Shigeo Nakamura
Eiichi Hayashi
Genjin Mago
Tadahiko Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2008555044A priority Critical patent/JPWO2008090835A1/ja
Publication of WO2008090835A1 publication Critical patent/WO2008090835A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

　メッキ下地面とするための粗化処理によって得られる粗化面の表面粗さが低粗度で、かつ、該粗化処理の際に同時になされるデスミア処理においてスミアが残存することなく除去され得る層間絶縁層を形成し得る多層プリント配線板の製造方法及び該方法に使用する接着フィルムを提供する。 　回路基板にラミネートすることで多層プリント配線板の層間絶縁層として使用する接着フィルムを、支持体層上に第１の硬化性樹脂組成物による被メッキ層及び第２の硬化性樹脂組成物による接着層をこの順に設けた構成にし、第１の硬化性樹脂組成物はその層（厚み４０μｍ）に多層プリント配線板の製造工程での硬化工程及び粗化工程と同じ処理を施した場合の粗化による質量減少率が３質量％未満となる組成物とし、第２の硬化性樹脂組成物は、その層（厚み４０μｍ）に多層プリント配線板の製造工程での硬化工程及び粗化工程と同じ処理を施した場合の粗化による質量減少率が３質量％以上１０質量％以下となる組成物とする。また、被メッキ層の厚みをＸμｍ、接着層の厚みをＹμｍとした場合に、Ｘ及びＹが、１０μｍ≦Ｘ＋Ｙ≦１００μｍ、１μｍ＜Ｘ及び１μｍ＜Ｙの条件を全て満たすようにする。
PCT/JP2008/050680 2007-01-23 2008-01-21 多層プリント配線板の製造方法 Ceased WO2008090835A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008555044A JPWO2008090835A1 (ja) 2007-01-23 2008-01-21 多層プリント配線板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007012208 2007-01-23
JP2007-012208 2007-01-23

Publications (1)

Publication Number Publication Date
WO2008090835A1 true WO2008090835A1 (ja) 2008-07-31

Family

ID=39644412

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050680 Ceased WO2008090835A1 (ja) 2007-01-23 2008-01-21 多層プリント配線板の製造方法

Country Status (3)

Country Link
JP (1) JPWO2008090835A1 (ja)
TW (1) TWI441853B (ja)
WO (1) WO2008090835A1 (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153839A (ja) * 2008-11-26 2010-07-08 Kyocer Slc Technologies Corp 配線基板の製造方法
JP2010267712A (ja) * 2009-05-13 2010-11-25 Sekisui Chem Co Ltd 多層回路基板の製造方法
JP2012094799A (ja) * 2010-09-27 2012-05-17 Sekisui Chem Co Ltd エポキシ樹脂材料及び多層基板
KR20140005783A (ko) * 2012-07-06 2014-01-15 아지노모토 가부시키가이샤 절연 수지 시트
JP2014013854A (ja) * 2012-07-05 2014-01-23 Ajinomoto Co Inc 支持体付き樹脂シート
JP2014187091A (ja) * 2013-03-22 2014-10-02 Ajinomoto Co Inc 絶縁樹脂シート
CN104685979A (zh) * 2012-09-27 2015-06-03 积水化学工业株式会社 多层基板的制造方法、多层绝缘膜及多层基板
JP2017050561A (ja) * 2016-11-16 2017-03-09 味の素株式会社 絶縁樹脂シート
JP2018027703A (ja) * 2017-11-13 2018-02-22 味の素株式会社 絶縁樹脂シート

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101682886B1 (ko) * 2009-07-14 2016-12-06 아지노모토 가부시키가이샤 동박이 부착된 접착 필름

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11172457A (ja) * 1997-12-05 1999-06-29 Ibiden Co Ltd 無電解めっき用接着剤および多層プリント配線板
JP2003304068A (ja) * 2002-04-05 2003-10-24 Mitsui Mining & Smelting Co Ltd プリント配線板用樹脂付金属箔及びこれを用いた多層プリント配線板
JP2004356238A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Works Ltd 金属箔付き絶縁シート、多層配線板、及び多層配線板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11172457A (ja) * 1997-12-05 1999-06-29 Ibiden Co Ltd 無電解めっき用接着剤および多層プリント配線板
JP2003304068A (ja) * 2002-04-05 2003-10-24 Mitsui Mining & Smelting Co Ltd プリント配線板用樹脂付金属箔及びこれを用いた多層プリント配線板
JP2004356238A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Works Ltd 金属箔付き絶縁シート、多層配線板、及び多層配線板の製造方法

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153839A (ja) * 2008-11-26 2010-07-08 Kyocer Slc Technologies Corp 配線基板の製造方法
JP2010267712A (ja) * 2009-05-13 2010-11-25 Sekisui Chem Co Ltd 多層回路基板の製造方法
JP2012094799A (ja) * 2010-09-27 2012-05-17 Sekisui Chem Co Ltd エポキシ樹脂材料及び多層基板
JP2014013854A (ja) * 2012-07-05 2014-01-23 Ajinomoto Co Inc 支持体付き樹脂シート
KR20140005783A (ko) * 2012-07-06 2014-01-15 아지노모토 가부시키가이샤 절연 수지 시트
JP2014017301A (ja) * 2012-07-06 2014-01-30 Ajinomoto Co Inc 絶縁樹脂シート
KR102000921B1 (ko) 2012-07-06 2019-07-17 아지노모토 가부시키가이샤 절연 수지 시트
CN104685979B (zh) * 2012-09-27 2018-11-16 积水化学工业株式会社 多层基板的制造方法、多层绝缘膜及多层基板
CN104685979A (zh) * 2012-09-27 2015-06-03 积水化学工业株式会社 多层基板的制造方法、多层绝缘膜及多层基板
JPWO2014050871A1 (ja) * 2012-09-27 2016-08-22 積水化学工業株式会社 多層基板の製造方法、多層絶縁フィルム及び多層基板
US9888580B2 (en) 2012-09-27 2018-02-06 Sekisui Chemical Co., Ltd. Method for manufacturing multilayer substrate, multilayer insulation film, and multilayer substrate
JP2014187091A (ja) * 2013-03-22 2014-10-02 Ajinomoto Co Inc 絶縁樹脂シート
JP2017050561A (ja) * 2016-11-16 2017-03-09 味の素株式会社 絶縁樹脂シート
JP2018027703A (ja) * 2017-11-13 2018-02-22 味の素株式会社 絶縁樹脂シート

Also Published As

Publication number Publication date
TW200840839A (en) 2008-10-16
JPWO2008090835A1 (ja) 2010-05-20
TWI441853B (zh) 2014-06-21

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